阅读说明：本技术 用于可表面安装的电子部件的间隔物 (Spacer for surface-mountable electronic components ) 是由 雷蒙德·李 于 2020-03-27 设计创作，主要内容包括：提供了一种间隔物,以允许表面安装器件(SMD)以更大的自由度被表面安装到PCB上。该间隔物被设计成可表面安装到PCB,并且包括非导电主体,该非导电主体具有面向SMD的第一表面、面向PCB的第二表面以及非导电主体中的通孔和/或凹部,以容纳在SMD和PCB之间提供电连接的电导体。间隔物可以提供以下一个或更多个：升高的高度(使得SMD被升高到PCB上方)、相对于SMD在PCB上的指定位置沿着PCB表面的偏移、或者相对于PCB表面在一个或更多个方向上的倾斜。(A spacer is provided to allow a Surface Mount Device (SMD) to be surface mounted on a PCB with greater freedom. The spacer is designed to be surface mountable to a PCB and comprises a non-conductive body having a first surface facing the SMD, a second surface facing the PCB and through holes and/or recesses in the non-conductive body to accommodate electrical conductors providing an electrical connection between the SMD and the PCB. The spacer may provide one or more of: elevated height (such that the SMD is elevated above the PCB), offset along the surface of the PCB relative to a specified location of the SMD on the PCB, or tilted in one or more directions relative to the surface of the PCB.)