阅读说明：本技术 Ibc电池组件的叉指状导电背板和ibc电池组件 (Interdigital conductive backboard of IBC battery pack and IBC battery pack ) 是由 黄兴 陈刚 于 2021-07-06 设计创作，主要内容包括：本申请适用于太阳能电池技术领域,提供了一种IBC电池组件的叉指状导电背板和IBC电池组件。IBC电池组件的叉指状导电背板,包括多个叉指导电片,每个叉指导电片均包括传输部和自传输部向外延伸的多个串联部,传输部用于传输电流,串联部用于串联多个IBC电池；叉指导电片包括第一片、第二片和第三片,第一片的串联部的延伸方向均为第一方向,第二片的串联部的延伸方向均为第二方向,第三片位于第一片和第二片之间,第三片的部分串联部的延伸方向为第一方向,第三片的其余串联部的延伸方向为第二方向,第一方向与第二方向相反。如此,可以高效率地导出电流,有效解决IBC电池的封装问题。(The application is suitable for the technical field of solar cells, and provides an interdigital conductive back plate of an IBC cell module and the IBC cell module. The interdigital conductive back plate of the IBC battery component comprises a plurality of interdigital conductive plates, each interdigital conductive plate comprises a transmission part and a plurality of series parts extending outwards from the transmission part, the transmission part is used for transmitting current, and the series parts are used for connecting a plurality of IBC batteries in series; the interdigital conducting strip comprises a first strip, a second strip and a third strip, wherein the extension direction of the serial part of the first strip is the first direction, the extension direction of the serial part of the second strip is the second direction, the third strip is positioned between the first strip and the second strip, the extension direction of part of the serial part of the third strip is the first direction, the extension direction of the rest serial parts of the third strip is the second direction, and the first direction is opposite to the second direction. Therefore, the current can be efficiently led out, and the packaging problem of the IBC battery is effectively solved.)

1. An interdigital conductive back plate of an IBC battery component is characterized by comprising a plurality of interdigital conductive plates, wherein each interdigital conductive plate comprises a transmission part and a plurality of series connection parts extending outwards from the transmission part, the transmission part is used for transmitting current, and the series connection parts are used for connecting a plurality of IBC batteries in series;

the interdigital conducting strip comprises a first piece, a second piece and a third piece, the extension direction of the series connection part of the first piece is the first direction, the extension direction of the series connection part of the second piece is the second direction, the third piece is located between the first piece and the second piece, the extension direction of the partial series connection part of the third piece is the first direction, the extension direction of the rest series connection parts of the third piece is the second direction, and the first direction is opposite to the second direction.

2. The interdigitated conductive backplate of an IBC cell assembly of claim 1, wherein the series connection comprises a buffer layer, a first insulating layer, and a first conductive layer disposed between the buffer layer and the first insulating layer, the first conductive layer for electrically connecting the main grid of the IBC cell.

3. The interdigitated conductive backplate of an IBC cell assembly of claim 2, wherein the series connection comprises a pad connecting the first conductive layer, the buffer layer being formed with a via from which the pad is exposed to electrically connect the main gates of the IBC cells.

4. The interdigitated conductive backplate of an IBC cell assembly according to claim 3, wherein the bonding pads are electrically connected to the main grid of the IBC cell by solder paste and/or conductive glue.

5. The interdigitated conductive backplate of an IBC cell assembly according to claim 3, wherein the bonding pads are circular and have a diameter equal to the largest dimension of the solder joint of the primary grid.

6. The interdigitated conductive backplate of an IBC cell assembly of claim 2, wherein a first glue layer is disposed between the buffer layer and the first conductive layer and a second glue layer is disposed between the first insulating layer and the first conductive layer.

7. The interdigital conductive backplate of an IBC battery assembly according to claim 2, wherein the first conductive layer comprises a flat surface contacting the buffer layer and an arcuate surface connected to the flat surface, the arcuate surface contacting the first insulating layer, the arcuate surface being configured to reflect back light incident from the back surface of the IBC battery assembly such that the back light is reflected by the arcuate surface and then incident on the non-grid line region of the back surface of the IBC battery.

8. The interdigitated conductive backplate of an IBC cell assembly of claim 1, wherein the transmission portion comprises a second insulating layer and a second conductive layer in conductive communication with the series portion and insulated from the IBC cell.

9. The interdigitated conductive backplate of an IBC cell assembly of claim 1, wherein the transmission portions of the first sheet are formed with diode bond sites for adjacent cell strings, adjacent transmission portions being disconnected at the diode bond sites.

10. An IBC cell assembly comprising an IBC cell and the interdigitated conductive back plate of any one of claims 1 to 9.

Technical Field

The application belongs to the technical field of solar cells, and particularly relates to an interdigital conductive back plate of an IBC cell module and the IBC cell module.

Background

In the related art, an Interdigital Back Contact (IBC) battery has no grid line on the front surface, and the efficiency is much higher than that of a conventional PERC battery, so that the IBC battery is a future technical development direction. The packaging technology and materials of the conventional PERC component cannot meet the packaging requirements of the IBC battery. Based on this, how to package the IBC battery becomes an urgent problem to be solved.

Disclosure of Invention

The application provides an interdigital conductive backboard of an IBC battery pack and the IBC battery pack, and aims to solve the problem of how to package an IBC battery.

In a first aspect, the present application provides an interdigital conductive backplane of an IBC battery assembly, including a plurality of interdigital conductive pads, each of which includes a transmission portion and a plurality of series portions extending outward from the transmission portion, where the transmission portion is configured to transmit a current, and the series portions are configured to connect a plurality of IBC batteries in series;

the interdigital conducting strip comprises a first piece, a second piece and a third piece, the extension direction of the series connection part of the first piece is the first direction, the extension direction of the series connection part of the second piece is the second direction, the third piece is located between the first piece and the second piece, the extension direction of the partial series connection part of the third piece is the first direction, the extension direction of the rest series connection parts of the third piece is the second direction, and the first direction is opposite to the second direction.

Optionally, the series connection portion includes a buffer layer, a first insulating layer, and a first conductive layer, the first conductive layer is disposed between the buffer layer and the first insulating layer, and the first conductive layer is used for electrically connecting the main grid of the IBC cell.

Optionally, the series connection portion includes a pad connected to the first conductive layer, the buffer layer is formed with a through hole, and the pad is exposed from the through hole to electrically connect the main gate of the IBC cell.

Optionally, the bonding pad is electrically connected to the main grid of the IBC cell through solder paste and/or conductive adhesive.

Optionally, the pad is circular, and the diameter of the pad is equal to the maximum size of the welding point of the main grid.

Optionally, a first adhesive layer is disposed between the buffer layer and the first conductive layer, and a second adhesive layer is disposed between the first insulating layer and the first conductive layer.

Optionally, the first conductive layer includes a plane and an arc surface connected to the plane, the plane contacts the buffer layer, the arc surface contacts the first insulating layer, and the arc surface is configured to reflect back light incident from a back surface of the IBC battery assembly, so that the back light is reflected by the arc surface and then incident on the non-gate line region on the back surface of the IBC battery.

Optionally, the transmission part includes a second insulating layer and a second conductive layer, the second conductive layer being conductive to the series part and insulated from the IBC cell.

Optionally, the transmission portion of the first sheet is formed with a diode bonding position of adjacent battery strings, and the adjacent transmission portion is disconnected at the diode bonding position.

In a second aspect, the present application provides an IBC cell assembly comprising an IBC cell and an interdigitated conductive backplane of any one of the above.

In the interdigital conductive back plate of the IBC battery component and the IBC battery component, the current can be efficiently led out by connecting the plurality of IBC batteries in series through the interdigital conductive plates with three different forms, and the packaging problem of the IBC batteries is effectively solved. And moreover, the conductive back plate is flexible, and can be compatible with various IBC batteries and various component models.

Drawings

Fig. 1 is a schematic structural diagram of an IBC cell assembly according to an embodiment of the present application;

FIG. 2 is a schematic structural diagram of an interdigitated conductive backplane according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of an interdigitated conductive backplane according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of an IBC battery pack in accordance with an embodiment of the present application;

FIG. 5 is a schematic structural view of a series portion of an interdigitated conductive backplane according to an embodiment of the present application;

FIG. 6 is a schematic structural view of a series portion of an interdigitated conductive backplane according to an embodiment of the present application;

FIG. 7 is a schematic structural view of a series portion of an interdigitated conductive backplane according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of the first conductive layer of the series portion of the interdigitated conductive back plate according to an embodiment of the present application.

Description of the main element symbols:

IBC cell assembly 100, IBC cell 20, interdigitated conductive backplane 10, transmission 101, series 102, buffer layer 1021, first glue layer 1022, first conductive layer 1023, plane 1027, arc face 1028, second glue layer 1024, first insulating layer 1025, bonding pad 1026, first sheet 11, transmission 111 of the first sheet, series 112 of the first sheet, diode soldering location 113, second sheet 12, transmission 121 of the second sheet, series 122 of the second sheet, third sheet 13, transmission 131 of the third sheet, series 132 of the third sheet.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1, an IBC cell assembly 100 according to an embodiment of the present application includes an IBC cell 20 and an interdigitated conductive backplane 10.

Referring to fig. 2 and 3, an interdigital conductive backplane 10 of an IBC battery assembly 100 provided in an embodiment of the present application includes a plurality of interdigital conductive sheets, each of which includes a transmission portion 101 and a plurality of series portions 102 extending outward from the transmission portion 101, where the transmission portion 101 is used for transmitting current, and the series portions 102 are used for connecting a plurality of IBC batteries 20 in series;

the interdigital conductive sheet comprises a first sheet 11, a second sheet 12 and a third sheet 13, wherein the extension directions of the serial parts 102(112) of the first sheet 11 are all the first direction, the extension directions of the serial parts 102(122) of the second sheet 12 are all the second direction, the third sheet 13 is positioned between the first sheet 11 and the second sheet 12, the extension direction of part of the serial parts 102(132) of the third sheet 13 is the first direction, the extension directions of the rest serial parts 102(132) of the third sheet 13 are the second direction, and the first direction is opposite to the second direction.

The interdigital conductive back plate 10 of the IBC battery assembly 100 according to the embodiment of the present application can efficiently conduct current by connecting a plurality of IBC batteries 20 in series through three types of interdigital conductive plates with different shapes, thereby effectively solving the problem of packaging the IBC batteries 20. And the conductive back plate is flexible and can be compatible with various IBC batteries 20 and various component models.

It is understood that, due to the series connection part 102(132) of the third sheet 13, the transmission part 101(131) of the third sheet 13 extends to both sides of the transmission part 101(131), so that the third sheet 13 can conduct 2 IBC cells 20 adjacent in the first direction (or the second direction), so that one column of IBC cells 20 forms a cell string.

Note that the first tab 11, the second tab 12, and the third tab 13 are three types of interdigital conductive tabs, each including a transmission portion 101 and a plurality of series portions 102 extending outward from the transmission portion 101, but the extending directions of the series portions 102 are different. For the sake of convenience of distinction, in fig. 2 and 3, the transfer portion of the first sheet 11 is referred to as a transfer portion 101(111) or a transfer portion 111; the transfer portion of the second sheet 12 is referred to as a transfer portion 101(121) or a transfer portion 121; the transfer portion of the third sheet 13 is referred to as transfer portion 101(131) or transfer portion 131. In explaining and explaining the commonality of the transmission portions of the interdigital conductive sheets, the transmission portions 101 are employed; in explaining and explaining the commonality of the series portion of the interdigital conductive sheets, the series portion 102 is employed.

Referring to fig. 1, in the IBC battery assembly 100 of the present embodiment, a plurality of IBC cells 20 are arranged in 10 rows and 6 columns. The 2 IBC cells 20 adjacent in the first direction (or the second direction) are electrically connected through 1 interdigital conductive pad. Each IBC cell 20 is in electrical communication with 4 series sections 102, wherein 2 series sections 102 are from one interdigitated conductive sheet and the remaining 2 series sections 102 are from another interdigitated conductive sheet.

Note that, in order to make the illustration clear and save the drawing, a part of the structure is omitted in fig. 1 using a cross-sectional line, and the omitted structure may refer to the illustrated structure.

In the present embodiment, the first sheet 11 and the IBC cells 20 in the first row are electrically connected in a one-to-one correspondence. The second plate 12 is electrically connected to the IBC cells 20 in the last row in a one-to-one correspondence. The third plate 13 is electrically connected to all IBC cells 20 in the IBC cell assembly 100.

It can be understood that, since the first sheet 11 corresponds to the IBC cells 20 in the first row one by one, the second sheet 12 corresponds to the IBC cells 20 in the last row one by one, and the third sheet 13 corresponds to two adjacent IBC cells 20, the configuration of various battery packs can be realized by adjusting the positions and the on/off states of the first sheet 11, the second sheet 12, and the third sheet 13, so that various IBC cells 20 and various module types can be compatible.

In the present embodiment, each column of IBC cells 20 forms a cell string, and two adjacent columns of IBC cells 20 form a cell group, each cell group corresponding to 1 diode bonding location 113. Specifically, the first column of IBC cells 20 and the second column of IBC cells 20 form a first set of cell strings; the third column of IBC cells 20 and the fourth column of IBC cells 20 form a second set of cell strings; the fourth column of IBC cells 20 and the fifth column of IBC cells 20 form a third set of cell strings.

Further, diode bonding locations 113 are formed between the IBC cells 20 in the first row and the first column and the corresponding first tabs 11 of the IBC cells 20 in the first row and the second column. A gap is formed between the IBC cell 20 located in the second column of the last row and the corresponding second sheet 12 of the IBC cell 20 located in the third column of the last row. Diode bonding locations 113 are formed between the IBC cells 20 in the first row and third column and the corresponding first tabs 11 of the IBC cells 20 in the first row and fourth column. A gap is formed between the IBC cell 20 in the fourth column of the last row and the corresponding second sheet 12 of the IBC cell 20 in the fifth column of the last row. Diode bonding locations 113 are formed between the IBC cells 20 in the fifth row and column and the corresponding first tabs 11 of the IBC cells 20 in the sixth row and column. The adjacent first tab 11 is conductive. In this way, the current of the battery pack is drawn through the diode soldering point 113.

In the present embodiment, the adjacent battery packs are conducted through the interdigital conductive sheets, so that all the IBC cells 20 of the IBC cell assembly 100 are connected in series.

It is understood that in other embodiments, multiple battery packs may be insulated from each other by the interdigitated conductive sheets, such that one battery pack includes 1, 3, 4, 5, 6, or other number of IBC cells 20. The plurality of groups of battery packs may include the same or different numbers of strings of IBC cells 20.

Referring to fig. 4, for example, diode bonding locations 113 are formed between the IBC cells 20 in the first row and the first column and the corresponding first tabs 11 of the IBC cells 20 in the first row and the second column. A gap is formed between the IBC cells 20 in the second column of the first row and the corresponding first sheet 11 of the IBC cells 20 in the third column of the first row. A gap is formed between the IBC cell 20 located in the second column of the last row and the corresponding second sheet 12 of the IBC cell 20 located in the third column of the last row. Diode bonding locations 113 are formed between the IBC cells 20 in the first row and third column and the corresponding first tabs 11 of the IBC cells 20 in the first row and fourth column. A gap is formed between the IBC cell 20 in the fourth column of the first row and the first sheet 11 corresponding to the IBC cell 20 in the fifth column of the first row. A gap is formed between the IBC cell 20 in the fourth column of the last row and the corresponding second sheet 12 of the IBC cell 20 in the fifth column of the last row. Diode bonding locations 113 are formed between the IBC cells 20 in the fifth row and column and the corresponding first tabs 11 of the IBC cells 20 in the sixth row and column. In this way, the current of the battery pack is led out through the diode welding position 113, and the three battery packs are mutually insulated through the on-off of the interdigital conducting strips.

Similarly, the columns 1-3 IBC cells 20 in FIG. 4 can be connected in series to form one cell group, and the columns 4-6 IBC cells 20 form another cell group by switching the interdigital conductive sheets, and a gap is formed between the two cell groups. Similarly, the columns 1-4 IBC cells 20 in FIG. 4 can be connected in series to form one cell group, the columns 5-6 IBC cells 20 form another cell group, and a gap is formed between the two cell groups by switching the interdigital conductive sheets. The specific explanation and description is similar to the explanation and description corresponding to fig. 4, and reference is made to the foregoing.

The specific structure of the IBC cell assembly 100 is not limited herein.

In this way, by adjusting the positions and the on-off states of the first sheet 11, the second sheet 12 and the third sheet 13, the structure of various battery packs is realized, and various IBC batteries 20 and various component models are compatible.

Referring to fig. 2 and 3, in the present embodiment, the serial portion 112 of the first slice 11 and the serial portion 132 of the third slice 13 are interlaced, and the serial portion 132 of the third slice 13 and the serial portion 122 of the second slice 12 are interlaced. Note that, due to the limitation of the drawings, and for convenience of explanation, fig. 2 and 3 show only parts of the first sheet 11, the second sheet 12, and the third sheet, and the other third sheet 13 between the first sheet 11 and the second sheet 12 is omitted.

Referring to fig. 3, IBC cells 20b and 20d are connected in series through the transmission part 121a and the transmission part 121b of the second sheet 12, thereby connecting adjacent two columns of IBC cells 20 in series. A gap is formed between the transmitting portion 131a and the transmitting portion 131b of the third sheet 13. The diode welding positions 113 of adjacent cell strings are formed between the transmission parts 111a and 111b of the first sheet 11, and the current of the battery pack is drawn out, so that two adjacent columns of IBC cells 20 form one battery pack.

Specifically, the series portion 112a of the first tab 11 electrically connects the positive main gates of the IBC cells 20 a. The series portion 132a of the third tab 13 electrically connects the negative main grid of the IBC cell 20 a. The series portion 112a of the first chip 11 transmits a current to the transmission portion 111a of the first chip 11. The series portion 132a of the third sheet 13 is electrically connected to the series portion 132c through the transmission portion 131 a. The series portion 132c of the third tab 13 is connected to the positive main gate of the IBC cell 20 b. In this way, the series portions 132a and 132c of the third sheet 13 connect the electrodes of the IBC cells 20a and 20b adjacent to each other, which have opposite polarities, to form a series circuit. The series portion 122a of the second sheet 12 is connected to the negative main grid of the IBC cell 20 b.

For the IBC cell 20a, from left to right in fig. 3, the series portion 112a of the first tab 11 is electrically connected to the positive main grid, the series portion 132a of the third tab 13 is electrically connected to the negative main grid, the series portion 112b of the first tab 11 is electrically connected to the positive main grid, and the series portion 132b of the third tab 13 is electrically connected to the negative main grid.

For the IBC cell 20b, from left to right in fig. 3, the series portion 132c of the third sheet 13 is electrically connected to the positive main grid, the series portion 122a of the second sheet 12 is electrically connected to the negative main grid, the series portion 132d of the third sheet 13 is electrically connected to the positive main grid, and the series portion 122b of the second sheet 12 is electrically connected to the negative main grid.

For the first tab 11, the series portions 112a and 112b, which extend in the first direction, are each connected to the positive main gate of the IBC cell 20 a. In other words, the series portion 112 of each first tab 11 connects the main gates of the IBC cells 20 of the same polarity.

For the third sheet 13, the series portions 132a and 132b extending in the second direction are connected to the negative main grid of the IBC cell 20a, and the series portions 132c and 132d extending in the first direction are connected to the positive main grid of the IBC cell 20 b. In other words, the series portion 132 of one side of the third plate 13 is connected to the positive main grid of the IBC cell 20, and the series portion 132 of the other side of the third plate 13 is connected to the negative main grid of the IBC cell 20.

For the second sheet 12, the series portions 132a and 132b, which extend in the second direction, are each connected to the negative main grid of the IBC cell 20 a. In other words, the series portion 122 of each second sheet 12 connects the main gates of the IBC cells 20 of the same polarity.

Referring to fig. 1 and fig. 3, alternatively, the transmission portion 101 of the interdigital conductive sheet is insulated from the IBC cell 20, the transmission portion 101 of the interdigital conductive sheet is electrically connected to the series portion 102, and the series portion 102 of the IBC cell 20 is electrically connected to the IBC cell 20. Specifically, a space is formed between the transmission part 101 and the IBC cell 20. Thus, the transmission part 101 is insulated from the IBC cell 20 by the space, which is low in cost and convenient for design.

Alternatively, the interdigitated conductive back plate 10 may be transparent. Specifically, the light transmittance of the interdigital conductive back plate 10 is greater than 70%. Thus, light can penetrate through the back surface of the IBC cell 20 which is not completely shielded by the interdigital conducting strip, so that the IBC cell 20 can generate electricity on two sides, and the photoelectric conversion efficiency of the IBC cell 20 is improved.

Referring to fig. 5, optionally, the serial connection portion 102 includes a buffer layer 1021, a first insulating layer 1025 and a first conductive layer 1023, the first conductive layer 1023 is disposed between the buffer layer 1021 and the first insulating layer 1025, and the first conductive layer 1023 is used for electrically connecting the main grid of the IBC cell 20.

In this way, when the series part 102 is connected to the IBC cell 20, the buffer layer 1021 can reduce the impact, thereby preventing the IBC cell 20 from being damaged. Also, the first insulating layer 1025 may isolate the first conductive layer 1023 from the outside, and prevent the first conductive layer 1023 from being conducted with an external object after the series connection portion 102 is connected to the IBC cell 20, thereby preventing adverse effects on the components.

In the present embodiment, the buffer layer 1021 includes polyethylene foam (EPE), i.e., pearl wool. Therefore, the buffer layer 1021 can be waterproof, damp-proof, shockproof and anti-collision.

In the present embodiment, the first conductive layer 1023 includes a copper foil. Thus, the first conductive layer 1023 has high conductivity and low cost.

In the present embodiment, first insulating layer 1025 comprises a thermoplastic Polyester (PET). Therefore, the first insulating layer 1025 is impact-resistant and corrosion-resistant, and the reliability of the assembly is guaranteed. And moreover, the PET has high transparency, so that light rays are shielded by the PET as little as possible, and the photoelectric conversion efficiency is improved.

Optionally, the series part 102 includes a pad 1026 connected to the first conductive layer 1023, and the buffer layer 1021 is formed with a through hole, from which the pad 1026 is exposed to electrically connect the main gate of the IBC cell 20.

In this way, the buffer layer 1021 is prevented from blocking the electrical connection of the first conductive layer 1023 and the IBC cell 20. Furthermore, the main grid of the IBC cell 20 may have a solder point formed thereon corresponding to the solder pad 1026, so that when the first conductive layer 1023 and the main grid of the IBC cell 20 are connected, the solder pad 1026 and the solder point can be used for positioning, which is beneficial to improving the accuracy and the production efficiency of soldering.

In the present embodiment, the number of pads 1026 of each series portion 102 is the same. Therefore, the interdigital conducting strip is convenient to manufacture. Specifically, the number of the pads 1026 of each series portion 102 is 3. It is understood that in other embodiments, the number of pads 1026 of each series portion 102 may be 2, 4, 5, or other numbers.

It is understood that the number of pads 1026 of the plurality of series sections 102 may be different in other embodiments. For example, the number of pads 1026 of each series portion 112 of the first sheet 11, the number of pads 1026 of each series portion 122 of the second sheet 12, and the number of pads 1026 of each series portion 132 of the third sheet 13 are different. For another example, the number of pads 1026 of the plurality of series portions 112 of the first sheet 11 is different, the number of pads 1026 of the plurality of series portions 122 of the second sheet 12 is different, and the number of pads 1026 of the plurality of series portions 132 of the third sheet 13 is different.

Optionally, the bonding pads 1026 are electrically connected to the main grid of the IBC cell 20 by solder paste and/or conductive glue.

Therefore, the interdigital conducting strip is conducted with the IBC battery 20, so that the thermal stress can be reduced, the thin IBC battery can be compatible, the risks of hidden cracking and fragment breaking are reduced, the difficulty of the production process can be greatly reduced, and the fragment loss rate is reduced.

For example, the bonding pad 1026 is electrically connected to the main gate of the IBC cell 20 by solder paste; for another example, the bonding pad 1026 is electrically connected to the main gate of the IBC cell 20 by a conductive adhesive; for another example, the bonding pad 1026 is electrically connected to the main gate of the IBC cell 20 by solder paste and conductive paste.

Optionally, a first glue layer 1022 is disposed between the buffer layer 1021 and the first conductive layer 1023, and a second glue layer 1024 is disposed between the first insulating layer 1025 and the first conductive layer 1023. As such, the buffer layer 1021, the first conductive layer 1023, and the first insulating layer 1025 may be fixed.

Specifically, the first glue layer 1022 and the second glue layer 1024 may be formed by curing UV glue, silicone glue, or other types of glue. Under the condition of adopting UV glue, can shine UV glue so that UV glue solidifies to the glue film through the ultraviolet ray for the solidification of glue film is comparatively convenient and rapid, is favorable to improving production efficiency. By adopting the silicone adhesive, the adhesive layer has strong adhesive force, good moisture resistance and strong adaptability to temperature change, and is favorable for improving the reliability of the interdigital conductive backboard 10.

Referring to fig. 6 and 7, optionally, the pad 1026 has a circular shape, and the diameter of the pad 1026 is equal to the maximum size of the pad of the main gate. Therefore, the contact area between the bonding pad 1026 and the welding point can be maximized, the contact resistance can be reduced, meanwhile, the tolerance of the offset between the bonding pad 1026 and the welding point caused by the offset of the IBC battery 20 can be improved, and the poor welding proportion caused by the offset can be reduced.

Note that "the maximum size of the welding point" refers to the distance between two points that are farthest apart in the boundary line of the welding point, i.e., the length of the longest line segment connecting the two points in the boundary line of the welding point. For example, the boundary line of the welding point is rectangular, and the maximum size is the length of the diagonal line of the rectangle; for another example, the boundary line of the welding point is circular, and the maximum size is the length of the diameter of the circle; for another example, the boundary line of the weld is elliptical, with the maximum dimension being the length of the major axis of the ellipse.

Specifically, the centers of the plurality of pads 1026 are arranged in order along the extending direction of the serial connection portion 102. Therefore, the arrangement of the bonding pads 1026 is standard, the bonding pads are convenient to be connected with the main grid, and the production efficiency is improved.

In other embodiments, the pads 1026 may be oval, rectangular, square, racetrack, triangular, or other shapes. The specific shape of the pad 1026 is not limited herein.

Referring to fig. 8, optionally, the first conductive layer 1023 includes a plane 1027 and an arc face 1028 connected to the plane 1027, the plane 1027 contacts the buffer layer 1021, the arc face 1028 contacts the first insulating layer 1025, and the arc face 1028 is used for reflecting back light incident from the back of the IBC battery assembly 100, so that the back light is reflected by the arc face 1028 and then incident to a non-grid line region of the IBC battery 20.

In other words, the first conductive layer 1023 has a semi-cylindrical shape.

Thus, the cross-sectional area of the first conductive layer 1023 can be increased, and the transfer resistance can be reduced. Moreover, in the case of the same cross-sectional area, the increased thickness can reduce the width of the first conductive layer 1023, thereby reducing the shading of the IBC cell 20 and increasing the light receiving area. In addition, the arc surface 1028 reflects the back light, and the back light is reflected by the arc surface 1028 and then enters the non-grid line region of the IBC battery 20 for reuse, which is beneficial to improving the photoelectric conversion efficiency of the IBC battery assembly 100.

Note that the backside refers to the side of the interdigitated conductive strips facing away from the IBC cell 20. Back light refers to light incident from the back of the IBC cell assembly 100, i.e., from the side of the interdigitated conductive sheets facing away from the IBC cell 20. Shown in fig. 1 is the back side of an IBC cell assembly 100.

Optionally, the transmission part 101 includes a second insulating layer and a second conductive layer, which is conductive to the series part 102 and insulated from the IBC cell 20.

In this way, the second insulating layer may isolate the second conductive layer from the outside, and after the series portion 102 is connected to the IBC cell 20, the second conductive layer is prevented from being conducted with an external object, so as to avoid adverse effects on the components.

In this embodiment, the second insulating layer is provided on a side of the second conductive layer facing away from the IBC cell 20. A space is formed between the transmission part 101 and the IBC cell 20. Thus, the transmission part 101 is insulated from the IBC cell 20 by the space, which is low in cost and convenient for design.

It is understood that in other embodiments, a second conductive layer may also be disposed between two second insulating layers. In this way, the second conductive layer is isolated from the outside by one second insulating layer, which is insulated from the IBC cell 20 by another second insulating layer.

Similarly, in this embodiment, the second conductive layer may include a plane and an arc surface connected to the plane, the plane contacts the second insulating layer, the arc surface faces away from the second insulating layer, the arc surface is used to reflect front light incident from the glass plate on the front side of the IBC battery assembly 100, the front light reflected by the arc surface is incident on the inner side surface of the glass plate, and the inner side surface is reflected again, so that the front light is incident on the front side of the IBC battery 20. .

In other words, the second conductive layer has a semi-cylindrical shape.

Therefore, the cross-sectional area of the second conductive layer can be increased, and the transmission resistance can be reduced. Moreover, the arc-shaped surface reflects the incident front light, and the incident front light is secondarily reflected to the front of the IBC cell 20 through the inner side surface of the glass plate for reuse, which is beneficial to improving the photoelectric conversion efficiency of the IBC cell assembly 100.

Note that the front side refers to the side of the IBC cell 20 facing away from the interdigitated conductive sheets. Front light refers to light incident from the front of the IBC cell assembly 100, i.e., from the side of the IBC cell 20 facing away from the interdigitated conductive sheets.

It can be understood that, in the present embodiment, the orthographic projection of the transmission part 101 on the plane where the IBC cell 20 is located outside the IBC cell 20. Therefore, a part of the light incident from the front surface of the IBC cell assembly 100 is not blocked by the IBC cell 20 and is incident on the transmission part 101. The second conductive layer is semi-cylindrical, so that light rays which are not shielded are incident to the arc-shaped surface and are reflected to the inner side surface of the glass plate by the arc-shaped surface, and the light rays are secondarily reflected to the front surface of the IBC battery 20 by the inner side surface to be reused.

Alternatively, the transmission portions 101 of the first sheet 11 are formed with diode-bonding positions 113 of adjacent battery strings, and the adjacent transmission portions 101 are disconnected at the diode-bonding positions 113. In this way, the current of the battery pack is drawn through the diode soldering point 113. Specifically, both the second insulating layer and the second conductive layer of the transmission portion 101 may be disconnected, or only the second conduction of the transmission portion 101 may be disconnected. In particular, the break of the diode bond site 113 may be S-shaped. Anti-counterfeiting marks can be added at the diode soldering positions 113.

In summary, the IBC battery assembly 100 and the interdigital conductive backplane 10 provided in the embodiment of the present application effectively solve the problem of packaging the IBC battery 20, and the interdigital conductive backplane 10 can be compatible with a plurality of IBC batteries with a main grid and a positive and negative electrode crossing interval through three types of interdigital conductive sheets. Moreover, the interdigitated conductive backplane 10 is compatible with different cell number module formats, such as 60, 66, 72, 78, etc., for example, full, two, three, four, etc.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.