阅读说明：本技术 薄型均温板元件结构及其制造方法 (Thin temperature-equalizing plate element structure and manufacturing method thereof ) 是由 陈振贤 黄振权 于 2020-05-26 设计创作，主要内容包括：一种薄型均温板元件结构,包含一第一片材、一第二片材、一焊接层结构、一第一毛细结构和一第二毛细结构,第一片材具有一沟槽结构,沟槽结构具有一支撑结构并容置第一毛细结构,焊接层结构环设于沟槽结构的外侧,并使第一片材与第二片材气密接合,第二毛细结构铺置于支撑结构与第二片材之间,本发明的第二毛细结构作为支撑结构高度的延伸,且厚度与焊接层结构的厚度趋于一致,以使薄型均温板元件结构具有较均匀的厚度。(A thin type temperature equalizing plate element structure comprises a first sheet, a second sheet, a welding layer structure, a first capillary structure and a second capillary structure, wherein the first sheet is provided with a groove structure, the groove structure is provided with a supporting structure and accommodates the first capillary structure, the welding layer structure is arranged on the outer side of the groove structure in a surrounding mode and enables the first sheet and the second sheet to be in airtight joint, and the second capillary structure is laid between the supporting structure and the second sheet.)

1. A thin vapor chamber device structure, comprising:

a first sheet having a first surface with a trench structure having a support structure therein;

a second sheet material, which is provided with a second surface corresponding to the first surface, and a closed accommodating space is formed between the groove structure of the first surface and the second surface;

the welding layer structure is arranged around the periphery of the groove structure and is arranged between the first sheet and the second sheet so as to enable the first sheet to be in airtight joint with the second sheet;

a first capillary structure formed in the groove structure, and a vacuum air channel space is formed between the first capillary structure and the second surface; and

and the second capillary structure is formed between the support structure and the second surface.

2. The thin temperature equalization plate element structure as claimed in claim 1, wherein the first surface has a first ring structure surrounding the outer side of the groove structure, and the second surface has a second ring structure matching and fitting the first ring structure.

3. The thin vapor chamber device structure of claim 2, wherein the first annular structure is an annular protrusion structure and the second annular structure is an annular recess structure.

4. The thin vapor chamber device structure of claim 2, wherein the first annular structure is an annular concave structure and the second annular structure is an annular convex structure.

5. The thin temperature-uniforming plate element structure of claim 2, wherein the first annular structure is a first annular recess structure, the second annular structure is a second annular recess structure, an annular space is formed between the first annular recess structure and the second annular recess structure, and the thin temperature-uniforming plate element structure further comprises an air-tight ring disposed in the annular space and closely attached to the first annular recess structure and the second annular recess structure.

6. The thin vapor chamber device structure of claim 2, wherein the first annular structure and the second annular structure are both an annular protrusion structure.

7. The thin temperature equalization plate element structure of claim 1, wherein the first capillary structure and the second capillary structure are formed by a slurry through a sintering process, the average pore size of the first capillary structure and the second capillary structure is less than 10 μm, the thickness of the thin temperature equalization plate element structure is not more than 1.0mm, and further a working fluid is disposed in the sealed accommodating space, and the sealed accommodating space is in a vacuum negative pressure state.

8. The thin vapor-panel element structure according to claim 1, wherein the thickness of the second wick structure is between 80% and 120% of the thickness of the solder layer structure.

9. The thin temperature-uniforming plate element structure as claimed in claim 1, wherein the first and second sheets are made of copper, copper alloy, titanium alloy or stainless steel.

10. A method of manufacturing a thin temperature-uniforming plate member structure, comprising:

providing a first sheet material with a first surface, wherein the first surface is provided with a groove structure and a first annular structure, a supporting structure is arranged in the groove structure, and the first annular structure is arranged outside the groove structure in a surrounding manner;

laying a slurry on the groove structure and covering the support structure, wherein the slurry contains a metal powder;

heating the slurry to sinter the metal powder to produce a first capillary structure formed in the trench structure and a second capillary structure formed on the support structure;

laying a brazing paste material on the outer side of the first annular structure of the first surface;

providing a second sheet material, wherein the second sheet material is provided with a second surface corresponding to the first surface, and the second surface is provided with a second annular structure corresponding to the first annular structure;

covering the first sheet and the second sheet to enable the first annular structure and the second annular structure to be buckled and isolate the first capillary structure and the second capillary structure from the hard soldering paste material; and

heating the solder paste material to form a solder layer structure to seal the first sheet and the second sheet.

Technical Field

The present invention relates to a thin temperature-uniforming plate element structure and a manufacturing method thereof, and more particularly, to a temperature-uniforming plate element structure having a capillary structure disposed at a specific position, so that the entire thin temperature-uniforming plate element structure has a uniform thickness.

Background

The development trend of electronic and handheld communication devices is continuously towards thinning and high functionality, and demands on the operation speed and functions of a Microprocessor (Microprocessor) in the device are also increasing. The microprocessor is a core element of electronic and communication products, and is easy to generate heat under high-speed operation to become a main heating element of the electronic device. If the heat is not dissipated instantaneously, a localized processing Hot Spot (Hot Spot) is created. Without a good thermal management scheme and a heat dissipation system, the microprocessor is often overheated and cannot perform its intended function, which may even affect the lifetime and reliability of the whole electronic device system. Therefore, electronic products need excellent heat dissipation capability, and particularly, ultra-thin electronic devices such as smart phones (smartphones) and Tablet PCs (Tablet PCs) need excellent heat dissipation capability. Currently, an effective way for electronic and communication products to handle Hot spots (Hot spots) is to contact the heat sink (Evaporator) of the thin Vapor Chamber (Vapor Chamber) with the microprocessor of the electronic device. The high heat generated by the microprocessor is conducted and distributed to the cabinet, thereby radiating heat into the air. The temperature equalizing plate is basically a closed cavity containing working fluid, and the purpose of rapid heat conduction or heat dissipation is achieved by means of liquid-gas two-phase change of continuous circulation of the working fluid in the cavity and the convection of gas and liquid between the heat absorption end and the condensation end, wherein the gas returns to the liquid.

In a conventional method for manufacturing a vapor chamber, a Copper Mesh (Copper Screen Mesh) or a Woven Mesh (Copper Woven Mesh) is laid in a groove formed in a Copper sheet substrate by etching. In practical application, the copper mesh must be cut according to the shape and size of the groove to be laid in the groove. The copper mesh is pressed by a graphite jig and sintered at high temperature to form a capillary structure on the surface of the groove. And welding the sheet copper substrate in a mode of grooves inside to form the air passage cavity. The sheet copper substrate is further sealed, filled with water, vacuumized, etc. to make a uniform temperature plate or plate type heat pipe with a capillary structure, as shown in fig. 1A.

However, the Copper Mesh (Copper Screen Mesh) is only cross-woven, and the capillary structure is simple. Ultra-thin temperature equalization plate elements with thicknesses less than 0.3 millimeter (mm) often have spaces of only tens of micrometers (um) in capillary structure thickness due to airway space limitations. Therefore, the capillary force of the copper mesh as a capillary structure is often insufficient in the case of antigravity. In addition, the shape of the temperature-uniforming plate element is not square and regular, and is light and thin, and the processes of weaving, cutting, manual laying, pressing of a graphite jig and the like of the copper mesh during mass production make the process of manufacturing the capillary structure of the ultrathin temperature-uniforming plate element by the copper mesh complicated and are not beneficial to high-yield mass production.

Furthermore, as the ultra-thin isothermal plate has thinner and thinner thickness, for example, the isothermal plate with a device thickness of 0.3mm is hermetically sealed by two copper alloy sheets with etched grooves of 0.2mm and 0.1mm through a Brazing process; a 0.25mm cell thickness vapor chamber was hermetically sealed by a Brazing process from 0.15mm and 0.1mm two copper alloy sheets with etched grooves, as shown in fig. 1B. The thickness of the welding layer structure is about 20um-30um, and 6% -10% of the thickness of the lower temperature-equalizing plate element is raised at the edge of the element, which affects the flatness. The thickness of the hard paste material is also relatively less negligible. When the edge of the braze paste material is lifted by the distance of the copper sheet substrate, the support in the middle is not high enough, as shown in a1 of fig. 1C. After evacuation, the pressure difference between the inside and outside of the element will cause the center of the vapor chamber to collapse inward, destroying the better flat structure of the element, as shown in FIG. 1D.

Furthermore, if a higher porosity material is used instead of a copper mesh as the capillary structure. However, when the capillary structure effect is gradually improved, a new problem is derived. When brazing two copper sheet substrates, the brazing paste material may penetrate into the capillary structure area to contaminate the capillary structure, thereby greatly reducing the capillary force, as shown in a2 of fig. 1C.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a thin temperature-uniforming plate element structure and a method for manufacturing the same, which can prevent contamination of a capillary structure, maintain the capillary force of the capillary structure, achieve high-quality mass production, and effectively solve the problems derived from the manufacturing of a thin temperature-uniforming plate by using a solder layer structure and a hard solder paste material.

In order to achieve the above object, the present invention discloses a thin temperature-uniforming plate element structure, which is characterized by comprising:

a first sheet having a first surface with a trench structure having a support structure therein;

a second sheet material, which is provided with a second surface corresponding to the first surface, and a closed accommodating space is formed between the groove structure of the first surface and the second surface;

the welding layer structure is arranged around the periphery of the groove structure and is arranged between the first sheet and the second sheet so as to enable the first sheet to be in airtight joint with the second sheet;

a first capillary structure formed in the groove structure, and a vacuum air channel space is formed between the first capillary structure and the second surface; and

and the second capillary structure is formed between the support structure and the second surface.

The first surface is provided with a first annular structure which is arranged on the outer side of the groove structure in a surrounding mode, the second surface is provided with a second annular structure, and the second annular structure is matched with and sleeved with the first annular structure.

Wherein the first annular structure is an annular convex structure, and the second annular structure is an annular concave structure.

Wherein, the first annular structure is an annular concave structure, and the second annular structure is an annular convex structure.

The thin temperature-equalizing plate element structure further comprises an airtight ring which is arranged in the annular space and is tightly attached to the first annular concave portion structure and the second annular concave portion structure.

Wherein, the first annular structure and the second annular structure are both an annular convex structure.

The first capillary structure and the second capillary structure are formed by a slurry through a sintering process, the average pore size of the first capillary structure and the second capillary structure is less than 10 micrometers, the thickness of the thin temperature-equalizing plate element structure is not more than 1.0mm, and a working fluid is further arranged in the closed accommodating space which is in a vacuum negative pressure state.

Wherein the thickness of the second capillary structure is between 80% and 120% of the thickness of the welding layer structure.

The first sheet material and the second sheet material are made of copper, copper alloy, titanium alloy or stainless steel.

Also discloses a manufacturing method of the thin temperature-equalizing plate element structure, which is characterized by comprising the following steps:

providing a first sheet material with a first surface, wherein the first surface is provided with a groove structure and a first annular structure, a supporting structure is arranged in the groove structure, and the first annular structure is arranged outside the groove structure in a surrounding manner;

laying a slurry on the groove structure and covering the support structure, wherein the slurry contains a metal powder;

heating the slurry to sinter the metal powder to produce a first capillary structure formed in the trench structure and a second capillary structure formed on the support structure;

laying a brazing paste material on the outer side of the first annular structure of the first surface;

providing a second sheet material, wherein the second sheet material is provided with a second surface corresponding to the first surface, and the second surface is provided with a second annular structure corresponding to the first annular structure;

covering the first sheet and the second sheet to enable the first annular structure and the second annular structure to be buckled and isolate the first capillary structure and the second capillary structure from the hard soldering paste material; and

heating the solder paste material to form a solder layer structure to seal the first sheet and the second sheet.

In summary, the second capillary structure on the supporting structure of the vacuum cavity of the thin temperature-uniforming plate element is used as the extension of the height of the supporting structure, so as to compensate the thickness difference of the middle area caused by the thickness of the welding layer structure around the element after the upper and lower sheets are sealed. The ultrathin temperature-equalizing plate utilizes the thickness of the second capillary structure on the supporting structure to complement the structural thickness of the welding layer added after the brazing sealing, so that the thickness of elements is uniform and consistent. The second wicking structure that is compressed between the support structure and the second sheet may also serve to reinforce the function of the first wicking structure in the channel structure. Meanwhile, the annular structure on the surface of the sheet isolates the hard soldering paste material from diffusing into the capillary structure in the sealing process, so that the pollution of the capillary structure is avoided, and the capillary force of the porous capillary structure is further maintained.

Drawings

FIG. 1A: a prior art vapor chamber made of copper mesh is shown.

Fig. 1B, 1C, and 1D: showing a temperature equalization plate in the prior art and its problems.

FIG. 2A: the cross-sectional view of the thin temperature equalization plate element structure according to an embodiment of the present invention is shown.

FIG. 2B: the cross-sectional view of the thin temperature-equalizing plate element according to another embodiment of the present invention is shown.

FIG. 2C: the cross-sectional view of the thin temperature-equalizing plate element according to another embodiment of the present invention is shown.

FIG. 2D: the cross-sectional view of the thin temperature-equalizing plate element according to another embodiment of the present invention is shown.

FIG. 3: a schematic diagram illustrating the structure of the first sheet and the second sheet in one embodiment of the present invention is shown.

FIG. 4A: the cross-sectional view of the thin temperature-equalizing plate element according to another embodiment of the present invention is shown.

FIG. 4B: the cross-sectional view of the thin temperature-equalizing plate element according to another embodiment of the present invention is shown.

FIG. 4C: the cross-sectional view of the thin temperature-equalizing plate element according to another embodiment of the present invention is shown.

FIG. 5 is a schematic view showing a method for manufacturing a thin temperature-uniforming plate element structure according to the present invention.

FIG. 6 is a flow chart showing the steps of the method for fabricating the thin temperature-uniforming plate element structure according to the present invention.

Detailed Description

In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described in detail hereinafter with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitation with respect to the scope of the invention or its corresponding embodiments is intended by the specific methods, devices, conditions, materials, etc. In addition, the elements shown in the drawings are only used for expressing the relative positions and are not drawn to scale, and the step numbers of the present invention are only used for separating different steps, not for representing the step sequence, and are described in advance.

Please refer to fig. 2A. FIG. 2A is a cross-sectional view of a thin temperature equalization plate element according to an embodiment of the invention. The thin temperature-equalizing plate member structure provided by the present invention comprises a first sheet material 1, a second sheet material 2, a welding layer structure 3, a first capillary structure 41 and a second capillary structure 42. The first sheet 1 has a first surface 10, the first surface 10 has a groove structure 100, and the groove structure 100 has a supporting structure 101 therein. The second sheet 2 has a second surface 20 corresponding to the first surface 10, and a closed accommodating space is formed between the groove structure 100 of the first surface 10 and the second surface 20. The welding layer structure 3 is disposed around the periphery of the groove structure 100 and between the first sheet 1 and the second sheet 2, so as to hermetically join the first sheet 1 and the second sheet 2. The first capillary structure 41 is formed in the groove structure 100, and a vacuum air channel space 5 for vacuum is formed between the first capillary structure 41 and the second surface 20. The second capillary structure 42 is formed between the support structure 101 and the second surface 20.

The support structure 101 of the thin temperature-equalizing plate element structure of the present invention has a second capillary structure 42, and the height of the second capillary structure 42 is approximately equal to the thickness of the soldering layer structure 3. Thus, when the height of the outer edge of the first surface 10 is comparable to the height of the support structure 101, the height of the outer edge of the first surface 10 plus the solder layer structure 3 is approximately equal to the height of the support structure 101 plus the second capillary structure 42. Therefore, the outer side and the central height of the thin temperature-uniforming plate element structure can be made equal without adding other processes to adjust the heights of the outer edge of the first surface 10 and the supporting structure 101, and the phenomenon that the thickness of the element is not uniform due to the collapse of the central part caused by the unequal heights of the structure as shown in fig. 1D can not occur.

In practice, after the upper and lower metal sheets are hermetically bonded by the hard solder paste soldering process, the thickness of the soldering layer structure 3 is about 20-30 um. This results in a thickness difference of 6.6% and 10% between the central and peripheral edges for ultra-thin vapor-panel elements having a thickness of only 0.3 mm. If the temperature-equalizing plate element is only 0.2mm, the thickness difference is as high as 10-15%. In the embodiment of the present invention, the second capillary structure 42 and the soldering layer structure 3 are consistent and can be controlled between 20um and 30 um. For example, the thickness of the second capillary structure is 70%, 80%, 90%, 100%, 110%, 120%, 130%, or any ratio between 70% and 130% of the thickness of the soldering layer structure.

Please refer to fig. 2B and fig. 3. FIG. 2B is a cross-sectional view of another embodiment of the thin temperature-uniforming plate element according to the present invention. FIG. 3 is a schematic diagram showing the structure of the first sheet and the second sheet in one embodiment of the invention. The thin temperature-equalizing plate member structure of the present invention comprises a first sheet 1, a second sheet 2, a welding layer structure 3, a first capillary structure 41, and a second capillary structure 42. The first sheet 1 has a first surface 10. The first surface 10 has a trench structure 100 and a first ring structure 109. The trench structure 100 has a support structure 101. The first ring structure 109 is disposed around the outer side of the trench structure 100. The second sheet 2 has a second surface 20 corresponding to the first surface 10. The second surface 20 has a second annular structure 209 matching and fitting the first annular structure 109, so that a sealed accommodating space is formed between the groove structure 100 of the first surface 10 and the second surface 20. The welding layer structure 3 is disposed around the outside of the first ring-shaped structure 109 and between the first sheet 1 and the second sheet 2 to hermetically join the first sheet 1 and the second sheet 2. The first capillary structure 41 is laid within the trench structure 100. A vacuum airway space 5 is formed between the first capillary structure 41 and the second surface 20. The second capillary structure 42 is laid between the support structure 101 and the second surface 20.

In the present invention, the ring shape does not mean only a ring but broadly means a geometric figure in which a protrusion or a depression is formed along the outer periphery of the dimensional shape of the thin temperature equalization plate member. In different embodiments, the ring shape may be various ring-shaped polygons or ring-shaped geometric figures with arc angles.

The first surface 10 and the second surface 20 of the thin temperature-equalizing plate element structure of the invention are respectively provided with a concave or convex ring structure, so that a physical turn is formed between the capillary structure and the welding layer structure 3, and the spatial continuity of the joint plane of the first surface and the second surface is blocked. Compared to the technique of fig. 1C, the rheological hard solder paste material or the chemical solvent or the cracked polymer material volatilized when the hard solder paste material is heated does not contaminate the porous capillary structure along a continuous plane as shown in a2 in fig. 1C. Therefore, the design of the ring structure of the invention can effectively maintain the capillary force of the capillary structure.

Wherein the first capillary structure 41 and the second capillary structure 42 are formed simultaneously from a slurry by a sintering process.

The first capillary structure 41 and the second capillary structure 42 are porous capillary structures, and the average pore size is smaller than 10 um. The capillary structure of this pore size class has better capillary force, but is also easily contaminated by the leaked hard solder paste, the solvent of the hard solder paste, or the incompletely decomposed polymer during sealing, thereby affecting the transport capability of the capillary structure to the working fluid. The design of the first annular structure 109 and the second annular structure 209 in the present invention can effectively prevent the first capillary structure 41 in the trench structure 100 from being contaminated during the brazing process. In addition, the thin temperature equalization plate element structure further has a Working Fluid (Working Fluid) disposed in the first capillary structure 41 or the second capillary structure 42 of the sealed accommodating space, and the sealed accommodating space is in a vacuum negative pressure state. The working fluid flows and circulates in the capillary structure and the vacuum air passage space in the form of liquid phase and gas phase to play the function of rapid heat conduction.

The thickness of the thin temperature-uniforming plate element structure is not more than 1.0mm, and the thin temperature-uniforming plate element structure can be effectively applied to mobile communication equipment, such as a 5G smart phone, a tablet computer or various electronic products which are required to be light and thin. In the case of a component structure limited to such a low thickness, the increased thickness of the braze layer structure (about 20-30 um) and the difference in thickness between the surrounding and intermediate regions of the component due to the pressure difference between the interior and exterior of the element become a non-negligible part. It is important to make the entire thickness of the temperature equalizing plate more uniform and flat by using the second capillary structure 42 as the extension of the height of the supporting structure 101 in the present invention. In one embodiment, the second capillary structure 42 of the present invention is sintered to form a porous capillary structure, and then pressed by the second sheet 2 to form a capillary structure with better structural strength. The second capillary structure 42 can be used as an auxiliary capillary structure of the temperature-uniforming plate, and can increase the space of the vacuum air passage and improve the heat-conducting function of the thin temperature-uniforming plate

In the embodiment of FIG. 2B, the first ring structure 109 is an annular protrusion structure; the second annular structure 209 is an annular concave structure. The annular protrusion structure 109 and the annular recess structure 209 may be nested with each other. If the annular convex structure is divided into an outer side, an inner side and a top side, at least one side of the annular convex structure is tightly attached to the annular concave structure.

Please refer to fig. 2C. FIG. 2C is a cross-sectional view of another embodiment of the thin temperature-uniforming plate element according to the present invention. In this embodiment, most of the components are the same as in the previous embodiment, and different parts are as follows. The first annular structure 109 is an annular concave structure; the second annular structure 209 is an annular protrusion structure. The annular protrusion structure 109 and the annular recess structure 209 may be nested with each other. If the annular convex structure is divided into an outer side, an inner side and a top side, at least one side of the annular convex structure is tightly attached to the annular concave structure.

Please refer to fig. 2D. FIG. 2D is a cross-sectional view of another embodiment of the thin temperature-uniforming plate element according to the present invention. In this embodiment, most of the components are the same as in the previous embodiment, and different parts are as follows. The second surface 20 also has a trench 200, and the trench 200 is located corresponding to the trench 100. When the grooves 200 are formed on the second surface 20, the enclosed space and the vacuum duct space 5 become larger, or the thickness of the first capillary structure 41 can be made thicker, so as to increase the capillary force.

Please refer to fig. 4A. FIG. 4A is a cross-sectional view of another embodiment of a thin temperature-uniforming plate element according to the present invention. In this embodiment, most of the components are the same as in the previous embodiment, and different parts are as follows. The first ring-shaped structure 109 is a first ring-shaped recess structure, and the second ring-shaped structure 209 is a second ring-shaped recess structure. An annular space is formed between the first annular recess structure 109 and the second annular recess structure 209. The thin temperature-equalizing plate element structure further comprises an airtight ring 6 arranged in the annular space; and the airtight ring 6 is tightly attached to the first annular recess structure 109 and the second annular recess structure 209. If the annular recess structure is divided into an outer side, an inner side and an upper side, the airtight ring 6 can be closely attached to at least one of the first annular recess structure 109 and the second annular recess structure 209. The airtight ring 6 can be of various materials with a melting point higher than the brazing temperature.

Please refer to fig. 4B. FIG. 4B is a cross-sectional view of another embodiment of the thin temperature-uniforming plate element according to the present invention. In this embodiment, most of the components are the same as in the previous embodiment, and different parts are as follows. The first annular structure 109 and the second annular structure 109 are both annular protrusion structures. If the annular protrusion structure is divided into an outer side, an inner side and an upper side, the first annular structure 109 is closely attached to the second surface 20, or the second annular structure 209 is closely attached to the first surface 10, or the inner side of the first annular structure 109 is closely attached to the outer side of the second annular structure 209, or the outer side of the first annular structure 109 is closely attached to the inner side of the second annular structure 209.

In the above embodiments, the dual structure of the first annular structure 109 and the second annular structure 209 is to cut off the continuity of the space between the first sheet 1 and the second sheet 2, so that the capillary structure inside the first annular structure 109 and the second annular structure 209 is not contaminated during the process of forming the solder layer structure 3 by the hard solder paste outside the first annular structure 109 and the second annular structure 209.

Please refer to fig. 4C. FIG. 4C is a cross-sectional view of another embodiment of the thin temperature-uniforming plate element according to the present invention. In this embodiment, most of the components are the same as in the previous embodiment, and different parts are as follows. The first sheet 1 may have three grooves 100. In practice, the number of the grooves 100 may be one, two, three, or more, depending on the specific design, and the invention is not limited thereto.

In one embodiment, the first sheet and the second sheet are made of copper, copper alloy, titanium or titanium alloy. Copper and copper alloys are excellent heat conductive materials and have low production costs. Titanium and titanium alloys have high strength, low weight characteristics, and excellent corrosion, fatigue, and crack resistance. Copper, copper alloys, titanium and titanium alloys are therefore preferred for the present invention.

In another embodiment, the first sheet and the second sheet are made of stainless steel, and the stainless steel has higher hardness than copper. The first surface and the second surface are respectively electroplated with a copper thin layer, and the copper thin layers on the surfaces of the sheets are beneficial to hard welding, so that the heat conduction efficiency is effectively improved.

Please refer to fig. 5 and 6. FIG. 5 is a schematic view showing a method for manufacturing a thin temperature-uniforming plate element structure according to the present invention. FIG. 6 is a flow chart showing the steps of the method for fabricating the thin temperature-uniforming plate element structure according to the present invention. The present invention provides a method for manufacturing a thin temperature-uniforming plate element structure, and fig. 5 is a view similar to the embodiment of fig. 2C, but the manufacturing method of each embodiment does not depart from the following steps S1-S7.

S1: a first sheet 1 having a first surface 10 is provided. The first surface 10 has a trench structure 100 and a first ring structure 109. The trench structure 100 has a support structure 101. The first ring structure 109 is disposed around the outer side of the trench structure 100.

S2: a second sheet 2 is provided having a second surface 20 corresponding to the first surface 10. The second surface 20 has a second annular structure 209 opposite the first annular structure 109.

S3: a slurry 40 is laid over the trench structure 100 and over the support structure 101. The slurry 40 includes a metal powder, a solvent and a polymer.

S4: the slurry 40 is heated to volatilize the solvent, cleave and remove the polymer, and reduce and sinter the metal powder, while simultaneously forming a first capillary structure 41 within the trench structure 100 and a second capillary structure 42 on the support structure 101.

S5: a brazing paste material 30 is applied to the first surface 10 outside the first ring-shaped structure 109.

S6: the first sheet 1 and the second sheet 2 are closed, the first annular structure 109 and the second annular structure 209 are matched and nested, and the capillary structure is isolated from the braze paste material 30. That is, the first and second capillary structures 41 and 42 are inside the first and second annular structures 109 and 209, and the braze paste material 30 is outside the first and second annular structures 109 and 209.

S7: the hard solder paste material 30 is heated to form a solder layer structure 3 to seal the first sheet 1 and the second sheet 2.

Specifically, in the step of S3, a steel plate 70 may be used to cover the first sheet 1, and the holes on the steel plate 70 correspond to the groove structures 100 of the first sheet 1. The slurry 40 is placed on one end of the steel plate 70. The slurry 40 is then scraped through the hole to the other end of the steel plate 70 by a scraper 71. A portion of the slurry 40 falls into the trench structure 100 and fills over the trench structure 100 and the support structure 101. The steel plate 70 shields the first ring-shaped structure 109 and the outer side of the first ring-shaped structure 109, so the first ring-shaped structure 109 and the outer side of the first ring-shaped structure 109 are not adhered with the slurry 40.

The laying may be a steel Printing Process, a Screen Printing Process or a Dispensing Process.

In step S4, the slurry 40 is first heated at a low temperature to volatilize the solvent, and the volume is reduced and the slurry is converged into a solidified slurry. Then the temperature is increased to heat to crack and remove the polymer, and the polymer uniformly dispersed among the metal powder is cracked and burned off. Finally, the temperature is raised to the sintering temperature of the metal powder to form the first capillary structure 41 and the second capillary structure 42 with porous pores.

The porous capillary structure formed in the trench structure 100 is the first capillary structure 41; the porous capillary structure formed on the support structure 101 is the second capillary structure 42, both of which are formed simultaneously.

In this embodiment, the hard solder paste material 30 is laid on the first surface 10 in step S5, and then the first sheet 1 and the second sheet 2 are closed in step S6. In another embodiment, it is also possible to first join the first sheet 1 and the second sheet 2 in step S6, and then lay the hard solder paste material 30 on the lateral outer edges of the first sheet 1 and the second sheet 2 in step S5. During the soldering (braising) sintering process, the braze paste material 30 is introduced between the first sheet 1 and the second sheet 2 by capillary effect.

The above steps can prevent the internal capillary structure from being polluted by the hard soldering paste material 30 in the process of manufacturing the thin temperature-uniforming plate element structure. Moreover, the height difference caused by the welding layer structure can be filled up by the capillary structure through the adjustment of the step of printing and laying the slurry.

In summary, the capillary structure formed on the supporting structure in the cavity of the temperature equalizing plate element is used as the extension of the height of the supporting structure, so as to make up for the thickness difference of the middle area caused by the thickness of the welding layer structure around the element after the upper and lower sheets are sealed. For ultra-thin vapor chamber plates with a thickness of less than 0.3mm, even solder layer structures with a thickness of only about 20um to 30um will cause a difference in height of 6.7% to 10% due to the difference in pressure between the inside and the outside of the device. Once the thickness of the element is only 0.2mm, the height difference between the peripheral area and the middle area reaches 10-15%. The ultrathin temperature-equalizing plate utilizes the thickness of the second capillary structure on the supporting structure to complement the structural thickness of the welding layer added after the brazing sealing, so that the thickness of elements is uniform and consistent. The second wicking structure that is compressed between the support structure and the second sheet may also serve to reinforce the function of the first wicking structure in the channel structure.

In addition, the invention separates the hard soldering paste material from diffusing into the capillary structure in the sealing process by the annular structure on the surface of the sheet of the temperature equalizing plate element, thereby avoiding the pollution of the capillary structure and further maintaining the capillary force of the porous capillary structure. Compared with the prior art, the invention solves the problems of the ultrathin temperature-equalizing plate and the high-efficiency capillary structure in the manufacturing process and realizes the high-quality mass production of the temperature-equalizing plate.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.