阅读说明：本技术 一种fpc线路板镀层的加工方法 (Processing method of FPC circuit board coating ) 是由 路福召 刘梅凤 于 2021-09-13 设计创作，主要内容包括：本发明公开了一种FPC线路板镀层的加工方法,包括以下步骤：电镀液的配置,对用于FPC线路板电镀的电镀液进行配制,将所需原料搅拌混合形成电镀液备用；对FPC线路板的表面进行预处理,将FPC线路板浸泡在酒精中,从而去除FPC线路板表面上的油渍。本发明所述的一种FPC线路板镀层的加工方法,属于FPC线路板领域,在步骤S3中FPC线路板表面喷涂的导电涂层为涂层铜箔,涂布厚度为35微米,该结构能够在FPC线路板表面形成导电涂层,便于通过电镀将锡材料贴合在线路板上,所述步骤S3中FPC线路板表面喷涂的导电涂层烘干采用红外烘干设备,烘干温度为65℃-75℃,烘烤时间为25min,该工艺能够有效快速将涂层贴合在线路板的表面。(The invention discloses a processing method of a plating layer of an FPC (flexible printed circuit) circuit board, which comprises the following steps of: preparing electroplating solution, namely preparing the electroplating solution for electroplating the FPC circuit board, and stirring and mixing the required raw materials to form the electroplating solution for later use; and (3) pretreating the surface of the FPC circuit board, and soaking the FPC circuit board in alcohol so as to remove oil stains on the surface of the FPC circuit board. The invention relates to a processing method of a coating of an FPC (flexible printed circuit) board, belonging to the field of FPC boards, wherein in step S3, a conductive coating sprayed on the surface of the FPC board is coated copper foil, the coating thickness is 35 microns, the structure can form the conductive coating on the surface of the FPC board, so that a tin material can be conveniently attached to the circuit board through electroplating, infrared drying equipment is adopted for drying the conductive coating sprayed on the surface of the FPC board in step S3, the drying temperature is 65-75 ℃, the baking time is 25min, and the process can effectively and quickly attach the coating to the surface of the circuit board.)

1. A processing method of FPC circuit board cladding is characterized by comprising the following steps:

s1, preparing electroplating solution, namely preparing the electroplating solution for electroplating the FPC board, and stirring and mixing the required raw materials to form the electroplating solution for later use;

s2, pretreating the surface of the FPC board, and soaking the FPC board in alcohol to remove oil stains on the surface of the FPC board, or wiping the oil stains on the surface of the flexible circuit board by using No. 120 solvent gasoline dipping cloth;

s3, spraying a conductive coating on the surface of the flexible circuit board, and drying the flexible circuit board for later use;

s4, classifying the FPC circuit boards, distinguishing the FPC circuit boards according to the circuit fineness of the circuit boards, and independently classifying the circuit boards with higher circuit fineness, wherein the circuit with the circuit grade below 3mil or below 3mil is used for independent distinguishing;

s5, hanging the distinguished FPC circuit board on an electroplating clamp, and locking the FPC circuit board, thereby ensuring the normal input of current in the electroplating process;

s6, placing the electroplating clamp fixed with the FPC circuit board into an electroplating cylinder containing the electroplating solution prepared in the step S1, introducing 18V and 50-75A of current, keeping the temperature of the electroplating solution at 20-25 ℃, and finally setting the electroplating time to be 30-75 min;

and S7, after the electroplating of the FPC board is finished, taking down the FPC board from the electroplating clamp and drying the FPC board in the air.

2. The processing method of FPC board cladding of claim 1, characterized in that: the electroplating solution in the step S1 is prepared from the following raw materials of a nitrogen-containing leveling agent, Sn2+:26-32g, free acid: 13-16g, ENSA 3.0-4.0g, graphene: 15.8-27.2g and distilled water.

3. The processing method of FPC board cladding of claim 1, characterized in that: the conductive coating sprayed on the surface of the FPC circuit board in the step S3 is a coated copper foil, and the coating thickness is 35 microns.

4. The processing method of FPC board cladding of claim 1, characterized in that: and in the step S3, the conductive coating sprayed on the surface of the FPC circuit board is dried by adopting infrared drying equipment, the drying temperature is 65-75 ℃, and the baking time is 25 min.

5. The processing method of FPC board cladding of claim 1, characterized in that: the distance between the adjacent conductive clamping points on the electroplating clamp in the step S5 is set as follows: the size of the electroplating clamp is the same as that of the FPC board to be electroplated in the horizontal direction, and the mode of clamping the FPC board by the electroplating clamp is thread fixing or elastic sheet fixing.

6. The processing method of FPC board cladding of claim 1, characterized in that: the electroplating cylinder in the step S6 is additionally provided with a temperature control system.

Technical Field

The invention relates to the field of FPC (flexible printed circuit) boards, in particular to a processing method of a coating of an FPC board.

Background

The FPC board is also called a flexible circuit board, and is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. Meanwhile, flexible circuit boards, also called flexible circuit boards and flexible circuit boards, are favored because they have excellent characteristics such as light weight, thin thickness, and free bending and folding. The copper foil is adhered to the insulating layer by the adhesive. There are many types of insulating film materials, but polyimide and polyester materials are most commonly used. The copper foil as the conductor is suitable for use in flexible circuits, which may be electrodeposited, or plated. The electrodeposited copper foil has a glossy surface on one side and a dull matte surface on the other side. It is a flexible material that can be made in a wide variety of thicknesses and widths, and the matte side of the ED copper foil is often specially treated to improve its adhesion. The wrought copper foil has the characteristics of hardness and smoothness in addition to flexibility, and is suitable for being applied to occasions requiring dynamic deflection. In addition to the adhesive used to bond the insulating film to the conductive material, it can also be used as a cover coat, as a protective coating, and as a covering coating. In the production process of the FPC circuit board, electroplating processing is needed, the traditional electroplating method of the FPC circuit board plating layer becomes the first choice when circuit board suppliers purchase due to the characteristic of high yield and low cost, but the problem of low efficiency exists when the electroplating method is designed, and therefore the electroplating efficiency of the FPC circuit board plating layer is reduced.

Disclosure of Invention

The invention mainly aims to provide a processing method of an FPC circuit board coating, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the invention adopts the technical scheme that:

a processing method of FPC circuit board cladding includes the following steps:

s1, preparing electroplating solution, namely preparing the electroplating solution for electroplating the FPC board, and stirring and mixing the required raw materials to form the electroplating solution for later use;

s2, pretreating the surface of the FPC board, and soaking the FPC board in alcohol to remove oil stains on the surface of the FPC board, or wiping the oil stains on the surface of the flexible circuit board by using No. 120 solvent gasoline dipping cloth;

s3, spraying a conductive coating on the surface of the flexible circuit board, and drying the flexible circuit board for later use;

s4, classifying the FPC circuit boards, distinguishing the FPC circuit boards according to the circuit fineness of the circuit boards, and independently classifying the circuit boards with higher circuit fineness, wherein the circuit with the circuit grade below 3mil or below 3mil is used for independent distinguishing;

s5, hanging the distinguished FPC circuit board on an electroplating clamp, and locking the FPC circuit board, thereby ensuring the normal input of current in the electroplating process;

s6, placing the electroplating clamp fixed with the FPC circuit board into an electroplating cylinder containing the electroplating solution prepared in the step S1, introducing 18V and 50-75A of current, keeping the temperature of the electroplating solution at 20-25 ℃, and finally setting the electroplating time to be 30-75 min;

and S7, after the electroplating of the FPC board is finished, taking down the FPC board from the electroplating clamp and drying the FPC board in the air.

The electroplating solution in the step S1 is prepared from the following raw materials of a nitrogen-containing leveling agent, Sn2+:26-32g, free acid: 13-16g, ENSA 3.0-4.0g, graphene: 15.8-27.2g and distilled water.

The conductive coating sprayed on the surface of the FPC circuit board in the step S3 is a coated copper foil, and the coating thickness is 35 microns.

And in the step S3, the conductive coating sprayed on the surface of the FPC circuit board is dried by adopting infrared drying equipment, the drying temperature is 65-75 ℃, and the baking time is 25 min.

The distance between the adjacent conductive clamping points on the electroplating clamp in the step S5 is set as follows: the size of the electroplating clamp is the same as that of the FPC board to be electroplated in the horizontal direction, and the mode of clamping the FPC board by the electroplating clamp is thread fixing or elastic sheet fixing.

The electroplating cylinder in the step S6 is additionally provided with a temperature control system.

Compared with the prior art, the invention has the following beneficial effects: in the step S3, the conductive coating sprayed on the surface of the FPC circuit board is coated copper foil, the coating thickness is 35 microns, the structure can form the conductive coating on the surface of the FPC circuit board, so that a tin material can be attached to the circuit board through electroplating, infrared drying equipment is adopted for drying the conductive coating sprayed on the surface of the FPC circuit board in the step S3, the drying temperature is 65-75 ℃, the baking time is 25min, and the process can effectively and quickly attach the coating to the surface of the circuit board.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

A processing method of FPC circuit board cladding includes the following steps:

s1, preparing electroplating solution, namely preparing the electroplating solution for electroplating the FPC board, and stirring and mixing the required raw materials to form the electroplating solution for later use;

s2, pretreating the surface of the FPC board, and soaking the FPC board in alcohol to remove oil stains on the surface of the FPC board, or wiping the oil stains on the surface of the flexible circuit board by using No. 120 solvent gasoline dipping cloth;

s3, spraying a conductive coating on the surface of the flexible circuit board, and drying the flexible circuit board for later use;

s4, classifying the FPC circuit boards, distinguishing the FPC circuit boards according to the circuit fineness of the circuit boards, and independently classifying the circuit boards with higher circuit fineness, wherein the circuit with the circuit grade below 3mil or below 3mil is used for independent distinguishing;

s5, hanging the distinguished FPC circuit board on an electroplating clamp, and locking the FPC circuit board, thereby ensuring the normal input of current in the electroplating process;

s6, placing the electroplating clamp fixed with the FPC circuit board into an electroplating cylinder containing the electroplating solution prepared in the step S1, introducing 18V and 50-75A of current, keeping the temperature of the electroplating solution at 20-25 ℃, and finally setting the electroplating time to be 30-75 min;

and S7, after the electroplating of the FPC board is finished, taking down the FPC board from the electroplating clamp and drying the FPC board in the air.

Wherein, the electroplating solution in the step S1 comprises the following raw materials of a nitrogen-containing leveling agent, Sn2+:26-32g, free acid: 13-16g, ENSA 3.0-4.0g, graphene: 15.8-27.2g and distilled water; in the step S3, the conductive coating sprayed on the surface of the FPC circuit board is coated copper foil, and the coating thickness is 35 microns; in the step S3, the conductive coating sprayed on the surface of the FPC circuit board is dried by adopting infrared drying equipment, the drying temperature is 65-75 ℃, and the baking time is 25 min; the distance between the adjacent conductive clamping points on the electroplating clamp in the step S5 is set as follows: the size of the electroplating clamp is the same as that of the FPC board to be electroplated in the horizontal direction, and the mode of clamping the FPC board by the electroplating clamp is thread fixation or elastic sheet fixation; the plating cylinder in step S6 is additionally provided with a temperature control system.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.