阅读说明：本技术 Euv光源中的目标材料控制 (Target material control in EUV light sources ) 是由 A·L·G·戈文达拉朱 D·贝塞姆斯 桑迪普·莱 P·A·威廉斯 S·金卡尔 J·M·卢肯 于 2020-03-09 设计创作，主要内容包括：提供了一种设备,该设备包括第一储存器系统、第二储存器系统、注入系统和流体控制系统,第一储存器系统包括被配置为在喷嘴供应系统的操作期间与喷嘴供应系统流动连通的第一储液器,第二储存器系统包括被配置为在喷嘴供应系统的操作期间的时间中的至少部分时间与第一储存器系统流动连通的第二储液器,注入系统被配置为从固体物质产生流体目标材料,流体控制系统被流动连接到注入系统、第一储存器系统、第二储存器系统和喷嘴供应系统。流体控制系统被配置为在喷嘴供应系统的操作期间：将至少一个储液器和喷嘴供应系统与注入系统隔离,并且保持在至少一个储液器与喷嘴供应系统之间的流体流动路径。(An apparatus is provided that includes a first reservoir system including a first reservoir configured to be in flow communication with a nozzle supply system during operation of the nozzle supply system, a second reservoir system including a second reservoir configured to be in flow communication with the first reservoir system at least a portion of a time during operation of the nozzle supply system, an injection system configured to produce a fluid target material from a solid substance, and a fluid control system fluidly connected to the injection system, the first reservoir system, the second reservoir system, and the nozzle supply system. The fluid control system is configured to, during operation of the nozzle supply system: the at least one reservoir and the nozzle supply system are isolated from the injection system and a fluid flow path is maintained between the at least one reservoir and the nozzle supply system.)

1. An apparatus for supplying a target material, the apparatus comprising:

a first reservoir system comprising a first reservoir configured to be in flow communication with a nozzle supply system during operation of the nozzle supply system, the first reservoir being maintained at a first pressure;

a second reservoir system comprising a second reservoir configured to be in flow communication with the first reservoir system at least a portion of the time during operation of the nozzle supply system;

an injection system configured to receive solid matter comprising a target material and produce a fluid target material from the solid matter, the injection system maintained at an injection pressure less than the first pressure; and

a fluid control system fluidly connected to the injection system, the first reservoir system, the second reservoir system, and the nozzle supply system, wherein the fluid control system is configured to:

isolating at least one reservoir and the nozzle supply system from the injection system during operation of the nozzle supply system, an

Maintaining a fluid flow path between at least one reservoir and the nozzle supply system during operation of the nozzle supply system.

2. The apparatus of claim 1, wherein the injection pressure is less than about 600 kilopascals (kPa).

3. The apparatus of claim 1, wherein the first pressure is at least 6000kPa, at least 10,000kPa, at least 25,000kPa, or in the range of about 6000kPa to 60,000 kPa.

4. The apparatus of claim 1, wherein the injection system and the second reservoir are maintained at the injection pressure while the second reservoir is refilled with a fluid target material from the injection system, and the injection system and the second reservoir are positioned relative to each other such that the second reservoir is prevented from overfilling with the fluid target material.

5. The apparatus of claim 1, wherein the fluid control system is configured to: maintaining a fluid flow path between the first reservoir and the nozzle supply system during operation of the nozzle supply system while the second reservoir is refilled with a fluid target material from the injection system.

6. The apparatus of claim 1, wherein the fluid control system is configured to purge target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system.

7. The apparatus of claim 1, wherein the fluid control system is configured to maintain a fluid flow path between at least one reservoir and the nozzle supply system during operation of the nozzle supply system by: maintaining a fluid flow path between the first reservoir and the nozzle supply system and between the second reservoir and the nozzle supply system during operation of the nozzle supply system, and simultaneously maintaining the nozzle supply system and the second reservoir at the first pressure.

8. The apparatus of claim 7, wherein the fluid control system is further configured to maintain a fluid flow path between the at least one reservoir and the nozzle supply system and enable the fluid flow path between the first reservoir and the second reservoir during operation of the nozzle supply system.

9. The device of claim 1, further comprising an environmental control device configured to:

independently and separately controlling the first pressure in the first reservoir and the second pressure in the second reservoir, an

Controlling the temperature of the first reservoir and the temperature of the second reservoir independently and separately.

10. The device of claim 9, wherein the environmental control device is further configured to adjust or reset the second pressure of the second reservoir based on a measured amount of fluid target material within the second reservoir.

11. The device of claim 9, wherein the environmental control device comprises a pressurized reservoir configured to contain and transfer inert gas from the pressurized reservoir to one or more of the first and second reservoirs through an orifice.

12. The apparatus of claim 1, wherein the fluid control system comprises a reservoir fluid control valve between the first reservoir and the second reservoir and a refill fluid control valve between the second reservoir and the injection system, wherein the fluid control system is configured to independently control the reservoir fluid control valve and the refill fluid control valve.

13. The apparatus of claim 12, wherein the reservoir fluid control valve comprises a freeze valve and the refill fluid control valve comprises a freeze valve.

14. The apparatus of claim 1, wherein the fluid control system is further configured to maintain a fluid flow path between the first reservoir and the second reservoir during operation of the nozzle supply system.

15. The apparatus of claim 1, wherein the second reservoir is further configured to be in flow communication with the nozzle supply system at least a portion of the time during operation of the nozzle supply system.

16. The apparatus of claim 1, wherein the injection system comprises:

a first chamber comprising a door configured to open such that solid matter can be received within a first volume defined by the first chamber;

a second chamber defining a second volume and in flow communication with the fluid control system; and

a flow blocking device formed in an otherwise unobstructed fluid path between the first chamber and the second chamber.

17. The apparatus of claim 16, wherein the flow blocking device is a freeze valve, wherein a fluid flow path is blocked by the solid matter in the freeze valve when the solid matter is maintained at a temperature below a melting point of the solid matter.

18. The apparatus of claim 1, further comprising a sensing system configured to estimate a volume of fluid target material in one or more of the first reservoir, the second reservoir, and the injection system and/or a presence of solid matter within the injection system.

19. The apparatus of claim 18, further comprising a control system in communication with the sensing system, the control system configured to determine a consumption rate of the fluid target material in the second reservoir based on an output from the high pressure transducer, the consumption rate being an amount of fluid target material used per time period.

20. A method for continuously supplying a target material in an uninterrupted manner, the method comprising:

receiving solid matter comprising a target material in an injection system maintained at an injection pressure and producing a fluid target material from the solid matter;

maintaining flow communication between the first reservoir and the nozzle supply system during operation of the nozzle supply system while maintaining the first reservoir at a first pressure greater than the injection pressure; and

effecting transfer of fluid target material at the first pressure between the first and second reservoirs at least part of the time during operation of the nozzle supply system while the fluid target material is being produced in the injection system at the injection pressure.

21. The method of claim 20, further comprising maintaining the first pressure of the first reservoir while a fluid target material is enabled to be transferred between the injection system and the second reservoir.

22. The method of claim 20, further comprising effecting transfer of fluid target material to the nozzle supply system throughout operation of the nozzle supply system by causing the fluid target material to flow:

from the first reservoir to the nozzle supply system;

from the second reservoir to the nozzle supply system; or

Simultaneously from the first reservoir and the second reservoir to the nozzle supply system.

23. The method of claim 20, further comprising: preventing, at least some of the time during operation of the nozzle supply system, fluid target material from being transferred to the second reservoir and/or the first reservoir.

24. The method of claim 20, further comprising: reloading solid matter including the target material into the injection system only when the injection system is at the injection pressure, wherein reloading solid matter including the target material into the injection system occurs while the nozzle supply system is at the first pressure.

25. The method of claim 20, further comprising: refilling the second reservoir with a fluid target material from the injection system while maintaining the first pressure of the first reservoir, and fluidly separating the second reservoir from the injection system after sufficient fluid target material has been transferred from the injection system into the second reservoir.

26. The method of claim 25, further comprising: maintaining the injection system and the second reservoir at the injection pressure while refilling the second reservoir with a fluid target material from the injection system and preventing the second reservoir from being overfilled with the fluid target material.

27. The method of claim 20, further comprising: purging target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system prior to ceasing operation of the nozzle supply system and ceasing flow communication between the first reservoir and the nozzle supply system.

28. The method of claim 20, further comprising: melting the solid matter of a target material in the injection system into the target fluid material.

29. The method of claim 20, wherein operation of the nozzle supply system comprises: delivering droplets of the fluid target material to an Extreme Ultraviolet (EUV) light source in which the droplets are configured to be irradiated with radiation to produce an EUV light-emitting plasma.

30. A method, comprising:

receiving solid matter comprising a target material in an injection system maintained at an injection pressure and producing a fluid target material from the solid matter;

maintaining flow communication between the first reservoir and the nozzle supply system during operation of the nozzle supply system while maintaining the first reservoir at a first pressure greater than the injection pressure; and

effecting transfer of the fluid target material between the injection system and a second reservoir while fluidly isolating the first reservoir and the nozzle supply system from the injection system.

31. The method of claim 30, wherein operation of the nozzle supply system comprises: delivering droplets of the fluid target material to an Extreme Ultraviolet (EUV) light source in which the droplets are configured to be irradiated with radiation to produce an EUV light-emitting plasma.

32. The method of claim 30, further comprising: maintaining the first pressure of the first reservoir while a fluid target material is transferable between the injection system and the second reservoir.

33. The method of claim 30, further comprising effecting transfer of the fluid target material between the second reservoir and the first reservoir while fluidly isolating the first reservoir, the second reservoir, and the nozzle supply system from the injection system.

34. The method of claim 30, further comprising effecting transfer of fluid target material to the nozzle supply system throughout operation of the nozzle supply system by causing the fluid target material to flow:

from the first reservoir to the nozzle supply system;

from the second reservoir to the nozzle supply system; or

Simultaneously from the first reservoir and the second reservoir to the nozzle supply system.

35. The method of claim 30, further comprising: preventing, at least some of the time during operation of the nozzle supply system, fluid target material from being transferred to the second reservoir and/or the first reservoir.

36. The method of claim 30, further comprising reloading solid matter including the target material into the injection system only when the injection system is at the injection pressure, wherein reloading solid matter including the target material into the injection system occurs while the nozzle supply system is at the first pressure.

37. The method of claim 30, further comprising: refilling the second reservoir with a fluid target material from the injection system while maintaining the first pressure of the first reservoir.

38. The method of claim 37, further comprising: maintaining the injection system and the second reservoir at the injection pressure while refilling the second reservoir with a fluid target material from the injection system and preventing the second reservoir from being overfilled with the fluid target material.

39. The method of claim 30, further comprising fluidly separating the second reservoir from the injection system after sufficient fluid target material has been transferred from the injection system into the second reservoir.

40. The method of claim 30, further comprising melting the solid matter of a target material in the injection system into the target fluid material.

Technical Field

The disclosed subject matter relates to an apparatus and method for controlling the supply of a target material in an Extreme Ultraviolet (EUV) light source.

Background

Extreme ultraviolet ("EUV") light, e.g., electromagnetic radiation having a wavelength of about 50 nanometers (nm) or less (also sometimes referred to as soft X-rays), and including light having a wavelength of about 13nm, is used in lithographic processes to produce very small features in and on substrates, such as silicon wafers used to produce integrated circuits and various other microelectronic devices.

Methods for generating EUV light include, but are not limited to, changing the physical state of the source material to a plasma state. The source material comprises a compound or element, such as xenon, lithium or tin, whose emission line is in the EUV range. In one such method, commonly referred to as laser produced plasma ("LPP"), the required plasma is produced by irradiating source material (e.g., in the form of droplets, streams or clusters of source material) with an amplified beam (which may be referred to as a drive laser). For this process, plasma is typically generated in a sealed container (e.g., a vacuum chamber) and monitored using various types of metrology equipment. Source materials that emit in the EUV range when in the plasma state (such as xenon, lithium or tin) are often referred to as target materials because they are targeted and irradiated by a driven laser.

Disclosure of Invention

In some general aspects, an apparatus is configured to supply a target material. The apparatus comprises: a first reservoir system, a second reservoir system, an infusion system, and a fluid control system. The first reservoir system includes a first reservoir configured to be in flow communication with the nozzle supply system during operation of the nozzle supply system, the first reservoir being maintained at a first pressure. The second reservoir system includes a second reservoir configured to be in flow communication with the first reservoir system at least a portion of the time during operation of the nozzle supply system. The injection system is configured to receive solid matter including a target material and produce a fluid target material from the solid matter, the injection system being maintained at an injection pressure less than the first pressure. The fluid control system is fluidly connected to the injection system, the first reservoir system, the second reservoir system, and the nozzle supply system. The fluid control system is configured to: the at least one reservoir and the nozzle supply system are isolated from the injection system during operation of the nozzle supply system and a fluid flow path is maintained between the at least one reservoir and the nozzle supply system during operation of the nozzle supply system.

Implementations may include one or more of the following features. For example, the injection pressure may be less than about 600 kilopascals (kPa). The first pressure may be at least 6000kPa, at least 10,000kPa, at least 25,000kPa, or in the range of about 6000kPa to 60,000 kPa.

While the second reservoir is being refilled with the fluid target material from the injection system, the injection system and the second reservoir may be maintained at an injection pressure and the injection system and the second reservoir may be positioned relative to each other such that the second reservoir is prevented from overfilling with the fluid target material.

The fluid control system may be configured to: a fluid flow path is maintained between the second reservoir and the nozzle supply system during operation of the nozzle supply system while the second reservoir is refilled with the fluid target material from the injection system. The fluid control system may be configured to purge the target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system.

The fluid control system may be configured to maintain a fluid flow path between the at least one reservoir and the nozzle supply system during operation of the nozzle supply system by: a fluid flow path is maintained between the first reservoir and the nozzle supply system and between the second reservoir and the nozzle supply system during operation of the nozzle supply system, and at the same time the nozzle supply system and the second reservoir are maintained at the first pressure. The fluid control system may also be configured to maintain a fluid flow path between the at least one reservoir and the nozzle supply system and to enable a fluid flow path between the first reservoir and the second reservoir during operation of the nozzle supply system.

The device may further comprise an environment control device configured to: the first pressure in the first reservoir and the second pressure in the second reservoir are independently and separately controlled, and the temperature of the first reservoir and the temperature of the second reservoir are independently and separately controlled. The environmental control device may also be configured to adjust or reset the second pressure of the second reservoir based on the measured amount of the fluid target material within the second reservoir. The environmental control device may include a pressurized reservoir configured to contain and transfer inert gas from the pressurized reservoir to one or more of the first and second reservoirs through the orifice.

The fluid control system may include a reservoir fluid control valve between the first reservoir and the second reservoir and a refill fluid control valve between the second reservoir and the injection system. The fluid control system may be configured to independently control the reservoir fluid control valve and the refill fluid control valve. The reservoir fluid control valve may comprise a freeze valve and the refill fluid control valve may comprise a freeze valve.

The fluid control system may also be configured to maintain a fluid flow path between the first reservoir and the second reservoir during operation of the nozzle supply system.

The second reservoir may also be configured to be in flow communication with the nozzle supply system at least part of the time during operation of the nozzle supply system.

The injection system may include a first chamber, a second chamber, and a flow blocking device. The first chamber includes a door configured to open such that solid matter can be received within a first volume defined by the first chamber, the second chamber defines a second volume and is in flow communication with the fluid control system, and a flow blocking device is formed in an otherwise unobstructed fluid path between the first and second chambers. The flow blocking device may be a freeze valve, wherein the fluid flow path is blocked by the solid matter in the freeze valve when the solid matter is maintained at a temperature below the melting point of the solid matter.

The apparatus may also include a sensing system configured to estimate a volume of the fluid target material in one or more of the first reservoir, the second reservoir, and the injection system and/or a presence of solid matter within the injection system. The apparatus may include a control system in communication with the sensing system, the control system configured to determine a consumption rate of the fluid target material in the second reservoir based on the output from the high pressure transducer, the consumption rate being an amount of the fluid target material used per time period. The sensing system may include a high pressure transducer associated with one or more of the first and second reservoirs.

The fluid control system may be configured to maintain a fluid flow path between the at least one reservoir and the nozzle supply system during operation of the nozzle supply system by: a fluid flow path is maintained between the first reservoir and the nozzle supply system during operation of the nozzle supply system and, at the same time, the nozzle supply system is maintained at a first pressure.

In other general aspects, a method for continuously supplying a target material in an uninterrupted manner is performed. The method comprises the following steps: the method includes receiving solid matter including a target material in an injection system maintained at an injection pressure and producing a fluid target material from the solid matter. The method includes maintaining flow communication between the first reservoir and the nozzle supply system during operation of the nozzle supply system while maintaining the first reservoir at a first pressure greater than the injection pressure. The method includes effecting transfer of the fluid target material at the first pressure between the first reservoir and the second reservoir at least part of the time during operation of the nozzle supply system while the fluid target material is being produced in the injection system at the injection pressure.

Implementations may include one or more of the following features. For example, the method may include maintaining a first pressure of the first reservoir while the fluid target material is enabled to be transferred between the injection system and the second reservoir. The method may comprise effecting transfer of the fluid target material to the nozzle supply system throughout operation of the nozzle supply system by causing the fluid target material to flow: from the first reservoir to the nozzle supply system; from the second reservoir to the nozzle supply system; or from both the first and second reservoirs to the nozzle supply system. The method can comprise the following steps: at least some of the time during operation of the nozzle supply system, the fluid target material is prevented from being transferred to the second reservoir and/or the first reservoir. The method may include reloading the solid matter including the target material into the injection system only when the injection system is at the injection pressure. Reloading of the solid matter including the target material into the injection system may occur while the nozzle supply system is at the first pressure.

The method may further include refilling the second reservoir with the fluid target material from the injection system while maintaining the first pressure of the first reservoir, and fluidly separating the second reservoir from the injection system after sufficient fluid target material has been transferred from the injection system into the second reservoir. The method may include maintaining the injection system and the second reservoir at the injection pressure while refilling the second reservoir with the fluid target material from the injection system and preventing the second reservoir from being overfilled with the fluid target material.

The method may include purging the target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system prior to stopping operation of the nozzle supply system and stopping flow communication between the first reservoir and the nozzle supply system. The method may include melting solid matter of the target material injected into the system into the target fluid material.

Operation of the nozzle supply system may include delivering droplets of a fluid target material to an Extreme Ultraviolet (EUV) light source where the droplets are configured to be irradiated with radiation to produce a plasma that emits EUV light.

The method may include controlling the temperature and pressure of the fluid target material in each of the first reservoir, the second reservoir, and the injection system in an independent and separate manner.

In other general aspects, a method includes: in an injection system maintained at an injection pressure, receiving solid matter comprising a target material and producing a fluid target material from the solid matter; maintaining flow communication between the first reservoir and the nozzle supply system during operation of the nozzle supply system while maintaining the first reservoir at a first pressure greater than the injection pressure; and effecting transfer of the fluid target material between the injection system and the second reservoir while fluidly isolating the first reservoir and the nozzle supply system from the injection system.

Implementations may include one or more of the following features. For example, operation of the nozzle supply system may include delivering droplets of a fluid target material to an Extreme Ultraviolet (EUV) light source where the droplets are configured to be irradiated with radiation to produce a plasma that emits EUV light.

The method may include maintaining a first pressure of the first reservoir while the fluid target material is enabled to transfer between the injection system and the second reservoir. The method may include effecting transfer of the fluid target material between the second reservoir and the first reservoir while fluidly isolating the first reservoir, the second reservoir, and the nozzle supply system from the injection system.

The method may comprise effecting transfer of the fluid target material to the nozzle supply system throughout operation of the nozzle supply system by causing the fluid target material to flow: from the first reservoir to the nozzle supply system; from the second reservoir to the nozzle supply system; or from both the first and second reservoirs to the nozzle supply system.

The method can comprise the following steps: at least some of the time during operation of the nozzle supply system, the fluid target material is prevented from being transferred to the second reservoir and/or the first reservoir. The method may include reloading the solid matter including the target material into the injection system only when the injection system is at the injection pressure. Reloading of the solid matter including the target material into the injection system may occur while the nozzle supply system is at the first pressure.

The method may include refilling the second reservoir with a fluid target material from the injection system while maintaining the first pressure of the first reservoir. The method may include maintaining the injection system and the second reservoir at the injection pressure while refilling the second reservoir with the fluid target material from the injection system and preventing the second reservoir from being overfilled with the fluid target material. The method may include fluidly separating the second reservoir from the injection system after sufficient fluid target material has been transferred from the injection system into the second reservoir.

The method may also include melting solid matter of the target material injected into the system into the target fluid material. The method may further include controlling the temperature and pressure of the fluid target material in each of the first reservoir, the second reservoir, and the injection system in an independent and separate manner.

The method may further include purging the target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system prior to stopping operation of the nozzle supply system and stopping flow communication between the first reservoir and the nozzle supply system.

Drawings

FIG. 1 is a block diagram of an apparatus including a first reservoir system, a second reservoir system, an injection system, and a fluid control system, and configured to supply a fluid target material to a nozzle supply system during continuous operation of the nozzle supply system;

FIG. 2 is a block diagram of an implementation of the apparatus of FIG. 1, including an environmental control apparatus and showing an implementation of a fluid control system;

FIG. 3 is a block diagram of the apparatus of FIG. 1, wherein a nozzle supply system emits a target stream of fluid target material for use by an EUV light source;

FIG. 4 is a block diagram of an implementation of an injection system that may be used in the apparatus of FIG. 1;

FIG. 5 is a block diagram of an implementation of a nozzle supply system that may be used in the apparatus of FIG. 1;

fig. 6 is a flow chart of a process performed by the apparatus of fig. 1.

FIG. 7 is a flow chart of another process performed by the apparatus of FIG. 1;

FIG. 8A is a block diagram illustrating a time during a normal operating mode of the device of FIG. 1;

FIG. 8B is a block diagram illustrating a time during a supplemental mode of operation of the device of FIG. 1;

FIG. 9A is a block diagram illustrating a time during a normal operating mode of the apparatus of FIG. 1, wherein a fluid target material has been replenished into the injection system;

fig. 9B is a block diagram illustrating a time during a replenishment mode of operation of the device of fig. 1, wherein a fluid flow path between the first reservoir system and the second reservoir system is blocked and a fluid flow path between the second reservoir system and the injection system is blocked;

fig. 9C is a block diagram illustrating a time during a replenishment mode of operation of the apparatus of fig. 1, wherein a fluid flow path between the first reservoir system and the second reservoir system is blocked and a fluid flow path between the second reservoir system and the injection system is open;

fig. 9D is a block diagram illustrating a time during a replenishment mode of operation of the device of fig. 1, wherein a fluid flow path between the first reservoir system and the second reservoir system is blocked, and the fluid flow path between the second reservoir system and the injection system is blocked after the second reservoir system has been refilled with the fluid target material from the injection system;

fig. 9E is a block diagram illustrating a time during a replenishment mode of operation of the apparatus of fig. 1, wherein a fluid flow path between the first reservoir system and the second reservoir system is open and a fluid flow path between the second reservoir system and the injection system is blocked;

fig. 9F is a block diagram illustrating a time during a replenishment mode of operation of the apparatus of fig. 1, wherein a fluid flow path between the first reservoir system and the second reservoir system is open and a fluid flow path between the second reservoir system and the injection system is blocked, and the first reservoir system has been refilled with a fluid target material from the second reservoir system;

fig. 9G is a block diagram illustrating a time during a normal operating mode of the device of fig. 1, wherein a fluid flow path between the first reservoir system and the second reservoir system is open and a fluid flow path between the second reservoir system and the injection system is blocked;

FIG. 10 is a block diagram of another implementation of the apparatus of FIG. 1, including a level sensing apparatus configured to estimate a volume of fluid target material in the second reservoir system;

FIG. 11 is a block diagram of another implementation of the device of FIG. 1 in which the environmental control device is fluidly connected to a first reservoir system and a second reservoir system by a flow communication connection;

FIG. 12 is a block diagram of another implementation of the injection system of FIG. 1; and

fig. 13A-13D are block diagrams of the injection system of fig. 12 at various stages during injection of a solid substance to form a fluid target material.

Detailed Description

Referring to fig. 1, the apparatus 100 is configured to supply a fluid target material 120 to a nozzle supply system 140 during continuous operation of the nozzle supply system 140. The nozzle supply system 140 may be configured to supply the fluid target material 120 in the form of a target stream 121 for use by the system 124. The fluid target material 120 is a target material in a fluid state (such as a liquid state).

The apparatus 100 includes a first reservoir system 102, a second reservoir system 103, an injection system 104, and a fluid control system 190. The fluid control system 190 is fluidly connected to the injection system 104, the first reservoir system 102, the second reservoir system 103, and the nozzle supply system 140. In some implementations, the fluid control system 190 includes the flow communication device 116 and the fluid controller 106 operable to adjust one or more aspects of the flow communication device 116.

The injection system 104 is configured to receive a solid substance 122 comprising a target material. The flow communication device 116 is an adjustable fluid flow path that is capable of flow communication with the first reservoir system 102, the second reservoir system 103, the injection system 104, and the nozzle supply system 140. For example, the flow communication device 116 includes a fluid transfer line 115 and one or more regulating devices 118 and 119, the regulating devices 118 and 119 configured to regulate, direct, or control the flow of fluid through the fluid transfer line by, for example, opening, closing, or partially blocking various channels within the fluid transfer line. The flow communication device 116 may further include an adjustment means 117 along the fluid flow path towards the nozzle supply system 140, the adjustment means 117 being for controlling the flow of fluid to the nozzle supply system 140.

Because the apparatus 100 includes two reservoir systems 102, 103 in addition to the injection system 104 (which enables refilling of the target material into the entire apparatus 100), the fluid target material 120 may be transferred between the first reservoir system 102 and the second reservoir system 103 while the solid substance 122 of the target material 120 is added to the injection system 104. In particular, during operation of the nozzle supply system 140 for supplying the target stream 121, the fluid control system 190 controls flow communication between the first reservoir system 102, the second reservoir system 103, and the injection system 104 to maintain a continuous supply of the fluid target material 120 to the nozzle supply system 140 such that the target stream 121 supplied to the system 124 is not interrupted.

Furthermore, actions occurring within the apparatus 100 do not adversely affect the performance of the nozzle supply system 140 that might otherwise occur due to perturbations in fluid pressure. Further, in some implementations, while fluid is being supplied to the nozzle supply system 140, the first reservoir system 102 is in flow communication with the nozzle supply system 140 and is also maintained at a high pressure, and the first reservoir system 102 may provide a primary source of the fluid target material 120 to the nozzle supply system 140.

Fluid control between each of the first reservoir system 102, the second reservoir system 103, the injection system 104, and the nozzle supply system 140 may be independently controlled by the fluid control system 190, and in this manner, at least one of the reservoir systems 102 or 103 in flow communication with the nozzle supply system 140 may provide a source of the fluid target material 120 to the nozzle supply system 140 at all times during operation of the nozzle supply system 140.

As described above, the flow communication device 116 includes the fluid transfer line 115 and one or more conditioning apparatuses 117, 118, 119, the conditioning apparatuses 117, 118, 119 configured to condition, direct, or control the flow of fluid through the fluid transfer line 115 by, for example, opening, closing, or partially blocking various channels within the fluid transfer line 115. The fluid transfer line 115 may include, for example, one or more interconnected conduits formed of tantalum tungsten (TaW) or other suitable material that may contain the fluid target material 120 at varying high pressures. The conduit may be flexible. The flow communication device 116 may include other various fluid control devices, not shown, configured to provide controllable fluid flow paths between various portions of the device 100. The flow communication device 116 may include (in addition to the noted fluid transfer line 115 and one or more regulating means 117, 118, 119) one or more valves, pipes, fluid flow regulating devices and tanks.

Each of the regulating means 117, 118, 119 may comprise a valve control device. In this way, the fluid flow through a particular regulating device 117, 118, 119 can be regulated by opening or closing a valve within its valve control apparatus. Each valve control device may comprise a fluid valve, which may be, for example, a thermally controlled valve, a manual valve, and/or an electric motor. In thermal control valves (also known as freeze valves), the passages are heated to maintain the fluid within the fluid path in a liquid state, and the passages are allowed to cool or actively cool to convert the fluid to a solid state. Thus, in some implementations discussed herein, the valve control devices within the conditioning apparatus 118, 119 include a freeze valve. Each valve control device of the regulating means 117, 118, 119 may have any suitable shape, such as a 90 ° bend tube, a restricted access tube or a cylindrical tube.

Further, as shown in fig. 2, the device 100 may include an environmental control device 236, the environmental control device 236 configured to independently control the environment (such as temperature and pressure) of each of the first reservoir system 102 and the second reservoir system 103. Environmental control of the first reservoir system 102 and the second reservoir system 103 may be performed independently of environmental control of the injection system 104. In particular, the reloading of the solid matter 122 into the injection system 104 may be performed at a temperature below the melting point of the fluid target material 120 and at atmospheric pressure. At the same time, one or more of the reservoir systems 102 or 103 supply the fluid target material to the nozzle supply system 140. This is achieved in part due to the fact that the injection system 104 may be environmentally separated from each of the reservoir systems 102, 103. Additional advantages and features of the device 100 will be discussed below after a detailed description of the components of the device 100.

During operation of the nozzle supply system 140, one or more of the first reservoir system 102 and the second reservoir system 103 contains a fluid target material 120. At least one of the first reservoir system 102 and the second reservoir system 103 may thereby deliver the fluid target material 120 to the nozzle supply system 140 during operation of the nozzle supply system 140. Meanwhile, the injection system 104 is configured to produce the fluid target material 120 from the solid matter 122 including the target material (and store the fluid target material 120 within the injection tank 114). The injection system 104 supplies the fluid target material 120 to the second reservoir system 103 at different times and stages during operation of the nozzle supply system 140; specifically, when the second reservoir system 103 is fluidly isolated from the nozzle supply system 140, the first reservoir system 102 and the second reservoir system 103 may be at a lower pressure and in flow communication with the injection tank 114 of the injection system 104. In some implementations where the injection tank 114 operates at the same pressure as the first reservoir 112, the injection system 104 may additionally or alternatively supply the fluid target material 120 to the first reservoir system 102.

The nozzle supply system 140 is configured to receive the fluid target material 120 from the apparatus 100 and supply the fluid target material 120 in the form of a target stream 121 to the system 124. For example, as shown in fig. 3, if the system 124 is an EUV light source 324, the nozzle supply system 140 may emit a target stream 121 of a fluid target material 120 such that a target 321p is delivered to a plasma formation location 326 in a vacuum chamber 328. The plasma formation location 326 may receive at least one light beam 342, which light beam 342 has been generated by a light source 344 and delivered to the vacuum chamber via a light path 346. The interaction between beam 342 and the target material in target 321p produces a plasma that emits EUV light 348, which is collected 350 and provided to a lithographic exposure apparatus 352. In this example, the fluid target material 120 may be any material that emits EUV light 348 when in a plasma state. For example, the fluid target material 120 may include water, tin, lithium, and/or xenon.

The first reservoir system 102 includes a first reservoir 112, the first reservoir 112 being a container configured to contain the fluidic target material 120 and in continuous flow communication with the nozzle supply system 140 during operation of the nozzle supply system 140. The first reservoir 112 is a volume defined by a structure that may be formed, filled, or reinforced with molybdenum (Mo), forged Mo, or any material that remains stable and solid above the melting point of the fluid target material 120 and also does not chemically react with the fluid target material 120. The first reservoir 112 is in flow communication with the nozzle supply system 140 via a flow communication device 116, the flow communication device 116 being fluidly coupled and controlled by the fluid controller 106.

The first reservoir 112 is maintained at a first pressure P during operation of the nozzle supply system 140₁₁₂In some implementations, the first pressure P₁₁₂Adjustable by the environmental control device 236. At certain times during operation, the first pressure P is achieved for other implementations₁₁₂May for example be at least 6000kpa, at least 10,000kpa, at least 25,000kpa, or in the range of 6,000 kpa to 60,000 kpa. During operation of the nozzle supply system 140, and when the first reservoir 112 supplies the fluid target material 120 to the nozzle supply system 140, the first pressure P₁₁₂For example, may be any suitable pressure greater than the pressure within nozzle supply system 140.

The second reservoir system 103 includes a second reservoir 113, the second reservoir 113 being a container configured to contain the fluidic target material 120 and being in flow communication with the first reservoir system 102 at least a portion of the time during operation of the nozzle supply system 140. The second reservoir 113 is a volume defined by a structure that may be formed, filled, or reinforced with molybdenum (Mo), forged Mo, or any material that remains stable and solid above the melting point of the fluid and also does not chemically react with the fluid target material 120. The second reservoir 113 is in flow communication with the first reservoir system 102 via a flow communication device 116 under the control of the fluid controller 106.

In some implementations, the volume within the structure of the second reservoir 113 is the same size as the volume within the structure of the first reservoir 112; such that the first reservoir 112 and the second reservoir 113 may hold/retain the same amount of the fluid target material 120. In other implementations, the volume within the structure of the second reservoir 113 may be greater than the volume within the structure of the first reservoir 112. In these implementations, the second reservoir 113 will be able to hold/retain a greater amount of the fluid target material 120 than the first reservoir 112.

The second reservoir 113 is maintained at a second pressure P during operation of the nozzle supply system 140₁₁₃Second pressure P₁₁₃Adjustable by the environmental control device 236. Second pressure P₁₁₃The value at any instant may depend on the current operation of the device 100. For example, at certain times, the second pressure P of the second reservoir 113₁₁₃An injection pressure P that may be maintained with the injection system 104₁₁₄The same is true. As another example, at other times, the second pressure P of the second reservoir 113₁₁₃May be maintained at a first pressure P with the first reservoir 112₁₁₂The same is true. And, at other times, when the second reservoir 113 is in flow communication with the injection system 104 (also maintained at atmospheric pressure), the second pressure P of the second reservoir 113₁₁₃May be atmospheric pressure.

The injection system 104 includes an injection tank 114, the injection tank 114 being a container configured to hold a fluid target material 120 (which is produced from a solid substance 122). At least a portion of the time during operation of the nozzle supply system 140, the injection tank 114 is in flow communication with one or more of the first reservoir system 102 and the second reservoir system 103. The injection system 104 is configured to produce the fluid target material 120 from the solid matter 122, and may do one or more of the following: in flow communication with the second reservoir system 103 to refill the second reservoir system 103 with the fluid target material 120 and in flow communication with the first reservoir system 102 to refill the first reservoir system 102 with the fluid target material 120. The injection system 104 may also include an injection chamber 130, the injection chamber 130 configured to receive the solid matter 122 containing the target material. The flood chamber 130 may include, for example, a removable cap so that the solid material 122 may be replaced within the flood chamber 130.

The injection system 104 and the second reservoir 103 may be positioned relative to each other such that when the injection system 104 refills the second reservoir system 103, the second reservoir 103 is prevented from overfilling with the fluid target material 120.

At various times during operation of the nozzle supply system 140, the injection tank 114 is in flow communication with one or more of the first reservoir system 102 and the second reservoir system 103 via the flow communication device 116 and such flow communication is under the control of the fluid controller 106 of the fluid control system 190. The injection chamber 130 is in flow communication with the injection tank 114 such that the fluid target material 120 produced from the solid matter 122 within the injection chamber 130 can be supplied to the injection tank 114 in an environmentally controlled manner.

Injection pressure P₁₁₄Is the pressure at which the injection tank 114 is maintained. Injection pressure P₁₁₄Is adjustable depending on whether the fluid target material 120 is being supplied to one or more of the first reservoir system 102 and the second reservoir system 103. For example, the injection pressure P when the injection canister 114 is refilled with solid matter 122 from the injection chamber 130₁₁₄May be maintained at a low pressure (such as atmospheric pressure), approximately 101 kpa.

As described above, the fluid control system 190 is configured to control flow communication between the first reservoir system 102, the second reservoir system 103, and the injection system 104 to maintain a continuous supply of the fluid target material 120 to the nozzle supply system 140. In particular, the fluid controller 106 is configured to determine the current fluid status of one or more of the regulating devices 117, 118, 119; receiving input regarding a desired flow communication within the apparatus 100; and adjusts the fluid state of one or more of the regulating devices 117, 118, 119 based on the desired flow communication within the apparatus 100.

The fluid controller 106 may include or have access to one or more programmable processors, and the programmable processors may each execute a program of instructions to perform desired actions by operating on input data and generating appropriate outputs to one or more conditioning devices 117, 118, 119. The fluid controller 106 may be implemented in any of digital electronic circuitry, computer hardware, firmware, or software. In further implementations, the fluid controller 106 may have access to a memory, and the memory may be a read-only memory and/or a random access memory and may provide a storage device suitable for tangibly embodying computer program instructions and data. The fluid controller 106 may also include one or more input devices (such as a keyboard, touch-enabled device, audio input device) and one or more output devices (such as an audio output or a video output). The fluid controller 106 may be in communication with one or more actuating elements within each of the modulation devices 117, 118, 119.

During operation of the nozzle supply system 140, the fluid controller 106 may be instructed to isolate the first reservoir 112 and the nozzle supply system 140 from the second reservoir 113 and the injection tank 114 (during replenishment of the fluid target material 120 in the second reservoir 113). Such isolation may be achieved, at least in part, by the fluid controller 106 instructing the regulating device 118 to close, which causes the regulating device 118 to close and block the passage of the fluid target material 120. At other times (e.g., when both the first reservoir system 102 and the second reservoir system 103 have sufficient fluid target material 120), the fluid controller 106 is instructed to isolate the first reservoir 112, the second reservoir 113, and the nozzle supply system 140 from the injection tank 114 during operation of the nozzle supply system 140. Such isolation may be achieved, at least in part, by fluid controller 106 instructing conditioning device 119 to close (thereby causing conditioning device 119 to close and block passage of fluid target material 120).

Further, the fluid controller 106 may be instructed to maintain a continuous fluid flow path between the first reservoir 112 and the nozzle supply system 140 during operation of the nozzle supply system 140. The continuous fluid flow path may be accomplished at least in part by the fluid controller 106 sending an instruction to the regulating device 117 of the flow communication device 116 to open or remain open. At least some of the time during operation of the nozzle supply system 140, the fluid controller 106 may be instructed to maintain a fluid flow path between the first reservoir 112, the second reservoir 113, and the nozzle supply system 140. The continuous fluid flow path may be accomplished at least in part by the fluid controller 106 sending instructions to the regulating devices 117 and 118 of the flow communication device 116 to open or remain open.

Referring to fig. 2, an implementation 216 of flow communication device 116 and an implementation 200 of device 100 are shown. In flow communication 216, regulating device 118 (of fig. 1) corresponds to reservoir valve system 218 and regulating device 119 (of fig. 1) corresponds to refill valve system 219. The reservoir valve system 218 and refill valve system 219 are controlled by the fluid controller 106. The reservoir valve system 218 is located between the first reservoir 112 and the second reservoir 113 and is configured to fluidly isolate the first reservoir 112 and the nozzle supply system 140 from the second reservoir 113 and the injection tank 114 for at least a portion of the time during operation of the nozzle supply system 140. The refill valve system 219 is located between the second reservoir 113 and the injection tank 114 and is configured to fluidly isolate the first reservoir 112, the nozzle supply system 140, and the second reservoir 113 from the injection tank 114 at least a portion of the time during operation of the nozzle supply system.

In some implementations, reservoir valve system 218 and refill valve system 219 include a reservoir freeze valve 218F and a refill freeze valve 219F, respectively. The reservoir freeze valve 218F and refill freeze valve 219F are controlled by the fluid controller 106. The cryo-valve includes a length of tubing that contains the fluid target material 120 and allows the fluid target material 120 to pass through either side of the cryo-valve and a regulated temperature regulation device in thermal communication with the length of tubing. The conditioning thermostat is configured to vary the temperature of the pipe segment within a temperature range near the melting point of the fluid target material 120. For example, the regulated temperature conditioning device may be a cartridge heater in thermal communication with the pipe segment. If the temperature of the pipe segment remains substantially below the melting point of the fluid target material 120, any liquid within the pipe segment will solidify (change state to a frozen state) and the solid matter blocks the fluid passage through the pipe segment, thereby preventing additional fluid target material 120 from passing through the freeze valve. When the temperature regulating device is adjusted to heat the pipe section above the melting point of the solid matter, the solid matter can melt and if the temperature is high enough, i.e. well above the melting point of the solid matter, the solid matter in the plug will melt to form the fluid target material 120, the fluid target material 120 now being free to flow through the flow channel of the pipe section.

For example, when the temperature regulating device of the reservoir freeze valve 218F cools the length of tubing of the reservoir freeze valve 218F to a temperature well below the melting point of the fluid target material 120, the reservoir freeze valve 218F fluidly isolates the first reservoir 112 and the nozzle supply system 140 from the second reservoir 113 and the injection system 104. Further, when the temperature regulation device within the refill freeze valve 219F cools the tubing section of the refill freeze valve 219F to a temperature well below the melting point of the fluid target material 120, the refill freeze valve 219F fluidly isolates the injection system 104 from the nozzle supply system 140, the first reservoir 112, and the second reservoir 113.

In some implementations, as shown in fig. 2, the nozzle supply system 240 includes a capillary tube 241, the capillary tube 241 extending generally along a longitudinal direction (i.e., parallel to the X-direction) and defining an opening 243. An opening 243 is located at one end of the capillary 241, and the opening 243 opens into the system 124 at one end. The capillary 241 may be made of glass in the form of fused silica, borosilicate, aluminosilicate, or quartz, for example. The fluid target material 120 flows through the capillary 241 and is ejected through the opening 243. The laplace pressure is the pressure difference between the inside and the outside of a curved surface forming the boundary between the gas region and the liquid region. The pressure difference is caused by the surface tension of the interface between the liquid and the gas. When the first pressure P of the first reservoir 112₁₁₂Above the laplace pressure, the fluid target material 120 exits the opening 243 as the target stream 121.

The nozzle supply system 140 is configured to supply the fluid target material 120 to the system 124. Pressure P of system 124 external to nozzle supply system 140₁₂₄May be equal to or lower than the pressure P applied to the first reservoir system 102₁₁₂So that the fluid target materialMaterial 120 due to pressure P₁₁₂Pressure P (which is applied to nozzle supply system 140) and system 124₁₂₄The pressure differential therebetween is forced away from the nozzle supply system 140. In some implementations, the first pressure P of the first reservoir 112₁₁₂Greater than atmospheric pressure and pressure P of system 124₁₂₄Less than atmospheric pressure.

As described above, the environmental control device 236 is configured to independently control the temperature and pressure of each of the first and second reservoirs 112, 113. The environmental control device 236 is configured to independently and separately control the first pressure P of the first reservoir 112₁₁₂And a second pressure P of the second reservoir 113₁₁₃. The environmental control device 236 is also configured to independently and separately control the first temperature T of the first reservoir 112₁₁₂And a second temperature T of the second reservoir 113₁₁₃. As shown in fig. 2, the environmental control device 236 may be configured to independently control the temperature and pressure of one or more aspects of the nozzle supply system 240. Also, the fluid controller 106 may control one or more aspects of fluid flow within the nozzle supply system 240. These controls are discussed in more detail with reference to the nozzle supply system 540 of FIG. 5.

The environmental control device 236 may include a plurality of components, each configured to independently and separately control the temperature or pressure of any of the first and second reservoirs 112, 113. For example, the environmental control device 236 may include a first pressure P for controlling the first reservoir 112₁₁₂For controlling the second pressure P of the second reservoir 113₁₁₃For controlling the first temperature T of the first reservoir 112₁₁₂And for controlling a second temperature T of the second reservoir 113₁₁₃The component (2). Independently and separately controlling the first pressure P of the first reservoir 112₁₁₂And a second pressure P of the second reservoir 113₁₁₃May be a pressure control assembly in flow communication with the first reservoir 112 or the second reservoir 113, respectively. In some implementations, pressurized gas may be applied to each of the chambers of the first and second reservoirs 112, 113, and by adjusting the pressure of the respective pressurized gases,the corresponding first pressure P can be adjusted₁₁₂And a second pressure P₁₁₃. A pressurized gas that is inert or non-reactive with the fluid target material 120 should be used. For example, the pressurized gas may be a mixture of hydrogen and argon, such as a 2% mixture of hydrogen in argon. Further, the environmental control device 236 may include a controller that analyzes data from various sensors/measurement devices within the device 200 and determines how to adjust components within the device 200 based on such analysis.

In another example, the first temperature T of the first reservoir 112 is independently and separately controlled₁₁₂And a second temperature T of the second reservoir 113₁₁₃May include an oven, a thermocouple device, or be configured to measure and maintain the first temperature T₁₁₂And a second temperature T₁₁₃Another device of each of. For example, the environmental control device 236 may include a pressure sensor on each of the first reservoir 112, the second reservoir 113, and the infusion tank 114. The environmental control apparatus 236 may include one or more thermocouple devices for each zone or area within the apparatus 200 where temperature is to be monitored.

Referring again to fig. 1, in some implementations, the solid substance 122 is an ingot (such as a block or disk) made primarily of tin. The ingot may be at least 99% (or at least 99.9%) pure by weight. This indicates that traces of other non-tin materials (such as lead and antimony) may be present in the solid substance 122. In this example, where the solid substance 122 is a tin ingot, the injection system 104 includes one or more devices that heat the solid substance 122 to a temperature above 450 ° F (which is the melting point of tin). After melting, the solid tin becomes liquid tin and other non-tin materials (such as lead and antimony, or molecules or other constituents). The non-tin material may include one or more molecules, atoms, compounds, or other components, each of which may be in a solid or liquid state depending on the melting point of the component. Liquid tin (in this case, the fluid target material 120) is thus supplied to the injection tank 114. For example, every 400 hours during operation of the nozzle supply system 140, 5 kilograms of a tin ingot can be placed into the implantation chamber 130 in the implantation system 104. In other examples, other ingot sizes may be placed into the implantation chamber 130 at other replacement frequencies.

Referring to fig. 4, an implementation of the injection system 104 (shown in fig. 1) is shown as an injection system 404. The injection system 404 includes an injection tank 414 (for storing the fluid target material 120 and supplying the fluid target material 120 to the first reservoir system 102 and/or the second reservoir system 130), an injection chamber 430 (for reloading the solid material 122), and a fluid transfer system 461. The infusion chamber 430 includes a main cavity 425, the main cavity 425 being large enough to receive the removable carrier 428. The solid substance 122 is received within the second cavity 429 of the removable carrier 428. The implantation chamber 430 includes a removable cover 430L that serves as a mechanism to hermetically seal the main cavity 425 and also to enable removal of the removable carrier 428 when solid matter 122 needs to be replaced. The infusion chamber 430 can comprise, for example, a tubing segment having a central fluid flow passage that is part of the fluid flow path between the infusion chamber 430 and the fluid delivery system 461. A tube segment may extend from the inject chamber 430 and the removable carrier 428, and the interior of the tube segment may be in flow communication with the transfer opening defined by the second cavity 429, and may also be in flow communication with the fluid transfer system 461 via a flow passage.

For example, the fluid delivery system 461 may include a regulating device that controls the flow of fluid from the implantation chamber. In this manner, the conditioning apparatus may control the fluid flow path between the infusion chamber 430 and the infusion tank 414. The conditioning apparatus may comprise, for example, a valve arrangement comprising one or more valves that interact with the central fluid flow passage of the pipe segment, such that the flow of the fluid target material 120 within the central fluid flow passage is controlled by operation of the one or more valves of the valve arrangement.

In some implementations, the valve arrangement of the fluid transfer system 461 may include a freeze valve. The freeze valve may include a pipe section and a thermostat in thermal communication with the pipe section. The conditioning thermostat is configured to vary the temperature of the pipe segment within a temperature range near the melting point of the solid substance 122. The temperature regulating device may be a cartridge heater in thermal communication with the tube segment. For example, if the temperature of the pipe segment remains substantially below the melting point of the solid mass 122, any liquid that has flowed out of the carrier 428 (due to gravity) will solidify as it reaches the central fluid flow channel, and the solid mass blocks the central fluid flow channel to prevent additional fluid from flowing through the central fluid flow channel. Thus, when the thermostat is adjusted to heat the tube segment to a temperature above the melting point of the solid matter 122, the solid matter 122 may melt, and if the temperature is high enough (i.e., above the melting point), the solid matter 122 in the plug will melt and flow freely through the central fluid flow passage.

In certain implementations, the valve arrangement of the fluid transfer system 461 may include a gate valve in addition to the freeze valve, and the gate valve may be placed between the freeze valve and the injection tank 414. The gate valve may be opened before heating the section of the freezing valve so that the molten fluid does not come into contact with the actual gate of the gate valve.

Any components of the device 100 (including the first reservoir system 102, the second reservoir system 103, the injection system 104, and the flow communication device 116) that are in contact with any fluid flow path or fluid cavity should be made of materials that are compatible and non-reactive with the solid mass 122, the fluid target material 120, and any non-target materials (whether in solid or fluid or liquid form) that may be present in the solid mass 122. For example, the structure of the first reservoir 112; the structure of the second reservoir 113; infusion chamber 430, removable carrier 428, conditioning apparatus, or other components in fluid delivery system 461; the conditioning devices 117, 118, 119 and the fluid transfer lines of the flow communication apparatus 116 may be made of various rigid metals or metal alloys.

Further, referring to fig. 5, in some implementations, the nozzle supply system 540 includes a dedicated component 531, the dedicated component 531 configured to operate under the control of the environmental control equipment 236 and the fluid controller 106 to purge fluid targets from interfaces within the nozzle supply system 540 and within the apparatus 100.

In this implementation, the nozzle supply system 540 includes a nozzle assembly 542 having a capillary tube 541 extending generally in a generally longitudinal direction thereof and defining an opening 543 through which the fluid target material 120 exits as a target stream 121. The dedicated assembly 531 comprises a gas line 532, the gas line 532 being fluidly coupled at one end to the flow communication apparatus 116 between the regulating means 117 and the nozzle assembly 542 of the apparatus 200. Gas line 532 is fluidly coupled to a gas source at the other end. The dedicated assembly 531 further comprises a fluid valve 533, such as a service freeze valve for opening and closing a fluid flow path of the gas line 532, which is defined between the gas source at one end and the nozzle assembly 542 and the apparatus 200 at the other end.

The environmental control apparatus 236 includes a temperature regulating device in thermal communication with the flow communication apparatus 116 and the gas line 532 along a path between the regulating device 117 and the nozzle assembly 542, and a pressure regulating device that can pressurize the gas line 532. At certain times, such as when the nozzle assembly 542 needs to be replaced, and prior to replacing the nozzle assembly 542, the fluid controller 106 instructs the fluid valve 533 to open, e.g., if the fluid valve 533 is a freeze valve, it may then be warmed or heated to a temperature above the melting point of the fluid target material 120. The environmental control device 236 may apply a pressure P to the gas line 532₅₃₁Increases to greater than the first pressure P applied to the first reservoir 112₁₁₂Thereby pushing fluidic target material 120 remaining within the nozzle assembly 542 and/or in the flow path between the nozzle assembly 542 and the first reservoir 112 back into the first reservoir 112.

The nozzle supply system 540 may also include a nozzle valve system 545 located between the capillary tube 541 and the gas line 532. Nozzle valve system 545 may be configured to fluidly isolate nozzle assembly 542 from apparatus 200 after fluid target material 120 has been purged from flow communication apparatus 116.

Referring to fig. 6, while nozzle supply system 140 is operating to produce fluid target material 120 to system 124, a process 670 is performed by apparatus 100 to control the transfer of fluid target material 120 to nozzle supply system 140 (shown in fig. 1). Reference is additionally made to fig. 8A in discussing the steps of process 670. Fig. 8A depicts relevant components of an implementation of device 100 through various steps in process 670.

Initially, as shown in FIG. 8AThe injection system 104 is shown receiving solid matter 122 comprising a target material. The injection system 104 is maintained at an injection pressure P₁₁₄. For example, referring to fig. 4, a lid 430L on the inject pocket 430 may be opened or removed from the body of the inject pocket 430 to enable the solid matter 122 to be received within the inject pocket 430 (or the removable carrier 428). During this time, the implantation chamber 130 is thus exposed to atmospheric pressure. The solid matter 122 may have a size and weight based on the size of the implantation chamber 430. Further, this process of opening the lid 430L and inserting the solid substance 122 into the injection chamber 430 can be automated without manual intervention.

In addition, the flood chamber 430 (or the removable carrier 428) may be equipped with a sensor system that can detect when the lid 430L is closed or when solid matter 122 is present within the flood chamber 430.

During which time (where the injection system 104 receives the solid material 122 671]) Due to the injection pressure P₁₁₄At atmospheric pressure, the injection system 104 may be fluidly isolated from the rest of the apparatus 100. For example, prior to opening the injection system 104 to receive the solids 122, the fluid controller 106 may instruct the adjustment device 119 to close to fluidly isolate the injection system 104 from the second reservoir 113, the first reservoir 112, and the nozzle supply system 140. In this manner, during this time, the fluid target material 120 is prevented from being transferred from the main tank 114 to any one of the second reservoir 113, the first reservoir 112, and the nozzle supply system 140 via the flow communication connection 116.

The injection system 104 generates fluid target material 120[673 ] from the solid matter 122]. An example of how the injection system 104 may produce the fluid target material 120 from the solid matter 122 is provided next with reference to FIG. 4. Initially, the main cavity 425 of the infusion chamber 430 can be sealed by, for example, securing a cover 430L to the remainder of the infusion chamber 430. The cavity of the infusion tank 414 and the main cavity 425 may be in flow communication with each other to enable pressure equalization and also to enable the final target material fluid 120 to flow freely from the infusion chamber 430 to the infusion tank 414. At this point, the main chamber 425, at least a portion of the delivery system 461, and the chamber of the infusion canister 414 may be maintained at an infusion pressure P that is less than atmospheric pressure₁₁₄. Next, the inserted solidThe substance 122 is heated to a temperature above the melting point of the solid substance 122 until the solid substance 122 becomes the fluid target material 120.

During the period of time that the fluid target material 120 is being produced 673 by the solid substance 122 within the injection system 104, the regulating device 119 continues to isolate the injection system 104 from the second reservoir 113, the first reservoir 112, and the nozzle supply system 140. In this manner, the operation of nozzle supply system 140 to supply fluid target material 120 to system 124 may be maintained.

Furthermore, during the time that the nozzle supply system 140 supplies the fluid target material 120 to the system 124, the fluid control system 190 maintains flow communication between the first reservoir 112 and the nozzle supply system 140 [675 ]]. For example, the fluid controller 106 may instruct the regulating device 117 to remain open during this time to effect the transfer of the fluid target material 120 from the first reservoir 112 to the nozzle supply system 140 via the flow communication connection 116. In addition, the environmental control device 236 (FIG. 2) maintains the first reservoir 112 at the first pressure P₁₁₂And a first pressure P₁₁₂Greater than the injection pressure P₁₁₄. The environmental control device 236 (FIG. 2) may also ensure the first pressure P of the first reservoir 112₁₁₂Greater than pressure P₁₂₄To achieve an efficient continuous transfer of the fluid target material 120 from the first reservoir 112 to the nozzle supply system 140 during operation of the nozzle supply system 140.

When the fluid target material 120 is at the injection pressure P in the injection system 104₁₁₄When generated, referring to fig. 8A, the fluid control system 190 enables the fluid target material 120 to be transferred [677 ] between the first reservoir 112 and the second reservoir 113 at least a portion of the time during operation of the nozzle supply system 140]. For example, the fluid controller 106 may instruct the regulating device 118 to open to effect transfer of the fluid target material 120 between the first reservoir 112 and the second reservoir 113 through the flow communication connection 116.

Referring to fig. 7, while nozzle supply system 140 is operating to produce fluid target material 120 to system 124, a process 780 is performed by apparatus 100 to control the transfer of fluid target material 120 to nozzle supply system 140 (shown in fig. 1). Reference is additionally made to fig. 8B in discussing the steps of the process 780. Fig. 8B depicts relevant components of an implementation of device 100 through various steps in a process 780.

Initially, as shown in FIG. 8B, and as described above, the injection system 104 receives the solid substance 122[781 ] including the target material]. The injection system 104 is maintained at an injection pressure P₁₁₄. For example, referring to FIG. 4 and as described above, the solid matter 122 may be received within the injection chamber 430. During this time, the implantation chamber 130 is thus exposed to atmospheric pressure and the implantation system 104 may be fluidly isolated from the rest of the apparatus 100. For example, prior to opening the injection system 104 to receive the solids 122, the fluid controller 106 may instruct the adjustment device 119 to close, thereby fluidly isolating the injection system 104 from the second reservoir 113, the first reservoir 112, and the nozzle supply system 140. In this manner, during this time, the fluid target material 120 is prevented from being transferred from the main tank 114 to any one of the second reservoir 113, the first reservoir 112, and the nozzle supply system 140 via the flow communication connection 116.

The injection system 104 generates a fluid target material 120[783] from the solid material 122. For example, and as described above, the inserted solid substance 122 is heated to a temperature above the melting point of the solid substance 122 until the solid substance 122 becomes the fluid target material 120. During this time, the adjustment device 119 continues to isolate the injection system 104 from the second reservoir 113, the first reservoir 112, and the nozzle supply system 140.

In this manner, the operation of nozzle supply system 140 to supply fluid target material 120 to system 124 may be maintained.

Additionally, during the time that the nozzle supply system 140 supplies the fluid target material 120 to the system 124, the fluid control system 190 maintains flow communication between the first reservoir 112 and the nozzle supply system 140 [785 ]]. For example, and as described above, the fluid controller 106 may instruct the regulating device 117 to remain open during this time to effect transfer of the fluid target material 120 from the first reservoir 112 to the nozzle supply system 140 via the flow communication connection 116. In addition, the environmental control device 236 (FIG. 2) maintains the first reservoir 112 at the first pressure P₁₁₂First, aPressure P₁₁₂Greater than the injection pressure P₁₁₄. The environmental control device 236 (FIG. 2) may also ensure the first pressure P of the first reservoir 112₁₁₂Greater than pressure P₁₂₄To achieve an effective continuous rotation of the fluid target material 120 from the first reservoir 112 to the nozzle supply system 140 during operation of the nozzle supply system 140.

When the first reservoir 112 and the nozzle supply system 140 are fluidly isolated from the injection system, referring to fig. 8B, the fluid control system 190 enables the fluid target material 120 to be transferred between the injection system 104 and the second reservoir 113 at least a portion of the time during operation of the nozzle supply system 140 [787 ]. For example, the fluid controller 106 may instruct the regulating device 119 to open or remain open (if already open) to effect transfer of the fluid target material 120 between the injection system 104 and the second reservoir 113 via the flow communication connection 116. Additionally, during this time, the fluid controller 106 may instruct the regulating device 118 to close or remain closed (if already closed) to isolate the second reservoir 113 and the injection system 104 from the first reservoir 112 and the nozzle supply system 140. In this manner, the operation of nozzle supply system 140 to supply fluid target material 120 to system 124 may be maintained.

Either or both of the processes 670 and 780 may also ensure the first pressure P of the first reservoir 112 while the fluid target material 120 is enabled to transfer between the injection system 104 and the second reservoir 113₁₁₂Is maintained at a pressure greater than the second pressure P₁₁₃And injection pressure P₁₁₄Such as in fig. 8B.

In some implementations, the transfer of the fluid target material 120 to the nozzle supply system 140 throughout operation of the nozzle supply system 140 may be accomplished by flowing the fluid target material 120 from the first reservoir 112 to the nozzle supply system 140, from the second reservoir 113 to the nozzle supply system 140, or from both the first reservoir 112 and the second reservoir 113 to the nozzle supply system 140.

Further, the environmental control device 236 may control the temperature and pressure of the fluid target material 120 in each of the first reservoir 112, the second reservoir 113, and the injection system 104 in an independent and separate manner during either or both of the processes 670, 780.

During a normal operating mode of the apparatus 100, each of the first reservoir 112 and the second reservoir 113 has sufficient fluid target material 120 to supply the fluid target material 120 to the nozzle supply system 140 without interrupting operation of the nozzle supply system 140 to provide the target stream 121 to the system 124. In normal operation, as shown in FIG. 8A, the first pressure P₁₁₂(applied to the first reservoir 112) and a second pressure P₁₁₃Is maintained at a high value (applied to the second reservoir 113). For example, the first pressure P₁₁₂And a second pressure P₁₁₃Each may be maintained at or above 6000 kilopascals (kPa), at least 10,000kPa, at least 25,000kPa, or in a range of 6000kPa to 60,000 kPa. First pressure P₁₁₂And a second pressure P₁₁₃Can be maintained at a pressure P greater than the system₁₂₄Such that the fluid target material 120 can be pushed through the nozzle supply system 140 and to the system 124. In this case, both the first reservoir 112 and the second reservoir 113 may supply the fluid target material 120 to the nozzle supply system 140. In addition, during the normal operating mode, the temperature T applied to the first reservoir 112 and the second reservoir 113₁₁₂And T₁₁₃May be maintained at a level above the melting point of the fluid target material 120, respectively, to ensure that the fluid target material 120 is maintained in a fluid state.

During the normal mode of operation, as shown in fig. 8A, the regulating device 119 is closed to isolate the first reservoir 112, the second reservoir 113 and the nozzle supply system 114 from the injection system 104. Because the injection system 104 is completely isolated from the rest of the apparatus 100, the fluid target material 120 can be injected (i.e., prepared) in the injection system 104 during the normal operating mode without affecting the normal operating mode. In particular, the injection of the fluid target material 120 in the injection system 104 requires that the injection system 104 operate at a different pressure and temperature than the other components of the apparatus 100 (e.g., the first reservoir system 102 and the second reservoir system 103). Because the injection system 104 is flow and environmentally isolated from the rest of the apparatus 100 during the normal operating mode, this process of injecting the fluid target material 120 in the injection system 104 may be operated in parallel with the normal operating mode.

The fluid target material 120 may be prepared in the injection system 104 as described below and with reference to fig. 4. Specifically, the solid material 122 is inserted into the injection chamber 430. The temperature of the injection system 104 may be maintained at room temperature while the solid matter 122 is inserted into the injection chamber 430. Further, if a removable carrier 428 is used, the solid substance 122 may be inserted first into the removable carrier 428, then the removable carrier 428 may be inserted into the injection chamber 430, and then the lid 430L may seal the injection chamber 430. Once the solid matter 122 is in the injection chamber 430, the temperature of the injection chamber 430 is raised until the solid matter 122 melts into the fluid target material 120, at which point the fluid delivery system 461 controls the flow of the fluid target material 120 into the injection tank 414, and the injection tank 414 is maintained at a temperature above the melting point of the fluid target material 120. Thus, the fluid target material 120 may be stored within the injection tank 414 for later use by the apparatus 100.

During normal operation, as the fluid target material 120 is used by the nozzle supply system 140 to produce the target stream 121, the amount of the fluid target material 120 is gradually depleted from either or both of the first reservoir 112 and the second reservoir 113, as shown in fig. 8A. At some point during normal operation, as shown in fig. 9A, the amount of fluid target material 120 in the first reservoir 112 and the second reservoir 113 becomes so low that it is necessary to switch from the normal operating mode of the device 100 to the supplemental operating mode of the device 100.

At the start of the replenishment mode, as shown in fig. 9B, the regulating device 118 is closed, thus serving to fluidly isolate the first reservoir 112 and the nozzle supply system 140 on one side from the second reservoir 113 on the other side. Once the regulating means 118 is closed, the ambient control device 236 depressurizes the second reservoir 113, which means that the pressure P applied to the second reservoir 113₁₁₃Is brought to a suitable low pressure, which may be near or at atmospheric pressure. For example, pressure P₁₁₃May be depressurized to a pressure equal to or lower than 600 kPa. At this time, the pressure P applied to the first reservoir 112₁₁₂Remain high (such as equal to or higher than 6000kPa or equal to a value between 6000kPa and 60,000 kPa) to enable the fluid target material 120 to continue to supply the nozzle supply system 140. Next, as shown in fig. 9C, the pressure P once applied to the second reservoir 113₁₁₃Having reached the appropriate low pressure, the fluid controller 106 instructs the regulating device 119 to open, thereby allowing fluid flow between the injection system 104 (and in particular the injection tank 114) and the second reservoir 113. Once the regulating device 119 is opened, the fluid target material 120 flows freely from the injection tank 114 to the second reservoir 113, as shown. The fluid target material 120 continues to flow into the second reservoir 113 until the fluid target material 120 within the injection tank 114 falls below a threshold value (or until the fluid target material 120 is depleted from the injection tank 114). In some implementations, the injection tank 114 can store a volume of the fluid target material 120 that exceeds the volume within the second reservoir 113. In these implementations, the second reservoir 113 may be prevented from being overfilled with the fluid target material 120 by: the second reservoir 113 and the injection tank 114 are properly positioned relative to each other along the Z-direction such that the minimum level of the fluid target material 120 within the injection tank 114 is always below the top of the second reservoir 113.

As described above, in some implementations, the conditioning device 119 is a freeze valve. In these implementations, to open the regulating device 119, the regulating thermostat heats the tube segment of the regulating device 119 to a value above the melting point of the fluid target material 120 to melt any solid matter 122 previously formed as a plug within the tube segment of the regulating device 119 (when the regulating device 119 is closed). The solid material 122 is thereby melted and the fluid target material 120 may flow through the pipe segment.

Next, as shown in fig. 9D, the fluid controller 106 instructs the regulating device 119 to close. In implementations where the conditioning device 119 is a freeze valve, a conditioning temperature conditioning device within the conditioning device 119 cools the conditioning area of the conditioning device 119 until the pipe segment reaches a temperature below the melting point of the fluid target material 120. Eventually, the fluid target material 120 solidifies within the pipe segment and forms a plug that prevents the fluid target material 120 from flowing through the regulating device 119. Once the adjustment device 119 is completely closed,the environmental control device 236 re-pressurizes the second reservoir 113, which indicates that the pressure P applied to the second reservoir 113₁₁₃Is brought to a suitable elevated pressure which may be at or above 6000kPa, or in the range of 6000kPa to 60,000 kPa. At this point, in some implementations, the pressure P applied to the second reservoir 113₁₁₃May be related to the pressure P applied to the first reservoir 112₁₁₂The same is true. Next, once the pressure P is applied₁₁₃To achieve the appropriate high pressure, as shown in FIG. 9E, the fluid controller 106 instructs the regulating device 118 to open. The fluid target material 120 is able to flow from the second reservoir 113 to the first reservoir 112, as shown in fig. 9F.

The supplementary mode ends and the normal operation mode of the device 100 resumes. In some implementations, as shown in fig. 9G, at this point of the normal operating mode, the fluid target material 120 may also be delivered from the second reservoir 113 to the nozzle supply system 140 and from the first reservoir 112 to the nozzle supply system 140.

In a normal operating mode, the injection system 104 may be used to inject (prepare) the fluid target material 120 from the solid matter 122. The injection system 104 may inject the fluid target material 120 from the solid substance 122 at a fixed frequency, or every few hours, every few tens of hours, or every few hundreds of hours. In some implementations, the injection system 104 may inject the fluid target material 120 from the solid matter 122 when instructed to do so.

At all times during the normal mode of operation and the supplemental mode of operation (throughout the steps shown in fig. 9A-9G), the fluid target material 120 is supplied from the first reservoir 112 to the nozzle supply system 140 to enable the nozzle supply system 140 to continuously generate the target stream 121 for use by the system 124.

The cycle described above with reference to fig. 9A-9G may be repeated during operation of the nozzle supply system 140 to continuously supply the fluid target material 120 to the nozzle supply system 140.

At some point during operation of the apparatus 100, the nozzle assembly 542 of the nozzle supply system 540 may need to be replaced. To do so, excess fluid target material 120 within flow communication device 116 should flow from the extension to nozzle assembly 542The path is drained back into the first reservoir 112 (or second reservoir 113). In particular, referring to FIG. 5, fluid valve 533 is open (while nozzle valve system 545 is open), and pressure P is under the control of environmental control device 236₅₃₁Gas applied into gas line 532 and a fluid path extending from nozzle assembly 542 back to first reservoir 112 (or second reservoir 113). If the fluid valve 533 is a freeze valve, the temperature within the valve rises to a level above the melting point of the fluid target material 120, thereby opening the fluid valve 533. Pressure P applied to gas within gas line 532₅₃₁Greater than the pressure P applied to the first reservoir 112₁₁₂(or greater than the pressure P applied to the second reservoir 113₁₁₃). Higher pressure P₅₃₁Causing the fluid target material 120 to be pushed away from the nozzle assembly 542 and back into the first reservoir 112 or the second reservoir 113 (when the regulating device 117 is open). At this point, nozzle valve system 545 may be closed, fluid valve 533 may be closed (e.g., by cooling), and nozzle assembly 542 may be removed and replaced with a new nozzle assembly.

In this manner, the nozzle assembly 542 may be replaced without replacing any of the first reservoir 112, the second reservoir 113, or the injection tank 114.

Applying a pressure P to the gas line 532₅₃₁The combined high temperature T534 may be large enough to clear the fluidic target material 120 from the flow path of the flow communication device 116 even beyond the first reservoir 112, as long as the regulating means 117, 118, 119 are all open and the flow communication device 116 is maintained at a temperature above the melting point of the fluidic target material 120.

In summary, the above-described apparatus 100, 200, 300, processes, and modes of operation enable the nozzle supply system 140 to continuously operate to supply the target stream 121 to the system 124 to achieve desired performance specifications for the system 124 without interruption to reload the solid matter 122 and to inject/prepare the fluid target material 120 from the solid matter 122.

Because the first and second reservoirs 112, 113 and the injection system 104 may be fluidly and environmentally separated from the nozzle supply system 140, the time taken to replace any components within the apparatus 100 may be significantly reduced, and may occur even while the nozzle supply system 140 is generating the target stream 121, as long as one of the first or second reservoirs 112, 113 is supplying the fluid target material 120 to the nozzle supply system 140.

Newly added solid matter 122 is added to the injection system 104, the injection system 104 including an injection chamber 130, during which the injection chamber 130 may be maintained at a low pressure. Also, the solid substance 122 melts while in the original high vacuum environment within the implantation chamber 130 to prevent or reduce oxidation within the fluid target material 120.

If any of the fluid delivery lines 115 or conditioning devices 117, 118, 119 within the flow communication apparatus 116 need to be disconnected for maintenance or repair, such disconnection may be performed after the fluid target material 120 is first purged from the flow communication apparatus 116 by controlling the pressure at different locations along the path toward the nozzle supply system 140. As described above, for example, to clear the fluid flow path from the nozzle supply system 140 to the first reservoir 112, the gas line 532 may be pressurized (to greater than the pressure P) while the regulating device 117 is open₁₁₂Pressure of).

As another example, to clear the fluid flow path from the first reservoir 112 to the second reservoir 113, the pressure P is at the same time that the regulating device 118 is open (and the regulating device 117 is closed)₁₁₂Can be increased to be greater than the pressure P₁₁₃The value of (c). Finally, to clear the fluid flow path from the second reservoir 113 to the injection system 104, the pressure P is opened (and the regulating device 118 is closed) while the regulating device 119 is open₁₁₃Can be increased to be greater than the pressure P₁₁₄The value of (c). Similar to the gas interface provided by the fluid valve 533 at the nozzle supply system 540, another gas interface may be provided between the injection tank 114 and the second reservoir 113 to push the fluid target material 120 from the injection tank 114 into the second reservoir 113 (while keeping the regulating device 119 open and the regulating device 118 closed). Once the injection tank 114 is purged of the fluid target material 120, the regulating device 119 may be closed and the injection tank 114 may then be replaced.

The removal of the fluid target material 120 from within the fluid transfer line 115 and conditioning devices 117, 118, 119 enables a modular architecture within the apparatus 100. In this manner, not all of the components within the apparatus 100 and the nozzle supply system 140 need to be replaced when only one of the components within the apparatus 100 is not operational. For example, only the inactive nozzle supply system 140 need be replaced (without replacing components within the apparatus 100). As another example, only the inactive reservoir (first reservoir 112 or second reservoir 113) need be replaced without having to replace the other reservoir or the injection system 104 or the nozzle supply system 140 (or even interfere with the operation of the nozzle supply system 140).

Any components operating at low pressure (e.g., about or near atmospheric pressure) may also be maintained in a relatively cool environment, such as near room temperature. Further, even when the first reservoir 112 is operating at high pressure to supply the fluid target material 120 to the nozzle supply system 140, reloading of the solid matter 122 may occur in such a low pressure/cold environment.

The apparatus 100, 200, 300, processes, and modes of operation enable the nozzle supply system 140 to be in operation and supply the target stream 121 at least 80% of the time, at least 90% of the time, or at least 99% of the time (e.g., 99.2% of the time). The average time required to replace the nozzle assembly 542 is reduced to less than 6 hours, less than 5 hours, or about 4.5 hours compared to what was previously achievable. This results in a reduction in ownership cost and a reduction in service man-hours for servicing the equipment or nozzle supply system 140 over time.

In some implementations, and with reference to fig. 10, the device 100 is a device 1000 that further includes a liquid level sensing device 1035 configured to estimate the volume of the fluid target material 120 in the second reservoir 113 at different points in time during the normal or supplemental modes of operation. The level sensing device 1035 may utilize one or more of electrical, magnetic, and ultrasonic components to achieve an estimate of the volume or level of the fluid target material 120. The level sensing device 1035 may be capable of withstanding the pressure P applied to the second reservoir 113₁₁₃Any of the devices of (1). In addition to this, the present invention is,in some implementations, the device 1000 may include another level sensing device 1035 configured to estimate the volume of the fluidic target material 120 in the first reservoir 112.

In some implementations, the liquid level sensing device 1035 may include one or more high pressure transducers. While the following discussion refers to only one high pressure transducer, the liquid level sensing device 1035 is not limited to having only one high pressure transducer. The level sensing device 1035 may include a transducer that may operate at high pressure (such as at the pressure at which the second reservoir 113 may operate) and be included in the second reservoir 113.

The high pressure transducer is a pressure sensor that measures the pressure of the gas within the second reservoir 113. The high pressure transducer 1035 generates a signal as a function of the pressure applied thereto. The high pressure transducer 1035 may measure the pressure of the gas within the second reservoir 113 such that as the volume of the fluid target material 120 in the second reservoir 113 changes, the pressure of the gas within the second reservoir 113 (and above the fluid target material 120) also changes. For example, when the second reservoir 113 is filled with the fluid target material 120 such that the volume of the fluid target material 120 increases (such as during a replenishment mode as shown in fig. 9C and 9D), the gas in the second reservoir 113 (and above the fluid target material 120) is slowly compressed within the second reservoir 113.

A high voltage transducer 1035 may be useful, as follows. In particular, the environmental control device 236 may set a pressure differential between the second reservoir 113 and the injection tank 114 to facilitate faster transfer of the fluid target material 120 from the injection tank 114 to the second reservoir 113. Specifically, the environmental control device 236 may ensure that the pressure P applied to the injection tank 114 is maintained prior to performing the steps shown in FIG. 9C₁₁₄Higher than the pressure P applied to the second reservoir 113₁₁₃. For example, the pressure P in the injection tank 114₁₁₄May be greater than the pressure P in the second reservoir 113₁₁₃100 and 200 kPa. Because the environmental control device 236 is applying this pressure differential, the second reservoir 113 is filled more quickly and, importantly, ensures that the second reservoir 113 is not overfilled with the fluid target material 120.

In this manner, the high pressure transducer 1035 enables a control system 1092 within the device 1000 (such control system 1092 may include aspects or components of the environmental control device 236 and/or the fluid controller 106) to track or monitor changes in the volume of the fluid target material 120 in the second reservoir 113. The output of the high pressure transducer 1035 may be an electrical signal representing the amount of the substance of the fluid target material 120 in the second reservoir 113. Also, this output may be analyzed by the control system 1092 to determine when to shut down the regulating device 119 or when a next refill or replenishment of the fluid target material 120 is required. For example, the control system 1092 may instruct the fluid controller 106 to reload the injection tank 114 each time the level of the fluid target material 120 within the second reservoir 113 drops below a certain level.

The control system 1092 may estimate the volume of the fluid target material 120 in the second reservoir 113 using the following equation:

(P₁₁₃)i×[V₁₁₃-(V₁₂₀)i]＝(P₁₁₃)f×[V₁₁₃-(V₁₂₀)i-Vt]wherein (P)₁₁₃) i is the initial pressure (P) of the second reservoir₁₁₃) i (known before the refill in fig. 9C begins); v₁₁₃Is the total volume of the second reservoir (known); (V)₁₂₀) i is the initial volume of fluid target material 120 remaining in the second reservoir (before the refill of fig. 9C begins); (P)₁₁₃) f is the current pressure in the second reservoir 113, which is the output from the high pressure transducer 1035; and Vt is the volume of fluid target material 120 that has been transferred from the infusion tank 114 to the second reservoir 113. Vt may be determined from a level sensor in the fill tank 114. In other implementations, other relationships and parameters may be used to estimate the volume of the fluid target material 120 in the second reservoir 113.

As the fluid target material 120 flows from the injection tank 114 to the second reservoir 113 (such as shown in fig. 9C), the output (P) of the high pressure transducer 1035₁₁₃) f is constantly changing and with each new value, the control system 1092 acquires the pressure P₁₁₃And this information can be used to understand, for example, that it has been transferred to the second reservoir113, and/or an initial volume (V) of the fluid target material 120 remaining in the second reservoir 113₁₂₀) And i. By knowing how much fluid target material 120 remains in the second reservoir 113 and how much fluid target material 120 remains in the first reservoir 112 before refilling (before the step shown in fig. 9C), the control system 1092 can determine the amount of fluid target material 120 used per period of time (the rate of consumption of the fluid target material 120). The control system 1092 may use the determined consumption rate to determine when to instruct the fluid controller 106 to trigger a refill in the second reservoir 113. In this manner, the first reservoir 112 may continuously provide a source of the fluid target material 120 to the nozzle supply system 140 at all times during operation of the nozzle supply system 140. The information from the pressure transducer 1035 may also be used to estimate the total amount of fluid target material 120 remaining in the first reservoir 112 and the second reservoir 113.

Furthermore, in the depicted implementation, when the high pressure transducer 1035 monitors the volume of the fluid target material 120 in the second reservoir 113, the second reservoir 113 may be prevented from being overfilled with the fluid target material 120 from the injection tank 114. For example, when the high pressure transducer 1035 reaches steady state, the compression of the gas within the second reservoir 113 has reached an upper limit. In this way, the second reservoir 113 has been completely filled with the fluid target material 120. The fluid control system 1092 may then prevent the fluid target material 120 from continuing to flow between the injection system 104 and the second reservoir 113. In this way, the second reservoir 113 may be prevented from being overfilled with the fluid target material 120.

In these implementations, the calculations may be performed by the control system 1092 after the fluid target material 120 has been transferred from the injection tank 114 to the second reservoir 113 (i.e., after the step shown in fig. 9C is completed), and before the first reservoir 112 and the second reservoir 113 are connected by opening the regulating device 118 (i.e., before the step shown in fig. 9E begins). The calculation includes estimating the volume Vt of the fluid target material 120 that has been transferred from the injection tank 114 to the second reservoir 113 using the equation described above (fig. 10). In addition, the control system 1092The total volume (V) of the fluid target material 120 contained within the second reservoir 113 may be calculated from the flow equation₁₂₀)t：

(V₁₂₀)t＝(V₁₂₀) The total volume (V) of the fluid target material 120 in the i + Vt. second reservoir 113₁₂₀) t is calculated as the initial volume (V) of the fluid target material 120 retained in the second reservoir 113₁₂₀) i and the volume Vt of the fluid target material 120 that has been transferred from the injection tank 114 to the second reservoir. The control system 1092 may also be based on the total volume (V) of the fluid target material 120 in the second reservoir₁₂₀) t and the known dimensions of the interior of the second reservoir 113 to estimate the height of the fluid target material 120 in the second reservoir 113.

In the depicted implementation, the control system 1092 may also perform these same calculations for the first reservoir 112.

Once the height of the fluid target material 120 is known or estimated in both the first reservoir 112 and the second reservoir 113, the control system 1092 may estimate or calculate the height difference Δ h. The height difference Δ h is the height of the fluid target material 120 in the second reservoir 113 minus the height of the fluid target material 120 in the first reservoir 112. The control system 1092 may calculate the head pressure Δ Ph based on the estimated height difference Δ h using the following equation:

ΔPh＝ρ120×g×Δh，

where ρ 120 is equal to the density of the fluid target material 120 and g is the gravitational constant.

The control system 1092 may instruct the environmental control device 236 to control the second pressure P of the second reservoir 113 based on the calculated head pressure Δ Ph₁₁₃. For example, the environmental control device 236 may pressurize the second reservoir 113 such that its pressure P₁₁₃Is equal to the first pressure P of the first reservoir 112₁₁₂And the head pressure Δ Ph. All this may occur during operation of the nozzle supply system 140, and the control system 1092 may repeatedly perform this calculation and instruct the environmental control device 236 to adjust or reset the second pressure P of the second reservoir 113₁₁₃. In this manner, the fluid target material 120 is continuously suppliedThe level (or height) of the fluid target material 120 in the first reservoir 112 and the second reservoir 113 may be maintained while supplied to the nozzle supply system 140.

Further, the control system 1092 may calculate the total amount of fluid target material 120 within the apparatus 1100 that is available before replenishment is needed by analyzing: the amount of fluidic target material 120 within each of the first reservoir 112 and the second reservoir 113; the amount of time that the first reservoir 112 has supplied the fluid target material 120 to the nozzle supply system 140; and the amount of fluid target material 120 transferred from the injection tank 114.

As shown in fig. 11, in another implementation 1100 of the device, environmental control device 236 is an environmental control device 1136 that includes a pressurized reservoir 1193. Environmental control device 1136 is fluidly connected to first reservoir 112 and second reservoir 113 by a flow communication connection 1194. The pressurized reservoir 1193 contains an inert gas that may be transferred from the pressurized reservoir 1193 to the first reservoir 112 and/or the second reservoir through the open orifice 1195 via the flow communication connection 1194. The orifice 1195 may be sized such that when the orifice 1195 is open, the orifice 1195 allows gas in the pressurized reservoir 1193 to be slowly transferred from the pressurized reservoir 1193 to the first reservoir 112 and/or the second reservoir 113.

In this implementation, and referring to fig. 11, the level (or height) of the fluidic target material 120 can be indirectly measured by releasing a volume of gas from the pressurized reservoir 1193 into the first reservoir 112 and the second reservoir 113 through the open orifice 1195. The pressure drop of the pressurized reservoir 1193 may be measured and the volume of gas that has been transferred from the pressurized reservoir 1193 to the first reservoir 112 and the second reservoir 113 may be estimated. The volume of gas that has been transferred from the pressurized reservoir 1193 may be used to estimate the volume of fluidic target material 120 remaining in the first reservoir 112 and the second reservoir 113. For example, the volume of gas that has been transferred from the pressurized reservoir 1193 may be estimated from the total pressure drop in the first and/or second reservoirs 112, 113 and the measured final pressure (at the first and/or second reservoirs 112, 113). The volume of the fluidic target material 120 remaining in the first reservoir 112 and the second reservoir 113 can then be calculated as the difference between the volume of gas that has been transferred from the pressurized reservoir 1193 and the total volume of the combined first reservoir 112 and second reservoir 113.

In the depicted implementation, the gas pressure P applied to the second reservoir 113₁₁₃May be lower than the gas pressure P applied to the first reservoir 112₁₁₂So that the second pressure P₁₁₃Less than the first pressure P₁₁₂。

In addition, the head pressure PH of the fluid target material 120 within the first reservoir 112₁₁₂Is the pressure applied from the column of the fluid target material 120 to the base of the first reservoir 112, and the head pressure PH of the fluid target material 120 within the second reservoir 113₁₁₃Is the pressure applied from the column of fluid target material 120 to the base of the second reservoir 113. The total pressure in the first reservoir 112 (from P) before opening the orifice 1195₁₁₂+PH₁₁₂Given) is equal to the total pressure (given by P) in second reservoir 113₁₁₃+PH₁₁₃Given). However, because of the gas pressure P in the first reservoir 112₁₁₂Higher than the gas pressure P in the second reservoir 113₁₁₃The inert gas leaks into the second reservoir 113 and the column of fluidic target material 120 in the second reservoir 113 flows into the first reservoir 112 once the environmental control device 1136 opens the orifice 1195.

The gas pressure differential (i.e., P) of the first reservoir 112 and the second reservoir 113₁₁₂-P₁₁₃) The fluid target material 120 is allowed to flow from the second reservoir 113 to the first reservoir 112 at a particular rate. The flow rate of the fluid target material 120 from the second reservoir 113 to the first reservoir 112 is controlled by the flow rate of the inert gas transferred from the pressurized reservoir 1193 to the first reservoir 112 (as this controls the pressure of the gas within the first reservoir 112). When the inert gas is transferred into the second reservoir 113, it is still at a higher pressure than the gas pressure within the second reservoir 113, and this pressure difference is vented by the gas control system connected to the second reservoir 113 so that the gas pressure in the second reservoir 113 is maintained and the fluid is ready for useThe target material 120 may continue to be delivered to the nozzle supply system 140 while the fluid target material 120 may be supplied to the first reservoir 112. In this manner, the flow rate of the fluidic target material 120 from the second reservoir 113 to the first reservoir 112 may be controlled to ensure that the formation of the target stream 121 from the nozzle supply system 140 is not adversely affected by upstream instabilities in the flow of the fluidic target material 120.

Referring to fig. 12, the injection system 104 is designed as an injection system 1204. The injection system 1204 effectively acts as a phase change vacuum passage and a single flow prevention device 1261, the passage including only two volumes, one defined by the injection chamber 1230 (which receives the solid matter 122) and one defined by the injection canister 1214, the single flow prevention device 1261 may be a freeze valve in some implementations. The flow blocking device 1261 acts as a fluid transfer system 461 between the injection chamber 1230 and the injection canister 1214.

The injection system 1204 may also include an environmental control device 1205. In some implementations, the environmental control apparatus 1205 includes a pressure system 1205p, the pressure system 1205p configured to regulate a relative or differential pressure between two volumes such that the fluid target material 120 is urged from the injection chamber 1230 to the injection canister 1214. In other implementations, the injection chamber 1230 is disposed above the injection canister 1214 and gravity causes any fluid target material 120 to fall from the injection chamber 1230 into the injection canister 1214. The environmental control apparatus 1205 also includes a temperature system 1205t, the temperature system 1205t configured to regulate the temperature of the freeze valve 1261 and the injection chamber 1230 and injection tank 1214.

The injection system 1204 does not have any other internal valves between the injection chamber 1230 and the injection canister 1214. However, the injection system 1204 uses a phase change (between liquid and solid) to transfer the material into a vacuum environment. In this case, the fluid target material 120 is transferred to the vacuum environment of the injection tank 1214. Despite the simple design, the injection system 1204 is configured to avoid exposing the fluid target material 120 to ambient air, which exposure may create unwanted contaminants into the fluid target material 120.

Referring to fig. 13A-13D, the process is performed. Initially, as shown in FIG. 13A, a door or cover on the implantation chamber 12301230L is opened and the solid substance 122 is inserted into the volume of the injection chamber 1230. At this time, the pressure system 1205P of the environment control apparatus 1205 maintains the pressure of the injection tank 1214 at the vacuum level P_V(sub-atmospheric) while the pressure of the implantation chamber 1230 is vented to the air/atmosphere P_A. Additionally, the temperature system 1205t of the injection chamber 1230 and freeze valve 1261 is at a temperature below the melting point of the solid material 122.

As shown in fig. 13B, once the solid material 122 is within the volume of the injection chamber 1230, the cover 1230L is closed. The pressure system 1205P then pumps the volume of the implantation chamber 1230 to a level P below atmospheric pressure_V'. Pressure P of implant chamber 1230_V' may be at a pressure P greater than the injection tank 1214_VOr the pressure P of the injection chamber 1230_V' pressure P that can be injected into tank 1214_VThe same (if gravity is used to influence the flow).

As shown in fig. 13C, the temperature system 1205t heats the solid substance 122 injected into the chamber 1230 to a temperature sufficient to melt the solid substance 122 and form the fluid target material 120.

Then, as shown in FIG. 13D, temperature system 1205t heats freeze valve 1261 to a temperature sufficient to melt solid matter within freeze valve 1261 into fluid target material 120. If desired, the temperature system 1205t may additionally heat the injection tank 1214 to ensure that it is at a temperature high enough to maintain the fluid state of the fluid target material 120. Due to the pressure P in the implantation chamber 1230_V' greater than the pressure P in the injection tank 1214_V(in an amount large enough to overcome any competing forces, such as gravity and surface tension), the fluid target material 120 flows out of the injection chamber 1230 and into the injection canister 1214. Alternatively, if the injection chamber 1230 is located above the injection canister 1214 and the pressure in the injection chamber 1230 is equal to the pressure in the injection canister 1214, such flow may occur by gravity.

Once all of the fluid target material 120 has flowed into the injection tank 1214, the temperature system 1205t cools the freeze valve 1261 to a temperature below the melting point of the fluid target material 120, and any remaining fluid target material 120 in the freeze valve 1261 solidifies and forms a fluid (and pressure) barrier so that the process can begin anew as shown in fig. 13A.

Other implementations are within the scope of the following claims. For example, and referring again to fig. 1, in some implementations, the injection tank 114 of the injection system 104 may be configured to operate at high pressures under various conditions. For example, after the injection system 104 has produced enough fluid target material 120, the injection tank 114 may begin operating at a high pressure corresponding to the high pressure applied to the second reservoir 113, and while operating at the high pressure, a fluid flow path may be established between the second reservoir 113 and the injection tank 114.

Other aspects of the invention are set forth in the following numbered clauses.

1. An apparatus for supplying a target material, the apparatus comprising:

a first reservoir system comprising a first reservoir configured to be in flow communication with a nozzle supply system during operation of the nozzle supply system, the first reservoir being maintained at a first pressure;

a second reservoir system comprising a second reservoir configured to be in flow communication with the first reservoir system at least a portion of the time during operation of the nozzle supply system;

an injection system configured to receive solid matter comprising a target material and produce a fluid target material from the solid matter, the injection system maintained at an injection pressure less than the first pressure; and

a fluid control system fluidly connected to the injection system, the first reservoir system, the second reservoir system, and the nozzle supply system, wherein the fluid control system is configured to:

isolating at least one reservoir and the nozzle supply system from the injection system during operation of the nozzle supply system, an

Maintaining a fluid flow path between at least one reservoir and the nozzle supply system during operation of the nozzle supply system.

2. The apparatus of clause 1, wherein the injection pressure is less than about 600 kilopascals (kPa).

3. The apparatus of clause 1, wherein the first pressure is at least 6000kPa, at least 10,000kPa, at least 25,000kPa, or in the range of about 6000kPa to 60,000 kPa.

4. The device of clause 1, wherein the injection system and the second reservoir are maintained at the injection pressure while the second reservoir is refilled with a fluid target material from the injection system, and the injection system and the second reservoir are positioned relative to each other such that the second reservoir is prevented from overfilling with the fluid target material.

5. The apparatus of clause 1, wherein the fluid control system is configured to: maintaining the fluid flow path between the second reservoir and the nozzle supply system during operation of the nozzle supply system while the second reservoir is refilled with a fluid target material from the injection system.

6. The apparatus of clause 1, wherein the fluid control system is configured to purge target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system.

7. The apparatus of clause 1, wherein the fluid control system is configured to maintain the fluid flow path between at least one reservoir and the nozzle supply system during operation of the nozzle supply system by: maintaining the fluid flow path between the first reservoir and the nozzle supply system and between the second reservoir and the nozzle supply system during operation of the nozzle supply system, and simultaneously maintaining the nozzle supply system and the second reservoir at the first pressure.

8. The apparatus of clause 7, wherein the fluid control system is further configured to maintain a fluid flow path between the at least one reservoir and the nozzle supply system and enable the fluid flow path between the first reservoir and the second reservoir during operation of the nozzle supply system.

9. The device of clause 1, further comprising an environmental control device configured to:

independently and separately controlling the first pressure in the first reservoir and the second pressure in the second reservoir, an

Controlling the temperature of the first reservoir and the temperature of the second reservoir independently and separately.

10. The device of clause 9, wherein the environmental control device is further configured to adjust or reset the second pressure of the second reservoir based on the measured amount of fluid target material within the second reservoir.

11. The device of clause 9, wherein the environmental control device comprises a pressurized reservoir configured to contain and transfer inert gas from the pressurized reservoir to one or more of the first reservoir and the second reservoir through an orifice.

12. The device of clause 1, wherein the fluid control system comprises a reservoir fluid control valve between the first reservoir and the second reservoir and a refill fluid control valve between the second reservoir and the injection system, wherein the fluid control system is configured to independently control the reservoir fluid control valve and the refill fluid control valve.

13. The apparatus of clause 12, wherein the reservoir fluid control valve comprises a freeze valve and the refill fluid control valve comprises a freeze valve.

14. The apparatus of clause 1, wherein the fluid control system is further configured to maintain the fluid flow path between the first reservoir and the second reservoir during operation of the nozzle supply system.

15. The apparatus of clause 1, wherein the second reservoir is further configured to be in flow communication with the nozzle supply system at least a portion of the time during operation of the nozzle supply system.

16. The apparatus of clause 1, wherein the injection system comprises:

a first chamber comprising a door configured to open such that solid matter can be received within a first volume defined by the first chamber;

a second chamber defining a second volume and in flow communication with the fluid control system; and

a flow blocking device formed in an otherwise unobstructed fluid path between the first chamber and the second chamber.

17. The apparatus of clause 16, wherein the flow blocking device is a freeze valve, wherein a fluid flow path is blocked by the solid matter in the freeze valve when the solid matter is maintained at a temperature below a melting point of the solid matter.

18. The apparatus of clause 1, further comprising a sensing system configured to estimate a volume of the fluid target material and/or a presence of solid matter within the injection system in one or more of the first reservoir, the second reservoir, and the injection system.

19. The device of clause 18, further comprising a control system in communication with the sensing system, the control system configured to determine a consumption rate of the fluid target material in the second reservoir based on an output from a high pressure transducer, the consumption rate being an amount of the fluid target material used per time period.

20. A method for continuously supplying a target material in an uninterrupted manner, the method comprising:

receiving solid matter comprising a target material in an injection system maintained at an injection pressure and producing a fluid target material from the solid matter;

maintaining flow communication between the first reservoir and a nozzle supply system during operation of the nozzle supply system while maintaining the first reservoir at a first pressure greater than the injection pressure; and

effecting transfer of fluid target material at the first pressure between the first and second reservoirs at least part of the time during operation of the nozzle supply system while the fluid target material is being produced in the injection system at the injection pressure.

21. The method of clause 20, further comprising maintaining the first pressure of the first reservoir while a fluid target material is enabled to be transferred between the injection system and the second reservoir.

22. The method of clause 20, further comprising effecting transfer of a fluid target material to the nozzle supply system throughout operation of the nozzle supply system by flowing the fluid target material:

from the first reservoir to the nozzle supply system;

from the second reservoir to the nozzle supply system; or

Simultaneously from the first reservoir and the second reservoir to the nozzle supply system.

23. The method of clause 20, further comprising: preventing, at least some of the time during operation of the nozzle supply system, fluid target material from being transferred to the second reservoir and/or the first reservoir.

24. The method of clause 20, further comprising: reloading solid matter including the target material into the injection system only when the injection system is at the injection pressure, wherein reloading solid matter including the target material into the injection system occurs while the nozzle supply system is at the first pressure.

25. The method of clause 20, further comprising refilling the second reservoir with fluid target material from the injection system while maintaining the first pressure of the first reservoir, and fluidly separating the second reservoir from the injection system after sufficient fluid target material has been transferred from the injection system into the second reservoir.

26. The method of clause 25, further comprising maintaining the injection system and the second reservoir at the injection pressure while refilling the second reservoir with a fluid target material from the injection system and preventing the second reservoir from being overfilled with the fluid target material.

27. The method of clause 20, further comprising purging target fluid material from each interface defined between the first reservoir, the second reservoir, the injection system, and the nozzle supply system prior to ceasing operation of the nozzle supply system and ceasing flow communication between the first reservoir and the nozzle supply system.

28. The method of clause 20, further comprising: melting the solid matter of a target material in the injection system into the target fluid material.

29. The method of clause 20, wherein operation of the nozzle supply system comprises delivering droplets of the fluid target material to an Extreme Ultraviolet (EUV) light source in which the droplets are configured to be irradiated with radiation to produce an EUV light-emitting plasma.

30. A method, comprising:

receiving solid matter comprising a target material in an injection system maintained at an injection pressure and producing a fluid target material from the solid matter;

maintaining flow communication between the first reservoir and the nozzle supply system during operation of the nozzle supply system while maintaining the first reservoir at a first pressure greater than the injection pressure; and

effecting transfer of the fluid target material between the injection system and a second reservoir while fluidly isolating the first reservoir and the nozzle supply system from the injection system.

31. The method of clause 30, wherein operation of the nozzle supply system comprises delivering droplets of the fluid target material to an Extreme Ultraviolet (EUV) light source in which the droplets are configured to be irradiated with radiation to produce an EUV light-emitting plasma.

32. The method of clause 30, further comprising maintaining the first pressure of the first reservoir while a fluid target material is transferable between the injection system and the second reservoir.

33. The method of clause 30, further comprising effecting transfer of the fluid target material between the second reservoir and the first reservoir while fluidly isolating the first reservoir, the second reservoir, and the nozzle supply system from the injection system.

34. The method of clause 30, further comprising effecting transfer of a fluid target material to the nozzle supply system throughout operation of the nozzle supply system by flowing the fluid target material:

from the first reservoir to the nozzle supply system;

from the second reservoir to the nozzle supply system; or

Simultaneously from the first reservoir and the second reservoir to the nozzle supply system.

35. The method of clause 30, further comprising: preventing, at least some of the time during operation of the nozzle supply system, fluid target material from being transferred to the second reservoir and/or the first reservoir.

36. The method of clause 30, further comprising reloading solid matter including the target material into the injection system only when the injection system is at the injection pressure, wherein reloading solid matter including the target material into the injection system occurs while the nozzle supply system is at the first pressure.

37. The method of clause 30, further comprising: refilling the second reservoir with a fluid target material from the injection system while maintaining the first pressure of the first reservoir.

38. The method of clause 37, further comprising maintaining the injection system and the second reservoir at the injection pressure while refilling the second reservoir with a fluid target material from the injection system and preventing the second reservoir from being overfilled with the fluid target material.

39. The method of clause 30, further comprising fluidly separating the second reservoir from the injection system after sufficient fluid target material has been transferred from the injection system into the second reservoir.

40. The method of clause 30, further comprising melting the solid matter of a target material in the injection system into the target fluid material.