阅读说明：本技术 一种电路基板、显示面板及制作方法 (Circuit substrate, display panel and manufacturing method ) 是由 徐涛 饶巍巍 潘连兴 姜发明 于 2021-06-30 设计创作，主要内容包括：本申请涉及显示器件制造的技术领域,尤其是涉及一种电路基板、显示面板及制作方法,其包括以下步骤：S1、配制导热粒子定位导热链；S2、溶解固态环氧树脂；S3、配置主体树脂；S4、添加填料以及固化剂；S5、胶膜制作；S6、热压合成型：将半固胶膜、铝板以及铜箔三者压合在一起,得到高导热电路基板的成品；S7、制作阵列基板；S8、制作彩膜基板；S9、成盒工序：将阵列基板与彩膜基板对合形成液晶盒；S10、模组工艺：将液晶盒的边缘与电路基板连接形成显示面板,本申请具有提高电路基板的导热性能,降低高温对电子器件各项性能的影响程度,使电子器件保持良好运行状态,提高显示面板运行稳定性的效果。(The application relates to the technical field of display device manufacturing, in particular to a circuit substrate, a display panel and a manufacturing method, which comprises the following steps: s1, preparing a heat conducting particle positioning heat conducting chain; s2, dissolving solid epoxy resin; s3, arranging main body resin; s4, adding a filler and a curing agent; s5, manufacturing an adhesive film; s6, hot-press molding: pressing the semi-solid glue film, the aluminum plate and the copper foil together to obtain a finished product of the high-heat-conductivity circuit substrate; s7, manufacturing an array substrate; s8, manufacturing a color film substrate; s9, a box forming process: combining the array substrate and the color film substrate to form a liquid crystal box; s10, die set process: the liquid crystal box has the advantages that the edge of the liquid crystal box is connected with the circuit substrate to form the display panel, the heat conducting performance of the circuit substrate is improved, the influence degree of high temperature on various performances of the electronic device is reduced, the electronic device is kept in a good running state, and the running stability of the display panel is improved.)

1. The utility model provides a circuit substrate, includes copper foil (1), insulating layer (2) and metal substrate (3), and insulating layer (2) are located between copper foil (1) and metal substrate (3), and the both sides that insulating layer (2) deviate from each other respectively with copper foil (1), metal substrate (3) rigid coupling, its characterized in that: in the process of manufacturing the insulating layer (2), a connecting agent, epoxy resin and heat conducting particles are uniformly filled in the insulating layer (2) to form a heat conducting particle-connecting agent-high molecular resin type heat conducting chain, wherein the heat conducting particles comprise nano boron nitride, aluminum nitride and aluminum oxide which are uniformly distributed in the insulating layer (2).

2. A circuit substrate according to claim 1, wherein: the epoxy resin comprises three grades of epoxy resins of E44, E12 and E03, and the proportional structure of the three grades of epoxy resins is E44: E12: E03=1:1: 3.

3. A display panel, characterized in that: the circuit substrate as claimed in any one of claims 1 to 2, wherein the display panel includes an array substrate (4) and a color filter substrate (5), the array substrate (4) and the color filter substrate (5) are fixedly connected to each other, and liquid crystal is filled between the array substrate (4) and the color filter substrate (5).

4. A manufacturing method of a display panel is characterized in that: comprising the circuit substrate and the display panel of any one of the preceding claims 1-3, the manufacturing method comprising the steps of:

s1, preparing a heat conducting particle positioning heat conducting chain: diluting a toughening agent by using butanone in a container, adding a connecting agent into the container, stirring, and adding ultra-small heat conducting particles into the stirred solution;

s2, dissolving solid epoxy resin: dissolving solid epoxy resin by butanone, standing, and stirring at high speed to completely dissolve the solid epoxy resin to obtain an epoxy resin solution;

s3, arrangement of host resin: adding a coupling agent and a dispersing agent into the epoxy resin solution in the S2, and stirring at a high speed to obtain a main epoxy resin solution;

s4, adding filler and curing agent: adding the solution obtained in the step S1 into the main epoxy resin solution in the step S3, stirring at a high speed to uniformly stir the mixture, adding a high-temperature curing agent diaminodiphenyl sulfone (DDS), a curing agent accelerator boron trifluoride monoethylamine and a low-temperature curing agent imidazole into the mixture, continuously stirring at a high speed, standing and defoaming to form a film solution for use;

s5, manufacturing an adhesive film: coating the prepared glue film solution in the S4 on a release film surface by using a coating rod, naturally drying the glue film, then placing the insulating glue film in an electric heating constant-temperature air blast drying oven for drying to form a semi-solidified state, and then taking out the insulating glue film;

s6, hot-press molding: wiping coupling agents on the surfaces of the processed aluminum plate and the processed copper foil (1), placing a semi-solid adhesive film between the aluminum plate and the copper foil (1), attaching the semi-solid adhesive film to one surface of the aluminum plate coated with the coupling agents and one surface of the copper foil (1) coated with the coupling agents, carrying out hot-pressing operation, pressing the semi-solid adhesive film, the aluminum plate and the copper foil (1) together, and taking down the aluminum plate and the copper foil after the aluminum plate and the copper foil are cooled to obtain a finished product of the high-thermal-conductivity circuit substrate;

s7, manufacturing an array substrate: cleaning a glass substrate, forming a metal film on the surface of the glass substrate through sputtering, coating photoresist on the surface of the metal film, exposing through a mask plate, performing corrosion processing on the glass substrate to enable the metal film to form a required shape, forming an insulator film on the surface of the glass substrate through chemical vapor deposition, and processing the insulator film into a designed shape through a photoetching process;

s8, manufacturing a color film substrate: cleaning a glass substrate, coating a black photosensitive resin layer on the surface of the glass substrate, exposing and developing through a mask plate to form a black matrix, coating a red organic photosensitive layer, exposing through a mask, developing and forming to form a red filter layer, and repeating the processes to sequentially form a green filter layer and a blue filter layer;

s9, a box forming process: dripping liquid crystal on the surface of the array substrate (4) or the color film substrate (5), coating border glue on the boundary area of the other substrate, and combining the array substrate (4) and the color film substrate (5) to form a liquid crystal box;

s10, die set process: and connecting the edge of the liquid crystal box with the circuit substrate to form the display panel.

5. The method for manufacturing a display panel according to claim 4, wherein: in step S1, after adding the ultra-small heat conducting particles to the stirred solution, ultrasonic mixing at 80 ℃ is also required.

6. The circuit substrate, the display panel and the manufacturing method according to claim 4, wherein: in step S7, after the glass substrate is etched, the remaining photoresist needs to be removed by a chemical stripping solution.

7. The method for manufacturing a display panel according to claim 4, wherein: in step S8, after the red, green and blue filter layers are formed, a transparent organic passivation layer is required to cover the entire surfaces of the red, green and blue filter layers.

8. The method for manufacturing a display panel according to claim 7, wherein: in step S8, the organic passivation layer is formed on the surface of the substrate by the same process as that for manufacturing the black matrix.

Technical Field

The present disclosure relates to the field of display device manufacturing technologies, and in particular, to a circuit substrate, a display panel and a manufacturing method thereof.

Background

The circuit substrate is an important production raw material in the industries of integrated circuits and semiconductors, and has wide application in the fields of high-power LEDs, aerospace, medical treatment, military, automobiles and the like. The circuit substrate is one of the core components for manufacturing the display panel.

The circuit substrate has three layers, each layer has different functions and is respectively a copper foil, an insulating layer and a metal substrate. The copper foil is used as a conductive layer for mainly placing various components, and the thickness of the copper foil is about 35 μm. The insulating layer is used as an intermediate medium of the copper foil and the metal substrate, the current on the surface of the copper foil is blocked, the copper foil and the metal substrate are prevented from forming a passage, the thickness of the insulating layer is not hard regulated, the overall quality of the circuit substrate is affected after the thickness is too thin, and voltage breakdown is not facilitated. The metal substrate is used as a heat dissipation layer to form a convective heat transfer layer with air, and generally an aluminum substrate or a copper substrate is used, wherein the aluminum plate is usually used as the heat dissipation layer because the aluminum plate has a higher cost performance. The circuit substrate composed of the copper foil, the insulating layer and the aluminum plate is called an aluminum-based copper-clad plate, and the heat-conducting property of the insulating layer is the dominant influence on the heat-conducting property of the aluminum-based copper-clad plate in the three-layer structure of the aluminum-based copper-clad plate.

With the miniaturization and integration of modern electronic components, when high-power electronic equipment normally operates, heat generated on the unit area of a circuit substrate rapidly rises, the circuit substrate is difficult to dissipate the rapidly generated heat in a short time, and the reliability, the precision and the service life of the electronic components in the high-power electronic equipment are seriously influenced or safety problems are caused.

The circuit substrate serves as a carrier of electronic components in electronic products, the faster the circuit substrate transfers heat from top to bottom, the better the heat-conducting property of the circuit substrate is, and the circuit substrate with good heat-conducting property can reduce the influence degree of high temperature on various properties of the electronic components.

Disclosure of Invention

In order to improve the heat-conducting property of the circuit substrate, reduce the influence degree of high temperature on various properties of electronic devices, keep the electronic devices in a good running state and improve the running stability of the display panel, the application provides the circuit substrate, the display panel and the manufacturing method.

A circuit substrate adopts the following technical scheme:

a circuit substrate comprises a copper foil, an insulating layer and a metal substrate, wherein the insulating layer is positioned between the copper foil and the metal substrate, two sides of the insulating layer, which deviate from each other, are fixedly connected with the copper foil and the metal substrate respectively, in the process of manufacturing the insulating layer, a connecting agent, epoxy resin and heat conducting particles are uniformly filled in the insulating layer to form a heat conducting particle-connecting agent-high molecular resin type heat conducting chain, and the heat conducting particles comprise nano boron nitride, aluminum nitride and aluminum oxide which are uniformly distributed in the insulating layer.

By adopting the technical scheme, according to experimental research, nanometer boron nitride, aluminum oxide, a connecting agent and epoxy resin are uniformly filled into the insulating layer, a heat conduction particle-connecting agent-high polymer resin type heat conduction chain can be formed in the insulating layer, the heat conductivity of the prepared insulating layer is obviously improved, the heat conduction performance of the circuit substrate is further improved, the influence degree of high temperature on various performances of electronic devices is reduced, the electronic devices are kept in a good running state, and the running stability of the display panel is improved.

Optionally, the epoxy resin includes three grades of epoxy resins, E44, E12, and E03, and the ratio structure of the three grades of epoxy resins is E44: E12: E03=1:1: 3.

By adopting the technical scheme, according to experimental determination, compared with a single grade of epoxy resin, the insulating layer is filled with three grades of epoxy resin, so that the heat-conducting property of the insulating layer can be improved; when the proportional structure of the three grades of epoxy resin is E44: E12: E03=1:1:3, the thermal conductivity of the insulating layer is at a high level.

A display panel adopts the following technical scheme:

a display panel comprising the circuit substrate according to any one of claims 1-2, wherein the display panel comprises an array substrate and a color filter substrate, the array substrate and the color filter substrate are fixedly connected with each other, and liquid crystal is filled between the array substrate and the color filter substrate.

By adopting the technical scheme, the circuit substrate is adopted to manufacture the display panel, so that the heat dissipation performance of the display panel can be improved, the influence degree of high temperature on various performances of the display panel is reduced, and the display panel is kept in a good running state.

The manufacturing method of the display panel adopts the following technical scheme:

a method for manufacturing a display panel comprising the circuit substrate and the display panel according to any one of claims 1 to 3, the method comprising the steps of:

s1, preparing a heat conducting particle positioning heat conducting chain: diluting a toughening agent by using butanone in a container, adding a connecting agent into the container, stirring, and adding ultra-small heat conducting particles into the stirred solution;

s2, dissolving solid epoxy resin: dissolving solid epoxy resin by butanone, standing, and stirring at high speed to completely dissolve the solid epoxy resin to obtain an epoxy resin solution;

s3, arrangement of host resin: adding a coupling agent and a dispersing agent into the epoxy resin solution in the S2, and stirring at a high speed to obtain a main epoxy resin solution;

s4, adding filler and curing agent: adding the solution obtained in the step S1 into the main epoxy resin solution in the step S3, stirring at a high speed to uniformly stir the mixture, adding a high-temperature curing agent diaminodiphenyl sulfone (DDS), a curing agent accelerator boron trifluoride monoethylamine and a low-temperature curing agent imidazole into the mixture, continuously stirring at a high speed, standing and defoaming to form a film solution for use;

s5, manufacturing an adhesive film: coating the prepared glue film solution in the S4 on a release film surface by using a coating rod, naturally drying the glue film, then placing the insulating glue film in an electric heating constant-temperature air blast drying oven for drying to form a semi-solidified state, and then taking out the insulating glue film;

s6, hot-press molding: wiping the coupling agent on the surfaces of the processed aluminum plate and the processed copper foil, placing the semi-solid adhesive film between the aluminum plate and the copper foil, attaching the semi-solid adhesive film to one surface of the aluminum plate coated with the coupling agent and one surface of the copper foil coated with the coupling agent, performing hot pressing operation, pressing the semi-solid adhesive film, the aluminum plate and the copper foil together, and taking down the semi-solid adhesive film, the aluminum plate and the copper foil after cooling to obtain a finished product of the high-thermal-conductivity circuit substrate;

s7, manufacturing an array substrate: cleaning a glass substrate, forming a metal film on the surface of the glass substrate through sputtering, coating photoresist on the surface of the metal film, exposing through a mask plate, performing corrosion processing on the glass substrate to enable the metal film to form a required shape, forming an insulator film on the surface of the glass substrate through chemical vapor deposition, and processing the insulator film into a designed shape through a photoetching process;

s8, manufacturing a color film substrate: cleaning a glass substrate, coating a black photosensitive resin layer on the surface of the glass substrate, exposing and developing through a mask plate to form a black matrix, coating a red organic photosensitive layer, exposing through a mask, developing and forming to form a red filter layer, and repeating the processes to sequentially form a green filter layer and a blue filter layer;

s9, a box forming process: dripping liquid crystal on the surface of the array substrate or the color film substrate, coating frame glue on the boundary area of the other substrate, and combining the array substrate and the color film substrate to form a liquid crystal box;

s10, die set process: and connecting the edge of the liquid crystal box with the circuit substrate to form the display panel.

By adopting the technical scheme, the steps from S1 to S6 realize the manufacture of the circuit substrate with good heat conduction performance, and the whole manufacturing process realizes automation and sterility. And S7 to S10, assembling the circuit substrate and the liquid crystal box to realize the automatic manufacture of the display panel, and because the circuit substrate has good heat-conducting property, the circuit substrate is adopted to manufacture the display panel, so that the heat dissipation performance of the display panel can be improved, the influence degree of high temperature on various properties of the display panel is reduced, and the display panel is kept in a good running state.

Optionally, in step S1, after adding the ultra-small heat conducting particles to the stirred solution, ultrasonic mixing at 80 ℃ is further performed.

By adopting the technical scheme, ultrasonic mixing is carried out at 80 ℃, and the uniform mixing degree of the ultra-small particle heat conduction particles and the mixed solution of the butanone, the toughening agent and the connecting agent can be further improved.

Alternatively, in step S7, after the glass substrate is etched, the residual photoresist needs to be removed by a chemical stripping solution.

By adopting the technical scheme, the residual photoresist on the glass substrate can be dissolved and removed by using the chemical stripping liquid, so that the metal film with the required shape is smoothly exposed without damaging the metal film and the glass substrate.

Optionally, in step S8, after the red, green and blue filter layers are formed, a transparent organic protection layer is further required to cover the entire surfaces of the red, green and blue filter layers.

By adopting the technical scheme, the transparent organic protective layer can protect the red, green and blue filter layers and ensure the stability of the characteristics of the red, green and blue filter layers.

Optionally, in step S8, the uniformly distributed column spacers are formed on the surface of the organic passivation layer according to the same process flow as that for manufacturing the black matrix.

By adopting the technical scheme, when the columnar liner is used for forming a box by the color film substrate and the array substrate, a certain box thickness is kept to fill and store liquid crystal.

In summary, the present application includes at least one of the following beneficial technical effects:

1. nanometer boron nitride, aluminum oxide, a connecting agent and epoxy resin are uniformly filled in the insulating layer, a heat conducting particle-connecting agent-high molecular resin type heat conducting chain can be formed in the insulating layer, the heat conductivity of the prepared insulating layer is obviously improved, the heat conducting performance of the circuit substrate is further improved, the influence degree of high temperature on various performances of electronic devices is reduced, the electronic devices are kept in a good running state, and the running stability of the display panel is improved;

2. the circuit substrate is adopted to manufacture the display panel, so that the heat dissipation performance of the display panel can be improved, the influence degree of high temperature on various performances of the display panel is reduced, and the display panel is kept in a good running state.

Drawings

Fig. 1 is a schematic structural diagram of a circuit substrate, a display panel and a manufacturing method according to an embodiment of the present application.

Description of reference numerals: 1. copper foil; 2. an insulating layer; 3. a metal substrate; 4. an array substrate; 5. a color film substrate; 6. an anisotropic conductive adhesive; 7. a flexible circuit board.

Detailed Description

The present application is described in further detail below with reference to fig. 1.

Example 1

The embodiment of the application discloses a circuit substrate, refer to fig. 1, the circuit substrate includes copper foil 1, insulating layer 2 and metal substrate 3, insulating layer 2 is located between copper foil 1 and metal substrate 3, and the both sides that insulating layer 2 deviates from each other are fixed with copper foil 1, metal substrate 3 bonding respectively. One side of the copper foil 1 departing from the insulating layer 2 is fixedly connected with a plurality of flexible circuit boards 7, and the flexible circuit boards 7 are parallel to each other.

In the process of manufacturing the insulating layer 2, the inside of the insulating layer 2 is uniformly filled with a connecting agent, epoxy resin and heat conducting particles to form a heat conducting chain in a form of heat conducting particles-connecting agent-high molecular resin, wherein the heat conducting particles comprise nano boron nitride, aluminum nitride and aluminum oxide which are uniformly distributed in the inside of the insulating layer 2. The epoxy resin comprises three grades of epoxy resins E44, E12 and E03, and the proportional structure of the three grades of epoxy resins is E44: E12: E03=1:1: 3.

According to experimental research, nanometer boron nitride, aluminum oxide, a connecting agent and epoxy resin are uniformly filled into the insulating layer 2, a heat conducting particle-connecting agent-high molecular resin type heat conducting chain can be formed in the insulating layer 2, the heat conductivity of the prepared insulating layer 2 is obviously improved, the heat conducting performance of the circuit substrate is further improved, the influence degree of high temperature on various performances of electronic devices is reduced, the electronic devices are enabled to keep a good operation state, and the operation stability of the display panel is improved. Compared with a single grade of epoxy resin, the three grades of epoxy resin are filled in the insulating layer 2, so that the heat-conducting property of the insulating layer 2 can be improved; when the proportional structure of the three grades of epoxy resin is E44: E12: E03=1:1:3, the thermal conductivity of the insulating layer 2 is at a high level.

Example 2

The embodiment of the application discloses a display panel, referring to fig. 1, the display panel includes an array substrate 4 and a color film substrate 5, the array substrate 4 and the color film substrate 5 are opposite to each other and are fixedly bonded, and liquid crystal is filled between the array substrate 4 and the color film substrate 5. Anisotropic conductive adhesive 6 is fixedly bonded at a plurality of positions close to the edge of the array substrate 4 on one side of the array substrate 4 away from the color film substrate 5, and one end of each flexible circuit board 7, which is far away from the copper foil 1, is fixedly bonded with the array substrate 4 through the anisotropic conductive adhesive 6.

The circuit substrate in embodiment 1 is used to manufacture the display panel, so that the heat dissipation performance of the display panel can be improved, the influence degree of high temperature on various performances of the display panel can be reduced, and the display panel can be kept in a good operation state.

Example 3

The embodiment of the application discloses a manufacturing method of the circuit substrate and the display panel, which comprises the following steps:

s1, referring to fig. 1, adding butanone and a toughening agent into a stirring container, diluting the toughening agent with butanone, adding into the container, stirring at a high speed, adding ultra-small heat conducting particles into the stirred solution, wherein the heat conducting particles are nano boron nitride, aluminum nitride and aluminum oxide, and performing ultrasonic mixing and stirring at 80 ℃.

S2, referring to FIG. 1, butanone and solid epoxy resin are added into a stirring container, the solid epoxy resin is dissolved by butanone, the mixture is kept stand for 20 minutes and then stirred for 15 minutes at a stirring speed of 800 r/min-1000 r/min, so that the solid epoxy resin is completely dissolved to obtain an epoxy resin solution.

S3, referring to FIG. 1, the coupling agent and the dispersant are added to the epoxy resin solution in S2, and the mixture is stirred at a stirring speed of 800r/min to 1000r/min for 15 minutes to obtain a main epoxy resin solution.

S4, referring to FIG. 1, adding the mixed solution obtained in S1 into the main epoxy resin solution in S3, and stirring for 15 minutes at a stirring speed of 800r/min to 1000r/min to uniformly stir the mixture; then adding high-temperature curing agent diaminodiphenyl sulfone (DDS), curing agent accelerator boron trifluoride monoethylamine and low-temperature curing agent imidazole into the mixture, stirring for 20 minutes at the stirring speed of 800 r/min-1000 r/min, standing for 3 hours, and defoaming to form a film solution for use.

S5, referring to FIG. 1, coating the prepared adhesive film solution in S4 on a release film surface by using a coating rod, and naturally drying the release film surface to volatilize the low-temperature solvent on the surface; and then placing the insulating adhesive film in an electric heating constant-temperature air blast drying oven, setting the temperature at 120 ℃, drying for 3.5 minutes to form a semi-solidified state, and taking out the semi-solidified state.

S6, referring to FIG. 1, cleaning an aluminum plate and a copper foil 1 by using a cleaning agent, wiping a coupling agent on the surfaces of the treated aluminum plate and copper foil 1, placing a semi-solid adhesive film between the aluminum plate and the copper foil 1, attaching the semi-solid adhesive film to the surface of the aluminum plate coated with the coupling agent and the surface of the copper foil 1 coated with the coupling agent, placing the circuit substrate on an operation table of a hot pressing machine for hot pressing operation, pressing the semi-solid adhesive film, the aluminum plate and the copper foil 1 together, firstly enabling the semi-solid adhesive film to flow and flatten under the action of pressure, then heating to completely solidify the semi-solid adhesive film, providing enough time to completely solidify the semi-solid adhesive film, cooling the semi-solid adhesive film, and then taking down the circuit substrate to obtain a finished product of the high-thermal-conductivity circuit substrate.

S7, referring to FIG. 1, the glass substrate is first cleaned with a cleaning agent and ultrapure water to remove foreign matter on the surface. And then, forming a metal film on the surface of the glass substrate by sputtering, accelerating inert element atoms by using an electric field in a vacuum environment, bombarding a metal target platform, sputtering the metal atoms out, and depositing the metal atoms on the glass substrate to form the metal film. And uniformly coating a layer of photoresist on the surface of the metal film, irradiating the photoresist on the glass substrate through a mask plate by ultraviolet rays for exposure, dissolving an exposed part of the photoresist by a developing solution, and leaving a part of a pattern in a required shape. And putting the glass substrate into an etching solution, wherein the film which is not covered by the photoresist is etched by the etching solution, and removing the residual photoresist by using a chemical stripping solution to leave the metal film with the required shape on the glass substrate. An insulator thin film is formed on the surface of the glass substrate by chemical vapor deposition, and then the insulator thin film is processed into a designed shape by the photoetching process. And finally, performing quality detection and removing defective products.

S8, referring to FIG. 1, the glass substrate is first cleaned with a cleaning agent and ultrapure water to remove foreign matter on the surface. And then, coating a black photosensitive resin layer on the surface of the glass substrate, exposing and developing through a mask plate to form a black matrix, wherein the black matrix corresponds to the position of a pixel. Then coating a layer of red organic photosensitive layer, mask exposing, developing and forming to form a red filter layer corresponding to the pixel, repeating the above steps to form a green filter layer and a blue filter layer in sequence, and filling the green filter layer and the blue filter layer in the corresponding grids of the black matrix. And a transparent organic protective layer is covered on the surfaces of the red, green and blue filter layers. And a layer of transparent conductive film is integrally deposited on the surface of the transparent organic protective layer and is used as a common electrode of all pixel voltage signals. And finally, forming uniformly distributed column-shaped liner objects on the surface of the transparent conductive film according to the same process flow as the process flow for manufacturing the black matrix.

S9, referring to fig. 1, uniformly dropping liquid crystal on the surface of the array substrate 4, uniformly coating border adhesive on the border area of the color film substrate 5, and pressing the array substrate 4 and the color film substrate 5 together by a cold press in a vacuum environment to form a liquid crystal cell. And applying an electrical signal to carry out qualification rate detection on the liquid crystal box.

S10, referring to fig. 1, aligning an electrode at one end of the flexible circuit board 7 away from the copper foil 1 with an electrode at the edge of the liquid crystal cell through the anisotropic conductive adhesive 6, pressing, heating and curing to complete the welding of the liquid crystal cell and the circuit substrate, thereby forming the display panel.

The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.