阅读说明：本技术 存储器装置和包括存储器装置的电子装置 (Memory device and electronic device including the same ) 是由 优素福·锡纳尔 朴宰弘 李韩烘 白善均 洪源基 于 2021-05-27 设计创作，主要内容包括：提供了一种存储器装置和电子装置。存储器装置可以包括：存储器模块,包括模块板和定位在模块板的一侧上的存储器连接器；第一外壳和第二外壳,第一外壳放置在存储器模块上方,第二外壳放置在存储器模块下方,其中,第一外壳包括覆盖模块板的上面和存储器连接器的上面的第一主盖；至少一个夹紧孔,在与存储器连接器叠置的位置处穿透第一主盖；器件间紧固柱,从第一主盖的下面向下突出；以及固定孔,在平面上定位在器件间紧固柱的内部,并且穿透器件间紧固柱和第一主盖。(A memory device and an electronic device are provided. The memory device may include: a memory module comprising a module board and a memory connector positioned on one side of the module board; a first housing placed above the memory module and a second housing placed below the memory module, wherein the first housing includes a first main cover covering an upper face of the module board and an upper face of the memory connector; at least one clamping hole penetrating the first main cover at a position overlapping the memory connector; an inter-device fastening post protruding downward from the lower face of the first main cover; and a fixing hole positioned inside the inter-device fastening post on a plane and penetrating the inter-device fastening post and the first main cover.)

1. A memory device, the memory device comprising:

a housing assembly; and

a memory module disposed within the housing assembly, the memory module including a module board and a memory connector located on one side of the module board;

wherein the housing assembly comprises a first housing above the memory module and a second housing below the memory module,

wherein the first housing includes a first main cover covering an upper face of the module board and an upper face of the memory connector,

wherein the at least one clamping hole penetrates the first main cover at a position overlapping the memory connector,

wherein the inter-device fastening post protrudes downward from the lower face of the first main cover, and

wherein the fixing hole extends through the inter-device fastening post and the first main cover.

2. The memory device of claim 1, wherein the second housing includes a second main cover at least partially covering an underside of the module board.

3. The memory device of claim 2, wherein the inter-device fastening post does not overlap the second main cap.

4. The memory device of claim 3, wherein the ends of the inter-device fastening pillars are coplanar with the underside of the second main lid.

5. The memory device of claim 2, wherein the first main lid has a rectangular configuration with a first long side, a second long side, a first short side, and a second short side,

wherein the memory connector is positioned on the first short side of the first main cover, and

the first housing includes a first side cover extending downward from a first long side of the first main cover, a second side cover extending downward from a second short side, and a third side cover extending downward from the second long side.

6. The memory device according to claim 5, wherein the first side cover, the second side cover, and the third side cover contact an upper face of the second main cover.

7. The memory device of claim 6, wherein the second main lid comprises a first long side, a second long side, a first short side, and a second short side,

wherein, the outer surface of the first side cover is coplanar with the side surface of the first long edge of the second main cover,

wherein an outer face of the second side cover is coplanar with a side face of the second short side of the second main cover, and

wherein, the outside of the third side cover is coplanar with the side of the second long edge of the second main cover.

8. The memory device of claim 2, wherein the module board includes a module fastening hole,

wherein the second housing includes a coupling hole overlapping the module fastening hole, and

wherein the first case includes a coupling groove communicating with the module fastening hole and the coupling hole.

9. The memory device of claim 8, the memory device further comprising:

and a fastening member passing through the coupling hole of the second case and the module fastening hole from a lower portion of the second main cover and inserted into the coupling groove.

10. The memory device of any one of claims 1 to 9, wherein the securing hole comprises:

the holes are penetrated through the inner wall of the casing,

a first expansion hole located above the penetration hole and having an inner diameter larger than that of the penetration hole, and

a second expansion hole located below the penetration hole and having an inner diameter larger than that of the penetration hole.

11. The memory device of claim 10, wherein the first expansion aperture and the second expansion aperture are symmetrical.

12. A memory device, the memory device comprising:

a housing assembly; and

a memory module disposed within the housing assembly, the memory module including a module board and a memory connector on one side of the module board;

wherein the housing assembly comprises a first housing above the memory module and a second housing below the memory module, wherein the first housing comprises a first main cover covering an upper face of the module board and an upper face of the memory connector, and wherein the second housing comprises a second main cover; and is

Wherein at least one of the first and second main covers includes a base portion and fins protruding outward from the base portion.

13. The memory device of claim 12, the memory device further comprising:

and the thermal gap filling piece is positioned between the fin and the module plate.

14. The memory device of claim 12, wherein the memory connector extends from the module board in a first direction, wherein the fin comprises a plurality of sub-fins arranged in a second direction transverse to the first direction, and wherein each of the sub-fins extends in the first direction.

15. An electronic device, the electronic device comprising:

a memory module comprising a memory connector;

a housing assembly containing the memory module, the housing assembly including one or more clamping holes on an upper face of the housing assembly;

a connector body including a connector hole and a slot; and

a host connector configured to be mounted on the upper face of the connector body, wherein the host connector includes a latch having a hook.

16. The electronic device of claim 15, wherein the memory connector is inserted into the connector aperture, the hook is secured to the clamping aperture, and at least a portion of the housing assembly is inserted into the slot.

17. The electronic device of claim 16, wherein the host connector further comprises a tab coupling the hook to the connector body, and wherein the tab comprises a spring.

18. The electronic device of claim 15, wherein the housing assembly further comprises at least one securing aperture, the at least one securing aperture comprising:

the holes are penetrated through the inner wall of the casing,

a first expansion hole located above the through hole, wherein an inner diameter of the first expansion hole is larger than an inner diameter of the through hole, and

and a second expansion hole located below the penetration hole, wherein an inner diameter of the second expansion hole is larger than an inner diameter of the penetration hole.

19. The electronic device of claim 18, further comprising:

at least one fastener receiving aperture and at least one fastener configured to be inserted into the at least one fastener receiving aperture and the at least one securing aperture.

20. The electronic device according to claim 19, wherein the fastener receiving hole, the fixing hole, and the fastener are plural respectively,

wherein some of the plurality of fasteners are inserted into respective ones of the fixation holes and fastener-receiving holes from above the fixation holes, and wherein some of the plurality of fasteners are inserted into respective ones of the fixation holes and fastener-receiving holes from below the fixation holes.

Technical Field

The present disclosure relates to a memory device and an electronic device including the same.

Background

A memory device represented by an SSD (solid state drive) is widely used not only for conventional electronic devices such as desktop PCs, tablet PCs, and laptop PCs, but also for mobility-related electronic devices such as automobiles, drones, and airplanes. Electronic devices may be exposed to various environments. For example, when the memory device is used in an automobile, the memory device may be affected by vibration, a vehicle accident, and the like, and in some cases, the memory device may be exposed to high temperature. In addition, the mechanical reliability of the memory device may be threatened by external impacts. In addition, high temperature environments can cause failure of the memory device.

Disclosure of Invention

Aspects of the present disclosure provide a memory device having excellent mechanical strength and increased heat capacity.

Aspects of the present disclosure also provide an electronic device having excellent mechanical strength and increased heat capacity.

However, aspects of the present disclosure are not limited to the one set forth herein. Other aspects of the disclosure will become more apparent to those of ordinary skill in the art to which the disclosure pertains by reference to the detailed description of the disclosure given below.

According to one aspect of the present disclosure, a memory device includes a housing assembly and a memory module disposed within the housing assembly. The memory module includes a module board and a memory connector positioned on one side of the module board. The housing assembly includes a first housing above the memory module and a second housing below the memory module. The first housing includes a first main cover covering an upper face of the module board and an upper face of the memory connector. At least one clamping hole penetrates the first main cover at a position overlapping the memory connector. Inter-device fastening posts project downward from the underside of the first main cover. A fixing hole extends through the inter-device fastening post and the first main cover.

According to one aspect of the present disclosure, a memory device includes a housing assembly and a memory module disposed within the housing assembly. The memory module includes a module board and a memory connector positioned on one side of the module board. The housing assembly includes a first housing above the memory module and a second housing below the memory module. The first housing includes a first main cover covering an upper face of the module board and an upper face of the memory connector. The second housing includes a second main cover. At least one of the first and second main covers includes a base portion and a fin protruding outward from the base portion.

According to one aspect of the present disclosure, an electronic device includes: a memory module having a memory connector positioned on one side; and a housing assembly that houses the memory module. The housing assembly includes one or more gripping apertures on an upper face of the housing assembly. The connector body includes a connector bore and a slot. The host connector is configured to mount on the upper face of the connector body and includes a latch having a hook.

Drawings

Other aspects and features of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:

FIG. 1 is a block diagram of a memory system according to an embodiment;

FIG. 2 is a perspective view of a memory device according to an embodiment;

FIG. 3 is an exploded perspective view of a memory device according to an embodiment;

FIG. 4 is an exploded perspective view of a memory device according to an embodiment, viewed from a direction different from that of FIG. 3;

FIG. 5 is a cross-sectional view of the memory device of FIG. 2 taken along a first direction;

FIG. 6 is a plan view of a memory module according to an embodiment;

fig. 7 is a bottom view of the first housing according to an embodiment;

fig. 8 is a plan view of a second housing according to the embodiment;

FIG. 9 is a partial perspective view of a host according to an embodiment;

FIG. 10 is a cross-sectional view of FIG. 9;

FIG. 11 is a partial perspective view of a memory device according to an embodiment;

fig. 12 is a perspective view showing a state in which the memory device is fastened to the host;

fig. 13 is a perspective view showing a state before the memory device is fastened to the host;

FIG. 14 is a cross-sectional view showing the process of securing the memory connector to the host connector;

fig. 15 is a schematic diagram showing a process of fixing a memory device according to an embodiment to an electronic device;

fig. 16 is a sectional view illustrating a fixing process at the first inter-device fastening post of fig. 15;

fig. 17 is a sectional view illustrating a fixing process at the second inter-device fastening post of fig. 15;

FIG. 18 is a perspective view showing a host connector and a memory device together according to another embodiment;

FIG. 19 is a cross-sectional view of a memory device according to another embodiment;

FIG. 20 is a cross-sectional view of a memory device according to yet another embodiment;

FIG. 21 is a perspective view of a memory device according to yet another embodiment;

FIG. 22 is a cross-sectional view of FIG. 21 taken in a first direction;

FIG. 23 is a perspective view of a memory device according to yet another embodiment;

FIG. 24 is a cross-sectional view of FIG. 23 taken in a first direction;

FIG. 25 is a perspective view of a memory device according to yet another embodiment;

FIG. 26 is a cross-sectional view of FIG. 25 taken along a second direction;

FIG. 27 is a perspective view of a memory device according to yet another embodiment; and

fig. 28 is a cross-sectional view of fig. 27 taken in a second direction.

Detailed Description

Hereinafter, various embodiments of the present disclosure will be explained with reference to the drawings.

FIG. 1 is a block diagram of a memory system according to an embodiment.

Referring to fig. 1, the memory system includes a host 20 and a memory device 10. The host 20 and the memory device 10 may communicate with each other through a predetermined interface. The interface may be, for example, but not limited to UFS (universal flash), SAS (serial attached SCSI), SATA (serial advanced technology attachment), PCIe (peripheral component interconnect express), eMMC (embedded multimedia card), FC (fibre channel), ATA (advanced technology attachment), IDE (integrated drive electronics), USB (universal serial bus), IEEE 1394 (firewire), and the like.

The host 20 controls the overall operation of the memory device 10. The host 20 may include an application 21, a drive 22, a host controller 23, a buffer memory 26, and a host interface (I/F) 24.

The application 21 may control the electronic device based on a command set that may be used in the electronic device. The application 21 may support, for example, but not limited to, a SCSI (Small computer System interface) command set.

The driver 22 may drive the memory device 10 connected to the host 20. Specifically, the driver 22 receives a command for controlling the memory device 10 from the application 21, processes the command using the host controller 23, and may then output the processing result of the command to the application 21.

The application 21 and the driver 22 may be implemented as, but not limited to, software or firmware.

The host controller 23 controls the overall operation inside the host 20. For example, the host controller 23 may transfer data stored in the buffer memory 26 to the memory device 10 through the host interface 24 in response to a write command received from the drive 22. Further, the host controller 23 may also receive data from the memory device 10 through the host interface 24 in response to a read command received from the drive 22.

The buffer memory 26 may be used as a main memory of the host 20, or may be used as a cache memory or a temporary memory for temporarily storing data. The buffer memory 26 may also be used as a drive memory for driving software such as the application 21 and the driver 22. The buffer memory 26 may include, but is not limited to, volatile memory such as DRAM (dynamic random access memory).

The host interface 24 may send data to the memory device interface 14 of the memory device 10 over data lines DIN and receive data from the memory device interface 14 of the memory device 10 over data lines DOUT. The data lines DIN and DOUT may be connected between the host 20 and the memory device 10 by connecting the host connector and the memory device connector. A detailed description of the connection structure of the host connector and the memory device connector will be explained later.

Memory device 10 may include a memory device interface 14, a memory controller 13, a memory 15, and a buffer memory 16. The memory device 10 may be connected to a host 20 through a memory device interface 14.

The memory controller 13 may perform an operation of writing, reading, or erasing data requested by the host 20 on the memory 15.

The buffer memory 16 may be used to temporarily store data to be stored in the memory 15 and data read from the memory 15. The buffer memory 16 may include, but is not limited to, a volatile memory such as a DRAM (dynamic random access memory).

The memory 15 may include a nonvolatile memory such as a flash memory, an MRAM (magnetoresistive random access memory), a PRAM (phase change random access memory), and an FeRAM (ferroelectric random access memory). Although the following embodiments show examples in which the memory device 10 is an SSD (solid state drive) including a flash memory, applicable embodiments are not limited thereto.

The aforementioned memory system may be built in or mounted inside various electronic devices. The electronic apparatus is an apparatus including an electronic device and an electronic component, and may include, for example, a desktop PC, a tablet PC, a laptop PC, a netbook computer, a workstation, a server, a PDA, a mobile phone, a smartphone, a video phone, an e-book reader, an MP3 player, a digital camera, a TV, a projector, a game machine, a navigation device, a robot, a Global Navigation Satellite System (GNSS), and a medical apparatus including an electronic device, a washing machine, a refrigerator, and the like. Further, in the case of an automobile, a drone, an airplane, a ship, a satellite, or the like, as long as the device includes electronic equipment or electronic components, the device may also be referred to as an electronic device.

Fig. 2 is a perspective view of a memory device 100 according to an embodiment. Fig. 3 is an exploded perspective view of the memory device 100 according to an embodiment. Fig. 4 is an exploded perspective view of the memory device 100 according to the embodiment, viewed from a direction different from that of fig. 3. Fig. 5 is a cross-sectional view of the memory device 100 of fig. 2 taken along a first direction. FIG. 6 is a plan view of a memory module according to an embodiment. Fig. 7 is a bottom view of a first housing according to an embodiment. Fig. 8 is a plan view of a second housing according to an embodiment.

Referring to fig. 2, in the illustrated embodiment, the memory device 100 has a substantially rectangular parallelepiped shape. If a plane having the largest area in a rectangular parallelepiped is defined as the lower face BF, the bottom face of the memory device 100 may have a rectangular shape. The rectangular shape includes first and second long sides LS1 and LS2 opposite to each other and first and second short sides SS1 and SS2 opposite to each other. In the present specification, portions where each side meets in a rectangular shape are referred to as corners CNR1 to CNR 4. Specifically, a portion where the first long side LS1 meets the first short side SS1 is referred to as a first corner CNR1, a portion where the first long side LS1 meets the second short side SS2 is referred to as a second corner CNR2, a portion where the second short side SS2 meets the second long side LS2 is referred to as a third corner CNR3, and a portion where the second long side LS2 meets the first short side SS1 is referred to as a fourth corner CNR 4.

In the drawing, the extending direction of the long side of the bottom face having a rectangular shape is indicated by a first direction X, the extending direction of the short side is indicated by a second direction Y, and the thickness direction of the rectangular parallelepiped is indicated by a third direction Z. The planes defined by the two directions may be referred to as the XY plane, the YZ plane, and the ZX plane, respectively. In the case of this reference, the bottom surface of the memory device 100 is placed on the XY plane. Unless otherwise stated herein, the planar shape of the specific member or the appearance in plan view refers to a shape in which the specific member is placed on the XY plane.

For convenience of explanation, among the two bottom surfaces of the memory device 100, a surface positioned on one side (upper side in the drawing) in the third direction Z is referred to as an upper face UF, and a surface positioned on the other side (lower side in the drawing) in the third direction Z is referred to as a lower face BF. Further, for other components, the face positioned on one side based on the third direction Z will also be referred to as upper face UF, and the face positioned on the other side will also be referred to as lower face BF. However, the terms "upper" and "lower" with respect to the upper UF and the lower BF merely distinguish them in positions symmetrical to each other, and it is apparent that even in the case where the terms are referred to as "upper" and "lower", the upper and lower may be reversed according to a change in the direction of the memory device 100, or the plane may be positioned in the left-right direction or the diagonal direction.

The rectangular parallelepiped shape includes four sides SF1 to SF4 connecting the upper UF and lower BF. In the present specification, four side faces of the rectangular parallelepiped may be referred to as a first side face SF1 connected to the first long side LS1, a second side face SF2 connected to the second short side SS2, a third side face SF3 connected to the second long side LS2, and a fourth side face SF4 connected to the first short side SS1, respectively, of the bottom face of the plan view. The upper UF and lower BF of the rectangular parallelepiped are placed on the XY plane, the first side SF1 and third side SF3 are placed on the XZ plane, and the second side SF2 and fourth side SF4 may be placed on the YZ plane. The definitions of the above-mentioned directions, faces, corners and the like will be used throughout the specification even if they are not shown in the drawings.

The appearance of the memory device 100 may follow a standardized or arbitrary form factor. The size of the rectangular parallelepiped memory device 100 is also changeable by various standards. In an embodiment, the memory device 100 may follow an elongated dimension standard with a long side length (width in the first direction X) of 119mm, a short side length (width in the second direction Y) of 36.5mm, and a height (width in the third direction Z) of 9.5 mm. In another embodiment, the memory device 100 may follow a short form factor standard with a long side length (width in the first direction X) of 52mm, a short side length (width in the second direction Y) of 36.5mm, and a height (width in the third direction Z) of 9.5 mm. The aforementioned dimensional standards may allow for tolerances within 5% for each dimension. For example, the aforementioned dimensional criteria may allow for tolerances (such as 0.25mm, 0.35mm, and 0.45 mm).

Hereinafter, although a case where the memory device 100 has a long size standard will be mainly explained as an example, the technical idea of the embodiment may be modified and applied to a short size standard or various other size standards.

Referring to fig. 2 to 8, the memory device 100 includes a memory module 110 and a case assembly 120 accommodating the memory module 110. The housing assembly 120 may substantially define the appearance of the memory device 100. The memory module 110 may be covered by the housing assembly 120 except for a certain area in which the memory connector MCN is positioned.

Referring to fig. 2 to 5, the memory module 110 may include a module board BDH, a memory connector MCN disposed on at least one end of the module board BDH, and an electronic component CHP placed on at least one face of the module board BDH.

The module board BDH may include one or more insulating layers and wiring layers. The module board BDH may include a printed circuit board.

The module board BDH may have a plate-like shape. Module board BDH may be positioned substantially in the XY plane. The overall planar shape of the module board BDH may be similar to that of the memory device 100. For example, if the memory device 100 has a rectangular or similar appearance in a plan view, the module board BDH may also have a rectangular or similar appearance.

The size of the module board BDH is smaller than the size of the memory device 100 in a plan view, but the size of the module board BDH may be similar to the size of the memory device 100. For example, the area occupied by the module board BDH may be in the range of 50% to 99% among the area occupied by the memory device 100.

The module board BDH occupies a central portion of the memory device 100 in plan view, and each side of the module board BDH may be positioned inward from each corresponding side of the memory device 100 (i.e., each side of the module board BDH is spaced inward from the corresponding side of the memory device 100). Except for some parts, the case assembly 120 is placed outside the module board BDH in a space between each side of the module board BDH and each side of the memory device 100 to prevent the module board BDH from being exposed to the outside.

Module panel BDH may include one or more module fastener holes MH1 through MH 4. If there are a plurality of module fastening holes MH 1-MH 4, each module fastening hole MH 1-MH 4 may have the same size and shape, but is not limited thereto.

The module fastening holes MH1 to MH4 penetrate the module board BDH in the third direction Z (thickness direction). The module fastening holes MH1 to MH4 provide a space in which a fastening member such as a screw or a bolt (i.e., any type of threaded fastener) is inserted. Hereinafter, although a screw is provided as an example of the fastening member, it is apparent that various types of fastening members may be used.

Module fastening holes MH1 to MH4 may be placed at corners CNR1 to CNR4 of the module board BDH. The module fastening holes MH 1-MH 4 may include a first module fastening hole MH1 placed at the first corner CNR1, a second module fastening hole MH2 placed at the second corner CNR2, a third module fastening hole MH3 placed at the third corner CNR3, and a fourth module fastening hole MH4 placed at the fourth corner CNR 4. However, the present disclosure is not limited thereto, and the module fastening holes MH1 to MH4 may be omitted at some corners, and may be further installed in regions other than the corners (e.g., a central portion and a region adjacent to the side surface).

The position of each of the module fastening holes MH1 to MH4 based on each of the corners CNR1 to CNR4 may be deformed differently.

In an embodiment, the positions of each of the module fastening holes MH1 to MH4 may be designed such that distances spaced apart in the first direction X are equal to each other and distances spaced apart in the second direction Y are equal to each other based on each of the corners CNR1 to CNR4 to provide an effective coupling force. In such an embodiment, if each corner of the module board BDH is positioned at the vertex of one rectangle, the figure obtained by connecting each of the module fastening holes MH1 to MH4 defines a rectangle.

In another embodiment, each of the module fastening holes MH1 to MH4 may be relocated from the above-described position according to the wiring design of the module board BDH, the chip arrangement, the position of the memory connector MCN, and the like. For example, as shown in the drawings, when the memory connector MCN is placed on the first short side SS1 to be generally further offset toward the second long side LS2 than the first long side LS1, the fourth module fastening hole MH4 placed at the fourth corner CNR4 may be spaced farther from the first short side SS1 in the first direction X than the first module fastening hole MH1 placed at the first corner CNR 1. In this case, a straight line connecting the first module fastening hole MH1 and the fourth module fastening hole MH4 may be inclined at a first angle with respect to the second direction Y.

In the case where the second and third module fastening holes MH2 and MH3 are placed near the second short side SS2 of the non-aligned memory connector MCN thereon, although the distance separating the second and third module fastening holes MH2 and MH3 from the second short side SS2 in the first direction X may be the same, it is also possible to reduce the deviation of the separation distance between the module fastening holes MH1 to MH4 in the first direction X by designing the separation distance of the second module fastening holes MH2 to be larger than the separation distance of the third module fastening holes MH 3. In this case, a straight line connecting the second module fastening hole MH2 and the third module fastening hole MH3 may be inclined at a second angle with respect to the second direction Y. The second angle may have the same sign as the first angle. The second angle may have a smaller absolute value than the first angle, but is not limited thereto. In an embodiment, a pattern obtained by connecting each of the module fastening holes MH1 to MH4 may define a trapezoid.

The module fastening holes MH1 to MH4 may have a closed curved shape (such as a circle) in a plan view. In this case, all the module fastening holes MH1 to MH4 are completely surrounded by the module board BDH in a plan view. As another example, some of the module fastening holes MH1 through MH4 may also be open to the sides (e.g., long sides) of the module panel BDH. That is, since module fastening holes MH1 through MH4 are placed closer to the sides of module board BDH and the sides of module board BDH are placed inside the virtual circle formed by module fastening holes MH1 through MH4, module fastening holes MH1 through MH4 do not form a circular closed curve shape and may be opened to the sides of module board BDH in the horizontal direction. Also in this case, the width opening to the side of the module board BDH may be smaller than the diameter of the virtual circle.

The memory connector MCN may be placed at one end of the module board BDH. In the illustrated embodiment, memory connector MCN is connected to first short side SS1 of module board BDH and protrudes outward from first short side SS1 of module board BDH in first direction X. However, the embodiment is not limited thereto, and the memory connector MCN may be placed on other edge or edges of the module board BDH.

In an embodiment, the width of the memory connector MCN in the second direction Y may be smaller than the width of the module board BDH in the second direction Y. In addition, the memory connector MCN may be placed to be spaced apart from the extension line of the first long side LS1 and/or the extension line of the second long side LS2 of the module board BDH. The memory connector MCN may be generally positioned further toward the second long side LS2 than the first long side LS 1. That is, the distance between the memory connector MCN and the extension line of the first long side LS1 of the module board BDH may be greater than the distance between the memory connector MCN and the extension line of the second long side LS2 of the module board BDH. However, the embodiment is not limited thereto, and the memory connector MCN may be positioned at an equal distance from the long side of the module board BDH.

The memory connector MCN is connected to the module board BDH. Although the memory connector MCN may be provided as a separate component from the module board BDH and attached to the module board BDH, the memory connector MCN may be provided integrally with the module board BDH. When the memory connector MCN is integrally provided with the module board BDH, the memory connector MCN may be provided in a module board BDH projection region where a part of the module board BDH projects outward.

The memory connector MCN may include a plurality of connection terminals EL 1. The plurality of connection terminals EL1 may be arranged to be spaced apart along the second direction Y. Each connection terminal EL1 of the memory connector MCN can be connected to each connection terminal EL2 of the corresponding host connector 200. A detailed explanation of the connection between the memory connector MCN and the host connector 200 is provided below.

Each connection terminal EL1 of the memory connector MCN can be connected to the wiring of the module board BDH. When the memory connector MCN is integrally provided with the module board BDH, the connection terminal EL1 of the memory connector MCN may be formed on the same layer using the same material as that of the wiring of the module board BDH. Each of the connection terminals EL1 may have a shape of a pad electrode having a width wider than that of the wiring of the module board BDH. The plurality of connection terminals EL1 may be exposed to the outside while being at least partially not covered with the insulating layer. A plurality of connection terminals EL1 may be placed on the upper side UF of the memory connector MCN and also on the lower side BF. In some cases, the plurality of connection terminals EL1 may be placed on both the upper UF and the lower BF of the memory connector MCN. Further, the memory connector MCN includes a plurality of layers divided in the thickness direction, and a plurality of connection terminals EL1 may be placed on at least one face of each layer.

The size, shape, and position of the memory connector MCN, the arrangement of the connection terminal EL1, and the like may comply with various standards. For example, the size, shape, and position of the memory connector MCN, the arrangement of the connection terminal EL1, and the like may correspond to standards (such as e1.s, m.2, and NF 2).

The electronic components CHP are placed on the upper UF and/or lower BF of the module board BDH. The electronic component CHP may be manufactured in the form of a chip separate from the module board BDH and mounted on the module board BDH.

The electronic component CHP may include a semiconductor component. The semiconductor element may include a memory (such as a NAND flash memory or a DRAM memory) and a memory controller that controls the memory. The electronic component CHP may also comprise a capacitor component. Each electronic component CHP may be connected to the wiring of the module board BDH to perform an electrical operation. The plurality of electronic components CHP may be spaced apart from each other. A horizontal gap may be defined in the space between each of the electronic components CHP. The horizontal gap may be filled with air or the like.

Referring to fig. 2-4, the housing assembly 120 generally has a rectangular parallelepiped shape with a hollow interior. The memory module 110 is housed inside the housing assembly 120. The housing assembly 120 may serve as a case.

As shown, housing assembly 120 may include an upper UF, a lower BF, and four sides SF1, SF2, SF3, and SF 4. Upper UF and lower BF of housing assembly 120 constitute upper UF and lower BF of memory device 100, and the four sides may each constitute first side SF1, second side SF2, third side SF3, and fourth side SF4 of memory device 100. At a position corresponding to the fourth side SF4 of the memory device 100, the case assembly 120 may include a connector opening COP exposing the memory connector MCN in the first direction X.

The housing assembly 120 may be provided by assembling a plurality of components. In particular, the housing assembly 120 may include a first housing 121 positioned at the top and a second housing 122 positioned at the bottom. The first and second housings 121, 122 may be secured together to define an at least partially sealed space. The memory module 110 may be accommodated in a sealed space.

The first and second housings 121 and 122 are made of metal such as stainless steel, aluminum (Al), copper (Cu), titanium (Ti), nickel (Ni), or an alloy containing them, or may be made of a polymer material, a carbon-based material, or a composite material thereof.

In some embodiments, the first and second housings 121, 122 may include a Thermal Interface Material (TIM), a Phase Change Material (PCM), or an encapsulated PCM (epcm). The above-described material may be mixed with the constituent materials of the first and second housings 121 and 122, may be coated on the inner faces (lower face BF in the case of the first housing 121, and upper face UF in the case of the second housing 122) or both faces of the first and second housings 121 and 122, and may be made of a separate film or the like and attached to the inner faces or both faces of the first and second housings 121 and 122. Such thermal interface materials and the like may help the first and second housings 121 and 122 absorb, store, or diffuse heat. The thermal capacity of the housing assembly 120 and the memory device 100 comprising the housing assembly 120 may be increased accordingly.

The material of the first housing 121 and the material of the second housing 122 may be the same or may be different from each other.

The first and second housings 121 and 122 may each include a lower cover corresponding to a bottom surface of the case assembly 120. At least one of the first and second housings 121 and 122 may further include a side cover corresponding to a side of the housing assembly 120. Although the first case 121 is illustrated to include a lower cover and a plurality of side covers, a plurality of side covers may be included in the second case 122. In addition, some side covers may be included in the first case 121, and some other side covers may be included in the second case 122.

Referring to fig. 2 to 5 and 7, the first housing 121 includes a plurality of side covers CV _ SF1, CV _ SF2 and CV _ SF3 and a first main cover CVU as an upper UF cover.

The first main cover CVU is placed on the XY plane. The first main cover CVU may have a uniform thickness.

The first main cover CVU may have a substantially rectangular shape in plan view. The planar shape of the first main cover CVU may be substantially the same as that of the memory device 100. The length of the long side and the length of the short side of the memory device 100 may be determined by the length of the long side and the length of the short side of the first main cover CVU, respectively.

The first main cover CVU may cover not only the module board BDH of the memory module 110 but also the memory connector MCN of the memory module 110. The first short side SS1 of the first main cover CVU may be arranged at an end of the memory connector MCN, or may be placed at an outside of the memory connector MCN.

The plurality of side covers may be integrally formed by being connected to the first main cover CVU. The plurality of side covers may include a first side cover CV _ SF1 extending downward from the first long side LS1 of the first main cover CVU, a second side cover CV _ SF2 extending downward from the second short side SS2, and a third side cover CV _ SF3 extending downward from the second long side LS 2. There is no side cover on the first short side SS1 side of the first main cover CVU, thereby defining a connector opening COP. Adjacent side covers CV _ SF1, CV _ SF2, and CV _ SF3 may be integrally connected to each other.

Although each of the side covers CV _ SF1, CV _ SF2, and CV _ SF3 may have the same thickness and may also have the same thickness as that of the first main cover CVU, the embodiment is not limited thereto.

Side covers CV _ SF1, CV _ SF2, and CV _ SF3 may have heights corresponding to the height of memory device 100. In the assembled memory device 100 according to the exemplary embodiment, the ends of the side covers CV _ SF1, CV _ SF2, and CV _ SF3 are placed on the upper face UF of the second main cover CVB of the second case 122, which is a lower cover. In this case, the height of the memory device 100 may correspond to the sum of the height of the side cover and the thickness of the second main cover CVB.

The height of first side cover CV _ SF1, the height of second side cover CV _ SF2, and the height of third side cover CV _ SF3 may be generally the same. However, the third side cover CV _ SF3 has an end portion protruding from the fourth corner CNR4 in which the inter-device fastening posts DL1 to DL3 are not placed, and the third side cover CV _ SF3 may partially have the same height as that of the inter-device fastening posts DL1 to DL 3.

The first case 121 may include coupling grooves CPG1 to CPG4 spatially connected to the module fastening holes MH1 to MH4 and fastened by module screws (i.e., threaded fasteners) 130. The coupling grooves CPG1 to CPG4 of the first housing 121 may be arranged in the same number as the number of module fastening holes MH1 to MH 4. The coupling grooves CPG1 to CPG4 of the first housing 121 may overlap the corresponding module fastening holes MH1 to MH 4. Although the planar shape of the coupling grooves CPG1 to CPG4 of the first case 121 and the planar shape of the module fastening holes MH1 to MH4 may be the same, the embodiment is not limited thereto.

The first housing 121 may include top fastening posts in which the coupling grooves CPG1 to CPG4 are placed. Four top fastening posts may also be provided if there are four bonding grooves CPG1 through CPG 4. That is, as shown in fig. 7, the first housing 121 has a first top fastening post LU1 placed in the first corner CNR1, a second top fastening post LU2 placed in the second corner CNR2, a third top fastening post LU3 placed at the third corner CNR3, and a fourth top fastening post LU4 placed at the fourth corner CNR 4.

Top fastening posts LU 1-LU 4 protrude downward from the underside BF of the first main cover CVU. In an embodiment, the ends of the top fastening posts LU 1-LU 4 may be in contact with the upper face UF of the memory module 110 (or module board BDH). The top fastening posts LU 1-LU 4 may act as spacers to maintain a gap between the first housing 121 and the memory module 110.

The bonding grooves CPG 1-CPG 4 are placed in the top fastening posts LU 1-LU 4. The coupling grooves CPG1 to CPG4 may have a shape that is recessed upward from the ends of the top fastening posts LU1 to LU 4. The combination grooves CPG1 through CPG4 may not penetrate the first main cover CVU. The bottom surfaces of the coupling grooves CPG1 to CPG4 may have the same height as the height of the lower face BF of the first main cover CVU, but are not limited thereto. When the coupling grooves CPG1 to CPG4 are placed inside the top fastening posts LU1 to LU4 in this manner, the contact area with the module screws 130 is increased and the fastening strength between the components due to the module screws 130 can be increased.

The top fastening posts LU 1-LU 4 may have, but are not limited to, a polygonal shape (such as a square, rectangle, or rounded rectangle).

The height of the top fastening posts LU 1-LU 4 may be modified according to the location and thickness of the memory module 110 placed therein, the height criteria of the memory device 100, etc. The height of top fastening posts LU 1-LU 4 may be smaller than the height of side covers CV _ SF1, CV _ SF2, and CV _ SF 3.

The XY plane-based width of top fastening posts LU 1-LU 4 may be greater than the width (or thickness) of side covers CV _ SF1, CV _ SF2, and CV _ SF 3.

As shown in fig. 4, the first housing 121 may further include one or more inter-device fastening posts DL1 to DL3 in which fixing holes DH1 to DH3 are placed. Similar to the top fastening posts LU1 to LU4, inter-device fastening posts DL1 to DL3 protrude downward from the lower face BF of the first main cover CVU. The XY plane-based widths of inter-device fastening posts DL 1-DL 3 may be greater than the widths (or thicknesses) of side covers CV _ SF1, CV _ SF2, and CV _ SF 3. The height of inter-device fastening posts DL 1-DL 3 is greater than the height of top fastening posts LU 1-LU 4, and may be greater than or equal to the height of side covers CV _ SF1, CV _ SF2, and CV _ SF 3. The planar shape of the inter-device fastening posts DL1 to DL3 may be, but is not limited to, a polygon (such as a square, a rectangle, or a rounded rectangle).

The inter-device fastening posts DL 1-DL 3 may be placed outside the top fastening posts LU 1-LU 4. There may be a plurality of inter-device fastening posts DL1 to DL 3. The plurality of inter-device fastening posts DL 1-DL 3 may include, for example, a first inter-device fastening post DL1 placed outside the first top fastening post LU1 at the first corner CNR1, a second inter-device fastening post DL2 placed outside the second top fastening post LU2 at the second corner CNR2, and a third inter-device fastening post DL3 placed outside the third top fastening post LU3 at the third corner CRN 3. In the case of the fourth corner CNR4 placed adjacent to the memory connector MCN, the inter-device fastening post may be omitted.

Adjacent side covers, top fastening posts and/or inter-device fastening posts may be integrated and connected to each other. For example, at the first corner CNR1, the facing sides of the first top fastening post LU1 and the first inter-device fastening post DL1 are interconnected, and the side facing the first side SF1 may be connected to the first side cover CV _ SF 1. Further, at the second corner CNR2, facing sides of the second top fastening post LU2 and the second inter-device fastening post DL2 are interconnected, the second top fastening post LU2 is connected to the first side cover CV _ SF1, and the second inter-device fastening post DL2 may be connected to the first side cover CV _ SF1 and the second side cover CV _ SF 2. Further, at a third corner CNR3, facing sides of a third top fastening post LU3 and a third inter-device fastening post DL3 are interconnected, the third top fastening post LU3 is connected to a third side cover CV _ SF3, and the third inter-device fastening post DL3 may be connected to the third side cover CV _ SF3 and the second side cover CV _ SF 2. Further, at a fourth corner CNR4, a fourth top fastening post LU4 may be connected to the third side cover CV _ SF 3.

As shown in fig. 4, each of the inter-device fastening posts DL 1-DL 3 may include a fixing hole DH 1-DH 3 therein. The fixing holes DH1 to DH3 penetrate the inter-device fastening posts DL1 to DL3 in the third direction Z. The hole depths of the fixing holes DH1 to DH3 may be the same as the heights of the inter-device fastening posts DL1 to DL 3. One ends of the fixing holes DH1 to DH3 may be open at ends of the inter-device fastening posts DL1 to DL3, and the other ends of the fixing holes DH1 to DH3 may be open on the upper face UF of the first main cover CVU.

The fixing holes DH1 to DH3 may include penetration holes TRH disposed at the central portion and expansion holes ENH disposed at both ends based on the third direction Z. As shown in fig. 7, the penetration holes TRH and the expansion holes ENH may be spatially interconnected.

The penetration hole TRH and the expansion hole ENH may each have a circular shape in plan view. The inner diameter of the expansion hole ENH is larger than the inner diameter of the penetration hole TRH, and the expansion hole ENH may be placed outside the penetration hole TRH in a plan view. The planar shape of the penetration hole TRH and the planar shape of the expansion hole ENH may be in a concentric relationship.

In an embodiment, the inner diameter of the penetration hole TRH may be 2.7 mm. The center of the penetration hole TRH may be spaced apart from the adjacent edge of the first main cover CVU by 3.0 mm. For example, the center of the penetration hole TRH of the fixing hole DH1 placed at the first corner CNR1 of the first main cover CVU may be spaced apart from each of the first long side LS1 and the first short side SS1 by 3.0 mm.

At the boundary between the penetration hole TRH and the expansion hole ENH, the expansion hole ENH may include a bottom surface placed on the XY plane. The bottom surface of the expansion hole ENH may serve as a head seating portion on which a screw head 330H (shown in fig. 15) of the device screw 330 is seated.

A spiral (i.e., a mechanical thread) may be formed on the inner wall of the penetration hole TRH. Even in this case, the spiral may not be placed on the inner wall of the expansion hole ENH.

The expansion holes ENH may include a first expansion hole ("ENH 1" of fig. 16) placed above the penetration hole TRH and a second expansion hole ("ENH 2" of fig. 16) placed below the penetration hole TRH. The first expansion hole ENH1 and the second expansion hole ENH2 may be in a symmetrical relationship. The first expansion hole ENH1 and the second expansion hole ENH2 may have the same inner diameter and height, but are not limited thereto.

The fixing holes DH1 to DH3 having the aforementioned structure may help to eliminate the fixing process of the memory device 100. Specifically, the memory device 100 may be fixed to a host or an electronic device having a screw receiving hole ("400H" of fig. 15, or referred to as a "fastener receiving hole") by a device screw 330. If screw receiving hole 400H is placed below memory device 100, in some cases, device screw 330 may need to be inserted from above, in other cases, from below. The fixing holes DH1 to DH3 allow upward and downward insertion of the device screw 330, and the first and second expansion holes ENH1 and ENH2 provided at both ends of the fixing holes DH1 to DH3 provide a seating space for the screw head 330H for both upward and downward insertion, which may ensure safe fixation (i.e., the screw head 330H may be sunk in the fixing holes DH1 to DH 3). Unexplained reference numeral "330B" (as shown in fig. 15) denotes a main body of the device screw 330.

As shown in fig. 3, the first housing 121 may further include at least one clamping hole CLH penetrating the first main cover CVU. When connected to the host connector 200, the clamping hole CLH provides a space for the hook 211 of the host connector 200 (fig. 9) to be inserted. The clamping hole CLH may be positioned adjacent to the first short side SS1 of the first main cover CVU.

The clamping hole CLH may be positioned at a position overlapping the memory connector MCN. The chucking hole CLH may have a rectangular shape in which the second direction Y is a long side in a plan view. In an embodiment, the width of the clamping hole CLH in the second direction Y may be 4.0mm and the width in the first direction X may be 2.5mm, but other dimensions are also possible.

The number of the clamping holes CLH may correspond to the number of the hooks 211 on the host connector 200. There may also be two clamping holes CLH if the host connector 200 includes two hooks 211. The plurality of chucking holes CLH may be arranged along the second direction Y. In an embodiment, one clamping hole CLH may be placed to be spaced 7.25mm from the second long side LS2 of the first main cover CVU, and the other clamping hole CLH may be placed to be spaced 16.25mm from the second long side LS2 of the first main cover CVU. The gap between the clamping holes CLH may be 5.0 mm.

Referring to fig. 2 to 5 and 8, the second housing 122 includes a second main cover CVB as a lower cover.

The second main cover CVB is placed on the XY plane. The second main cover CVB may have the same thickness as that of the first main cover CVU, but the embodiment is not limited thereto.

The area of the second main cover CVB may be smaller than that of the first main cover CVU. The second main cover CVB covers the entire module board BDH of the memory module 110 from below, but may be configured to expose the memory connector MCN. The first short side SS1 of the second main cover CVB is placed inside the first short side SS1 of the first main cover CVU, and may be positioned inside the end of the memory connector MCN. The first short side SS1 of the first main cover CVU may be disposed on the first short side SS1 of the module board BDH, but is not limited thereto.

The second main cover CVB may include first and second chamfered portions CAF1 and CAF2 (fig. 8) formed at each of the second and third corners CNR2 and CNR3 so as not to interfere with the inter-device fastening columns DL2 and DL3 of the first case 121 (that is, so as not to overlap the inter-device fastening columns DL2 and DL3 in the third direction Z). The shape of the first chamfered portion CAF1 may be substantially the same as the shape of the lower face BF of the second inter-device fastening post DL2, and the shape of the second chamfered portion CAF2 may be substantially the same as the shape of the lower face BF of the third inter-device fastening post DL 3. As shown in fig. 8, when the chamfered portions CAF1 and CAF2 are formed on the second main cover CVB, the first long side LS1, the second long side LS2, and the second short side SS2 of the second main cover CVB may be recognized as shapes protruding from the virtual rectangle LL. The first long side LS1, the second long side LS2, and the second short side SS2 of the second main cover CVB protruding from the virtual rectangle LL may be disposed on the first long side LS1, the second long side LS2, and the second short side SS2 of the first main cover CVU, respectively.

As shown in fig. 8, second case 122 may include coupling holes CPH1 to CPH4 spatially connected to module fastening holes MH1 to MH4 and fastened by module screws 130. The number of the coupling holes CPH1 to CPH4 of the second housing 122 may correspond to the same number of module fastening holes MH1 to MH 4. The coupling holes CPH1 through CPH4 of the second case 122 may overlap the module fastening holes MH1 through MH4 and the coupling grooves CPG1 through CPG4 of the first case 121 corresponding to the module fastening holes MH1 through MH 4. Although the plane shapes of the coupling holes CPH1 through CPH4 and the module fastening holes MH1 through MH4 of the second housing 122 may be the same, the embodiment is not limited thereto.

As shown in fig. 3, the second housing 122 may include bottom fastening posts LB1 to LB4 in which the coupling holes CPH1 to CPH4 are positioned. If there are four coupling holes CPH 1-CPH 4, four bottom fastening posts LB 1-LB 4 may also be provided. That is, second housing 122 has a first bottom fastening post LB1 placed at first corner CNR1, a second bottom fastening post LB2 placed at second corner CNR2, a third bottom fastening post LB3 placed at third corner CNR3, and a fourth bottom fastening post LB4 placed at fourth corner CNR 4.

Bottom fastening columns LB1 to LB4 protrude upward from the upper face UF of the second main cover CVB. In an embodiment, the ends of bottom fastening posts LB 1-LB 4 may make contact with the underlying BF of memory module 110 (or module board BDH). The bottom fastening posts LB1 through LB4 may serve as spacers to maintain a gap between the second housing 122 and the memory module 110.

The coupling holes CPH 1-CPH 4 are placed in the bottom fastening posts LB 1-LB 4. The coupling holes CPH1 to CPH4 may penetrate the bottom fastening posts LB1 to LB4 in the third direction Z. The coupling holes CPH1 to CPH4 may extend through the bottom fastening posts LB1 to LB4 to be opened at the bottom fastening posts LB1 to LB4 and at the lower face BF of the second main cover CVB. The combination holes CPH1 through CPH4 may provide a seating jaw (seat jaw) on which the head 130H of the module screw 130 is seated by including a hole enlargement having an enlarged inner diameter at the lower portion. When the coupling holes CPH1 to CPH4 are placed inside the bottom fastening posts LB1 to LB4 in this way, the contact area with the module screw 130 is increased, and the fastening strength between the components due to the module screw 130 may be increased.

The bottom fastening posts LB1 to LB4 may have a polygonal shape (such as a square, a rectangle, or a rounded rectangle). However, embodiments are not limited to polygonal shapes.

The height of the bottom fastening columns LB1 to LB4 may be varied according to the position and thickness of the memory module 110 placed therein, the height standard of the memory device 100, and the like. The height of bottom fastening posts LB1 to LB4 may be smaller than the height of side covers CV _ SF1, CV _ SF2, and CV _ SF 3.

The XY plane-based widths of bottom fastening posts LB 1-LB 4 may be greater than the widths (or thicknesses) of side covers CV _ SF1, CV _ SF2, and CV _ SF 3.

The first housing 121, the memory module 110, and the second housing 122 may be fastened to each other by module screws 130. Each module screw 130 sequentially passes through a corresponding one of the coupling holes CPH1 through CPH4 and a corresponding one of the module fastening holes MH1 through MH4 of the second housing 122 from the lower face BF of the second housing 122, and is inserted into the coupling grooves CPG1 through CPG4 of the first housing 121 to couple them to each other. A screw (i.e., a mechanical thread) rotated in the same direction may be placed on the inner walls of the coupling holes CPH1 to CPH4 of the second housing 122, the module fastening holes MH1 to MH4, and/or the coupling grooves CPG1 to CPG4 of the first housing 121 for smooth fastening with the module screw 130. In the fastened memory device 100, the head 130H of the module screw 130 may be placed under the second case 122, and may also be placed inside the coupling holes CPH1 to CPH4 of the second case 122. "130B" may represent the body of the module screw 130.

Referring to fig. 2 to 8, the memory device 100 may have a sealing structure in which the memory module 110 is completely enclosed by the first and second housings 121 and 122 except for the fourth side SF4 on which the memory connector MCN is placed when assembled.

Specifically, an end of the first side cover CV _ SF1 of the first outer case 121 may be in contact with an upper face UF of the second main cover CVB on the first long side LS1 side. The side face of the second main cover CVB on the first long side LS1 side constitutes the first side face SF1 of the memory device 100 together with the outer face of the first side cover CV _ SF 1. Although the side of the second main cover CVB on the side of the first long side LS1 and the outer face of the first side cover CV _ SF1 are aligned with each other and may be placed on the same XZ plane, the embodiment is not limited thereto.

Further, an end of the second side cover CV _ SF2 of the first outer case 121 may be in contact with an upper face UF of the second main cover CVB on the second short side SS2 side. The side of the second main cover CVB on the second short side SS2 side may constitute a second side SF2 of the memory device 100 together with the outer face of the second side cover CV _ SF 2. Although the side of the second main cover CVB on the side of the second short side SS2 and the outer face of the second side cover CV _ SF2 are aligned with each other and may be placed on the same YZ plane, the embodiment is not limited thereto.

Further, an end of the third side cover CV _ SF3 of the first outer case 121 may be in contact with the upper face UF of the second main cover CVB on the second long side LS2 side. The side surface of the second main cover CVB on the second long side LS2 side may constitute the third side surface SF3 of the memory device 100 together with the outer face of the third side cover CV _ SF 3. Although the side of the second main cover CVB on the side of the second long side LS2 and the outer face of the third side cover CV _ SF3 are aligned with each other and may be placed on the same XZ plane, the embodiment is not limited thereto.

As shown in fig. 8, in the second corner CNR2 and the third corner CNR3, the second main cover CVB includes a first chamfered portion CAF1 and a second chamfered portion CAF 2. These first and second chamfered portions CAF1 and CAF2 form respective openings that receive the second and third inter-device fastening posts DL2 and DL3 of the first housing 121. Both side surfaces of the first chamfered portion CAF1 of the second main cover CVB make contact with both side surfaces of the adjacent second inter-device fastening post DL2, and both side surfaces of the second chamfered portion CAF2 of the second main cover CVB may make contact with both side surfaces of the adjacent third inter-device fastening post DL3, respectively. Thus, the second corner CNR2 and the third corner CNR3 of the assembled memory device 100 may be sealed.

In the case of the first corner CNR1, an opening where the second main cover CVB is not placed is provided, and the space is filled with the first inter-device fastening post DL 1.

The ends of the first to third inter-device fastening pillars DL1 to DL3 may be placed on the same XY plane as the lower face BF of the second main cover CVB.

In the case of the fourth corner CNR4, although there is no inter-device fastening post, since the third side cap CV _ SF3 has a width corresponding to that of the first inter-device fastening post DL1 and protrudes downward, the total height may be adjusted. In this case, the end of the protruding third side cover CV _ SF3 may be placed on the same XY plane as the lower face BF of the second main cover CVB.

The first side SF1, the second side SF2, and the third side SF3 of the memory device 100 may be securely sealed by the fastening structure as described above. Fourth side SF4 of memory device 100 may be substantially sealed by host connector 200 described below.

In this way, when the memory device 100 has a sealing structure, the mechanical strength can be increased. When the memory device 100 is applied to mobility-related electronic devices such as automobiles, drones, and airplanes, the memory device 100 may be exposed to impacts such as vibrations and may be subjected to strong external impacts such as traffic accidents. However, since the mechanical strength is increased by the sealing structure as described above, the mechanical reliability can be improved. In addition, mobility-related electronic devices may be exposed to harsh environments as specified by USCAR (american automobile research council), LV124 (quality and reliability test standards co-established by german automobile manufacturers), and the like. In the case of the memory device 100 which is tightly sealed as in the present embodiment, the memory device 100 has excellent moisture-proof and dust-proof characteristics and can exhibit high reliability even in a severe environment. In addition, the sealing structure has a significant effect in protecting the memory device 100 from EMI, EMC, and other electromagnetic waves. Further, in the case of the embodiment, even for internal chip heat generation, heat dissipation is effectively performed by the sealing structure in which each portion is in contact with each other, and when the case assembly 120 includes a thermal interface material or the like, the heat capacity increases, and the DTT entry time of the memory device 100 can be delayed. In addition, since the memory device 100 includes the coupling holes CPH1 to CPH4 that can be fastened in the upward direction and the downward direction, the memory device 100 can be securely fixed to a host or an electronic device in various ways. A detailed explanation thereof will be described later.

Hereinafter, a method of fastening the memory device 100 to the host connector 200 will be explained. First, the structure of the host connector 200 will be explained.

Fig. 9 is a partial perspective view of a host according to an embodiment. Fig. 10 is a cross-sectional view of fig. 9. FIG. 11 is a partial perspective view of a memory device according to an embodiment.

Referring to fig. 9 to 11, the host may include a host connector 200 and a system board SBD.

The system board SBD may include a Printed Circuit Board (PCB). The host connector 200 may be fixed to the system board SBD. Although the drawings show a shape in which the host connector 200 is fixed to the system board SBD by a threaded fastener, the fixing method is not limited to the illustrated method. The host connector 200 and the system board SBD may be electrically connected.

Host connector 200 may include a connector body HB, a plurality of connection terminals EL2 mounted in connector body HB, and a latch 210 mounted on upper face UF of connector body HB.

Connector body HB may include a main body HBM and a body cap HBC. A connector hole COH accommodating the memory connector MCN is provided at the front (one of the side faces, and is a facing surface facing the first side face SF1 of the memory device 100) of the main body HBM. As shown in fig. 9, body HBM and body cover HBC may be at least partially spaced apart from each other, and slots SLT1 and SLT2 may be defined that receive at least a portion of housing assembly 120. As will be explained later, the groove may include a side groove portion SLT1 and an upper groove portion SLT2 that is angled with respect to the side groove portion SLT 1. The side groove portion SLT1 and the upper groove portion SLT2 are spatially connected. The body HBM and the body cap HBC may be provided as separate members and may then be fastened together. Alternatively, the main body HBM and the body cover HBC may be integrally formed.

The connector hole COH is provided on a front (or facing surface) of the main body HBM. The horizontal width of the connector hole COH is equal to or greater than the horizontal width of the memory connector MCN of the memory device 100 to provide a space capable of accommodating the memory connector MCN. As shown in fig. 10, a plurality of connection terminals EL2 may be placed inside the connector hole COH of the main body HBM. When the memory connector MCN of the memory device 100 is inserted into the connector hole COH, the connection terminal EL1 of the memory connector MCN and the connection terminal EL2 of the host connector 200 are electrically connected to each other, and the memory device 100 and the host may be interconnected. At least some or all of the sides (the first side SF1 and the third side SF3), the upper UF, and the lower BF of the memory connector MCN inserted into the connector hole COH for complete airtightness may come into contact with the inner wall of the connector hole COH, but the embodiment is not limited thereto.

The body cover HBC may include a side cover portion HBC _ S covering one outer face of the main body HBM and upper cover portions HBC _ U1 and HBC _ U2 covering an upper face UF of the main body HBM. The side cover portion HBC _ S is spaced apart from one side surface of the main body HBM by a distance equal to or greater than the thickness of the third side cover CV _ SF3 of the first housing 121, and constitutes a side groove portion SLT1 that accommodates the third side cover CV _ SF 3. The upper lid portions HBC _ U1 and HBC _ U2 are spaced from the upper face UF of the main body HBM by a distance equal to or greater than the thickness of the first main lid CVU of the first housing 121, and constitute an upper slot portion SLT2 that accommodates the first main lid CVU.

As shown in fig. 9, the upper lid portion may include a first upper lid portion HBC _ U1 adjacent to the side lid portion HBC _ S and a second upper lid portion HBC _ U2 positioned to be spaced apart from the first upper lid portion HBC _ U1. The first upper cover part HBC _ U1 may be directly connected to the side cover part HBC _ S. In the space between the first upper lid section HBC _ U1 and the second upper lid section HBC _ U2, the upper face UF of the main body HBM may be exposed without being covered by the body lid HBC.

The latch 210 is placed in a space between the first upper lid section HBC _ U1 and the second upper lid section HBC _ U2. As shown in fig. 9, the ends of the latch 210 may be recessed relative to the ends of the upper cover portions HBC _ U1 and HBC _ U2.

The latch 210 may include a latch body 210_ BD and one or more hooks 211 placed at an end of the latch body 210_ BD. The number and size of the hooks 211 may correspond to the number and size of the clamping holes CLH of the memory device 100.

The hook 211 may protrude outward from an end of the latch body 210_ BD in a plan view. IN the sectional view, the hook 211 may include a tip end 211_ TP protruding downward, an outer face 211_ OU of the tip end 211_ TP, and an inner face 211_ IN of the tip end 211_ TP. As shown in fig. 10, the width of the hook 211 may be gradually narrowed toward the tip 211_ TP along the third direction Z.

In the sectional view, the outer face 211_ OU of the hook 211 may have a slope inclined inward toward the tip 211_ TP. The profile of the ramp may have a straight line or a convex curve.

IN the sectional view, the inner face 211_ IN of the hook 211 may have a straight line or a concave curve. The absolute value of the angle formed by the inner face 211_ IN of the hook 211 and the latch body 210_ BD may be greater than the absolute value of the angle formed by the outer face 211_ OU of the hook 211 and the latch body 210_ BD.

Latch 210 may be coupled to connector body HB by way of a tab 212. The joint 212 may be configured to include a spring. Since the spring has a restoring force, even if the latch 210 is lifted by an external force, the spring may lower the latch 210 to an original position when the external force is removed.

Fig. 12 is a perspective view showing a state in which the memory device is secured to the host. Fig. 13 is a perspective view showing a state before the memory device is fastened to the host. Fig. 14 is a sectional view showing a process of fastening the memory connector to the host connector.

Referring to fig. 12 to 14, the latch 210 of the host connector 200 is in a state where the latch body 210_ BD is positioned in the horizontal direction and the hook 211 is directed downward before being fastened to the memory device 100. The hook 211 is positioned at a lower height than the upper face UF of the first main cover CVU of the first housing 121 with respect to the memory device 100 to be inserted.

The fourth side SF4 of the memory device 100 is pushed into the front of the host connector 200 for fastening. At this time, the memory connector MCN is inserted into the inside of the connector hole COH, the third side cover CV _ SF3 is inserted into the side groove portion SLT1, and the first main cover CVU is inserted into the upper groove portion SLT2, respectively. During the fastening process, the side groove portion SLT1 and the upper groove portion SLT2 may be used to guide the memory device 100 to be inserted in the correct direction.

When the memory device 100 is further pushed, the end of the first main cover CVU of the first housing 121 positioned on the first short side SS1 may come into contact with the outer face 211_ OU of the hook 211. In this state, when the memory device 100 is further pushed, the hook 211 is automatically lifted along the slope of the outer face 211_ OU by a force. When the tip 211_ TP of the hook 211 is lifted above the upper face UF of the first main cover CVU, the end of the first main cover CVU may be further moved inward. At this time, the end of the first main cover CVU is no longer in contact with the hook 211. The lifted hook 211 may be lowered downward by a restoring force of a spring applied to the joint 212. Although the hook 211 receives a restoring force to point to the lower point, since the upper face UF of the first main cover CVU is positioned at a higher position than the lower point, the hook 211 is not lowered any more and may be placed on the upper face UF of the first main cover CVU.

Next, when the memory device 100 is further pushed inward, the hook 211 reaches a point where the clamping hole CLH of the first housing 121 is positioned, at which point the restoring force of the spring applied to the joint 212 acts, and the hook 211 is inserted into the clamping hole CLH. In this state, the connection terminal EL1 of the memory connector MCN and the connection terminal EL2 of the host connector 200 are electrically connected, and the connection is completed.

When the hook 211 is inserted into the chucking hole CLH, the hook 211 restricts the movement of the chucking hole CLH in the first direction X. Accordingly, the memory device 100 including the chucking hole CLH may be prevented from moving in the first direction X. Further, incomplete insertion or over-insertion of the memory device 100 is prevented so that the connection terminal EL1 of the memory connector MCN and the connection terminal EL2 of the host connector 200 can be connected at a desired position.

Further, as described above, the third side cover CV _ SF3 of the memory device 100 is inserted into the side groove portion SLT1, and the first main cover CVU is inserted into the upper groove portion SLT 2. The side groove portion SLT1 may restrict movement of the memory device 100 in the second direction Y, and the upper groove portion SLT2 may restrict movement of the memory device 100 in the third direction Z. Thus, the memory device 100 can achieve tight fastening to the host, with movement in the first direction X, the second direction Y, and the third direction Z being restricted in the memory device 100.

Meanwhile, the exposed fourth side SF4 and the clamping hole CLH of the memory device 100 may be completely covered by the connector body HB and the latch 210 by being fastened with the host connector 200. The structure in which memory device 100 is inserted into slots SLT1 and SLT2 of connector body HB may not only help prevent movement, but may also form a substantially sealed structure. As described above, since the sealing structure of such a memory system is advantageous in terms of impact resistance, dust resistance, moisture resistance, expansion of heat capacity, electromagnetic wave shielding, and the like, a repeated explanation will not be provided.

Fig. 15 is a schematic diagram showing a process of fixing a memory device according to an embodiment to an electronic device. Fig. 16 is a sectional view illustrating a fixing process at the first inter-device fastening post of fig. 15. Fig. 17 is a sectional view illustrating a fixing process at the second inter-device fastening post of fig. 15.

Referring to fig. 15 to 17, the memory device 100 fastened to the host connector 200 may be placed on a fixing member (e.g., the system board SBD or the frame 400) of the host or an electronic device including the host. Memory device 100 may be secured to an electronic device by means of device screws 330.

As described above, the first case 121 of the memory device 100 may include the inter-device fastening pillars DL1 to DL3, and the inter-device fastening pillars DL1 to DL3 include each of the three fixing holes DH1 to DH 3. Each of the fixing holes DH1 to DH3 includes a penetration hole TRH and expansion holes ENH at both ends of the penetration hole TRH. The first expansion hole ENH1 positioned at the upper side provides a seating space for the head 300H of the device screw 330 inserted from above, and the second expansion hole ENH2 positioned at the lower side may provide a seating space for the head 300H of the device screw 330 inserted from below. Thus, as shown, memory device 100 allows for the insertion of device screw 330 up and down. Such a fixed structure may be advantageous in terms of process freedom of the memory device 100.

For example, all device screws (i.e., threaded fasteners) 330 of the memory device 100 may be inserted and secured from above. As another example, all device screws 330 of the memory device 100 may be inserted and fixed from below. As another example, as shown in fig. 15, some of the device screws 330 may be inserted from above, and some of the remaining device screws 330 may be inserted and fixed from below. This insertion of the device screw 330 from multiple directions allows for attachment to a host or electronic device of various configurations. Further, since a method having excellent processing efficiency can be selected, the processing efficiency can be improved. Further, when the device screw 330 is inserted into one memory apparatus 100 in different directions, a strict fixing structure against an external force vibrating in the third direction Z can be realized.

Fig. 18 is a perspective view showing a host connector and a memory device according to another embodiment. Fig. 18 shows that a cable type connector can be used as the host connector 201.

Referring to fig. 18, unlike the embodiment of fig. 9, the host connector 201 according to the present embodiment is not fixed to a system board or the like, but is provided as a cable type connector instead. Cable 201_ CB may be connected to other cables or to a system board of a host.

Also in the case of this embodiment, as shown in fig. 9 and 10, host connector 201 includes connector body HB, a plurality of connection terminals EL2 mounted in connector body HB, and latch 210 mounted on upper face UF of connector body HB, and connector body HB includes grooves SLT1 and SLT 2. As described above with reference to fig. 9 and 10, when the memory device 100 is inserted into the connector hole COH of the host connector 201, the latch 210 is fastened to the clamping hole CLH of the memory device 100. Further, the third side cover CV _ SF3 of the memory device 100 is inserted into the side groove portion SLT1, and the first main cover CVU is inserted into the upper groove portion SLT 2. Accordingly, strict fastening in which mobility between the memory device 100 and the host connector 201 is restricted in the first direction X, the second direction Y, and the third direction Z may be performed.

In this embodiment, the memory device 100 may be fixed to the frame 400 of the electronic device in the same manner as explained with reference to fig. 15 to 17.

Hereinafter, other embodiments of the memory device 100 will be explained. In the following embodiments, repeated explanation of the same members as those described above will be simplified or not provided, and differences will be mainly explained.

Fig. 19 is a cross-sectional view of a memory device according to another embodiment. Fig. 19 shows that the memory device may further comprise a gap filler GFL.

Referring to fig. 19, a gap filler GFL may be placed between the memory module 110 and the housing assembly 120. For example, gap fillers GFL may be placed between the upper face UF of the memory module 110 and the lower face BF of the first main cover CVU of the first housing 121 and/or between the lower face BF of the memory module 110 and the upper face UF of the second main cover CVB of the second housing 122. In this manner, movement of the memory module 110 in the memory device 100 can be further prevented if the gap filler GFL fills the vertical gap between the memory module 110 and the housing assembly 120.

The gap filler GFL placed between the memory module 110 and the housing assembly 120 can make contact with the memory module 110 and/or the housing assembly 120. Although the gap filler GFL may be fitted between the memory module 110 and the housing assembly 120 in a non-attached state, the gap filler GFL may also be secured to at least one of the memory module 110 and the housing assembly 120 by methods such as applying, coating, attaching, and fastening.

The gap filler GFL may be made of a hard material or may be made of a soft material. In some cases, the gap filler GFL may include an insulating material or may include a conductive material. When the gap filler GFL includes a conductive material, the gap filler GFL can also function as wiring, electromagnetic wave shielding, and antistatic.

Fig. 20 is a cross-sectional view of a memory device according to yet another embodiment. FIG. 20 is a block diagram illustrating additional functions performed by the memory device and gap filling.

As shown in fig. 20, the memory device may include a thermal gap filler GFL _ H and/or a buffer gap filler GFL _ C.

The thermal gap filler GFL _ H may comprise a thermal interface material TIM, a phase change material PCM or an encapsulated phase change material ePCM. The thermal gap filler GFL _ H may not only serve to absorb and store heat generated from the memory module 110, but also transfer the heat to the case assembly 120 side to dissipate the heat. The thermal gap filler GFL _ H can be placed on an electronic component CHP (such as a memory or a memory controller) that generates a large amount of heat.

The buffer gap filler GFL _ C can be used to absorb an impact and protect the adjacent electronic component CHP susceptible to the impact. The buffer gap filler GFL _ C may include, but is not limited to, a polymer material (such as polyurethane for example). The buffer gap filler GFL _ C can be placed on a capacitor having a relatively low heating value but high demand for external impact protection.

FIG. 21 is a perspective view of a memory device according to another embodiment. Fig. 22 is a cross-sectional view of fig. 21 taken in a first direction.

Referring to fig. 21 and 22, the memory device according to the present embodiment is different from the embodiment of fig. 2 to 8 in that: the first case 121_1 further includes an upper fin FNU.

The upper fin FNU has a structure protruding upward from the first base BSU. The first base BSU and the upper fins FNU form a stepped structure on the upper face UF of the first housing 121_ 1. The height of the upper fins FNU protruding from the first base BSU may be about 6.5 mm. The protrusion of the upper fin FNU increases the height of the memory device, and the maximum height of the memory device may become 15 mm.

The upper fin FNU may be formed by bending the first main cover CVU of the first outer case 121_ 1. The first base BSU and the upper fin FNU may be provided as an integral structure. The thickness of the first base BSU and the thickness of the upper fins FNU may be uniform, but is not limited thereto.

Since the upper fins FNU are provided in the first case 121_1, the surface area of the first case 121_1 may be enlarged. When the surface area of the first housing 121_1 is enlarged, the heat capacity may be increased.

In addition, an additional space due to the protruding height of the upper fins FNU may be generated below the upper fins FNU of the first cover 121_ 1. When the thermal gap filler GFL _ H including TIM, PCM, ePCM, etc. is placed in the additional space, the material with increased heat capacity can be further filled by the increased volume, and the entire heat capacity of the memory device can be further increased.

The upper fin FNU may have a rectangular shape extending in the first direction X in plan view. The first base BSU is positioned near the first short side SS1 on which the clamping hole CLH is placed and the second short side SS2 on which the second inter-device fastening post DL2 and the third inter-device fastening post DL3 are placed, and the upper fin FNU may be positioned in a region between the first short side SS1 and the second short side SS 2. First and second short sides SS1 and SS2 of upper fin FNU may be positioned generally adjacent first and second short sides SS1 and SS2 of module board BDH. In the embodiment, the first and second short sides SS1 and SS2 of the upper fin FNU may be positioned inside the first and second short sides SS1 and SS2 of the module board BDH, but the embodiment is not limited thereto.

The first side SF1 and the third side SF3 of the upper fin FNU may be connected to the first side cover CV _ SF1 and the third side cover CV _ SF3 of the first case 121_1 without steps. The first side SF1 and the third side SF3 of the upper fin FNU may be placed on the same XZ plane with respect to the first side cover CV _ SF1 and the third side cover CV _ SF3, but the embodiment is not limited thereto.

FIG. 23 is a perspective view of a memory device according to another embodiment. Fig. 24 is a cross-sectional view of fig. 23 taken in a first direction.

Referring to fig. 23 and 24, the present embodiment is different from the embodiment of fig. 21 and 22 in that: the memory device includes not only the upper fin FNU but also the lower fin FNB.

Specifically, the first cover 121_1 includes upper fins FNU, and the second cover 122_1 includes lower fins FNB. The lower fin FNB has a structure protruding downward from the second base BSB. The lower fins FNB may be formed by bending the second main cover CVB of the second outer case 122_ 1. The second base BSB and the lower fin FNB may be provided as an integral structure. Although the thickness of the second base BSB and the thickness of the lower fins FNB may be uniform, the embodiment is not limited thereto. The lower fin FNB may be formed in a symmetrical shape to the upper fin FNU.

Since the lower fins FNB are provided in the second cover 122_1, the surface area of the second cover 122_1 may be enlarged. When the surface area of the second housing 122_1 is enlarged, the heat capacity may be increased.

In addition, an additional space due to the protruding height of the lower fins FNB is generated above the lower fins FNB of the second cover 122_ 1. When the thermal gap filler GFL _ H related to the heat capacity is filled in the additional space, the entire heat capacity of the memory device can be further increased.

In this embodiment, the height of the memory device can be increased by the sum of the protruding height of the upper fins FNU and the protruding height of the lower fins FNB. If the increase in height of the memory device caused by the fins FNU and FNB is designed to be about 6.5mm as in the embodiment of fig. 21 and 22, the projecting height of the upper fin FNU and the projecting height of the lower fin FNB can be adjusted accordingly. In an embodiment, the protruding height of the upper fins FNU and the protruding height of the lower fins FNB may be the same 3.25mm, respectively.

When compared to the embodiment of fig. 21 and 22, if the sum of the height of the upper fins FNU and the height of the lower fins FNB is 6.5mm, the increase in volume due to the fins FNU and FNB may not be significantly different from the embodiment of fig. 21 and 22. However, this embodiment also differs from the embodiment of fig. 21 and 22 in that: a heat absorption path or a heat dissipation path is additionally provided in the upper and lower portions of the memory module 110. Based on such differences, an appropriate embodiment may be selected in consideration of the arrangement position of the heat generating element in the memory module 110, and the like. In some cases, by including all of the upper fins FNU and the lower fins FNB, but by setting these heights to be different from each other, the volumes of the additional spaces provided at the upper and lower portions of the memory module 110 can also be precisely adjusted.

FIG. 25 is a perspective view of a memory device according to another embodiment. Fig. 26 is a cross-sectional view of fig. 25 taken along a second direction.

Referring to fig. 25 and 26, the memory device according to the present embodiment is different from the embodiment of fig. 21 and 22 in that: the upper fin FNU of the first case 121_2 includes a plurality of upper sub-fins FFU.

The upper fin FNU has a structure protruding upward from the first base BSU. The upper fin FNU includes a plurality of upper sub-fins FFU. Each of the upper sub-fins FFU may be arranged along the second direction Y. The space between the upper sub-fins FFU is also positioned to protrude upward from the first base BSU. In an embodiment, the maximum height of the upper sub-fin FFU may be 6.5 mm.

In an exemplary embodiment, the number of the upper sub-fins FFU may be eight. The widths of the upper sub-fins FFU in the second direction Y are generally uniform, but the upper sub-fins FFU positioned at both ends in the second direction Y may have a width smaller than that of the central upper sub-fin FFU. The gap between the upper sub-fins FFU may be, but is not limited to, about the same as the width of the upper sub-fins FFU.

This embodiment shows a case where the lower space of the protruding upper fin FNU is filled with the material of the first casing 121_2 itself instead of the thermal gap filler GFL _ H. In this case, if the first case 121_2 is made of a material such as TIM, PCM, and ePCM, it may be advantageous to increase the heat capacity. In addition, in the case of this embodiment, the surface area of the first housing 121_2 may be further increased by including a plurality of upper sub-fins FFU. Therefore, it can be expected that the heat capacity increases with the increase in the surface area of the first housing 121_ 2.

FIG. 27 is a perspective view of a memory device according to yet another embodiment. Fig. 28 is a cross-sectional view of fig. 27 taken along a second direction.

Referring to fig. 27 and 28, the memory device according to the present embodiment is different from the embodiment of fig. 25 and 26 in that: the second housing 122_2 further includes a lower fin FNB including a plurality of lower sub-fins FFB. The sum of the maximum height of the upper sub-fin FFU and the maximum height of the lower sub-fin FFB may be 6.5 mm.

In an exemplary embodiment, the number of the lower sub-fins FFB may be eight. The arrangement of the lower sub-fins FFB may be substantially the same as the arrangement of the upper sub-fins FFU. As in the embodiment of fig. 23 and 24, the upper space of the lower fin FNB may be filled with the second casing 122_2 material.

In the case of the present embodiment, a heat absorbing path or a heat dissipating path may be additionally provided in the upper and lower portions of the memory module 110, as compared with the embodiments of fig. 25 and 26. As explained in the embodiments of fig. 23 and 24, based on the above-described differences, an appropriate embodiment may be selected in consideration of the arrangement positions of the heat generating elements and the like in the memory module 110.

It will be appreciated by those skilled in the art that many variations and modifications can be made to the preferred embodiment without substantially departing from the principles of the present inventive concept. Accordingly, the disclosed preferred embodiments of the inventive concept are used in a generic and descriptive sense only and not for purposes of limitation.