Composition, silicon-containing liquid coolant, preparation method of silicon-containing liquid coolant and immersion cooling system
阅读说明：本技术 一种组合物、含硅液冷剂及其制备方法以及浸没冷却系统 (Composition, silicon-containing liquid coolant, preparation method of silicon-containing liquid coolant and immersion cooling system ) 是由 周黎旸 汪星平 王金明 李�昊 赵晖 杨怀宇 于 2021-07-15 设计创作，主要内容包括：本申请公开了一种组合物、含硅液冷剂及其制备方法以及浸没冷却系统,涉及液冷技术领域。本申请提供的组合物,包括以下重量份的组份：氟碳化合物60-85份；三氟丙基甲基硅油5-15份；流动促进剂0.5-2.8份；六氟丙烯三聚体2-10份。本申请解决了现有冷却液存在的流动性不佳以及冷却液组分系统与电子设备材料的兼容性较差等缺点,提供了一种具有良好的流动性、极佳的散热功能以及优异材料兼容性的液冷剂。(The application discloses a composition, a silicon-containing liquid coolant, a preparation method of the silicon-containing liquid coolant and an immersion cooling system, and relates to the technical field of liquid cooling. The composition provided by the application comprises the following components in parts by weight: 60-85 parts of fluorocarbon; 5-15 parts of trifluoropropyl methyl silicone oil; 0.5-2.8 parts of a flow promoter; 2-10 parts of hexafluoropropylene trimer. The liquid cooling agent overcomes the defects of poor liquidity, poor compatibility between a cooling liquid component system and electronic equipment materials and the like of the existing cooling liquid, and provides the liquid cooling agent with good liquidity, excellent heat dissipation function and excellent material compatibility.)
1. The composition is characterized by comprising the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of a flow promoter;
2-10 parts of hexafluoropropylene trimer.
2. The composition of claim 1, wherein the fluorocarbon compound has the following general structural formula: ri-(C(Rf)F(CF2)xO)n-(CF2O)m-(CF2)y-RsWherein R isfSelected from H, -F, -CF3or-CF2CF3A group; riSelected from H, -F, -CF3、-CF2CF3、-CF3O or-CF2CF3An O group; rsSelected from-F, -CF3、-CF2CF3or-CF (CF)3)CF3A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
3. The composition as claimed in claim 1, wherein the molecular weight of the trifluoropropylmethylsilicone oil is 500-2000.
4. The composition of claim 1, wherein the flow promoter is a fluorine modified silane.
5. The composition of claim 4, wherein the flow promoter is prepared by the following method: adding 5-12 parts of tetramethyl tetravinylcyclotetrasiloxane according to the parts by weight into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexylethyl methacrylate, 0.5-1.2 parts of butenediol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, reacting for 4-8h under the protection of nitrogen, and then distilling under reduced pressure for 0.5-2h at 140 ℃ to obtain the flow promoter.
6. The composition of claim 1, wherein the composition is used in a cooling medium or a heat transfer medium.
7. The composition of claim 6, wherein the composition is present in the cooling medium or heat transfer medium in an amount of at least 20% by weight.
8. The silicon-containing liquid coolant is characterized by comprising the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of a flow promoter;
2-10 parts of hexafluoropropylene trimer.
9. The silicon-containing liquid refrigerant according to claim 8, wherein the fluorocarbon compound has the following general structural formula: ri-(C(Rf)F(CF2)xO)n-(CF2O)m-(CF2)y-RsWherein R isfSelected from H, -F, -CF3or-CF2CF3A group; riSelected from H-F、-CF3、-CF2CF3、-CF3O or-CF2CF3An O group; rsSelected from-F, -CF3、-CF2CF3or-CF (CF)3)CF3A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
10. The silicon-containing liquid refrigerant as claimed in claim 8, wherein the molecular weight of the trifluoropropylmethylsilicone oil is 500-2000.
11. The silicon-containing coolant according to claim 8, wherein the flow promoter is a fluorine-modified silane.
12. The silicon-containing liquid coolant of claim 11 wherein the flow promoter is prepared by the method of: adding 5-12 parts of tetramethyl tetravinylcyclotetrasiloxane according to the parts by weight into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexylethyl methacrylate, 0.5-1.2 parts of butenediol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, reacting for 4-8h under the protection of nitrogen, and then distilling under reduced pressure for 0.5-2h at 140 ℃ to obtain the flow promoter.
13. The method for producing the silicon-containing liquid refrigerant according to any one of claims 8 to 11, comprising:
and (2) physically mixing the fluorocarbon, the trifluoropropylmethyl silicone oil, the flow promoter and the hexafluoropropylene trimer in a liquid phase state according to corresponding proportions to obtain the liquid refrigerant.
14. An immersion cooling system, comprising:
a totally or non-totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the composition of any one of claims 1 to 7 or the silicon-containing liquid coolant of any one of claims 8 to 11.
15. The immersion cooling system of claim 14, wherein the composition or liquid coolant is present in the cooling medium in an amount of at least 20% by weight.
16. The immersion cooling system of claim 14, wherein the heat generating component comprises an electronic device.
17. The immersion cooling system of claim 14, wherein the heat generating component is partially or fully immersed in the cooling medium.
18. The immersion cooling system of claim 14, wherein the immersion cooling system is a single-phase immersion cooling system.
Technical Field
The application relates to the technical field of liquid cooling, in particular to a composition, a silicon-containing liquid coolant, a preparation method thereof and an immersion cooling system.
Background
The heating element is directly immersed in the cooling liquid, and heat generated by running of equipment such as a server and the like is taken away by means of flowing circulation of the liquid. Immersion liquid cooling is typically direct contact type liquid cooling. Because the heating element is in direct contact with the cooling liquid, the heat dissipation efficiency is higher, the noise is lower, and the problem of high-heat puzzle prevention can be solved. The immersion liquid cooling is divided into two-phase liquid cooling and single-phase liquid cooling, and the heat dissipation mode can adopt the forms of a dry cooler, a cooling tower and the like.
Immersion liquid coolant this kind of insulating coolant liquid is substances such as silicone oil, mineral oil, fluorizating liquid usually, it is characterized by: the insulating and non-corrosive electronic component is completely insulated, and even if the component is immersed for more than 20 years, the electronic component is not affected; and the efficient heat dissipation efficiency can ensure that the machine room does not need large refrigeration equipment such as an air conditioner and the like, the space is saved by more than 75%, and the PUE close to 1.0 can exert the maximum computing capacity on the limited electric power.
However, the liquid coolant in the prior art generally has the disadvantages of poor fluidity and poor compatibility between the component system of the liquid coolant and the materials of the electronic equipment, and the performance of the liquid coolant needs to be further improved.
Disclosure of Invention
The embodiment of the application relates to a composition, a silicon-containing liquid coolant, a preparation method thereof and an immersion cooling system, solves the defects of poor liquidity, poor compatibility between a cooling liquid component system and an electronic equipment material and the like of the existing cooling liquid, and provides the liquid coolant with good liquidity, excellent heat dissipation function and excellent material compatibility.
In order to achieve the above purpose, the present application mainly provides the following technical solutions:
the embodiment of the application provides a composition, which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of a flow promoter;
2-10 parts of hexafluoropropylene trimer.
Preferably, the fluorocarbon compound has the following general structural formula: ri-(C(Rf)F(CF2)xO)n-(CF2O)m-(CF2)y-RsWherein R isfSelected from H, -F, -CF3or-CF2CF3A group; riSelected from H, -F, -CF3、-CF2CF3、-CF3O or-CF2CF3An O group; rsSelected from-F, -CF3、-CF2CF3or-CF (CF)3)CF3A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
Preferably, the molecular weight of the trifluoropropylmethylsilicone oil is 500-2000.
Preferably, the flow promoter is a fluorine modified silane.
Preferably, the flow promoter is prepared by the following method: adding 5-12 parts of tetramethyl tetravinylcyclotetrasiloxane according to the parts by weight into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexylethyl methacrylate, 0.5-1.2 parts of butenediol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, reacting for 4-8h under the protection of nitrogen, and then distilling under reduced pressure for 0.5-2h at 140 ℃ to obtain the flow promoter.
Preferably, the composition is used in a cooling medium or a heat transfer medium.
Preferably, the composition is present in the cooling medium or heat transfer medium in an amount of at least 20% by weight.
The embodiment of the application also provides a silicon-containing liquid coolant which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of a flow promoter;
2-10 parts of hexafluoropropylene trimer.
Preferably, the fluorocarbon compound has the following general structural formula: ri-(C(Rf)F(CF2)xO)n-(CF2O)m-(CF2)y-RsWherein R isfSelected from H, -F, -CF3or-CF2CF3A group; riSelected from H, -F, -CF3、-CF2CF3、-CF3O or-CF2CF3An O group; rsSelected from-F, -CF3、-CF2CF3or-CF (CF)3)CF3A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
Preferably, the molecular weight of the trifluoropropylmethylsilicone oil is 500-2000.
Preferably, the flow promoter is a fluorine modified silane.
Preferably, the flow promoter is prepared by the following method: adding 5-12 parts of tetramethyl tetravinylcyclotetrasiloxane according to the parts by weight into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexylethyl methacrylate, 0.5-1.2 parts of butenediol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, reacting for 4-8h under the protection of nitrogen, and then distilling under reduced pressure for 0.5-2h at 140 ℃ to obtain the flow promoter.
The embodiment of the application also provides a preparation method of the silicon-containing liquid refrigerant, which comprises the following steps: and (2) physically mixing the fluorocarbon, the trifluoropropylmethyl silicone oil, the flow promoter and the hexafluoropropylene trimer in a liquid phase state according to corresponding proportions to obtain the liquid refrigerant.
An embodiment of the present application further provides an immersion cooling system, including:
a totally or non-totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the above composition or the above liquid refrigerant.
Preferably, the composition or liquid coolant is present in the cooling medium in an amount of at least 20 weight percent.
Preferably, the heat generating component comprises an electronic device.
Preferably, the heat generating component is partially or fully immersed in the cooling medium.
Preferably, the immersion cooling system is a single phase immersion cooling system.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
1. the silicon-containing liquid refrigerant provided by the application takes fluorocarbon and trifluoropropylmethyl silicone oil as main matrixes, and adds fluorine modified silane with multi-end branching as a flow promoter, on one hand, the branched structure has a good flow promoting effect, on the other hand, the system compatibility of the fluorocarbon and the trifluoropropylmethyl silicone oil can be promoted, so that the silicon-containing liquid refrigerant becomes a similar single system, the contact area of the silicon-containing component part and a silicon-containing material of an electronic substrate can be increased, the silicon-containing liquid refrigerant can flow and transfer quickly, the heat conduction is greatly promoted, meanwhile, the compatibility of a cooling liquid component system and the electronic equipment material can be improved, and the electronic equipment material is protected from being damaged.
2. The silicon-containing liquid coolant provided by the application is non-flammable and has good insulating property, and the physicochemical property of the silicon-containing liquid coolant can completely match the requirements of various indexes of a data center or an electronic equipment cooling system on the cooling medium.
Drawings
FIG. 1 is a diagram of an electronic device sample 1 in a compatibility test 1 according to an embodiment of the present disclosure;
FIGS. 1-1a and 1-1b are a comparative picture of an embodiment of the present application of a liquid coolant before and after immersion of part 1 of an electronic device sample 1 in the liquid coolant;
FIGS. 1-2a and 1-2b are a comparative picture of an embodiment of the present application of a liquid coolant before and after immersion of part 2 of an electronic device sample 1 in the liquid coolant;
FIGS. 1-3a and 1-3b are a comparative picture of an embodiment of the electronic device sample 1 before and after immersion of the component 3 in a liquid coolant, and a comparative picture of an infrared spectrum, respectively;
FIGS. 1-4a and FIGS. 1-4b are a comparative sample and infrared spectrum of a part 4 of an electronic device sample 1 of the example of the present application before and after immersion in a liquid coolant, respectively;
FIGS. 1-5a and FIGS. 1-5b are a comparative sample set and an infrared spectrum set, respectively, of a part 5 of an electronic device sample 1 of the present example before immersion in a liquid coolant;
FIG. 2 is a diagram of an electronic device sample 2 during a compatibility test according to an embodiment of the present disclosure;
FIGS. 2-a and 2-b are a liquid-cooled, liquid-immersed comparative sample 2 and an infrared spectrum comparative sample, respectively, in accordance with an embodiment of the present invention;
FIG. 3 is a diagram of a testing apparatus for compatibility test 2 according to an embodiment of the present application;
FIG. 4 is a comparison graph of the IR spectra of a liquid coolant before and after use in accordance with compatibility test 2 of the example of the present application.
Detailed Description
In order to facilitate the understanding of the scheme of the present application by those skilled in the art, the following further description is provided with specific examples, and it should be understood that the examples are illustrative of the scheme of the present application and are not intended to limit the scope of the present application.
The embodiment of the application relates to a composition, a silicon-containing liquid coolant, a preparation method thereof and an immersion cooling system, solves the defects of poor liquidity, poor compatibility between a cooling liquid component system and an electronic equipment material and the like of the existing cooling liquid, and provides the liquid coolant with good liquidity, excellent heat dissipation function and excellent material compatibility.
In order to achieve the above purpose, the present application mainly provides the following technical solutions:
the embodiment of the application provides a composition, which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of a flow promoter;
2-10 parts of hexafluoropropylene trimer.
In a preferred embodiment of the present application, the fluorocarbon compound has the following general structural formula: ri-(C(Rf)F(CF2)xO)n- (CF2O)m-(CF2)y-RsWherein R isfSelected from H, -F, -CF3or-CF2CF3A group; riSelected from H, -F, -CF3、-CF2CF3、 -CF3O or-CF2CF3An O group; rsSelected from-F, -CF3、-CF2CF3or-CF (CF)3)CF3A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
In a preferred embodiment of the present application, the fluorocarbon is at least one of the following: h- (C (H) F (CF)2)xO)n-(CF2O)m- (CF2)y-F，H-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，H-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3， H-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，F-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-F，F- (C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，F-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，F- (C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3- (C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3- (C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3CF2-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-F， CF3CF2-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3CF2-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3， CF3CF2-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-F， CF3O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3， CF3O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3CF2O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y- F，CF3CF2O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3CF2O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y- CF2CF3，CF3CF2O-(C(H)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，H-(CF2(CF2)xO)n-(CF2O)m- (CF2)y-F，H-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF3，H-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，H- (CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，F-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-F，F-(CF2(CF2)xO)n- (CF2O)m-(CF2)y-CF3，F-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，F-(CF2(CF2)xO)n-(CF2O)m-(CF2)y- CF(CF3)CF3，CF3-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3- (CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3CF2- (CF2(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3CF2-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3CF2- (CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3CF2-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3， CF3O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3O- (CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3， CF3CF2O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3CF2O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF3， CF3CF2O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3CF2O-(CF2(CF2)xO)n-(CF2O)m-(CF2)y- CF(CF3)CF3，H-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，H-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3， H-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，H-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3， F-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，F-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，F- (C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，F-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3， CF3-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3- (C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3CF2-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3CF2-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3， CF3CF2-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3CF2-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y- CF(CF3)CF3，CF3O-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3O-(C(CF3)F(CF2)xO)n-(CF2O)m- (CF2)y-CF3，CF3O-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3O-(C(CF3)F(CF2)xO)n-(CF2O)m- (CF2)y-CF(CF3)CF3，CF3CF2O-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3CF2O-(C(CF3)F(CF2)xO)n- (CF2O)m-(CF2)y-CF3，CF3CF2O-(C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3CF2O- (C(CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，H-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，H- (C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，H-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，H- (C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，F-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F， F-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，F-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3， F-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3-(C(CF2CF3)F(CF2)xO)n-(CF2O)m- (CF2)y-F，CF3-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3-(C(CF2CF3)F(CF2)xO)n-(CF2O)m- (CF2)y-CF2CF3，CF3-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3CF2- (C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3CF2-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3， CF3CF2-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3CF2-(C(CF2CF3)F(CF2)xO)n-(CF2O)m- (CF2)y-CF(CF3)CF3，CF3O-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-F，CF3O-(C(CF2CF3)F(CF2)xO)n- (CF2O)m-(CF2)y-CF3，CF3O-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF2CF3，CF3O- (C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3，CF3CF2O-(C(CF2CF3)F(CF2)xO)n-(CF2O)m- (CF2)y-F，CF3CF2O-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF3，CF3CF2O-(C(CF2CF3)F(CF2)xO)n- (CF2O)m-(CF2)y-CF2CF3，CF3CF2O-(C(CF2CF3)F(CF2)xO)n-(CF2O)m-(CF2)y-CF(CF3)CF3. In these fluorocarbons, x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
In a preferred embodiment of the present application, the molecular weight of the above trifluoropropylmethylsilicone oil is 500-2000.
In a preferred embodiment of the present application, the flow promoter is a fluorine-modified silane. Preferably, the fluorine modified silane is prepared by the following method: adding 5-12 parts of tetramethyltetravinylcyclotetrasiloxane into 40-60 parts of dimethylbenzene according to parts by weight for dispersion and stirring, then adding 3-8 parts of perfluorohexylethyl methacrylate, 0.5-1.2 parts of butenediol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, carrying out nitrogen protection reaction for 4-8 hours, and then carrying out reduced pressure distillation at 140 ℃ for 0.5-2 hours to obtain a flow promoter, wherein the specific reaction formula is shown as the following formula (1).
In a preferred embodiment of the present application, the above composition is used for a cooling medium or a heat transfer medium.
In a preferred embodiment of the present application, the above composition is present in the cooling medium or heat transfer medium in an amount of at least 20% by weight.
The embodiment of the application also provides a silicon-containing liquid coolant which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of a flow promoter;
2-10 parts of hexafluoropropylene trimer.
In a preferred embodiment of the present application, the fluorocarbon compound has the following general structural formula: ri-(C(Rf)F(CF2)xO)n- (CF2O)m-(CF2)y-RsWherein R isfSelected from H, -F, -CF3or-CF2CF3A group; riSelected from H, -F, -CF3、-CF2CF3、 -CF3O or-CF2CF3An O group; rsSelected from-F, -CF3、-CF2CF3or-CF (CF)3)CF3A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
In a preferred embodiment of the present application, the molecular weight of the above trifluoropropylmethylsilicone oil is 500-2000.
In a preferred embodiment of the present application, the flow promoter is a fluorine-modified silane, and the preparation method thereof is as described above.
The embodiment of the application also provides a preparation method of the silicon-containing liquid refrigerant, which comprises the following steps: and (2) physically mixing the fluorocarbon, the trifluoropropylmethyl silicone oil, the flow promoter and the hexafluoropropylene trimer in a liquid phase state according to corresponding proportions to obtain the silicon-containing liquid refrigerant.
The composition or the liquid coolant provided by the embodiment of the application can be used in an electronic device cooling system. The silicon-containing liquid coolant provided by the embodiment of the application has good material compatibility, does not cause swelling corrosion to chips and circuits in equipment even if contacted for a long time, and can be applied to various sensitive materials, including but not limited to aluminum, PMMA, butyl rubber, copper, polyethylene, natural rubber, carbon steel, polypropylene, nitrile rubber, 302 stainless steel, polycarbonate, ethylene propylene diene monomer rubber, brass, polyester, molybdenum, epoxy resin, tantalum, PET, tungsten, phenolic resin, copper alloy C172, ABS, magnesium alloy AZ32B and the like.
An embodiment of the present application further provides an immersion cooling system, including:
a totally or non-totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the above composition or the above liquid refrigerant.
In some embodiments, the above-described composition or refrigerant is present in the above-described cooling medium in an amount of at least 20% by weight, such as a cooling medium comprising at least 20% by weight, at least 35% by weight, at least 45% by weight, at least 65% by weight, at least 85% by weight, or 100% by weight of the above-described composition or refrigerant. In addition to the above-mentioned liquid refrigerant, the cooling medium may also comprise one or more of the following components in an amount of up to 75% by weight, based on the total weight of the cooling medium: ethers, alkanes, perfluoroolefins, alkenes, halogenated alkenes, perfluorocarbons, perfluorinated tertiary amines, perfluorinated ethers, cycloalkanes, esters, perfluorinated ketones, ethylene oxide, aromatics, siloxanes, hydrochlorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons, hydrofluoroolefins, hydrochloroolefins, hydrochlorofluoroolefins, hydrofluoroethers, or mixtures thereof; or alkanes, perfluoroolefins, halogenated olefins, perfluorocarbons, perfluorinated tertiary amines, perfluorinated ethers, cycloalkanes, perfluorinated ketones, aromatics, siloxanes, hydrochlorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons, hydrofluoroolefins, hydrochlorofluoroolefins, hydrofluoroethers, or mixtures thereof, based on the total weight of the working fluid. Such additional components may be selected to alter or enhance the properties of the composition for a particular use.
In some embodiments of the present application, the heat generating component is partially or completely immersed in the cooling medium to exchange heat between the electronic device and the cooling medium. The heat generating component may include one or more electronic devices. The electronic device may include a computer server; data centers may also be included, particularly data centers operating at frequencies greater than 3 GHz. Among other things, a data center may include centrally managed computing resources and associated equipment or portions of a data center that support the system, as well as module components that provide the data center with other modules. The electronic device further comprises one or more of a microprocessor, a semiconductor wafer used to manufacture the semiconductor device, a power control semiconductor, an electrochemical cell, a power distribution switching gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, or a laser.
In some embodiments of the present application, the immersion cooling system is a single-phase immersion cooling system. The immersion cooling system, when operating in single-phase immersion cooling, may further comprise a pump and a heat exchanger, the pump being operative to move cooling medium to and from the heat-generating component and the heat exchanger, and the heat exchanger being operative to cool the medium. The heat exchanger may be disposed within the housing or outside the housing.
Embodiments of the present application also provide a method for cooling a heat-generating component comprising partially or fully immersing the heat-generating component in a cooling medium comprising the above-described composition or liquid coolant to effect heat exchange between the electronic device and the cooling medium.
For better understanding of the above technical solutions, the following detailed descriptions will be provided with reference to the drawings and specific embodiments of the specification, but the present invention is not limited thereto.
Examples
Silicon-containing liquid refrigerants were prepared by physically mixing the liquid refrigerants in the liquid phase state according to the component ratios in table 1, and the physical and chemical properties of the liquid refrigerants were tested to obtain the test results shown in table 2.
TABLE 1 composition structure and ratio of liquid refrigerant
The flow improver of example 1 above was prepared by the following method: adding 8 parts of tetramethyltetravinylcyclotetrasiloxane into 50g of dimethylbenzene, dispersing and stirring, then adding 5g of perfluorohexylethyl methacrylate, 0.5g of butenediol and 0.5g of decenal, heating to 70 ℃, adding 0.01g of benzoyl peroxide and 0.005g of dodecyl mercaptan, reacting for 4 hours under the protection of nitrogen, and then distilling at 140 ℃ under reduced pressure for 2 hours to obtain a flow promoter;
the flow improver of example 2 above was prepared by the following method: adding 5g of tetramethyltetravinylcyclotetrasiloxane into 40g of dimethylbenzene, dispersing and stirring, then adding 3g of perfluorohexylethyl methacrylate, 1.2g of butenediol and 0.1g of decenal, heating to 75 ℃, adding 0.005g of benzoyl peroxide and 0.001g of dodecyl mercaptan, reacting for 8 hours under the protection of nitrogen, and then distilling at 140 ℃ under reduced pressure for 0.5 hour to obtain a flow promoter;
the flow improver of example 3 above was prepared by the following method: adding 12g of tetramethyltetravinylcyclotetrasiloxane into 60g of xylene, dispersing and stirring, then adding 8g of perfluorohexylethyl methacrylate, 0.8g of butenediol and 1g of decenal, heating to 60 ℃, adding 0.01g of benzoyl peroxide and 0.003g of dodecyl mercaptan, reacting for 6 hours under the protection of nitrogen, and then distilling at 140 ℃ under reduced pressure for 1 hour to obtain the flow promoter.
TABLE 2 basic physicochemical Properties test results of liquid refrigerant
As can be seen from the detection data in Table 2, the silicon-containing liquid coolant provided by the embodiment of the application has the characteristics of low viscosity, low dielectric constant, high specific heat capacity and high thermal conductivity coefficient, is non-toxic and non-flammable, and has sufficient safety performance. Wherein the heat conductivity coefficient of the silicon-containing liquid refrigerant is more than 4 times of that of the commercial liquid refrigerant FC40 (0.067W/m.K) and Novec series (0.065W/m.K), and the specific heat capacities of the silicon-containing liquid refrigerants are all more than 1160J/(kg.DEG C), thereby providing more effective heat transfer, and simultaneously the viscosity of the silicon-containing liquid refrigerant can reach 3.45mm at the lowest2S, has goodFluidity, which can provide a more effective cooling effect when used in a cooling system for a heat generating component.
Compatibility test 1:
the compatibility of the liquid refrigerant provided by the application and an electronic device is detected, the adopted electronic device detection samples are shown in table 2, and the adopted detection method comprises the following steps:
(1) high boiling point liquid refrigerant detection process
Weighing 5g of material sample in a 50mL beaker, adding 50g of high-boiling liquid refrigerant, placing the material sample in an oven for soaking for 96h at 80 ℃, taking out the material sample, collecting the liquid refrigerant, cleaning the sample by using the liquid refrigerant, wherein the washing time is not more than 30s, then sucking the residual liquid refrigerant on the sample by using filter paper, standing for 30min at room temperature, and carrying out weight, volume, hardness change and infrared test.
(2) Low boiling point liquid coolant detection process
Weighing 5g of material sample in a Soxhlet extraction tube (if the sample is required to be filled in a filter paper barrel), and weighing 100mL of low-boiling-point refrigerant in a Soxhlet extraction bottle (zeolite or a rotor is added in the extraction bottle). Installing the Soxhlet extraction device, turning on cooling water, turning on the power supply of the oil bath pan, and setting the heating temperature (higher than the boiling point of polyether). Heated to reflux for 72 h. And collecting the liquid refrigerant after taking out the material sample, sucking the residual liquid refrigerant on the sample by using filter paper, standing at room temperature for 30min, and then carrying out weight, volume, hardness change and infrared test.
(3) Class of detection
a. Appearance: and respectively observing the appearance of the sample and the appearance of the liquid cooling agent before and after soaking, and recording.
b. Mass change:
the mass of the specimen in the air before and after immersion was measured according to the specification of GB/T1690, and the mass change percentage (. DELTA.W) was calculated:
in the formula: Δ W-percent change in weight of material sample,%;
W1material before immersionWeight of the sample in air, g;
W3weight in air, g, of the soaked material sample.
c. Volume change:
the mass of the test specimens in air and in distilled water before and after immersion was measured according to the specification of GB/T1690, respectively, and the volume change percentage (. DELTA.V) was calculated:
in the formula: Δ V — percent change in sample volume,%;
W1-weight in air, g, of the sample before soaking;
W2-weight of sample in water before soaking, g;
W3-weight in air, g, of the soaked sample;
W4-weight of soaked sample in water, g;
d. variation in hardness
The hardness of the sample before and after immersion was measured according to the specification of GB/T6031, and the change in hardness Δ H ═ H was obtained1-H0In which H is1Hardness before immersion, H0Hardness after soaking.
e. Liquid refrigerant infrared
Coating a sample on a potassium bromide window, and placing the potassium bromide window in an infrared spectrometer at 4000-400 cm-1Infrared scanning measurements were performed in the wavenumber range.
TABLE 3 compatibility test results of silicon-containing refrigerants and electronic devices
In the detection method, the liquid cooling agent is still in a clear state, the electronic device is not subjected to swelling corrosion, and the volume and mass changes of the electronic device sample before and after soaking are very small as can be seen from the detection data in Table 4. The comparison of the infrared spectrums of the corresponding liquid coolant before and after soaking the electronic device shows that the coincidence degree of the infrared spectrums is high, no obvious change is seen, and the composition of the visible liquid coolant is basically unchanged, so that the silicon-containing liquid coolant provided by the application has very good material compatibility with the electronic device, does not cause swelling corrosion to chips and circuits in equipment, and does not cause short circuit damage to the electronic device.
Compatibility test 2:
the computer host is arranged in the liquid cooling device, the cooling medium is filled in the liquid cooling device, so that the computer host is completely immersed in the cooling medium, and the computer host is externally connected with the display. The liquid cooling device is connected to a pump, and when the pump is operated, a cooling medium circulates through the pump and exchanges heat with a heat exchanger outside the liquid cooling device, as shown in fig. 3. The cooling medium of the liquid cooling device adopts the silicon-containing liquid refrigerant provided by the application, under the condition that the CPU runs at full load, the computer stably runs for 24 hours, the temperature of the CPU is detected through a CPU-Z program, and the temperature of the cooling medium is displayed by the thermometer with the display of the machine body.
For comparison, the computer mainframe only uses a common fan to exchange heat with the CPU, runs for 24h under the condition that the CPU runs at full load, and detects the temperature of the CPU through a CPU-Z program.
The test data is shown in table 4 below, from which it can be seen that the cooling effect of the CPU is higher than that of the conventional fan heat exchange using a silicon-containing coolant as the cooling medium.
The silicon-containing liquid coolant is used as a cooling medium, so that after the computer continuously and stably operates for 1 month, the performance of the computer is still stable, the cooling medium does not damage components such as a mainboard, a CPU (central processing unit), a GPU (graphics processing unit) and the like, the silicon-containing liquid coolant in a case is sampled and subjected to spectrum analysis, infrared spectrograms before and after use of the silicon-containing liquid coolant shown in a figure 4 are obtained, and the infrared spectrograms can be seen from the graphs, the components of the silicon-containing liquid coolant are basically not changed, so that the liquid coolant does not cause swelling corrosion to all accessories of a computer host, and the material compatibility is very good.
TABLE 4 CPU temperature test data
Finally, the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application, and all the technical solutions of the present application should be covered by the claims of the present application.
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