阅读说明：本技术 能够实现单个探针块自动精密控制的阵列测试装置 (Array testing device capable of realizing automatic precise control of single probe block ) 是由 金昌奎 李艺瑟 于 2021-05-14 设计创作，主要内容包括：本发明的能够实现单个探针块自动精密控制的阵列图案测试装置通过探针块的单个控制来检测受检对象基板的图案是否不合格,可包括：底部,包括桁架；基板放置部,配置在底部的上部,用于在上表面放置受检对象并移动基板；以及探针龙门架,配置在基板放置部的一侧,通过与借助上述基板放置部进行移动的受检对象基板的至少一部分相接触,来测定基板的电特性。(The array pattern testing apparatus capable of realizing automatic precise control of a single probe block according to the present invention detects whether a pattern of a substrate to be inspected is unqualified by single control of the probe block, and may include: a bottom including a truss; a substrate placing section disposed above the bottom section, for placing the object to be inspected on the upper surface and moving the substrate; and a probe gantry which is arranged on one side of the substrate placing part and is contacted with at least one part of the detected substrate moved by the substrate placing part to measure the electrical characteristics of the substrate.)

1. An array pattern testing apparatus capable of realizing automatic precise control of a single probe block, which detects whether a pattern of a substrate to be inspected is unqualified or not by precisely controlling the probe block, comprising:

a bottom including a truss;

a substrate placing section disposed above the bottom section, for placing an object to be inspected on an upper surface thereof and moving a substrate; and

and a probe gantry which is arranged on one side of the substrate placing part and is contacted with at least one part of the detected substrate moved by the substrate placing part to measure the electrical characteristics of the substrate.

2. The apparatus for testing an array pattern capable of performing automatic fine control of a single probe card according to claim 1, wherein the probe gantry comprises:

a contact table section provided with one or more probe blocks having probe pins capable of contacting a test object substrate and capable of adjusting positions based on the position of the test object substrate; and

and a first alignment camera disposed on one side of the contact table part, for recognizing an alignment mark on the inspection target substrate for performing a position alignment between the probe block and the inspection target substrate.

3. The apparatus of claim 2, wherein the first calibration camera is movable along a first direction.

4. The apparatus of claim 1, wherein the probe gantry further comprises:

a second calibration camera for photographing whether or not position alignment is achieved between the probe pin and a contact pad of the inspection object substrate; and

and a probe block controller which performs alignment by individually moving the probe block based on the photographing information obtained from the second alignment camera.

5. The apparatus of claim 4, wherein the second calibration camera further comprises a second calibration camera controller, the second calibration camera controller being disposed at one side of the truss and being capable of moving the second calibration camera in the first direction and the third direction so as to perform the ultra-short distance imaging for precisely determining whether or not the displacements between the target substrate and the probe pins of the probe block are the same.

6. The array pattern testing apparatus capable of realizing automatic fine control of a single probe block according to claim 4,

the second calibration camera further includes a block control calculation unit which determines whether or not displacements between the object and the probe block are the same by calculation performed by the first direction displacement calculation unit and the second direction displacement calculation unit,

the first direction displacement calculating unit compares the first direction displacements of the probe block with the object to be inspected to determine whether the first direction displacement of the probe block needs to be changed,

the second direction displacement calculation unit compares the second direction displacement of the probe block with the object to be inspected to determine whether the second direction displacement of the probe block needs to be changed.

7. The apparatus for testing array pattern capable of realizing automatic fine control of individual probe blocks according to claim 4, wherein the probe block controller further comprises:

a probe block holder part capable of realizing unit-level grasping of the probe block;

the first direction displacement controller can realize the first direction displacement micro-displacement operation of the probe block;

the second direction displacement controller can realize the second direction displacement micro-movement operation of the probe block; and

and the third direction displacement controller can realize the third direction displacement micro-displacement operation of the probe block.

8. The apparatus of claim 4, wherein the second calibration camera is a line scan camera capable of obtaining a linear image by continuously moving along the first direction.

9. The apparatus of claim 1, further comprising a prober buffer disposed at a rear side of the prober gantry and configured to receive one or more probers.

10. The apparatus of claim 9, further comprising a prober block transferring unit disposed between the prober gantry and the prober block buffering unit, for transferring the prober block to the contact table unit or recovering the prober block from the contact table unit.

11. The apparatus for testing an array pattern capable of performing automatic fine control of a single probe block according to claim 10, wherein the probe block transfer unit further comprises:

the probe block grabbing part can realize unit-level loading or unloading of the probe blocks by the probe portal frame;

a first direction driving part capable of realizing unit-level first direction displacement micro-shift operation of the probe block grabbing part;

a second direction driving part which can realize the second direction displacement micro-movement operation of the probe block grabbing part; and

and the third direction driving part can realize the unit-level third direction displacement micro-displacement operation of the probe block grabbing part.

12. The array pattern testing apparatus according to claim 1, wherein the substrate placing section comprises:

a loading plate portion having a flat plate shape and including one or more adsorption holes penetrating a surface thereof, the loading plate portion being capable of adsorbing an object to be examined through the adsorption holes;

an adsorption member disposed below the loading plate portion and capable of adsorbing an object to be examined to the loading plate portion through the adsorption hole;

a mounting/dismounting pin portion disposed at a lower portion of the mounting plate portion and configured to move up and down through a through hole formed in the mounting plate portion to adjust mounting/dismounting of the object to be examined; and

and a contact guide part which is arranged at the lower part of the assembling and disassembling pin part and enables the object to be detected placed on the loading plate part to contact with the probe portal frame by moving the loading plate part along the vertical direction.

13. The apparatus of claim 1, further comprising a test camera disposed at one side of the bottom part and moving in the first direction and the third direction to take a two-dimensional image, so that a user can visually check whether the test result of the apparatus is wrong.

Technical Field

The present invention relates to an array test apparatus capable of automatically and precisely controlling a single probe block, and more particularly, to an array test apparatus capable of automatically and precisely controlling a single probe block, which is capable of independently changing a displacement of a probe block in a first direction, a displacement of a probe block in a second direction, and a displacement of a probe pin by determining whether or not the displacement of a test object is the same as that of the probe pin by a second calibration camera after a calibration mark of the test object is confirmed by a first calibration camera and the position is adjusted.

Background

The statements made in this section merely provide background information related to the present disclosure and may not constitute prior art.

As a final process of manufacturing a display product, a detection process has been conventionally performed in such a manner that after probe pins of a probe block are brought into physical contact with a circuit pattern of a display, an electric signal is applied to a tester to measure and detect the circuit pattern of the display to be inspected, thereby outputting measurement data.

Since the position of the circuit pattern of the display as the object to be inspected differs depending on the model, the conventional array test apparatus needs to replace the probe block and the probe pin correspondingly for measurement and detection.

However, even if the probe block and the probe pin are replaced so as to correspond to the model of the display, if the probe block and the probe pin do not belong to the dedicated model, a slight deviation occurs between the circuit pattern of the display and the probe block.

Therefore, the conventional array test apparatus has to have a function of adjusting the position of a single probe block, that is, to align the circuit patterns of the glass to be inspected by moving the glass placement table and the probe block, and although there are many adjustment methods developed for this, there is a problem that it is difficult to accurately realize the displacement of the probe block and the probe pin.

On the other hand, in a situation where a slight deviation occurs between the circuit pattern of the glass as the object of inspection and the probe block, it is difficult to precisely measure and detect the circuit pattern of the display, and not only the measurement accuracy of the measurement of the glass circuit pattern is inevitably lowered, but also data having accuracy and reliability cannot be obtained.

Although some related companies in korea and overseas have studied an array test apparatus capable of fine-tuning probe pins in order to solve the problems of the conventional array test apparatus as described above, the X-axis movement driving unit, the Y-axis movement driving unit, the Z-axis movement driving unit, and the control unit provided with the probe blocks have an excessively high cost in terms of practical production, or the manufacturing cost of the apparatus is not so high as compared with the conventional array test apparatus, so that the market competitiveness is low, and thus a case of actually realizing commercialization cannot be found.

Therefore, it is required to develop a device capable of solving the technical problems of the related art as described above.

Disclosure of Invention

Technical problem

The present invention is intended to remedy the disadvantages mentioned above of the prior art and has the following object.

First, the present invention provides an array test apparatus capable of automatically and precisely controlling a single probe block, in which a plurality of probe blocks can be mounted so as to correspond to circuits of different types of test objects.

Second, the present invention provides an array test apparatus capable of performing automatic precise control of a single probe block by performing double measurement using a first calibration camera and a second calibration camera to precisely measure the position between a circuit to be inspected and a probe pin.

Third, the present invention provides an array test apparatus capable of realizing automatic precise control of a single probe block by confirming a degree of deviation between a circuit of an object to be inspected and a probe pin by a second calibration camera and finely adjusting positions of the probe block on a first direction axis, a second direction axis and a third direction axis when a deviation occurs between the probe pin and the object to be inspected.

Technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention pertains from the following descriptions.

Technical scheme

According to the present invention, the array pattern testing apparatus capable of realizing automatic precise control of a single probe block according to the present invention detects whether a pattern of a test object substrate is unqualified by the automatic precise control of the single probe block, and may include: a bottom including a truss; a substrate placing section disposed above the bottom section, for placing the object to be inspected on the upper surface and moving the substrate; and a probe gantry (gantry) disposed on one side of the substrate placement unit and configured to measure electrical characteristics of the substrate by contacting at least a portion of the target substrate moved by the substrate placement unit.

The present invention is characterized in that the probe gantry may include: a contact table section provided with one or more probe blocks having probe pins capable of contacting a test object substrate and capable of adjusting positions based on the position of the test object substrate; and a first calibration camera arranged on one side of the contact stage part for recognizing an alignment mark (align mar) on the inspection target substrate for performing position alignment between the probe block and the inspection target substrate.

In this case, the probe gantry may further include: the second calibration camera is used for shooting whether the position alignment is realized between the probe pin and the contact pad of the detected object substrate; and a probe block controller that individually moves the probe block for alignment based on photographing information obtained from the second calibration camera.

The second calibration camera may further include a second calibration camera controller disposed at one side of the truss, and configured to move the second calibration camera in the first direction and the third direction so as to perform ultra-short distance photographing for precisely determining whether displacements between the target substrate and the probe pins of the probe block are the same.

Also, the second calibration camera may be replaced with a line scan camera capable of obtaining a linear image by continuously moving in the first direction.

On the other hand, the second calibration camera may further include a block control operation unit which determines whether or not displacements between the object and the probe block are the same by operations of the first direction displacement operation unit which determines whether or not a first direction displacement of the probe block needs to be changed by comparing the first direction displacements of the object and the probe block, and the second direction displacement operation unit which determines whether or not a second direction displacement of the probe block needs to be changed by comparing the second direction displacements of the object and the probe block.

According to other features of the invention, the probe block controller may further comprise: the probe block support part can realize unit-level grabbing of the probe block; the first direction displacement controller can realize the first direction displacement micro-displacement operation of the probe block; the second direction displacement controller can realize the second direction displacement micro-movement operation of the probe block; and a third direction displacement controller capable of realizing a third direction displacement micro-displacement operation of the probe block.

In this case, the array pattern test apparatus capable of implementing automatic fine control of a single probe block may further include: the probe block buffer part is arranged on one side of the rear part of the probe portal frame and can load the probe block; and a probe block transfer unit disposed at one side between the probe gantry and the probe block buffer unit, for transferring the probe block to the contact stage unit or recovering the probe block from the contact stage unit.

On the other hand, the substrate placing section may further include: a loading plate portion having a flat plate shape, including one or more adsorption holes penetrating the surface, and capable of adsorbing an object to be examined through the adsorption holes; an adsorption member disposed below the loading plate section and capable of adsorbing the test object to the loading plate section through the adsorption hole; a mounting/dismounting pin portion disposed at a lower portion of the loading plate portion and configured to move up and down through a through hole formed in the loading plate portion to adjust mounting/dismounting of the object to be examined; and a contact guide part which is configured at the lower part of the assembling and disassembling pin part and enables the object to be detected placed on the loading plate part to contact with the probe portal frame by moving the loading plate part along the vertical direction.

Other embodiments of the present invention will be partially described in the following description, and some of them can be easily identified by the description or can be known by embodiments of the present invention.

The general description above and the detailed description below are only exemplary and explanatory and do not limit the invention described in the claims.

ADVANTAGEOUS EFFECTS OF INVENTION

The present invention configured as described above has the following effects.

First, a calibration mark of an object to be inspected can be confirmed by the first calibration camera and a first fine adjustment of a position between the object to be inspected and the probe block can be performed.

Secondly, whether the displacement between the circuit of the detected object and the probe block unit of a single unit is the same or not can be judged through a second calibration camera, and if the displacement is different, the three-direction displacement of the probe block can be independently and precisely adjusted for the second time through a probe block controller.

Third, a plurality of probe blocks can be loaded so that the corresponding detection can be performed according to the model of the object to be inspected, and the probe blocks can be automatically replaced by the probe block transfer unit.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art to which the present invention pertains from the description in the scope of the claims of the invention.

Drawings

Fig. 1 is a perspective view of a probe block array testing apparatus according to an embodiment of the invention.

Fig. 2 is a perspective view of a probe gantry of the probe block array testing apparatus according to an embodiment of the present invention.

Fig. 3 is a structural diagram of a first calibration camera of the probe block array test apparatus according to an embodiment of the present invention and a diagram showing functions thereof.

Fig. 4 is a structural diagram of a second calibration camera of the probe block array test apparatus according to an embodiment of the present invention and a diagram showing functions thereof.

Fig. 5 is a structural diagram of a second calibration camera controller of the probe block array test apparatus according to an embodiment of the present invention and a diagram illustrating a second calibration camera adjusted by the second calibration camera controller.

Fig. 6 is a diagram showing an algorithm of a block control arithmetic unit of the probe block array test apparatus according to the embodiment of the present invention.

Fig. 7 is a diagram illustrating a probe block controller of the probe block array test apparatus according to an embodiment of the present invention.

Fig. 8 is a diagram illustrating probe blocks in which first direction displacement, second direction displacement, and third direction displacement are individually adjusted by a probe block controller of a probe block array test apparatus according to an embodiment of the present invention.

Fig. 9 is a diagram showing a state where displacements between the object to be inspected and the probe block in the probe block array test apparatus according to the embodiment of the present invention are the same.

Fig. 10 to 12 are diagrams illustrating a process of confirming whether the displacement between the object to be inspected and the probe block is the same and changing the displacement therebetween in the probe block array test apparatus according to the embodiment of the present invention.

Fig. 13 is a diagram illustrating a probe block buffer unit of the probe block array test apparatus according to an embodiment of the present invention.

Fig. 14 is a diagram illustrating a probe block transfer unit of the probe block array test apparatus according to the embodiment of the present invention.

Fig. 15 is a diagram illustrating a state in which the first direction displacement, the second direction displacement, and the third direction displacement of the probe block gripping part are adjusted by the probe block transfer part of the probe block array test apparatus according to the embodiment of the present invention.

Fig. 16 is a diagram showing an algorithm for loading/unloading probe blocks by the probe block transfer unit and the probe block buffer unit according to a test object.

Detailed Description

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, in describing the embodiments of the present invention, when it is judged that a detailed description of related well-known functions or structures may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted.

The objects, features and advantages of the present invention will become apparent from the detailed description set forth below when taken in conjunction with the drawings. However, since the present invention can be modified in various ways and includes a plurality of embodiments, specific embodiments will be illustrated in the drawings and described in detail below.

When it is judged that a detailed description of known functions or configurations related to the present invention may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted. In addition, the numbers used in the description of the present specification are only the reference numbers for distinguishing one component from another component.

The suffix "part" of a component used in the following description is used or mixed for convenience of specification, and does not have a meaning or function distinguished from each other.

Fig. 1 is a perspective view of a probe block array testing apparatus according to an embodiment of the invention.

The array pattern testing apparatus capable of implementing automatic precise control of the single probe block 390 according to an embodiment of the present invention may include a base 100, a substrate placing part 200, and a probe gantry 300.

The base 100 may include a truss 110.

The bottom 100 may be made of a rigid body (e.g., a metal such as iron, aluminum, or copper, or a synthetic resin such as Polystyrene (PS), ABS, Polyacetal (POM), Polyethylene (PE), polyvinyl chloride (PVC), Polycarbonate (PC), Polycaprolactone (PCL), or polypropylene (PP)) having a constant shape.

The substrate placing part 200 may include a loading plate part, an adsorption member, an attaching and detaching pin part, and a contact guide part.

The loading plate portion has a flat plate shape, includes one or more suction holes penetrating the surface, and can suck the test object 20 through the suction holes.

The suction member is disposed below the loading plate portion, and can suck the test object 20 to the loading plate portion through the suction hole.

The mounting/dismounting pin portion is disposed at a lower portion of the mounting plate portion, and can move up and down through a through hole formed in the mounting plate portion to adjust mounting/dismounting of the inspection object 20.

The contact guide portion is disposed below the mounting/dismounting pin portion, and can make the object 20 placed on the mounting plate portion contact with the probe gantry 300 by moving the mounting plate portion in the vertical direction.

The probe gantry 300 may include a contact stage 310, a first calibration camera 320, a second calibration camera 350, and a probe tile controller 360.

Hereinafter, detailed functions of each of the above-described structures will be described.

Fig. 2 is a perspective view of a probe gantry 300 of the probe block array testing apparatus according to an embodiment of the present invention.

The probe gantry 300 may include a contact stage 310, a first calibration camera 320, a second calibration camera 350, and a probe tile controller 360.

The second calibration camera 350 may further include a second calibration camera controller 351, and the probe block controller 360 may further include a probe block holder part 361, a first directional displacement controller 362, a second directional displacement controller 363, and a third directional displacement controller 364.

The probe gantry 300 may also include an inspection camera.

The inspection camera is disposed at one side of the base 100, moves in the first direction and the third direction, and captures a two-dimensional image, so that a user can visually confirm whether or not a test result of the array pattern testing apparatus is erroneous.

The inspection camera may provide a shot image that a user can confirm with the naked eye in order to detect the test result, whether a failure is generated.

The lens of the inspection camera may be composed of a combination of a plurality of lenses so that the magnification can be adjusted according to the distance between an arbitrary position of the inspection object 20, at which it is necessary to confirm whether a failure is generated, and the inspection camera 380.

One or more probe blocks 390 are provided on the contact stage part 310, and the probe blocks 390 have probe pins that contact the substrate of the inspection object 20 and are adjustable in position based on the position of the substrate of the inspection object 20.

Fig. 3 is a structural diagram of a first calibration camera 320 of the probe block array test apparatus according to an embodiment of the present invention and a diagram illustrating functions thereof.

As shown in part (a) of fig. 3, the first calibration camera 320 may be moved in a first direction.

The first calibration camera 320 is disposed on one side of the contact stage 310, and recognizes an alignment mark 21(align mark) on the inspection object 20 substrate in order to perform a positional alignment between the probe block 390 and the inspection object 20 substrate.

In more detail, as shown in part (b) of fig. 3, the first calibration camera 320 may search for an alignment mark disposed on the upper surface side of the inspection object 20.

When the first calibration camera 320 recognizes the alignment marks arranged on the upper surface side of the object to be inspected 20, since there is no need to perform the position adjustment of the probe block 390, the object to be inspected 20 placed on the substrate placing part 200 can be moved in the upper direction by the contact guide part of the substrate placing part 200 in a case where the contact stage part 310 is not operated.

When the first calibration camera 320 cannot recognize the alignment mark disposed on the upper surface side of the inspection object 20, since the position adjustment of the probe block 390 is required, the alignment mark can be searched by moving the first calibration camera 320 in the first direction. When the first calibration camera 320 recognizes the alignment mark, the displacement of the probe block 390 can be adjusted by the contact stage part 310 in a manner corresponding to the moving distance of the first calibration camera 320. Subsequently, the inspection object 20 placed on the board placing part 200 may be moved in the upper direction by the contact guide part of the board placing part 200 to guide the inspection object 20 to be in contact with the probe block 390.

Finally, the calibration mark of the object 20 can be confirmed by the first calibration camera 320 and the position between the object 20 and the probe block 390 can be fine-adjusted for the first time.

Fig. 4 is a structural diagram of a second calibration camera 350 of the probe block array test apparatus according to an embodiment of the present invention and a diagram illustrating functions thereof.

The second alignment camera 350 may further include a second alignment camera controller 351 disposed at one side of the girder 110, and configured to move the second alignment camera 350 in the first direction and the third direction so as to perform an ultra-short distance photographing for precisely measuring whether or not the displacements between the substrate of the inspection target 20 and the probe pins of the probe block 390 are the same.

The second calibration camera 350 may be replaced with a line scan camera capable of obtaining a linear image by continuously moving in the first direction.

Unlike an area camera that shoots one frame per unit scene, a line scan camera can shoot one line per unit scene.

Unlike an area camera that can perform shooting in a stopped state, a line scan camera can also perform shooting while moving.

Therefore, when the second calibration camera 350 is a line scan camera, it is possible to capture an Image even if the object 20 moves, and to achieve a resolution as if two 1Mega region cameras are used, and to prevent the occurrence of Image blurring (Image smear) by adjusting the synchronization speed of the second calibration camera 350 in accordance with the moving speed of the object 20, and to use a captured Image without performing separate Image processing on a portion overlapped by Frame Overlap (Frame Overlap).

Fig. 5 is a structural diagram of the second calibration camera controller 351 of the probe block array test apparatus according to an embodiment of the present invention and a diagram illustrating the second calibration camera 350 adjusted by the second calibration camera controller 351.

The second calibration camera controller 351 can perform a moving operation of the second calibration camera 350 so as to move in the first direction and the third direction, so as to perform ultra-short distance photographing in order to precisely measure whether or not the displacements between the substrate of the inspection object 20 and the probe pins of the probe block 390 are the same.

The second calibration camera controller 351 may slightly move the second calibration camera 350 in the first and third directions so as to detect whether a fine pitch (pitch) unit-level displacement between the circuit substrate of the inspection object 20 and the probe block 390 corresponds.

Finally, the second calibration camera 350 determines whether the unit-level displacements between the circuit of the inspection object 20 and the probe block 390 are the same, and when the displacements are different, the third-direction displacement of the probe block 390 can be individually adjusted for the second time by the probe block controller 360.

Fig. 6 is a diagram showing an algorithm of the block control arithmetic unit 352 of the probe block array test apparatus according to the embodiment of the present invention.

The block control operation unit 352 may include a first direction displacement operation unit, a second direction displacement operation unit, and a third direction displacement operation unit.

The block control arithmetic unit 352 can determine whether or not the displacements of the test object 20 and the probe block 390 are the same.

The block control arithmetic unit 352 can capture the object 20 and the probe block 390 and take an image. The displacement of the probe block 390 can be adjusted by combining the two images obtained by the above-described imaging to determine whether the displacements of the object 20 and the probe block 390 are the same.

The first direction displacement calculator determines whether or not the first direction displacement of the probe block 390 needs to be changed by comparing the first direction displacements of the object 20 and the probe block 390.

The second directional displacement calculator compares the second directional displacements of the test object 20 and the probe block 390 to determine whether the second directional displacement of the probe block 390 needs to be changed.

The third direction displacement calculating unit determines whether the third direction displacement of the probe block 390 needs to be changed by comparing the third direction displacements of the object 20 and the probe block 390.

In more detail, the first direction displacement calculation section may determine whether the probe block 390 is placed at an accurate position on the first direction axis by comparing the first direction position of the circuit of the inspection object 20 and the first direction position of the probe block 390 with each other based on the scene photographed by the second calibration camera 350.

The second direction displacement operation part may judge the second direction displacement of the probe block 390 when the probe block 390 is placed at an accurate position on the first direction axis.

When the probe block 390 is not placed at an accurate position on the first direction axis, the first direction displacement operation part may finely adjust the position of the first direction of the probe block 390 by operating the first direction displacement controller 362 of the probe block controller 360. After the first direction fine adjustment of the probe block 390 is completed, the second direction displacement calculating part may determine the second direction displacement of the probe block 390.

The second direction displacement operation part may determine whether the probe block 390 is placed at an accurate position on the second direction axis by comparing the second direction position of the circuit of the inspection object 20 and the second direction position of the probe block 390 with each other based on the scene photographed by the second calibration camera 350.

When the probe block 390 is placed at an accurate position on the second direction axis, the probe block 390 of the probe block array test apparatus according to an embodiment of the present invention may determine whether the circuit of the test object 20 is defective.

When the probe block 390 is not placed at an accurate position on the second direction axis, the position of the second direction of the probe block 390 can be finely adjusted by operating the second direction displacement controller 363 of the probe block controller 360. After finishing the second-direction fine adjustment of the probe block 390, the probe block 390 of the probe block array test apparatus according to the embodiment of the invention may determine whether the circuit of the inspection object 20 is not qualified.

Fig. 7 is a diagram illustrating a probe block controller 360 of the probe block array test apparatus according to an embodiment of the present invention.

Fig. 8 is a diagram illustrating a probe tile 390 in which first, second, and third directional displacements are individually adjusted by a probe tile controller 360 of a probe tile array test apparatus according to an embodiment of the present invention.

The probe block controller 360 may further include a probe block holder 361, a first direction displacement controller 362, a second direction displacement controller 363, and a third direction displacement controller 364.

The probe block holder 361 can grasp each unit of the probe block 390.

As shown in fig. 8 (a), when the first direction displacement calculator determines that there is a deviation in the first direction axis displacement between the circuit of the object 20 and the probe block 390, the first direction displacement controller 362 can perform a first direction displacement fine displacement operation of the probe block 390.

As shown in fig. 8 (b), when the second direction displacement calculator determines that the second direction axis displacement between the circuit of the test object 20 and the probe block 390 is deviated, the second direction displacement controller 363 may perform the second direction displacement fine displacement operation of the probe block 390.

As shown in fig. 8 (c), when it is determined by the third direction displacement calculator that there is a deviation in the third direction axis displacement between the circuit of the inspection object 20 and the probe block 390, the third direction displacement controller 364 may perform a third direction displacement micro-displacement operation of the probe block 390.

Fig. 9 is a diagram showing a state where displacements between the object 20 and the probe block 390 are the same in the probe block array test apparatus according to the embodiment of the present invention.

Fig. 10 to 12 are diagrams illustrating a process of confirming whether the displacements between the test object 20 and the probe block 390 are the same and changing the displacement therebetween in the probe block array test apparatus according to the embodiment of the present invention.

As shown in fig. 9, the positions of the probe blocks 390 corresponding to the circuits of the inspection object 20 in the first direction and the second direction are accurately displaced.

As shown in part (a) of fig. 10, although the position of the probe block 390 corresponding to the circuit of the inspection object 20 is an accurate displacement in the second direction, the position in the first direction is an erroneous displacement.

As shown in part (a) of fig. 11, although the position of the probe block 390 corresponding to the circuit of the inspection object 20 is an accurate displacement in the first direction, the position is an erroneous displacement in the second direction.

As shown in fig. 12 (a), the probe block 390 corresponding to the circuit of the inspection object 20 is displaced in an error in both the first direction and the second direction.

As shown in fig. 9, since the positions of the probe block 390 corresponding to the circuit of the object 20 in the first direction and the second direction are accurately displaced, the probe block 390 is located at an accurate position when the probe block controller 360 is not operated, and thus, the probe block array test apparatus according to an embodiment of the present invention can detect the circuit of the object 20.

Although the position of the probe block 390 corresponding to the circuit of the object 20 is accurately displaced in the second direction as shown in part (a) of fig. 10, since the position in the first direction is an erroneous displacement, the probe block 390 may be moved to an accurate position by performing a first direction displacement fine adjustment operation by the first direction displacement controller 362 of the probe block controller 360 as shown in part (b) of fig. 10, and thus the probe block array test apparatus according to an embodiment of the present invention may detect the circuit of the object 20.

Although the position of the probe block 390 corresponding to the circuit of the object 20 is accurately displaced in the first direction as shown in part (a) of fig. 11, since the position is erroneously displaced in the second direction, the probe block 390 may be moved to an accurate position by performing a second direction displacement fine adjustment operation by the second direction displacement controller 363 of the probe block controller 360 as shown in part (b) of fig. 11, and thus the probe block array test apparatus according to an embodiment of the present invention may detect the circuit of the object 20.

As shown in part (a) of fig. 12, the positions of the probe block 390 corresponding to the circuit of the object 20 in the first direction and the second direction are both erroneously shifted, and thus, as shown in part (b) of fig. 12, the probe block 390 may be moved to an accurate position by performing the first direction shift fine adjustment operation and the second direction shift fine adjustment operation by the first direction shift controller 362 and the second direction shift controller 363 of the probe block controller 360, and thus, the probe block array test apparatus according to an embodiment of the present invention may detect the circuit of the object 20.

Fig. 13 is a diagram illustrating a probe block buffer 400 of a probe block array test apparatus according to an embodiment of the present invention.

The probe block buffer 400 is disposed on the rear side of the probe gantry 300, and can be loaded with one or more probe blocks 390.

The probe block buffer unit 400 can store a plurality of probe blocks 390 so that a test can be performed in accordance with the model of the display of the test object 20.

Fig. 14 is a diagram illustrating a probe block transfer unit 410 of a probe block array test apparatus according to an embodiment of the present invention.

The probe block transfer part 410 may include a probe block grasping part 414, a first direction driving part 411, a second direction driving part 412, and a third direction driving part 413.

The probe block grasping part 414 can perform unit-level loading or unloading of the probe block 390 by the probe gantry 300 according to the model of the display of the object 20.

As shown in fig. 14, although the probe block grasping portion 414 may be formed with 4 units, it may include 4 or less or 4 or more units, unlike fig. 14. The first direction driving part 411 and the third direction driving part 413 may be additionally included in a manner corresponding to the number of cells of the probe block grasping part 414 so as to achieve unit-level fine adjustment of the probe block grasping part 414.

The first direction driving part 411 may include a first direction driving board 411A, and may perform a unit-level first direction displacement micro-shift operation of the probe block grasping part 414.

The first direction driving part 411 may generate power and transmit the generated power to the first direction driving plate 411A. The first direction driving plate 411A may implement a unit-level first direction displacement micro-shift operation of the probe block grasping portion 414 by transmitting power to the probe block grasping portion 414.

The second direction driving part 412 may perform a second direction displacement nudging operation of the probe block gripping part 414.

The third direction driving part 413 may perform a third direction displacement fine shift operation at a unit level of the probe block grasping part 414.

The prober block transfer unit 410 is disposed between the prober gantry 300 and the prober block buffer unit 400, and can transfer the prober block 390 to the contact stage unit 310 or collect the prober block 390 from the contact stage unit 310.

Fig. 15 is a diagram illustrating a state in which the first direction displacement, the second direction displacement, and the third direction displacement of the probe block gripping part 414 are adjusted by the probe block transfer part 410 of the probe block array test apparatus according to the embodiment of the present invention.

The probe block catching section 414 can realize unit-level catching of the probe block 390.

As shown in fig. 15 (a), when the first direction axis displacements of the prober block 390 of the prober gantry 300 and the prober block gripping portion 414 of the prober block transfer portion 410 are different from each other, the first direction driving portion 411 may perform a unit-level first direction displacement micro-displacement operation of the prober block gripping portion 414.

As shown in fig. 15 (b), when the second direction axis displacements of the prober block 390 of the prober gantry 300 and the prober block grasping portion 414 of the prober block transfer portion 410 are different from each other, the second direction driving portion 412 can slightly displace the entire prober block grasping portion 414 in the second direction.

As shown in fig. 15 (c), when the third direction axis displacements of the prober blocks 390 of the prober gantry 300 and the prober block gripping portions 414 of the prober block transfer unit 410 are different from each other, the third direction driving unit 413 may perform a unit-level third direction displacement micro-displacement of the prober block gripping portions 414.

Fig. 16 is a diagram showing an algorithm for loading/unloading the probe block 390 by the probe block transfer unit 410 and the probe block buffer unit 400 according to the object to be inspected.

When the type of the test object 20 is the same as that of the test object in the conventional test, the probe block array test apparatus according to the embodiment of the present invention can perform the test without driving the probe block transfer unit 410 and the probe block buffer unit 400.

When the model of the inspection object 20 is different from the model of the inspection object in the conventional inspection, the probe block transfer unit 410 can be driven.

In more detail, the probe block transfer unit 410 may detachably mount the probe block 390 that has been conventionally detected.

When the first direction displacements between the probe block gripping part 414 and the probe block 390 are different from each other, the adjustment may be performed by activating the first direction driving part 411 so that the first direction displacement of the probe block gripping part 414 is the same as the first direction displacement of the probe block 390 of the probe gantry 300.

When the first direction displacement between the probe block catching part 414 and the probe block 390 becomes the same by the first direction driving part 411 or is the same at the beginning, it can be judged whether the second direction displacement is the same.

When the second-direction displacements between the probe block gripping part 414 and the probe block 390 are different from each other, the adjustment may be performed by activating the first-direction driving part 411 so that the second-direction displacement of the probe block gripping part 414 is the same as the second-direction displacement of the probe block 390 of the probe gantry 300.

When the second-direction displacement between the probe block grasping part 414 and the probe block 390 becomes the same by the second-direction driving part 412 or is the same from the beginning, it is possible to judge whether the third-direction displacement is the same.

When the third directional displacements between the probe block gripping part 414 and the probe block 390 are different from each other, the adjustment may be performed by activating the third directional driving part 413 so that the third directional displacement of the probe block gripping part 414 is the same as the third directional displacement of the probe block 390 of the probe gantry 300.

When the third direction displacement between the probe block gripping part 414 and the probe block 390 becomes the same or is initially the same by the third direction driving part 413, the probe block transfer part 410 may load the unloaded probe block 390 on the probe block buffer part 400 by moving to the probe block buffer part 400.

The probe block transfer unit 410 can load the probe block 390 corresponding to the model of the test object 20. The prober block transfer unit 410 can dock the prober block 390 to the prober gantry 300.

Through the above-described flow, the probe block array test apparatus can correspondingly test and load a plurality of probe blocks 390 according to the model of the object 20, and can automatically replace the probe blocks 390 by the probe block transfer unit 410.

The embodiments of the present invention are merely exemplary to illustrate the technical idea of the present invention, and those skilled in the art to which the present invention pertains can make various modifications and variations to the embodiments of the present invention without departing from the scope of the essential features of the invention.

The embodiments of the present invention are merely illustrative, and do not limit the technical spirit of the present invention, and therefore, the scope of the present invention is not limited to the embodiments of the present invention.

The scope of the invention should be construed in accordance with the claims and all technical ideas identical or equivalent thereto are included in the scope of the invention.