阅读说明：本技术 光固化组合物、封装结构和半导体器件 (Photocuring composition, packaging structure and semiconductor device ) 是由 王士昊 洪海兵 杨楚峰 城野贵史 于 2021-08-19 设计创作，主要内容包括：本发明提供了一种光固化组合物、封装结构和半导体器件。该光固化组合物包括可光固化芳烃单体、可光固化活性稀释剂、自由基光引发剂和阳离子光引化剂,可光固化芳烃单体包括具有(Z～(2))-(b)-A-(Z～(1))-(a)所示结构的单体中的一种或多种,A为具有多个苯基取代或未取代的烃基、或多个苯基取代或未取代的具有杂原子的烃基、或取代或未取代的苯基；a和b分别为0至2的整数,且a+b为1至4的整数；Z～(1)和Z～(2)选自具有所示基团中的任意一种,*表示结合位置,X为单键或氧或硫,Y为取代或未取代的C-(1)到C-(20)的亚烷基或取代或未取代的C-(1)到C-(20)的烷氧基,c为0或1,R～(1)是氢或取代或未取代的C-(1)到C-(20)烷基。提高了所形成薄膜的光固化效率、透光率,降低了收缩率。(The invention provides a photocuring composition, a packaging structure and a semiconductor device. The photo-curing composition comprises a photo-curable aromatic hydrocarbon monomer, a photo-curable reactive diluent, a free radical photoinitiator and a cationic photoinitiator, wherein the photo-curable aromatic hydrocarbon monomer comprises a compound having (Z) 2 ) b ‑A‑(Z 1 ) a One of the monomers of the structure shownOr more, A is a substituted or unsubstituted hydrocarbyl group having a plurality of phenyl groups, or a substituted or unsubstituted hydrocarbyl group having a heteroatom, or a substituted or unsubstituted phenyl group; a and b are each an integer of 0 to 2, and a + b is an integer of 1 to 4; z 1 And Z 2 Is selected from the group consisting of Any one of the groups represents a bonding position, X is a single bond or oxygen or sulfur, and Y is substituted or unsubstituted C 1 To C 20 Alkylene or substituted or unsubstituted C 1 To C 20 C is 0 or 1, R 1 Is hydrogen or substituted or unsubstituted C 1 To C 20 An alkyl group. The light curing efficiency and the light transmittance of the formed film are improved, and the shrinkage rate is reduced.)

1. A photocurable composition, comprising: 0.01 to 50 parts by mass of a photocurable aromatic monomer; 0.01 to 90 parts by mass of a photocurable reactive diluent; 0.01 to 10 parts by mass of a free radical photoinitiator; 0.01 to 10 parts by mass of a cationic photoinitiator; 0 to 5 parts by mass of an auxiliary agent,

the photo-curable aromatic hydrocarbon monomer comprises one or more monomers with a structure shown in a formula I,

(Z²)_b-A-(Z¹)_a

formula I

Wherein A is a substituted or unsubstituted hydrocarbon group having a plurality of phenyl groups, or a substituted or unsubstituted hydrocarbon group having a hetero atom having a plurality of phenyl groups, or a substituted or unsubstituted phenyl group; a and b are each an integer of 0 to 2, and a + b is an integer of 1 to 4; z¹And Z²Each independently selected from any one of the groups shown in the formula II;

wherein X represents a bonding position of the elements, X is a single bond or oxygen or sulfur, and Y is a substituted or unsubstituted C₁To C₂₀Alkylene or substituted or unsubstituted C₁To C₂₀C is 0 or 1, R¹Is hydrogen or substituted or unsubstituted C₁To C₂₀An alkyl group.

2. The photocurable composition according to claim 1, wherein the photocurable aromatic hydrocarbon monomer is present in an amount of 10 to 40 parts by mass; preferably, the mass part of the photocurable reactive diluent is 50-80; preferably, the mass part of the free radical photoinitiator is 1-6; preferably, the mass part of the cationic photoinitiator is 2-8.

3. The photocurable composition of claim 1 or 2 wherein a is triphenyl-substituted methyl or biphenylene, X is oxygen, c is 1, and R1 is hydrogen.

4. The photocurable composition as claimed in claim 1, wherein the photocurable reactive diluent is selected from any one or more of monomers of oxygen-containing heterocyclic group, the oxygen-containing heterocyclic group being epoxy group or oxetane group, the number of the oxetane group in the monomer of the oxygen-containing heterocyclic group being 1, 2, 3 or 4; preferably, the monomer containing the oxygen heterocyclic group is an alkane monomer with two polymerizable epoxy groups, and the viscosity is lower than 50mPa & s at 25 ℃; preferably the photocurable reactive diluent is a diglycidyl ether.

5. The photocurable composition of claim 1 wherein the cationic photoinitiator has a relative molecular mass greater than 500, preferably the cationic photoinitiator is an iodonium salt photoinitiator or a sulfonium salt photoinitiator.

6. The photocurable composition of claim 1, wherein the radical photoinitiator is selected from any one or more of benzoin and derivatives thereof, benzil initiators, alkyl phenone initiators, acyl phosphorous oxide initiators, benzophenone initiators, and thioxanthone initiators.

7. The photocurable composition of claim 1 wherein the auxiliary agent is selected from one or more of a polymerization inhibitor, a surfactant, an antioxidant, a thermal stabilizer, an antifoaming agent, and a leveling agent.

8. An encapsulation structure comprising an organic layer, wherein the organic layer is formed by photocuring using the photocurable composition of any one of claims 1-7.

9. The encapsulation structure according to claim 8, further comprising an inorganic insulating layer, wherein the inorganic insulating layer is stacked on the organic layer, preferably the inorganic insulating layer is selected from any one of metal oxide, metal nitride and metal sulfide, preferably the inorganic insulating layer is selected from any one of vacuum evaporation coating, direct current sputtering coating and ion cluster beam deposition coating.

10. A semiconductor device comprising a functional structure and an encapsulation structure, wherein the encapsulation structure is the encapsulation structure of claim 9, preferably wherein the semiconductor device is any one of an electroluminescent device, a photoluminescent device, a lighting device, a light emitting diode, a solar cell, a thin film transistor, and a photodetector.

Technical Field

The invention relates to the field of semiconductor device packaging, in particular to a photocuring composition, a packaging structure and a semiconductor device.

Background

Organic Light-Emitting Diodes (OLEDs for short) have the characteristics of all solid-state, active Light emission, high brightness, high contrast, ultra-thin and ultra-Light, low cost, low power consumption, no view angle limitation, wide working temperature range and the like, can be manufactured on a flexible, Light and durable plastic substrate, can realize flexible display in the true sense, and is a technology which can best meet the requirements of people on future displays. However, the biggest problem of the current OLED is its short lifetime, which is only about 5000 hours. Research results show that the existence of water vapor and oxygen inside the OLED device is a main factor influencing the service life.

In order to solve the problem of the service life of the device, the most direct method with the most obvious effect is to research and improve the packaging process. The OLED packaging mainly comprises cover plate packaging, filler packaging, laser packaging, film packaging and the like. Among them, thin film encapsulation is represented by a three-layer structure (PECVD-flip-PECVD), and its excellent performance has become the mainstream way of flexible OLED encapsulation. The third laminated layer is obtained by using a first inorganic layer (SiNX) as a smooth substrate, printing an organic polymer buffer layer on the substrate by ink jet printing and then curing, and using a third inorganic layer (SiNX) as a last inorganic layer. Commonly used organic polymer buffer layers include acrylic resins, methacrylic resins, isoprene resins, vinyl resins, epoxy resins, polyurethane resins, cellulose resins, perylene resins, imide resins or mixtures of two or more (CN 201410009204.1). In general, the heat resistance of the organic layer must be maintained at 100 ℃ for reliability of the organic light emitting device. However, during a long period of high-temperature exposure, a phenomenon in which the organic layer and the inorganic layer are peeled off may occur.

Samsung SDI corporation proposed an ink composition of silicone-modified acrylates. The silicone-modified acrylate-based ink composition exhibited a higher photocuring rate, high light transmittance, and a low etching rate (CN201510142313.5) compared to the acrylate-based ink composition containing no silicone. However, it is difficult for the current ink composition to satisfy performance indexes such as high light transmittance, high light curing rate, low air permeability, and high heat resistance, which are required for the increasing film packaging.

Epoxy system encapsulation materials have lower curing shrinkage and better mechanical properties than the commonly used acrylate resin system encapsulation materials, but the conventional epoxy system encapsulation materials are generally cured by heat (CN201611039160.2), and the OLED is damaged at high temperature, so that the conventional formulation must be modified to use UV curing.

The chemical research institute of Chinese academy of sciences proposed a composition containing highly phenyl polysiloxane, which can be used for the preparation of polysiloxane composition for packaging material or optical film (CN 201710042088.7). However, the performance index of the OLED packaging material only partially meets the requirements of OLED packaging.

Disclosure of Invention

The invention mainly aims to provide a photocuring composition, an encapsulation structure and a semiconductor device, and aims to solve the problem that the photocuring efficiency, light transmittance and shrinkage of a film are difficult to improve simultaneously in the film encapsulation of an OLED in the prior art.

In order to achieve the above object, according to one aspect of the present invention, there is provided a photocurable composition comprising: 0.01 to 50 parts by mass of a photocurable aromatic monomer; 0.01 to 90 parts by mass of a photocurable reactive diluent; 0.01 to 10 parts by mass of a free radical photoinitiator; 0.01 to 10 parts by mass of a cationic photoinitiator; 0 to 5 parts by mass of an auxiliary agent, wherein the light-curable aromatic hydrocarbon monomer comprises one or more monomers with the structure shown in the formula I,

(Z²)_b-A-(Z¹)_a

formula I

Wherein A is a substituted or unsubstituted hydrocarbon group having a plurality of phenyl groups, or a substituted or unsubstituted hydrocarbon group having a hetero atom having a plurality of phenyl groups, or a substituted or unsubstituted phenyl group; a and b are each an integer of 0 to 2, and a + b is an integer of 1 to 4; z¹And Z²Each independently selected from any one of the groups shown in the formula II;

wherein X represents a bonding position of the elements, X is a single bond or oxygen or sulfur, and Y is a substituted or unsubstituted C₁To C₂₀Alkylene or substituted or unsubstituted C₁To C₂₀C is 0 or 1, R¹Is hydrogen or substituted or unsubstituted C₁To C₂₀An alkyl group.

Further, the mass part of the photo-curable aromatic hydrocarbon monomer is 10-40; preferably, the mass part of the photocurable reactive diluent is 50-80; preferably, the mass part of the free radical photoinitiator is 1-6; preferably, the mass part of the cationic photoinitiator is 2-8.

Further, A is a triphenyl-substituted methyl group or a biphenylene group, X is oxygen, c is 1, and R1 is hydrogen.

Further, the above-mentioned photocurable reactive diluent is selected from any one or more of monomers of oxygen-containing heterocyclic group, the oxygen-containing heterocyclic group is epoxy group or oxetane group, the number of the oxetane group in the monomer of the oxygen-containing heterocyclic group is 1, 2, 3 or 4; preferably, the monomer containing the oxygen heterocyclic group is an alkane monomer having two polymerizable epoxy groups and has a viscosity of less than 50mPa · s at 25 ℃; preferably the photocurable reactive diluent is a diglycidyl ether.

Further, the above cationic photoinitiator has a relative molecular mass of more than 500, and preferably the cationic photoinitiator is an iodonium salt photoinitiator or a sulfonium salt photoinitiator.

Further, the free radical photoinitiator is selected from one or more of benzoin and derivatives thereof, benzil initiators, alkyl phenone initiators, acyl phosphorus oxide initiators, benzophenone initiators and thioxanthone initiators.

Further, the auxiliary agent is selected from one or more of polymerization inhibitor, surfactant, antioxidant, heat stabilizer, defoaming agent and leveling agent.

According to another aspect of the present invention, there is provided an encapsulation structure comprising an organic layer formed by photocuring using the photocurable composition of any one of the above.

Further, the above package structure further includes an inorganic insulating layer, the inorganic insulating layer is stacked on the organic layer, preferably, the inorganic insulating layer is selected from any one of metal oxide, metal nitride and metal sulfide, and preferably, the inorganic insulating layer is selected from any one of vacuum evaporation coating, direct current sputtering coating and ion cluster beam deposition coating.

According to another aspect of the present invention, there is provided a semiconductor device comprising a functional structure and an encapsulation structure, the encapsulation structure being any one of the above-mentioned encapsulation structures, preferably the semiconductor device is any one of an electroluminescent device, a photoluminescent device, a lighting device, a light emitting diode, a solar cell, a thin film transistor and a photodetector.

By applying the technical scheme of the invention, the monomer containing the benzene ring and the epoxy group and the photo-curable reactive diluent are adopted, and the formed polymer film has higher light transmittance, higher curing speed and lower shrinkage, so that the requirements of the packaging film in the prior art are better met.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.

As analyzed in the background of the present application, in the prior art, when the OLED is packaged in a thin film, the light curing efficiency, the light transmittance and the shrinkage of the thin film are difficult to be improved simultaneously, and in order to solve the problem, the present application provides a light curing composition, a packaging structure and a semiconductor device.

In one exemplary embodiment of the present application, there is provided a photocurable composition comprising: 0.01 to 50 parts by mass of a photocurable aromatic monomer; 0.01 to 90 parts by mass of a photocurable reactive diluent; 0.01 to 10 parts by mass of a free radical photoinitiator; 0.01 to 10 parts by mass of a cationic photoinitiator; 0 to 5 parts by mass of an auxiliary agent;

the photocurable aromatic hydrocarbon monomer comprises one or more monomers selected from the group consisting of monomers having the structure shown in formula I,

(Z²)_b-A-(Z¹)_a

formula I

Wherein A is a hydrocarbon substituted or unsubstituted with a plurality of phenyl groups, or a hydrocarbon substituted or unsubstituted with a plurality of phenyl groups and having a heteroatom, or a substituted or unsubstituted phenyl group; a and b are each an integer of 0 to 2, and a + b is an integer of 1 to 4; z¹And Z²Each independently selected from any one of the groups shown in the formula II;

wherein X represents a bonding position of the elements, X is a single bond or oxygen or sulfur, and Y is a substituted or unsubstituted C₁To C₂₀Alkylene or substituted or unsubstituted C₁To C₂₀C is 0 or 1, R¹Is hydrogen or substituted or unsubstituted C₁To C₂₀An alkyl group.

The monomer containing benzene ring and epoxy group and the photo-curable reactive diluent are adopted, and the formed polymer film has higher light transmittance, higher curing speed and lower shrinkage, so that the requirements of the packaging film in the prior art are better met.

In the above description, "a plurality of hydrocarbon groups of substituted or unsubstituted phenyl groups, or a plurality of substituted or unsubstituted benzene groupsBy hydrocarbyl having hetero atoms of the radical "is meant that two or more substituted or unsubstituted phenyl groups are not condensed but are instead substituted or unsubstituted C via a single bond, an oxygen atom, a sulfur atom, a₁To C₅Alkyl, unsubstituted or heteroatom-substituted C₃To C₆Alkylene, ethenylene, ethynylene, or carbonyl-linked hydrocarbons. "alkylene" means an alkanediyl attached between each end via a saturated hydrocarbon without a double bond. "heteroatom" means any atom selected from the group consisting of N, O, S and P, and the term "heteroatom" means that a carbon atom is substituted through any atom selected from the group consisting of N, O, S and P.

In order to improve the synergistic effect of the components, the mass part of the photocurable aromatic hydrocarbon monomer is preferably 10-40; preferably, the mass part of the photocurable reactive diluent is 50-80; preferably, the mass part of the free radical photoinitiator is 1-6; preferably, the mass part of the cationic photoinitiator is 2-8.

In order to improve the property stability of the composition, preferably, the above A is a triphenyl-substituted methyl group or biphenylene group, X is oxygen, preferably c is 1, and R is¹Is hydrogen.

In some embodiments of the present application, the photocurable reactive diluent is selected from one or more of monomers containing an oxygen-containing heterocyclic group, wherein the oxygen-containing heterocyclic group is an epoxy group or an oxetane group, and the number of the oxetane groups in the monomer containing the oxygen-containing heterocyclic group is 1, 2, 3 or 4. The photocuring speed is improved by using an epoxy group or an oxetane group. In order to facilitate the processing and shaping of the product and improve the surface flatness of the sample after curing, the monomer containing the oxygen heterocyclic group is preferably an alkane monomer with two polymerizable epoxy groups, and the viscosity is lower than 50mPa & s at 25 ℃; preferably the photocurable reactive diluent is a diglycidyl ether.

When the photoinitiator is a micromolecular photoinitiator, the molecular weight is low, the residual photoinitiator after curing can migrate to the surface of the material, and a film layer formed after a long time is easy to oxidize and yellow, so that the defects of light transmittance reduction, device efficiency reduction and chromaticity impurity are caused, and meanwhile, odor is easy to generate. Therefore, the cationic photoinitiator preferably has a relative molecular mass of more than 500, and the macromolecular photoinitiator has a higher molecular weight, so that molecules are more difficult to migrate, thereby improving the performance of the product. In addition, the chroma of the composition prepared by the macroinitiator is lower and is closer to colorless transparency, which is also beneficial to the light transmittance of an OLED device.

The type of cationic photoinitiator used in the present application can be selected from the types of cationic initiators conventionally used, preferably the cationic photoinitiator is an iodonium salt photoinitiator or a sulfonium salt photoinitiator, such as(Uvacure-1590)、(Esacure1187)、(CD1012)。

Because iodonium salts or sulfonium salts have shorter ultraviolet absorption wavelengths and short wavelength UV contains higher energy, if the curing time is longer, which may damage the devices required to be packaged by the composition, the combination of the free radical photoinitiator and the cationic initiator can further accelerate the curing speed, preferably, the free radical photoinitiator comprises one or more of but not limited to benzoin and derivatives thereof, benzil type initiators, alkyl phenone type initiators, acyl phosphorus oxide initiators, benzophenone type initiators and thioxanthone type initiators, and other suitable free radical photoinitiators can be selected by one skilled in the art according to common knowledge or common technical means in the field.

In order to improve the film forming property of the photocurable encapsulating composition, it is preferable that the photocurable encapsulating composition further comprises an auxiliary agent. The auxiliary agent comprises one or more of a polymerization inhibitor, a surfactant, an antioxidant, a heat stabilizer, a defoaming agent and a leveling agent. It will be appreciated that other adjuvants may also be included in the composition. The above-mentioned additives can be selected from the corresponding additives commonly used in the packaging film in the prior art, and are not listed here.

Each of the above components can be obtained from commercially available products or prepared by typical methods. The components are uniformly mixed at 25-40 ℃ for use.

In another exemplary embodiment of the present application, there is provided an encapsulation structure including an organic layer formed by photocuring using the photocurable composition of any one of the above. As the photocuring composition adopts the monomer containing the benzene ring and the epoxy group and the photocuring reactive diluent, the formed polymer film has higher light transmittance, higher curing speed and lower shrinkage, thereby better meeting the requirements of packaging films in the prior art.

The process of forming the above organic layer may refer to the following processes: the components are mixed uniformly at 25-40 ℃, and then the uniformly mixed composition is arranged on the surface of an object to be encapsulated, and is cured to form an organic layer by UV curing for about 1 second to about 100 seconds with a dosage of about 10 milliwatts per square centimeter to about 5000 milliwatts per square centimeter. Methods for disposing the above-described composition on the object to be encapsulated include, but are not limited to, ink-jet printing, deposition, and the like.

For better encapsulation, the encapsulation structure may further include other functional material layers, which are not specifically limited by the present invention, and those skilled in the art can select according to common knowledge or common technical means, for example, preferably, an inorganic insulating layer, i.e., an encapsulation layer formed by an inorganic insulating material, including but not limited to inorganic insulating materials such as metal oxide, metal nitride or metal sulfide, is added. The inorganic insulating material may be formed into the inorganic insulating material layer by a variety of means including, but not limited to, vacuum evaporation, dc sputtering, ion beam deposition, and the like.

In another exemplary embodiment of the present application, a semiconductor device is provided, which includes a functional structure and a package structure, where the package structure is any one of the package structures described above. The polymer film formed by the photocuring composition has higher light transmittance, higher curing speed and lower shrinkage, so that the requirements of semiconductor packaging films in the prior art are better met, and the light transmittance and the sealing property of semiconductor devices are further ensured.

The photocurable composition described above herein is disposed on a surface of a semiconductor device to be encapsulated and cured using UV radiation to form an encapsulation structure. Methods of disposing the photocurable encapsulating composition include, but are not limited to, ink jet printing.

The functional structure may be a member that may cause quality degradation or deterioration due to gas or liquid permeation in the environment, including but not limited to: any one of an electroluminescent device, a photoluminescent device, a lighting device, a light emitting diode, a solar cell, a thin film transistor, and a photodetector.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. It should be understood that these examples are provided for illustration only and are not to be construed as limiting the invention in any way. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Preparation example 1: preparation of aromatic Hydrocarbon monomer (A1)

In a 1000mL flask with a cooling tube and stirrer, 600mL of anhydrous dichloromethane (Shanghai Michelin Biochemical technology) was placed. After the temperature in the flask was cooled to 0 ℃, 35.5g of trimethylamine (shanghai mclin biochem) and 37.0g of glycidol (shanghai mclin biochem) were added while stirring, and 100.0g of triphenylchloromethane (shanghai mclin biochem) was slowly added dropwise. After the temperature of the flask was increased to 30 ℃, stirring was performed for 4 hours. Thereafter, the residual solvent was removed by distillation under the reduced pressure and the solution was subjected to column chromatography using silica gel, whereby 100g of the compound represented by formula 3 was prepared, the purity of which was determined by HPLC to be 93%.

The product verification result is as follows: 1H NMR delta 7.26-7.30(15H, m), 3.60-3.63(1H, m), 3.33-3.36(1H, m), 2.73-2.76(1H, m), 2.59-2.63(1H, m), 2.35-2.37(1H, m)

Preparation example 2: preparation of aromatic Hydrocarbon monomer (A2)

In a 1000mL flask with cooling tube and stirrer, 600mL of acetonitrile (Shanghai Michelin Biochemical technology) was placed. After the temperature in the flask was cooled to 0 ℃, 71.0g of trimethylamine (shanghai mclin biochem) and 74.0g of glycidol (shanghai mclin biochem) were added while stirring, and 87.9g of biphenyldichlorobenzyl (shanghai mclin biochem) was slowly added dropwise. After the temperature of the flask was increased to 30 ℃, stirring was performed for 4 hours. Thereafter, the residual solvent was removed by distillation under the reduced pressure and the solution was subjected to column chromatography using silica gel, whereby 93.9g of the compound represented by formula 4 was prepared, the purity was determined to be 91% by HPLC.

The product verification result is as follows: 1H NMR delta 7.61-7.64(4H, m), 6.98-7.01(4H, m), 4.15-4.19(2H, m), 3.90-3.93(2H, m), 2.98-3.04(2H, m), 2.60-2.64(2H, m), 2.34-2.38(2H, m)

The details of the components used in the comparative examples and examples are as follows:

(A) a photocurable aromatic hydrocarbon monomer: (A1) preparation of the monomer of example 1, (a2) preparation of the monomer of example 2;

(B) photocurable reactive diluent: (B1)1, 4-butanediol diglycidyl ether, (B2) ethylene glycol diglycidyl ether (shanghai such as chemical engineering);

(C) free radical photoinitiator: 2-Isopropylthioxanthone (ITX) (changzhou strength);

(D) macromolecular cationic photoinitiator: uvacure-1590;

(E) small molecule cationic photoinitiator: PAG-201 (50% ethylene carbonate solution) (changzhou strength);

(F) free radical photo-curing monomer: (F1) tetraethyleneglycol diacrylate (Shanghai Michelin Biochemical technology), (F2)4,4' -biphenylene dimethanoic acid ester (Shijiazhuang, Y Xian Cheng chemical technology,)；

(G) auxiliary initiator: ethyl 4-dimethylaminobenzoate (EDAB) (changzhou strength);

the materials are uniformly mixed according to the proportion in the table 2-1 and then are tested, and the test results are shown in the table 3:

TABLE 2-1

Tables 2 to 2

TABLE 3

	Curing shrinkage (%)	Photocuring Rate (%)	APHA
				Example 1	5.21	85.1	107
Example 2	6.64	76.5	98
				Example 3	8.07	72.9	89
Example 4	5.59	83.7	110
				Example 5	6.81	76.9	98
Example 6	8.35	72.7	95
				Example 7	6.85	77.2	113
Example 8	6.02	70.8	130
				Comparative example 1	9.96	70.2	124
Comparative example 2	9.52	68.7	131
				Comparative example 3	10.12	70.6	135
Comparative example 4	9.83	69.1	139
				Comparative example 5	11.54	72.5	196

In Table 3, the properties of the various compositions were measured by the following methods:

cure shrinkage (%): placing the composition in a polytetrafluoroethylene mold under nitrogen atmosphere at 150mW/cm²After UV curing at 395nm for 10 seconds, the composition was left in an oven at 80 ℃ for 0.5h to fully cure. After curing was complete, the length of the specimen was measured using a vernier caliper. The cure shrinkage of the encapsulating composition was calculated according to equation 1:

curing shrinkage (%) of (| C-D |/C) × 100%

Where C is the length of the mold before curing and D is the length of the sample after UV curing.

Photocuring rate (%): at 915cm^-1(C-O-C) and 1720cm^-1The intensity of an absorption peak near (C ═ O) was measured for the composition for encapsulation using FT-IR. The composition was applied to a glass substrate using a sprayer, followed by passing at 150mW/cm under a nitrogen atmosphere²After UV curing by UV irradiation at 395nm for 10 seconds, the sample was placed in an oven at 80 ℃ for 0.5 hour to completely cure the sample, thereby obtaining a sample having a size of 10cm × 10cm × 10 μm (width × length × thickness). Subsequently, FT-IR was used at 915cm^-1(C-O-C) and 1720cm^-1The intensity of the absorption peak of the cured film was measured in the vicinity of (C ═ O). The photocuring rate was calculated by equation 2:

the photocuring rate (%) was |1- (A/B) |. times.100%

(wherein A is at 915cm as measured for the cured film^-1Intensity of nearby absorption peak and at 1720cm^-1The ratio of the intensities of the nearby absorption peaks, and B is at 915cm measured for the composition for encapsulation^-1Intensity of nearby absorption peak and at 1720cm^-1The ratio of the intensities of the nearby absorption peaks).

APHA: the test compositions were placed in 10mm cuvettes and tested in full transmission mode using a HunterLab ColorQuest XE colorimeter. A larger APHA number indicates a darker yellow color.

As shown in Table 3, the polymer films formed using the compositions of examples 1 to 8 having the photocurable aromatic hydrocarbon monomer represented by the above formula 1 had higher photocuring rate, lower volume shrinkage, and lower APHA color than those of comparative examples 1 to 5 not containing the monomer, thereby better satisfying the requirements of the prior art encapsulating films.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.