阅读说明：本技术 振动组件、扬声器及电子设备 (Vibration assembly, speaker and electronic equipment ) 是由 单连文 马积双 张宇 于 2020-06-09 设计创作，主要内容包括：本公开提供了一种振动组件、扬声器及电子设备。振动组件包括：球顶、振膜和音圈。球顶包括多孔金属散热层；振膜的部分覆盖于球顶的部分表面；音圈与球顶背向振膜的一面连接。该振动组件和扬声器的散热效果好,能够长时间正常工作,这确保了扬声器和电子设备的声学性能,提升用户体验。(The present disclosure provides a vibration assembly, a speaker and an electronic device. The vibration assembly includes: ball top, vibrating diaphragm and voice coil loudspeaker voice coil. The dome comprises a porous metal heat dissipation layer; part of the vibrating diaphragm covers part of the surface of the top of the ball; the voice coil is connected with one side of the ball top, which faces back to the diaphragm. This vibration subassembly and speaker's radiating effect is good, can normally work for a long time, and this has ensured speaker and electronic equipment's acoustic performance, promotes user experience.)

1. A vibratory assembly, comprising:

the dome comprises a porous metal heat dissipation layer;

the vibrating diaphragm is partially covered on part of the surface of the top of the ball; and

and the voice coil is connected with one surface of the ball top, which faces back to the vibrating diaphragm.

2. The vibration assembly of claim 1 wherein the porous metal heat sink layer comprises a first heat sink surface and a second heat sink surface opposite the first heat sink surface, the second heat sink surface being proximate the voice coil relative to the first heat sink surface;

the porous metal heat dissipation layer comprises first heat dissipation holes, second heat dissipation holes and third heat dissipation holes which are connected in a staggered mode, the first heat dissipation holes are connected to the first heat dissipation surface, the second heat dissipation holes are connected to the second heat dissipation surface, the third heat dissipation holes are arranged transversely, and the third heat dissipation holes are connected between the first heat dissipation holes and the second heat dissipation holes.

3. The vibration assembly of claim 1 wherein the material of the porous metal heat sink layer comprises a foamed metal material.

4. The vibratory assembly of claim 3, wherein the dome further comprises: and the first heat dissipation supporting layer is arranged between the porous metal heat dissipation layer and the voice coil.

5. The vibratory assembly of claim 4, wherein the dome further comprises: and the second heat dissipation supporting layer is arranged on one surface of the porous metal heat dissipation layer, which is opposite to the first heat dissipation supporting layer.

6. The vibration assembly of claim 5 wherein the first heat dissipating support layer comprises a first metal layer; and/or

The second heat dissipation support layer includes a second metal layer.

7. The vibration assembly of claim 1, wherein the diaphragm includes a diaphragm body and a thermal insulation layer disposed between the diaphragm body and the dome.

8. The vibration assembly of claim 7, wherein the thermal insulation layer covers part or all of a face of the diaphragm body facing the dome.

9. The vibration assembly of claim 7 wherein the voice coil is opposite the thermal isolation layer.

10. The vibration assembly of claim 1 wherein a layer of thermally conductive adhesive is disposed between the voice coil and the dome.

11. A loudspeaker, characterized in that the loudspeaker comprises: a vibration assembly as claimed in any one of claims 1 to 10.

12. An electronic device characterized in that it comprises a loudspeaker according to claim 11.

Technical Field

The present disclosure relates to the field of electronic devices, and in particular, to a vibration assembly, a speaker, and an electronic device.

Background

Electronic equipment such as cell-phone, panel computer and intelligent audio amplifier all include the speaker, and the speaker gives these electronic equipment the function of broadcast audio frequency. The loudspeaker comprises a vibrating diaphragm and a voice coil, and the vibrating diaphragm is driven by the voice coil to vibrate to produce sound. However, the voice coil generates heat during operation, and if the heat is not dissipated in time, the normal operation of the voice coil and the diaphragm is affected.

Disclosure of Invention

The present disclosure provides an improved vibration assembly, speaker and electronic device.

One aspect of the present disclosure provides a vibration assembly, comprising:

the dome comprises a porous metal heat dissipation layer;

the vibrating diaphragm is partially covered on part of the surface of the top of the ball; and

and the voice coil is connected with one surface of the ball top, which faces back to the vibrating diaphragm.

Optionally, the porous metal heat dissipation layer includes a first heat dissipation surface and a second heat dissipation surface opposite to the first heat dissipation surface, and the second heat dissipation surface is close to the voice coil relative to the first heat dissipation surface;

the porous metal heat dissipation layer comprises first heat dissipation holes, second heat dissipation holes and third heat dissipation holes which are connected in a staggered mode, the first heat dissipation holes are connected to the first heat dissipation surface, the second heat dissipation holes are connected to the second heat dissipation surface, the third heat dissipation holes are arranged transversely, and the third heat dissipation holes are connected between the first heat dissipation holes and the second heat dissipation holes.

Optionally, the material of the porous metal heat dissipation layer comprises a foamed metal material.

Optionally, the dome further comprises: and the first heat dissipation supporting layer is arranged between the porous metal heat dissipation layer and the voice coil.

Optionally, the dome further comprises: and the second heat dissipation supporting layer is arranged on one surface of the porous metal heat dissipation layer, which is opposite to the first heat dissipation supporting layer.

Optionally, the first heat dissipation support layer comprises a first metal layer; and/or

The second heat dissipation support layer includes a second metal layer.

Optionally, the diaphragm includes a diaphragm body and a thermal insulation layer disposed between the diaphragm body and the dome.

Optionally, the thermal insulation layer covers part or all of a surface of the diaphragm body facing the dome.

Optionally, the voice coil is opposite the thermal insulation layer.

Optionally, a heat conductive adhesive layer is disposed between the voice coil and the dome.

Another aspect of the present disclosure provides a speaker, including: a vibratory assembly as set forth in any of the above.

Another aspect of the present disclosure provides an electronic device including the speaker mentioned above.

The technical scheme provided by the disclosure at least has the following beneficial effects:

since the dome includes the porous metal heat dissipation layer, this gives the dome good heat dissipation performance. Through making voice coil loudspeaker voice coil and the one side of ball top dorsad vibrating diaphragm be connected, make the heat direct transfer that the voice coil loudspeaker voice coil produced to the ball top, reduce the heat and transmit through the vibrating diaphragm. The part through making the vibrating diaphragm covers in the partial surface of ball top, and the heat accessible ball top that the voice coil loudspeaker voice coil produced is not scattered by the region that the vibrating diaphragm covered, and this heat dissipation problem of effectively having solved vibration subassembly ensures that voice coil loudspeaker voice coil and vibrating diaphragm normally work, and then does benefit to vibration subassembly and speaker and work for a long time, ensures electronic equipment's pronunciation effect, promotes user experience.

Drawings

FIG. 1 is a schematic diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure;

FIG. 2 illustrates a partial structural cross-sectional view of a loudspeaker according to an exemplary embodiment of the present disclosure;

FIG. 3 illustrates a top view of a speaker according to an exemplary embodiment of the present disclosure;

FIG. 4 illustrates a partial structural schematic view of a vibration assembly according to an exemplary embodiment of the present disclosure;

FIG. 5 illustrates a partial structural cross-sectional view of the vibration assembly shown in accordance with an exemplary embodiment of the present disclosure;

FIG. 6 illustrates a partial structural cross-sectional view of a porous metal heat sink layer according to an exemplary embodiment of the present disclosure;

FIG. 7 illustrates a topography of a copper foam under a microscope according to an exemplary embodiment of the present disclosure;

FIG. 8 illustrates a partial structural cross-sectional view of a ball top illustrating the present disclosure according to an exemplary embodiment;

FIG. 9 illustrates a partial structural cross-sectional view of a ball top illustrating the present disclosure according to an exemplary embodiment;

FIG. 10 illustrates a partial structural cross-sectional view of the vibration assembly shown in accordance with an exemplary embodiment of the present disclosure;

fig. 11 is a graph showing temperature versus time for the voice coil in the speaker provided in example 1 and the voice coil in the speaker provided in the comparative example.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in the description and claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprises" or "comprising" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

As used in this disclosure and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

In some embodiments, a loudspeaker includes a vibration assembly, the vibration assembly including: ball top, vibrating diaphragm and voice coil loudspeaker voice coil. The ball top covers in the surface of vibrating diaphragm, and the vibrating diaphragm is connected with the voice coil loudspeaker voice coil dorsad's one side of ball top, and forms the sound chamber between the support of vibrating diaphragm towards the one side of voice coil loudspeaker. Play the additional strengthening to the vibrating diaphragm through setting up the ball top to when voice coil loudspeaker voice coil high-frequency oscillation, the vibration can not appear cutting apart to the vibrating diaphragm, and then guarantees tone quality. However, the dome comprises a polymer foam material, which has poor heat conductivity, so that heat generated by the voice coil is enclosed in the sound cavity of the diaphragm facing the voice coil, and is not easily dissipated through the dome. When the temperature of the voice coil reaches a set threshold, the power output by the power amplifier to the voice coil is reduced. Moreover, when the temperature inside the speaker rises, the material of the diaphragm becomes soft, and the resonant frequency thereof decreases. Based on this, if the vibration subassembly is difficult for the heat dissipation, be unfavorable for voice coil loudspeaker voice coil and the long-time normal work of vibrating diaphragm, influence the acoustics performance of speaker.

Based on the above defects, embodiments of the present disclosure provide a vibration assembly, a speaker and an electronic device, which are described in detail below with reference to the accompanying drawings:

the electronic device provided by the embodiment of the present disclosure includes but is not limited to: the intelligent mobile phone comprises a mobile phone, a tablet computer, an iPad, a digital broadcast terminal, a messaging device, a game console, a medical device, a fitness device, a personal digital assistant, an intelligent wearable device, an intelligent television, a sweeping robot, an intelligent sound box and the like.

Fig. 1 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present disclosure. Referring to fig. 1, an electronic device 100 includes a main body 110 and a speaker 120. The body 110 has a mounting cavity and a sound guide hole 111 communicating with the mounting cavity. The speaker 120 and other components are assembled in the mounting chamber, and the speaker 120 guides the sound through the sound guide hole 111.

Illustratively, the body 110 includes a middle frame, a rear cover, and a display panel. The middle frame comprises a front face and a back face opposite to the front face, the display panel is assembled on the front face of the middle frame, the rear cover is assembled on the back face of the middle frame, and the middle frame, the rear cover and the display panel are matched to form an installation cavity of the machine body 110. The sound guide hole 111 may be provided in the middle frame.

Illustratively, the speaker 120 is disposed proximate to a display panel of the electronic device 100. Illustratively, speaker 120 is disposed proximate a rear cover of electronic device 100. Illustratively, speakers 120 are provided at the top and/or bottom of electronic device 100. Illustratively, the speaker 120 is disposed in the middle of the electronic device 100. The present disclosure does not specifically limit the position where the speaker 120 is disposed.

Fig. 2 illustrates a partial structural cross-sectional view of a speaker 120 according to an exemplary embodiment of the present disclosure. Fig. 3 illustrates a top view of a speaker 120 according to an exemplary embodiment of the present disclosure. Referring to fig. 2 and 3 in combination, the speaker 120 includes a vibration assembly 130, a magnetic circuit assembly 150, and a bracket 160. The magnetic circuit assembly 150 provides a magnetic field to the vibration assembly 130. The vibration assembly 130 and the magnetic circuit assembly 150 are assembled to the bracket 160, and then the bracket 160 is assembled to the mounting cavity of the electronic device 100.

Fig. 4 is a partial structural view illustrating the vibration assembly 130 according to an exemplary embodiment of the present disclosure, and fig. 5 is a partial structural sectional view illustrating the vibration assembly 130 according to an exemplary embodiment of the present disclosure. Referring to fig. 2, 4 and 5 in combination, the vibration assembly 130 includes: a dome 131, a diaphragm 132, and a voice coil 133.

The dome 131 includes a porous metal heat dissipation layer 134, which gives the dome 131 good heat dissipation performance.

Part of the diaphragm 132 covers part of the surface of the dome 131. Illustratively, referring to fig. 4, the diaphragm 132 has a ring-shaped structure, and the dome 131 is disposed in a middle region of the diaphragm 132. Thus, the diaphragm 132 does not completely cover the dome 131, which facilitates reducing the weight of the vibration assembly 130 and also facilitates dissipating heat from the area of the dome 131 not covered by the diaphragm 132.

The voice coil 133 is connected to a surface of the dome 131 facing away from the diaphragm 132. Compared to the connection of the voice coil 133 and the diaphragm 132, the heat generated by the voice coil 133 can be dissipated directly through the dome 131, so as to reduce the heat dissipated through the diaphragm 132, which prevents the diaphragm 132 from being softened due to a higher temperature, thereby ensuring the vibration performance of the diaphragm 132.

Based on the above, since the dome 131 includes the porous metal heat dissipation layer 134, this gives the dome 131 good heat dissipation capability. By connecting the voice coil 133 to the surface of the dome 131 opposite to the diaphragm 132, heat generated by the voice coil 133 is directly transferred to the dome 131, thereby reducing heat transfer through the diaphragm 132. By covering part of the diaphragm 132 on part of the surface of the dome 131, heat generated by the voice coil 133 can be dissipated through an area of the dome 131 not covered by the diaphragm 132, that is, heat is dissipated in the direction of the arrow in fig. 5, which effectively solves the heat dissipation problem of the vibration component 130, ensures that the voice coil 133 and the diaphragm 132 work normally, further facilitates the long-time work of the vibration component 130 and the speaker 120, ensures the acoustic performance of the speaker 120 and the electronic device 100, and improves user experience.

In the disclosed embodiment, the porous metal heat sink layer 134 includes a plurality of heat dissipation holes for dissipating heat. The following embodiments are given in the present disclosure with respect to the arrangement form of the heat dissipation holes:

FIG. 6 illustrates a partial structural cross-sectional view of the porous metal heat sink layer 134 shown in the present disclosure according to an exemplary embodiment. In some embodiments, referring to fig. 6, the porous metal heat sink layer 134 includes a first heat sink surface 135 and a second heat sink surface 136 opposite the first heat sink surface 135, the second heat sink surface 136 being proximate the voice coil 133 relative to the first heat sink surface 135; the porous metal heat dissipation layer 134 includes first, second and third heat dissipation holes 137, 138, 139 connected in a staggered manner, the first heat dissipation hole 137 is connected to the first heat dissipation surface 135, the second heat dissipation hole 138 is connected to the second heat dissipation surface 136, the third heat dissipation hole 139 is disposed horizontally, and the third heat dissipation hole 139 is connected between the first heat dissipation hole 137 and the second heat dissipation hole 138. Based on the above, the heat generated by the voice coil 133 can enter the porous metal heat dissipation layer 134 through the second heat dissipation hole 138, and is dissipated to the first heat dissipation hole 137 through the third heat dissipation hole 139, and then is transferred outward through the first heat dissipation hole 137, so as to achieve the longitudinal (y-axis direction) heat dissipation from the voice coil 133 to the porous metal heat dissipation layer 134, the lateral (x-axis direction) heat dissipation along the porous metal heat dissipation layer 134, and the outward longitudinal (y-axis direction) heat dissipation from the porous metal heat dissipation layer 134. In addition, since the porous metal heat dissipation layer 134 is made of metal, it can also dissipate heat through metal, thus giving the porous metal heat dissipation layer 134 good heat conductivity and heat dissipation performance.

It should be noted that fig. 6 is only an example, and the first heat dissipation hole 137, the second heat dissipation hole 138, and the third heat dissipation hole 139 may also be arranged in the porous metal heat dissipation layer 134 in other regular or irregular manners. For example, the first, second and third heat dissipation holes 137, 138 and 139 may be regular heat dissipation holes, for example, the first, second and third heat dissipation holes 137, 138 and 139 may be cylindrical holes, regular prism holes or truncated cone holes. Illustratively, the first heat dissipation hole 137, the second heat dissipation hole 138 and the third heat dissipation hole 139 are all irregularly structured heat dissipation holes. The third heat dissipation hole 139 may be disposed in the porous metal heat dissipation layer 134 parallel to the second heat dissipation surface 136 to transfer heat in a lateral direction. The first and second heat dissipation holes 137 and 138 may be vertically disposed in the porous metal heat dissipation layer 134 to transfer heat in a longitudinal direction.

The porous metal heat sink layer 134 can be fabricated in a number of ways, two examples are given below with respect to the structure of the porous metal heat sink layer 134:

in a first type of embodiment, the porous metal heat dissipation layer 134 may be a metal plate on which a plurality of heat dissipation holes are machined. For the structure of the heat dissipation holes, reference may be made to the above description of the first, second and third heat dissipation holes 137, 138 and 139.

In a second class of embodiments, the material of the porous metal heat sink layer 134 may comprise a foamed metal material. Illustratively, the foamed metal material includes foamed copper or foamed aluminum. Preferably, the material of the porous metal heat dissipation layer 134 includes copper foam. Referring to a topography of the foamed copper under a microscope shown in fig. 7 according to an exemplary embodiment of the present disclosure, copper wires are wound around each other, a large number of heat dissipation holes are distributed in the foamed copper, and the porosity of the foamed copper can reach 96% to 98%, the bulk density is small, the specific surface area is large, which endows the dome 131 with characteristics of good heat dissipation performance, light weight, and the like.

Fig. 8 illustrates a partial structural cross-sectional view of the dome 131 shown in accordance with an exemplary embodiment of the present disclosure. In some embodiments, referring to fig. 8, the dome 131 further comprises: a first heat sink support layer 140 is disposed between the porous metal heat sink layer 134 and the voice coil 133. When the porous metal heat dissipation layer 134 includes a foamed metal material, it is not favorable to increase the mechanical strength of the dome 131 because the foamed metal material has a low hardness. The first heat dissipation support layer 140 supports the porous metal heat dissipation layer 134, so that the globe top 131 has good mechanical strength, and the first heat dissipation support layer 140 can prevent heat from flowing back from the porous metal heat dissipation layer 134 to the first heat dissipation support layer 140 and entering the cavity where the voice coil 133 is located.

Illustratively, the first heat dissipation support layer 140 includes a first metal layer, which may be a metal sheet such as a copper foil or an aluminum foil, which is easily available and has good supporting and heat conducting effects, so that the globe top 131 has good mechanical strength and heat conducting effects, and heat generated by the voice coil 133 is dissipated.

Fig. 9 illustrates a partial structural cross-sectional view of a dome 131 shown in accordance with an exemplary embodiment of the present disclosure. In some embodiments, referring to fig. 9, the dome 131 further comprises: and a second heat dissipation support layer 141 disposed on a surface of the porous metal heat dissipation layer 134 opposite to the first heat dissipation support layer 140. The first heat dissipation support layer 140 and the second heat dissipation support layer 141 cooperate to provide the dome 131 with good mechanical strength, and the first heat dissipation support layer 140 and the second heat dissipation support layer 141 both have heat conductivity, so as to facilitate the dome 131 to dissipate heat generated by the voice coil 133.

The second heat dissipation support layer 141 may include a second metal layer, which may be a metal sheet, such as a copper foil or an aluminum foil, which is easily available and has good supporting and heat conducting effects.

Based on the above, the heat generated from the voice coil 133 can be dissipated outward through the dome 131, but the heat is inevitably dissipated through the diaphragm 132. To address this issue, in some embodiments, referring to a partial structural cross-sectional view of the vibration assembly 130 illustrated in fig. 10 and illustrated in accordance with an exemplary embodiment of the present disclosure, the diaphragm 132 includes a diaphragm body 142 and a thermal insulation layer 143 disposed between the diaphragm body 142 and the dome 131. Thus, after the heat generated by the voice coil 133 is transferred to the dome 131, due to the limitation of the thermal insulation layer 143, the heat is transferred along the direction of the arrow along the lateral direction of the dome 131, and then is transferred and dissipated along the longitudinal direction in the area of the dome 131 not covered by the diaphragm 132, so as to prevent the heat generated by the voice coil 133 from being directly transferred from the dome 131 to the diaphragm 132 to affect the vibration performance of the diaphragm 132, and finally, the heat is dissipated from the area of the dome 131 not covered by the diaphragm 132, which ensures that the vibration component 130 dissipates heat effectively, and further ensures the sound quality of the speaker 120.

Illustratively, the thermal insulation layer 143 may be formed by applying a thermal insulation material to the diaphragm body 142. Illustratively, the insulating material comprises a thermal insulating glue.

In some embodiments, with continued reference to fig. 10, voice coil 133 is opposite thermal barrier 143. That is, the voice coil 133 is opposed to the heat insulating layer 143 in the y-axis direction. Thus, heat generated by the voice coil 133 is directly blocked by the thermal insulation layer 143 while being transferred in the longitudinal direction, which enables most of the heat generated by the voice coil 133 to be transferred in the transverse direction through the dome 131 and then to be transferred and dissipated in the longitudinal direction in the region of the dome 131 not covered by the diaphragm 132.

In some embodiments, the thermal insulation layer 143 covers a portion of a side of the diaphragm body 142 facing the dome 131. In other words, a portion of one surface of the diaphragm body 142 facing the dome 131 is covered with the thermal insulation layer 143. Thus, the thermal insulation layer 143 plays a thermal insulation protection role for part of the diaphragm body 142.

In some embodiments, with continued reference to fig. 10, the thermal insulation layer 143 covers all of the side of the diaphragm body 142 facing the dome 131. In other words, the thermal insulation layer 143 completely covers the side of the diaphragm body 142 facing the dome 131. Thus, the heat generated by the voice coil 133 can be effectively prevented from being transferred to the diaphragm body 142 along the side of the dome 131 or the air, and the vibration performance of the diaphragm body is not affected.

In some embodiments, with continued reference to fig. 10, a layer of thermally conductive adhesive 144 is disposed between the voice coil 133 and the dome 131. Therefore, the heat generated by the voice coil 133 is more favorably transferred to the dome 131, so that the heat dissipation through the dome 131 reduces the heat accumulated in the sound cavity where the voice coil 133 is located.

In order to more clearly understand the heat dissipation effect of the dome 131 provided by the embodiments of the present disclosure, the following description is made in conjunction with embodiment 1 and a comparative example:

example 1

The present embodiment provides a speaker 120 including a vibration assembly 130, a magnetic circuit assembly 150, and a bracket 160. Referring to fig. 10, the vibration assembly 130 includes: a dome 131, a diaphragm 132, and a voice coil 133. The diaphragm 132 is in an annular structure, the dome 131 is disposed in the middle of the diaphragm 132, the diaphragm 132 covers the dome 131, and the voice coil 133 is connected to a surface of the dome 131 opposite to the diaphragm 132. The dome 131 includes: a porous metal heat dissipation layer 134 made of foamed copper, and a first aluminum foil and a second aluminum foil provided on two heat dissipation surfaces opposite to the porous metal heat dissipation layer 134. The side of the diaphragm 132 facing the dome 131 or the voice coil 133 is coated with a thermal insulation layer 143.

Comparative example

This comparative example provides a speaker, including: vibration subassembly, magnetic circuit subassembly and support. The vibration component comprises a ball top, a vibrating diaphragm and a voice coil. The speaker provided by the comparative example is different from the speaker provided by the example 1 in at least comprising: the component structure of ball top (the ball top that the comparative example adopted includes the polymer foaming layer), and the vibrating diaphragm is located between ball top and the voice coil loudspeaker voice coil, and vibrating diaphragm and voice coil loudspeaker voice coil direct contact, vibrating diaphragm one side uncoated insulating layer towards the voice coil loudspeaker voice coil.

The speaker provided in example 1 and the speaker provided in comparative example were numbered as speaker No. 1 and speaker No. 2, respectively. The method includes the steps of placing a loudspeaker 1 and a loudspeaker 2 in the same closed environment respectively, controlling the voice coil of the loudspeaker 1 and the voice coil of the loudspeaker 2 to work at the same power, and obtaining a curve relation between the working time and the temperature of the voice coil of the loudspeaker 1 and a curve relation between the working time and the temperature of the voice coil of the loudspeaker 2 respectively, specifically referring to a graph of the temperature of the voice coil in the loudspeaker provided by example 1 and the temperature of the voice coil in the loudspeaker provided by a comparative example in relation to time shown in fig. 11. As can be seen from fig. 11, the temperature of the voice coil of the speaker No. 1 is lower than that of the voice coil of the speaker No. 2 with time, and in the range of about 30 to 60 seconds, the temperature of the voice coil of the speaker No. 1 is lower than that of the voice coil of the speaker No. 2 by about 10 ℃, which is advantageous for the normal operation of the speaker No. 1. Since the No. 1 loudspeaker and the No. 2 loudspeaker are both in a closed environment, the final temperatures of the two loudspeakers reach equilibrium. Based on this, the vibration assembly and the loudspeaker provided by the embodiment of the disclosure have good heat dissipation functions.

In summary, in the vibration element 130, the speaker 120 and the electronic device 100 provided in the embodiment of the disclosure, since the dome 131 of the vibration element 130 includes the porous metal heat dissipation layer 134, the dome 131 is endowed with good heat dissipation capability. By connecting the voice coil 133 to the surface of the dome 131 opposite to the diaphragm 132, heat generated by the voice coil 133 is directly transferred to the dome 131, thereby reducing heat transfer through the diaphragm 132. Through the cooperation of the first heat dissipation support layer 140 and the porous metal heat dissipation layer 134, or through the cooperation of the first heat dissipation support layer 140 and the second heat dissipation support layer 141 and the porous metal heat dissipation layer 134, not only is a good heat dissipation capability given to the dome 131, but also a good mechanical strength is given to the dome 131, so as to avoid the occurrence of segmentation vibration of the diaphragm 132. By having a portion of the diaphragm 132 cover a portion of the dome 131, not only is there an advantage in reducing the weight of the vibration assembly 130 and the speaker 120, but also in facilitating heat dissipation from the area of the dome 131 not covered by the diaphragm 132. Through setting up insulating layer 143 between vibrating diaphragm body 142 and dome 131 to the heat that voice coil 133 transmitted to dome 131 separates, makes the heat along horizontal transmission in dome 131, is finally dispersed by the dome 131 region that is not covered by vibrating diaphragm 132, avoids the vibration performance of vibrating diaphragm 132 to the heat like this, and does benefit to vibration subassembly 130 and speaker 120 heat dissipation. The speaker 120 has good heat dissipation performance, and can ensure power and sound quality after a long-time operation, which gives good acoustic performance to the electronic apparatus 100 including the speaker 120.

The above embodiments of the present disclosure may be complementary to each other without conflict.

The present disclosure is to be considered as limited only by the preferred embodiments and not limited to the specific embodiments described herein, and all changes, equivalents, and modifications that come within the spirit and scope of the disclosure are desired to be protected.