阅读说明：本技术 电子设备、耳机转接线及电子设备组件 (Electronic equipment, earphone patch cord and electronic equipment subassembly ) 是由 林翔 于 2021-08-30 设计创作，主要内容包括：本申请公开了一种电子设备、耳机转接线及电子设备组件,该电子设备包括：中央处理器(Central Processing Unit,CPU)、开关模组和通信接口,通信接口包括第一传输端口和第二传输端口；其中,CPU的第一端口与开关模组的第一端连接,CPU的第二端口与开关模组的第二端连接,开关模组的目标第三端与第一传输端口连接,开关模组的使能端与第二传输端口连接；在耳机转接线与通信接口连接的情况下,开关模组根据第二传输端口的使能以使CPU与第一传输端口导通,第一传输端口与耳机转接线中的反馈电路连接,第二传输端口与耳机转接线中的接地模块连接。(The application discloses electronic equipment, earphone patch cord and electronic equipment subassembly, this electronic equipment includes: the system comprises a Central Processing Unit (CPU), a switch module and a communication interface, wherein the communication interface comprises a first transmission port and a second transmission port; the first port of the CPU is connected with the first end of the switch module, the second port of the CPU is connected with the second end of the switch module, the target third end of the switch module is connected with the first transmission port, and the enabling end of the switch module is connected with the second transmission port; under the condition that the earphone patch cord is connected with the communication interface, the switch module enables the CPU to be conducted with the first transmission port according to the enabling of the second transmission port, the first transmission port is connected with the feedback circuit in the earphone patch cord, and the second transmission port is connected with the grounding module in the earphone patch cord.)

1. An electronic device, characterized in that the electronic device comprises: the system comprises a Central Processing Unit (CPU), a switch module and a communication interface, wherein the communication interface comprises a first transmission port and a second transmission port;

the first port of the CPU is connected with the first end of the switch module, the second port of the CPU is connected with the second end of the switch module, the third end of the switch module is connected with the first transmission port, and the enable end of the switch module is connected with the second transmission port;

under the condition that an earphone patch cord is connected with the communication interface, the switch module enables the CPU to be conducted with the first transmission port according to the enabling of the second transmission port, the first transmission port is connected with a feedback circuit in the earphone patch cord, and the second transmission port is connected with a grounding module in the earphone patch cord.

2. The electronic device of claim 1, further comprising a first circuit comprising a ground module and a microphone module; the switch module further comprises a fourth end and a fifth end;

the fourth end is connected with a grounding module in the first circuit, and the fifth end is connected with the microphone module;

and under the condition that the earphone patch cord is not connected with the communication interface, the switch module enables the CPU to be conducted with the first circuit.

3. The electronic device of claim 1 or 2, wherein the switch module is a two-way single-pole double-throw switch; the third end of the switch module comprises a first sub-port and a second sub-port;

the first end of the double-path single-pole double-throw switch is connected with the first port of the CPU, the second end of the double-path single-pole double-throw switch is connected with the second port of the CPU, the sixth end and the seventh end of the double-path single-pole double-throw switch are both connected with the first transmission port, and the enabling end of the double-path single-pole double-throw switch is connected with the second transmission port.

4. The electronic device of claim 1 or 2, wherein the switch module is four field effect transistors; the third end of the switch module is provided with a source electrode S of the first field effect transistor and a source electrode S of the second field effect transistor;

a drain electrode D of a first field effect transistor is connected with a first port of the CPU, a grid G of the first field effect transistor is an enabling end, the grid G of the first field effect transistor is connected with the second transmission port, and a source electrode S of the first field effect transistor is connected with the first transmission port;

a drain electrode D of a second field effect transistor is connected with a second port of the CPU, a grid G of the second field effect transistor is an enabling end, the grid G of the second field effect transistor is connected with the second transmission port, and a source electrode S of the second field effect transistor is connected with the first transmission port;

a drain electrode D of a third field effect transistor is connected with a first port of the CPU, a grid G of the third field effect transistor is an enabling end, the grid G of the third field effect transistor is connected with the second transmission port, and a source electrode S of the third field effect transistor is connected with a grounding module in the electronic equipment;

and a drain D of a fourth field effect transistor is connected with a second port of the CPU, a grid G of the fourth field effect transistor is an enabling end, the grid G of the fourth field effect transistor is connected with the second transmission port, and a source S of the fourth field effect transistor is connected with a microphone module in the electronic equipment.

5. A headset patch cord, the headset patch cord comprising: a feedback circuit and a first grounding module;

the feedback circuit is connected with a first transmission port in a communication interface of the electronic equipment, and the first grounding module is connected with a second transmission port in the communication interface;

the feedback circuit receives the audio signal output by the electronic equipment through the first transmission port.

6. The headset patch cord of claim 5, wherein the feedback circuit comprises at least one of: the device comprises a left sound channel module, a right sound channel module, a microphone module, a second grounding module and a channel configuration module.

7. The earphone patch cord of claim 5 or 6, wherein a second grounding module in the feedback circuit is connected to the first transmission port;

and a first configuration channel module and a second configuration channel module in the feedback circuit are both connected with the first grounding module.

8. An electronic device assembly, characterized in that the electronic device assembly comprises an electronic device according to any one of claims 1 to 4, and a headset patch cord according to any one of claims 5 to 7, which is detachably connected to a communication interface of the electronic device.

9. A method for outputting an audio signal, the method comprising:

under the condition that the electronic equipment is connected with the earphone patch cord, a control module in the electronic equipment is conducted with a circuit of the first port through enabling of the second port;

the audio signal output device outputs an audio signal to the earphone patch cord through the first transmission port.

10. The method of claim 9, further comprising:

under the condition that the electronic equipment is not connected with the earphone patch cord, connecting the control module with the first circuit;

an audio signal is output by the first circuit.

Technical Field

The application belongs to the technical field of communication, and particularly relates to an electronic device, an earphone patch cord and an electronic device assembly.

Background

Generally, when the electronic device is connected to the headphone device, a type C (Universal Serial Bus (USB)) interface may be used for connection. Specifically, the type C port of the electronic equipment is connected with the type C interface of the type C transfer 3.5mm transfer line, and the earphone interface of the type C transfer 3.5mm transfer line is connected with the earphone equipment, so that the audio signal output by the electronic equipment is transmitted to the earphone equipment through the type C transfer 3.5mm transfer line.

However, since the signal feedback angle in the electronic device is only connected to the type C interface of the electronic device, when an audio signal reaches the type C interface, the impedance of the section of the patch cord that the type C is connected to by 3.5mm, and the impedance of the patch cord connected to the type C interface of the electronic device are both large, which may cause crosstalk to occur in the left and right channels of the headphone device, thereby resulting in poor sound quality of the audio signal output by the headphone device.

Disclosure of Invention

The embodiment of the application aims to provide electronic equipment, an earphone patch cord and an electronic equipment assembly, and the problem that crosstalk occurs in left and right sound channels of the earphone equipment, so that the tone quality of audio signals output by the earphone equipment is poor can be solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides an electronic device, including: the system comprises a Central Processing Unit (CPU), a switch module and a communication interface, wherein the communication interface comprises a first transmission port and a second transmission port; the first port of the CPU is connected with the first end of the switch module, the second port of the CPU is connected with the second end of the switch module, the target third end of the switch module is connected with the first transmission port, and the enabling end of the switch module is connected with the second transmission port; under the condition that the earphone patch cord is connected with the communication interface, the switch module enables the CPU to be conducted with the first transmission port according to the enabling of the second transmission port, the first transmission port is connected with the feedback circuit in the earphone patch cord, and the second transmission port is connected with the grounding module in the earphone patch cord.

In a second aspect, an embodiment of the present application provides a headset patch cord, where the headset patch cord includes: a feedback circuit and a first grounding module. The feedback circuit is connected with a first transmission port in a communication interface of the electronic equipment; the first grounding module is connected with a second transmission port in the communication interface; the feedback circuit receives the audio signal output by the electronic equipment through the first transmission port.

In a third aspect, an embodiment of the present application provides an electronic device assembly, including: the electronic device of the first aspect, and the headset patch cord of the second aspect.

In the embodiment of the application, because the audio signal can directly reach the feedback circuit in the earphone patch cord through the communication interface and the path of the earphone patch cord, the problem that crosstalk occurs in the left and right sound channels of the earphone device due to the fact that the impedance of the patch cord of 3.5mm is switched by the type C when the audio signal reaches the type C interface and the impedance of the patch cord connected with the type C interface of the electronic device is large is avoided, and the audio performance of the type C interface is effectively improved and the tone quality of the audio signal output by the earphone device is improved.

Drawings

Fig. 1 is a structural diagram of an earphone device provided in the related art;

fig. 2 is a schematic diagram of an electronic device provided by the related art interfacing with a headset;

fig. 3 is a schematic diagram of an electronic device according to an embodiment of the present application;

fig. 4 is a second schematic diagram of an electronic device according to an embodiment of the present disclosure;

fig. 5 is a third schematic diagram of an electronic device according to an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a typeC to 3.5mm patch cord according to an embodiment of the present disclosure;

FIG. 7 is a second schematic structural diagram of a typeC to 3.5mm patch cord according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of an electronic device assembly according to an embodiment of the present disclosure;

fig. 9 is a second schematic structural diagram of an electronic device assembly according to an embodiment of the present disclosure;

fig. 10 is a schematic hardware structure diagram of an electronic device according to an embodiment of the present disclosure;

fig. 11 is a second schematic diagram of a hardware structure of an electronic device according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

The current type C to 3.5mm patch cord will cause the crosstalk performance to be reduced. Crosstalk refers to the ratio of the magnitude of sound output by one channel of a headphone device to that of sound output by the other channel, i.e., the separation of the left and right channels of the headphone device. As shown in fig. 1, since the left and right channels of the headphone apparatus share one GND (i.e., R in fig. 1)_GND) Because the impedance exists below the GND of the earphone device, including the impedance of the earphone line, the contact impedance of the earphone device and the earphone seat, and the wiring impedance on the board, the signal sent out on one channel of the earphone device is divided by the lower GND resistor, and is recognized by the other channel, so that crosstalk is formed.

In order to improve the crosstalk performance of the electronic device, the conventional technology solves the problem by increasing the feedback angle. Specifically, the port of the feedback horn is connected to the input anode of the headphone amplifier, and the audio signal is connected to the cathode of the input of the headphone amplifier. Thus, when one channel of the headphone set is on GND, the interference is fed back through the positive pole of the amplifier of the other channel, thereby canceling the crosstalk.

However, as shown in fig. 2, a schematic diagram of the connection between the electronic device and the earphone interface in the conventional art is shown. The electronic device comprises a Central Processing Unit (CPU) and a Type C usb interface (hereinafter referred to as a Type C port), wherein a Type C to 3.5mm patch cord comprises the Type C usb interface and a 3.5mm earphone interface, and since the feedback angles (i.e. Hph-ref1 and Hph-ref2) are only connected to the Type C port of the electronic device, the impedance of the Type C to 3.5mm patch cord section and the patch cord and the electronic device interface connection is not filtered, which is also the root cause of the crosstalk.

In order to solve the above technical problem, in the embodiment of the present application, a circuit of the electronic device may be extended to a feedback circuit in the earphone patch cord, so that a switch module in the electronic device may output an audio signal to the feedback circuit in the earphone patch cord after receiving the audio signal.

Through this application scheme, owing to prolonged behind the circuit of electronic equipment, the circuit of electronic equipment can be connected to the feedback circuit in the earphone patch cord, consequently audio signal can directly reach the feedback circuit in the earphone patch cord through this route in to avoided audio signal only can reach type C interface and lead to the problem that crosstalk appears in the left and right sound channels of earphone equipment, so when promoting the audio performance of type C interface effectively, promoted the tone quality of the audio signal of earphone equipment output.

Example one

An embodiment of the present application provides an electronic device, and fig. 3 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application. As shown in fig. 3, an electronic device provided in an embodiment of the present application may include: the device comprises a Central Processing Unit (CPU), a switch module and a communication interface, wherein the communication interface comprises a first transmission port and a second transmission port.

The first port 10 of the CPU is connected with the first end 11 of the switch module, the second port 12 of the CPU is connected with the second end 13 of the switch module, the third end 14 of the switch module is connected with the first transmission port, and the enable end of the switch module is connected with the second transmission port; under the condition that the earphone patch cord is connected with the communication interface, the switch module enables the CPU to be conducted with the first transmission port according to the enabling of the second transmission port, the first transmission port is connected with the feedback circuit in the earphone patch cord, and the second transmission port is connected with the grounding module in the earphone patch cord.

Optionally, in this embodiment of the application, the communication interface includes four ports, that is, the first transmission port specifically includes two ports (that is, the first port and the third port), and the second transmission port includes two ports (that is, the second port and the fourth port).

It can be understood that the third end of the switch module is connected with a first port of the four ports of the communication interface, and the enable end of the switch module is connected with a second port of the four ports of the communication interface; under the condition that the earphone patch cord is connected with the communication interface, the switch module conducts a circuit of the first port of the communication interface according to the enabling of the second port, the third port of the four ports is connected with the feedback circuit in the earphone patch cord, and the fourth port of the four ports is connected with the grounding module in the earphone patch cord. Under the condition that the switch module receives the audio signal, the audio signal is output to the feedback circuit through the first port and the third port of the communication interface.

For convenience of illustration of the respective ports in fig. 3, a first port of a first transmission port in the communication interface is represented by an a2 port, a second port of a second transmission port in the communication interface is represented by an A3 port, a third port of the first transmission port in the communication interface is represented by a B2 port, and a fourth port of the second transmission port in the communication interface is represented by a B3 port.

Optionally, in this embodiment of the present application, the switch module may be a two-way single-pole double-throw switch or four fets.

Optionally, in this embodiment of the application, in a case that the switch module is a two-way single-pole double-throw switch, the third terminal of the switch module includes a sixth terminal and a seventh terminal. The first end of the double-path single-pole double-throw switch is connected with the first port of the CPU, the second end of the double-path single-pole double-throw switch is connected with the second port of the CPU, the sixth end and the seventh end of the double-path single-pole double-throw switch are both connected with the first transmission port, and the enabling end of the double-path single-pole double-throw switch is connected with the second transmission port.

In the embodiment of the application, under the condition that the switch module is double-circuit single-pole double-throw switch, because audio signal can pass through the route between communication interface and the earphone patch cord through double-circuit single-pole double-throw switch, directly reach the feedback circuit in the earphone patch cord, consequently avoided audio signal only can reach type C interface and lead to the problem that crosstalk appears in the left and right sound channels of earphone equipment, so when promoting the audio performance of type C interface effectively, promoted the tone quality of the audio signal of earphone equipment output.

Optionally, in this embodiment of the application, when the switch module is four fets, the third terminal of the switch module is the source S of the fet. The drain D of the first field effect transistor is connected with the first port of the CPU, the grid G of the first field effect transistor is an enabling end, the grid G of the first field effect transistor is connected with the second transmission port, and the source S of the first field effect transistor is connected with the first transmission port;

a drain electrode D of a second field effect transistor is connected with a second port of the CPU, a grid G of the second field effect transistor is an enabling end, the grid G of the second field effect transistor is connected with the second transmission port, and a source electrode S of the second field effect transistor is connected with the first transmission port;

a drain electrode D of a third field effect transistor is connected with a first port of the CPU, a grid G of the third field effect transistor is an enabling end, the grid G of the third field effect transistor is connected with the second transmission port, and a source electrode S of the third field effect transistor is connected with a grounding module in the electronic equipment;

and a drain D of a fourth field effect transistor is connected with a second port of the CPU, a grid G of the fourth field effect transistor is an enabling end, the grid G of the fourth field effect transistor is connected with the second transmission port, and a source S of the fourth field effect transistor is connected with a microphone module in the electronic equipment.

In the embodiment of the application, under the condition that the switch module is the field effect transistor, the on-state that can pass through the field effect transistor makes audio signal pass through the route between communication interface and the earphone patch cord, directly arrives in the feedback circuit in the earphone patch cord, consequently avoided audio signal only can arrive type C interface and lead to the problem that crosstalk appears in the left and right sound channels of earphone equipment, so when promoting the audio performance of type C interface effectively, promoted the tone quality of the audio signal of earphone equipment output.

Optionally, in this embodiment of the present application, the switch module may also be another component having a switching function, and this embodiment of the present application is not limited.

Optionally, in this embodiment of the application, the communication interface may be a type C port, where a plurality of ports in the type C port are in a floating state, for example, an a2 port, an A3 port, a B11 port, a B10 port, a B2 port, a B3 port, an a10 port, and an a11 port, and then some ports (for example, an a2 port, an A3 port, a B2 port, and a B3 port) in the plurality of ports may be used as the communication interface for the audio signal.

Optionally, in this embodiment of the present application, the electronic device further includes a first circuit, where the first circuit includes a grounding module and a microphone module; the switch module further comprises a fourth terminal and a fifth terminal.

The fourth end is connected with a grounding module in the first circuit, and the fifth end is connected with a microphone module. Under the condition that the earphone patch cord is not connected with the communication interface, the switch module is conducted with the first circuit, and under the condition that the switch module receives the audio signals, the electronic equipment controls the audio signals to be output to the first circuit through the fourth end and the fifth end.

Optionally, in an embodiment of the present application, the first circuit further includes at least one of: the device comprises a left sound channel module, a right sound channel module and a channel configuration module.

Optionally, in this embodiment of the present application, the configured frequency channel module may include a CC1 module and a CC2 module.

For example, taking the switch module as a two-way single-pole double-throw switch as an example, and referring to fig. 3, as shown in fig. 4, a schematic structural diagram of an electronic device provided in the embodiment of the present application is shown. The electronic equipment comprises a CPU, a type C port and a first circuit, wherein the type C port comprises an A2 port, an A3 port, a B2 port and a B3 port; a first port 10 (namely, HPH _ REF1) of the CPU is connected with a first end of the switch module, and a second port 12 (namely, HPH _ REF2) of the CPU is connected with a second end of the switch module; the A2 port and the B2 port in the type C port are connected to a feedback angle (HP _ REF) of the two-way single-pole double-throw switch, the A3 port and the B3 port in the type C port are connected to an enabling end of the two-way single-pole double-throw switch, a fourth end (represented by the A1 port in FIG. 4) of the switch module is connected with a grounding module (represented by SUB1 in FIG. 4) in a first circuit, a fifth end (represented by the A2 port in FIG. 4) of the switch module is connected with a microphone module (represented by SUB2 in FIG. 4) in the first circuit, a sixth end (namely the B1 port) and a seventh end (namely the B2 port) of the switch module are connected with the A2 port in the type C port, and the enabling end (namely the switch enabling) of the switch module is connected with the A3 port in the type C port.

Optionally, in this embodiment of the present application, the first field effect transistor and the second field effect transistor may be Nmos transistors, and the third field effect transistor and the fourth field effect transistor may be Pmos transistors.

Optionally, in the embodiment of the present application, a pull-up resistor R1 may be added to 1.8V at the a3 port and the B3 port of the type C port, and the resistance of R1 is greater than or equal to 10K ohms, so that the first fet and the second fet can turn on the circuit at the first port of the communication interface according to the enabling of the second port.

For example, taking four field effect transistors as a switch module, and referring to fig. 3, as shown in fig. 5, a schematic structural diagram of an electronic device provided in the embodiment of the present application is shown. The electronic device includes a CPU, a type C port including an A2 port, an A3 port, a B2 port, and a B3 port, and a first circuit; the first port 10 (i.e. HPH _ REF1) of the CPU is connected to the D-poles of the first fet (indicated by Q3 in fig. 5) and the third fet (indicated by Q1 in fig. 5), respectively, and the second port 12 (i.e. HPH _ REF2) of the CPU is connected to the D-poles of the second fet (indicated by Q4 in fig. 5) and the fourth fet (indicated by Q2 in fig. 5), respectively; the S-pole of Q1 is connected to the ground module (denoted SUB1 in fig. 5) in the first circuit, the S-pole of Q2 is connected to the microphone module (denoted SUB2 in fig. 5) in the first circuit, the S-poles of Q3 and Q4 are connected to the a2 port in type C port, and the G-poles of Q1, Q2, Q3, and Q4 are all connected to the a3 port of type C port.

The embodiment of the application provides an electronic device, which comprises a switch module and a communication interface, wherein the communication interface comprises four ports, and under the condition that the switch module receives an audio signal, the audio signal is output to a feedback circuit through a sixth port and a seventh port of the four ports. In the scheme, because the audio signal can directly reach the feedback circuit in the earphone patch cord through the communication interface and the earphone patch cord, the problem that crosstalk occurs in the left and right sound channels of the earphone device due to the fact that the audio signal can only reach the type C interface is avoided, and thus the audio performance of the type C interface is effectively improved, and meanwhile, the tone quality of the audio signal output by the earphone device is improved.

Example two

The embodiment of the application provides an earphone patch cord, and fig. 6 shows a schematic structural diagram of the earphone patch cord provided by the embodiment of the application. As shown in fig. 6, the earphone patch cord provided in the embodiment of the present application may include: a feedback circuit 15 and a first grounding module 16.

The feedback circuit 15 is connected to a first transmission port in a communication interface of the electronic device, and the first grounding module 16 is connected to a second transmission port in the communication interface; the feedback circuit 15 receives the audio signal output by the electronic device through the first transmission port. Optionally, in this embodiment of the application, the earphone patch cord may be a typeC to 3.5mm patch cord, and may also be another type of earphone patch cord, which is not limited in this embodiment of the application.

Optionally, in an embodiment of the present application, the feedback circuit includes at least one of: the device comprises a left sound channel module, a right sound channel module, a microphone module, a second grounding module, a channel configuration module and the like. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.

Optionally, in this embodiment of the application, a second grounding module in the feedback circuit is connected to the first transmission port; and a first configuration channel module and a second configuration channel module in the feedback circuit are both connected with the first grounding module.

Exemplarily, referring to fig. 6, as shown in fig. 7, a schematic structural diagram of a typeC to 3.5mm patch cord provided in an embodiment of the present application is shown. the type C-to-3.5 mm patch cord comprises a type C port, a 3.5mm earphone interface and a feedback circuit, wherein the type C port comprises an A2 port, a B2 port, an A3 port and a B3 port; the a2 port and the B2 port in the type C port are connected with the grounding module (i.e. GND) in the feedback circuit, the A3 port and the B3 port in the type C port are connected with the configured channel modules (i.e. the CC1 module and the CC2 module) in the feedback circuit, and the A3 port, the B3 port and the configured channel modules are all grounded.

It should be noted that, if the earphone patch cord is not connected to the communication interface, when the switch module receives the audio signal, the audio signal may be output from the fourth terminal (i.e., the a1 port) and the fifth terminal (i.e., the a2 port) of the switch module to the ground module (SUB1) and the microphone module (SUB2) in the first circuit of the electronic device, so as to output the audio signal through the microphone module in the first circuit.

In the embodiment of the application, the audio signal can be output to the feedback circuit in the type C switching 3.5mm switching line through four ports in the type C port, so that the audio performance of the type C port can be effectively improved, and the crosstalk performance is improved by more than 20 dB; moreover, as the performance crosstalk of the 3.5mm earphone in the traditional technology is more than 70dB, the crosstalk of the current USB type C-to-3.5 mm analog earphone can only reach 45dB, and the technical scheme of the application can improve the crosstalk performance of the analog earphone of the type C-to-3.5 mm patch cord to be almost the same as that of the traditional 3.5mm earphone, so as to improve the compatibility.

The embodiment of the application provides an earphone patch cord, the earphone patch cord includes feedback circuit and first ground module, and feedback circuit is connected with the first transmission port in the communication interface of electronic equipment, and first ground module is connected with the second transmission port in the communication interface, and feedback circuit receives the audio signal of electronic equipment output through first transmission port. In the scheme, because the audio signal can directly reach the feedback circuit in the earphone patch cord through the communication interface and the earphone patch cord, the problem that crosstalk occurs in the left and right sound channels of the earphone device due to the fact that the audio signal can only reach the type C interface is avoided, and thus the audio performance of the type C interface is effectively improved, and meanwhile, the tone quality of the audio signal output by the earphone device is improved.

EXAMPLE III

The embodiment of the present application provides an electronic device assembly, and the electronic device assembly provided by the embodiment of the present application may include: the electronic device and the earphone patch cord in the embodiment are detachably connected with the communication interface of the electronic device.

Exemplarily, referring to fig. 4 and 7, as shown in fig. 8, a schematic structural diagram of an electronic device assembly is shown, that is, a structure in which an electronic device is connected to a typeC 3.5mm patch cord. The enable terminal in the two-way single-pole double-throw switch of the electronic device is pulled up by default, and then the HP _ REF1 and the HP _ REF2 are respectively output from the A1 port and the A2 port of the two-way single-pole double-throw switch. When the enable terminal of the two-way single pole double throw switch is pulled down to GND, HP _ REF1 and HP _ REF2 are output from the B1 port and B2 port, respectively, in the type C port. After the electronic equipment is connected with the type C switching 3.5mm switching line, the A3 port and the B3 port in the type C switching 3.5mm switching line enable ends of the double-path single-pole double-throw switch to be grounded, the double-path single-pole double-throw switch is switched to the B1 port and the B2 port, so that audio signals are output to the feedback circuit in the type C switching 3.5mm switching line from the B1 port and the B2 port, the HPH _ REF of the electronic equipment can be connected to a 3.5mm earphone seat on the type C switching 3.5mm switching line, and audio crosstalk performance is improved.

Further exemplarily, referring to fig. 5 and 7, as shown in fig. 9, a schematic structural diagram of the electronic device assembly is shown, that is, a structure in which the electronic device is connected to a typeC 3.5mm patch cord. The enabling terminals of the four field effect transistors of the electronic device are pulled up by default, G voltages of the four field effect transistors are all high level, D poles and S poles of Q1 and Q2 are conducted, D poles and S poles of Q3 and Q4 are cut off, and then HPH _ REF1 and HPH _ REF2 are respectively connected to SUB1 and SUB2 in the first circuit. After the electronic equipment is connected with the type C switching 3.5mm switching line, the A3 port and the B3 port in the type C switching 3.5mm switching line are used for grounding the G poles of the four field effect transistors, so that the D poles and the S poles of the Q1 and the Q2 are cut off, and the D poles and the S poles of the Q3 and the Q4 are conducted, so that the HPH _ REF of the electronic equipment can be connected to a 3.5mm earphone seat on the type C switching 3.5mm switching line, and the audio crosstalk performance is improved.

Example four

The embodiment of the present application provides an audio signal output method, which may include the following steps 201 and 202.

Step 201, under the condition that the electronic device is connected with the earphone patch cord, the audio signal output device conducts the CPU in the electronic device and the first transmission port through the enabling of the second transmission port.

Step 202, the audio signal output device outputs an audio signal to the earphone patch cord through the first transmission port.

In the embodiment of the application, when the electronic device is connected to the earphone patch cord, the A3 port and the B3 port on the earphone patch cord are grounded, the enable of the switch module in the electronic device is grounded, the path of the switch module is switched from the a1 port and the a2 port to the B1 port and the B2 port, and the audio signal is connected to the ground module (i.e., GND) in the feedback circuit of the 3.5mm earphone of the earphone patch cord through the first transmission port (i.e., the first port and the third port of the communication interface) in the communication interface.

Optionally, in this embodiment of the application, when the electronic device is not connected to the earphone patch cord, the audio signal output device may turn on the CPU of the electronic device and the first circuit, and output the audio signal to the first circuit.

In this embodiment, when the electronic device is not connected to the earphone patch cord, the audio signal is connected to the ground module in the first circuit through the fourth terminal of the switch module, and is connected to the microphone module in the first circuit through the fifth terminal of the switch module.

It should be noted that, for the connection relationship between the ports in step 201 and step 202 and the related description of each module, reference may be made to the description in the foregoing embodiment, and details are not described here again.

The embodiment of the application provides an audio signal output method, and under the condition that an electronic device is connected with an earphone patch cord, an audio signal output device can output an audio signal to the earphone patch cord through a first transmission port in a communication interface. In the scheme, because the audio signal can directly reach the feedback circuit in the earphone patch cord through the communication interface and the earphone patch cord, the problem that crosstalk occurs in the left and right sound channels of the earphone device due to the fact that the audio signal can only reach the type C interface is avoided, and thus the audio performance of the type C interface is effectively improved, and meanwhile, the tone quality of the audio signal output by the earphone device is improved.

The audio signal output device in the embodiment of the present application may be a device, or may be a component, an integrated circuit, or a chip in an electronic device. The device can be mobile electronic equipment or non-mobile electronic equipment. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine or a self-service machine, and the like, and the embodiments of the present application are not particularly limited.

The audio signal output device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, and embodiments of the present application are not limited specifically.

Optionally, as shown in fig. 10, an electronic device 90 is further provided in this embodiment of the present application, and includes a processor 91, a memory 92, and a program or an instruction stored in the memory 92 and executable on the processor 91, where the program or the instruction is executed by the processor 91 to implement the processes of the foregoing method embodiment, and can achieve the same technical effect, and no further description is provided here to avoid repetition.

It should be noted that the electronic device in the embodiment of the present application includes the mobile electronic device and the non-mobile electronic device described above.

Fig. 11 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.

The electronic device 100 includes, but is not limited to: a radio frequency unit 101, a network module 102, an audio output unit 103, an input unit 104, a sensor 105, a display unit 106, a user input unit 107, an interface unit 108, a memory 109, and a processor 110.

Those skilled in the art will appreciate that the electronic device 100 may further comprise a power source (e.g., a battery) for supplying power to various components, and the power source may be logically connected to the processor 110 through a power management system, so as to implement functions of managing charging, discharging, and power consumption through the power management system. The electronic device structure shown in fig. 11 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description is not repeated here.

It should be understood that, in the embodiment of the present application, the input Unit 104 may include a Graphics Processing Unit (GPU) 1041 and a microphone 1042, and the Graphics Processing Unit 1041 processes image data of a still picture or a video obtained by an image capturing device (such as a camera) in a video capturing mode or an image capturing mode. The display unit 106 may include a display panel 1061, and the display panel 1061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 107 includes a touch panel 1071 and other input devices 1072. The touch panel 1071 is also referred to as a touch screen. The touch panel 1071 may include two parts of a touch detection device and a touch controller. Other input devices 1072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein. The memory 109 may be used to store software programs as well as various data including, but not limited to, application programs and an operating system. The processor 110 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 110.

The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the program or the instruction implements the processes of the foregoing method embodiments, and can achieve the same technical effects, and in order to avoid repetition, details are not repeated here.

The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.

The embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to execute a program or an instruction to implement each process of the foregoing method embodiments, and can achieve the same technical effect, and in order to avoid repetition, the details are not repeated here.

It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.