阅读说明：本技术 内窥镜插入部散热结构 (Endoscope insertion portion heat radiation structure ) 是由 顾良 李苏云 于 2020-05-25 设计创作，主要内容包括：本发明公开了一种内窥镜插入部散热结构,包括从插入部前端延伸至后端的传热管以及位于插入部前端的热源、导热片、导热片压紧块和传热支架；导热片压紧块通过压紧面将导热片前端贴合压在热源背面,导热片后端绕过导热片压紧块后延伸至传热支架的吸热面且贴合固定,传热支架与传热管贴合固定,热源产生的热量依次通过导热效率高的导热片、传热支架和传热管后均布至整个插入部该结构能将插入部前端温度及时散至后端,避免了热量集中在前端,而且能实现整个插入部的热量均布,提高了电子器件的工作环境,制作和装卸方便,成本低。(The invention discloses a heat dissipation structure of an insertion part of an endoscope, which comprises a heat transfer pipe, a heat source, a heat conduction sheet pressing block and a heat transfer support, wherein the heat transfer pipe extends from the front end to the rear end of the insertion part; the conducting strip compact heap is pressed the laminating of conducting strip front end at the heat source back through the compact surface, the conducting strip rear end is walked around the conducting strip compact heap and is extended to the heat-absorbing surface and the laminating of heat transfer support after, it is fixed with the laminating of heat-transfer pipe, the heat that the heat source produced loops through the efficient conducting strip of heat conduction, equipartition behind heat transfer support and the heat-transfer pipe can in time disperse to the rear end with the front end temperature of portion of inserting to whole this structure of portion of inserting, the heat concentration in the front end has been avoided, and can realize the heat equipartition of whole portion of inserting, the operational environment of electronic device has been improved, the preparation is convenient with loading and unloading, and is low in cost.)

1. An endoscope insertion portion heat radiation structure characterized in that: the heat transfer pipe extends from the front end to the rear end of the insertion part, and the heat source, the heat conducting fins, the heat conducting fin pressing block and the heat transfer support are positioned at the front end of the insertion part; the heat conducting strip compact heap presses the laminating of heat conducting strip front end at the heat source back through the compact surface, and the heat conducting strip rear end is walked around the heat conducting strip compact heap and is extended to the heat-absorbing surface of heat transfer support and laminating fixedly, and the heat transfer support is fixed with the heat-transfer pipe laminating, and the heat that the heat source produced loops through heat conducting strip, heat transfer support and the heat-transfer pipe that the heat conduction efficiency is high after equipartition to whole portion of inserting.

2. The endoscope insertion portion heat dissipation structure according to claim 1, characterized in that: the heat insulation material is used for isolating heat transfer between the heat source and the heat transfer support and the outer pipe of the insertion part.

3. The endoscope insertion portion heat dissipation structure according to claim 2, characterized in that: the heat-insulating material is a plastic material.

4. The endoscope insertion portion heat dissipation structure according to claim 1, characterized in that: the front end of the heat transfer bracket is matched with the mounting hole on the heat conducting fin pressing block through a mounting shaft.

5. The endoscope insertion portion heat dissipation structure according to claim 4, wherein: the mounting hole on the heat conducting fin pressing block is connected with the pressing surface through the cantilever structures on two sides, the heat conducting fin penetrates through the cantilever structures on the two sides, and the cantilever structures are used for bearing the main pressure of the heat conducting fin pressing block.

6. The endoscope insertion portion heat dissipation structure according to claim 1, characterized in that: the rear end of the heat transfer bracket is in interference fit with the heat transfer pipe through the connecting surface.

7. The endoscope insertion portion heat dissipation structure according to claim 1, characterized in that: the heat absorbing surface is positioned on the outer side of the heat transfer support, and the front side or the front side and the rear side of the heat absorbing surface on the heat transfer support are provided with inclined planes for natural transition of the heat conducting fins.

8. The endoscope insertion portion heat dissipation structure according to claim 1, characterized in that: the heat conducting sheet is made of sheet flexible heat conducting material with single side being coated with adhesive, and the heat conducting support and the heat conducting pipe are made of metal or non-metal heat conducting material with high strength.

9. The endoscope insertion portion heat dissipation structure according to claim 1, characterized in that: the outer surface of the heat transfer pipe is pasted with a heat conducting fin for assisting heat dissipation.

Technical Field

The invention belongs to the field of endoscopes, and particularly relates to a radiating structure of an insertion part of an endoscope.

Background

The endoscope belongs to small electronic medical equipment, various electronic devices are generally placed in an insertion part of the endoscope, part of the electronic devices in the insertion part of the endoscope form a heating source, the internal design space is limited, heat concentration is easy to cause, the service life of the devices is easy to shorten, and certain harm is caused to a human body. Most of the existing endoscopes have incomplete internal heat dissipation design, have no heat conduction design or conduct heat in a small range, and mostly guarantee the use temperature of equipment by sacrificing image performance and reducing power consumption.

Disclosure of Invention

The invention aims to provide a heat dissipation structure of an insertion part of an endoscope, which can timely dissipate the temperature of the front end of the insertion part to the rear end, avoid heat from being concentrated at the front end, realize uniform heat distribution of the whole insertion part, improve the working environment of electronic devices, and has the advantages of convenient manufacture, assembly and disassembly and low cost.

The technical scheme adopted by the invention is as follows:

a heat dissipation structure of an insertion part of an endoscope comprises a heat transfer pipe extending from the front end to the rear end of the insertion part, and a heat source, a heat conduction sheet pressing block and a heat transfer support which are positioned at the front end of the insertion part; the heat conducting strip compact heap presses the laminating of heat conducting strip front end at the heat source back through the compact surface, and the heat conducting strip rear end is walked around the heat conducting strip compact heap and is extended to the heat-absorbing surface of heat transfer support and laminating fixedly, and the heat transfer support is fixed with the heat-transfer pipe laminating, and the heat that the heat source produced loops through heat conducting strip, heat transfer support and the heat-transfer pipe that the heat conduction efficiency is high after equipartition to whole portion of inserting.

Preferably, the heat insulation material is arranged at the front end of the insertion part and used for isolating the heat source and the heat transmission bracket from heat transmission with the outer pipe of the insertion part.

Further, the heat insulation material is a plastic material.

Preferably, the front end of the heat transfer bracket is matched with a mounting hole on the heat conducting fin pressing block through a mounting shaft.

Furthermore, the mounting hole in the heat conducting fin pressing block is connected with the pressing surface through the cantilever structures on two sides, the heat conducting fin penetrates through the cantilever structures on two sides, and the cantilever structures are used for bearing the main pressure of the heat conducting fin pressing block.

Preferably, the rear end of the heat transfer bracket is in interference fit with the heat transfer pipe through the connecting surface.

Preferably, the heat absorbing surface is located at the outer side of the heat transfer bracket, and the front side, or the front side and the rear side, of the heat absorbing surface on the heat transfer bracket are provided with inclined surfaces for natural transition of the heat conducting fins.

Preferably, the heat conducting sheet is made of a sheet-shaped flexible heat conducting material with a single-side back glue, and the heat conducting support and the heat conducting pipe are made of metal or nonmetal heat conducting materials with high strength.

Preferably, the outer surface of the heat transfer pipe is coated with heat conducting fins for assisting heat dissipation.

The invention has the beneficial effects that:

the structure can timely dissipate the temperature of the front end of the insertion part to the rear end, thereby avoiding the heat from concentrating at the front end, realizing the uniform heat distribution of the whole insertion part and improving the working environment of the electronic device; the structure is simple, the manufacture and the assembly and disassembly are convenient, and the cost is low.

Drawings

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

Fig. 2 is a partially enlarged view of fig. 1.

Fig. 3 is a schematic structural view of the heat-conducting plate pressing block in fig. 1.

Fig. 4 is a schematic structural view of the heat transfer bracket of fig. 1.

In the figure: 1-a heat transfer tube; 2-a heat transfer support; 21-mounting the shaft; 22-inclined plane; 23-a heat absorbing surface; 24-a joint face; 3-a heat conducting sheet; 4-heat conducting fin pressing blocks; 41-mounting holes; 42-cantilever structure; 43-a compression surface; 5-a heat source; 6-heat insulation material; 7-insertion of the outer tube.

Detailed Description

The invention is further illustrated by the following figures and examples.

As shown in fig. 1 to 4, an endoscope insertion portion heat dissipation structure includes a heat transfer pipe 1 extending from a front end to a rear end of the insertion portion, and a heat source 5, a heat conductive sheet 3, a heat conductive sheet pressing block 4, and a heat transfer holder 2 at the front end of the insertion portion; the laminating of conducting strip compact heap 4 through pressing surface 43 with the laminating of 3 front ends of conducting strip presses at the 5 backs of heat source, and the conducting strip 3 rear end is walked around and is extended to the heat-absorbing surface 23 of heat transfer support 2 and the laminating is fixed after conducting strip compact heap 4, and heat transfer support 2 is fixed with the laminating of heat-transfer pipe 1, and the heat that heat source 5 produced loops through conducting strip 3 that the heat conduction efficiency is high, heat transfer support 2 and heat-transfer pipe 1 back equipartition to whole portion of inserting. The structure can timely dissipate the temperature of the front end of the insertion part to the rear end, thereby avoiding the heat from concentrating at the front end, realizing the uniform heat distribution of the whole insertion part and improving the working environment of the electronic device; the structure is simple, the manufacture and the assembly and disassembly are convenient, and the cost is low.

As shown in fig. 1 and 2, in the present embodiment, the structure further includes a thermal insulation material 6 located at the front end of the insertion portion, and the thermal insulation material 6 is used for blocking heat transfer between the heat source 5 and the heat transfer bracket 2 and the insertion portion outer tube 7, so as to further avoid the temperature of the front end from being too high; the insulating material 6 is preferably a plastic material.

As shown in fig. 1 and 2, in the present embodiment, the rear end of the heat transfer holder 2 is in interference fit with the heat transfer pipe 1 through the joint surface 24 without a gap, thereby improving the heat transfer efficiency.

As shown in fig. 1 and 2, in the present embodiment, a heat conducting sheet 3 for assisting heat dissipation is attached to the outer surface of the heat transfer pipe 1.

As shown in fig. 1 to 4, in the present embodiment, the front end of the heat transfer bracket 2 is engaged with the mounting hole 41 of the heat-conducting strip pressing block 4 through the mounting shaft 21, so as to perform the positioning function, and ensure the mounting accuracy of the heat-conducting strip 3.

As shown in fig. 3, in the present embodiment, the mounting hole 41 of the heat conduction sheet pressing block 4 and the pressing surface 43 are connected by the cantilever structures 42 on both sides, the heat conduction sheet 3 passes through between the cantilever structures 42 on both sides, and the cantilever structures 42 are used for bearing the main pressing force of the heat conduction sheet pressing block 4.

As shown in fig. 1, 2 and 4, in the present embodiment, the heat absorbing surface 23 is located outside the heat transfer bracket 2, and the heat transferring bracket 2 is provided with an inclined surface 22 for natural transition of the heat conducting strip 3 on the front side, or on the front side and the rear side of the heat absorbing surface 23, so as to avoid the heat conducting strip 3 from being damaged by bending.

In the present embodiment, the heat conducting sheet 3 is preferably a thin flexible heat conducting material with a single-sided adhesive, and the heat conducting support 2 and the heat conducting pipe 1 are preferably made of a high-strength metal or non-metal heat conducting material.

While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that many modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.