阅读说明：本技术 相互屏蔽的印刷电路板组装件 (Mutually shielded printed circuit board assembly ) 是由 J·A·哈里根 于 2020-03-31 设计创作，主要内容包括：一种电子组装件,包括第一印刷电路板(PCB)、第二PCB和接地屏蔽。第一PCB包括第一多个电子组件和第一导电层。第二PCB包括第二多个电子组件和第二导电层。接地屏蔽被电连接在第一PCB的第一导电层与第二PCB的第二导电层之间以电连接第一PCB与第二PCB。第一PCB和第二PCB以堆叠方式被布置,使得该第一导电层和该第二导电层相互屏蔽第一多个电子组件中的至少一者和第二多个电子组件中的至少一者以防电磁干扰。(An electronic assembly includes a first Printed Circuit Board (PCB), a second PCB, and a ground shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The ground shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stacked manner such that the first conductive layer and the second conductive layer shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from each other against electromagnetic interference.)