阅读说明：本技术 一种优化连接器串扰的pcb板、实现方法 (PCB for optimizing connector crosstalk and implementation method ) 是由 李永翠 于 2021-06-30 设计创作，主要内容包括：本发明提供一种优化连接器串扰的PCB板、实现方法,所述的PCB板包括多层的板卡本体,板卡本体上设置有若干排高密口焊垫,相邻的两排高密口焊垫之间设置有一排地孔；板卡本体的最上层的出线连接到距离板卡本体出线侧最近的一排高密口焊垫的PIN；依次往下,板卡本体的下层出线,连接到远离板卡本体出线侧的一排高密口的焊垫的PIN；将若干排高密焊垫平分成两个区域,且同一个区域的多排高密焊垫的PIN定义成同一个信号。避免了高速差分信号的PIN脚及焊垫之间的串扰,确保了链路的信号完整性；同时合理利用板卡上的走线空间,避免过设计带来的成本浪费；该方法简洁高效易实现,同时增加了系统设计可靠性。(The invention provides a PCB for optimizing connector crosstalk and an implementation method, wherein the PCB comprises a multilayer board card body, a plurality of rows of high-density port welding pads are arranged on the board card body, and a row of ground holes are arranged between two adjacent rows of high-density port welding pads; the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density port welding pads closest to the outgoing line side of the board card body; sequentially going downwards, the lower layer of the board card body is led out, and the PINs are connected to the pads of a row of high-density ports far away from the outgoing side of the board card body; the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal. Crosstalk between the PIN foot and the welding pad of the high-speed differential signal is avoided, and signal integrity of a link is ensured; meanwhile, the routing space on the board card is reasonably utilized, and the cost waste caused by over-design is avoided; the method is simple, efficient and easy to implement, and meanwhile, the reliability of system design is improved.)

1. A PCB for optimizing connector crosstalk comprises a multi-layer board card body, wherein a plurality of rows of high-density opening welding pads are arranged on the board card body, and a row of ground holes are formed between two adjacent rows of high-density opening welding pads;

the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density port welding pads closest to the outgoing line side of the board card body;

the lower layer of the board card body is led out and connected to PIN of a row of high-density port welding pads far away from the outgoing line side of the board card body;

the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal.

2. The PCB for optimizing the connector crosstalk according to claim 1, wherein a row of high-density port welding pads on the board body closest to the outgoing line side is a first row of high-density port welding pads, and so on, and a row of high-density port welding pads on the board body farthest from the outgoing line side is an Nth row of high-density port welding pads;

the layer of the board card body, which is led out to the outgoing line side, is sequentially a first layer to an Nth layer from top to bottom;

the outgoing line of the first layer of the board card body is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, the outgoing line of the Nth layer of the board card body is connected to the PIN of the Nth row of high-density port welding pads.

3. The PCB board for optimizing connector crosstalk according to claim 2, wherein ground holes are arranged on the same side of each row of high-density pads, and the distance from each row of ground holes to the row of high-density pads PIN is a set threshold value.

4. The PCB board for optimizing connector crosstalk according to claim 3, wherein each row of high-density port pads comprises a plurality of pairs of differential signal PINs of high-density ports;

and a ground hole is arranged between the differential signal PIN of each adjacent pair of high-density ports in the same row.

5. The PCB for optimizing connector crosstalk according to claim 4, wherein the PIN of the high-density port bonding pad and the outgoing line of the PIN of the high-density port bonding pad on the layer of the card body except the top layer form L-shaped units, no intersection point exists between the L-shaped units, and the PIN of the high-density port bonding pad does not have an intersection point with each L-shaped unit on the outgoing line of the top layer of the card body.

6. The PCB board for optimizing connector crosstalk according to claim 5, wherein high-density connectors are arranged at the positions of high-density port welding pads on the board card body; a row of ground holes are formed between the PINs of the two adjacent rows of high-density connectors;

the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density connectors closest to the outgoing line side of the board card body;

the layers of the board card body are sequentially connected downwards in an outgoing line mode, and the outgoing line at the lower layer of the board card body is connected to PIN of a row of high-density connectors far away from the outgoing line side of the board card body;

the PIN of the high-density connectors in the rows is divided into two areas in equal halves, and the PIN of the high-density connectors in the rows in the same area is defined as the same signal.

7. An implementation method for optimizing a connector crosstalk PCB board is characterized by comprising the following steps:

arranging a plurality of rows of high-density port welding pads on the board card body;

a ground hole is arranged between two adjacent rows of high-density opening welding pads;

setting PIN for connecting the outgoing line of the uppermost layer of the board card body to a row of high-density port welding pads closest to the outgoing line side of the board card body; the lower outgoing line of the board card body is connected to PIN of a row of high-density port welding pads far away from the outgoing line side of the board card body;

the pads of the high-density connectors are divided into two areas, and the PINs of the high-density pads in the same area are defined as the same signal.

8. The method for implementing the optimized connector crosstalk PCB according to claim 7, wherein a PIN is provided for connecting an outgoing line at the uppermost layer of the board body to a row of high-density pads closest to the outgoing line side of the board body; down in proper order, the step that the lower floor that sets up the integrated circuit board body is qualified for the next round of competitions and is connected to the pad of the one row of high density mouthful of the side of keeping away from integrated circuit board body outgoing line PIN specifically includes:

defining a row of high-density port welding pads which are closest to the outgoing line side on the board card body as a first row of high-density port welding pads, and so on, and defining a row of high-density port welding pads which are farthest from the outgoing line side on the board card body as an Nth row of high-density port welding pads;

defining the layer of the board card body, which is led out to the outgoing line side, as a first layer to an Nth layer from top to bottom in sequence;

an outgoing line of a first layer of the board card body is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, an outgoing line of the Nth layer of the board card body is connected to the PIN of the Nth row of high-density port welding pads.

9. The method of claim 8, wherein the step of providing a ground via between two adjacent rows of high-density pads further comprises:

and arranging the ground holes on the same side of each row of high-density welding pads, wherein the distance from each row of ground holes to the central line of the row of high-density welding pads PIN is a set threshold value.

10. The method for implementing the optimized connector crosstalk PCB of claim 9, wherein each row of high-density port pads comprises a plurality of pairs of differential signal PINs of high-density ports; the method further comprises the following steps:

and arranging a ground hole between the differential signal PIN of each adjacent pair of high-density ports in the same row.

Technical Field

The invention relates to the technical field of PCB anti-interference design, in particular to a PCB for optimizing connector crosstalk and an implementation method.

Background

In server design, especially in a PCIE5.0 high-speed signal interconnection topological link, board card density increases and a laminated board thickness becomes thicker and thicker along with an increase in signal rate, and in a high-speed interconnection architecture, a high-density connector is widely applied to a system interconnection architecture due to small volume, high density and easiness in plugging and unplugging for selection of the connector.

Because the high density of the interface is high, in practical application, the distances between pin pins and pad fotprints of each high-speed differential port are very close, which increases crosstalk between signals, so that the crosstalk between differential holes of the high-speed connector is usually ignored in design, especially under the condition of very thick lamination, the crosstalk between via holes cannot be ignored, and in design, the signal via hole pitch is too small, and the crosstalk is too large; some designers customize the pin and the footprint of the high-speed differential port to design the PCB board at a high-density port with a relatively long distance, so as to avoid crosstalk, which causes a high-density connector and an excessive utilization of the space in the board, thereby resulting in cost waste.

Disclosure of Invention

Aiming at the problem that crosstalk is avoided by customizing a pin of a high-speed differential port and a high-density port with a relatively long distance from a hotspot print, and thus a high-density connector and the problem that cost is wasted due to overlarge space utilization in a board are caused, the invention provides the PCB for optimizing the crosstalk of the connector and the implementation method.

The technical scheme of the invention is as follows:

in a first aspect, the technical scheme of the invention provides a PCB for optimizing connector crosstalk, which comprises a multilayer board card body, wherein a plurality of rows of high-density port welding pads are arranged on the board card body, and a ground hole is arranged between two adjacent rows of high-density port welding pads;

the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density port welding pads closest to the outgoing line side of the board card body;

the lower layer of the board card body is led out and connected to PIN of a row of high-density port welding pads far away from the outgoing line side of the board card body;

the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal.

Preferably, a row of high-density port welding pads closest to the outgoing line side on the board card body is a first row of high-density port welding pads, and so on, and a row of high-density port welding pads farthest from the outgoing line side on the board card body is an Nth row of high-density port welding pads;

the layer of the board card body, which is led out to the outgoing line side, is sequentially a first layer to an Nth layer from top to bottom;

the outgoing line of the first layer of the board card body is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, the outgoing line of the Nth layer of the board card body is connected to the PIN of the Nth row of high-density port welding pads.

Preferably, the ground holes are arranged on the same side of each row of high-density bonding pads, and the distance between each row of ground holes and the row of high-density bonding pads PIN is a set threshold value.

Preferably, each row of high-density port welding pads comprises a plurality of pairs of differential signal PIN of high-density ports;

and a ground hole is arranged between the differential signal PIN of each adjacent pair of high-density ports in the same row.

Preferably, the outgoing lines of the PIN of the high-density port welding pad and the PIN of the high-density port welding pad on the layer of the board body except the top layer form L-shaped units, no intersection point exists between each L-shaped unit, and the outgoing lines of the PIN of the high-density port welding pad on the top layer of the board body and each L-shaped unit do not have an intersection point.

Preferably, a high-density connector is arranged at the position of the high-density port welding pad on the board card body; a row of ground holes are formed between the PINs of the two adjacent rows of high-density connectors;

the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density connectors closest to the outgoing line side of the board card body;

the layers of the board card body are sequentially connected downwards in an outgoing line mode, and the outgoing line at the lower layer of the board card body is connected to PIN of a row of high-density connectors far away from the outgoing line side of the board card body;

the PIN of the high-density connectors in the rows is divided into two areas in equal halves, and the PIN of the high-density connectors in the rows in the same area is defined as the same signal.

In a second aspect, the technical solution of the present invention further provides a method for implementing an optimized connector crosstalk PCB, including the following steps:

arranging a plurality of rows of high-density port welding pads on the board card body;

a ground hole is arranged between two adjacent rows of high-density opening welding pads;

setting PIN for connecting the outgoing line of the uppermost layer of the board card body to a row of high-density port welding pads closest to the outgoing line side of the board card body; the lower outgoing line of the board card body is connected to PIN of a row of high-density port welding pads far away from the outgoing line side of the board card body;

the pads of the high-density connectors are divided into two areas, and the PINs of the high-density pads in the same area are defined as the same signal.

Preferably, the PIN is arranged, wherein the outgoing line of the uppermost layer of the board card body is connected to a row of high-density port welding pads closest to the outgoing line side of the board card body; down in proper order, the step that the lower floor that sets up the integrated circuit board body is qualified for the next round of competitions and is connected to the pad of the one row of high density mouthful of the side of keeping away from integrated circuit board body outgoing line PIN specifically includes:

defining a row of high-density port welding pads which are closest to the outgoing line side on the board card body as a first row of high-density port welding pads, and so on, and defining a row of high-density port welding pads which are farthest from the outgoing line side on the board card body as an Nth row of high-density port welding pads;

defining the layer of the board card body, which is led out to the outgoing line side, as a first layer to an Nth layer from top to bottom in sequence;

an outgoing line of a first layer of the board card body is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, an outgoing line of the Nth layer of the board card body is connected to the PIN of the Nth row of high-density port welding pads.

Preferably, the step of providing a ground via between two adjacent rows of high-density-port pads further includes:

and arranging the ground holes on the same side of each row of high-density welding pads, wherein the distance from each row of ground holes to the row of high-density welding pads PIN is a set threshold value.

Preferably, each row of high-density port welding pads comprises a plurality of pairs of differential signal PIN of high-density ports; the method further comprises the following steps:

and arranging a ground hole between the differential signal PIN of each adjacent pair of high-density ports in the same row.

Preferably, the method further comprises:

arranging outgoing lines of the PIN of the high-density port welding pad and the PIN of the high-density port welding pad on layers of the board card body except the top layer to form L-shaped units, wherein no intersection point exists between the L-shaped units;

the outgoing line of the PIN provided with the high-density port welding pad on the top layer of the board card body is not intersected with each L-shaped unit.

Preferably, the method further comprises:

and a high-density connector is arranged at the position of the welding pad of the high-density port on the board card body.

Thus, a row of ground holes are formed between the PINs of the two adjacent rows of high-density connectors; the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density connectors closest to the outgoing line side of the board card body; sequentially going downwards, leading out wires from the lower layer of the board card body, and connecting the wires to PIN of a row of high-density connectors far away from the wire outlet side of the board card body; the PIN of the high-density connectors in the rows is divided into two areas in equal halves, and the PIN of the high-density connectors in the rows in the same area is defined as the same signal.

According to the technical scheme, the invention has the following advantages: crosstalk between the PIN foot and the welding pad of the high-speed differential signal is avoided, signal integrity of a link is ensured, and signal failure caused by crosstalk is avoided; meanwhile, the routing space on the board card is reasonably utilized, and the cost waste caused by over-design is avoided; the method is simple, efficient and easy to implement, and meanwhile, the reliability of system design is improved.

In addition, the invention has reliable design principle, simple structure and very wide application prospect.

Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.

Drawings

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a part of a board card body according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of outgoing lines of each layer of a part of the board card body according to an embodiment of the present invention.

In the figure, 1-board body, 102-board body outgoing line side, 103-board body layer, 104-outgoing line, 105-differential signal PIN.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 and fig. 2, an embodiment of the present invention provides a PCB for optimizing connector crosstalk, which includes a multi-layer board card body 1, where the board card body 1 is provided with a plurality of rows of high-density-port pads, and a row of ground holes is provided between two adjacent rows of high-density-port pads;

the outgoing line of the uppermost layer of the board card body 1 is connected to the PIN of a row of high-density port welding pads closest to the outgoing line side 102 of the board card body;

the lower outgoing line 104 of the board card body is connected to PIN of a row of high-density welding pads 102 far away from the outgoing line side 102 of the board card body;

the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal.

The PCB comprises a multi-layer board card body 1, wherein a plurality of rows of high-density port welding pads are arranged on the board card body 1, and a row of ground holes are formed between two adjacent rows of high-density port welding pads;

the outgoing line of the uppermost layer of the board card body 1 is connected to the PIN of a row of high-density port welding pads closest to the outgoing line side 102 of the board card body;

the layers of the board card body are sequentially connected downwards in an outgoing line mode, and the lower outgoing line 104 of the board card body is connected to PIN of welding pads 102 with a row of high-density ports far away from the outgoing line side 102 of the board card body;

the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal.

In this embodiment, the row of high-density port pads closest to the outgoing side 102 on the board body 1 is the first row of high-density port pads, and so on, and the row of high-density port pads farthest from the outgoing side 102 on the board body is the nth row of high-density port pads;

the layer of the board card body 1, which is led out to the outgoing line side 102, is sequentially a first layer to an Nth layer from top to bottom;

the outgoing line 104 of the first layer of the board card body 1 is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, the outgoing line 104 of the Nth layer of the board card body 1 is connected to the PIN of the Nth row of high-density port welding pads.

The PCB comprises a multi-layer board card body 1, wherein a plurality of rows of high-density port welding pads are arranged on the board card body 1, and a row of ground holes are formed between two adjacent rows of high-density port welding pads;

the outgoing line of the uppermost layer of the board card body 1 is connected to the PIN of a row of high-density port welding pads closest to the outgoing line side 102 of the board card body;

the lower outgoing line 104 of the board card body is connected to the PIN of the welding pads 102 with a row of high-density ports far away from the outgoing line side 102 of the board card body;

the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal.

In this embodiment, the row of high-density port pads closest to the outgoing side 102 on the board body 1 is the first row of high-density port pads, and so on, and the row of high-density port pads farthest from the outgoing side 102 on the board body is the nth row of high-density port pads;

the layer of the board card body 1, which is led out to the outgoing line side 102, is sequentially a first layer to an Nth layer from top to bottom;

the outgoing line 104 of the first layer of the board card body 1 is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, the outgoing line 104 of the Nth layer of the board card body 1 is connected to the PIN of the Nth row of high-density port welding pads.

The ground holes g are arranged on the same side of each row of high-density welding pads, and the distance from each row of ground holes to the central line of the PIN of each row of high-density welding pads is a set threshold value.

Each row of high-density port welding pads comprise a plurality of pairs of differential signal PIN105 of high-density ports;

and a ground hole G is arranged between the differential signals PIN of each adjacent pair of high-density ports in the same row.

The PCB comprises a multi-layer board card body 1, wherein a plurality of rows of high-density port welding pads are arranged on the board card body 1, and a row of ground holes are formed between two adjacent rows of high-density port welding pads;

the outgoing line of the uppermost layer of the board card body 1 is connected to the PIN of a row of high-density port welding pads closest to the outgoing line side 102 of the board card body;

the lower outgoing line 104 of the board card body is connected to the PIN of the welding pads 102 with a row of high-density ports far away from the outgoing line side 102 of the board card body;

the rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal.

In this embodiment, the row of high-density port pads closest to the outgoing side 102 on the board body 1 is the first row of high-density port pads, and so on, and the row of high-density port pads farthest from the outgoing side 102 on the board body is the nth row of high-density port pads;

the layer of the board card body 1, which is led out to the outgoing line side 102, is sequentially a first layer to an Nth layer from top to bottom;

the outgoing line 104 of the first layer of the board card body 1 is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, the outgoing line 104 of the Nth layer of the board card body 1 is connected to the PIN of the Nth row of high-density port welding pads.

The ground holes g are arranged on the same side of each row of high-density welding pads, and the distance from each row of ground holes to the central line of the PIN of each row of high-density welding pads is a set threshold value.

Each row of high-density port welding pads comprise a plurality of pairs of differential signal PIN105 of high-density ports;

and a ground hole G is arranged between the differential signals PIN of each adjacent pair of high-density ports in the same row.

The PIN of the high-density port welding pad and the outgoing line of the PIN of the high-density port welding pad on the layer of the board card body except the top layer form L-shaped units, no intersection point exists among the L-shaped units, and the outgoing line of the PIN of the high-density port welding pad on the top layer of the board card body and the L-shaped units do not have intersection points.

The PCB comprises a multi-layer board card body 1, wherein a plurality of rows of high-density port welding pads are arranged on the board card body 1, and a row of ground holes are formed between two adjacent rows of high-density port welding pads; the board card body comprises a plurality of layers 103 of board card body;

the outgoing line of the uppermost layer of the board card body 1 is connected to the PIN of a row of high-density port welding pads closest to the outgoing line side 102 of the board card body;

the lower outgoing line 104 of the board card body is connected to PIN of a row of high-density welding pads 102 far away from the outgoing line side 102 of the board card body;

actually, when the PIN of the high-density interface welding pad is in wiring, the upper layer outgoing line is connected with the PIN close to the outgoing line direction, so that the lower layer outgoing line is connected with the PIN close to the outgoing line direction.

The rows of high-density pads are equally divided into two areas, and the PINs of the rows of high-density pads in the same area are defined as the same signal. It should be noted that TX-TX or RX-RX are distributed closely, that is, one area is defined as TX and the other area is defined as RX, so that after back drilling, the high-speed traces do not generate crosstalk with the high-speed holes.

In this embodiment, the row of high-density port pads closest to the outgoing side 102 on the board body 1 is the first row of high-density port pads, and so on, and the row of high-density port pads farthest from the outgoing side 102 on the board body is the nth row of high-density port pads;

the layer of the board card body 1, which is led out to the outgoing line side 102, is sequentially a first layer to an Nth layer from top to bottom;

the outgoing line 104 of the first layer of the board card body 1 is connected to the PIN of the first row of high-density port welding pads;

and sequentially downwards, the outgoing line 104 of the Nth layer of the board card body 1 is connected to the PIN of the Nth row of high-density port welding pads.

The ground holes g are arranged on the same side of each row of high-density welding pads, and the distance from each row of ground holes to the central line of the PIN of each row of high-density welding pads is a set threshold value. In actual production, the distance between the added ground hole g and the high-density connector differential signal PIN105 is required to be confirmed by a PCB factory to meet the manufacturing requirement.

Each row of high-density port welding pads comprise a plurality of pairs of differential signal PIN105 of high-density ports;

and a ground hole G is arranged between the differential signals PIN of each adjacent pair of high-density ports in the same row.

The PIN of the high-density port welding pad and the outgoing line of the PIN of the high-density port welding pad on the layer of the board card body except the top layer form L-shaped units, no intersection point exists among the L-shaped units, and the outgoing line of the PIN of the high-density port welding pad on the top layer of the board card body and the L-shaped units do not have intersection points.

A high-density connector is arranged at the position of the high-density port welding pad on the board card body; a row of ground holes are formed between the PINs of the two adjacent rows of high-density connectors;

the outgoing line of the uppermost layer of the board card body 1 is connected to the PIN of a row of high-density connectors closest to the outgoing line side 102 of the board card body;

sequentially going downwards, leading out wires from the lower layer of the board card body 1, and connecting the wires to PIN of a row of high-density connectors far away from the wire outlet side of the board card body;

the PIN of the high-density connectors in the rows is divided into two areas in equal halves, and the PIN of the high-density connectors in the rows in the same area is defined as the same signal.

At the high-density connector PIN, a grounding hole g is additionally arranged between every two rows of PINs, so that crosstalk between front, back, left and right differential holes can be effectively avoided.

Another embodiment of the present invention further provides a method for implementing an optimized connector crosstalk PCB, including the following steps:

step 1: arranging a plurality of rows of high-density port welding pads on the board card body;

step 2: a ground hole is arranged between two adjacent rows of high-density opening welding pads;

and step 3: setting PIN for connecting the outgoing line of the uppermost layer of the board card body to a row of high-density port welding pads closest to the outgoing line side of the board card body; sequentially downwards, arranging PIN of a lower-layer outgoing line of the board card body connected to a row of high-density port welding pads far away from the outgoing line side of the board card body;

and 4, step 4: the pads of the high-density connectors are divided into two areas, and the PINs of the high-density pads in the same area are defined as the same signal.

Another embodiment of the present invention further provides a method for implementing an optimized connector crosstalk PCB, including the following steps:

step 1: arranging a plurality of rows of high-density port welding pads on the board card body;

step 2: a ground hole is arranged between two adjacent rows of high-density opening welding pads; it should be noted that the ground holes are arranged on the same side of each row of high-density pads, and the distance from each row of ground holes to the PIN center line of the row of high-density pads is a set threshold;

and step 3: setting PIN for connecting the outgoing line of the uppermost layer of the board card body to a row of high-density port welding pads closest to the outgoing line side of the board card body; the lower outgoing line of the board card body is connected to PIN of a row of high-density port welding pads far away from the outgoing line side of the board card body;

in the step, PIN is arranged, wherein the outgoing line of the uppermost layer of the board card body is connected to a row of high-density welding pads closest to the outgoing line side of the board card body; down in proper order, the step that the lower floor that sets up the integrated circuit board body is qualified for the next round of competitions and is connected to the pad of the one row of high density mouthful of the side of keeping away from integrated circuit board body outgoing line PIN specifically includes: defining a row of high-density port welding pads which are closest to the outgoing line side on the board card body as a first row of high-density port welding pads, and so on, and defining a row of high-density port welding pads which are farthest from the outgoing line side on the board card body as an Nth row of high-density port welding pads; defining the layer of the board card body, which is led out to the outgoing line side, as a first layer to an Nth layer from top to bottom in sequence; an outgoing line of a first layer of the board card body is connected to the PIN of the first row of high-density port welding pads; and sequentially downwards, an outgoing line of the Nth layer of the board card body is connected to the PIN of the Nth row of high-density port welding pads.

And 4, step 4: the pads of the high-density connectors are divided into two areas, and the PINs of the high-density pads in the same area are defined as the same signal. It should be noted that TX-TX or RX-RX are distributed closely, that is, one area is defined as TX and the other area is defined as RX, so that after back drilling, the high-speed traces do not generate crosstalk with the high-speed holes.

It should be noted that each row of high-density port welding pads includes a plurality of pairs of differential signal PINs of high-density ports; the method further comprises the following steps: and arranging a ground hole between the differential signal PIN of each adjacent pair of high-density ports in the same row. Arranging outgoing lines of the PIN of the high-density port welding pad and the PIN of the high-density port welding pad on layers of the board card body except the top layer to form L-shaped units, wherein no intersection point exists between the L-shaped units; the outgoing line of the PIN provided with the high-density port welding pad on the top layer of the board card body is not intersected with each L-shaped unit.

And a high-density connector is arranged at the position of the welding pad of the high-density port on the board card body. Thus, a row of ground holes are formed between the PINs of the two adjacent rows of high-density connectors; the outgoing line of the uppermost layer of the board card body is connected to the PIN of the row of high-density connectors closest to the outgoing line side of the board card body; sequentially going downwards, leading out wires from the lower layer of the board card body, and connecting the wires to PIN of a row of high-density connectors far away from the wire outlet side of the board card body; the PIN of the high-density connectors in the rows is divided into two areas in equal halves, and the PIN of the high-density connectors in the rows in the same area is defined as the same signal.

Aiming at the high-density connector, through reasonably distributing the distribution of TX/RX differential signal PIN, an upper layer outgoing line is connected with PIN close to the outgoing line direction, so that the upper layer outgoing line is connected with PIN close to the outgoing line direction, a lower layer outgoing line is connected with PIN close to the outgoing line direction, and TX-TX or RX-RX is distributed close to the outgoing line direction, so that after backdrilling, crosstalk between signal lines and via holes is avoided; meanwhile, the ground holes g are additionally arranged among PIN distribution of the high-density connector, so that the effect of crosstalk isolation can be effectively achieved, crosstalk between a PIN PIN and a welding pad of a high-speed differential signal is avoided, the signal integrity of a link is ensured, and signal failure caused by crosstalk is avoided; meanwhile, the routing space on the board card is reasonably utilized, and the cost waste caused by over-design is avoided; the method is simple, efficient and easy to implement, and meanwhile, the reliability of system design is improved.

Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.