阅读说明：本技术 用于扩散接合的方法及为此具有压力变化的设备 (Method for diffusion bonding and device therefor with pressure variation ) 是由 尼尔斯·哈内克劳斯 于 2020-01-23 设计创作，主要内容包括：本发明涉及一种用于借助第一冲头和第二冲头(11,13)进行扩散接合的方法,其中在这两个冲头(11,13)之间布置板状的接合件(21,22)。为了进行扩散接合而借助于该第一冲头和/或该第二冲头(11,13)将压力施加到这些接合件(21,22)上。附加地还引入该压力的变化。根据本发明提出,藉由该第一冲头(11)施加该压力和该压力变化,而该第二冲头(13)可以被实施成刚性的。此外,本发明涉及一种用于实施该方法的设备。(The invention relates to a method for diffusion bonding by means of a first and a second punch (11, 13), wherein a plate-shaped bonding element (21, 22) is arranged between the two punches (11, 13). For diffusion bonding, pressure is applied to the bonding elements (21, 22) by means of the first and/or second punch (11, 13). Additionally, a variation of this pressure is also introduced. According to the invention, the pressure and the pressure change are applied by the first punch (11), while the second punch (13) can be embodied as rigid. The invention further relates to a device for carrying out the method.)