阅读说明：本技术 温度检测装置以及半导体热处理设备 (Temperature detection device and semiconductor heat treatment equipment ) 是由 方洋 闫士泉 于 2021-08-30 设计创作，主要内容包括：本申请公开一种温度检测装置及半导体热处理设备,装配简单,能够有效提升拉温操作的工作效率以及测温的准确性。所述用于半导体热处理设备的温度检测装置包括：温度检测件,所述温度检测件呈杆状,一端设置有测温热传感器；安装板,可拆卸地与所述半导体热处理设备的工艺门连接；驱动部,装配于所述安装板表面,所述驱动部包括驱动源以及限位组件,其中所述限位组件夹持所述温度检测件,且所述温度检测件的长度方向平行于所述安装板表面；所述驱动源连接至所述限位组件,用于驱动所述限位组件运动,以带动所述温度检测件沿其长度方向运动,使所述温度检测件设有所述测温热传感器的一端通过所述工艺门上的通孔伸入所述半导体热处理设备的工艺管中。(The application discloses temperature-detecting device and semiconductor thermal treatment equipment, the assembly is simple, can effectively promote the work efficiency of drawing the temperature operation and the accuracy of temperature measurement. The temperature detection device for the semiconductor heat treatment equipment comprises: the temperature detection piece is rod-shaped, and one end of the temperature detection piece is provided with a temperature measurement heat sensor; the mounting plate is detachably connected with a process door of the semiconductor heat treatment equipment; the driving part is assembled on the surface of the mounting plate and comprises a driving source and a limiting component, wherein the limiting component clamps the temperature detection piece, and the length direction of the temperature detection piece is parallel to the surface of the mounting plate; the driving source is connected to the limiting assembly and used for driving the limiting assembly to move so as to drive the temperature detection piece to move along the length direction of the temperature detection piece, and one end, provided with the temperature measurement heat sensor, of the temperature detection piece extends into a process pipe of the semiconductor heat treatment equipment through a through hole in the process door.)

1. A temperature detection device for a semiconductor heat treatment apparatus, comprising:

the temperature detection piece is rod-shaped, and one end of the temperature detection piece is provided with a temperature measurement heat sensor;

the mounting plate is detachably connected with a process door of the semiconductor heat treatment equipment;

the drive division, assemble in mounting panel surface, the drive division includes driving source and spacing subassembly, wherein:

the limiting assembly clamps the temperature detection piece, and the length direction of the temperature detection piece is parallel to the surface of the mounting plate;

the driving source is connected to the limiting assembly and used for driving the limiting assembly to move so as to drive the temperature detection piece to move along the length direction of the temperature detection piece, and one end, provided with the temperature measurement heat sensor, of the temperature detection piece extends into a process pipe of the semiconductor heat treatment equipment through a through hole in the process door.

2. The temperature sensing device of claim 1, wherein the limit assembly comprises:

a first clamping member connected to the driving source and including at least two driving rollers;

the second clamping piece comprises at least two driven rotating wheels, the number of the driving rotating wheels is the same as that of the driven rotating wheels, the driving rotating wheels and the driven rotating wheels are arranged oppositely in a one-to-one correspondence mode, and the temperature detection piece is clamped between the driving rotating wheels and the driven rotating wheels;

the driving rotating wheel can rotate under the driving of the driving source, so that the temperature detection piece is driven to move along the length direction of the temperature detection piece.

3. The temperature sensing device of claim 2, wherein the driving wheel includes a driving wheel body and a driving shaft, the driving shaft is rotatably mounted on the surface of the mounting plate and perpendicular to the surface of the mounting plate, and the driving wheel body is mounted on the driving shaft.

4. The temperature detection apparatus according to claim 3, wherein the drive source includes:

a motor;

the motor mounting frame is arranged on the surface of the mounting plate and used for assembling the motor;

the synchronous belt wheel is sleeved on the output shaft of the motor and used for rotating along with the output shaft of the motor;

the synchronous belt is in transmission connection with the synchronous belt wheel and the driving rotating shaft, so that the synchronous belt wheel can drive the driving rotating shaft to rotate.

5. The temperature detecting device according to claim 4, wherein the driving wheel is mounted on a portion of the driving shaft away from the mounting plate, and the synchronous belt is connected to a portion of the driving shaft close to the mounting plate in a transmission manner;

the second clamping piece further comprises a mounting rack which is assembled on the surface of the mounting plate; the driven rotating wheel comprises a driven rotating wheel body and a driven rotating shaft, the driven rotating shaft is rotatably assembled on the mounting frame and is perpendicular to the surface of the mounting plate, and the driven rotating wheel is assembled on the driven rotating shaft;

the side of initiative runner body with the driven runner body all is provided with the centre gripping groove, the centre gripping groove of initiative runner body with the driven runner body sets up relatively to be located the coplanar, temperature detect spare centre gripping in the centre gripping inslot.

6. The apparatus according to claim 5, wherein one end of the mounting bracket is rotatably mounted on the surface of the mounting plate, and the other end of the mounting bracket is provided with an adjusting member for driving the mounting bracket to rotate so that the driven wheel is close to or far away from the driving wheel.

7. The temperature sensing device of claim 6, wherein the adjustment member comprises:

the rod piece is arranged in parallel to the surface of the mounting plate and penetrates through the mounting frame, a limiting end head is arranged at the first end of the rod piece, and threads are arranged on the outer surface of the second end of the rod piece;

the fixing block is arranged on the mounting plate, a threaded hole is formed in the fixing block, and the second end of the rod piece penetrates through the mounting frame and is in threaded connection with the fixing block;

the elastic piece is sleeved on the rod piece and positioned between the first end of the rod piece and the mounting frame;

and the pressing plate is arranged between the elastic piece and the mounting frame and used for transmitting the acting force applied by the elastic piece to the pressing plate to the mounting frame.

8. The apparatus according to claim 1, wherein the mounting plate is provided with a position-limiting portion for cooperating with a position-limiting member on the process door to limit the relative position of the mounting plate and the process door.

9. The temperature detecting device according to claim 8, wherein one of the position-limiting portion and the position-limiting member is a position-limiting pin, and the other is a position-limiting hole.

10. A semiconductor thermal processing apparatus, comprising:

a process tube;

the process door is arranged at the pipe orifice of the process pipe;

a temperature sensing device as claimed in any one of claims 1 to 9 mountable on the process door.

Technical Field

The application relates to the field of semiconductor processing equipment, in particular to a temperature detection device and semiconductor heat treatment equipment.

Background

Semiconductor thermal processing (e.g., vertical furnace equipment, horizontal furnace equipment) is a widely used equipment in the field of integrated circuits. In order to confirm that the temperature data of each temperature zone in the process tube of the semiconductor heat treatment equipment meets the process requirements, the process tube needs to be subjected to temperature pulling, and the temperature data of each temperature zone in the process tube is collected. The temperature-pulling device commonly used at present is a device placed outside a machine table. The device comprises a rod-shaped temperature detection part, a temperature measurement heat sensor (thermo) is arranged on the rod-shaped temperature detection part, and the temperature detection part can move in the process pipe along the axial direction of the process pipe to measure the temperature of each temperature zone.

The temperature detection piece comprises an outer sleeve, a single thermocouple is inserted into the outer sleeve, and the measuring end of the single thermocouple is positioned at the top end of the outer sleeve. Before temperature is raised, the outer sleeve pipe with single thermocouple is inserted from the bottom to near the top of the technological pipe and then moved from top to bottom to complete the temperature measurement of the technological pipe from top to bottom.

Fig. 1 shows a conventional temperature-raising device. The device includes a thermal device base 401, a linear module 402, an extension arm 403, and a thermal sensor mounting hole 404. The end of the temperature detecting member 300 is fixed to the thermal sensor mounting hole 404, and the signal cable 405 of the temperature detecting member 300 is connected to the measurement and control module inside the base 401. As shown in fig. 2, the temperature sensing member 300 enters the process tube 100 from the guide opening 202 of the process door 200 through the flange 201 of the process door 200. After the temperature detecting element 300 is aligned with the opening of the guiding opening 202, the linear module 402 in fig. 1 is activated. The linear module 402 drives the extension arm 403 and the thermal sensor mounting hole 404 to move vertically, and finally drives the temperature detecting member 300 into the process tube 100 for temperature measurement.

The disadvantages of the prior art include: first, the conventional temperature raising apparatus is inconvenient to use, and before performing the temperature raising operation, the temperature raising apparatus needs to be moved to a corresponding position of the semiconductor thermal processing equipment, and then the relative position and the perpendicularity of the temperature detection member 300 to the process door 200 are adjusted to ensure that the temperature detection member 300 can be aligned with the guide opening 202 and maintain the perpendicular state. This adjustment is complicated, and includes the following specific tasks: the position adjustment of the base 401, the levelness adjustment of the base 401, the height adjustment of the extension arm 403, the level adjustment of the extension arm 403, the position adjustment of the thermal sensor mounting hole 404, and the like, have many operation steps, are complicated to operate, consume a long time, and have large manual operation errors. If the inclination of the temperature detection piece 300 is too large, temperature pulling data distortion and scratch of a temperature measurement heat sensor can be caused, and even the process tube can be damaged.

Secondly, the current device that draws temperature can appear unstable condition in the use. The extension arm 403 of the temperature-pulling device is relatively large in size due to the structure of the process tube itself. In the process that the linear module 402 drives the extension arm to move, the temperature detection member 300 may shake or tilt, which may result in failure of temperature measurement.

It is urgently needed to provide a temperature detection device with simple adjustment mode and convenient use so as to improve the working efficiency of temperature pulling operation and the temperature measurement accuracy.

Disclosure of Invention

In view of this, the present application provides a temperature detection device and a semiconductor heat treatment apparatus, which do not need to perform excessive adjustment on the assembly of the temperature detection device, can realize simple temperature pulling operation, and improve the working efficiency of the temperature pulling operation and the accuracy of temperature measurement.

The application provides a temperature detection device for semiconductor heat treatment equipment, including: the temperature detection piece is rod-shaped, and one end of the temperature detection piece is provided with a temperature measurement heat sensor; the mounting plate is detachably connected with a process door of the semiconductor heat treatment equipment; the drive division, assemble in mounting panel surface, the drive division includes driving source and spacing subassembly, wherein: the limiting assembly clamps the temperature detection piece, and the length direction of the temperature detection piece is parallel to the surface of the mounting plate; the driving source is connected to the limiting assembly and used for driving the limiting assembly to move so as to drive the temperature detection piece to move along the length direction of the temperature detection piece, and one end, provided with the temperature measurement heat sensor, of the temperature detection piece extends into a process pipe of the semiconductor heat treatment equipment through a through hole in the process door.

Optionally, the limiting assembly includes: a first clamping member connected to the driving source and including at least two driving rollers; the second clamping piece comprises at least two driven rotating wheels, the number of the driving rotating wheels is the same as that of the driven rotating wheels, the driving rotating wheels and the driven rotating wheels are arranged oppositely in a one-to-one correspondence mode, and the temperature detection piece is clamped between the driving rotating wheels and the driven rotating wheels; the driving rotating wheel can rotate under the driving of the driving source, so that the temperature detection piece is driven to move along the length direction of the temperature detection piece.

Optionally, the initiative runner includes initiative runner body and initiative pivot, the initiative pivot rotationally assemble in the mounting panel surface, and perpendicular to the mounting panel surface, the initiative runner body assemble in the initiative pivot, just the initiative runner body can follow when the initiative pivot rotates.

Optionally, the driving source includes: a motor; the motor mounting frame is arranged on the surface of the mounting plate and used for assembling the motor; the synchronous belt wheel is sleeved on the output shaft of the motor and used for rotating along with the output shaft of the motor; the synchronous belt is in transmission connection with the synchronous belt wheel and the driving rotating shaft, so that the synchronous belt wheel can drive the driving rotating shaft to rotate.

Optionally, the driving rotating wheel is assembled on a part of the driving rotating shaft away from the mounting plate, and the synchronous belt is connected to a part of the driving rotating shaft close to the mounting plate in a transmission manner; the second clamping piece further comprises a mounting rack which is assembled on the surface of the mounting plate; the driven rotating wheel comprises a driven rotating wheel body and a driven rotating shaft, the driven rotating shaft is rotatably assembled on the mounting frame and is perpendicular to the surface of the mounting plate, and the driven rotating wheel is assembled on the driven rotating shaft; the side of initiative runner body with the driven runner body all is provided with the centre gripping groove, the centre gripping groove of initiative runner body with the driven runner body sets up relatively to be located the coplanar, temperature detect spare centre gripping in the centre gripping inslot.

Optionally, one end of the mounting bracket is rotatably assembled on the surface of the mounting plate, and the other end of the mounting bracket is provided with an adjusting piece for driving the mounting bracket to rotate so that the driven runner is close to or far away from the driving runner.

Optionally, the adjusting member includes: the rod piece is arranged in parallel to the surface of the mounting plate and penetrates through the mounting frame, a limiting end head is arranged at the first end of the rod piece, and threads are arranged on the outer surface of the second end of the rod piece; the fixing block is arranged on the mounting plate, a threaded hole is formed in the fixing block, and the second end of the rod piece penetrates through the mounting frame and is in threaded connection with the fixing block; the elastic piece is sleeved on the rod piece and positioned between the first end of the rod piece and the mounting frame; and the pressing plate is arranged between the elastic piece and the mounting frame and used for transmitting the acting force applied by the elastic piece to the pressing plate to the mounting frame.

Optionally, the mounting plate is provided with a limiting portion for matching with the limiting member on the process door, so as to limit the relative position of the mounting plate and the process door.

Optionally, one of the limiting portion and the limiting member is a limiting pin, and the other is a limiting hole.

The present application also provides a semiconductor thermal processing apparatus, comprising:

a process tube;

the process door is arranged at the pipe orifice of the process pipe;

the temperature detection device can be installed on the process door.

In the temperature detection device and the semiconductor heat treatment apparatus of the present application, a main structure of the temperature detection device includes a mounting plate and the driving portion. The mounting plate may be directly mounted to a process door of the semiconductor thermal processing apparatus. Therefore, the temperature detection device can be assembled to the semiconductor heat treatment equipment by installing the mounting plate, the assembly is very simple, the adjusting step of the temperature measurement heat sensor is omitted, and the working efficiency is improved.

And, because the driving part is provided, and the driving part comprises a limiting component and a driving source, and the temperature detection piece is clamped by the limiting component, the possibility of shaking of the temperature detection piece when moving along the length direction of the temperature detection piece can be reduced as long as the clamping force provided by the limiting component keeps the stability of the temperature measurement heat sensor in the direction vertical to the length direction of the temperature detection piece after the temperature detection device is assembled to the semiconductor heat treatment equipment.

And after the temperature detection device is assembled to the semiconductor heat treatment equipment, a temperature measurement heat sensor arranged at one end of the temperature detection device can move along with the movement of the temperature detection device, and the movement direction of the temperature measurement heat sensor passes through a guide opening of a process door of the semiconductor heat treatment equipment and is parallel to the length direction of the semiconductor heat treatment equipment. Therefore, the temperature measuring heat sensor can realize the measurement of the temperature of each part in the semiconductor heat treatment equipment on the premise of not contacting the inner wall of the semiconductor heat treatment equipment, and the probability that the temperature measuring heat sensor scratches the inner wall of the semiconductor heat treatment equipment when the temperature measuring heat sensor is in the semiconductor heat treatment equipment is reduced.

Therefore, the temperature detection device has the characteristics of small size, convenience in installation, convenience in positioning, reliability in working process and accuracy in temperature-pulling data, and can effectively improve the temperature-pulling working efficiency and the temperature-pulling accuracy.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic drawing showing a temperature rise of a semiconductor heat treatment apparatus in the prior art.

Fig. 2 is a partially enlarged schematic view of a semiconductor heat treatment apparatus according to the prior art when performing a pulling-up process.

Fig. 3 is a schematic structural view of the temperature detection device according to an embodiment of the present application when the temperature detection device is assembled to a semiconductor thermal processing apparatus.

Fig. 4 is a schematic view illustrating a connection relationship when the temperature detection device is assembled to a semiconductor thermal processing apparatus according to an embodiment of the present application.

Fig. 5 is a schematic structural view of the temperature detection device according to an embodiment of the present application when the temperature detection device is assembled to a semiconductor thermal processing apparatus.

Fig. 6 is a schematic structural diagram of the temperature detection device according to an embodiment of the present application.

Fig. 7 is another schematic structural diagram of the temperature detection device according to an embodiment of the present application.

Detailed Description

The temperature detection device (or referred to as a temperature raising device) and the semiconductor heat treatment apparatus according to the present invention will be further described below with reference to the drawings and examples.

Fig. 3 is a schematic structural diagram illustrating a temperature detecting device 500 assembled in a semiconductor thermal processing apparatus according to an embodiment of the present disclosure.

In this embodiment, the temperature detecting apparatus 500 includes a temperature detecting member 300, the temperature detecting member 300 has a rod shape, one end of the temperature detecting member 300 is provided with a temperature measuring heat sensor, and the end of the temperature detecting member 300 provided with the temperature measuring heat sensor can be inserted into the process tube 100 of the semiconductor heat treatment equipment, and the temperature measurement of the process tube 100 is realized by the temperature measuring heat sensor.

The semiconductor heat treatment equipment can be vertical furnace equipment or horizontal furnace equipment, and actually can also be other semiconductor heat treatment equipment with similar structure and function, and the invention is not limited.

The temperature measuring thermal sensor may be a thermal resistance type temperature measuring sensor, a thermocouple type temperature measuring sensor, or other sensors capable of achieving similar functions, which is not limited in the present invention. The temperature measuring thermal sensor provided at one end of the temperature sensing member 300 can also follow the movement of the temperature sensing member 300 when the temperature sensing member 300 is pulled.

In the embodiment shown in fig. 3, a thermocouple temperature sensor is used as the temperature measuring thermal sensor. The thermocouple type temperature measuring sensor can directly measure the temperature and convert the temperature signal into a thermal electromotive force signal. The thermocouple type temperature sensor usually consists of a thermode, an insulating sleeve protection tube, a junction box and other main parts, and is usually matched with a display instrument, a recording instrument and an electronic regulator for use.

In this embodiment, the thermocouple type temperature sensor includes at least one of an S-type thermocouple, a K-type thermocouple, a T-type thermocouple, and the like, and those skilled in the art can select the specific model of the thermocouple type temperature sensor according to the actual needs and the characteristics of each type of thermocouple.

The temperature detection device 500 further includes: and a mounting plate 501, wherein the mounting plate 501 is detachably connected with the process door 200 of the semiconductor heat treatment equipment.

When the temperature sensing device 500 is assembled to the process door 200 of the semiconductor thermal processing apparatus using the mounting plate 501, the temperature of the process tube can be measured by driving the rod-shaped temperature sensing member 300 in the longitudinal direction thereof without configuring the linear module 402 and the extension arm 403 shown in fig. 1 to adjust the position of the temperature sensing member 300.

The mounting plate 501 may be made of rigid materials such as ceramic, plastic, metal, etc., and the material for preparing the mounting plate 501 needs to have a higher melting point, so that the probability that the mounting plate 501 is melted and deformed by the high temperature in the process pipe when the temperature detection apparatus 500 is applied to the semiconductor heat treatment equipment is reduced.

Fig. 4 is a schematic diagram illustrating a connection relationship between a temperature detecting device 500 and a semiconductor thermal processing apparatus according to an embodiment of the present invention.

In this embodiment, the mounting plate 501 is provided with a position limiting portion for cooperating with a position limiting member on the process door 200 to limit the relative position of the mounting plate 501 and the process door 200. Optionally, the limiting part includes a limiting hole 602, and the limiting member includes a limiting pin 204; alternatively, the limiting part comprises a limiting pin 204 and the limiting part comprises a limiting hole 602.

The restraint apertures 602 may be used in conjunction with the restraint pins 204. When the mounting plate 501 is assembled, the limit hole 602 is aligned with the limit pin 204 disposed at the target position, so that the assembly position of the mounting plate 501 is fixed. In some embodiments, more than two stop holes 602 may be provided to better fix the position of the mounting plate 501 in cooperation with more than two stop pins 204 provided at the target location.

In the embodiment shown in fig. 3, 4 and 5, the mounting plate 501 is provided with a limiting hole 602, the process door 200 of the semiconductor thermal processing apparatus is provided with a limiting pin 204, the limiting pin 204 may be a cylindrical pin, a conical pin, a diamond pin, etc., and a person skilled in the art may set the specific structure of the limiting pin 204 as required.

The installation of the mounting plate 501 at a predetermined position can be ensured by the guidance of the limit pin 204, and the position adjustment at a later stage is not needed. After the limiting hole 602 provided on the mounting plate 501 is assembled on the limiting pin 204, the mounting plate 501 can be fixed to the process door 200 by the screw 502, and the temperature detection device 500 is mounted. This assembly may simplify the assembly of the temperature sensing device 500.

As shown in fig. 4 and 6, the mounting plate 501 is provided with screw holes 601, and screw holes are provided at positions corresponding to the process door 200. The screw 502 is connected to a threaded hole in the process door through a screw hole 601 provided in the mounting plate 501. The screws, screw holes 601 and threaded holes described above may also actually serve to define the relative position of the process door 200 and the mounting plate 501.

As shown in fig. 4 and 6, the limiting hole 602 and the screw hole 601 penetrate the mounting plate 501 in a direction perpendicular to the surface of the mounting plate 501 and are disposed along the same side of the mounting plate 501.

In the embodiment shown in fig. 4 and 6, the number of the limiting holes 602 is one, and the limiting holes 602 are located at the center of one side edge of the mounting plate 501. The number of the screw holes 601 is two, and is provided on both sides of the position limiting hole 602 to fix the mounting plate 501 to the target position from both sides of the position limiting hole 602.

In fact, the number of screw holes 601 may be set as needed. For example, the number of screw holes 601 may be set to two or more to enhance stability when the mounting plate 501 is fitted to a target position; or only one screw hole 601 is arranged to reduce the assembly difficulty of the mounting plate 501. When a plurality of screw holes 601 are provided, the distribution positions of the respective screw holes 601 may be set as needed.

In the embodiment shown in fig. 3 to 5, the process door 200 comprises a process door flange 201 and a fixing plate 203, the process pipe 100 is mounted in an annular groove of the process door flange 201, the fixing plate 203 may be a triangular plate or the like, and the fixing plate 203 is located on a side of the process door flange 201 away from the process pipe 100, and the fixing plate 203 and the limiting pin 204 and the threaded hole may be provided on the fixing plate 203.

In a preferred embodiment, the temperature detecting device 500 may further include a hanging plate 604, wherein the hanging plate 604 is disposed along one side of the mounting plate 501, and is disposed on the same side of the mounting plate 501 as the limiting hole 602 and the screw hole 601.

Hanging plate 604 is perpendicular to the surface of mounting plate 501. When the temperature detection device 500 is mounted on the fixed plate 203, the mounting plate 501 may be hung on the fixed plate 203 by a hanging plate 604. The hanging plate 604 is hung on the surface of the fixing plate 203, and the mounting plate 501 is arranged close to the side edge of the fixing plate 203. The hanging plate 604 is arranged, so that the installation is convenient, the firmness degree of the installation plate 501 after being installed in place can be increased, and the possibility of change of the relative position of the installation plate 501 is reduced.

In the embodiment shown in fig. 3 to 5, the hanging plate 604 is integrally formed with the mounting plate 501 and is formed by plastic or metal casting. Peg board 604 is sized to facilitate hanging peg board 604 onto the surface of fixed plate 203 and to facilitate removal of peg board 604 from the surface of fixed plate 203.

In some embodiments, only the hanging plate 604 and the screw hole 601, only the limiting hole 602 and the screw hole 601, or the hanging plate 604, the limiting pin 204, and the screw hole 601 may be provided, the specific structure of the limiting portion may be set as required, the combination of the limiting portion and the hanging plate may also be set as required, and the combination manner in the above embodiments is not limited.

The temperature detecting device 500 further includes a driving portion, the driving portion is assembled on the surface of the mounting plate 501, and the driving portion includes a driving source and a limiting component 603.

The driving source is connected to the limiting component 603 for driving the limiting component 603 to move, so as to drive the temperature detecting component 300 to move along the length direction thereof, so that the end of the temperature detecting component 300 provided with the temperature measuring thermal sensor extends into the process tube 100 through the guiding hole 202 on the process door 200.

In the embodiment shown in fig. 3 to 5, the temperature measuring heat sensor follows the movement of the temperature detecting member 300, and the movement direction of the temperature detecting member 300 is parallel to the length direction of the temperature detecting member 300. After the temperature detecting device 500 is assembled to the target position, the length direction of the temperature detecting member 300 is parallel to the length direction of the process tube 100, and the temperature measuring heat sensor can move back and forth along the length direction of the process tube 100 under the driving of the driving source to measure the temperature of all places inside the process tube 100.

Fig. 6 is a schematic structural diagram of a temperature detection device 500 according to an embodiment of the present disclosure.

In this embodiment, the limiting member 603 clamps the temperature detection member 300, and the length direction of the temperature detection member 300 is parallel to the surface of the mounting plate 501, so as to prevent the temperature detection member 300 from colliding with the surface of the mounting plate 501 during the movement of the temperature detection member 300 along the length direction thereof.

The moving direction of the temperature detecting member 300 is the temperature pulling direction of the temperature detecting device 500. Because the temperature detection piece 300 can move back and forth along the length direction of the temperature detection piece 300, and the length direction of the temperature detection piece 300 is the same as the length direction of the process pipe 100, the movement direction of the temperature detection piece 300 is along the length direction of the process pipe 100, and the clamping of the limiting component 603 reduces the possibility of scratch and collision between the temperature detection piece 300 and the process pipe 100 in the temperature pulling process, thereby reducing the possibility of damage of the process pipe 100 or damage of the temperature detection piece 300, and improving the durability of the temperature detection device 500.

In the embodiment shown in fig. 6, the position limiting assembly 603 comprises: comprises a first clamping piece 513 and a second clamping piece 504. The second clamping member 504 is disposed opposite to the first clamping member 513 to form a clamping area, and the temperature detecting member 300 is clamped in the clamping area.

As shown in fig. 3-6, the first clamping member 513 is connected to a drive source that includes at least two drive rollers 5031. The second clamping member 504 includes at least two follower rollers 5032. The number of the driving rollers 5031 is the same as that of the driven rollers 5032, and the temperature detecting members 300 are disposed opposite to each other in a one-to-one correspondence manner, and the clamping forces provided by the first clamping member 513 and the second clamping member 504 for the temperature detecting members 300 are equal in magnitude and opposite in direction, which is beneficial to reducing the possibility of the temperature detecting members 300 tilting.

The larger the number of the driving pulleys 5031 and the driven pulleys 5032, the larger the clamping force provided to the temperature detecting member 300, the more stable the clamping of the temperature detecting member 300, and the lower the possibility of the roll of the temperature detecting member 300.

The temperature detecting member 300 is disposed between the opposite side surfaces of the driving rollers 5031 and the driven rollers 5032, and is held between the side surfaces of the driving rollers 5031 and the driven rollers 5032. The side surfaces of the driving rollers 5031 and the driven rollers 5032 are each sufficiently large to make sufficient contact with the temperature sensing member 300. The contact area of the temperature detection member 300 with the driving pulley 5031 and the driven pulley 5032 is related to the friction force received by the temperature detection member 300 when the temperature detection member is moving or at rest, and the larger the contact area is, the larger the friction force is. The friction force can prevent the temperature detecting member 300 from being undesirably displaced when the temperature detecting member 300 is moved or is stationary, so that the movement of the temperature detecting member 300 is more smooth, thereby reducing the possibility of the temperature measuring heat sensor provided at one end of the temperature detecting member 300 from being undesirably displaced.

All the active rollers 5031 in the first clamping member 513 are arranged on the same straight line, and after the temperature detecting member 300 is assembled on the limiting component 603, the length direction of the temperature detecting member 300 is parallel to the straight line, so that all the active rollers 5031 in the first clamping member 513 can contact with the temperature detecting member 300, provide clamping force and friction force for the temperature detecting member 300, and prevent component force in other directions generated by the clamping force when the temperature detecting member 300 is clamped, so that the length direction of the temperature detecting member 300 does not conform to the preset target movement direction.

The driving pulley 5031 is driven by a driving source to rotate, so as to drive the temperature detecting member 300 to move along the length direction thereof, and drive the temperature measuring thermal sensor disposed at one end of the temperature detecting member 300 to move along the length direction of the temperature detecting member 300, so as to complete a temperature pulling operation in a target direction.

The driving pulley 5031 comprises a driving pulley body and a driving shaft 5121, wherein the driving shaft 5121 is rotatably assembled on the surface of the mounting plate 501 and perpendicular to the surface of the mounting plate 501, the driving pulley body is assembled on the driving shaft 5121, and the driving shaft 5121 passes through the axis of the driving pulley body. The driving rotating shaft 5121 rotates when driven by the driving source, and the driving rotating wheel body can rotate along with the driving rotating shaft 5121 when the driving rotating shaft 5121 rotates.

The follower wheel 5032 comprises a follower wheel body and a follower spindle 5122, wherein the follower spindle 5122 is rotatably assembled on the surface of the mounting plate 501 and is perpendicular to the surface of the mounting plate 501, the follower wheel body is assembled on the follower spindle 5122, the follower wheel body can rotate along with the follower spindle 5122 when the follower spindle 5122 rotates, and the follower spindle 5122 passes through the axis of the follower wheel body.

When the driving pulley 5031 rotates following the driving of the driving source, the driven pulley 5032 can rotate following the friction force between the driven pulley 5032 and the temperature detection member 300 in the opposite direction to the rotation direction of the driving pulley 5031, so that the temperature detection member 300 moves forward or backward in the longitudinal direction thereof.

In a preferred embodiment, the driving source includes a motor 505, a motor mounting block 509, a timing pulley 510, and a timing belt.

The motor 505 mainly functions to generate a driving torque as a power source for electric appliances or various machines. One skilled in the art can select the type of motor 505 needed as desired.

A motor mount 509 is mounted to the surface of the mounting plate 501, and a motor 505 is mounted to the motor mount 509, with an output shaft of the motor 505 passing through the surface of the motor mount 509 and having a section located between the motor mount 509 and the mounting plate 501.

The synchronous pulley 510 is sleeved on the output shaft of the motor 505 and is used for rotating along with the output shaft of the motor 505.

The synchronous belt drive is connected to the synchronous pulley 510 and the driving shaft 5121, so that the synchronous pulley 510 can drive the driving shaft 5121 to rotate. Specifically, the timing belt 511 is sleeved on the surfaces of the timing pulley 510 and the driving spindle 5121, and is used for transmitting the rotation of the timing pulley 510 to the driving spindle 5121, so as to drive the driving pulley 5031 to rotate.

In some embodiments, when the first clamping member 513 includes a plurality of driving rollers 5031, since the driving shafts 5121 of the driving rollers 5031 are arranged on the same straight line, the timing belt may be in driving contact with the surfaces of all the driving shafts 5121 to drive all the driving shafts 5121 to rotate.

In some embodiments, the surface of the synchronous pulley 510 is provided with a tooth groove, the driving pulley body is assembled on a portion of the driving rotating shaft 5121 away from the mounting plate 501, the synchronous belt drive is connected to a portion of the driving rotating shaft 5121 close to the mounting plate 501, and a portion of the driving rotating shaft 5121 close to the mounting plate 501 is sleeved with the synchronous gear 707. The surface of the synchronous belt 511 is provided with belt teeth which are matched with a synchronous belt wheel 510 with a tooth groove and a synchronous gear 707 to realize the transmission of the motor 505. Under the drive of the synchronous belt 511, the driving rotary shaft 5121 rotates in the same direction along with the synchronous pulley 510.

In some embodiments, the base of the timing belt 511 may be made of polyurethane or neoprene. The strong layer of the synchronous belt 511 for bearing load can be formed by die-casting steel wires and glass fiber materials with small elongation, the elongation is very small under the action of working tension and variable stress, the pitch of the synchronous belt 511 can be kept unchanged, teeth and synchronous gear tooth grooves are correctly meshed without losing steps, synchronous transmission without slip is realized, an accurate transmission ratio is obtained, the transmission efficiency is up to 98%, the transmission is stable, and the buffer and vibration reduction effects are achieved.

In fact, the specific structures of the synchronous pulley 510 and the synchronous belt 511 can be set according to the needs, and are not limited by the above description.

The second clamping member 504 further includes a mounting bracket 507, the mounting bracket 507 is mounted on the surface of the mounting plate 501, and the driven rotary shaft 5122 is rotatably mounted on the mounting bracket 507.

The side of initiative runner body and driven runner body all is provided with the centre gripping groove, and the centre gripping groove of initiative runner body and driven runner body sets up relatively to be located the coplanar, temperature detect spare 300 centre gripping in the centre gripping inslot.

After the second clamping member 504 is mounted on the mounting bracket 507, the height of the driven wheel 5032 relative to the upper surface of the mounting plate 501 is the same as the height of the driving wheel 5031 relative to the upper surface of the mounting plate 501, so that the clamping grooves formed on the side surfaces of the driving wheel body and the driven wheel body can be arranged oppositely and located on the same plane, so as to clamp the temperature detecting member 300 stably.

One end of the mounting bracket 507 is rotatably mounted on the surface of the mounting plate 501, and the other end of the mounting bracket 507 is provided with an adjusting member for driving the mounting bracket 507 to rotate so as to enable the driven turning wheel 5032 to approach or depart from the driving turning wheel 5031, so that the size of a clamping area formed between the first clamping member 513 and the second clamping member 504 can be changed, thereby adapting to clamping temperature detecting members 300 with different sizes and increasing the applicable scenes of the temperature detecting device 500.

In some embodiments, the mounting bracket 507 is provided with a rotating shaft 508 at one end and an adjusting member at the other end. By using an adjustment member to enable the mounting 507 to rotate about the rotation axis 508, the position of the other end of the mounting 507 is changed, thereby changing the position of the driven wheel 5032 mounted on the mounting 507, and the second clamping member 504 is moved towards the first clamping member 513 to reduce the size of the clamping area in the first direction; or away from the first clamping member 513 to increase the size of the clamping area in a first direction that is perpendicular to the length direction of the temperature sensing member 300.

Referring to fig. 7, fig. 7 is a schematic view illustrating another structure of the temperature detecting device 500 according to an embodiment of the present disclosure.

In this embodiment, the adjusting member 506 includes a rod 705, a fixing block 702, an elastic member 704, and a pressing plate 703.

The rod 705 is arranged in parallel to the surface of the mounting plate 501 and penetrates through the mounting frame 507, a limiting end 701 is arranged at the first end of the rod, and the size of the limiting end 701 at least in the direction perpendicular to the length direction of the rod 705 is larger than that of the rod 705, so that a certain limiting effect is achieved.

The outer surface of the second end of rod 705 is provided with threads, and the second end of rod 705 can be fitted into some threaded structure. In the embodiment shown in fig. 6 and 7, the second end of the mounting bracket 507 includes an opening structure 706, and the rod 705 can pass through the opening structure 706.

The mounting panel 501 is located to fixed block 702, is provided with the screw hole on the fixed block 702, and the screw hole matches with the screw thread that rod 705 second end set up, and rod 705's second end passes mounting bracket 507 and fixed block threaded connection. In some embodiments, the threaded hole extends through the mounting block 702, and the operator can screw the rod 705 through the mounting block 702 to increase the range of adjustment of the adjustment member 506 to the position of the mounting bracket 507.

The elastic member 704 is sleeved on the rod 705 and located between the first end of the rod and the mounting frame 507. The elastic member 704 is always in a compressed state, and the elastic direction is the length direction of the rod 705 to apply force to the mounting frame 507. The elastic member 704 includes at least a spring.

The pressing plate 703 is disposed between the elastic member 704 and the mounting member 507, the elastic member 704 applies a force to the pressing plate 703, the pressing plate 703 transmits the force applied to the pressing plate 703 by the elastic member to the mounting bracket 507, and drives the second end of the mounting bracket 507 to rotate around the first end of the mounting bracket 507, so as to adjust the relative position between the mounting bracket 507 and the first clamping member 513.

When the operator tightens the rod 705 into the threaded hole, the mounting bracket 507 is driven to rotate slightly around the rotating shaft 508 at the first end of the mounting bracket 507, so as to shorten the length of the elastic member 704, increase the elastic force of the elastic member 704, and increase the acting force exerted by the elastic member 704 on the mounting bracket 507, which is finally transmitted to the clamping force of the first clamping member 513 and the second clamping member 504 on the temperature detection member 300.

When the operator does not tighten the rod 705, the elastic member 704 is always in a compressed state, so that the elastic member 704 can still apply force to the mounting frame 507 through the pressing plate 703, the temperature detection member 300 is clamped, and stability and reliability of clamping are improved.

The rod 705, the fixing block 702 and the pressing plate 703 may be made of suitable materials as required. For example, at least one of ceramics, metals, plastics, and the like may be selected to prepare the rod 705, the fixing block 702, and the pressing plate 703. It should be noted that the material of the rod 705, the fixing block 702 and the pressing plate 703 is at least rigid to prevent deformation when the mounting bracket 507 is adjusted.

Since the position of the driving rollers 5031 of the first clamping member 513 is fixed relative to the upper surface of the mounting plate 501 and the size of the clamping area is changed by changing the position of the driven rollers 5032 of the second clamping member 504, the size of the clamping area is always controllable, the temperature detection member 300 can be kept in close contact with the groove wall of the clamping groove provided by the driving rollers 5031 of the first clamping member 513 during operation, and even if the temperature detection member 300 is subjected to an external force, lateral movement, shaking or tilting is unlikely to occur.

Moreover, since the size of the clamping area can be changed by changing the position of the driven rotating wheel 5032 of the second clamping member 504, even if the size of the temperature detection member 300 deviates from the size of the clamping area formed in the limiting component 603, the position of the driven rotating wheel 5032 of the second clamping member 504 can be adjusted according to the actual size of the temperature detection member 300, so as to adjust the size of the clamping force provided by the first clamping member 513 and the second clamping member 504 for the temperature detection member 300, provide elastic clamping for the temperature detection members 300 of different sizes, reduce the probability that the temperature detection member 300 is damaged by an excessive clamping force, reduce the probability that the temperature detection member 300 is damaged by being clamped by an excessively small clamping force, reduce the probability that the temperature detection member 300 falls and is damaged, and enhance the reliability of clamping.

When the temperature detecting member 300 is driven by the driving unit to move, the temperature detecting member 300 passes through the guide opening 202 and enters the process tube 100. The clamping force of the first clamping member 513 and the second clamping member 504 on the temperature detection member 300 can be adjusted by the adjusting member 506.

The motor 505 drives the driving spindle 5121 to rotate in the same direction as the output shaft of the motor 505, so as to drive the driving wheel 5031 to rotate in the same direction as the output shaft of the motor 505, and further drive the temperature detecting member 300 to move along the length direction thereof. Under the action of the friction force, the driven pulley 5032 rotates in the opposite direction to the output shaft of the motor 505.

Under the clamping action of the first clamping member 513 and the second clamping member 504, the degree of freedom of the temperature detection member 300 in the direction perpendicular to the length direction thereof is strictly limited, and the temperature detection member 300 can only move along the length direction thereof, so that the probability of shaking and tilting of the temperature detection member 300 is greatly reduced.

The embodiment of the application also provides semiconductor heat treatment equipment.

Referring to fig. 5, a schematic structural diagram of a temperature detection apparatus 500 assembled in a semiconductor thermal processing apparatus according to an embodiment is shown.

In this embodiment, the temperature sensing device 500 is installed on the process door 200 of the process tube 100 of the semiconductor heat treatment apparatus, as shown in fig. 4, the process door 200 includes a process door flange 201, and the process tube 100 is installed in an annular groove of the process door flange 201. The temperature detecting member 300 passes through the guide opening 202 of the process door 200, and a temperature measuring thermal sensor provided at one end thereof is inserted into the process tube. The power supply line and the signal line of the temperature measuring heat sensor are led out and then connected with the measurement and control module 600.

Referring to fig. 3 to 7, in the embodiment, the semiconductor thermal processing apparatus includes a process tube 100 and a process gate 200. The process door 200 is disposed at the mouth of the process tube 100.

The mounting plate 501 of the temperature detecting device 500 can be assembled on the process door 200 of the process pipe 100, the end of the temperature detecting member 300 provided with the temperature measuring thermal sensor is arranged towards the guide port 202 on the process door flange 201, and the temperature detecting member 300 can extend into or out of the process pipe 100 when moving along the length direction of the temperature detecting member 300, so that the possibility that the temperature detecting member 300 and the temperature measuring thermal sensor arranged at one end of the temperature detecting member 300 collide with the inner wall of the process pipe 100 is reduced.

The process door 200 further comprises a mounting plate 203, wherein the mounting plate 203 may be a triangular plate, and the mounting plate 203 is located on a side of the process door flange 201 away from the process tube 100, and the mounting plate 203 and the process door flange are arranged substantially in parallel, and the above-mentioned spacer pins 204 and threaded holes may be provided on the mounting plate 203. The guiding opening 202 is exposed out of the fixing plate 203, and a limiting pin 204 is disposed on a sidewall surface of the fixing plate 203.

The temperature detecting device 500 includes a hanging plate 604, and the hanging plate 604 is disposed along one side of the mounting plate 501 and perpendicular to the surface of the mounting plate 501. The mounting plate 501 may be hung to the upper surface of the fixed plate 203 by a hanging plate 604, the upper surface of the fixed plate 203 facing the process tube 100. In some embodiments, mounting plate 501 is also assembled to fixing plate 203 through a stop.

The main structure of the temperature detection device 500 provided by the embodiment of the present application only includes the mounting plate 501 and the driving portion, and the structure is simple.

And, the mounting plate 501 can be directly mounted to the process door 200 of the semiconductor heat treatment apparatus, so that the temperature sensing device 500 can be assembled to the semiconductor heat treatment apparatus by mounting the mounting plate 501, the assembly is very simple, the adjustment step of the temperature sensing member 300 is omitted, and the working efficiency is improved.

Moreover, since the driving part is provided and comprises the limiting component and the driving source, and the temperature detection piece 300 is clamped by the limiting component, the possibility of shaking of the temperature detection piece 300 during movement along the length direction can be reduced as long as the clamping force provided by the limiting component keeps the stability of the temperature measurement heat sensor in the length direction perpendicular to the temperature detection piece 300 after the temperature detection device 500 is assembled to the semiconductor heat treatment equipment.

Moreover, after the temperature detection device 500 is assembled on the semiconductor heat treatment equipment, the temperature measurement thermal sensor arranged at one end of the temperature detection piece 300 can move along with the movement of the temperature detection piece 300, and the movement direction of the temperature detection piece 300 and the temperature measurement thermal sensor arranged at one end of the temperature detection piece is parallel to the length direction of the process tube 100, so that the temperature at each position in the process tube 100 can be measured on the premise of not contacting the inner wall of the process tube 100, and the probability that the temperature detection piece 300 and the temperature measurement thermal sensor arranged at one end of the temperature detection piece rub against the inner wall of the process tube 100 when the temperature detection piece 300 and the temperature measurement thermal sensor arranged at one end of the temperature detection piece are in the process tube 100 is reduced.

Therefore, the temperature detection device 500 has the characteristics of small size, convenience in installation, convenience in positioning, reliability in working process and accuracy in temperature-pulling data, and can effectively improve the temperature-pulling working efficiency and the temperature-pulling accuracy.

The above-mentioned embodiments are only examples of the present application, and not intended to limit the scope of the present application, and all equivalent structures or equivalent flow transformations made by the contents of the specification and the drawings, such as the combination of technical features between the embodiments and the direct or indirect application to other related technical fields, are also included in the scope of the present application.