阅读说明：本技术 显示结构及电子器件 (Display structure and electronic device ) 是由 刘召军 刘时彪 管云芳 于 2021-08-06 设计创作，主要内容包括：本发明公开了一种显示结构及电子器件,显示结构包括第一基板、LED芯片和反射构件；所述反射构件包括内部具有容纳腔的筒部、沿所述筒部的一端向外延伸的延伸部和横置于所述筒部与所述延伸部交界处的透光片,所述延伸部的内壁和所述筒部的内壁均设置有反射层,所述筒部的背离所述延伸部的一端设有开口；所述LED芯片固定于所述第一基板上,所述反射构件从所述开口套设在所述LED芯片外并落在所述第一基板上,所述LED芯片容纳于所述容纳腔内。本发明能够提高出光的色纯度和光强,以及避免串光。(The invention discloses a display structure and an electronic device, wherein the display structure comprises a first substrate, an LED chip and a reflecting component; the reflecting component comprises a barrel part with an accommodating cavity inside, an extending part extending outwards along one end of the barrel part and a light transmitting sheet transversely arranged at the junction of the barrel part and the extending part, reflecting layers are arranged on the inner wall of the extending part and the inner wall of the barrel part, and an opening is formed in one end, away from the extending part, of the barrel part; the LED chip is fixed on the first substrate, the reflecting component is sleeved outside the LED chip from the opening and falls on the first substrate, and the LED chip is accommodated in the accommodating cavity. The invention can improve the color purity and the light intensity of the emergent light and avoid light crosstalk.)

1. A display structure includes a first substrate, an LED chip, and a reflective member;

the reflecting component comprises a barrel part with an accommodating cavity inside, an extending part extending outwards along one end of the barrel part and a light transmitting sheet transversely arranged at the junction of the barrel part and the extending part, reflecting layers are arranged on the inner wall of the extending part and the inner wall of the barrel part, and an opening is formed in one end, away from the extending part, of the barrel part;

the LED chip is fixed on the first substrate, the reflecting component is sleeved outside the LED chip from the opening and falls on the first substrate, and the LED chip is accommodated in the accommodating cavity.

2. The display structure according to claim 1, wherein the number of the LED chips is plural, and each of the LED chips corresponds to one of the reflective members.

3. The display structure according to claim 2, wherein the first substrate is a first flexible substrate, and further comprising a second flexible substrate, the second flexible substrate is disposed above the LED chips, a surface of the second flexible substrate facing a side of the LED chips is provided with receiving grooves corresponding to the LED chips one to one, each receiving groove is provided with one of the reflective members, an end of the extending portion is connected to a bottom of the receiving groove, the second flexible substrate is connected to the first flexible substrate, and the reflective members are fixed in the receiving grooves by the first flexible substrate and the second flexible substrate.

4. The display structure of claim 2, further comprising more than two display units, each display unit comprising at least two display pixels, each display pixel displaying a different color, each display pixel comprising the LED chip and a luminescent material of a corresponding color, the luminescent material being disposed in the receiving cavity and adjacent to the light transmissive sheet.

5. The structure of claim 4, wherein each of the display units comprises three of the display pixels, and the light-emitting materials of the three display pixels are a red light-emitting material, a blue light-emitting material and a green light-emitting material, respectively.

6. The display structure according to claim 2, further comprising more than two display units, each of the display units comprising at least two display pixels, each of the display pixels displaying a different color, each of the display pixels comprising the LED chips, the LED chips being LED chips displaying corresponding colors, respectively.

7. The display structure according to claim 6, wherein each of the display units includes three of the display pixels, and the LED chips of the three display pixels are LED chips displaying red, blue, and green colors, respectively.

8. The display structure according to any one of claims 1 to 7, wherein the light-transmissive sheet is a filter;

the extension is bowl-shaped.

9. The display structure according to claim 3, wherein a gap is provided between an inner wall of the barrel portion and a side wall of the LED chip; a gap is formed between the outer wall of the cylinder part and the inner wall of the accommodating groove.

10. The display structure of claim 3, wherein the second flexible substrate is connected to the first flexible substrate by a snap-fit structure.

11. The display structure according to claim 10, wherein one of the first flexible substrate and the second flexible substrate is provided with a settling tank, and the other of the first flexible substrate and the second flexible substrate is engaged in the settling tank.

12. The display structure according to claim 10, wherein one of the first flexible substrate and the second flexible substrate is provided with a groove, and the other of the first flexible substrate and the second flexible substrate is provided with a projection which engages with the groove.

13. The display structure as claimed in any one of claims 10 to 12, wherein an adhesive layer is disposed between the engaging structures.

14. The display structure according to any one of claims 1 to 7, wherein an electrode line for supplying power to the LED chip is provided on the first substrate, and the LED chip is electrically connected to the electrode line.

15. An electronic device comprising the display structure according to any one of claims 1 to 14.

Technical Field

The present invention relates to the field of display technologies, and in particular, to a display structure and an electronic device.

Background

Inorganic Light-Emitting diodes (ILED) are conventional semiconductor Light-Emitting devices, and have good photoelectric properties and wide applications. With the development of process technology and the improvement of application requirements, the research trend of the ILED device is that flexibility, miniaturization, array and integration are realized.

At present, in a display structure formed by ILED, it is a common practice to provide P, N electrode lines and a die bonding region on an upper surface of a substrate, and an LED chip is bonded with a solder paste on the die bonding region by a flip chip bonding technique, which mainly has the following disadvantages: color purity is not sufficient. For LEDs, especially micro LEDs, sidewall defects in the LED chip that occur during fabrication can alter the wavelength of light exiting the sidewall, thereby emitting different colors of light from the sidewall, affecting color purity. ② the light emitting efficiency is reduced. The existence of the side wall defects reduces the light extraction efficiency of the LED chip. And thirdly, the phenomenon of light crosstalk is generated. Light between adjacent LED chips influences each other, so that color control of the full-color display structure is not accurate enough.

Disclosure of Invention

The present invention is directed to overcome the above-mentioned defects in the prior art, and provides a display structure and an electronic device, in which a reflective member is added to improve the color purity and light extraction efficiency of an LED chip, and to prevent crosstalk.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a display structure includes a first substrate, an LED chip, and a reflective member;

the reflecting component comprises a barrel part with an accommodating cavity inside, an extending part extending outwards along one end of the barrel part and a light transmitting sheet transversely arranged at the junction of the barrel part and the extending part, reflecting layers are arranged on the inner wall of the extending part and the inner wall of the barrel part, and an opening is formed in one end, away from the extending part, of the barrel part;

the LED chip is fixed on the first substrate, the reflecting component is sleeved outside the LED chip from the opening and falls on the first substrate, and the LED chip is accommodated in the accommodating cavity.

The invention also provides an electronic device comprising the display structure.

The embodiment of the invention has the following beneficial effects:

according to the embodiment of the invention, the reflecting component is arranged, so that the light-emitting color purity and the light-emitting intensity of the LED chip are improved, and light crosstalk is avoided.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Wherein:

fig. 1 is a schematic structural diagram of a display structure according to an embodiment of the invention.

Fig. 2 is a schematic view of the structure of the reflecting member in the structure shown in fig. 1.

Fig. 3 is a schematic structural view of a display structure according to an embodiment of the invention before assembly.

Fig. 4 is a schematic assembled structure of the structure shown in fig. 3.

FIG. 5 is a schematic structural view of a display structure according to another embodiment of the present invention before assembly.

Fig. 6 is a schematic assembled structure of the structure shown in fig. 5.

FIG. 7 is a schematic structural view of a display structure according to another embodiment of the present invention before assembly.

Fig. 8 is a schematic assembled structure of the structure of fig. 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, a display structure includes a first substrate 100, an LED chip 21, and a reflective member 40; the LED display device comprises a plurality of LED chips 21, a plurality of LED chips 21 are arrayed to form a display array, the display array is used for providing image display, each LED chip 21 corresponds to a reflection member 40, each reflection member 40 comprises a cylinder 41 with an accommodating cavity inside, an extension part 42 extending outwards along one end of the cylinder 41 and a light-transmitting sheet 43 transversely arranged at the junction of the cylinder 41 and the extension part 42, the inner walls of the extension part 42 and the cylinder 41 are provided with reflection layers, and one end of the cylinder 41, which is far away from the extension part 42, is provided with an opening 44; the display array, that is, all the LED chips 21 are fixed on the first substrate 100, the reflecting member 40 is sleeved outside the LED chips 21 from the opening 44 and falls on the first substrate 100, the LED chips 21 are accommodated in the accommodating cavity 45 from the opening 44, and the cylindrical portion 41 surrounds the side wall of the LED chips 21. According to the LED chip, the reflecting component 40 is arranged, so that the light-emitting color purity and the light-emitting intensity of the LED chip 21 are improved, and light crosstalk is avoided, the LED chip 21 is arranged in the accommodating cavity 45, the inner wall of the cylinder part is provided with the reflecting layer, the inner wall of the cylinder part has a reflecting effect on light emitted from the side wall of the LED chip 21, the light is emitted from the position right above the light-transmitting sheet after being reflected for multiple times, so that the light-emitting intensity and the color purity of the device are improved, the light emitted from the light-transmitting sheet 43 and scattered to the periphery can be reflected by the inner wall of the extending part 42 and emitted from the position above the light-transmitting sheet 43 through the arrangement of the extending part 42 and the arrangement of the reflecting layer on the inner wall of the extending part 42, and the light crosstalk phenomenon between the adjacent LED chips 21 is avoided.

In this embodiment, the first substrate 100 may be a rigid substrate or a flexible substrate.

In this embodiment, the first substrate 100 is provided with an electrode line for supplying power to each LED chip, and each LED chip is a flip-chip LED chip, that is, the anode and the cathode of the LED chip 21 are both located on the side connected to the first substrate 100.

The invention also provides a preparation method of the display structure, which comprises the following steps:

step 1: a first substrate 100 is provided. Electrode lines are prepared on the first substrate 100.

Step 2: an LED chip 21 is provided, and the LED chip 21 is fixed on the first substrate 100.

The preparation of the display array can be completed and transferred to the blue film through typical LED processes such as cleaning, photoetching, deposition, etching, thinning, scribing and the like. Each LED chip 21 of the display array is bonded to the positive and negative electrical connection ends of the electrode wires on the first substrate 100 by a flip chip bonding machine, completing the mounting of the display array.

And step 3: the above-described reflecting member 40 is provided.

And 4, step 4: the reflecting member 40 is fitted over the LED chip 21 from the opening 44, the LED chip 21 is accommodated in the accommodating chamber 45 from the opening 44, and the cylindrical portion 41 surrounds the side wall of the LED chip 21.

The reflective member 40 may then be secured using known packaging techniques.

When the first substrate 100 is a flexible substrate, if the reflective member 40 is fixed on the first substrate 100, since the reflective member 40 is rigid, and the reflective member 40 is unstable in structure due to bending along with bending of the first substrate 100, the present invention further discloses a flexible display structure, referring to fig. 3 to 8, including a first flexible substrate 10, a second flexible substrate 30, and a display array, where the display array includes two or more LED chips 21, the first flexible substrate 10 is provided with an electrode line for supplying power to each LED chip 21 of the display array, the display array is disposed on the first flexible substrate 10, and each LED chip 21 is fixed on the first flexible substrate 10; the second flexible substrate 30 is disposed above the LED chip 21, the surface of the second flexible substrate 30 facing the LED chip 21 is provided with receiving grooves 31 corresponding to the LED chips 21 one by one, each receiving groove 31 is provided with a reflection member 40, referring to fig. 2, the reflection member 40 includes a barrel 41 having a receiving cavity 45 therein, an extension 42 extending outward along one end of the barrel 41, and a light transmitting sheet 43 transversely disposed at the junction of the barrel 41 and the extension 42, the inner wall of the extension 42 and the inner wall of the barrel 41 are both provided with a reflection layer, the end of the barrel 41 facing away from the extension 42 is provided with an opening 44, the end of the extension 42 is connected to the bottom of the receiving groove 31, the second flexible substrate 30 is connected to the first flexible substrate 10, the LED chip 21 is received in the receiving cavity 45 through the opening 44, the reflection member 40 is fixed in the receiving groove 31 by the first flexible substrate 10 and the second flexible substrate 30 under compression, a flexible display structure is constructed. The second flexible substrate 30 and the first flexible substrate 10 fix the reflective member 40 by pressing, and prevent structural damage caused by bending of the reflective member together with the first flexible substrate 10 or the second flexible substrate 30.

When constructing a full-color flexible display structure, in a specific embodiment, the display array includes more than two display units, each display unit includes at least two display pixels, each display pixel of each display unit displays a different color, each display pixel includes an LED chip 21 and a luminescent material 22 of a corresponding color, and the luminescent material 22 is disposed in the accommodating cavity 45 and adjacent to the light transmissive sheet 43. When the power is on, the LED chip 21 emits light electrically, and the LED chip 21 emits light to excite the luminescent material 22 above the LED chip 21 to emit light of a corresponding color. According to the invention, the luminescent material 22 is arranged in the accommodating cavity 45 of the reflecting member 40, so that the luminescent material 22 is separated from the LED chip 21, and the LED chip 21 is prevented from damaging the luminescent material 22 when being bent along with the first flexible substrate 10, thereby influencing the color conversion efficiency.

In an embodiment, referring to fig. 3 and 4, specifically, each display unit includes three display pixels, and the light-emitting materials 22 of the three display pixels are a red light-emitting material, a blue light-emitting material and a green light-emitting material, respectively, so that full-color display of three colors of red, blue and green can be realized.

Further, a gap is formed between the luminescent material 22 and the LED chip 21, so that the LED chip 21 is prevented from colliding with the luminescent material 22, and the loss of the luminescent material 22 is avoided.

In this embodiment, the light emitting material 22 may be a quantum dot material or a phosphor material. The LED chip 21 may be a solid color LED chip 21. The LED chip 21 includes an N-type layer, an active layer, and a P-type layer, which are sequentially stacked.

In another specific embodiment, referring to fig. 5 and 6, the display array includes more than two display units, each display unit includes at least two display pixels, each display pixel displays different colors, each display pixel includes an LED chip 21, and the LED chips 21 are LED chips 21 displaying corresponding colors, respectively. In the present embodiment, the LED chip 21 emits light of different colors to realize full-color.

Referring to fig. 5 and 6, in a specific embodiment, each display unit includes display pixels of three colors, and the LED chips 21 of each display pixel are LED chips 21 displaying red, blue, and green, respectively.

In the above embodiments, further, the light-transmitting sheet 43 is a filter, and the filter allows light with a narrow wavelength range to exit, so as to further improve the color purity of each display pixel, and facilitate more precise color control. The filter can be set according to the color of the required emergent light, in a specific embodiment, when the emergent light color is green, the green light filter can be used, only the green light of the waveband near 530nm has high transmittance, when the emergent light color is red, the red light filter can be used, only the red light of the waveband near 625nm has high transmittance, when the emergent light color is blue, the blue light filter can be used, and only the blue light of the waveband near 465nm has high transmittance. In a specific embodiment, each display unit includes three display pixels, each display pixel displays red, green, and blue colors, and the corresponding filters are respectively set as a red light filter, a green light filter, and a blue light filter.

In the above embodiments, referring to fig. 1 to 8, the extending portion 42 is bowl-shaped, so that the light scattered by the light-transmitting sheet 43 can be reflected by the inner wall of the extending portion 42 and emitted from the upper side of the light-transmitting sheet 43, thereby preventing the crosstalk.

In each of the above embodiments, further, referring to fig. 1 to 8, a gap is provided between the inner wall of the cylindrical portion 41 and the side wall of the LED chip 21, not only to prevent the LED chip 21 from colliding with the reflective member 40 when the first flexible substrate 10 and the second flexible substrate 30 are bent, but also to provide a large bend of the first flexible substrate 10 and the second flexible substrate 30. A gap is provided between the outer wall of the cylindrical portion 41 and the inner wall of the accommodation groove 31, not only to avoid the reflection member 40 from being crushed and damaged when the second flexible substrate 30 is bent, but also to provide a large bend of the first flexible substrate 10 and the second flexible substrate 30.

In the above embodiments, the second flexible substrate 30 is connected to the first flexible substrate 10 by a snap-fit structure.

Further, an adhesive layer 50 is disposed between the engaging structures to tightly connect the second flexible substrate 30 and the first flexible substrate 10.

Specifically, referring to fig. 3 and 4, in this embodiment, the first flexible substrate 10 is a whole flat plate, the second flexible substrate 30 is provided with a settling tank 32 for accommodating the first flexible substrate 10, the bottom and/or the side wall of the settling tank 32 is provided with an adhesive layer 50, the first flexible substrate 10 is integrally clamped in the settling tank 32, so as to realize the assembly of the whole display structure, the LED chip 21 and the electrode wires are all packaged inside the flexible substrate, and good sealing performance can be further realized. Of course, in another embodiment, the second flexible substrate 30 may be a whole flat plate, a settling tank for accommodating the second flexible substrate 30 is provided on the first flexible substrate 10, and the second flexible substrate 30 is engaged in the settling tank.

Referring to fig. 5 and 6, in this embodiment, the first flexible substrate 10 may not be a whole board, the first flexible substrate 10 is composed of a plurality of independent flexible substrates, a settling tank 32 is disposed around each accommodating groove 31 of the second flexible substrate 30, the bottom and/or the side wall of the settling tank 32 is provided with an adhesive layer 50, and each independent flexible substrate is clamped in the corresponding settling tank 32, so as to achieve the assembly of the whole display structure. In other embodiments, the LED chips 21 may be grouped, with each group of LED chips 21 being disposed on a separate flexible substrate.

Referring to fig. 7 and 8, in the present embodiment, the first flexible substrate 10 is a whole plane plate, the groove 11 is provided on the first flexible substrate 10, the protrusion 33 engaged with the groove 11 is provided on the second flexible substrate 30, the adhesive layer 50 is provided on the engaged surface of the groove 11 and the protrusion 33, and the engagement between the groove 11 and the protrusion 33 realizes the engagement between the first flexible substrate 10 and the second flexible substrate 30. Of course, in other embodiments, the groove 11 may be disposed on the second flexible substrate 30, and the protrusion 33 may be disposed on the first flexible substrate 10.

In each of the above embodiments, the electrode wire is preferably shaped in a wave, which provides a large bend. The first flexible substrate 10 is further provided with a positive electrode electrical connection end and a negative electrode electrical connection end corresponding to each LED chip 21, the positive electrode electrical connection end is connected with the positive electrode of the LED chip 21, and the negative electrode electrical connection end is connected with the negative electrode of the LED chip 21, in each of the above embodiments, the LED chips 21 are flip-chip LED chips, that is, the positive electrode and the negative electrode of the LED chip 21 are both located on one side connected with the first flexible substrate 10.

The invention also provides a preparation method of the flexible display structure, which comprises the following steps:

step 1: a first flexible substrate 10 is provided, on which first flexible substrate 10 electrode lines are provided for supplying power to each LED chip 21 of the display array.

In this step, a dimple pattern of the electrode lines is made on the flexible substrate by a method combining nano-imprinting and photolithography. Then, electrode metal is evaporated in the dents by electron beam evaporation to form electrode wires, specifically, in one embodiment, the electrode wires are Cr/Au electrode wires and have a thickness of 20nm/100 nm. Next, after the photolithography and development, solder is evaporated at a position corresponding to the positive electrode electrical connection terminal and the negative electrode electrical connection terminal to form a positive electrode electrical connection terminal and a negative electrode electrical connection terminal, and specifically, SAC tin-silver-copper alloy solder can be evaporated by a resistance evaporator to have a height of about 2 μm.

Step 2: providing a display array, wherein the display array comprises more than two LED chips 21, fixing the display array on the first flexible substrate 10, and electrically connecting each LED chip 21 with the corresponding electrode wire to obtain the first flexible substrate 10 provided with the display array.

In the step, the display array is formed by the existing process method, and the preparation of the display array can be completed and transferred to the blue film through typical LED processes such as cleaning, photoetching, deposition, etching, thinning, scribing and the like. Through the flip-chip bonding machine, bond every LED chip 21 that will show the array and the anodal electricity link end and the negative pole electricity link end of the electrode line on the first flexible substrate 10, accomplish the installation that shows the array.

And step 3: a second flexible substrate 30 is provided, and accommodating grooves 31 corresponding to the LED chips 21 one to one are formed in a surface of the second flexible substrate 30 facing the LED chips 21.

In this step, the accommodating groove 31 may be formed on the flexible substrate by nanoimprint, lithography, or laser burning.

And 4, step 4: referring to fig. 7, a reflective member 40 is provided, the reflective member 40 includes a cylindrical portion 41 having an accommodating cavity 45 therein, an extending portion 42 extending outward along one end of the cylindrical portion 41, and a light transmissive sheet 43 disposed transversely at a boundary between the cylindrical portion 41 and the extending portion 42, an inner wall of the extending portion 42 and an inner wall of the cylindrical portion 41 are both provided with a reflective layer, and one end of the cylindrical portion 41 facing away from the extending portion 42 is provided with an opening 44.

And 5: the opening 44 of the receiving groove 31 of the second flexible substrate 30 is placed upward, one reflecting member 40 is disposed in each receiving groove 31, and the end of the extending portion 42 is connected to the bottom of the receiving groove 31, thereby obtaining the second flexible substrate 30 mounted with the reflecting member 40.

Step 6: when it is necessary to fill the luminescent material 22 in the reflective member 40, the luminescent material 22 may be filled up to the bottom of the cylindrical portion 41 (i.e., on the light transmissive sheet 43) by ink jet printing or the like. The luminescent material 22 may be filled before the reflective member 40 is mounted, or the luminescent material 22 may be filled after the reflective member 40 is mounted.

And 7: an adhesive layer 50 is applied to the corresponding location of the second flexible substrate 30.

And 8: the first flexible substrate 10 mounted with the display array is connected with the second flexible substrate 30 mounted with the reflection member 40, so that the LED chip 21 is accommodated in the accommodating cavity 45 from the opening 44, and the reflection member 40 is fixed in the accommodating groove 31 by the first flexible substrate 10 and the second flexible substrate 30 in a pressing manner, thereby forming the display structure.

The first flexible substrate 10 on which the display unit is mounted and the second flexible substrate 30 on which the reflective member 40 is mounted are connected, so that the LED chip 21 is accommodated in the accommodating cavity 45 through the opening 44, and the reflective member 40 is fixed by pressing the first flexible substrate 10 and the second flexible substrate 30, thereby forming the display structure.

The invention also discloses an electronic device comprising the display structure. The electronic device may be a television, a tablet, a mobile phone, a computer, a screen, etc.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.