阅读说明：本技术 电容器及其制作方法 (Capacitor and manufacturing method thereof ) 是由 陆斌 沈健 于 2020-03-31 设计创作，主要内容包括：本申请提供一种电容器及其制作方法,能够制备小体积、高容值密度的电容器。该电容器包括：多翼结构,包括N组翼状结构和N个支撑结构,每组翼状结构包括平行设置的M个翼状结构,该支撑结构的外侧壁上形成有M个限位槽,该M个翼状结构分别通过该M个限位槽固定于该支撑结构的外侧,M和N为正整数；叠层结构,该叠层结构包覆该多翼结构,该叠层结构包括至少一层电介质层和多层导电层,该至少一层电介质层和该多层导电层形成导电层与电介质层彼此交替的结构；至少一个第一外接电极,电连接至该多层导电层中的部分或者全部奇数层导电层；至少一个第二外接电极,电连接至该多层导电层中的部分或者全部偶数层导电层。(The application provides a capacitor and a manufacturing method thereof, which can be used for manufacturing a capacitor with small volume and high capacitance value density. The capacitor includes: the multi-wing structure comprises N groups of wing structures and N supporting structures, each group of wing structures comprises M wing structures arranged in parallel, M limiting grooves are formed in the outer side wall of each supporting structure, the M wing structures are fixed on the outer side of each supporting structure through the M limiting grooves, and M and N are positive integers; the laminated structure wraps the multi-wing structure and comprises at least one dielectric layer and a plurality of conductive layers, and the at least one dielectric layer and the plurality of conductive layers form a structure in which the conductive layers and the dielectric layers are alternated; at least one first external electrode electrically connected to some or all of the odd-numbered conductive layers; and at least one second external electrode electrically connected to some or all of the even-numbered conductive layers among the plurality of conductive layers.)

A capacitor, comprising:

the multi-wing structure comprises N groups of wing structures and N support structures, wherein each group of wing structures comprises M wing structures arranged in parallel, M limiting grooves are formed in the outer side wall of each support structure, the M wing structures are fixed on the outer side of each support structure through the M limiting grooves, and M and N are positive integers;

the laminated structure wraps the multi-wing structure and comprises at least one dielectric layer and a plurality of conductive layers, and the at least one dielectric layer and the plurality of conductive layers form a structure in which the conductive layers and the dielectric layers are alternated;

at least one first external electrode electrically connected to some or all of the odd-numbered conductive layers among the plurality of conductive layers;

at least one second external electrode electrically connected to some or all of the even-numbered conductive layers among the plurality of conductive layers.

The capacitor of claim 1 wherein the sidewalls of the support structure are recessed inwardly to form the M retaining grooves on the outer sidewalls of the support structure.

The capacitor of claim 1 wherein the sidewalls of the support structure are outwardly convex to form the M retaining grooves on the outer sidewalls of the support structure.

A capacitor according to any one of claims 1 to 3, wherein the support structure is cylindrical or plate-like.

A capacitor according to any one of claims 1 to 3, wherein the support structure is hollow cylindrical or channel-like.

A capacitor according to any one of claims 1 to 3, wherein the support structure is a T-shaped structure.

The capacitor according to any one of claims 1 to 6, further comprising: an annular structure located outboard of the N support structures and the N sets of wing structures.

The capacitor of claim 7, wherein the ring-like structure is formed by alternating stacks of M layers of the first material and M-1 layers of the second material.

The capacitor of claim 8 wherein said wing structure is formed from said first material.

The capacitor of any one of claims 1 to 9, wherein some or all of the plurality of conductive layers are conformal with the multi-wing structure.

The capacitor of any one of claims 1 to 9, wherein a portion of the plurality of conductive layers is conformal with the multi-wing structure and another portion of the plurality of conductive layers is complementary in shape to the multi-wing structure.

The capacitor according to any one of claims 1 to 11, further comprising:

the isolating ring is positioned above the outer sides of the N supporting structures and used for separating the laminated structure into an inner part and an outer part, and the first external electrode and the second external electrode are only electrically connected with the part, positioned on the inner side of the isolating ring, of the laminated structure.

The capacitor of claim 12, further comprising:

at least one first conductive via structure and at least one second conductive via structure, wherein,

the first conductive via structure is located in the isolation ring, and the second conductive via structure is located in a region outside the isolation ring and close to the center of the capacitor; or the first conductive through hole structure and/or the second conductive through hole structure are/is positioned in a region close to the center of the capacitor outside the isolating ring;

the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.

The capacitor of any one of claims 1 to 13, wherein the multi-wing structure is made of an electrically conductive material, the second external electrode being electrically connected to the multi-wing structure.

A capacitor according to any one of claims 1 to 13, wherein the multi-winged structure comprises a host material and a conductive layer or region on the surface of the host material, and the second external electrode is electrically connected to the multi-winged structure by being electrically connected to the host material and the conductive layer or region on the surface of the host material.

The capacitor according to any one of claims 1 to 15, further comprising: and the filling structure coats the laminated structure and fills a gap formed by the laminated structure.

The capacitor according to any one of claims 1 to 16, further comprising: and the substrate is arranged below the multi-wing structure.

The capacitor of claim 17, wherein the wing structures of the N sets of wing structures in contact with the substrate have regions of discontinuity between different support structures.

The capacitor of claim 18 wherein said substrate forms a substrate trench at said discontinuous region, said stacked structure further disposed within said substrate trench.

The capacitor of any one of claims 17 to 19, wherein the support structure extends into the substrate.

The capacitor according to any one of claims 1 to 20, further comprising: the electrode layer, set up in laminated structure's top, the electrode layer includes at least one first electrically conductive region and at least one second electrically conductive region of mutual separation, first electrically conductive region forms first external electrode, the electrically conductive region of second forms second external electrode.

The capacitor according to any one of claims 1 to 21, wherein the first external electrode and/or the second external electrode are electrically connected to conductive layers of the plurality of conductive layers through an interconnection structure.

The capacitor of claim 22, wherein said interconnect structure comprises at least one insulating layer, at least one first conductive via structure and at least one second conductive via structure, wherein said first and second conductive via structures extend through said at least one insulating layer, wherein said first external electrode is electrically connected to some or all of the odd-numbered ones of said plurality of conductive layers through said at least one first conductive via structure, and wherein said second external electrode is electrically connected to some or all of the even-numbered ones of said plurality of conductive layers through said at least one second conductive via structure.

The capacitor of any one of claims 1 to 23, wherein a conductive layer of the plurality of conductive layers comprises at least one of:

the high-temperature-resistant conductive coating comprises a heavily-doped polycrystalline silicon layer, a metal silicide layer, a carbon layer, a conductive polymer layer, an aluminum layer, a copper layer, a nickel layer, a tantalum nitride layer, a titanium nitride layer, an aluminum titanium nitride layer, a tantalum silicon nitride layer and a tantalum carbon nitride layer.

The capacitor of any one of claims 1 to 24, wherein a dielectric layer of the at least one dielectric layer comprises at least one of:

a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, a metal oxide layer, a metal nitride layer, and a metal oxynitride layer.

A method for manufacturing a capacitor, comprising:

preparing a multi-wing structure above a substrate, wherein the multi-wing structure comprises N groups of wing structures and N support structures, each group of wing structures comprises M wing structures arranged in parallel, M limiting grooves are formed in the outer side wall of each support structure, the M wing structures are respectively fixed to the outer side of each support structure through the M limiting grooves, and M and N are positive integers;

preparing a laminated structure on the surface of the multi-wing structure, wherein the laminated structure coats the multi-wing structure and comprises at least one dielectric layer and a plurality of conductive layers, and the at least one dielectric layer and the plurality of conductive layers form a structure in which the conductive layers and the dielectric layers are alternated;

preparing at least one first external electrode and at least one second external electrode, wherein the first external electrode is electrically connected to some or all of the odd-numbered conductive layers in the plurality of conductive layers, and the second external electrode is electrically connected to some or all of the even-numbered conductive layers in the plurality of conductive layers.

The method of claim 26, wherein the side walls of the support structure are recessed inwardly to form the M retaining grooves on the outer side walls of the support structure.

The method of claim 26, wherein the side walls of the support structure are outwardly convex to form the M retaining grooves on the outer side walls of the support structure.

The method of any one of claims 26 to 28, wherein the support structure is columnar or sheet-like.

The method of any one of claims 26 to 28, wherein the support structure is hollow cylindrical or grooved.

The method of any one of claims 26 to 28, wherein the support structure is a T-shaped structure.

The method of claim 31, wherein fabricating the multi-wing structure over the substrate comprises:

preparing a multi-layer structure over the substrate, the multi-layer structure including M layers of a first material layer and M-1 layers of a second material layer, the M layers of the first material layer and the M-1 layers of the second material layer forming a structure in which the first material layer and the second material layer alternate with each other, the first material being different from the second material, and the first material layer being in direct contact with the substrate;

preparing N first grooves extending along a first direction on the basis of the multilayer structure, and removing part of the second material exposed in the N first grooves to form N hollow columnar or groove-shaped first structures made of the first material, wherein the first direction is a direction perpendicular to the substrate;

depositing a third material on the upper surface of the multilayer structure in the N first structures;

and preparing N second grooves extending along the first direction on the basis of the multilayer structure, and removing the second material layer exposed in the N second grooves to form N hollow columnar or groove-shaped second structures made of the first material so as to prepare the multi-wing structure.

The method of any one of claims 26 to 32, wherein the capacitor further comprises: an annular structure located outboard of the N support structures and the N sets of wing structures.

The method of claim 33, wherein the ring-like structure is formed by alternating stacks of M layers of the first material and M-1 layers of the second material.

The method of any one of claims 26 to 34, wherein some or all of the plurality of conductive layers conform to the multi-wing structure.

A method according to any of claims 26 to 34, wherein a portion of the plurality of conductive layers is conformal with the multi-wing structure and another portion of the plurality of conductive layers is complementary in shape to the multi-wing structure.

The method of any one of claims 26 to 36, further comprising:

preparing an isolating ring, wherein the isolating ring is positioned above the outer sides of the N support structures, the isolating ring is used for separating the laminated structure into an inner part and an outer part, and the first external electrode and the second external electrode are only electrically connected with the part, positioned on the inner side of the isolating ring, of the laminated structure.

The method of claim 37, further comprising:

preparing at least one first conductive via structure and at least one second conductive via structure, wherein,

the first conductive via structure is located in the isolation ring, and the second conductive via structure is located in a region outside the isolation ring and close to the center of the capacitor; or the first conductive through hole structure and/or the second conductive through hole structure are/is positioned in a region close to the center of the capacitor outside the isolating ring;

the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.

The method of any one of claims 26 to 38, wherein the multi-winged structure is made of an electrically conductive material, the second external electrode being electrically connected to the multi-winged structure.

The method according to any one of claims 26 to 38, wherein the multi-winged structure comprises a body material and a conductive layer or region of the surface of the body material, and the second external electrode is electrically connected to the multi-winged structure by being electrically connected to the body material and the conductive layer or region of the surface of the body material.

The method of any one of claims 26 to 40, further comprising:

and preparing a filling structure, wherein the filling structure coats the laminated structure and fills a gap formed by the laminated structure.

A method according to any one of claims 26 to 41, wherein wing structures of the N sets of wing structures in contact with the substrate present a discontinuous region between different support structures.

The method of claim 42, wherein the substrate forms a substrate trench at the discontinuous region, the stacked structure further disposed within the substrate trench.

A method according to any of claims 26 to 43, wherein the support structure extends into the substrate.

The method of any one of claims 26 to 44, wherein the preparing at least one first external electrode and at least one second external electrode comprises:

preparing an electrode layer above the laminated structure, wherein the electrode layer comprises at least one first conductive region and at least one second conductive region which are separated from each other, the first conductive region forms the first external electrode, and the second conductive region forms the second external electrode.

The method of any one of claims 26 to 45, further comprising:

preparing an interconnection structure, wherein the first external electrode and/or the second external electrode are electrically connected to the conductive layers in the multilayer conductive layers through the interconnection structure.

The method of claim 46, wherein the interconnect structure comprises at least one insulating layer, at least one first conductive via structure, and at least one second conductive via structure, wherein the first and second conductive via structures extend through the at least one insulating layer, wherein the first external electrode is electrically connected to some or all of the odd-numbered conductive layers of the plurality of conductive layers through the at least one first conductive via structure, and wherein the second external electrode is electrically connected to some or all of the even-numbered conductive layers of the plurality of conductive layers through the at least one second conductive via structure.