阅读说明：本技术 用于sim卡失效检测的方法、装置及产品 (Method, device and product for detecting failure of SIM card ) 是由 袁超 张宗杰 王坤 于 2021-11-15 设计创作，主要内容包括：本申请公开用于SIM卡失效检测方法,包括：将测试模块放置在设备的高温高湿内腔中；采用测试模块连接SIM卡的六个功能区的电极；采用提示模块获得SIM卡的工作状态；采用控制模块控制装置的控制界面；测试模块包括测试底板、载带齿孔、探针放置板、弹性探针和操作手柄,测试底板被用于平行放置不多于2条SIM卡载带,载带齿孔被设置于测试底板上,载带齿孔被用于将SIM卡固定在测试底板上,探针放置板被设置于测试底板的上方,弹性探针被设置于探针放置板上,弹性探针被用于在探针放置板被下压时连接测试底板上SIM卡的功能区电极,操作手柄被用于控制所述探针放置板上下移动。本申请还公开一种用于SIM卡失效检测的装置及产品。(The application discloses a method for detecting the failure of an SIM card, which comprises the following steps: placing a test module in a high-temperature high-humidity inner cavity of equipment; connecting electrodes of six functional areas of the SIM card by adopting a test module; acquiring the working state of the SIM card by adopting a prompting module; controlling a control interface of the device by adopting a control module; the test module comprises a test base plate, a carrying belt tooth hole, a probe placing plate, an elastic probe and an operating handle, wherein the test base plate is used for placing not more than 2 SIM card carrying belts in parallel, the carrying belt tooth hole is arranged on the test base plate, the carrying belt tooth hole is used for fixing the SIM card on the test base plate, the probe placing plate is arranged above the test base plate, the elastic probe is arranged on the probe placing plate, the elastic probe is used for connecting a functional area electrode of the SIM card on the test base plate when the probe placing plate is pressed down, and the operating handle is used for controlling the probe placing plate to move up and down. The application also discloses a device and a product for detecting the failure of the SIM card.)

1. A method for SIM card failure detection, comprising:

placing a test module in a high-temperature high-humidity inner cavity of equipment;

the testing module is adopted to be connected with electrodes of six functional areas of the SIM card;

acquiring the working state of the SIM card by adopting a prompting module;

controlling a control interface of the device by using a control module;

the test module comprises a test bottom plate, a carrier tape tooth hole, a probe placing plate, an elastic probe and an operating handle, the test backplane is used for placing not more than 2 SIM card carrier tapes in parallel, the carrier tape perforations are arranged on the test backplane, the carrier tape sprocket holes are used to fix the SIM card on the test substrate, the probe placement board is disposed above the test substrate, the elastic probes are disposed on the probe placement board, the elastic probes being used to electrically connect electrodes of six functional regions of all the SIM cards on the test substrate when the probe placement board is pressed down, the operating handle is used for controlling the probe placing plate to move up and down, the prompt module, the test module and the control module are electrically connected, and the prompt module is used for displaying the power-on state of the test module.

2. The method of claim 1, wherein the number of elastic probes is in the range of [480,600 ].

3. The method of claim 1, wherein the elastic probe is made of a conductive material, the contact portion of the probe tip with the electrode is circular, and the diameter of the probe is not more than 2.5 mm.

4. The method of claim 1, wherein the connection of the resilient probes to the probe placement plate comprises a spring device.

5. The method according to claim 1, wherein the prompting module comprises LED lamps, the number of the LED lamps is the sum of the number of the electrodes of the five functional areas in all the SIM cards, and each LED lamp is used for displaying the working state of the electrode of one functional area in the SIM card.

6. The method of claim 1, wherein the control interface is used to set a test time, display an operating status of a functional area in the SIM card, and save the time when the operating status is abnormal.

7. An apparatus for SIM card failure detection, comprising:

a test module configured to connect electrodes of six functional regions of the SIM card;

a prompt module configured to obtain a working state of the SIM card;

a control module configured as a control interface for controlling the device;

the test module is placed in a high-temperature high-humidity inner cavity of the equipment;

the test module comprises a test bottom plate, a carrier tape tooth hole, a probe placing plate, an elastic probe and an operating handle, the test backplane is used for placing not more than 2 SIM card carrier tapes in parallel, the carrier tape perforations are arranged on the test backplane, the carrier tape sprocket holes are used to fix the SIM card on the test substrate, the probe placement board is disposed above the test substrate, the elastic probes are disposed on the probe placement board, the elastic probes being used to electrically connect electrodes of six functional regions of all the SIM cards on the test substrate when the probe placement board is pressed down, the operating handle is used for controlling the probe placing plate to move up and down, the prompt module, the test module and the control module are electrically connected, and the prompt module is used for displaying the power-on state of the test module.

8. An apparatus for SIM card failure detection, comprising a processor and a memory having stored thereon program instructions, characterized in that the processor is configured to perform the method for SIM card failure detection according to any one of claims 1 to 7 when executing the program instructions.

9. An article of manufacture for SIM card failure detection, comprising the apparatus for SIM card failure detection of claim 7 or 8.

Technical Field

The present application relates to the field of smart card detection technologies, and in particular, to a method, an apparatus, and a product for detecting a failure of a SIM card.

Background

The smart card is widely applied to social life by virtue of the characteristics of convenience, high efficiency, safety and the like, and the reliability of the smart card is concerned more and more, so that how to effectively test the smart card is more and more important. In the test content, the performance requirements of customers in high-temperature and high-humidity environments are also becoming stricter.

At present, the test method of the smart card is to put the smart card carrier tape in a closed high-temperature and high-humidity space (the temperature is about 80 ℃, and the humidity is about 85%), and then take out the smart card and put the smart card in an electric tester to test the on-off of pins after one week.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

the existing testing method has more complicated steps, can only test the performance of the intelligent card when the intelligent card is not electrified, and cannot realize the real-time detection of the electrified state in a high-temperature and high-humidity environment.

Disclosure of Invention

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a method, a device and a product for detecting the failure of an SIM card, which aim to solve the technical problem of detecting the working state of the SIM card in real time under a high-temperature and high-humidity environment.

In some embodiments, the method comprises:

a method for SIM card failure detection, comprising:

placing a test module in a high-temperature high-humidity inner cavity of equipment;

the testing module is adopted to be connected with electrodes of six functional areas of the SIM card;

acquiring the working state of the SIM card by adopting a prompting module;

controlling a control interface of the device by using a control module;

the test module comprises a test bottom plate, a carrier tape tooth hole, a probe placing plate, an elastic probe and an operating handle, the test backplane is used for placing not more than 2 SIM card carrier tapes in parallel, the carrier tape perforations are arranged on the test backplane, the carrier tape sprocket holes are used to fix the SIM card on the test substrate, the probe placement board is disposed above the test substrate, the elastic probes are disposed on the probe placement board, the elastic probes being used to electrically connect electrodes of six functional regions of all the SIM cards on the test substrate when the probe placement board is pressed down, the operating handle is used for controlling the probe placing plate to move up and down, the prompt module, the test module and the control module are electrically connected, and the prompt module is used for displaying the power-on state of the test module.

Specifically, the number of the elastic probes is in the range of [480,600 ].

Specifically, the elastic probe is made of a conductive material, the contact part of the top end of the probe and the electrode is circular, and the diameter of the probe is not more than 2.5 mm.

Specifically, the joint of the elastic probe and the probe placing plate comprises a spring device.

Specifically, the prompting module comprises LED lamps, the number of the LED lamps is the sum of the numbers of the electrodes of the five functional areas in all the SIM cards, and each of the LED lamps is used for displaying the working state of the electrode of one functional area in the SIM card.

Specifically, the control interface is used for setting test time, displaying the working state of the functional area in the SIM card, and saving the time when the working state is abnormal.

In some embodiments, the apparatus comprises:

a test module configured to connect electrodes of six functional regions of the SIM card;

a prompt module configured to obtain a working state of the SIM card;

a control module configured as a control interface for controlling the device;

the test module is placed in a high-temperature high-humidity inner cavity of the equipment;

the test module comprises a test bottom plate, a carrier tape tooth hole, a probe placing plate, an elastic probe and an operating handle, the test backplane is used for placing not more than 2 SIM card carrier tapes in parallel, the carrier tape perforations are arranged on the test backplane, the carrier tape sprocket holes are used to fix the SIM card on the test substrate, the probe placement board is disposed above the test substrate, the elastic probes are disposed on the probe placement board, the elastic probes being used to electrically connect electrodes of six functional regions of all the SIM cards on the test substrate when the probe placement board is pressed down, the operating handle is used for controlling the probe placing plate to move up and down, the prompt module, the test module and the control module are electrically connected, and the prompt module is used for displaying the power-on state of the test module.

In some embodiments, the apparatus comprises:

a processor and a memory storing program instructions, the processor being configured to, when executing the program instructions, perform the method for SIM card failure detection as described above.

In some embodiments, the product comprises:

as described above for the SIM card failure detection apparatus.

The method, the device, the product and the storage medium for detecting the failure of the SIM card provided by the embodiment of the disclosure can realize the following technical effects:

the probes in the test module are connected with the electrodes in the six functional areas of the SIM card under manual control, the led lamps in the prompt module are connected with the electrodes in the five functional areas of the SIM card and reflect the working states of the electrodes in the five functional areas of the SIM card, and the prompt module is used for controlling a control interface of the device. The test module is placed in an inner cavity of the equipment in a high-temperature high-humidity environment, and the technical barrier that the traditional SIM card cannot be detected in the high-temperature high-humidity electrifying environment is broken.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic diagram of a method for SIM card failure detection provided by an embodiment of the present disclosure;

fig. 2 is a schematic diagram of an apparatus for SIM card failure detection provided by an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a test module provided in the embodiments of the present disclosure;

fig. 4 is a schematic diagram of another apparatus for SIM card failure detection provided by an embodiment of the present disclosure.

In fig. 2, 21 is a test module, 22 is a prompt module, and 23 is a control module; in fig. 3, 211 is an operation handle, 212 is a probe placing plate, 213 is an elastic probe, and 214 is a testing base plate; in fig. 4, 100 denotes a processor, 101 denotes a memory, 102 denotes a communication interface, and 103 denotes a bus.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

The term "plurality" means two or more unless otherwise specified.

In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.

The term "correspond" may refer to an association or binding relationship, and a corresponds to B refers to an association or binding relationship between a and B.

In the disclosed embodiment, a Smart Card (Smart Card) refers to the generic term of a plastic Card (usually the size of a credit Card) with a microchip embedded therein. Some smart cards contain a microelectronic chip and require data interaction via a reader/writer. The smart card is equipped with CPU, RAM and I/O, and can process a large amount of data without interfering the operation of the CPU of the host computer. The integrated circuit in the card comprises a central processing unit CPU, a programmable read-only memory EEPROM, a random access memory RAM and a card Operating system COS (chip Operating system) solidified in the read-only memory ROM. The data in the card is divided into an external reading part and an internal processing part.

With reference to fig. 1, an embodiment of the present disclosure provides a method for detecting a failure of a SIM card, including:

s01, placing the test module in a high-temperature high-humidity inner cavity of the equipment;

s02, connecting the electrodes of the six functional areas of the SIM card by adopting the test module;

s03, obtaining the working state of the SIM card by adopting a prompt module;

s04, controlling the control interface of the device by a control module;

the test module includes a test base plate 214, a carrier tape perforation, a probe placing plate 212, an elastic probe 213 and an operating handle 211, the test backplane 214 is used to place no more than 2 SIM card carriers in parallel, the carrier tape sprocket holes are provided on the test backplane, the carrier tape sprocket holes are used to fix the SIM card on the test substrate, the probe placement board 212 is disposed above the test substrate 214, the elastic probes 213 are disposed on the probe mounting plate 212, the elastic probes 213 are used to electrically connect the electrodes of all the six functional regions of the SIM card on the test board 214 when the probe mounting plate 212 is pressed, the operation handle 211 is used to control the probe mounting plate 212 to move up and down, the prompt module, the test module and the control module are electrically connected, and the prompt module is used to display the power-on state of the test module.

The probe placing plate 212 is moved downwards by using the operating handle 211 until the elastic probes 213 contact the electrodes of the functional area on the SIM card on the testing base plate 214 to realize power-on, and the prompting module can display the power-on or power-off state of the testing module to reflect the working state of the SIM card. The whole testing module is placed in a high-temperature high-humidity inner cavity of the equipment so as to test the working state of the SIM card under the condition of power on under the high-temperature high-pressure environment.

Optionally, the number of the elastic probes 213 is in a range of [480,600 ].

The device can realize the test of at least 80 SIM cards and not more than 100 SIM cards at one time by limiting the volume of the high-temperature and high-humidity inner cavity of the device.

Optionally, the elastic probe 213 is made of a conductive material, a contact portion between the tip of the probe and the electrode is a circle, and a diameter of the probe is not greater than 2.5 mm.

The elastic probes 213 are used to energize the electrodes of the six functional areas of the SIM card, and the contact surfaces and diameters of the prototype are designed to facilitate the energizing process.

Optionally, the joint between the elastic probe 213 and the probe placing plate 212 includes a spring device.

Because the number of SIM cards detected at a time is large, when the probe placing plate 212 is pressed down, it is difficult to ensure that the probes with the same length can detect the electrodes on all the SIM cards at the same time, and therefore the length of the probes can be adjusted at the right time by arranging the spring device at the joint of the probe placing plate 212 and the probes.

Optionally, the prompting module includes LED lamps, the number of the LED lamps is the sum of the numbers of the electrodes of the five functional regions in all the SIM cards, and each of the LED lamps is used for displaying the working state of the electrode of one functional region in the SIM card.

The LED lamp is used for displaying the working state of the SIM card, if the LED lamp is on, the electrode is in the electrified state, and if the LED lamp is off, the electrode is in the non-electrified state, namely the abnormal working state.

Optionally, the control interface is used to set a test time, display a working state of the functional area in the SIM card, and store a time when the working state is abnormal.

The control interface can be used for setting the time required to be tested, displaying the working state of the functional area in the SIM card according to the prompt of the prompt module, and storing the test time if the prompt module prompts that the functional area is in an abnormal working state.

With reference to fig. 2 and 3, an apparatus for detecting a failure of a SIM card according to an embodiment of the present disclosure includes a testing module 21 configured to connect electrodes of six functional regions of the SIM card;

a prompt module 22, configured to obtain an operating state of the SIM card;

a control module 23 configured as a control interface for controlling the device;

the test module 21 is placed in a high-temperature high-humidity inner cavity of the equipment;

the test module 21 includes a test base plate 213, a carrier tape sprocket hole, a probe placement plate 212, a spring probe 213, and an operation handle 211, the test base plate 214 is used to place not more than 2 SIM card carrier tapes in parallel, the carrier tape gear is disposed on the test base plate 214, the carrier tape gear is used to fix the SIM cards to the test base plate 214, the probe placement plate 212 is disposed above the test base plate 214, the spring probe 213 is disposed on the probe placement plate 212, the spring probe 213 is used to connect electrodes of six functional regions of all the SIM cards on the test base plate 214 when the probe placement plate 212 is pressed down, and the operation handle 211 is used to control the probe placement plate 212 to move up and down.

By adopting the device for detecting the failure of the SIM card, the probe placing plate is moved downwards by using the operating handle until the elastic probe contacts with the electrode of the functional area on the SIM card on the testing bottom plate, so that the electrification is realized, and the prompting module can display the electrification or outage state of the testing module so as to reflect the working state of the SIM card. The whole testing module is placed in a high-temperature high-humidity inner cavity of the equipment so as to test the working state of the SIM card under the condition of power on under the high-temperature high-pressure environment.

As shown in fig. 4, an apparatus for detecting a failure of a SIM card according to an embodiment of the present disclosure includes a processor (processor) 100 and a memory (memory) 101. Optionally, the apparatus may also include a Communication Interface (Communication Interface) 102 and a bus 103. The processor 100, the communication interface 102, and the memory 101 may communicate with each other via a bus 103. The communication interface 102 may be used for information transfer. The processor 100 may invoke logic instructions in the memory 101 to perform the method for SIM card failure detection of the above embodiments.

In addition, the logic instructions in the memory 101 may be implemented in the form of software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products.

The memory 101, which is a computer-readable storage medium, may be used for storing software programs, computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 100 executes functional applications and data processing by executing program instructions/modules stored in the memory 101, i.e. implements the method for SIM card failure detection in the above embodiments.

The memory 101 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the terminal device, and the like. In addition, the memory 101 may include a high-speed random access memory, and may also include a nonvolatile memory.

The embodiment of the disclosure provides a product, which includes the above apparatus for detecting the failure of the SIM card.

Embodiments of the present disclosure provide a computer-readable storage medium storing computer-executable instructions configured to perform the above-described method for SIM card failure detection.

Embodiments of the present disclosure provide a computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the above-described method for SIM card failure detection.

The computer-readable storage medium described above may be a transitory computer-readable storage medium or a non-transitory computer-readable storage medium.

The technical solution of the embodiments of the present disclosure may be embodied in the form of a software product, where the computer software product is stored in a storage medium and includes one or more instructions to enable a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium comprising: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes, and may also be a transient storage medium.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising an …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.

Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It can be clearly understood by the skilled person that, for convenience and brevity of description, the specific working processes of the system, the apparatus and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units may be merely a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than disclosed in the description, and sometimes there is no specific order between the different operations or steps. For example, two sequential operations or steps may in fact be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. Each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.