阅读说明：本技术 用于转移半导体器件的桥拾取头 (Bridge pick-up head for transferring semiconductor devices ) 是由 奥斯卡·托伦茨阿巴德 丹尼尔·布罗多塞亚努 阿里·森古尔 波亚·萨克提 于 2020-04-21 设计创作，主要内容包括：拾取工具(PUT)包括桥拾取头。桥拾取头包括：第一桥支腿部分、第二桥支腿部分以及在第一支腿部分和第二支腿部分之间的桥中心部分,第一桥支腿部分和第二桥支腿部分均包括顶面和侧面,第一桥支腿部分和第二桥支腿部分的顶面在桥中心部分上方延伸；在桥中心部分上的桥基部分,桥基部分包括在桥中心部分上的底侧、小于底侧的顶侧以及限定在顶侧和底侧之间的一个或更多个倾斜表面；以及尖端,该尖端被配置为在桥基部分的顶侧上与半导体器件附接。(The pick-up tool (PUT) comprises a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first leg portion and the second leg portion, the first bridge leg portion and the second bridge leg portion each including a top surface and a side surface, the top surfaces of the first bridge leg portion and the second bridge leg portion extending above the bridge center portion; an abutment portion on the bridge center portion, the abutment portion including a bottom side on the bridge center portion, a top side smaller than the bottom side, and one or more inclined surfaces defined between the top side and the bottom side; and a tip configured to attach with the semiconductor device on the top side of the abutment portion.)