阅读说明：本技术 金属中框及其馈点面的处理方法、壳体组件和电子设备 (Metal middle frame and processing method of feed point surface thereof, shell assembly and electronic equipment ) 是由 仰坪炯 于 2020-04-30 设计创作，主要内容包括：本申请提供了金属中框及其馈点面的处理方法、壳体组件和电子设备。金属中框馈点面的处理方法包括：提供金属中框；对金属中框的预定区域的表面进行激光重熔,以便得到馈点面。由此,经过激光重熔处理的金属中框的表面具有较佳的表面硬度,可以显著地降低馈点面的磨损,进而缓解馈点面氧化所带来的接触不良的风险；经过激光重熔处理的金属中框的表面具有较低的表面粗糙度,能够有效降低弹片与馈点面之间的摩擦系数,缓解磨料的产生,抑制馈点面的氧化和接触不良的问题；而且较低的表面粗糙度可以抑制馈点面吸附空气中水汽而发生氧化腐蚀的现象,进而确保馈点面的接触稳定性；同时,上述处理方法简单易实施,成本较低,便于工业化管理和量产。(The application provides a metal middle frame, a processing method of a feed point surface of the metal middle frame, a shell assembly and electronic equipment. The processing method of the metal middle frame feed point surface comprises the following steps: providing a metal middle frame; and carrying out laser remelting on the surface of a preset area of the metal middle frame so as to obtain a feed point surface. Therefore, the surface of the metal middle frame subjected to laser remelting has better surface hardness, so that the abrasion of the feed point surface can be remarkably reduced, and the risk of poor contact caused by oxidation of the feed point surface is further relieved; the surface of the metal middle frame subjected to laser remelting has lower surface roughness, so that the friction coefficient between the elastic sheet and the feed point surface can be effectively reduced, the generation of abrasive is relieved, and the problems of oxidation and poor contact of the feed point surface are inhibited; the lower surface roughness can inhibit the feed point surface from absorbing water vapor in the air to generate oxidation corrosion, thereby ensuring the contact stability of the feed point surface; meanwhile, the treatment method is simple and easy to implement, has low cost and is convenient for industrial management and mass production.)

1. A processing method of a metal middle frame feed point surface is characterized by comprising the following steps:

providing a metal middle frame;

and carrying out laser remelting on the surface of a preset area of the metal middle frame so as to obtain the feed point surface.

2. The method of claim 1, wherein the laser remelting is performed in a protective atmosphere.

3. The method according to claim 1 or 2, wherein the condition of the laser remelting satisfies at least one of the following conditions:

the laser power is 10W-500W;

the sweeping speed is 10 mm/s-5000 mm/s;

the pulse width of Q is 10 ns-1000 ns;

the frequency is 1000 Hz-4000000 Hz.

4. The method of claim 1, further comprising, prior to performing the laser remelting: and carrying out cleaning treatment on the surface of the predetermined area, wherein the cleaning treatment method is selected from CNC or laser carving.

5. The method of claim 1, wherein the thickness of the metal middle frame subjected to the laser remelting is 20-50 micrometers.

6. The method of claim 1 or 4, further comprising: and coating lubricating oil on the surface of the preset area subjected to the laser remelting.

7. A metal middle frame, characterized in that the feed point surface of the metal middle frame is obtained by the processing method of any one of claims 1-6.

8. The metal middle frame according to claim 7, wherein the material of the metal middle frame is aluminum alloy, and the Vickers hardness of the surface of the feed point surface is 130HV 0.3-160 HV 0.3.

9. The metal middle frame according to claim 8, wherein the surface roughness Ra of the feed point surface is 0.21-0.44.

10. A housing assembly comprising a metal middle frame as claimed in any one of claims 7 to 9.

11. An electronic device, comprising:

the housing assembly of claim 10;

the display screen assembly is connected with the shell assembly, an installation space is defined between the display screen assembly and the shell assembly, and a feed point surface of a metal middle frame of the shell assembly faces the display screen assembly; and

the main board is arranged in the installation space and electrically connected with the display screen assembly, a metal elastic sheet is arranged on the main board, and the metal elastic sheet is in surface contact with the feed point.

Technical Field

The application relates to the technical field of electronic equipment, in particular to a metal middle frame and a processing method of a feed point surface of the metal middle frame, a shell assembly and electronic equipment.

Background

In the wireless terminal equipment, after a mainboard radio frequency signal is generated, the signal is properly processed and guided into the metal middle frame through the feed point, finally, the transmission and the reception of the antenna signal are realized by the metal middle frame, the feed point is used as a connection point of the mainboard and the metal middle frame, and the transmission and the reception of the wireless signal are directly influenced by the contact reliability of the feed point. At present, the connection structure of the antenna feed point mainly comprises three connection structures of screw connection, spring plate-middle frame laser etching and spring plate-gold-plated copper sheet, but the three connection modes have many defects and influence the reliability of the feed point contact.

Therefore, research on the metal middle frame feed point is awaited.

Disclosure of Invention

The present application is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present application is to provide a method for processing a metal middle frame feed point surface, where the surface hardness of the feed point surface processed by the method is better, the surface roughness is lower, and the reliability of an antenna feed point link structure can be effectively improved.

In one aspect of the application, a method for processing a metal middle frame feed point surface is provided. According to the embodiment of the application, the processing method of the metal middle frame feed point surface comprises the following steps: providing a metal middle frame; and carrying out laser remelting on the surface of a preset area of the metal middle frame so as to obtain the feed point surface. Therefore, the surface of the metal middle frame subjected to laser remelting has better surface hardness, so that the abrasion of the feed point surface can be remarkably reduced, and the risk of poor contact caused by oxidation of the feed point surface is further relieved; the surface of the metal middle frame subjected to laser remelting has lower surface roughness, so that the friction coefficient between the elastic sheet and the feed point surface can be effectively reduced, the generation of abrasive is relieved, and the problems of oxidation and poor contact of the feed point surface are inhibited; the lower surface roughness can inhibit the feed point surface from absorbing water vapor in the air to generate oxidation corrosion, thereby ensuring the contact stability of the feed point surface; meanwhile, the treatment method is simple and easy to implement, has low cost and is convenient for industrial management and mass production.

In another aspect of the present application, the present application provides a metal bezel. According to the embodiment of the application, the feed point surface of the metal middle frame is obtained by the processing method of the feed point surface of the metal middle frame. Therefore, the surface hardness, the surface roughness and the corrosion resistance of the feed point surface of the metal middle frame are better, the contact with the elastic sheet on the mainboard of the electronic equipment is good, the friction resistance between the elastic sheet and the feed point surface is high, and the contact reliability between the elastic sheet and the feed point surface is obviously improved. As can be understood by those skilled in the art, the metal middle frame has all the features and advantages of the processing method of the feed point surface of the metal middle frame, which are not described in detail herein.

In yet another aspect of the present application, a housing assembly is provided. According to an embodiment of the application, the housing assembly comprises a metal middle frame as described above. Therefore, the surface hardness, the surface roughness and the corrosion resistance of the feed point surface of the metal middle frame of the metal shell are better, the contact with the elastic sheet on the mainboard of the electronic equipment is good, the friction resistance between the elastic sheet and the feed point surface is high, and the contact reliability between the elastic sheet and the feed point surface is obviously improved. Those skilled in the art will appreciate that the housing assembly has all of the features and advantages of the metal bezel previously described and will not be described in detail herein.

In yet another aspect of the present application, an electronic device is provided. According to an embodiment of the present application, the electronic device includes: the housing assembly described above; the display screen assembly is connected with the shell assembly, an installation space is defined between the display screen assembly and the shell assembly, and a feed point surface of a metal middle frame of the shell assembly faces the display screen assembly; the main board is arranged in the installation space and electrically connected with the display screen assembly, a metal elastic sheet is arranged on the main board, and the metal elastic sheet is in surface contact with the feed point. Therefore, the contact reliability between the elastic sheet on the mainboard of the electronic equipment and the feed point surface of the metal middle frame is high, and the overall performance of the electronic equipment can be improved. Those skilled in the art will appreciate that the electronic device has all the features and advantages of the metal bezel described above, and thus, the detailed description thereof is omitted.

Drawings

FIG. 1 is a flow chart of a method for processing a metal middle frame feed point surface in one embodiment of the present application.

Fig. 2 is a flow chart of a method for processing a metal middle frame feed point surface in another embodiment of the present application.

Fig. 3 is a schematic structural diagram of an electronic device in another embodiment of the present application.

FIG. 4 is a scanning electron micrograph of a center frame feed point surface in example 1.

Fig. 5 is a scanning electron micrograph of the middle frame feed point surface in comparative example 1.

Detailed Description

Embodiments of the present application are described in detail below. The following description of the embodiments is merely exemplary in nature and is in no way intended to limit the present disclosure. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications.

The present application was made by the inventors through the following persons and findings:

at present, the feed point connection mode between the metal middle frame and the mainboard can adopt a spring plate-middle frame laser etching mode, and is specific: the gold-plated elastic sheet is welded on the main board in a soldering mode, the oxide skin or a pollution layer on the surface of a preset area (used for forming a feed point surface) of the metal middle frame is removed in a laser etching mode, clean metal middle frame alloy materials are exposed, the elastic sheet abuts against the area of the metal middle frame alloy etching after assembly, and finally electric connection between the main board and the metal middle frame is achieved. However, the inventor finds that the contact reliability between the elastic sheet and the feed point surface is poor, and the antenna performance is further affected, mainly because: 1. compared with the elastic sheet, the surface hardness of the feed point surface is lower, and the metal of the feed point surface is severely abraded due to repeated friction of the elastic sheet on the feed point surface in the processes of drop test and subsequent use, so that the surface contact resistance is increased, and the electric connection between the main board and the middle frame is finally influenced; 2. the surface roughness of the feed point surface is large, and the risk of oxidation corrosion caused by a large amount of adsorbed water vapor exists when the feed point surface runs in a high-temperature and high-humidity environment for a long time, so that the contact reliability between the elastic sheet and the feed point surface is seriously influenced. In view of the above defects, the inventors found that the remelting treatment can be performed on the surface metal material in a predetermined region (for forming the feed point surface) of the metal middle frame by using a laser remelting method (i.e., melting the metal material by using laser energy, and then rapidly cooling the metal material to become a solid state), so that the surface hardness of the feed point surface can be improved, the surface roughness can be reduced, and the contact reliability between the elastic piece and the feed point surface can be greatly improved.

In view of the above, in one aspect of the present application, a method for processing a metal middle frame feed point surface is provided. According to the embodiment of the application, referring to fig. 1, the processing method of the metal middle frame feed point surface comprises the following steps:

s100: providing a metal middle frame.

According to the embodiment of the application, the specific material of the metal middle frame has no special requirement, and a person skilled in the art can flexibly select the material according to the actual requirement. In some embodiments, the material of the metal middle frame includes, but is not limited to, aluminum alloy, titanium alloy, magnesium alloy, or stainless steel.

S200: and carrying out laser remelting on the surface of a preset area of the metal middle frame so as to obtain a feed point surface.

According to the embodiment of the application, the surface of the metal middle frame subjected to laser remelting has better surface hardness, so that the abrasion of the feed point surface can be remarkably reduced, and the risk of poor contact caused by oxidation of the feed point surface is further relieved; the surface of the metal middle frame subjected to laser remelting has lower surface roughness, so that the friction coefficient between the elastic sheet and the feed point surface can be effectively reduced, the generation of abrasive is relieved, and the problems of oxidation and poor contact of the feed point surface are inhibited; the lower surface roughness can inhibit the phenomenon that the feed point surface adsorbs water vapor in the air to generate oxidation corrosion, namely, the wear resistance and the oxidation resistance of the feed point surface are improved, and further the contact stability of the feed point surface is ensured; meanwhile, the treatment method is simple and easy to implement, has low cost and is convenient for industrial management and mass production.

Furthermore, the surface roughness of the feed point surface after laser remelting is reduced, so that the adsorption of water vapor in the feed point surface can be effectively inhibited, the oxidation corrosion process caused by the adsorption of the water vapor is further inhibited, and the stability of the feed point contact is ensured. In some embodiments, laser etching (only removing oxide skin and pollution layer in a predetermined area) and laser remelting are respectively performed on the feed point surface of the die-cast Al-10Si (an aluminum alloy material) middle frame, and the middle frame is placed in a constant-temperature and constant-humidity environment with the temperature of 65 ℃ and the humidity of 95% for 96 hours, and then taken out and tested for surface resistance by using an universal meter. Through tests, the resistance of the feed point surface of the laser engraving is in the interval of 1.5-2.7 omega, and the resistance of the feed point surface of the laser remelting is in the interval of 0.24-1.45 omega, so that the corrosion and oxidation resistance of the feed point surface after the laser remelting treatment is obviously improved.

The reason why the laser remelting can improve the surface hardness of the feed point surface is mainly shown as the following two points: 1. surface grain refinement: this is because the metal on the surface of the feed point after laser heating is melted, but the surface area of the whole middle frame is far larger than that of the feed point actually processed, and the high heat at the feed point is rapidly dissipated, so that the melted surface of the area is rapidly cooled, and the grain refinement effect is generated. (2) And (4) solid solution strengthening. After laser treatment, the metal is in a molten state, alloy elements in the metal cannot be precipitated in time in the high-speed cooling process, and finally the alloy elements only can be remained in the inner part of the middle frame matrix in a solid solution state, so that an obvious solid solution strengthening effect is generated. Due to the two reasons, the surface hardness of the feed point surface after remelting is greatly improved.

The reason why the laser remelting can reduce the surface roughness of the feed point surface is as follows: because the metal melt has certain fluidity, the melt tends to be flattened under the action of surface tension, so that the surface roughness of the finally obtained remelted feed point surface is obviously reduced.

Further, before performing the subsequent laser remelting, referring to fig. 2, the method further includes S300: and (3) carrying out cleaning treatment on the surface of the predetermined area, wherein the cleaning treatment method is selected from CNC or laser etching. Therefore, pollutants on the surface of the predetermined area can be well removed, so that the surface hardness of the feed point surface is improved, and the surface roughness is reduced. The specific conditions of CNC and laser etching have no special requirements, and the skilled person can design flexibly according to actual requirements, and redundant description is omitted here.

Further, the laser remelting is performed under a protective atmosphere. Wherein the gas of the protective atmosphere is at least one selected from nitrogen, argon and helium. Therefore, the metal material can be well prevented from being oxidized in the remelting process.

According to the embodiment of the application, the laser adopted in the laser remelting can be continuous light or pulse light. Wherein the laser remelting condition meets at least one of the following conditions:

the laser power is 10-500W (such as 10W, 50W, 100W, 150W, 200W, 250W, 300W, 350W, 400W, 450W and 500W); the sweeping speed is 10-5000 mm/s (such as 10mm/s, 50mm/s, 100mm/s, 500mm/s, 1000mm/s, 1500mm/s, 1800mm/s, 2000mm/s, 2400mm/s, 2500mm/s, 3000mm/s, 3500mm/s, 4000mm/s, 4500mm/s, 5000 mm/s); the Q pulse width is 1-1000 ns (such as 1ns, 10ns, 30ns, 50ns, 100ns, 150ns, 200ns, 300ns, 600ns, 700ns, 800ns, 900ns, 1000 ns); the frequency is 1000-4000000 Hz (such as 1000Hz, 5000Hz, 10000Hz, 50000Hz, 100000Hz, 500000Hz, 1000000Hz, 2000000Hz, 3000000Hz, 4000000 Hz). Therefore, under the conditions, a metal material with a certain thickness (namely, the metal material for forming the metal middle frame) can be melted, and the improvement of the surface hardness and the reduction of the surface roughness of the feed point are facilitated; if the power, the sweeping speed, the Q pulse width or the frequency is smaller, the thickness of the molten metal material can be thinner, and the improvement effect on the surface hardness and the surface roughness of the feed point surface is relatively poorer; if the power, the sweep rate, the Q pulse width, or the frequency is too large, the thickness of the molten metal material is thick, and further, the structure of the feed point surface and the metal middle frame area near the feed point surface may deform to some extent, which affects the appearance structure and the appearance effect of the metal middle frame.

The thickness of the metal middle frame subjected to laser remelting is 20-50 micrometers, such as 20 micrometers, 25 micrometers, 30 micrometers, 35 micrometers, 40 micrometers, 45 micrometers or 50 micrometers. Therefore, after the metal material with the thickness is remelted, the surface hardness of the feed point surface can be better improved, the surface roughness of the feed point surface is reduced, and the appearance structure of the metal middle frame is ensured not to be changed; if the thickness of the metal middle frame subjected to laser remelting is less than 20 micrometers, the improvement effect on the surface hardness and the surface roughness of the feed point surface is relatively poor; if the thickness of the metal middle frame after laser remelting is larger than 50 micrometers, the structure of the feed point surface and the metal middle frame area nearby the feed point surface may deform to some extent, and the appearance structure and the appearance effect of the metal middle frame are affected.

Further, the processing method of the metal middle frame feed point surface further comprises the following steps: and coating lubricating oil on the surface of the preset area subjected to laser remelting. Therefore, after the lubricating oil is coated, on one hand, the friction coefficient between the elastic sheet on the main board and the remelted feed point surface of the electronic equipment in the use process can be further reduced, and the generation of abrasive materials worn by the feed point surface is weakened; on the other hand, lubricating oil can play the effect of isolated air, therefore can effectively alleviate and present the oxidation corrosion of some face under the high temperature and high humidity environment, ensure the contact stability of shell fragment and present some face.

The contact oil has good lubricating, anti-wear and anti-oxidation effects, and can effectively ensure good contact and contact stability between the elastic sheet and the feed point surface.

According to the embodiment of the application, the material of the metal middle frame is aluminum alloy, and the Vickers hardness of the surface of the feed point surface obtained by the treatment method is 130HV 0.3-160 HV0.3 (such as 130HV0.3, 133HV0.3, 135HV0.3, 138HV0.3, 140HV0.3, 143HV0.3, 145HV0.3, 148HV0.3, 150HV0.3, 153HV0.3, 150HV0.3, 158HV0.3 and 160HV 0.3). Compared with a feed point surface directly subjected to laser engraving (or the surface hardness of the feed point surface before laser remelting is about 110), the surface hardness of the feed point surface subjected to laser remelting is effectively improved. It should be noted that the vickers hardness test conditions herein are: a force of 300g was applied to the feed point surface, and the load was maintained for 10 seconds.

According to the embodiment of the application, the material of the metal middle frame is aluminum alloy, and the surface roughness Ra of the feed point surface obtained by the treatment method is 0.21-0.44, such as Ra of 0.21, 0.25, 0.28, 0.30, 0.32, 0.35, 0.38 and 0.40.

In another aspect of the present application, the present application provides a metal bezel. According to the embodiment of the application, the feed point surface of the metal middle frame is obtained by the processing method of the feed point surface of the metal middle frame. Therefore, the surface hardness, the surface roughness and the corrosion resistance of the feed point surface of the metal middle frame are better, the contact with the elastic sheet on the mainboard of the electronic equipment is good, the friction resistance between the elastic sheet and the feed point surface is high, and the contact reliability between the elastic sheet and the feed point surface is obviously improved. As can be understood by those skilled in the art, the metal middle frame has all the features and advantages of the processing method of the feed point surface of the metal middle frame, which are not described in detail herein.

Wherein, the material of the metal middle frame is aluminum alloy, and the surface hardness of the feed point surface is 130HV 0.3-160 HV0.3 (such as 130HV0.3, 133HV0.3, 135HV0.3, 138HV0.3, 140HV0.3, 143HV0.3, 145HV0.3, 148HV0.3, 150HV0.3, 153HV0.3, 150HV0.3, 158HV0.3, 160HV 0.3). Compared with a feed point surface directly subjected to laser engraving (or the surface hardness of the feed point surface before laser remelting is about 110HV0.3), the surface hardness of the feed point surface subjected to laser remelting is effectively improved.

Further, the surface roughness Ra of the feed point surface is 0.21-0.44. For example, Ra is 0.21, 0.25, 0.28, 0.30, 0.32, 0.35, 0.38, 0.40. It can be seen that the surface roughness of the laser remelted feed point surface is low.

In yet another aspect of the present application, a housing assembly is provided. According to an embodiment of the application, the housing assembly comprises a metal middle frame as described above. Therefore, the surface hardness, the surface roughness and the corrosion resistance of the feed point surface of the metal middle frame of the metal shell are better, the contact with the elastic sheet on the mainboard of the electronic equipment is good, the friction resistance between the elastic sheet and the feed point surface is high, and the contact reliability between the elastic sheet and the feed point surface is obviously improved. Those skilled in the art will appreciate that the housing assembly has all of the features and advantages of the metal bezel previously described and will not be described in detail herein.

According to the embodiment of the application, the housing assembly comprises the battery rear cover and the middle frame, wherein the battery rear cover and the middle frame can be two independent structures connected together or can be an integral structure, and a person skilled in the art can flexibly select the structure according to actual conditions without special limitation requirements.

In yet another aspect of the present application, an electronic device is provided. According to an embodiment of the present application, referring to fig. 3, the electronic device 1000 includes: the housing assembly 100 described above; the display screen assembly 200, the display screen assembly 200 is connected with the shell assembly 100, an installation space is defined between the display screen assembly 200 and the shell assembly 100, and the feed point surface of the metal middle frame of the shell assembly 100 is arranged towards the display screen assembly 200; and a main board (not shown in fig. 3), the main board being disposed in the installation space and electrically connected to the display screen assembly, and a metal spring being disposed on the main board and in contact with the feed point surface. Therefore, the contact reliability between the elastic sheet on the mainboard of the electronic equipment and the feed point surface of the metal middle frame is high, and the overall performance of the electronic equipment can be improved. Those skilled in the art will appreciate that the electronic device has all the features and advantages of the metal bezel described above, and thus, the detailed description thereof is omitted.

Examples

Example 1

Providing an Al-10Si aluminum alloy middle frame;

cleaning a preset area of the aluminum alloy middle frame by using a laser etching method to expose the metal surface of the middle frame;

performing laser remelting treatment on a preset area of the Al-10Si aluminum alloy middle frame by using pulse laser, wherein the laser power of the pulse laser is 75W; the sweeping speed is 100 mm/s; the Q pulse width is 30 ns; the frequency is 4000kHz, and a feed point surface is obtained.

Comparative example 1

Providing an Al-10Si aluminum alloy middle frame;

and cleaning the preset area of the aluminum alloy middle frame by using a laser etching method to expose the metal surface of the middle frame, namely the feed point surface.

The feeding point surfaces in the example 1 and the comparative example 1 are respectively subjected to electron microscope scanning, and an electron microscope scanning image of the feeding point surface in the example 1 is shown in fig. 4 (the laser remelting surface marked in fig. 4 is the feeding point surface, and the marked CNC surface is the metal middle frame surface which is adjacent to the feeding point surface and is not subjected to laser remelting treatment), and an electron microscope scanning image of the feeding point surface in the comparative example 1 is shown in fig. 5. Therefore, the surface smoothness of the feed point surface subjected to laser remelting is better, and the surface roughness is lower.

The feed point surfaces in example 1 and comparative example 1 were tested for vickers hardness and surface roughness, respectively, with the vickers hardness of the surface of the feed point surface of example 1 being 150HV0.3 and the surface roughness Ra being 0.37; the feed point surface of comparative example 1 had a Vickers hardness of 110HV0.3 and a surface roughness Ra of 0.60.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.