阅读说明：本技术 一种双面线路触摸屏结构及其制备方法 (Double-sided circuit touch screen structure and preparation method thereof ) 是由 王超 余志辉 钟素文 夏大映 于 2021-09-13 设计创作，主要内容包括：本发明提供一种应用于触摸屏技术领域的双面线路触摸屏制备方法,本发明还提供一种双面线路触摸屏结构,所述的双面线路触摸屏制备方法的制备步骤为：基材(1)A面形成A面Metal层(2),基材(1)B面形成B面Metal层(3)；A面Metal层(2)黄光显影,B面Metal层(3)黄光显影；A面Metal层(2)和B面Metal层(3)蚀刻；形成A面ITO层(5),B面Metal层(3)外进行ITO镀膜,形成B面ITO层(6)；A面ITO层(5)显影,B面ITO层(6)显影,A面ITO层(5)蚀刻,B面ITO层(6)蚀刻,本发明所述的双面线路触摸屏结构及制备方法,相比现有技术能够减少之别步骤,降低产品生产成本,从而有效降低制备成本,提高制备效率。(The invention provides a double-sided circuit touch screen manufacturing method applied to the technical field of touch screens, and also provides a double-sided circuit touch screen structure, wherein the double-sided circuit touch screen manufacturing method comprises the following steps: a surface A Metal layer (2) is formed on the surface A of the substrate (1), and a surface B Metal layer (3) is formed on the surface B of the substrate (1); yellow developing is carried out on the surface A Metal layer (2), and yellow developing is carried out on the surface B Metal layer (3); etching the A surface Metal layer (2) and the B surface Metal layer (3); an A surface ITO layer (5) is formed, and ITO coating is carried out outside the B surface Metal layer (3) to form a B surface ITO layer (6); compared with the prior art, the double-sided circuit touch screen structure and the preparation method can reduce other steps and reduce the production cost of products, thereby effectively reducing the preparation cost and improving the preparation efficiency.)

1. A preparation method of a double-sided circuit touch screen is characterized by comprising the following steps: the preparation method of the double-sided circuit touch screen comprises the following preparation steps:

s1, coating a Metal film on the surface A of a substrate (1) to form a Metal layer (2) on the surface A, and coating a Metal film on the surface B of the substrate (1) to form a Metal layer (3) on the surface B;

s2, yellow light development is carried out on the surface A Metal layer (2) on the surface A of the base material (1), and yellow light development is carried out on the surface B Metal layer (3) on the surface B of the base material (1);

s3, etching the A surface Metal layer (2) and the B surface Metal layer (3);

s4, carrying out ITO film coating on the outside of the A surface Metal layer (2) to form an A surface ITO layer (5), and carrying out ITO film coating on the outside of the B surface Metal layer (3) to form a B surface ITO layer (6);

and S5, developing the A-surface ITO layer (5), developing the B-surface ITO layer (6), etching the A-surface ITO layer (5) and etching the B-surface ITO layer (6) to finish the preparation of the double-sided circuit touch screen.

2. The method for manufacturing a double-sided circuit touch screen according to claim 1, wherein the method comprises the following steps: when the Metal coating on the surface A of the base material (1) and the Metal coating on the surface B of the base material (1) are carried out simultaneously, the Metal coating is carried out simultaneously.

3. The method for manufacturing a double-sided circuit touch screen according to claim 1 or 2, characterized in that: when the A surface Metal layer (2) and the B surface Metal layer (3) are etched, the etching is carried out simultaneously.

4. The method for manufacturing a double-sided circuit touch screen according to claim 1 or 2, characterized in that: when the ITO coating is carried out outside the A surface Metal layer (2) and the ITO coating is carried out outside the B surface Metal layer (3), the ITO coating is carried out simultaneously.

5. The method for manufacturing a double-sided circuit touch screen according to claim 1 or 2, characterized in that: and when the A-surface ITO layer (5) is etched and the B-surface ITO layer (6) is etched, the etching is carried out simultaneously.

6. The method for manufacturing a double-sided circuit touch screen according to claim 1 or 2, characterized in that: the base material (2) is cleaned firstly, and then the base material (2) is subjected to Metal coating.

7. The method for manufacturing a double-sided circuit touch screen according to claim 1 or 2, characterized in that: and cleaning the Metal layer of the substrate (2), and then performing ITO film coating.

8. The method for manufacturing a double-sided circuit touch screen according to claim 1 or 2, characterized in that: the wiring of the A-surface Metal layer (2) is arranged below the wiring of the A-surface ITO layer (5), and the line width of the wiring of the A-surface Metal layer (2) is smaller than the line width of the wiring of the A-surface ITO layer (5); the wiring of the Metal layer (3) on the B surface is arranged below the wiring of the ITO layer (6) on the B surface, and the line width of the wiring of the Metal layer (3) on the B surface is smaller than the line width of the wiring of the ITO layer (6) on the B surface.

9. The utility model provides a two-sided circuit touch-sensitive screen structure which characterized in that: the double-sided circuit touch screen structure comprises a substrate (1), wherein a surface A Metal coating film of the substrate (1) forms a surface A Metal layer (2), a surface B Metal coating film of the substrate (1) forms a surface B Metal layer (3), an A surface ITO layer (5) is formed by an ITO coating film outside the surface A Metal layer (2), and a B surface ITO layer (6) is formed by an ITO coating film outside the surface B Metal layer (3).

10. The dual-sided wiring touch screen structure of claim 9, wherein: the ITO layer is indium tin oxide, and the Metal layer is made of Mo/Al/Mo material or Cu material.

Technical Field

The invention belongs to the technical field of touch screens, and particularly relates to a preparation method of a double-sided circuit touch screen.

Background

In the preparation of the double-sided circuit touch screen, the production process of double-sided ITO and double-sided Metal products is complex (other processes such as A-side ITO film coating, A-side ITO yellow light development, A-side ITO etching and film removing, B-side ITO film coating, B-side ITO yellow light development, A-side ITO pattern protection, B-side ITO etching and film removing, B-side Metal film coating, B-side Metal yellow light development, B-side Metal etching and film removing, A-side Metal film coating, A-side Metal yellow light development, B-side Metal pattern protection, A-side Metal etching and film removing, A/B-side Metal circuit OC protection or silk-screen insulating ink and the like), the production process is long (15 steps in total), and the production cost is high.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: aiming at the defects of the prior art, the preparation method of the double-sided circuit touch screen is simple in step, can reduce other steps compared with the prior art, and reduces the production cost of products, so that the preparation cost is effectively reduced, and the preparation efficiency is improved.

To solve the technical problems, the invention adopts the technical scheme that:

the invention relates to a preparation method of a double-sided circuit touch screen, which comprises the following steps:

s1, coating a Metal film on the surface A of a substrate to form a Metal layer on the surface A, and coating a Metal film on the surface B of the substrate to form a Metal layer on the surface B;

s2, yellow light developing is conducted on the Metal layer on the surface A of the substrate A, and yellow light developing is conducted on the Metal layer on the surface B of the substrate B, wherein the Metal layer on the surface A is the surface A;

s3, etching the A surface Metal layer and the B surface Metal layer;

s4, performing ITO film coating outside the A surface Metal layer to form an A surface ITO layer, and performing ITO film coating outside the B surface Metal layer to form a B surface ITO layer;

and S5, developing the A-surface ITO layer, developing the B-surface ITO layer, etching the A-surface ITO layer and etching the B-surface ITO layer to finish the preparation of the double-sided circuit touch screen.

When the Metal coating on the surface A of the substrate and the Metal coating on the surface B of the substrate are carried out, the Metal coating is carried out simultaneously.

When the A surface Metal layer and the B surface Metal layer are etched, the etching is carried out simultaneously.

When the ITO coating is carried out outside the Metal layer on the surface A and outside the Metal layer on the surface B, the ITO coating is carried out simultaneously.

And when the A-surface ITO layer and the B-surface ITO layer are etched, the etching is carried out simultaneously.

The substrate is cleaned firstly, and then Metal coating is carried out on the substrate.

And cleaning the Metal layer of the substrate, and then performing ITO film coating.

The A surface Metal layer wire is arranged below the A surface ITO layer wire, and the line width of the A surface Metal layer wire is smaller than that of the A surface ITO layer wire; the surface B Metal layer wire is arranged below the surface B ITO layer wire, and the line width of the surface B Metal layer wire is smaller than that of the surface B ITO layer wire.

The invention also relates to a double-sided circuit touch screen structure which is simple in structure, can reduce other steps and product production cost compared with the prior art, thereby effectively reducing the preparation cost and improving the preparation efficiency.

The double-sided circuit touch screen structure comprises a substrate, wherein a surface A Metal layer is formed by a surface A Metal coating, a surface B Metal layer is formed by a surface B Metal coating of the substrate 1, an surface A ITO layer is formed by an outer ITO coating of the surface A Metal layer, and a surface B ITO layer is formed by an outer ITO coating of the surface B Metal layer.

The ITO layer is indium tin oxide, and the Metal layer is made of Mo/Al/Mo material or Cu material.

By adopting the technical scheme of the invention, the following beneficial effects can be obtained:

the double-sided circuit touch screen structure and the preparation method provided by the invention provide a brand-new technical scheme based on unique and ingenious conception. The application provides improvements in well-established processes and products, the space for improvement is quite limited, and the labor required for making new improvements is quite involved. The improvement of the application can produce equivalent technical effect. In the large-scale production process, unexpected economic benefits and technical benefits can be brought to enterprises. Aiming at the prior art, the invention adjusts the concept, effectively reduces the number of preparation steps from 15 to 8, ensures that the quality of the prepared product is not influenced and obviously improves the preparation efficiency. Compared with the prior art, the double-sided circuit touch screen structure and the preparation method can reduce other steps and reduce the production cost of products, thereby effectively reducing the preparation cost and improving the preparation efficiency.

Drawings

The contents of the description and the references in the drawings are briefly described as follows:

FIG. 1 is a schematic cross-sectional view of a double-sided circuit touch screen structure according to the present invention;

in the drawings, the reference numbers are respectively: 1. a substrate; 2. a surface A Metal layer; 3.a B surface Metal layer; 5. an ITO layer on the surface A; 6. a B surface ITO layer; 7. surface A; 8. and (B) surface.

Detailed Description

The following detailed description of the embodiments of the present invention, such as the shapes and structures of the components, the mutual positions and connection relations among the components, the functions and operation principles of the components, will be made by referring to the accompanying drawings and the description of the embodiments:

as shown in fig. 1, the invention relates to a method for manufacturing a double-sided circuit touch screen, which comprises the following steps: s1, coating a Metal film on the surface A of a substrate 1 to form a Metal layer 2 on the surface A, and coating a Metal film on the surface B of the substrate 1 to form a Metal layer 3 on the surface B; s2, yellow light developing is carried out on the surface A Metal layer 2 of the surface A of the base material 1, and yellow light developing is carried out on the surface B Metal layer 3 of the surface B of the base material 1; s3, etching the A surface Metal layer 2 and the B surface Metal layer 3; s4, performing ITO (indium tin oxide) coating outside the A surface Metal layer 2 to form an A surface ITO layer 5, and performing ITO coating outside the B surface Metal layer 3 to form a B surface ITO layer 6; and S5, developing the A surface ITO layer 5, developing the B surface ITO layer 6, etching the A surface ITO layer 5 and etching the B surface ITO layer 6 to finish the preparation of the double-sided circuit touch screen. The steps are based on unique and ingenious conception, and a brand-new technical scheme is provided for solving the problems in the prior art. The application provides improvements in well-established processes and products, the space for improvement is quite limited, and the labor required for making new improvements is quite involved. The improvement of the application can produce equivalent technical effect. In the large-scale production process, unexpected economic benefits and technical benefits can be brought to enterprises. Aiming at the prior art, the invention adjusts the concept, effectively reduces the number of preparation steps from 15 to 8, ensures that the quality of the prepared product is not influenced and obviously improves the preparation efficiency. Compared with the prior art, the double-sided circuit touch screen structure and the preparation method can reduce other steps and reduce the production cost of products, thereby effectively reducing the preparation cost and improving the preparation efficiency.

When the Metal coating on the surface A of the substrate 1 and the Metal coating on the surface B of the substrate 1 are carried out, the Metal coating is carried out simultaneously. When the A surface Metal layer 2 and the B surface Metal layer 3 are etched, the etching is carried out simultaneously. When the ITO coating is carried out outside the A surface Metal layer 2 and the ITO coating is carried out outside the B surface Metal layer 3, the ITO coating is carried out simultaneously. And when the A-surface ITO layer 5 and the B-surface ITO layer 6 are etched, the etching is carried out simultaneously. The substrate 2 is cleaned first, and then the substrate 2 is subjected to Metal coating. And cleaning the Metal layer of the substrate 2, and then performing ITO film coating. The technology of the invention actually comprises two technical schemes for solving the existing problems. The first scheme is as follows: a surface Metal coating film, B surface Metal coating film, A surface Metal yellow light development, B surface Metal yellow light development, A/B surface Metal simultaneous etching, A surface ITO coating film, B surface ITO coating film, A surface ITO development, B surface ITO development and A/B surface ITO simultaneous etching; the process is short (total 10 processes); scheme II: simultaneously coating the surface A and the surface B with Metal, developing the surface A with yellow light, developing the surface B with yellow light, simultaneously etching the surface A/B with Metal, simultaneously coating the surface A and the surface B with ITO, developing the surface A with ITO, developing the surface B with ITO, and simultaneously etching the surface A/B with ITO; the process is short (total 8 processes); the metal wire area of the product of the two schemes does not need to be protected by OC or printing ink in the follow-up process (the anti-oxidation effect of the ITO is superior to that of partial metal, and an OC or insulating printing ink protection layer does not need to be arranged on the ITO), so that the working procedure is effectively simplified.

The A surface Metal layer 2 wire is arranged below the A surface ITO layer 5 wire, and the line width of the A surface Metal layer 2 wire is smaller than that of the A surface ITO layer 5 wire; the line width of the B surface Metal layer 3 is smaller than that of the B surface ITO layer 6. By the structure, the ITO layer can reliably protect the Metal layer.

The invention also relates to a double-sided circuit touch screen structure which is simple in structure, can reduce other steps and product production cost compared with the prior art, thereby effectively reducing the preparation cost and improving the preparation efficiency.

The double-sided circuit touch screen structure comprises a substrate 1, wherein a substrate 1A surface Metal coating forms a substrate layer 2, a substrate 1B surface Metal coating forms a substrate layer 3, an ITO coating outside the substrate layer 2 forms an ITO layer 5, and an ITO coating outside the substrate layer 3 forms an ITO layer 6. The ITO layer is indium tin oxide, and the Metal layer is made of Mo/Al/Mo material or Cu material.

The preparation method of the invention comprises the following technical scheme of the specific embodiment:

1. coating a Metal on the surface A of a substrate: coating the cleaned glass in a coating machine (magnetron sputtering), and coating a corresponding metal film layer and a corresponding film layer thickness according to the requirement of the wire resistance;

2. cleaning the glass coated with the Metal film on the surface A, and coating the Metal film on the surface B in a film coating machine;

3. cleaning, coating, pre-baking, exposing, developing and post-baking the glass with the Metal film layers on the two sides in a yellow light workshop to finish the circuit graph of the A/B surface Metal;

4. cleaning, coating, pre-baking, exposing, developing and post-baking the glass finished in the step 3 in a yellow light workshop to finish the circuit graph of the B/A surface Metal;

5. etching the glass finished in the step 4 in a yellow light workshop by using a metal etching solution, wherein a metal etching machine needs to use a soaking mode and a spraying mode simultaneously; after finishing, stripping the photoresist on the surface of the glass by using an organic stripping liquid;

6. cleaning the glass finished in the step (5), and then performing A-surface ITO film coating in a film coating machine (magnetron sputtering);

7. carrying out B-surface ITO film coating on the glass finished in the step 6 in a film coating machine;

8. cleaning, coating, pre-baking, exposing, developing and post-baking the glass finished in the step 7 in a yellow light workshop to finish the circuit pattern of the ITO on the A/B surface;

9. cleaning, coating, pre-baking, exposing, developing and post-baking the glass finished in the step 8 in a yellow light workshop again to finish the circuit pattern of the ITO on the B/A surface;

10. etching the glass finished in the step 9 in a yellow light workshop by using an ITO etching solution, wherein an ITO etching machine needs to use a soaking mode and a spraying mode simultaneously; the selection of the etching time depends on the etching time of the ITO side with lower resistance; and after etching, stripping the photoresist on the surface of the glass by using a stripping liquid.

The double-sided circuit touch screen structure and the preparation method provided by the invention provide a brand-new technical scheme based on unique and ingenious conception. The application provides improvements in well-established processes and products, the space for improvement is quite limited, and the labor required for making new improvements is quite involved. The improvement of the application can produce equivalent technical effect. In the large-scale production process, unexpected economic benefits and technical benefits can be brought to enterprises. Aiming at the prior art, the invention adjusts the concept, effectively reduces the number of preparation steps from 15 to 8, ensures that the quality of the prepared product is not influenced and obviously improves the preparation efficiency. Compared with the prior art, the double-sided circuit touch screen structure and the preparation method can reduce other steps and reduce the production cost of products, thereby effectively reducing the preparation cost and improving the preparation efficiency.

The present invention has been described in connection with the accompanying drawings, and it is to be understood that the invention is not limited to the specific embodiments disclosed, but is intended to cover various modifications, changes and equivalents of the embodiments of the invention, and its application to other applications without departing from the spirit and scope of the invention.