Semiconductor laser scanning unhairing system and method

文档序号:1967893 发布日期:2021-12-17 浏览:19次 中文

阅读说明:本技术 一种半导体激光扫描脱毛系统及方法 (Semiconductor laser scanning unhairing system and method ) 是由 杨国锋 王垚 于 2021-09-16 设计创作,主要内容包括:本发明适用于医美技术领域,提供了一种半导体激光扫描脱毛系统及方法,包括主机以及与主机连接的手柄,所述手柄包括:半导体激光器,具有单条半导体巴条,用于提供激光光源,一维扫描振镜,用于改变激光光源的传播方向,使激光光源达到工作面时被扫描成光斑;以及半导体冷却装置,用于对所述半导体激光器进行冷却,本发明的有益效果是:由于其使用的单条半导体巴条,使得半导体激光器的功率较低,既能达到脱毛效果,也减少了安全隐患,同时也降低了冷却装置的工作负荷,工作距离可调,治疗区域面积大小可调,手柄与主机相对独立,可以单独的进行维修以及部件的更换等。(The invention is suitable for the technical field of medical science and beauty, and provides a semiconductor laser scanning unhairing system and a semiconductor laser scanning unhairing method, wherein the semiconductor laser scanning unhairing system comprises a host and a handle connected with the host, and the handle comprises: the laser comprises a semiconductor laser, a one-dimensional scanning galvanometer and a laser control unit, wherein the semiconductor laser is provided with a single semiconductor bar and used for providing a laser light source; and the semiconductor cooling device is used for cooling the semiconductor laser, and the semiconductor laser has the beneficial effects that: because the single semiconductor bar is used, the power of the semiconductor laser is lower, the unhairing effect can be achieved, the potential safety hazard is reduced, the working load of the cooling device is reduced, the working distance is adjustable, the area of a treatment area is adjustable, the handle and the host machine are relatively independent, and the semiconductor laser can be independently maintained, parts can be replaced and the like.)

1. A semiconductor laser scanning epilation system, includes host computer and the handle of being connected with the host computer, its characterized in that, the handle includes:

a semiconductor laser 5 having a single semiconductor bar for providing a laser light source;

the one-dimensional scanning galvanometer 1 is used for changing the propagation direction of the laser light source so that the laser light source is scanned into light spots when reaching a working surface; and

a semiconductor cooling device 4 for cooling the semiconductor laser 5;

the host includes:

the power supply 6 is used for supplying power to the laser power supply 7, the control device 10, the one-dimensional scanning galvanometer 1 and the cooling device 8;

the laser power supply 7 is electrically connected with the semiconductor laser 5 and used for providing power for the semiconductor laser 5;

the cooling device 8 is connected with the semiconductor cooling device 4 and is used for providing cold energy for the semiconductor cooling device 4;

a galvanometer driving control board 9 for controlling the deflection angle and the vibration frequency of the one-dimensional scanning galvanometer 1; and

and a control device 10 for controlling the above components.

2. A semiconductor laser scanning depilation system as claimed in claim 1, wherein said handle further comprises a protection window provided at an output end of said one-dimensional scanning galvanometer 1 for protecting said one-dimensional scanning galvanometer 1.

3. A semiconductor laser scanning depilation system as claimed in claim 1, wherein a collimating device 3 is further provided between the semiconductor laser 5 and the one-dimensional scanning galvanometer 1, said collimating device 3 being adapted to collimate the output laser light of the semiconductor laser 5.

4. A semiconductor laser scanning hair removal system as claimed in claim 1, wherein said host further comprises a display device 11 in communication with said control device 10, said display device 11 being adapted to perform parameter setting and operation mode selection.

5. The semiconductor laser scanning hair removal system as claimed in claim 1, wherein the display device 11 is a touch screen.

6. A semiconductor laser scanning depilation system as claimed in claim 1, wherein the cooling device 8 is an air cooling unit or a water cooling unit.

7. A semiconductor laser scanning unhairing method is characterized by comprising the following steps:

s1, cleaning the skin, namely cleaning the long hairs in the treatment area of the user and cleaning the surrounding skin;

s2, after the skin is cleaned, setting corresponding treatment parameters through a touch screen according to the skin state of the user;

s3, the touch screen sends the set treatment parameters to the control device through a serial port;

s4, changing the size of a line spot scanning area by setting and changing the vibration angle of the one-dimensional scanning galvanometer so that the size of an output spot can adapt to a treatment part;

s5, pressing a handle button switch or a foot switch to provide a switch signal for the control device;

s6, after receiving the switch signal, the control device converts the control data signal into the control signal of the drive motor to the vibrating mirror drive control panel, and at the same time, the control device outputs the switch signal of the laser power supply to control the start and stop of the semiconductor laser, the output laser is reflected by the one-dimensional scanning axis vibrating mirror through the collimating device and then penetrates through the protection window to form a laser surface light spot with high energy density, which is formed by scanning the line light spot at high speed;

s7, controlling the projection position of the laser line facula, controlling the treatment handle to project the focused laser on the operation surface, and enabling the hair follicle to absorb enough laser energy to achieve the purpose of hair removal.

Technical Field

The invention relates to the technical field of medical science and beauty, in particular to a semiconductor laser scanning unhairing system and a semiconductor laser scanning unhairing method.

Background

Laser medical cosmetology is an important branch of medicine and is developing at a rapid pace. Laser depilation also becomes an important component of laser medical cosmetology, and the semiconductor laser depilation therapeutic apparatus is a main therapeutic apparatus that can realize human depilation at present, can reach permanent and painless depilation, and safe, no trace, convenient. Laser pulses with proper wavelength range and energy are emitted to generate heat action so as to destroy hair follicles, and the aim of laser depilation is achieved.

Scanning galvanometer technology is gradually widely applied in various industries, and is partially applied in the medical and cosmetic fields, but is not applied in the laser depilation field. The scanning galvanometer is composed of a scanning reflecting mirror, a swing motor, a position sensor, a driving circuit, a servo controller and the like, and is a high-precision and high-speed position follow-up control system. The scanning galvanometer is utilized to change the laser propagation direction, the semiconductor laser forms linear light spots after collimation, and the light beams form surface light spots spliced by the linear light spots on the surface of the skin under the high-speed reciprocating swing of the scanning galvanometer. Because the motion frequency of the scanning galvanometer is fast, uniform laser spots can be formed in effective time. The same treatment effect as that of the traditional multi-semiconductor laser depilation with uniform light spots is achieved.

At present, the laser depilation mainly adopts a semiconductor laser, and the power of the semiconductor laser is mainly 300W, 500W, 600W, 1200W and 2400W. The high-power laser adopts a multi-bar stacked array form, and the main structural components of the existing device are shown in fig. 5:

a system host: the system mainly comprises a display system, a control system, a power supply, a sensor, a cooling water circulation system and a filtering system. The display system mainly interacts with a user, sets parameters and displays an alarm. The control system mainly controls the sensor parameters and the laser power supply. The power supply mainly comprises a laser power supply, a water pump power supply, a control panel power supply, a refrigerator power supply and the like. The sensor mainly detects rivers, temperature and quality of water and is used for protecting the laser instrument. The cooling water circulation system mainly provides cooling circulating water for the laser and comprises a water tank, a water pump and a refrigerator. The filter system is mainly used for protecting the laser, and a PP cotton filter element and ion exchange resin are selected and matched according to different lasers.

The treatment handle: the device mainly comprises a semiconductor laser, a water cooling structure, an optical waveguide, a refrigerating head and a TEC refrigerating piece. The semiconductor laser (stacked array) mainly emits laser pulses with proper wavelength ranges (808 nm, 755nm and 1064 nm) and energy to generate heat action so as to destroy hair follicles and achieve the aim of laser depilation. The water cooling structure mainly provides water cooling heat dissipation for the semiconductor laser (stacked array) and the TEC refrigeration piece. The optical waveguide functions to homogenize the semiconductor laser light, making the laser light reaching the skin uniform. The refrigerating head is mainly used for cooling the skin, reducing the pain of a user and improving the user experience.

The disadvantages are that: the power of the high-power semiconductor laser is 300-2400W, so that potential safety hazards exist; the radiation generated by the laser device is harmful to the human body, especially the eyes, so that radiation-proof spectacles have to be worn before the machine is used. The higher the power is, the greater the potential safety hazard is, and the higher the laser power is, the greater the heat generation is, and the system must adopt a refrigerator with higher power;

the treatment handle has a complex structure; because the semiconductor laser must be too high, the minimum power is 300W at present, heat must be taken away through a water path, and meanwhile, the refrigeration TEC refrigeration module needs to dissipate heat. The handle must have a cooling water circulation structure. Meanwhile, an optical shaping part (optical waveguide) is also arranged, so that the structure of the handle is complex and heavy.

Disclosure of Invention

An embodiment of the present invention provides a semiconductor laser scanning depilation system and method, which are used to solve the technical problems in the background art.

The embodiment of the invention is realized in such a way that a semiconductor laser scanning unhairing system comprises a host and a handle connected with the host, wherein the handle comprises:

a semiconductor laser having a single semiconductor bar for providing a laser light source;

the one-dimensional scanning galvanometer is used for changing the propagation direction of the laser light source so that the laser light source is scanned into light spots when reaching a working surface; and

the semiconductor cooling device is used for cooling the semiconductor laser;

the host includes:

the power supply is used for supplying power to the laser power supply, the control device, the one-dimensional scanning galvanometer and the cooling device;

the laser power supply is electrically connected with the semiconductor laser and used for providing power supply for the semiconductor laser;

the cooling device is connected with the semiconductor cooling device and used for providing cold energy for the semiconductor cooling device;

the galvanometer driving control board is used for controlling the deflection angle and the vibration frequency of the one-dimensional scanning galvanometer; and

and the control device is used for controlling the components.

As a further scheme of the invention: the handle further comprises a protection window which is arranged at the output end of the one-dimensional scanning galvanometer and used for protecting the one-dimensional scanning galvanometer.

As a still further scheme of the invention: and a collimating device is arranged between the semiconductor laser and the one-dimensional scanning galvanometer and is used for collimating the output laser of the semiconductor laser.

As a still further scheme of the invention: the host computer also comprises a display device communicated with the control device, and the display device is used for setting parameters and selecting working modes.

As a still further scheme of the invention: the display device is a touch screen.

As a still further scheme of the invention: the cooling device is an air cooling unit or a water cooling unit.

The embodiment of the invention also provides a semiconductor laser scanning unhairing method, which comprises the following steps:

s1, cleaning the skin, namely cleaning the long hairs in the treatment area of the user and cleaning the surrounding skin;

s2, after the skin is cleaned, setting corresponding treatment parameters through a touch screen according to the skin state of the user;

s3, the touch screen sends the set treatment parameters to the control device through a serial port;

s4, changing the size of a line spot scanning area by setting and changing the vibration angle of the one-dimensional scanning galvanometer so that the size of an output spot can adapt to a treatment part;

s5, pressing a handle button switch or a foot switch to provide a switch signal for the control device;

s6, after receiving the switch signal, the control device converts the control data signal into the control signal of the drive motor to the vibrating mirror drive control panel, and at the same time, the control device outputs the switch signal of the laser power supply to control the start and stop of the semiconductor laser, the output laser is reflected by the one-dimensional scanning axis vibrating mirror through the collimating device and then penetrates through the protection window to form a laser surface light spot with high energy density, which is formed by scanning the line light spot at high speed;

s7, controlling the projection position of the laser line facula, controlling the treatment handle to project the focused laser on the operation surface, and enabling the hair follicle to absorb enough laser energy to achieve the purpose of hair removal.

Compared with the prior art, the invention has the beneficial effects that: because the single semiconductor bar is used, the power of the semiconductor laser is lower, the unhairing effect can be achieved, the potential safety hazard is reduced, the working load of the cooling device is reduced, the working distance is adjustable, the area of a treatment area is adjustable, the handle and the host machine are relatively independent, and the semiconductor laser can be independently maintained, parts can be replaced and the like.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor laser scanning depilation system.

Fig. 2 is a schematic structural diagram of a handle in a semiconductor laser scanning depilation system.

Fig. 3 is a schematic diagram of the operation of a semiconductor laser scanning depilation system.

Fig. 4 is a control schematic diagram of a semiconductor laser scanning depilation system.

Fig. 5 is a schematic diagram of a prior art laser hair removal device.

In the drawings: 1-one-dimensional scanning galvanometer, 2-laser, 3-collimation device, 4-semiconductor cooling device, 5-semiconductor laser, 6-power supply, 7-laser power supply, 8-cooling device, 9-galvanometer driving control board, 10-control device and 11-display device.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Specific implementations of the present invention are described in detail below with reference to specific embodiments.

As shown in fig. 1-2, a structure diagram of a semiconductor laser scanning depilation system provided by an embodiment of the present invention includes a host and a handle connected to the host, where the handle includes a semiconductor laser 5, a one-dimensional scanning galvanometer 1 and a semiconductor cooling device 4, and the semiconductor laser 5 has a single semiconductor bar for providing a laser light source; the one-dimensional scanning galvanometer 1 is used for changing the propagation direction of the laser light source so that the laser light source is scanned into light spots when reaching a working surface; the semiconductor cooling device 4 is used for cooling the semiconductor laser 5.

For the semiconductor laser 5, because the single semiconductor bar is used, the power of the semiconductor laser 5 is low, and in practical application, the power of the semiconductor laser 5 is only 50W-100W, so that the potential safety hazard is reduced compared with the power of 300-2400W in the prior art, and meanwhile, the working load of a cooling device is also reduced. The handle is independent from the main machine, and can be independently maintained, replaced and the like.

As shown in fig. 1 to 2, as a preferred embodiment of the present invention, the handle further includes a protection window disposed on an output end of the one-dimensional scanning galvanometer 1, and configured to protect the one-dimensional scanning galvanometer 1. The protection window is generally made of transparent material, does not affect the transmission of the laser 2, and simultaneously protects the one-dimensional scanning galvanometer 1, and in the embodiment, the semiconductor cooling device 4 also simultaneously cools the skin at the protection window.

As shown in fig. 1 to 2, as another preferred embodiment of the present invention, a collimating device 3 is further disposed between the semiconductor laser 5 and the one-dimensional scanning galvanometer 1, and the collimating device 3 is used for collimating the output laser of the semiconductor laser 5.

The collimating means 3 here can be omitted if the laser light 2 has already been collimated in the semiconductor laser 5 on the fast and slow axes.

As shown in fig. 1, as another preferred embodiment of the present invention, the host comprises a power supply 6, a laser power supply 7, a cooling device 8, a galvanometer driving control board 9 and a control device 10, wherein the power supply 6 is used for supplying power to the laser power supply 7, the control device 10, the one-dimensional scanning galvanometer 1 and the cooling device 8; the laser power supply 7 is electrically connected with the semiconductor laser 5 and is used for providing power for the semiconductor laser 5; the cooling device 8 is connected with the semiconductor cooling device 4 and is used for providing cold energy for the semiconductor cooling device 4; the galvanometer driving control board 9 is used for controlling the deflection angle and the vibration frequency of the one-dimensional scanning galvanometer 1; the control device 10 is used to control the above components.

As shown in fig. 1, as another preferred embodiment of the present invention, the host further comprises a display device 11 in communication with the control device 10, wherein the display device 11 is used for setting parameters and selecting an operation mode. The parameter setting here may be setting of parameters such as energy density and laser power.

Preferably, the display device 11 is a touch screen.

As shown in fig. 1, as another preferred embodiment of the present invention, the cooling device 8 is an air cooling unit or a water cooling unit, but other types of cooling methods may be adopted, and are not particularly limited herein.

As shown in fig. 3 to 4, an embodiment of the invention further provides a semiconductor laser scanning depilation method, which may include the following steps:

s1, cleaning the skin, namely cleaning the long hairs in the treatment area of the user and cleaning the surrounding skin, specifically, cleaning the hairs by a hair scraper;

s2, after the skin is cleaned, setting corresponding treatment parameters through a touch screen according to the skin state of a user, wherein the treatment parameters can be energy density, laser power and other parameters, and click preparation is carried out after the setting is finished;

s3, after the click preparation is completed, the touch screen sends the set treatment parameters to the control device through the serial port;

s4, changing the size of a linear light spot scanning area by setting and changing the vibration angle of the one-dimensional scanning galvanometer, so that the size of an output light spot can adapt to a treatment part, namely different light spot sizes can be selected by combining the treatment part of a user, and the parameters can send the set treatment parameters to the control device through a serial port through the touch screen;

s5, when the user is ready for treatment, the user presses the handle button switch or the foot switch to provide a switch signal for the control device;

s6, after receiving the switch signal, the control device converts the control data signal into the control signal of the drive motor to the vibrating mirror drive control panel, and at the same time, the control device outputs the switch signal of the laser power supply to control the start and stop of the semiconductor laser, the output laser is reflected by the one-dimensional scanning axis vibrating mirror through the collimating device and then penetrates through the protection window to form a laser surface light spot with high energy density, which is formed by scanning the line light spot at high speed;

s7, controlling the projection position of the laser line facula, controlling the treatment handle to project the focused laser on the operation surface, and enabling the hair follicle to absorb enough laser energy to achieve the purpose of hair removal.

The embodiment of the invention provides a semiconductor laser scanning depilation system, and the single semiconductor bar is used, so that the power of the semiconductor laser 5 is lower, the depilation effect can be achieved, the potential safety hazard is reduced, the workload of the cooling device is reduced, the working distance is adjustable, the area of a treatment area is adjustable, the handle and the host computer are relatively independent, and the individual maintenance, component replacement and the like can be carried out.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

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