阅读说明：本技术 基于介电泳组装原理的大面积电子电路制造技术 (Technology for manufacturing large-area electronic circuit based on dielectrophoresis assembly principle ) 是由 丁海涛 刘潇锋 杨强 司糈昊 于 2021-07-26 设计创作，主要内容包括：基于介电泳理论和交流电动流体力学理论,利用交流电场下介电泳对金属纳米粒子悬浮液的作用,对导电岛微电极阵列进行组装。由于导电岛的存在,空间电场的分布发生改变,局域电场强度增大并且电场梯度提高。在纳米粒子的介电组装的过程中,因为存在交流电渗流及交流电热流等电动力学现象,所以能够通过驱动液体运动实现粒子运动而对粒子链的形成产生作用,从而实现了对导电岛微电机阵列进行组装。本发明解决了传统纳米制造技术的低效率、高成本等问题,能够简易的实现对导电岛微电极阵列的组装。(Based on the dielectrophoresis theory and the alternating-current electrohydrodynamic theory, the conducting island microelectrode array is assembled by utilizing the action of dielectrophoresis on the metal nanoparticle suspension liquid under the alternating-current electric field. Due to the presence of the conductive islands, the distribution of the spatial electric field changes, the local electric field strength increases and the electric field gradient increases. In the process of dielectric assembly of the nano particles, as alternating current electroosmosis, alternating current heat flow and other electro-dynamic phenomena exist, particle motion can be realized by driving liquid motion to act on the formation of particle chains, and therefore the assembly of the conductive island micro-motor array is realized. The invention solves the problems of low efficiency, high cost and the like of the traditional nano manufacturing technology, and can simply realize the assembly of the microelectrode array of the conductive island.)

1. The method for manufacturing the conducting island microelectrode array system structure assembled based on the metal nanoparticle suspension by dielectrophoresis is characterized by comprising the following steps of:

the method comprises the following steps of firstly, manufacturing a microelectrode array of a plane parallel conductive island, and carrying out hydrophilic treatment on the surface of a rigid material with an insulating property as a substrate; using a metal material as a microelectrode array material, forming a conducting island microelectrode array system structure by using the technologies of photoetching, etching and the like, preparing a metal film on the surface by using a sputtering technology, and implanting a miniature bulb into the surface of the conducting island structure between each pair of electrodes to form a conducting island microelectrode array;

secondly, dielectrophoresis assembly of the metal nanoparticle suspension liquid is carried out, the metal nanoparticle suspension liquid is dripped in the range of each conductive island region by using a hydrophobic pen, the metal nanoparticle suspension liquid is dripped in the range of each conductive island region, and an alternating current signal with 10V and the driving frequency of 600Hz is applied to each pair of electrodes in the conductive island microelectrode array system, so that the assembly of the metal nanoparticles in the microelectrode array system is realized;

and thirdly, removing the colloid of the conductive island electrode micro-array system, immersing the assembled conductive island micro-electrode array system in a selective degumming solution, and removing a cementing structure.

2. The method for manufacturing the conducting island microelectrode array system structure based on the dielectrophoresis assembly of the metal nanoparticle suspension according to claim 1, wherein the conducting island microelectrode array with the miniature bulb can be adjusted in structure to form a corresponding font.

3. The method for manufacturing the conducting island microelectrode array system structure based on the dielectrophoresis assembly of the metal nanoparticle suspension according to claim 1, wherein the metal nanoparticle suspension dielectrophoresis assembly is performed.

Technical Field

The invention relates to the technical field of micro-nano manufacturing, in particular to an assembly of a conductive island microelectrode system by utilizing the action of dielectrophoresis force on a metal nanoparticle suspension under the condition of alternating current.

Background

Since the twentieth century, micro-nano manufacturing technology has been rapidly developed, and with the continuous progress of photoelectron information technology, the ordered nano microstructure has certain representativeness to micro-nano structure devices, so that the ordered nano microstructure is widely applied and popularized in the micro-nano field. Currently, there are two main common methods for preparing nano-microstructures: one is the traditional micromachining method which is characterized by top-down machining, such as various micro-nano imprinting technologies, photoetching technologies and the like. These methods do play an important role in the micro-nano field, but these methods have certain limitations in terms of processing principles, and require extremely high requirements for experimental environments and high experimental equipment costs. And the other is a self-assembly method, which has the processing characteristics from bottom to top, is simple and has low cost, so that the self-assembly technology is highly valued in the micro-nano field. Where the precise manipulation and assembly of nanomaterials into a specified position is a problem of great interest in the field of nanoelectronic device manufacturing. This is because the position of the nanomaterial plays an important role in the overall performance of the device. The nanoparticle control method with the remarkable effect can accurately control the particles and can place and arrange the particles.

Disclosure of Invention

Different from the complex process and the expensive cost of processing the ordered nano microstructure by the traditional technology, the invention adopts the method of applying alternating current to the metal nanoparticle suspension liquid to ensure that an electrode system with the guiding effect of the copolymer structure in the metal nanoparticle suspension liquid is subjected to dielectrophoresis force assembly, thereby realizing the ordered nano microstructure.

The process mainly comprises the following specific steps:

the method comprises the following steps of firstly, manufacturing a microelectrode array of a plane parallel conductive island, and carrying out hydrophilic treatment on the surface of a rigid material with an insulating property as a substrate; using a metal material as a microelectrode array material, forming a conducting island microelectrode array system structure by using the technologies of photoetching, etching and the like, preparing a metal film on the surface by using a sputtering technology, and implanting a miniature bulb into the surface of the conducting island structure between each pair of electrodes to form a conducting island microelectrode array;

secondly, dielectrophoresis assembly of the metal nanoparticle suspension liquid is carried out, the metal nanoparticle suspension liquid is dripped in the range of each conductive island region by using a hydrophobic pen, the metal nanoparticle suspension liquid is dripped in the range of each conductive island region, and an alternating current signal with 10V and the driving frequency of 600Hz is applied to each pair of electrodes in the conductive island microelectrode array system, so that the assembly of the metal nanoparticles in the microelectrode array system is realized;

and thirdly, removing the colloid of the conductive island electrode micro-array system, immersing the assembled conductive island micro-electrode array system in a selective degumming solution, and removing a cementing structure.

The method for arranging and assembling the metal particles in the conducting island microelectrode array system by applying the alternating current to the metal nanoparticle suspension to assemble the dielectrophoresis force can greatly reduce the cost and realize the stable, efficient, simple and convenient rapid arrangement and assembly of the metal particles. The technical scheme can be widely applied to the aspects of cell separation, micro-nano sensors and the like.

1): selection and treatment of the substrate: using a rigid material with an insulated surface as a substrate, and carrying out hydrophilic treatment on the surface of the rigid material;

2): manufacturing a conductive island microelectrode array: selecting a metal material as a material for generating a conducting island microelectrode array, forming a conducting island microelectrode array system structure by using photoetching and etching technologies, preparing a metal film on the surface of the structure by using a sputtering process, and implanting a miniature bulb into the surface of the conducting island structure between each pair of electrodes to form a conducting island microelectrode array system;

3) dielectrophoretic assembly of a suspension of metal nanoparticles: the metal nanoparticle suspension is dripped into the range of each conductive island region by using a hydrophobic pen, the metal nanoparticle suspension is dripped into the range drawn by the hydrophobic pen, and an alternating current signal with 10V and the driving frequency of 600Hz is applied to the electrode, so that dielectrophoresis assembly of the metal nanoparticle suspension is realized.

4) Removal of the cement structure: and immersing the assembled microelectrode array system of the conductive island in a selective photoresist removing solution to remove the photoresist structure.

The method for arranging and assembling the metal particles in the conducting island microelectrode array system by applying the alternating current to the metal nanoparticle suspension to assemble the dielectrophoresis force can greatly reduce the cost and realize the stable, efficient, simple and convenient rapid arrangement and assembly of the metal particles. The technical scheme can be widely applied to the aspects of cell separation, micro-nano sensors and the like.

Drawings

FIG. 1 is a top view of a substrate of the present invention.

FIG. 2-1 is a top view after spin coating a photoresist onto a substrate; fig. 2-2 is a front view after spin coating a photoresist onto a substrate.

FIG. 3-1 is a top view of a conducting island microelectrode array after photolithography, metal layer sputtering and micro bulb implantation; FIG. 3-2 is a front view of a conducting island microelectrode array after photolithography, metal layer sputtering and implantation of a miniature bulb.

FIG. 4-1 is a top view of a metal nanoparticle suspension after dielectrophoretic assembly; fig. 4-2 is a front view of the metal nanoparticles after dielectrophoresis assembly.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings.

The manufacturing method of the conducting island microelectrode array system structure assembled based on dielectrophoresis of the metal nanoparticle suspension comprises the following steps:

firstly, manufacturing a plane parallel conductive island microelectrode array:

1): selection and treatment of the substrate: as shown in fig. 1, a rigid material with an insulated surface is used as a substrate 1, and the surface is subjected to hydrophilic treatment;

2): manufacturing a conductive island microelectrode array system: selecting a metal material as a material for generating a conducting island microelectrode array, photoetching and etching the material by using photoresist 2 to form a conducting island microelectrode array system structure, preparing a metal film on the surface of the structure by using a sputtering process, and implanting a miniature bulb 4 into the surface of the conducting island structure between each pair of electrodes to form a conducting island microelectrode array system 3 (figures 2-1 and 2-2, figures 3-1 and 3-2);

secondly, dielectrophoresis assembly of the metal nanoparticle suspension: the method comprises the following steps of (1) utilizing a hydrophobic pen to regulate the range of a metal nanoparticle suspension liquid in each conductive island region, dripping the metal nanoparticle suspension liquid in the range of each conductive island region, and applying an alternating current signal with 10V and the driving frequency of 600Hz to each pair of electrodes in a conductive island microelectrode array system to realize the assembly of a metal nanoparticle wire 5 in the microelectrode array system (figure 4-1, figure 4-2);

and thirdly, removing the colloid of the conductive island electrode micro-array system, immersing the assembled conductive island micro-electrode array system in a selective degumming solution, and removing a cementing structure.

The invention fully utilizes the metal nano particle suspension under the action of dielectrophoresis under the alternating current electric field to realize the assembly of the conductive island microelectrode array. Different from the complex process and high cost in the traditional nano microstructure manufacturing process, the method has the advantages of simple operation and low cost, and can be used for large-scale preparation. The working principle of the invention is based on dielectrophoresis theory and alternating current electrohydrodynamics theory, and the distribution of a space electric field is changed due to the addition of the conductive islands, so that the local electric field intensity is increased and the electric field gradient is improved. In the process of dielectric assembly of the nano particles, the electro-dynamic phenomena such as alternating current electroosmosis flow, alternating current heat flow and the like can realize particle movement by driving liquid movement to generate an effect on the formation of particle chains. And as the angle of the conductive island is increased, the curvature radius of the assembled metal nanoparticle line is larger and larger.