阅读说明：本技术 电子电路单元 (Electronic circuit unit ) 是由 W·基恩勒 G·弗拉姆 R·舒尔茨 于 2020-03-25 设计创作，主要内容包括：电子电路单元(1)、尤其用作电机的逆变器或换流器的电路单元,包括至少一个电子器件单元(4)、尤其功率电子器件单元,其中,电子器件单元(4)包括至少一个载体基板(5)和至少一个布置在载体基板(5)上的电气和/或电子构件元件(32),其中,在载体基板(5)处在载体基板(5)的基板上侧(7)上构造至少一个第一连接位置(10)、至少两个第二连接位置(20),其中,第一连接位置(10)布置在两个第二连接位置(20)之间；其中,电子电路单元(1)此外包括带有用于电接触电子构件(8)的至少一个第一汇流条(12)和对电子构件(8)的至少一个第二汇流条(22)电接触的至少一个电气或电子构件(8)；提出了：能导电的桥接元件(40)将两个第二连接位置(20)彼此导电地连接起来,其中,桥接元件(40)桥状地引导越过第一连接位置(10)且通过中间空间与第一连接位置隔开和电绝缘,其中,第一连接位置(10)通过第一连接元件(11)与第一汇流条(12)导电地连接,并且第二连接位置(20)通过第二连接元件(21)与第二汇流条(22)导电地连接。(Electronic circuit unit (1), in particular a circuit unit for use as an inverter or converter of an electric machine, comprising at least one electronics unit (4), in particular a power electronics unit, wherein the electronics unit (4) comprises at least one carrier substrate (5) and at least one electrical and/or electronic component element (32) arranged on the carrier substrate (5), wherein at least one first connection location (10), at least two second connection locations (20) are formed on a substrate top side (7) of the carrier substrate (5) on the carrier substrate (5), wherein the first connection location (10) is arranged between the two second connection locations (20); wherein the electronic circuit unit (1) further comprises at least one electrical or electronic component (8) with at least one first busbar (12) for electrically contacting the electronic component (8) and at least one second busbar (22) for electrically contacting the electronic component (8); it proposes that: an electrically conductive bridging element (40) electrically conductively connects the two second connection points (20) to one another, wherein the bridging element (40) is guided over the first connection point (10) in a bridge-like manner and is separated from and electrically insulated from the first connection point by an intermediate space, wherein the first connection point (10) is electrically conductively connected to the first busbar (12) by means of the first connection element (11), and the second connection point (20) is electrically conductively connected to the second busbar (22) by means of the second connection element (21).)

1. Electronic circuit unit (1), in particular a circuit unit for use as an inverter for an electrical machine or as a converter, comprising at least one electronics unit (4), in particular a power electronics unit, wherein the electronics unit (4) comprises at least one carrier substrate (5) and at least one electrical and/or electronic component element (32) arranged on the carrier substrate (5), wherein at least one first connection location (10) and at least two second connection locations (20) are formed on a substrate top side (7) of the carrier substrate (5) on the carrier substrate (5), wherein the first connection location (10) is arranged between the two second connection locations (20),

wherein the electronic circuit unit (1) further comprises at least one electrical or electronic component (8) with at least one first busbar (12) for electrically contacting the electronic component (8) and at least one second busbar (22) for electrically contacting the electronic component (8),

characterized in that an electrically conductive bridging element (40) electrically conductively connects the two second connection locations (20) to one another, wherein the bridging element (40) is guided in a bridge-like manner over the first connection location (10) and is spaced apart from the first connection location by an intermediate space and is electrically insulated therefrom,

wherein the first connection point (10) is electrically conductively connected to the first busbar (12) by means of a first connection element (11), and the second connection point (20) is electrically conductively connected to the second busbar (22) by means of a second connection element (21).

2. Electronic circuit unit according to claim 1, characterized in that the first connection element (11) is configured as a ribbon bond and/or a wire bond and/or the second connection element (21) is configured as a ribbon bond and/or a wire bond.

3. Electronic circuit unit according to any one of the preceding claims, characterised in that said first connection elements (11) and said second connection elements (21) are arranged alternately.

4. Electronic structural assembly according to any one of the preceding claims, characterized in that the first connection element (11) and the second connection element (21) are arranged parallel to each other.

5. Electronic structural assembly according to any one of the preceding claims, characterized in that the first connection location (10) extends planarly on the carrier substrate (5) between the two second connection locations (20) in the extension direction (E).

6. Electronic structural assembly according to claim 5, characterised in that the points at which the first connection elements (11) are in electrically conductive contact with the first connection locations (11) are arranged alongside one another along the direction of extension (E).

7. Electronic structural assembly according to any one of the preceding claims, characterized in that points at which the second connection element (21) is conductively connected with the bridging element (40) are arranged alongside one another in the direction of extension of the bridging element (40).

8. Electronic structural assembly according to one of the preceding claims, characterized in that the first connecting element (11) is in electrically conductive contact with the first busbar (12) along the first busbar (12) and/or the second connecting element (21) is in electrically conductive contact with the second busbar (22) along the second busbar (22).

9. Electronic structural assembly according to any one of the preceding claims, characterized in that the bridging element (40) is configured as a metal strip.

10. Electronic structural assembly according to any one of the preceding claims, characterized in that an electrically insulating spacer element is arranged in an intermediate space between the bridge element (40) and the first connection location (10).

Technical Field

The invention relates to an electronic circuit unit, in particular for use as an inverter or converter for an electric machine, having the features of the preamble of independent claim 1.

Background

In hybrid or electric vehicles, converter and inverter arrangements with a rectifier circuit are used, which is formed by an intermediate circuit capacitor and a half-bridge circuit, which is formed, for example, in a power module. For example, for operating an electric machine, an inverter is used, which supplies phase currents to the electric machine. The inverters and converters comprise, for example, a power module and at least one intermediate circuit capacitor, which briefly supplies electrical energy. The power module can comprise, for example, a carrier substrate with conductor tracks, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic component assembly. It is known to electrically conductively connect the connection contacts of the intermediate circuit capacitor to the power module. For this purpose, contact elements which are led out of the power module and which are in electrical contact with the electronic component assembly are connected to the connection contacts of the intermediate circuit capacitor. The electronic component assembly can be cast from an electrically insulating substance, from which contact elements that electrically contact the electronic component assembly are led out and are connected to connection elements outside the electrically insulating substance.

US 20070109715 a1 shows such an intermediate circuit capacitor, which is connected electrically conductively to the power module. In this case, the electronics assembly of the power module is arranged in a frame, and the contact elements which electrically contact the electronics assembly are led out of the frame for further contacting and are then screwed to the connection contacts of the intermediate circuit capacitor and are thereby conductively contacted.

Disclosure of Invention

According to the invention, an electronic circuit unit, in particular a circuit unit used as an inverter or converter for an electric machine, is proposed. The electronic circuit unit comprises at least one electronic component unit, in particular a power electronic component unit, wherein the electronic component unit comprises at least one carrier substrate and at least one electrical and/or electronic component element arranged on the carrier substrate, wherein at least one first connection location and at least two second connection locations are formed on a substrate upper side of the carrier substrate at the carrier substrate, wherein the first connection location is arranged between the two second connection locations, wherein the electronic circuit unit furthermore comprises at least one electrical or electronic component with at least one first busbar for electrically contacting the electronic component and at least one second busbar for electrically contacting the electronic component. According to the invention, an electrically conductive bridging element connects the two second connection points to one another in an electrically conductive manner, wherein the bridging element is guided in a bridge-like manner over the first connection point and is spaced apart from and electrically insulated from the first connection point by an intermediate space, wherein the first connection point is electrically conductively connected to the first busbar by the first connection element, and the second connection point is electrically conductively connected to the second busbar by the second connection element.

Compared to the prior art, the electronic circuit unit having the features of the independent claim has the following advantages: the inductance in the region of the electronic circuit unit in which the bus bars of the electronic component are conductively connected to the electronics unit via the connecting element is drastically reduced. This is achieved by: the two second connection locations are conductively connected on the carrier substrate by means of a bridging element. Although the carrier substrate, for example a DBC substrate (direct bonded copper) is of single-layer construction and the first connection location is arranged on the carrier substrate between two second connection locations, the two second connection locations are nevertheless conductively contacted by the second connection element in the region between the two second connection locations by a bridging of the first connection location. More T +/T-contact pairs at the connection element are then able to make electrically conductive contacts between the connection locations of the bus bar and the carrier substrate than in the state of the art. Here, the T +/T-contact pair represents a pair made up of a respective first connection element and second connection element. The first and second connection elements direct current in opposite directions. A plurality of pairs of corresponding first and second connecting elements can be formed by the bridging element for connecting the bus bar to the connecting point. The inductance in the electronic circuit unit can then be reduced and thus a faster switching of the semiconductor switch in the electronic circuit unit can be achieved.

Further advantageous embodiments and refinements of the invention are possible by means of the features specified in the dependent claims.

According to an advantageous embodiment, it is provided that the first connecting element is designed as a ribbon and/or wire bond and/or that the second connecting element is designed as a ribbon and/or wire bond. The bus bar can be advantageously connected well and easily to the connection point of the substrate by means of a ribbon bond or a wire bond as a connection element, and a large number of pairs of connection elements can be used for the connection. The inductance in the region of the connection between the bus bar and the connection point of the substrate is advantageously reduced by the large number of pairs of connection elements.

According to an advantageous embodiment, it is provided that the first connecting element and the second connecting element are arranged alternately. By means of this alternating arrangement of the first and second connection elements, the first connection element is arranged, for example, between two second connection elements and/or, conversely, the second connection element is arranged between two first connection elements. Thus, in addition to the reduction of the inductance due to the individual pairs of connecting elements, the pairs can interact with one another and the inductance of the connection between the bus bar and the connection location of the substrate can be further reduced.

According to an advantageous embodiment, it is provided that the first connecting element and the second connecting element are arranged parallel to one another. By means of the parallel arrangement, the current paths in the connecting elements run parallel to one another and in the first and second connecting elements run parallel to one another in opposite directions. Thereby, the inductance of the connection portion between the bus bar and the connection position of the substrate is further reduced by the connection member.

According to an advantageous embodiment, it is provided that the first connection points extend in the extension direction on the carrier substrate in a planar manner between the two second connection points. The first connection point extends here, for example, parallel to the bridging element. The connecting elements can then be contacted in pairs and/or alternately in an electrically conductive manner over the entire extent of the bridging element and of the first connection point.

According to an advantageous embodiment, it is provided that points at which the first connection elements are in electrically conductive contact with the first connection locations are arranged alongside one another in the direction of extension.

According to an advantageous embodiment, it is provided that the points at which the second connecting element and the bridging element are electrically conductively connected are arranged next to one another in the direction of extent of the bridging element.

According to an advantageous embodiment, it is provided that the first connecting element is in electrically conductive contact with the first busbar along the first busbar and/or that the second connecting element is in electrically conductive contact with the second busbar along the second busbar.

According to an advantageous embodiment, it is provided that the bridging element is designed as a metal strip. The bridging element then has good electrical conductivity and can advantageously be well shaped, machined and contacted.

According to an advantageous embodiment, it is provided that an electrically insulating spacer element is arranged in the intermediate space between the bridge element and the first connection point. The electrically insulating spacer element separates an electrically conductive bridge element from the first connection location and insulates the bridge element from the first connection location. At the same time, the spacer element can bring about a thermal contact of the bridging element with respect to the carrier substrate, and heat can be conducted away from the bridging element via the carrier substrate, for example, to a heat sink.

Drawings

Embodiments of the invention are illustrated in the drawings and explained in more detail in the following description. Wherein:

fig. 1 shows a diagram of an electronic circuit unit from the prior art;

fig. 2 shows a top view of an electronic circuit unit from the prior art;

fig. 3 shows a diagram of an embodiment of an electronic circuit unit according to the invention.

Detailed Description

The electronic circuit unit according to the invention can find various applications, for example as an inverter or converter in automotive technology. For example, the electronic circuit unit and the inverter, which is called a inverter, can also be applied to operate a motor of, for example, a hybrid vehicle or an electric vehicle.

Fig. 1 and 2 show an embodiment of an electronic circuit unit 1 from the prior art. The circuit unit 1 comprises an electronics unit 4, in particular a power electronics unit, wherein the electronics unit 4 comprises a carrier substrate 5 and an electrical and/or electronic component element 32 arranged on the carrier substrate 5. The carrier substrate 5 can comprise a plurality of layers made of electrically conductive materials, such as metals and/or dielectric materials. The carrier substrate 5 is, for example, a circuit carrier, in this embodiment a DBC substrate (Direct Bonded Copper). However, the carrier Substrate 5 can also be, for example, an AMB Substrate (Active Metal soldered), an IMS Substrate (Insulated Metal Substrate), a Printed Circuit Board (PCB) or another Substrate suitable for power modules. On the substrate top side 7 of the carrier substrate 5, various electrical and/or electronic component elements 32 can be arranged, such as, for example, power semiconductors, such as, for example, Field Effect transistors, such as, for example, MIS-FETs (Metal Insulated Semiconductor Field Effect transistors), IGBTs (Insulated-gate bipolar transistors), power MOSFETs (Metal oxide Semiconductor Field Effect transistors) and/or diodes, for example, rectifier diodes. The power semiconductor (die) can be, for example, a power semiconductor without a housing. Furthermore, passive component elements such as, for example, resistors or capacitors can also be arranged as electrical and/or electronic component elements 32 on the carrier substrate 5.

Furthermore, the carrier substrate 5 can comprise conductor circuits 17, 27. The electrical and/or electronic component elements 32 can be connected to one another or to further electrical and/or electronic elements which are arranged outside the electronics unit 4 and are not shown in the figures, for example by way of the conductor tracks 17, 27 of the carrier substrate 5, by way of bonding wires or other suitable electrically conductive contact elements, for example by soldering or sintering. The conductor circuits 17, 27 can be designed as conductor planes, as in this exemplary embodiment. At least one first connection point 10 is formed on the substrate top side 7 of the carrier substrate 5, at which first connection point the first conductor path 17 can be contacted in an electrically conductive manner. Furthermore, at least two second connection points 20 are formed on the substrate top side 7 of the carrier substrate 5, at which the second conductor tracks 27 can be contacted in an electrically conductive manner. At the connection position, the electronics unit 4 can be connected in an electrically conductive manner to elements arranged outside the electronics unit 4. Here, the first connection position 10 has a polarity, denoted by T +, set opposite to the second connection position 20, for example, wherein the polarity of the second connection position 20 is denoted by T +.

As shown in the figures, the electronics unit 4 comprises one first connection site 10 and two second connection sites 20 on the carrier substrate. The first connection location 10 is arranged at least partially between the two connection locations 20 and separates the second connection locations 20 from one another. The two connection locations 20 have the same polarity T +. The connection locations 10 arranged between said connection locations 20 have oppositely arranged polarities T-. The connection point 10 represents, for example, a region of the first conductor path 17 in which the conductor path 17 can be contacted in an electrically conductive manner. The connection location 20 represents, for example, a region of the second conductor path 27 or the second conductor path 27, in which connection location the conductor path 27 can be contacted in an electrically conductive manner.

In this exemplary embodiment, the carrier substrate 5 of the electronics unit 4 is arranged on the upper side 3 of the heat sink 2 and is soldered, for example, to the upper side 3 of the heat sink 2. The carrier substrate 5 can be placed on the heat sink 2 directly or in the case of an intermediate layer of a heat-conducting layer. The heat sink 2 serves to dissipate heat generated in the electronics unit 4 and is characterized by a high thermal conductivity. The heat sink 2 is made of a material with good heat conductivity, such as, for example, aluminum or copper. In this exemplary embodiment, the cooling body 2 is made of copper and is designed as a plate. Structures, which are not shown in the figures, for improving the heat dissipation, such as, for example, ribs, pins or channels, can also be formed on the heat sink 2. The carrier substrate 5 of the electronics unit 4 can also be placed, for example, directly on the upper side 3 of the heat sink 2 and be insulated from the heat sink 2, for example, by an electrically insulating layer surrounded by the carrier substrate 5.

Furthermore, as shown in fig. 1, the electronic circuit unit 1 comprises at least one electrical and/or electronic component 8 which is not comprised by the electronics unit 4. In the embodiment described in the present application, the electrical and/or electronic component 8 is a capacitor. A power capacitor can be used, for example, as an intermediate circuit capacitor of the electronic circuit unit 1. Such a capacitor can also comprise a plurality of capacitor elements which are conductively connected to one another, which capacitor elements themselves form the individual capacitances and also comprise, for example, the conductive connecting elements necessary for conductively connecting these capacitor elements. In this case, different capacitor technologies, such as, for example, film capacitors, such as stacked capacitors or circular winding capacitors, or other suitable capacitor technologies, can be used as capacitors or as capacitor elements.

In an exemplary embodiment, the capacitor comprises two bus bars 12, 22 as electrical and/or electronic component 8. In the context of the present application, the bus bars 12, 22 of the electrical and/or electronic component 8 are understood to be electrically conductive and one-piece components which issue or project from the electrical and/or electronic component 8 and which are provided for electrically contacting the electrical and/or electronic component 8 with electrical and/or electronic components arranged outside the electrical and/or electronic component 8. In this exemplary embodiment, two bus bars 12, 22 then project from the capacitor as electrical and/or electronic component 8, which are provided for electrically contacting two electrodes of the capacitor 8 with electrical and/or electronic components arranged outside the capacitor 8, such as in particular the electronics unit 4. The bus bars 12, 22 can be at least partially made of one or more metals, such as copper or aluminum, and are, for example, partially insulated or also not insulated. They can be made of, for example, sheet material. In the present application, a distinction is made between a first busbar 12 and a second busbar 22, wherein the first busbar 12 represents a connecting contact which, as in the exemplary embodiment, in the case of a capacitor as the electrical and/or electronic component 8, starts from a first of the two electrodes of the capacitor, and the second busbar 22 represents a connecting contact which starts from a second of the two electrodes of the capacitor. The bus bars 12, 22, a first bus bar 12 and a second bus bar 22 are shown by way of example in the figure. However, it is also possible to form a plurality of first and/or second bus bars 12, 22, which can also be connected in an electrically conductive manner, for example, to further connection points formed on a further electronics unit 4, which is not shown in the figures. Furthermore, the electrical and/or electronic component 8 can be connected in an electrically conductive manner via further electrical contacts, which are not shown in the figures, for example also with further elements, which are not shown in the figures, such as, for example, further electrical and/or electronic components 8.

As shown in fig. 1, in the electronic circuit unit 1 the first bus bar 12 is formed in a planar manner and the second bus bar 22 is formed in a planar manner. In the context of the present application, the bus bars 12, 22 are understood to be electrically conductive planar conductors, for example conductive strips or strips. Thus, the bus bars 12, 22 can be, for example, bus bars. The bus bars 12, 22 can, for example, be curved or bent or also run in a curved or stepped manner. In this case, the bus bars 12, 22 can overlap to a large extent and can also be guided at least partially parallel to one another, for example, in a planar manner, in order to be able to guide the current with the lowest possible inductance. For this purpose, the bus bars 12, 22 can also preferably be guided parallel to one another at least in regions and can also be equally wide, for example.

In fig. 3 an electronic circuit unit 1 according to the invention is shown. Here, the electronic circuit unit 1 comprises a bridging element 40. The bridging element 40 is made of an electrically conductive material. The bridging element 40 is configured, for example, as a metal strip. The bridging element 40 electrically conductively connects two second connection points 20, which are spaced apart from the first connection point 10, to one another. For this purpose, the bridging element 40 is guided in the form of a bridge over the first connection point 10 and/or the first conductor path 17. The bridging element 40 is separated from the first connection point 10 and the first conductor path 17 by an intermediate space, which electrically insulates the bridging element 40 from the first connection point 10. The intermediate space can be empty or electrically insulating spacer elements can be arranged in the intermediate space. As shown in fig. 3, the first connection locations 10 extend on the substrate upper side 7 of the carrier substrate 5 below the bridging element 40 and between the two second connection locations 20 and then expand and extend in a planar manner in the extension direction E on the carrier substrate 5. The direction of extension E runs here, for example, parallel to a connecting line between two second connecting points 20. The bridging element 40 can be fastened at the second connection location 20, for example by soldering, bonding, sintering and/or diffusion soldering.

As shown in fig. 3, the first connection point 10 is electrically conductively connected to the first busbar 12 by a plurality of first connection elements 11. At the same time, the bridging element 40 is electrically conductively connected to the second busbar 22 via a plurality of second connecting elements 21. The first conductor circuit 17, the first connection location 10, the first connection element 11 and the first bus bar 12 are thus conductively connected to one another and thus have the same potential T-. At the same time, said second conductor circuit 27, second connection location 20, bridging element 40, second connection element 21 and second bus bar 22 are conductively connected to each other and therefore at the same potential T +.

The connecting elements 11, 12 can be configured, for example, as wire bonds and/or ribbon bonds. In this exemplary embodiment, three first connecting elements 11, which are designed as ribbon bonds, and four second connecting elements 21, which are also designed as ribbon bonds, are provided.

Fig. 3 shows that the first connecting elements 11 and the second connecting elements 21 are arranged alternately here, i.e. the first connecting elements 11 and the second connecting elements 21 are arranged alternately for connection. The connecting elements 11, 21 with oppositely set polarities T +, T-then follow one another and the inductance of the connection between the electronics unit 4 and the electronic member 8 is reduced.

The connecting elements 11, 21 are arranged parallel to each other. The first connecting element 11 and the second connecting element 21 can then be oriented, for example, in pairs parallel to one another. As shown in fig. 3, however, all connecting elements 11, 21 can also be oriented parallel to one another, for example.

Each of the first connection elements 11 has a first end at which it is connected with the first connection location 10; and has a second end at which the first connecting element is connected to the first busbar 12. Likewise, each of the second connection elements 21 has a first end at which it is connected with the bridging element 40; and has a second end at which the second connecting element is connected with the second busbar 22. The points at which the first connection elements 11 are conductively contacted at the first end with the first connection locations 10 are arranged alongside one another at the first connection locations 10 in the extension direction E. The points at which the first connecting elements 11 are in electrically conductive contact with the first busbar 12 at the second end are arranged alongside one another along the longitudinal extension of the first busbar 12. The points at which the second connection elements 21 are in electrically conductive contact with the bridging element 40 at the first end are arranged alongside one another at the bridging element 40. The points at which the second connecting members 21 conductively contact the second bus bar 22 at the second end are arranged alongside one another along the longitudinal extension of the second bus bar 22.

It goes without saying that further embodiments and mixed forms of the embodiments shown are also possible.