阅读说明：本技术 一种超滑岛推动装置和超滑岛的处理方法 (Ultra-smooth island pushing device and ultra-smooth island processing method ) 是由 聂锦辉 马明 郑泉水 于 2021-09-14 设计创作，主要内容包括：本申请公开了一种超滑岛推动装置,包括：透明基底；位于所述透明基底表面的透明推动体阵列,所述透明推动体阵列与待推动的超滑岛阵列相同。可见,本申请中超滑岛推动装置包括透明基底和透明推动体阵列,由于推动体阵列与待推动的超滑岛阵列一致,所以推动体阵列中的推动体与超滑岛阵列中的超滑岛可以一一对应,在推动时,超滑岛阵列中的所有超滑岛均会发生移动,避免逐个推动超滑岛,增加推岛效率,缩短推岛时间,并且,超滑岛推动装置是透明的,可以清楚的观察到超滑岛阵列的推动情况,非常简单、方便。此外,本申请还提供一种具有上述优点的超滑岛处理方法。(The application discloses ultra-smooth island thrust unit includes: a transparent substrate; and the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the ultra-smooth island array to be pushed. It is thus clear that super-slip island thrust unit includes transparent basement and transparent promotion body array in this application, because promote the body array unanimous with the super-slip island array of waiting to promote, so promote the promotion body in the body array and can the one-to-one with super-slip island in the super-slip island array, when promoting, all super-slip islands in the super-slip island array all can take place to remove, avoid promoting super-slip island one by one, increase and push away island efficiency, shorten and push away the island time, and, super-slip island thrust unit is transparent, the promotion condition of observing super-slip island array that can understand, and is very simple, and convenient. In addition, the application also provides a method for processing the ultra-smooth island with the advantages.)

1. A super-skive island propulsion apparatus, comprising:

a transparent substrate;

and the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the ultra-smooth island array to be pushed.

2. The super-skimming island pushing device according to claim 1, wherein said transparent pushing body array is a transparent electrode array.

3. The super-skimming island pushing device according to claim 2, further comprising:

a transparent insulating layer disposed on a surface of each electrode in the transparent electrode array.

4. The super-skimming island pushing device according to claim 3, further comprising:

a transparent flexible insulating layer disposed between the transparent substrate and the transparent electrode array.

5. A method for processing a super-slip island, comprising:

coating a first photoresist on the upper surface of a substrate, and exposing and developing the first photoresist;

preparing a pushing layer on the upper surface of the developed first photoresist, and stripping the first photoresist to form a pushing body array to obtain a processing jig; the pushing body array is the same as the ultra-smooth island array to be pushed; wherein the substrate is a transparent substrate, and the pushing body array is a transparent pushing body array;

correspondingly contacting the pushing body array with the ultra-smooth island array, applying pressure and pushing the ultra-smooth island array;

and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island which is subjected to self-reply.

6. The method for processing the ultra-smooth island according to claim 5, wherein when the pushing body array is a transparent electrode array, after determining the ultra-smooth island where self-recovery occurs, the method further comprises:

marking the self-replied ultra-smooth island;

correspondingly contacting the transparent electrode array with the ultra-smooth island array, and applying static electricity to the electrode corresponding to the self-recovered ultra-smooth island to enable the self-recovered ultra-smooth island to be adsorbed to the electrode applying the static electricity;

contacting the processing jig absorbed with the self-recovered ultra-smooth island with a target substrate and applying pressure;

separating the processing jig adsorbed with the self-recovered ultra-smooth island from the target substrate, and removing static electricity to adsorb the self-recovered ultra-smooth island on the target substrate.

7. The method for treating the ultra-smooth island according to claim 6, wherein the surface of each electrode in the transparent electrode array is wrapped with a transparent insulating layer.

8. The method of claim 7, wherein when the transparent insulating layer is not a photoresist, applying a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist comprises:

sequentially laminating and preparing a first sub-insulating layer, an electrode layer and a second photoresist on the upper surface of the substrate, and exposing and developing the second photoresist;

correspondingly, after the developing, a push layer is prepared on the upper surface of the first photoresist, and the first photoresist is stripped to form a push body array, so that the processing jig is obtained and comprises:

etching the electrode layer to form the transparent electrode array, and removing the second photoresist;

coating a second sub-insulating layer on the upper surface of the transparent electrode array;

coating a third photoresist on the upper surface of the second sub-insulating layer, and exposing and developing the third photoresist;

and etching the second sub-insulating layer, and removing the third photoresist.

9. The method of claim 7, wherein when the transparent insulating layer is a photoresist insulating layer, applying a first photoresist on an upper surface of a substrate, and exposing and developing the first photoresist comprises:

sequentially laminating and preparing a third sub-insulating layer, an electrode layer and a fourth photoresist on the upper surface of the substrate, and exposing and developing the fourth photoresist;

correspondingly, after the developing, a push layer is prepared on the upper surface of the first photoresist, and the first photoresist is stripped to form a push body array, so that the processing jig is obtained and comprises:

etching the electrode layer to form the transparent electrode array, and removing the fourth photoresist;

and coating a fourth sub-insulating layer on the upper surface of the transparent electrode array, and exposing and developing the fourth sub-insulating layer.

10. The method for processing the ultra-smooth island according to claim 7, wherein before the step of coating the first photoresist on the upper surface of the substrate and exposing and developing the first photoresist, the method further comprises:

and growing a transparent flexible insulating layer on the upper surface of the substrate.

11. The method of claim 2, wherein the preparing the push layer on the top surface of the first photoresist after developing comprises:

and preparing an electrode layer on the upper surface of the developed first photoresist by adopting a magnetron sputtering mode.

12. The method for processing the ultra-smooth island according to any one of claims 5 to 11, wherein before the step of correspondingly contacting the pushing body array with the ultra-smooth island array and applying pressure, the method further comprises the following steps:

and manufacturing an island cover on the upper surface of each ultra-smooth island in the ultra-smooth island array.

Technical Field

The application relates to the technical field of structural ultra-lubricity, in particular to an ultra-slippery island pushing device and a processing method of an ultra-slippery island.

Background

The ultra-smooth structure refers to the phenomenon that the friction force between two Van der Waals solid surfaces which are smooth at the atomic level and are not in contact with each other is almost zero and has no abrasion. The material of the ultra-sliding piece in the ultra-sliding device can be graphene, molybdenum disulfide and other two-dimensional materials, an ultra-sliding island array is obtained by adopting a photoetching mode when the ultra-sliding piece is prepared at present, then the ultra-sliding islands are pushed one by using a probe, and the ultra-sliding islands with self-recovery capability are transferred to a target substrate. Because the probes are needed to push the ultra-smooth islands one by one, the process of pushing the islands consumes long time, and the island pushing efficiency is low.

Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.

Disclosure of Invention

The application aims to provide a super-slip island pushing device and a super-slip island processing method so as to improve the island pushing efficiency.

In order to solve the above technical problem, the present application provides a super-skimming island pushing device, including:

a transparent substrate;

and the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the ultra-smooth island array to be pushed.

Optionally, the transparent pushing body array is a transparent electrode array.

Optionally, the method further includes:

a transparent insulating layer disposed on a surface of each electrode in the transparent electrode array.

Optionally, the method further includes:

a transparent flexible insulating layer disposed between the transparent substrate and the transparent electrode array.

The application also provides a method for processing the ultra-smooth island, which comprises the following steps:

coating a first photoresist on the upper surface of a substrate, and exposing and developing the first photoresist;

preparing a pushing layer on the upper surface of the developed first photoresist, and stripping the first photoresist to form a pushing body array to obtain a processing jig; the pushing body array is the same as the ultra-smooth island array to be pushed; wherein the substrate is a transparent substrate, and the pushing body array is a transparent pushing body array;

correspondingly contacting the pushing body array with the ultra-smooth island array, applying pressure and pushing the ultra-smooth island array;

and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island which is subjected to self-reply.

Optionally, when the pushing body array is a transparent electrode array, after the determining of the self-healing ultra-smooth island, the method further includes:

marking the self-replied ultra-smooth island;

correspondingly contacting the transparent electrode array with the ultra-smooth island array, and applying static electricity to the electrode corresponding to the self-recovered ultra-smooth island to enable the self-recovered ultra-smooth island to be adsorbed to the electrode applying the static electricity;

contacting the processing jig absorbed with the self-recovered ultra-smooth island with a target substrate and applying pressure;

separating the processing jig adsorbed with the self-recovered ultra-smooth island from the target substrate, and removing static electricity to adsorb the self-recovered ultra-smooth island on the target substrate.

Optionally, a transparent insulating layer is wrapped on the surface of each electrode in the transparent electrode array.

Optionally, when the transparent insulating layer is not a photoresist, applying a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist includes:

sequentially laminating and preparing a first sub-insulating layer, an electrode layer and a second photoresist on the upper surface of the substrate, and exposing and developing the second photoresist;

correspondingly, after the developing, a push layer is prepared on the upper surface of the first photoresist, and the first photoresist is stripped to form a push body array, so that the processing jig is obtained and comprises:

etching the electrode layer to form the transparent electrode array, and removing the second photoresist;

coating a second sub-insulating layer on the upper surface of the transparent electrode array;

coating a third photoresist on the upper surface of the second sub-insulating layer, and exposing and developing the third photoresist;

and etching the second sub-insulating layer, and removing the third photoresist.

Optionally, when the transparent insulating layer is a photoresist insulating layer, applying a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist includes:

sequentially laminating and preparing a third sub-insulating layer, an electrode layer and a fourth photoresist on the upper surface of the substrate, and exposing and developing the fourth photoresist;

correspondingly, after the developing, a push layer is prepared on the upper surface of the first photoresist, and the first photoresist is stripped to form a push body array, so that the processing jig is obtained and comprises:

etching the electrode layer to form the transparent electrode array, and removing the fourth photoresist;

and coating a fourth sub-insulating layer on the upper surface of the transparent electrode array, and exposing and developing the fourth sub-insulating layer.

Optionally, before the step of coating the first photoresist on the upper surface of the substrate and exposing and developing the first photoresist, the method further includes:

and growing a transparent flexible insulating layer on the upper surface of the substrate.

Optionally, the step of preparing the push layer on the upper surface of the first photoresist after developing includes:

and preparing an electrode layer on the upper surface of the developed first photoresist by adopting a magnetron sputtering mode.

Optionally, before the correspondingly contacting the pushing body array with the ultra-smooth island array and applying pressure, the method further comprises:

and manufacturing an island cover on the upper surface of each ultra-smooth island in the ultra-smooth island array.

The application provides a super-sliding island thrust unit includes: a transparent substrate; and the transparent pushing body array is positioned on the surface of the transparent substrate and is the same as the ultra-smooth island array to be pushed.

It is thus clear that super-slip island thrust unit includes transparent basement and transparent promotion body array in this application, because promote the body array unanimous with the super-slip island array of waiting to promote, so promote the promotion body in the body array and can the one-to-one with super-slip island in the super-slip island array, when promoting, all super-slip islands in the super-slip island array all can take place to remove, avoid promoting super-slip island one by one, increase and push away island efficiency, shorten and push away the island time, and, super-slip island thrust unit is transparent, the promotion condition of observing super-slip island array that can understand, and is very simple, and convenient.

In addition, the application also provides a method for processing the ultra-smooth island with the advantages.

Drawings

For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a super-slip island pushing device according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of another ultra-smooth island pushing device provided in the embodiment of the present application;

fig. 3 is a flowchart of a method for processing a super-skid island according to an embodiment of the present disclosure;

FIG. 4 is a flow chart of another method for processing a super-skid island according to the present application

FIGS. 5-10 are schematic diagrams illustrating a process for transferring the super-islands by using the transparent electrode array in the embodiment of the present application;

FIGS. 11-16 are process flow diagrams of forming an insulating layer when the insulating layer is not a photoresist in the practice of the present application;

fig. 17 is a schematic diagram of a processing tool with a flexible layer contacting an array of ultra-smooth islands with undulating surface according to an embodiment of the present disclosure.

Detailed Description

In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

As described in the background section, currently, when preparing an ultra-slide device, an ultra-slide island array is obtained by photolithography, and then the ultra-slide islands are pushed one by using a probe to transfer the ultra-slide islands with self-recovery capability onto a target substrate. Because the probes are needed to push the ultra-smooth islands one by one, the process of pushing the islands consumes long time, and the island pushing efficiency is low.

In view of the above, the present application provides a super-slip island pushing device, please refer to fig. 1, where fig. 1 is a schematic structural diagram of a super-slip island pushing device according to an embodiment of the present application, including:

a transparent substrate 1;

and the transparent pushing body array 2 is positioned on the surface of the transparent substrate 1, and the transparent pushing body array 2 is the same as the ultra-smooth island array to be pushed.

The transparent pushing body array 2 comprises a plurality of pushing bodies, the ultra-smooth island array comprises a plurality of ultra-smooth islands, the transparent pushing body array 2 and the ultra-smooth island array to be pushed are the same in finger, the size of the pushing bodies is the same as that of the ultra-smooth islands, and the distance between the pushing bodies is equal to that between the ultra-smooth islands.

It should be noted that, in the present application, there is no limitation on whether the transparent pusher array 2 is conductive or not, as the case may be. The transparent pushing body array 2 can be a conductive array or a non-conductive array. When the self-recovered ultra-smooth island needs to be transferred, the transparent pushing body array 2 is a transparent electrode array.

The material of the transparent substrate 1 includes, but is not limited to, glass, quartz, sapphire, etc., and the material of the pusher in the transparent pusher array 2 includes, but is not limited to, indium tin oxide, fluorine-doped tin oxide, etc.

Super-slip island thrust unit includes transparent basement 1 and transparent promotion body array 2 in this application, because promote the body array unanimous with the super-slip island array of waiting to promote, so promote the promotion body in the body array and super-slip island in the super-slip island array can the one-to-one, when promoting, all super-slip islands in the super-slip island array all can take place to remove, avoid promoting super-slip island one by one, increase and push away island efficiency, shorten and push away the island time, and, super-slip island thrust unit is transparent, the promotion condition of observing super-slip island array that can understand, and is very simple, and convenient.

On the basis of the above embodiments, in an embodiment of the present application, please refer to fig. 2, the ultra-smooth island pushing device further includes:

a transparent insulating layer 11 disposed on a surface of each electrode in the transparent electrode array.

The transparent insulating layer 11 surrounds all surfaces of the electrodes, and the transparent insulating layer 11 is also provided between the transparent substrate 1 and the electrodes. Note that the material of the transparent insulating layer 11 is not particularly limited in this application and may be set by itself. For example, the material of the transparent insulating layer 11 may be photoresist, or non-photoresist such as Polydimethylsiloxane (PDMS) and silicon nitride.

In the process of electrostatically adsorbing the ultra-smooth island, the transparent insulating layer 11 can prevent electrostatic breakdown, and can apply larger voltage and electrostatic force to improve selectivity.

When the surface of the ultra-smooth island array has the height fluctuation, in order to ensure that the transparent electrode array and the ultra-smooth island array can both contact and operate, the ultra-smooth island pushing device further comprises:

a transparent flexible insulating layer disposed between the transparent substrate 1 and the transparent electrode array.

When the ultra-smooth island is pushed and transferred, and the surface of the electrode is wrapped by the transparent insulating layer 11, the transparent flexible insulating layer can not only realize the contact and the operation of the ultra-smooth island array with undulate surface, but also be used as a part of the insulating layer wrapping the electrode, and the manufacturing steps of the transparent insulating layer 11 between the transparent electrode array and the transparent substrate are saved.

Referring to fig. 3, fig. 3 is a flowchart of a method for processing a super-slip island according to an embodiment of the present application, where the method includes:

step S101: and coating a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist.

The coating method of the first photoresist is not particularly limited in this application and may be selected by itself. For example, a spin coating may be used to form a uniform first photoresist.

Step S102: preparing a pushing layer on the upper surface of the developed first photoresist, and stripping the first photoresist to form a pushing body array to obtain a processing jig; the pushing body array is the same as the ultra-smooth island array to be pushed; wherein, the substrate is a transparent substrate, and the pushing body array is a transparent pushing body array.

The pushing body array comprises a plurality of pushing bodies, the ultra-smooth island array comprises a plurality of ultra-smooth islands, the pushing body array and the ultra-smooth island array to be pushed are the same in finger, the size of the pushing bodies is the same as that of the ultra-smooth islands, and the spacing between the pushing bodies is equal to that between the ultra-smooth islands.

Step S103: and correspondingly contacting the pushing body array with the ultra-smooth island array, applying pressure, and pushing the ultra-smooth island array.

Thrust can be exerted on the processing jig, shearing is carried out between the ultra-sliding island layers, and batch pushing of the ultra-sliding islands is achieved.

Step S104: and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island which is subjected to self-reply.

Whether the pushing body array is conductive or not is not limited in the application as the case may be. The pushing body array can be a conductive array or a non-conductive array.

The substrate is a transparent substrate, the pushing body array is a transparent pushing body array, and the substrate and the pushing body array are transparent, so that the ultra-smooth islands can be observed to be self-recovered through an optical lens, and the method is very convenient.

The material of the transparent substrate includes, but is not limited to, glass, quartz, sapphire, etc., and the material of the pusher in the transparent pusher array includes, but is not limited to, indium tin oxide, fluorine-doped tin oxide, etc.

In order to increase the friction force between the pushing body array and the ultra-smooth island array and facilitate the sliding of the ultra-smooth island, before the pushing body array is correspondingly contacted with the ultra-smooth island array and pressure is applied, the method further comprises the following steps:

and manufacturing an island cover on the upper surface of each ultra-smooth island in the ultra-smooth island array.

According to the ultra-smooth island processing method, the transparent pushing body array is prepared on the upper surface of the substrate, the processing jig for processing the ultra-smooth island is obtained, the transparent pushing body array is in corresponding contact with the ultra-smooth island array and applies pressure, then the ultra-smooth island array is pushed, after the jig and the ultra-smooth island array are separated and processed, the ultra-smooth island with self-recovery capability can automatically recover to the original position, and due to the fact that the transparent pushing body array is consistent with the ultra-smooth island array to be pushed, pushing bodies in the pushing body array can correspond to the ultra-smooth islands in the ultra-smooth island array one by one, when the ultra-smooth island array is pushed, all the ultra-smooth islands in the ultra-smooth island array can move, the ultra-smooth islands are prevented from being pushed one by one, the island pushing efficiency is increased, and the island pushing time is shortened.

Referring to fig. 4, fig. 4 is a flowchart of another method for processing an ultra-smooth island according to an embodiment of the present application, in which the pushing body array is a transparent electrode array, the method includes:

step S101: and coating a first photoresist on the upper surface of the substrate, and exposing and developing the first photoresist.

Step S202: preparing an electrode layer on the upper surface of the developed first photoresist, and stripping the first photoresist to form a transparent electrode array to obtain a processing jig; the transparent electrode array is the same as the ultra-smooth island array to be pushed.

Optionally, as a specific embodiment, the preparing the electrode layer on the upper surface of the developed first photoresist includes: and preparing the electrode layer on the upper surface of the developed first photoresist by adopting a magnetron sputtering mode. However, the present application is not limited to this, and the electrode layer may be prepared by a chemical vapor deposition method.

The transparent electrode array includes a plurality of electrodes therein.

Step S203: and correspondingly contacting the transparent electrode array with the ultra-smooth island array, applying pressure, and pushing the ultra-smooth island array.

The schematic structure of the transparent electrode array 2 pushing the ultra-smooth island array 3 is shown in fig. 5.

Step S204: and separating the processing jig from the ultra-smooth island array, and determining the ultra-smooth island which is subjected to self-reply.

When the processing tool is separated from the ultra-smooth island array 3, as shown in fig. 6, a part of the ultra-smooth island is self-recovered, as shown in a dotted line box.

Step S205: marking the self-replied ultra-smooth island.

Step S206: and correspondingly contacting the transparent electrode array with the ultra-smooth island array, and applying static electricity to the electrode corresponding to the self-recovered ultra-smooth island to adsorb the self-recovered ultra-smooth island and the electrode applying the static electricity.

Referring to fig. 7, after the electrostatic adsorption occurs, the processing tool is lifted up, as shown in fig. 8, the ultra-smooth island with self-recovery capability is adsorbed to the electrode.

Step S207: and contacting the processing jig adsorbed with the self-recovered ultra-smooth island with a target substrate and applying pressure.

The self-healing ultra-smooth island comes into contact with the target substrate 4 as shown in fig. 9.

Step S208: separating the processing jig adsorbed with the self-recovered ultra-smooth island from the target substrate, and removing static electricity to adsorb the self-recovered ultra-smooth island on the target substrate.

After the static electricity is removed, the self-recovered ultra-smooth island is adsorbed on the target substrate 4 as shown in fig. 10.

In the ultra-smooth island processing method in this embodiment, after the batch pushing of the ultra-smooth island array is completed, static electricity is applied to the electrodes corresponding to the ultra-smooth islands capable of self-returning, then the processing jig is contacted with the ultra-smooth island array again, the ultra-smooth islands capable of self-returning are adsorbed by the static electricity, then the processing jig on which the ultra-smooth islands capable of self-returning are adsorbed is contacted with the target substrate, after the static electricity is removed, the ultra-smooth islands capable of self-returning are adsorbed on the target substrate, the transfer of the ultra-smooth islands capable of self-returning is completed, when the islands are transferred, the transfer of all the ultra-smooth islands capable of self-returning is completed at one time, and the island transferring efficiency is obviously improved.

On the basis of the above embodiments, in one embodiment of the application, the surface of each electrode in the transparent electrode array is wrapped with a transparent insulating layer.

In the process of electrostatically adsorbing the ultra-smooth island, the transparent insulating layer can prevent electrostatic breakdown, and can apply larger voltage and electrostatic force to improve selectivity.

It should be noted that the material of the transparent insulating layer is not particularly limited in this application, and may be set by itself. For example, the material of the insulating layer may be photoresist, or non-photoresist such as Polydimethylsiloxane (PDMS) and silicon nitride.

The processes of forming the transparent insulating layers are explained below respectively according to the material of the transparent insulating layers.

When the transparent insulating layer is not a photoresist, the process of forming the transparent insulating layer includes:

step S11: and sequentially laminating and preparing a first sub-insulating layer, an electrode layer and a second photoresist on the upper surface of the substrate, and exposing and developing the second photoresist.

Referring to fig. 11, a first sub-insulating layer 5, an electrode layer 6 and a second photoresist 7 are sequentially stacked on the upper surface of the substrate 1, and the second photoresist is exposed and developed as shown in fig. 12.

Step S12: and etching the electrode layer to form the transparent electrode array, and removing the second photoresist.

Referring to fig. 13, transparent electrode arrays 2 are distributed on the first insulating layer 5.

Step S13: and coating a second sub-insulating layer on the upper surface of the transparent electrode array.

In this step, referring to fig. 14, the second sub-insulating layer 8 covers the transparent electrode array 2.

Step S14: and coating a third photoresist on the upper surface of the second sub-insulating layer, and exposing and developing the third photoresist.

The third photoresist 9 is exposed and developed in this step, and then is shown in fig. 15.

Step S15: and etching the second sub-insulating layer, and removing the third photoresist.

Referring to fig. 16, after the third photoresist is removed, each electrode is wrapped by the first sub-insulating layer 5 and the second sub-insulating layer 8.

When the transparent insulating layer is a photoresist insulating layer, the process of forming the transparent insulating layer includes:

step S21: sequentially laminating and preparing a third sub-insulating layer, an electrode layer and a fourth photoresist on the upper surface of the substrate, and exposing and developing the fourth photoresist;

step S22: etching the electrode layer to form the transparent electrode array, and removing the fourth photoresist;

step S23: and coating a fourth sub-insulating layer on the upper surface of the transparent electrode array, and exposing and developing the fourth sub-insulating layer.

Since the insulating layer is made of photoresist, that is, the third sub-insulating layer and the fourth sub-insulating layer are made of photoresist, after the fourth sub-insulating layer is coated, the fourth sub-insulating layer is directly exposed and developed, so that each electrode is wrapped by the third sub-insulating layer and the fourth sub-insulating layer.

The first sub insulating layer and the second sub insulating layer may be made of the same material, the third sub insulating layer and the fourth sub insulating layer may be made of the same material, and the first, second, third, and fourth layers are for distinguishing the order of formation.

For the specific etching and developing processes, reference is made to related technologies, and detailed description is omitted here.

When the surface of the super-slip island array has undulations, in order to ensure that the transparent electrode array and the super-slip island array can both contact and operate, the method further includes, before applying a first photoresist on the upper surface of the substrate and exposing and developing the first photoresist:

and growing a transparent flexible insulating layer on the upper surface of the substrate.

When the ultra-smooth island is pushed and transferred and the surface of the electrode is wrapped by the insulating layer, the transparent flexible insulating layer can not only realize the contact and the operation of the ultra-smooth island array with undulate surface, but also be used as a part of the transparent insulating layer wrapping the electrode, and the manufacturing steps of the transparent insulating layer between the transparent electrode array and the substrate are saved. For example, when the transparent insulating layer is not a photoresist, the first sub-insulating layer is replaced by a transparent flexible insulating layer, and when the transparent insulating layer is a photoresist, the third sub-insulating layer is replaced by a transparent flexible insulating layer.

The material of the transparent flexible insulating layer may be PDMS, and when the electrode is wrapped by the transparent flexible insulating layer 10 and the second sub-insulating layer 8, a schematic diagram of the contact between the processing jig and the ultra-smooth island array with the undulating surface is shown in fig. 17, and the ultra-smooth island array is in complete contact with the transparent electrode array.

The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The ultra-smooth island pushing device and the ultra-smooth island processing method provided by the application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.