阅读说明：本技术 凹槽掩模版的制作方法 (Manufacturing method of groove mask ) 是由 王栋 谢超 侯广杰 于 2021-08-12 设计创作，主要内容包括：本发明属于掩模版制造技术领域,尤其涉及一种凹槽掩模版的制作方法,包括：预备基板：预备透光基板,其中,透光基板具有图形板面；开槽加工：在所述图形板面上加工出圆环状的凹槽；镀铬涂胶：在所述图形板面以及所述凹槽的槽壁、槽底上先镀铬层,再涂光刻胶层；光刻处理：先曝光再显影,使所述铬层呈现出预设图形结构。本发明相对于现有技术,降低了加工凹槽对产品良率的影响,提高了产品良品率。(The invention belongs to the technical field of mask manufacturing, and particularly relates to a manufacturing method of a groove mask, which comprises the following steps: preparing a substrate: preparing a light-transmitting substrate, wherein the light-transmitting substrate is provided with a pattern plate surface; grooving: processing a circular groove on the pattern plate surface; chrome plating and glue coating: firstly plating chromium layers on the surface of the pattern plate and the groove walls and the groove bottoms of the grooves, and then coating a photoresist layer; photoetching treatment: exposing and developing to make the chromium layer present a preset pattern structure. Compared with the prior art, the invention reduces the influence of processing grooves on the yield of products and improves the yield of the products.)

1. A manufacturing method of a groove mask is characterized by comprising the following steps:

preparing a substrate: preparing a light-transmitting substrate, wherein the light-transmitting substrate is provided with a pattern plate surface;

grooving: processing a circular groove on the pattern plate surface;

chrome plating and glue coating: firstly plating a chromium layer on the surface of the pattern plate and the area corresponding to the groove, and then coating a photoresist layer;

photoetching treatment: exposing and developing to make the chromium layer present a preset pattern structure.

2. The method for manufacturing the groove mask according to claim 1, wherein in the photolithography process, at least two exposures are performed on a region corresponding to the groove.

3. The method for manufacturing the groove mask as claimed in claim 2, wherein in the photolithography process, the whole area of the pattern plate is exposed for the first time, and the area corresponding to the groove is exposed for the second time.

4. The method for manufacturing a groove mask according to claim 3, wherein the brightness intensity of the second exposure is greater than the brightness intensity of the first exposure.

5. The method for manufacturing the groove mask as claimed in claim 2, wherein in the photolithography treatment, the area corresponding to the groove is exposed for the first time, and then the whole area of the pattern plate is exposed for the second time.

6. The method for manufacturing a groove mask according to claim 5, wherein the brightness intensity of the first exposure is greater than the brightness intensity of the second exposure.

7. The method for manufacturing the groove mask as claimed in claim 1, wherein a photoresist protective layer is coated on the groove wall and the groove bottom of the groove after the grooving process and before the chrome plating glue coating.

8. The method for manufacturing the groove mask as claimed in claim 1, wherein a PE protective film is coated on the groove wall and the groove bottom of the groove after the grooving process and before the chrome plating and glue coating;

and tearing off the PE protective film after the photoetching treatment.

9. The manufacturing method of the groove mask as claimed in claim 1, wherein the transparent substrate is quadrilateral and has a first corner, a second corner, a third corner and a fourth corner, and further has a first plate edge connecting the first corner and the second corner, a second plate edge connecting the second corner and the third corner, a third plate edge connecting the third corner and the fourth corner, and a fourth plate edge connecting the fourth corner and the first corner;

the surface of the graphic board is provided with a first mark point, a second mark point, a third mark point and a fourth mark point, the first mark point is positioned between the first board edge and the groove, the second mark point is positioned between the second board edge and the groove, the third mark point is positioned between the third board edge and the groove, and the fourth mark point is positioned between the fourth board edge and the groove;

a connecting line between the first marking point and the fourth corner is a first connecting line, a connecting line between the second marking point and the first corner is a second connecting line, a connecting line between the third marking point and the second corner is a third connecting line, and a connecting line between the fourth marking point and the third corner is a fourth connecting line, wherein the first connecting line, the second connecting line, the third connecting line and the fourth connecting line are all tangent to the outer ring of the groove.

10. The method for manufacturing the groove mask as claimed in claim 1, further comprising, between the grooving process and the chrome plating paste:

grinding and polishing: and grinding and polishing the light-transmitting substrate.

Technical Field

The invention belongs to the technical field of mask manufacturing, and particularly relates to a manufacturing method of a groove mask.

Background

As shown in figures 1 and 2, the groove mask is a mask suitable for the taiko wafer process, and compared with a common mask, the pattern surface of the groove mask is provided with a circular groove, wherein the inner diameter of the groove is about 190mm, the outer diameter of the groove is about 210mm, and the depth of the groove is 0.75 mm.

As shown in fig. 3, the conventional manufacturing method of the groove mask at present is as follows:

preparing a substrate: preparing a light-transmitting substrate, wherein the light-transmitting substrate is provided with a pattern plate surface;

chrome plating and glue coating: firstly plating a chromium layer on the surface of the pattern plate, and then coating a photoresist layer;

photoetching treatment: exposing and developing to make the chromium layer present a preset pattern structure;

grooving: and processing a circular groove on the pattern plate surface.

The chip and pressure generated in the process of processing the groove can easily damage the preset pattern structure on the light-transmitting substrate, so that the yield of the product is very low.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a manufacturing method of a groove mask plate, which aims to solve the problem of low yield of the groove mask plate.

The invention is realized by the following steps:

a manufacturing method of a groove mask comprises the following steps:

preparing a substrate: preparing a light-transmitting substrate, wherein the light-transmitting substrate is provided with a pattern plate surface;

grooving: processing a circular groove on the pattern plate surface;

chrome plating and glue coating: firstly plating chromium layers on the surface of the pattern plate and the groove walls and the groove bottoms of the grooves, and then coating a photoresist layer;

photoetching treatment: exposing and developing to make the chromium layer present a preset pattern structure.

Optionally, in the photolithography process, the region corresponding to the groove is exposed at least twice.

Optionally, in the photolithography process, the entire area of the pattern board is exposed for the first time, and then the area corresponding to the groove is exposed for the second time.

Optionally, the intensity of the light of the second exposure is greater than the intensity of the light of the first exposure.

Optionally, in the photolithography process, first exposing a region corresponding to the groove, and then exposing the entire region of the pattern board for the second time.

Optionally, the intensity of the light of the first exposure is greater than the intensity of the light of the second exposure.

Optionally, after the grooving process and before the chrome plating glue coating, a photoresist protective layer is coated on the groove wall and the groove bottom of the groove.

Optionally, after the grooving process and before the chrome plating and glue coating, covering a PE protective film on the groove wall and the groove bottom of the groove;

and tearing off the PE protective film after the photoetching treatment.

Optionally, the light-transmitting substrate is a quadrilateral, and has a first corner, a second corner, a third corner and a fourth corner, and further has a first plate edge connecting the first corner and the second corner, a second plate edge connecting the second corner and the third corner, a third plate edge connecting the third corner and the fourth corner, and a fourth plate edge connecting the fourth corner and the first corner;

the surface of the graphic board is provided with a first mark point, a second mark point, a third mark point and a fourth mark point, the first mark point is positioned between the first board edge and the groove, the second mark point is positioned between the second board edge and the groove, the third mark point is positioned between the third board edge and the groove, and the fourth mark point is positioned between the fourth board edge and the groove;

a connecting line between the first marking point and the fourth corner is a first connecting line, a connecting line between the second marking point and the first corner is a second connecting line, a connecting line between the third marking point and the second corner is a third connecting line, a connecting line between the fourth marking point and the third corner is a fourth connecting line, and the first connecting line, the second connecting line, the third connecting line and the fourth connecting line are all tangent to the outer ring of the groove.

Optionally, between the grooving process and the chrome plating glue, further comprising:

grinding and polishing: and grinding and polishing the light-transmitting substrate.

According to the manufacturing method, the groove is machined firstly, and then the preset pattern structure is manufactured on the pattern plate surface, so that the chip and the pressure generated in the groove machining process cannot influence the preset pattern structure, the influence of the groove machining on the product yield is reduced compared with the prior art, and the product yield is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a side view of a groove mask as it undergoes a taiko wafer process;

FIG. 2 is a bottom view of a groove mask;

FIG. 3 is a schematic diagram of a manufacturing process of a prior art groove mask;

FIG. 4 is a schematic view of a manufacturing process of a groove mask of the present invention;

fig. 5 is a top view of a light-transmitting substrate of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner" and "outer" etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The embodiment of the invention provides a manufacturing method of a groove 110 mask.

Referring to fig. 4 and 5, the method for manufacturing the mask blank of the groove 110 includes:

preparing a substrate: a transparent substrate 100 is prepared, wherein the transparent substrate 100 has a pattern plate surface.

The transparent substrate 100 may be a resin substrate or a glass substrate, and the specific material and thickness may be selected according to actual requirements.

Grooving: an annular groove 110 is formed in the pattern plate.

This course of working adopts CNC to process usually, and the technique is comparatively ripe, and the yield is high.

Chrome plating and glue coating: the areas corresponding to the pattern plate surface and the groove 110 are first plated with chromium layer and then coated with photoresist layer.

Wherein, the groove wall and the groove bottom at the two sides of the groove 110 are uniform and provided with a chromium layer and photoresist.

It should be noted that the chrome layer can be formed by vacuum coating process, and the photoresist layer can be formed by spraying photoresist.

Photoetching treatment: exposing and developing to make the chromium layer present a preset pattern structure.

The position of the predetermined pattern structure in the region corresponding to the groove 110 is hollowed out, so that after the exposure and development are completed, the chromium layer and the photoresist on the groove walls at the two sides and the groove bottom of the groove 110 are removed, and the groove 110 is exposed.

Therefore, according to the manufacturing method of the present invention, since the groove 110 is first processed, and then the preset pattern structure is manufactured on the pattern plate surface, the chip and the pressure generated in the process of processing the groove 110 will not affect the preset pattern structure, and compared with the prior art, the influence of processing the groove 110 on the product yield is reduced, and the product yield is improved.

In the embodiment of the present invention, the two side walls of the groove 110 are in smooth transition with the surface of the pattern plate, and the two side walls of the groove 110 are also in smooth transition with the bottom of the groove.

In the present embodiment, the groove 110 is flared.

In the embodiment of the present invention, in the photolithography process, the region corresponding to the groove 110 is exposed at least twice.

It should be noted that, during the process of spraying and coating the photoresist to form the photoresist layer, the photoresist on the two side walls of the groove 110 may flow down to the bottom of the groove 110 under the action of gravity, so that the thickness of the photoresist layer on the bottom of the groove 110 is relatively thick, if the time and intensity of the exposure to the region corresponding to the groove 110 are the same as those of other regions, after the exposure for a certain time and with a certain intensity, the photoresist layer to be removed in other regions is removed, and the photoresist layer in a part of the region of the bottom of the groove 110 is left, so that the chromium layer in a part of the region is abnormally etched, that is, the chromium layer in a part of the region may remain in the groove 110, and due to the quality of the finished product of the mask, one of the commonly used judgment means is that the brightness of the whole light shadow of the preset pattern structure on the mask is observed, and the remaining chromium layer in the bottom of the groove 110 may affect the brightness of the whole light shadow of the preset pattern structure, thereby influencing the judgment of the quality of the finished product of the subsequent mask.

Based on the method of the present invention, the area corresponding to the groove 110 is exposed at least twice, thereby avoiding the chromium layer from remaining in the groove 110.

In one embodiment, in the photolithography process, the entire area of the pattern plate is exposed for one time, and the area corresponding to the groove 110 is exposed for a second time.

In this embodiment, the intensity of the light of the second exposure is larger than that of the light of the first exposure.

In another embodiment, in the photolithography process, the area corresponding to the groove 110 is exposed for the first time, and then the whole area of the pattern board is exposed for the second time.

In this embodiment, the intensity of light of the first exposure is larger than that of light of the second exposure.

In one embodiment, a protective layer of photoresist is applied to the walls and bottom of the groove 110 after the grooving process and before the chrome plating paste. After the photoetching treatment, a stripping treatment is carried out, namely unexposed photoresist is dissolved, wherein the chromium layer on the region corresponding to the groove 110 is plated on the photoresist protective layer, and the photoresist protective layer is dissolved in stripping liquid in the stripping treatment, so that the problems that the photoresist layer of the partial region of the groove bottom of the groove 110 is left, the chromium layer etching of the partial region is abnormal, and the quality of a finished product of the mask is influenced can not occur, therefore, only normal exposure is needed in the photoetching treatment process, and secondary exposure is not needed.

In another embodiment, after the grooving process and before the chrome plating and glue coating, the groove wall and the groove bottom of the groove 110 are covered with a PE protective film;

and after the photolithography process, the PE protective film is torn off. Therefore, the chromium layer on the area corresponding to the groove 110 is plated on the PE protective film, and the chromium layer on the area corresponding to the groove 110 is peeled off along with the tearing of the PE protective film, so that only normal exposure is needed in the photoetching process, and secondary exposure is not needed.

In one embodiment, as shown in FIG. 5, the light-transmissive substrate 100 is quadrilateral and has a first corner 1011, a second corner 1012, a third corner 1013, and a fourth corner 1014, and further has a first plate edge 1021 connecting the first corner 1011 and the second corner 1012, a second plate edge 1022 connecting the second corner 1012 and the third corner 1013, a third plate edge 1023 connecting the third corner 1013 and the fourth corner 1014, and a fourth plate edge 1024 connecting the fourth corner 1014 and the first corner 1011; the graphic panel surface is provided with a first indicia spot 1031, a second indicia spot 1032, a third indicia spot 1033 and a fourth indicia spot 1034, the first indicia spot 1031 being located between the first panel edge 1021 and the recess 110, the second indicia spot 1032 being located between the second panel edge 1022 and the recess 110, the third indicia spot 1033 being located between the third panel edge 1023 and the recess 110, the fourth indicia spot 1034 being located between the fourth panel edge 1024 and the recess 110; a connecting line between the first marked point 1031 and the fourth corner 1014 is a first connecting line 1041, a connecting line between the second marked point 1032 and the first corner 1011 is a second connecting line 1042, a connecting line between the third marked point 1033 and the second corner 1012 is a third connecting line 1043, and a connecting line between the fourth marked point 1034 and the third corner 1013 is a fourth connecting line 1044, wherein the first connecting line 1041, the second connecting line 1042, the third connecting line 1043 and the fourth connecting line 1044 are all tangent to the outer ring of the groove 110.

After the grooving process, whether the groove 110 is abnormal or not can be quickly judged by judging whether the first connecting line 1041, the second connecting line 1042, the third connecting line 1043 and the fourth connecting line 1044 are all tangent to the outer ring of the groove 110, in actual operation, a camera can be used for shooting, and then whether the first connecting line 1041, the second connecting line 1042, the third connecting line 1043 and the fourth connecting line 1044 are all tangent to the outer ring of the groove 110 or not can be judged by graphic analysis of a computer, the whole process does not need to be released, and the method is efficient and quick.

In addition, in the embodiment, one connecting line is obtained through one marking point and one corner, and two marking points are not needed to obtain one connecting line, so that the structural complexity is reduced, and the production and manufacturing cost is reduced.

In a specific implementation, the first marker 1031, the second marker 1032, the third marker 1033 and the fourth marker 1034 are all located outside the predetermined pattern structure, and the first marker 1031, the second marker 1032, the third marker 1033 and the fourth marker 1034 may be formed by forming a groove structure on the pattern plate, the groove structure may be generally in the shape of a circular groove with a diameter of 1 mm, wherein for the identification of the first marker 1031, the second marker 1032, the third marker 1033 and the fourth marker 1034, a camera may be used to take a photograph, and since the light shadow of the position where the groove structure is formed may be different from the surrounding, the first marker 1031, the second marker 1034, the third marker 1033 and the fourth marker 1034 may be obtained by the pattern analysis of the computer.

In another embodiment, after the grooving process, the stress balance of the transparent substrate 100 may be broken, and deformation such as warpage may occur, in which case, even if the chrome plating paste and the photolithography process are performed, an acceptable product may not be obtained.

Therefore, the method also comprises the following steps between the grooving process and the chromium plating glue coating:

grinding and polishing: the light-transmitting substrate 100 is polished flat.

By the grinding and polishing, deformation of the transparent substrate 100 can be eliminated, and the yield of the product can be further improved.

The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.