阅读说明：本技术 一种半导体加工用静电消除设备 (Static elimination equipment for semiconductor processing ) 是由 肖友华 于 2021-08-09 设计创作，主要内容包括：本发明公开了一种半导体加工用静电消除设备,其结构包括机箱、检视窗、散热窗、反应箱、封闭门,所述的机箱正面位置设有检视窗且二者相互连通,所述的检视窗侧面设有散热窗且机箱底部连接反应箱,本发明具有的效果：利用离子风扇工作达到消除静电的目的,通过下漩涡轮旋转产生下沉气流带动覆盖在半导体板上的正负离子向下快速流动,结合增湿扇座制造的丰富水汽中和空气中的正负离子,降低正负离子的含量并减弱其转移静电的性能。(The invention discloses a static elimination device for semiconductor processing, which structurally comprises a case, an inspection window, a heat dissipation window, a reaction box and a closed door, wherein the inspection window is arranged on the front side of the case and is communicated with the case, the heat dissipation window is arranged on the side surface of the inspection window, and the bottom of the case is connected with the reaction box, so that the static elimination device has the following effects: the ion fan works to achieve the purpose of eliminating static electricity, the sinking air flow generated by the rotation of the lower vortex wheel drives positive and negative ions covered on the semiconductor board to flow downwards quickly, and the content of the positive and negative ions is reduced and the performance of transferring static electricity is weakened by combining the rich water vapor produced by the humidifying fan seat and the positive and negative ions in the air.)

1. The utility model provides an electrostatic elimination equipment for semiconductor processing, its structure includes quick-witted case (1), inspection window (2), radiator window (3), reaction box (4), closed door (5), its characterized in that:

case (1) openly position be equipped with inspection window (2) and the two communicates each other, inspection window (2) side be equipped with heat dissipation window (3) and case (1) bottom connection reaction case (4), reaction case (4) one side be equipped with and seal door (5) and link to each other with it.

2. The static elimination apparatus for semiconductor processing according to claim 1, wherein: reaction box (4) including box (40), ionic fan (41), semiconductor board (42), spacer block (43), down vortex wheel (44), humidification fan seat (45), axle core (46), box (40) in hookup ionic fan (41), ionic fan (41) under the position interval be equipped with semiconductor board (42), semiconductor board (42) both sides all be connected with spacer block (43) and its bottom through connection down vortex wheel (44), lower vortex wheel (44) bottom interval communicate humidification fan seat (45), humidification fan seat (45) terminal link to each other with axle core (46).

3. The static elimination apparatus for semiconductor processing according to claim 2, wherein: ion fan (41) including fan cover (410), conical shaft (411), high-tension electricity pipe (412), sink flabellum (413), kuppe ring (414), fan cover (410) middle-end position connect conical shaft (411), conical shaft (411) both sides all be equipped with high-tension electricity pipe (412) and its end-to-end connection and sink flabellum (413), the correspondence of fan leaf (413) one side of sinking be equipped with kuppe ring (414), kuppe ring (414) gomphosis connect fan cover (410).

4. The static elimination apparatus for semiconductor processing according to claim 2, wherein: the lower vortex wheel (44) comprises a lower concave frame (440), a swing frame (441), a convection rotating plate (442), a drainage through pipe (443) and a convection conveying pipe (444), wherein the inner side of the lower concave frame (440) is connected with the swing frame (441), the swing frame (441) is arranged on two sides of the convection rotating plate (442) and is connected with the convection rotating plate, the drainage through pipe (443) is arranged at the bottom of the convection rotating plate (442) at intervals, and the drainage through pipe (443) is communicated with the convection conveying pipe (444) below the drainage through pipe.

5. The static elimination apparatus for semiconductor processing according to claim 2, wherein: the humidifying fan seat (45) comprises a water guide pipe (450), a grid conveying frame (451) and a spraying and floating rotating ring (452), wherein the water guide pipe (450) is communicated with the grid conveying frame (451), and the spraying and floating rotating ring (452) is arranged at the top end of the grid conveying frame (451) and communicated with each other.

Technical Field

The invention relates to the field of semiconductors, in particular to static elimination equipment for semiconductor processing.

Background

Most semiconductor devices are static sensitive devices, static electricity is ubiquitous in the production process, a centrifugal fan can be installed in an internal structure for eliminating the static electricity in the equipment so as to achieve the purpose of eliminating the static electricity, but the use of an ion fan also has the fatal defect that a large amount of positive and negative ions can be released by the ion fan, the ions can freely move in the air and can be accumulated on other objects to generate a discharge phenomenon, and therefore the static electricity eliminating equipment for semiconductor processing needs to be developed so as to solve the problem that the discharge phenomenon is generated in the process of adopting the ion fan by the existing semiconductor processing equipment.

Summary of the invention

Aiming at the defects of the prior art, the invention is realized by the following technical scheme: an electrostatic eliminating device for semiconductor processing comprises a case, a detection window, a heat dissipation window, a reaction box and a sealing door, the front side of the case is provided with an inspection window which is communicated with the inspection window, the side surface of the inspection window is provided with a heat radiation window, the bottom of the case is connected with a reaction box, one side of the reaction box is provided with a closed door connected with the reaction box, the machine box is used as one of the core structures of the equipment, it is mainly used for the application of the processing and forming process of semiconductor products and is used as an assembly for controlling the operation of other structures, meanwhile, the frame of the device and the reaction box form a main body structure of the shell, the inspection window is made of transparent high-strength insulating glass material, keep high light transmission so that whether the operation of operator observation machine case and reaction box is normal can also effectively isolated electric charge, avoid the electric ion to overflow and attach to on other objects, can directly operate or overhaul the structure in the reaction box after the closed door is opened.

As a further optimization of the technical scheme, the reaction box comprises a box body, an ion fan, semiconductor plates, isolation blocks, a lower vortex wheel, a humidifying fan seat and a shaft core, wherein the ion fan is connected in the box body, the semiconductor plates are arranged under the ion fan at intervals, the isolation blocks are connected to two sides of each semiconductor plate, the bottom of each semiconductor plate is connected with the lower vortex wheel in a penetrating way, the bottom end of each lower vortex wheel is communicated with the humidifying fan seat at intervals, the tail end of each humidifying fan seat is connected with the shaft core, the box body is used as an inner shell carrier structure of the reaction box, a closed static eliminating space is formed in the reaction box through structural closure, a large number of positive and negative ions generated by the operation of the ion fan directly act on the semiconductor products of the semiconductor plates, and the positive and negative ions are uniformly attached to the semiconductor products by means of the characteristics of conveying the semiconductor products by the semiconductor plates, eliminate remaining static on the product, the spacing block mainly used isolates the friction collision of semiconductor product and structure, and it adopts the flexible glue material to make, is used for crashproof buffering on the one hand to use, and on the other hand also is the steam that is used for isolated bottom to rise.

As a further optimization of the technical proposal, the ion fan comprises a fan cover, a conical shaft, a high-voltage electric tube, a sinking fan blade and a guide groove ring, the middle end of the fan cover is connected with a conical shaft, both sides of the conical shaft are provided with high-voltage electric tubes, and the tail end of the conical shaft is connected with a sunken fan blade, one side of the sinking fan blade is correspondingly provided with a flow guide groove ring which is embedded and connected with a fan cover, a conical shaft connected with the fan cover adopts a conical structure design similar to a spindle body, the main purpose is to realize the effect of collecting the sinking airflow generated by the sinking fan blades which rotate in a linkage way in equal proportion, so that the positive and negative ion airflow generated under the discharge action of the high-voltage electric tube is highly gathered, meanwhile, the inclined channel design of the flow guide groove ring is combined to intensively guide the covering direction of airflow, so that the high-density forward semiconductor product is continuously output, and the static elimination effect on the product is ensured.

As a further optimization of the technical scheme, the lower vortex wheel comprises a lower concave frame, a swing frame, a convection rotating plate, a drainage through pipe and a convection conveying pipe, wherein the inner side of the lower concave frame is connected with the swing frame, the swing frame is arranged on two sides of the convection rotating plate and is connected with the convection rotating plate, the drainage through pipe is arranged at the bottom of the convection rotating plate at intervals, the drainage through pipe is communicated with the convection conveying pipe below the drainage through pipe, the lower concave frame forms a channel which is favorable for downward and rapid introduction of air flow by utilizing an inclined arc surface of the upper end surface of the lower concave frame, the disturbed air flow of the convection rotating plate manufactured by combining a honeycomb panel is coiled with ionic air and is highly concentrated and output from the drainage through pipe to the convection conveying pipe, and finally the ionic air is drained to the humidifying fan seat by the convection conveying pipe in the operation range to realize air ion neutralization reaction.

As a further optimization of the technical scheme, the humidifying fan seat comprises a water guide pipe, a grid conveying frame and a spraying and floating rotating ring, the water guide pipe is communicated with the grid conveying frame, the spraying and floating rotating ring is arranged at the top end of the grid conveying frame and communicated with the grid conveying frame, the water guide pipe is used for guiding external water or water flow into the water guide pipe, the water flow is concentrated at the position of the spraying and floating rotating ring through an inner hollow pipeline structure of the grid conveying frame, the water flow is converted into water mist under the action of centrifugal force of high-speed rotation, a certain height of the water mist is kept in a suspended state, and the water mist water vapor is combined with air carrying a large amount of positive and negative ions in the process, so that the ion dissipation is accelerated.

Advantageous effects

The static elimination equipment for semiconductor processing, provided by the invention, has the advantages of reasonable design and strong functionality, and has the following beneficial effects:

the invention firstly utilizes the characteristic that an ion fan can release a large amount of positive and negative ions during working so as to neutralize accumulated charges, an ionization device forms a stable high-voltage electric field under the action of low current and high voltage generated by a high-voltage generating device, ionized air forms positive and negative plasmas, the positive and negative plasmas are taken out by the air and reach the surface of an object, the positive charges in the air flow can be absorbed when the surface of the object is negative charges, and the negative charges in the air flow can be absorbed when the surface of the object is positive charges, so that the aim of eliminating static electricity is achieved, and the structure in the device is utilized to increase the humidity so as to reach the standard so as to ensure the capability of environment for dissipating the ions;

the invention generates sinking air flow by the rotation of the lower vortex wheel to drive positive and negative ions covered on the semiconductor plate to flow downwards quickly, and combines rich water vapor produced by the humidifying fan seat with the positive and negative ions in the air to reduce the content of the positive and negative ions and weaken the static electricity transfer performance of the positive and negative ions.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic side view of an electrostatic elimination apparatus for semiconductor processing according to the present invention;

FIG. 2 is a side sectional view of the structure of the reaction chamber of the present invention;

FIG. 3 is a cross-sectional side view of an ion fan according to the present invention;

FIG. 4 is a side cross-sectional view of the lower cyclone in accordance with the present invention;

FIG. 5 is a side sectional view of the structure of the humidifying fan base of the present invention;

in the figure: the device comprises a case-1, an inspection window-2, a heat dissipation window-3, a reaction box-4, a closed door-5, a box body-40, an ion fan-41, a semiconductor board-42, an isolation block-43, a lower vortex wheel-44, a humidifying fan seat-45, a shaft core-46, a fan cover-410, a conical shaft-411, a high-voltage electric tube-412, a sunken fan blade-413, a flow guide groove ring-414, a lower concave frame-440, a swing frame-441, a convection rotating plate-442, a flow guide through pipe-443, a convection transmission pipe-444, a water guide pipe-450, a grid transmission frame-451 and a spraying floating rotating ring-452.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

Referring to fig. 1 to 3, the present invention provides an embodiment of an electrostatic elimination apparatus for semiconductor processing:

referring to fig. 1, a static eliminating apparatus for semiconductor processing comprises a case 1, an inspection window 2, a heat dissipation window 3, a reaction box 4, and a sealing door 5, wherein the inspection window 2 is arranged on the front side of the case 1 and is communicated with the case 1, the heat dissipation window 3 is arranged on the side surface of the inspection window 2, the bottom of the case 1 is connected with the reaction box 4, the sealing door 5 is arranged on one side of the reaction box 4 and is connected with the reaction box, the case 1 is used as one of core structures of the apparatus, is mainly used for the application of the processing and forming process of semiconductor products and is used as an assembly for controlling the operation of other structures, and is used as a frame of the apparatus and the reaction box 4 to jointly form a main body structure of the housing, the inspection window 2 is made of transparent high-strength insulating glass material, and can effectively isolate charges while maintaining high-transmittance light rays so as to facilitate an operator to observe whether the operation of the case 1 and the reaction box 4 is normal, the electric ions are prevented from overflowing and attaching to other objects, and the closed door 5 can be directly operated in the reaction box 4 or the structure can be overhauled after being opened.

Referring to fig. 2, the reaction chamber 4 includes a chamber body 40, an ion fan 41, a semiconductor plate 42, an isolation block 43, a lower vortex wheel 44, a humidification fan seat 45, and a shaft core 46, the ion fan 41 is connected in the chamber body 40, the semiconductor plate 42 is disposed at intervals under the ion fan 41, both sides of the semiconductor plate 42 are connected with the isolation block 43, the bottom of the semiconductor plate is connected with the lower vortex wheel 44 in a penetrating manner, the bottom end of the lower vortex wheel 44 is connected with the humidification fan seat 45 at intervals, the end of the humidification fan seat 45 is connected with the shaft core 46, the chamber body 40 is used as an inner shell carrier structure of the reaction chamber 4, a closed static electricity eliminating space is formed in the reaction chamber 4 by closing the structure, a large amount of positive and negative ions generated by the operation of the ion fan 41 directly act on the semiconductor product of the semiconductor plate 42, the positive and negative ions are uniformly attached to the semiconductor product by virtue of the characteristics of the semiconductor plate 42, the isolating block 43 is mainly used for isolating the friction collision between the semiconductor product and the structure and is made of a soft rubber material, so that the isolating block is used for anti-collision buffering on one hand, and is also used for isolating the water vapor at the bottom from rising on the other hand, the lower vortex wheel 44 rotates to generate sinking airflow to drive positive and negative ions covered on the semiconductor plate 42 to flow downwards quickly, and the positive and negative ions in the rich water vapor and air manufactured by combining the humidifying fan seat 45 are combined to reduce the content of the positive and negative ions and weaken the static transfer performance of the positive and negative ions.

Referring to fig. 3, the ion fan 41 includes a fan housing 410, a conical shaft 411, high voltage electric tubes 412, sinking blades 413, and a guiding slot ring 414, wherein the middle end of the fan housing 410 is connected to the conical shaft 411, the two sides of the conical shaft 411 are respectively provided with the high voltage electric tubes 412, the ends of the high voltage electric tubes are connected to the sinking blades 413, one side of the sinking blades 413 is correspondingly provided with the guiding slot ring 414, the guiding slot ring 414 is embedded and connected to the fan housing 410, the conical shaft 411 connected to the fan housing 410 is designed to have a spindle-like conical structure, and the main purpose is to achieve the effect of collecting the sinking airflow generated by the sinking blades 413 in linkage rotation in equal proportion, so that the positive and negative ion airflows generated under the discharge action of the high voltage electric tubes 412 are highly collected, and the covering orientation of the airflow is concentrated by combining the inclined slot design of the guiding slot ring 414, so that the high density forward semiconductor product can be continuously output, ensuring the static elimination effect on the product.

Example 2

Referring to fig. 1 to 5, the present invention provides an embodiment of an electrostatic elimination apparatus for semiconductor processing:

referring to fig. 1, a static eliminating apparatus for semiconductor processing comprises a case 1, an inspection window 2, a heat dissipation window 3, a reaction box 4, and a sealing door 5, wherein the inspection window 2 is arranged on the front side of the case 1 and is communicated with the case 1, the heat dissipation window 3 is arranged on the side surface of the inspection window 2, the bottom of the case 1 is connected with the reaction box 4, the sealing door 5 is arranged on one side of the reaction box 4 and is connected with the reaction box, the case 1 is used as one of core structures of the apparatus, is mainly used for the application of the processing and forming process of semiconductor products and is used as an assembly for controlling the operation of other structures, and is used as a frame of the apparatus and the reaction box 4 to jointly form a main body structure of the housing, the inspection window 2 is made of transparent high-strength insulating glass material, and can effectively isolate charges while maintaining high-transmittance light rays so as to facilitate an operator to observe whether the operation of the case 1 and the reaction box 4 is normal, the electric ions are prevented from overflowing and attaching to other objects, and the closed door 5 can be directly operated in the reaction box 4 or the structure can be overhauled after being opened.

Referring to fig. 2, the reaction chamber 4 includes a chamber body 40, an ion fan 41, a semiconductor plate 42, an isolation block 43, a lower vortex wheel 44, a humidification fan seat 45, and a shaft core 46, the ion fan 41 is connected in the chamber body 40, the semiconductor plate 42 is disposed at intervals under the ion fan 41, both sides of the semiconductor plate 42 are connected with the isolation block 43, the bottom of the semiconductor plate is connected with the lower vortex wheel 44 in a penetrating manner, the bottom end of the lower vortex wheel 44 is connected with the humidification fan seat 45 at intervals, the end of the humidification fan seat 45 is connected with the shaft core 46, the chamber body 40 is used as an inner shell carrier structure of the reaction chamber 4, a closed static electricity eliminating space is formed in the reaction chamber 4 by closing the structure, a large amount of positive and negative ions generated by the operation of the ion fan 41 directly act on the semiconductor product of the semiconductor plate 42, the positive and negative ions are uniformly attached to the semiconductor product by virtue of the characteristics of the semiconductor plate 42, the isolating block 43 is mainly used for isolating the friction collision between the semiconductor product and the structure and is made of a soft rubber material, so that the isolating block is used for anti-collision buffering on one hand, and is also used for isolating the water vapor at the bottom from rising on the other hand, the lower vortex wheel 44 rotates to generate sinking airflow to drive positive and negative ions covered on the semiconductor plate 42 to flow downwards quickly, and the positive and negative ions in the rich water vapor and air manufactured by combining the humidifying fan seat 45 are combined to reduce the content of the positive and negative ions and weaken the static transfer performance of the positive and negative ions.

Referring to fig. 3, the ion fan 41 includes a fan housing 410, a conical shaft 411, high voltage electric tubes 412, sinking blades 413, and a guiding slot ring 414, wherein the middle end of the fan housing 410 is connected to the conical shaft 411, the two sides of the conical shaft 411 are respectively provided with the high voltage electric tubes 412, the ends of the high voltage electric tubes are connected to the sinking blades 413, one side of the sinking blades 413 is correspondingly provided with the guiding slot ring 414, the guiding slot ring 414 is embedded and connected to the fan housing 410, the conical shaft 411 connected to the fan housing 410 is designed to have a spindle-like conical structure, and the main purpose is to achieve the effect of collecting the sinking airflow generated by the sinking blades 413 in linkage rotation in equal proportion, so that the positive and negative ion airflows generated under the discharge action of the high voltage electric tubes 412 are highly collected, and the covering orientation of the airflow is concentrated by combining the inclined slot design of the guiding slot ring 414, so that the high density forward semiconductor product can be continuously output, ensuring the static elimination effect on the product.

Referring to fig. 4, the lower cyclone 44 includes a lower concave frame 440, a swing frame 441, a convection rotation plate 442, a flow guiding tube 443, and a convection transportation tube 444, the inner side of the lower concave frame 440 is connected to the swing frame 441, the swing frame 441 is disposed at two sides of the convection rotation plate 442 and connected to the same, the bottom of the convection rotation plate 442 is spaced by a flow guiding tube 443, the flow guiding tube 443 is connected to the convection transportation tube 444 below the flow guiding tube 443, the lower concave frame 440 forms a channel facilitating rapid introduction of an air flow downward by using an inclined arc surface of an upper end surface thereof, the air flow disturbed by the convection rotation plate 442 made of a honeycomb panel when rotating at a high speed is highly concentrated and output from the flow guiding tube 443 to the convection transportation tube 444, and finally the air flow guiding tube 444 guides the ion to the operation range of the humidification fan base 45 to achieve air ion neutralization reaction.

Referring to fig. 5, the humidifying fan seat 45 includes a water guiding pipe 450, a grid conveying frame 451, and a floating swivel 452, the water guiding pipe 450 is connected to the grid conveying frame 451, the floating swivel 452 is disposed at a top end of the grid conveying frame 451 and is connected to the grid conveying frame 451, the water guiding pipe 450 is used for guiding external water or water flow and concentrating the water flow at the position of the floating swivel 452 through an inner hollow pipe structure of the grid conveying frame 451, the water flow is converted into water mist under the action of a centrifugal force of high-speed rotation and maintains a suspended state of a certain height, and in the process, the water mist water vapor is combined with air carrying a large amount of positive and negative ions, so as to accelerate the dissipation of the ions.

The specific realization principle is as follows:

a large amount of positive and negative ions generated by the operation of the ion fan 41 in the reaction box 4 directly act on a semiconductor product of the semiconductor plate 42, the positive and negative ions are uniformly attached to the semiconductor product by depending on the characteristic that the semiconductor product is conveyed by the semiconductor plate 42, the residual static electricity on the product is eliminated, then the negative and positive ions covered on the semiconductor plate 42 are driven to flow downwards quickly by the sinking air flow generated by the rotation of the lower vortex wheel 44, the ionic air is guided into the operation range of the humidifying fan seat 45, the rich water vapor produced by the humidifying fan seat 45 neutralizes the positive and negative ions in the air, the dissipation of the ions is accelerated, and the problem of discharge phenomenon generated in the process of adopting the ion fan in the existing semiconductor processing equipment is solved.

While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.