阅读说明：本技术 一种用于测试板卡级设备的综合环境模拟装置 (Comprehensive environment simulation device for testing board card level equipment ) 是由 赵明敏 林珊珊 杨志超 赵鹏 鞠勇 于 2021-08-06 设计创作，主要内容包括：本发明公开了一种用于测试板卡级设备的综合环境模拟装置,包括：环境温度箱(5)、电磁干扰源(2)以及设置于所述环境温度箱(5)和所述电磁干扰源(2)之间的电磁干扰注入通道(4),其中所述电磁干扰注入通道(4)用于将所述电磁干扰源(2)提供的电磁干扰波注入所述环境温度箱(5)内部。(The invention discloses a comprehensive environment simulation device for testing board card-level equipment, which comprises: the electromagnetic interference device comprises an environment temperature box (5), an electromagnetic interference source (2) and an electromagnetic interference injection channel (4) arranged between the environment temperature box (5) and the electromagnetic interference source (2), wherein the electromagnetic interference injection channel (4) is used for injecting electromagnetic interference waves provided by the electromagnetic interference source (2) into the environment temperature box (5).)

1. A synthetic environment simulator for testing board level devices, comprising: the electromagnetic interference device comprises an environment temperature box (5), an electromagnetic interference source (2) and an electromagnetic interference injection channel (4) arranged between the environment temperature box (5) and the electromagnetic interference source (2), wherein the electromagnetic interference injection channel (4) is used for injecting electromagnetic interference waves provided by the electromagnetic interference source (2) into the environment temperature box (5).

2. The integrated environment simulating assembly according to claim 1, wherein the EMI injection channel (4) is connected to the environment temperature box (5) by a 360 ° shield ring.

3. The integrated environment simulator according to claim 1, wherein a shielding door (6) is provided on said ambient temperature chamber (5), and said shielding door (6) has electromagnetic wave shielding effectiveness.

4. The integrated environment simulation device of claim 1, wherein the electromagnetic interference wave is a surge, an electrical fast transient burst, or a damped oscillatory wave.

5. The integrated environmental simulation apparatus according to claim 1, wherein the inner walls of the ambient temperature chamber (5) are designed to have electromagnetic wave shielding effectiveness.

6. The integrated environmental simulation apparatus according to claim 1, wherein the environmental temperature chamber (5) is designed and improved to have the electromagnetic interference injection channel (4) and to maintain the original performance of the environmental temperature chamber, and the electromagnetic interference injection channel (4) is designed to ensure that the inside of the environmental temperature chamber (5) is not interfered by the external electromagnetic environment.

7. The environmental simulator of claim 1, wherein the environmental simulator is capable of simultaneously applying electromagnetic interference and temperature changes to board level devices to be tested.

8. A synthetic environment simulation means according to claim 3, wherein said shielded door (6) is designed according to the original door dimensions of said ambient temperature compartment (5) to ensure that the interior of said ambient temperature compartment (5) is not disturbed by the external electromagnetic environment.

9. A comprehensive environment simulation device according to claim 5, characterized in that the environment temperature box (5) is designed to be shielded to effectively isolate the influence of the external electromagnetic environment on the equipment in the environment temperature box (5).

10. The integrated environment simulation device according to claim 1, wherein a placing table for placing board-level equipment to be tested is arranged in the environment temperature box (5).

Technical Field

The present invention relates to the field of board level test equipment, and more particularly, to an integrated environment simulation apparatus for testing board level equipment.

Background

At present, the working environment of the board-level equipment is more and more complex, the board-level equipment often works under the simultaneous action of complex environmental factors such as extreme temperature and electromagnetic interference, and the environmental factors all affect the performance of the board-level equipment. Therefore, the board-level equipment needs to pass various tests before development and shaping.

The environment temperature box is internally provided with a temperature sensor and a temperature adjusting and controlling system, and can quickly and accurately adjust the temperature in the box, so that the environment of extreme temperature (extremely high temperature and extremely low temperature) where the board card level equipment is located can be simulated.

The electromagnetic interference simulation source can output electromagnetic interference waveforms such as surge, electric fast transient pulse group, damping oscillation wave and the like, so that the complex electromagnetic environment where the board-level equipment is located is simulated.

At present, tests of the board card level equipment in temperature environment, electromagnetic environment and the like are separately carried out, the influence on the equipment performance when various environmental factors act simultaneously cannot be comprehensively considered, the separated test result is possibly greatly different from the actual test result, and hidden dangers exist in the board card level equipment which is produced in a fixed mode.

Disclosure of Invention

In order to meet the test environment requirement of board card level equipment, the invention aims to provide a comprehensive environment simulation device capable of providing an extreme temperature and electromagnetic interference test environment at the same time, so as to at least solve the technical problem that the temperature environment and the electromagnetic environment of board card level equipment cannot be tested at the same time in the prior art.

According to the present application, there is provided a comprehensive environment simulation apparatus for testing board-level devices, comprising: the electromagnetic interference injection channel is used for injecting electromagnetic interference waves provided by the electromagnetic interference source into the environment temperature box.

Optionally, a 360 ° shielding ring is used at the end of the electromagnetic interference injection channel and the ambient temperature box.

Optionally, a shielding door is disposed on the ambient temperature chamber, and the shielding door has electromagnetic wave shielding effectiveness.

Optionally, the electromagnetic interference wave is a surge, an electrical fast transient pulse burst, or a damped oscillatory wave.

Optionally, the inner wall of the ambient temperature chamber is designed to have an electromagnetic wave shielding effect.

Optionally, the environment temperature box is designed and improved to have an electromagnetic interference injection channel and to maintain the original performance of the environment temperature box, and the electromagnetic interference injection channel is designed to ensure that the inside of the environment temperature box is not interfered by the external electromagnetic environment.

Optionally, the integrated environment simulation apparatus can apply electromagnetic interference and temperature change to the board level device to be tested at the same time.

Optionally, the shield door is designed according to the size of the original door of the ambient temperature box, so that the interior of the ambient temperature box is not interfered by the external electromagnetic environment.

Optionally, the ambient temperature box is designed to be shielded, so that the influence of an external electromagnetic environment on equipment in the ambient temperature box can be effectively isolated.

Optionally, a placing table for placing the board card level device to be tested is arranged in the ambient temperature box.

Therefore, in the invention, a test environment with electromagnetic interference can be provided in the environment temperature box, and meanwhile, the electromagnetic wave injected into the environment temperature box from the electromagnetic interference source through the electromagnetic interference injection channel is shielded in the environment temperature box through the specially designed environment temperature box and the shielding door, and is not interfered by external electromagnetic wave, so that the board-level equipment is ensured to be in the provided electromagnetic environment. The environment temperature box is used for adjusting the temperature of the inner space of the environment temperature box, and related electromagnetic interference factors are also transmitted to the inner space of the environment temperature box through the communication effect of the interface of the shielding environment, so that the electromagnetism and the environment conditions in the environment temperature box are changed. Through foretell structure for can provide electromagnetic interference and extreme temperature's test environment simultaneously in the ambient temperature case, provide a test environment that is close mutually with the abominable operational environment of reality for the integrated circuit board level equipment in the ambient temperature case, the simulation effect is true, has improved the degree of accuracy of test result. In addition, multiple tests can be simultaneously carried out on the same equipment, so that the test time is shortened, and the consumption of manpower and material resources is reduced. In addition, the electromagnetic interference source and the ambient temperature box are communicated by adopting a 360-degree shielding ring which can ensure the shielding efficiency of the ambient temperature box, and the shielding door is designed according to the size of the ambient temperature box door, so that the electromagnetic waves in the ambient temperature box can be effectively shielded, and the problem which is not solved all the time is solved.

Drawings

Some specific embodiments of the present application will be described in detail hereinafter by way of illustration and not limitation with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

FIG. 1 is a schematic diagram of an integrated environment simulation apparatus according to an embodiment of the present application.

Detailed Description

It should be noted that, in the present disclosure, the embodiments and features of the embodiments may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

In order to make the technical solutions of the present disclosure better understood by those skilled in the art, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances for describing the embodiments of the disclosure herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Fig. 1 is a schematic diagram of an integrated environment simulation apparatus for testing board level devices according to an embodiment of the present application. Referring to fig. 1, the integrated environment simulation apparatus for testing board-level devices includes: the electromagnetic interference device comprises an ambient temperature box 5, an electromagnetic interference source 2 and an electromagnetic interference injection channel 4 arranged between the ambient temperature box 5 and the electromagnetic interference source 2, wherein the electromagnetic interference injection channel 4 is used for injecting electromagnetic interference waves provided by the electromagnetic interference source 2 into the ambient temperature box 5.

Therefore, the board card level equipment 3 to be tested can be placed in the environment temperature box 5, the temperature environment in the environment temperature box 5 is adjusted through the regulation and control system of the environment temperature box 5, meanwhile, the electromagnetic interference waves provided by the electromagnetic interference injection channel 4 can be injected into the environment temperature box 5 through the electromagnetic interference injection channel 4, and the purpose of applying electromagnetic interference and temperature change to the board card level equipment at the same time is achieved. Therefore, the test environment of electromagnetic interference and extreme temperature can be provided simultaneously in the environmental temperature box 5 that this application provided, for the inboard board card level equipment 3 of environmental temperature box 5 provides a test environment that is close to with actual adverse operating environment mutually, the simulation effect is true, has improved the degree of accuracy of test result. In addition, multiple tests can be simultaneously carried out on the same equipment, so that the test time is shortened, and the consumption of manpower and material resources is reduced.

Optionally, a 360 ° shielding ring is used at the end of the electromagnetic interference injection channel 4 and the ambient temperature box 5.

Referring to fig. 1, the ambient temperature box 5 and the electromagnetic interference source 2 are communicated with the electromagnetic interference injection channel 4 through the 360 ° shielding ring interface 1, so that the electromagnetic interference source 2 can apply electromagnetic interference to the board-level device 3 in the ambient temperature box 5 through the reserved 360 ° shielding ring electromagnetic interference injection channel 4, thereby ensuring that the ambient temperature box 5 is not interfered by an external electromagnetic environment.

Optionally, a shielding door 6 is disposed on the ambient temperature box 5, and the shielding door 6 has an electromagnetic wave shielding effect. Thus, the board-level device 3 can be placed in the ambient temperature box 5 through the shield door 6 with a shield design. After the board level equipment 3 is placed in the ambient temperature box 5, the shielding door 6 is closed, so that the board level equipment 3 in the ambient temperature box 6 is not interfered by the external electromagnetic environment.

Optionally, the electromagnetic interference wave is a surge, an electrical fast transient pulse burst, or a damped oscillatory wave.

Alternatively, the inner wall of the ambient temperature chamber 5 is designed to have an electromagnetic wave shielding effect. The inner wall of the environment temperature box 5 is made of stainless steel, the environment temperature box 5 with the shielding effectiveness meeting the GJB6785-2009 requirement can be customized, and the influence of the external electromagnetic environment on equipment in the environment temperature box 5 is effectively isolated.

Optionally, the environmental temperature box 5 is designed and improved to have the electromagnetic interference injection channel 4 and to maintain the original performance of the environmental temperature box, and the electromagnetic interference injection channel 4 is designed to ensure that the inside of the environmental temperature box 5 is not interfered by the external electromagnetic environment.

Optionally, the integrated environment simulation apparatus can apply electromagnetic interference and temperature change to the board level device to be tested at the same time.

Optionally, the shield door 6 is designed according to the original door size of the ambient temperature box 5, so that the interior of the ambient temperature box 5 is not interfered by the external electromagnetic environment.

Optionally, the ambient temperature box 5 is designed to be shielded, so that the influence of an external electromagnetic environment on the equipment in the ambient temperature box 5 can be effectively isolated.

Optionally, a placing table for placing the board-level device to be tested is arranged in the ambient temperature box 5.

Therefore, the comprehensive environment simulation device for testing the board card level equipment comprises an environment temperature box 5, a 360-degree shielding ring joint interface 1, an electromagnetic interference source 2, an electromagnetic interference injection channel 4 and a shielding door 6. And the environment temperature box 5 is communicated with the electromagnetic interference source 2 through the 360-degree shielding ring joint interface 1 and the electromagnetic interference injection channel 4. The electromagnetic interference source 2 provides electromagnetic interference waves, such as transient electromagnetic interference waveforms that may output surges, electrical fast transient bursts, damped oscillatory waves, and so forth. The ambient temperature box 5 is used to regulate the temperature of its own interior space, thereby providing an extreme temperature environment for the board level device 3. And, shield door 6 that sets up on the inner wall of ambient temperature case 5 and the ambient temperature case 5 adopts the shielding design customization, shields external electromagnetic interference factor outside the case through the shielding function of ambient temperature case 5. The environment temperature box 5 after design improvement has electromagnetic interference injection channel and can keep the original performance of the environment temperature box, and the electromagnetic interference injection channel 4 of special design can ensure that the interior of the environment temperature box 5 is not interfered by the external electromagnetic environment. Therefore, the board card level equipment 3 can be placed in the environment temperature box, the environment temperature box 5 can be provided with the electromagnetic interference and the extreme temperature test environment at the same time, the board card level equipment 3 in the environment temperature box 5 is provided with a test environment close to the actual severe working environment, the simulation effect is real, and the accuracy of the test result is improved. In addition, multiple tests can be simultaneously carried out on the same equipment, the test time is shortened, and the consumption of manpower and material resources is reduced.

In addition, through adopting 360 shielding rings that can ensure ambient temperature case 5 shielding efficiency to come intercommunication electromagnetic interference source 2 and ambient temperature case 5, shield door 6 is designed according to the size of ambient temperature chamber door, can guarantee that the electromagnetic wave in the ambient temperature case 5 is effectively shielded, has overcome the problem that has not solved always.

The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present disclosure, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are presented only for the convenience of describing and simplifying the disclosure, and in the absence of a contrary indication, these directional terms are not intended to indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the scope of the disclosure; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.