阅读说明：本技术 电路安装品和设备 (Circuit mounting article and apparatus ) 是由 阿部孝寿 深尾朋宽 泽田知昭 福岛奖 于 2020-04-16 设计创作，主要内容包括：本发明一个方面涉及一种电路安装品,其是固定于布帛的电路安装品,所述电路安装品具备：具有柔软性的电路基板；和安装在所述电路基板的与所述布帛相向的布帛对面侧的电子部件,其中,在所述电路基板的所述布帛对面侧还具备用于固定于所述布帛的增强部。(One aspect of the present invention relates to a circuit mounted product fixed to a fabric, the circuit mounted product including: a flexible circuit board; and an electronic component mounted on a fabric opposite side of the circuit board opposite to the fabric, wherein the circuit board further includes a reinforcing portion for fixing to the fabric on the fabric opposite side of the circuit board.)

1. A circuit-mounted article characterized by being fixed to a fabric,

the circuit mounting article includes:

a flexible circuit board; and

an electronic component mounted on a side of the circuit board opposite to the fabric, wherein,

the circuit board further includes a reinforcing portion for fixing to the fabric on the opposite side of the fabric.

2. The circuit mounting article of claim 1,

at least a portion of the electronic component is covered with a coating agent.

3. The circuit mounting article of claim 2,

the coating agent is formed of the same material as the reinforcement portion.

4. The circuit mounting article according to claim 1 or claim 2,

the reinforcing portion is formed of the same material as the circuit substrate.

5. The circuit mounting article according to any one of claims 2 to 4,

the coating agent has an elastic modulus higher than that of the circuit substrate and lower than that of the electronic component.

6. The circuit mounting article according to any one of claims 1 to 5,

the distance between the reinforcing part and the electronic component is larger than the height of the electronic component.

7. The circuit mounting article according to any one of claims 1 to 6,

the circuit mounting article has a portion in which the height of the reinforcement portion is greater than the height of the electronic component.

8. The circuit mounting article according to any one of claims 1 to 7,

the circuit board includes an insulating layer and a wiring pattern formed of a conductor and provided on the insulating layer,

the wiring pattern is present in at least a part of a region of the circuit substrate where the reinforcement portion is formed.

9. A circuit-mounted article characterized by being fixed to a fabric,

the circuit mounting article includes:

a flexible circuit board;

an electronic component mounted on a side of the circuit board opposite to the fabric; and

and a reinforcing portion for fixing the circuit board to the fabric.

10. An apparatus, characterized by comprising:

the circuit-mounted product according to any one of claims 1 to 9;

a fabric; and

a fixing member for fixing the circuit mounted article and the fabric, wherein,

the reinforcing portion and the fabric are fixed to each other by the fixing member so that a surface of the circuit-mounted product on which the electronic component is mounted and the fabric face each other.

11. The apparatus of claim 10,

the fixing position for fixing the reinforcing part and the fabric by the fixing member is more than 2,

the apparatus is configured to have a selection method of 2 fixed positions that satisfies a condition that a length of the fabric present between arbitrarily selected 2 fixed positions is shorter than a length of the circuit mounted product present between the selected 2 fixed positions.

12. The apparatus according to claim 10 or claim 11,

the fabric is a fabric constituting a garment,

fixing the circuit-mounted article at a position such that: when the clothes are hung on a clothes hanger having a power transmission electronic component capable of performing non-contact communication or non-contact power supply with the electronic component of the circuit mounting, the electronic component of the circuit mounting can perform non-contact communication or non-contact power supply with the power transmission electronic component.

13. The apparatus according to any one of claims 10 to 12,

the fixing member has conductivity.

Technical Field

The present invention relates to a circuit mounted article and an apparatus.

Background

With the development of the electronic field, demands for downsizing, thinning, weight reduction, and high density of electronic devices and the like have been further increased. Depending on the application, there is a need for a flexible device that can be disposed on a curved surface, a concave-convex surface, or the like, can be freely deformed, or can be bent. In order to realize such a flexible device, it is considered to use a flexible circuit board or the like as a circuit board provided in the device. As the flexible circuit board, for example, a flexible circuit board described in patent document 1 can be cited.

Patent document 1 describes a flexible circuit board for mounting electronic components, which is configured such that: a reinforcing part having rigidity used for mounting components is attached to both sides of a flexible circuit board including a circuit wiring pattern for mounting electronic components.

Patent document 1 discloses the following: by attaching a reinforcing portion having rigidity when mounting a component to the outside of the main body of the flexible circuit board, automatic mounting of the component can be realized. The following subject matter is also disclosed: after the component is mounted, the reinforcing portion is easily separated and removed, and a mounted conventional flexible circuit board can be easily obtained.

Examples of the flexible device include wearable devices that can be worn by animals such as humans and dogs, and plants. The wearable device is sometimes used in a state of being integrated with clothing or the like. In this case, the circuit board provided in the wearable device is required to be not only flexible but also easily integrated with clothes and the like.

Documents of the prior art

Patent document

Patent document 1: japanese Utility model laid-open publication No. 59-119057

Disclosure of Invention

The purpose of the present invention is to provide a circuit-mounted product that can be favorably fixed to a fabric, and a device in which the circuit-mounted product is favorably fixed to a fabric.

One aspect of the present invention relates to a circuit mounted product fixed to a fabric, the circuit mounted product including: a flexible circuit board; and an electronic component mounted on a fabric opposite side of the circuit board opposite to the fabric, wherein the circuit board further includes a reinforcing portion for fixing to the fabric on the fabric opposite side of the circuit board.

Drawings

Fig. 1 is a plan view showing an example of a circuit mounted product according to an embodiment of the present invention.

Fig. 2 is a sectional view of the circuit mounted product shown in fig. 1, as viewed from a sectional line II-II.

Fig. 3 is a cross-sectional view showing an example of an apparatus according to another embodiment of the present invention.

Fig. 4 is a cross-sectional view showing another example of the circuit mounted product according to the embodiment of the present invention.

Fig. 5 is a diagram for explaining a positional relationship between the reinforcing part and the electronic component in the circuit mounted product according to the embodiment of the present invention.

Fig. 6 is a cross-sectional view showing another example of the circuit mounted product according to the embodiment of the present invention.

Fig. 7 is a sectional view showing another example of the apparatus according to another embodiment of the present invention.

Fig. 8 is a plan view showing another example of the circuit mounted product according to the embodiment of the present invention.

Fig. 9 is a sectional view of the circuit-mounted product shown in fig. 8, as viewed from a sectional line IX-IX.

Fig. 10 is a cross-sectional view showing another example of the circuit mounted product according to the embodiment of the present invention.

Fig. 11 is a sectional view showing another example of the apparatus according to another embodiment of the present invention.

Fig. 12 is a cross-sectional view showing an example of a circuit mounted product according to another embodiment of the present invention.

Fig. 13 is a schematic view showing an example of clothes to which the circuit mounted product according to the embodiment of the present invention is fixed.

Fig. 14 is a schematic view showing an example of a clothes hanger for hanging clothes to which a circuit mounted product according to the embodiment of the present invention is fixed.

Detailed Description

According to the studies of the present inventors, in the case of a conventional circuit board, even a flexible circuit board is used as follows: when the circuit board is sewn to a fabric for fixing the circuit board to the fabric constituting clothes or the like, the circuit board is broken from the sewn portion. For example, the flexible circuit board described in patent document 1 has a rigid reinforcing portion used when mounting components are attached to both sides of the flexible circuit board as described above. However, in the case of the flexible circuit board described in patent document 1, the reinforcing portion is provided only for solving the difficulty in mounting the components due to the flexibility of the circuit board, and the reinforcing portion is not intended to be cut from the fabric even if sewn thereto. In the case of the flexible circuit board described in patent document 1, it is desirable to remove the reinforcing portion after the mounting of the component. In the flexible circuit board described in patent document 1, the surface provided with the reinforcing portion is opposite to the mounting surface on which the electronic component is mounted, and thus it is considered that: the reinforcing portion is intended not to interfere with mounting of the electronic component.

As a result of various studies, the present inventors have found that the above object can be achieved by the following invention: provided are a circuit-mounted product which can be favorably fixed to a fabric, and a device in which the circuit-mounted product is favorably fixed to the fabric.

Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to these.

The circuit mounted product according to an embodiment of the present invention is a circuit mounted product fixed to a fabric. As shown in fig. 1 and 2, the circuit mounted product 11 includes: a flexible circuit board 12; and an electronic component 15 mounted on one surface side of the circuit board 12 (the opposite surface side of the circuit board 12 to the fabric). The circuit mounted product 11 further includes a reinforcing portion 16 for fixing to the fabric on the side opposite to the fabric of the circuit board 12. Fig. 1 is a plan view (a view from the opposite side of the fabric) showing an example of the circuit mounted product 11 according to the present embodiment. Fig. 2 is a cross-sectional view of the circuit mounted product 11 shown in fig. 1, as viewed along a cross-sectional line II-II.

When the circuit mounted article is fixed to the fabric, the obtained device has a structure in which the reinforcing portion and the fabric are fixed to each other by a fixing member (see fig. 3). That is, the reinforcing portion functions as a fabric fixing jig for fixing to the fabric. As the fixing member having a function of fixing the circuit mounted product to the fabric, a clip such as a stapler, a wire, an adhesive, or the like can be used. Fig. 3 is a cross-sectional view showing an example of a device 41 according to another embodiment of the present invention. Fig. 3 shows a configuration in which a wire is used as the fixing member 43. In fig. 3, since the wire as the fixing member 43 penetrates and is bonded to the reinforcing part 16, the circuit board 12, and the fabric 42, the circuit mounted product 11 and the fabric 42 are fixed to each other. In contrast, in the case of a circuit mounted product without a reinforcing portion, the strength of the flexible circuit board is weaker than that of the non-flexible circuit board having a high elastic modulus, and therefore the circuit board may be broken starting from a position where the wire penetrates the circuit board. On the other hand, the circuit mounted product of the present embodiment has the reinforcing portion, and the wire as the fixing member penetrates the reinforcing portion together with the circuit board, so that the risk of the circuit board breaking from the position where the wire penetrates can be reduced. In the case where a clamp or an adhesive is used as the fixing member, the fabric and the circuit mounted product are fixed via the reinforcement portion having the function of a fabric fixing jig, so that the risk of damage to the circuit board can be reduced.

In the circuit mounted product, the electronic component and the reinforcing portion are disposed on the fabric-facing side of the circuit board as described above. For example, as shown in fig. 3, when the circuit mounted product is fixed to the fabric (the circuit mounted product and the fabric are fixed so that the fabric-facing side of the circuit board faces the fabric), the electronic component is surrounded by the fabric and the circuit board. Therefore, it is possible to reduce the risk of the electronic component itself being damaged by the circuit component accidentally coming into contact with a person, a hard object, or the like, or the risk of the solder, which is responsible for the electrical connection between the electronic component and the wiring pattern on the circuit board, breaking, or the like.

When the circuit mounted product is fixed to the fabric, the circuit mounted product may be fixed to the fabric so that "a surface of the fabric opposite to a surface of the circuit board opposite to the fabric" is a surface that comes into contact with a person or the like (hereinafter, also referred to as a person or the like contact setting surface). In this case, the reinforcing portion and the electronic component may not be disposed on the contact setting surface of a person or the like. If the reinforcement portion and the electronic component are not disposed on the contact setting surface of the person or the like, even if the person or the like contacts the contact setting surface, only the surface of the flexible circuit board contacts the person, and thus the damage of the circuit component and the reinforcement portion to the person can be reduced, and the damage of the circuit component and the reinforcement portion can be reduced. For example, in the case where the fabric shown in fig. 3 is a garment, even if the circuit-mounted product is mounted on the inside of the garment as shown in fig. 3, the uncomfortable feeling (the uncomfortable feeling that a human body feels when touching the circuit-mounted product) when the person wears the garment can be reduced.

In the case where the circuit mounted product is fixed to the fabric, the circuit mounted product may be fixed to the fabric so that "a surface of the fabric opposite to the fabric-facing surface of the circuit board" is a surface in contact with the outside (hereinafter, also referred to as an external contact setting surface). That is, the contact setting surface of the person or the like in the above case may be fixed so as to be an external contact setting surface. In this case, the reinforcing portion and the electronic component may not be provided on the external contact setting surface. With this arrangement, for example, when the circuit mounted product including the electronic component such as an LED or a display device is fixed to a cloth such as clothes or shoes that is deformed by the movement of a person or the like, the display function of the LED or the display device is not impaired, and even if an object or the like comes into contact with the external contact setting surface, only the object or the like comes into contact with the surface of the flexible circuit board, so that damage to the object or the like due to the circuit component or the reinforcing portion can be reduced, and damage to the circuit component or the reinforcing portion can be reduced.

The above apparatus may be constituted as follows: the circuit mounted product including the circuit board is held by the fabric. Namely, the following constitution can be adopted: the circuit board 12 in fig. 3 also has a fabric (not shown) on the side opposite to the fabric 42. The fabric provided on the side opposite to the fabric 42 may be the same fabric as the fabric 42 or may be a different fabric from the fabric 42. The circuit board may be fixed to the fabric provided on the side opposite to the fabric 42, or may not be fixed to the fabric. Since the circuit board is configured such that the circuit board is not exposed to a human or the like touch setting surface or an external touch setting surface, the circuit component can be reduced from touching a human or an object, and damage to the circuit board, the human or the object can be reduced.

Since the circuit mounted product is supposed to be fixed to a fabric such as clothes, the circuit board 12 is supposed to have flexibility with less uncomfortable feeling when touched with the skin, and thus may have stretchability. Hereinafter, the circuit board 12 having flexibility is referred to as a flexible circuit board, and the circuit board having stretchability is referred to as a stretchable circuit board.

The reinforcing portion 16 may have any structure and any composition as long as it can reduce the risk of damage to the circuit board when the circuit board and the fabric are fixed to each other by the fixing member without the reinforcing portion. For example, the reinforcing portion 16 may be formed of the same material as the circuit board 12, or may be formed of a different material from the circuit board 12. When the reinforcing portion 16 is formed of the same material as the circuit board, it is also possible to assume a configuration in which the circuit mounted product is as shown in fig. 4 as one embodiment of the present invention. That is, the circuit mounted product 11 may be formed by folding back the end portion of the circuit board 12 to bond the circuit boards to each other as shown in fig. 4, thereby forming the reinforcing portion 21 (16). In this case, the folded-back portion 21 of the circuit board 12 can be said to correspond to the reinforcing portion 16. With this configuration, the reinforcing portion can be formed only from the circuit board without newly preparing the reinforcing portion. Fig. 4 is a cross-sectional view showing another example of the circuit mounted product 11 according to the present embodiment.

As shown in fig. 1 and 2, the circuit mounted product 11 is not limited to this configuration, but the reinforcing portion 16 is disposed in an end region of the circuit board 12. The circuit mounted product 11 may be configured such that: the reinforcing portion is disposed at the end portion of the circuit board 12 so that the end surface of the circuit board 12 is aligned with the end surface of the reinforcing portion 16, the reinforcing portion 16 may be disposed in the end portion region of the circuit board 12 as shown in fig. 1 and 2, or the reinforcing portion 16 may be disposed at the end portion of the circuit board 12 and in a region other than the end portion region of the circuit board 12. The number of the reinforcing portions is not limited to 2, and 3 or more reinforcing portions may be arranged on the opposite side of the circuit board to the fabric. In addition, the number of the reinforcing parts may be 1. In this case, the reinforcing portion may be, for example, a reinforcing portion formed by connecting 1 reinforcing portion in the case where the number of the reinforcing portions is 2 as shown in fig. 1 and 2. However, when the circuit mounted product is fixed to the fabric, the reinforcing portion may be disposed on the opposite side of the fabric to the circuit board so that the electronic component is surrounded by the circuit board and the fabric. This reduces the damage of the circuit component and the damage of the mounting structure (solder connection structure, etc.) of the circuit component.

The positional relationship between the reinforcing part and the electronic component in the circuit mounted product is not particularly limited, and examples thereof include the positional relationship shown in fig. 5. Fig. 5 is a diagram for explaining a positional relationship between the reinforcing part and the electronic component in the circuit mounted product. Fig. 5 is a plan view (a view from the side opposite to the fabric) showing another example of the circuit mounted product according to the embodiment of the present invention, but the wiring pattern is omitted in the figure. As shown in fig. 5, M represents a position that becomes a midpoint when the circuit mounted product is viewed in plan. When an arbitrary straight line passing through the midpoint M is drawn in a plan view of the circuit mounted product, a line segment d1 between ends of the circuit mounted product on the straight line is bisected at the midpoint M. When the plan view region of the circuit mounted product is divided into two by the line segment (line segment d1 in fig. 5) and each region is a region R1 and a region R2 (see fig. 5), the reinforcement portion may be disposed in at least a part of the region R1 and the reinforcement portion may be disposed in at least a part of the region R2. In addition, when an arbitrary straight line passing through the midpoint M is drawn in a plan view of the circuit mounted product, the reinforcement unit may be present in a line segment between the midpoint M and the end of the circuit mounted product, out of at least 1 line segment (corresponding to a line segment d2 in fig. 5) out of the arbitrary line segments (in fig. 5, the reinforcement unit 16a is present in a line segment d2 in the region R1, and the reinforcement unit 16b is present in a line segment d2 in the region R2). In addition, the reinforcing part and the electronic component may be configured in the following manner: in a plan view of the circuit mounted product, the "distance L2 from the midpoint M to the farthest point on the reinforcing portion" is longer than the "distance L3 from the midpoint M to the farthest point on the electronic component". By disposing the reinforcing part and the electronic component in this arrangement, when the circuit mounted product is fixed to the fabric, the electronic component is disposed so as to be surrounded by the circuit board and the fabric, and damage to the circuit component and damage to a mounting structure (solder connection structure or the like) of the circuit component can be reduced in the same manner as described above.

The reinforcing portion may be formed on the opposite side of the fabric of the circuit board by printing or the like, or may be formed by: a member to be used as the reinforcing portion is prepared, and the member is fixed to a region of the circuit board where the reinforcing portion is formed by an adhesive, solder, or the like.

As a material of the reinforcing portion, fibers, a curable resin composition, a thermoplastic resin composition, and the like can be cited from the viewpoint of reinforcement. Examples of the fibers include woven fabrics (woven fabrics), knitted fabrics (knit fabrics), knitted fabrics (woven fabrics), and non-woven fabrics (non-woven fabrics) which are generally used as fabrics. The fibers may be a combination of fibers of different forms. The curable resin composition is preferably a thermosetting resin composition, and examples thereof include silicone resins, urethane resins, epoxy resins, acrylic resins, fluororubbers, and the like. Examples of the thermoplastic resin contained in the thermoplastic resin composition include various rubbers such as ethylene-propylene-diene rubber, isoprene rubber, butadiene rubber, and chloroprene rubber, urethane resin, acrylic resin, and olefin resin. For the reinforcing portion that can be used in the present embodiment, olefin resins, acrylic resins, epoxy resins, and the like are preferable. The reinforcing portion may be formed of one or more of the above materials alone or in combination. For example, the fibers may be combined with the resin composition.

The circuit board 12 is not particularly limited as long as it has flexibility as described above, and its structure is not particularly limited. Examples of the circuit board 12 include: as shown in fig. 1 and 2, the present invention includes an insulating layer 13, and a substrate or the like which is provided on a surface or inside of the insulating layer 13 and includes a wiring pattern 14 formed of a conductor. When the circuit board 12 is a stretchable circuit board, the insulating layer 13 is referred to as a stretchable insulating layer having stretchability, the wiring pattern 14 is referred to as a stretchable wiring pattern, and the circuit mounted product 11 is referred to as a stretchable circuit mounted product.

[ Flexible Circuit Board ]

The flexible circuit board used in the present embodiment is not particularly limited as long as it is a flexible circuit board, and examples thereof include a circuit board having an elongation of less than 10%, preferably less than 5%. The flexible circuit board may have an elongation of less than 10% and a tensile modulus at 25 ℃ at room temperature of 10MPa or more, preferably 50MPa or more.

[ stretchable Circuit Board ]

The stretchable circuit board used in the present embodiment is not particularly limited as long as it is a board used as a stretchable circuit board. In addition, the stretchable insulating layer, the stretchable wiring, the stretchable circuit board, and the stretchable circuit mounted product in the present embodiment each have stretchability. The term "stretchable" as used herein means elastically deformable, and more specifically means having an elongation of 10% or more and a tensile modulus at 25 ℃ and room temperature of 0.5 to 500 MPa.

The elongation is 10% or more, preferably 25% or more, more preferably 50% or more, and further preferably 100% or more. The higher the elongation is, the more preferable, but the more preferable is 500% or less from the viewpoint that the thermoplastic resin tends to be plastically deformed to damage the original shape when the elongation is more than necessary. The tensile modulus at 25 ℃ and room temperature is 0.5 to 500MPa, preferably 1 to 300MPa, more preferably 2 to 200MPa, and still more preferably 2 to 100 MPa. When the elongation and the tensile modulus are within these ranges, the stretch-proof resin composition is easily deformed into an arbitrary shape, and for example, when a stretchable circuit board is attached to clothes or the like, the stretch-proof resin composition is excellent in followability to deformation of clothes. The tensile modulus is as follows: storage modulus at 25 ℃ as measured by temperature dependence measurement by tensile test using a dynamic viscoelasticity measuring apparatus. Examples of the dynamic viscoelasticity measuring apparatus include DMS6100 manufactured by Seiko instruments inc.

[ stretchable insulating layer ]

The resin composition used for the stretchable insulating layer is not particularly limited in composition as long as the cured product thereof has the properties such as the elongation and the tensile modulus.

Preferably, the resin composition includes a thermosetting resin and a curing agent thereof. More specifically, an example of the resin composition includes a resin composition containing a polyrotaxane (a), a thermosetting resin (B), and a curing agent (C). Hereinafter, each component will be described more specifically.

Specifically, the polyrotaxane (A) may be, for example, a polyrotaxane as described in Japanese patent publication No. 4482633 or International patent publication WO 2015/052853. As the polyrotaxane (a), a commercially available product, specifically, SeRM Super Polymer a1000 manufactured by Advanced soft materials Inc.

Examples of the thermosetting resin (B) include, but are not particularly limited to, thermosetting resins such as epoxy resins, phenol resins, polyimide resins, urea resins, melamine resins, unsaturated polyesters, and urethane resins, and among them, epoxy resins are preferably used.

Examples of the epoxy resin include bisphenol a type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, aralkyl epoxy resins, phenol novolac type epoxy resins, alkylphenol novolac type epoxy resins, biphenol type epoxy resins, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, epoxides of condensates of phenols and aromatic aldehydes having a phenolic hydroxyl group, triglycidyl isocyanurate, and alicyclic epoxy resins. These may be used alone in 1 kind or in combination of 2 or more kinds.

As the epoxy resin, for example, an epoxy resin containing 2 or more epoxy groups in 1 molecule and having a molecular weight of 500 or more can be preferably exemplified. As such an epoxy resin, a commercially available epoxy resin can be used, and examples thereof include JER1003 (molecular weight 1300, 2 functional, manufactured by Mitsubishi chemical Co., Ltd.), EXA4816 (molecular weight 824, 2 functional, manufactured by DIC Co., Ltd.), YP50 (molecular weight 60000 to 80000, 2 functional, manufactured by Nippon Tekko chemical Co., Ltd.), and the like.

Examples of the epoxy resin other than the epoxy resin include an epoxy resin having a modifying group modified with an alkylene oxide having 2 to 3 carbon atoms, containing 4mol or more of the modifying group in 1mol of the epoxy molecule, having 2mol or more of epoxy groups, and having an epoxy equivalent of 450eq/mol or more. By containing the epoxy resin as the thermosetting resin (B) and the curing agent (C), a resin composition having the elongation and the tensile modulus of a cured product thereof can be obtained. Specific examples of such epoxy resins include propylene oxide addition type bisphenol A epoxy resins (made by Adeka Corporation, EP4003S), ethylene oxide addition type hydroxyphenyl fluorene epoxy resins (made by Osaka Gas Chemicals Co., Ltd., EG-280), and the like. The epoxy resin may be used alone in 1 kind, or 2 or more kinds may be used in combination.

The resin composition containing the curing agent (C) and one component selected from the polyrotaxane (a) and the thermosetting resin (B) may be used, but from the viewpoint of easily obtaining a resin composition having the elongation and the tensile modulus as a cured product thereof, a resin composition containing both components ((a) and (B)) and the curing agent (C) is preferably used.

The curing agent (C) is not particularly limited as long as it functions as a curing agent for the thermosetting resin (B). In particular, as a curing agent that can be preferably used as the epoxy resin, phenolic resin, amine compound, acid anhydride, imidazole compound, thioether resin, bisamide, sulfonium salt curing agent, and the like are exemplified. The curing agent (C) may be used alone or in combination of 2 or more. The resin composition may contain a curing accelerator as needed. Examples of the curing accelerator include imidazole compounds.

In the resin composition, a crosslinking agent may be further added to the resin composition containing the polyrotaxane (a), and such a crosslinking agent is not particularly limited as long as it can form a crosslinked structure with at least a part of the cyclic molecules of the polyrotaxane (at least one reactive group of the cyclic molecules of the polyrotaxane).

The ratio of each component in the resin composition is not particularly limited as long as the effects of the present invention can be exerted, and for example, when all the components (a), (B), and (C) are contained, the polyrotaxane (a) is 10 to 80 parts by mass, more preferably about 30 to 50 parts by mass, when the total of the components (a) to (C) is 100 parts by mass; 10 to 89.9 parts by mass, more preferably 30 to 50 parts by mass of the thermosetting resin (B); the curing agent (C) is about 0.1 to 30 parts by mass, more preferably about 0.1 to 20 parts by mass. When the resin composition of the present embodiment contains an isocyanate resin as a crosslinking agent, the isocyanate resin may be added in an amount of 0 to 50 parts by mass, more preferably 10 to 40 parts by mass, based on the amount of the polyrotaxane (a) component. When the thermosetting resin composition contains the component (B) and the component (C) and does not contain the component (A), the amount of the thermosetting resin (B) is about 50 to 99 parts by mass, more preferably about 60 to 80 parts by mass, based on 100 parts by mass of the total amount of the resin composition; the curing agent (C) is about 1 to 50 parts by mass, more preferably about 1 to 40 parts by mass.

The resin composition may contain other additives such as a curing catalyst (curing accelerator), a flame retardant aid, a leveling agent, a colorant, and the like as needed within a range not to impair the effects of the present invention.

The method for producing the resin composition containing the epoxy resin is not particularly limited, and for example, the epoxy resin, the curing agent, and the solvent are mixed so as to be uniform. The solvent used is not particularly limited, and for example, toluene, xylene, methyl ethyl ketone, acetone, or the like can be used. These solvents may be used alone, or 2 or more kinds thereof may be used in combination. In addition, an organic solvent or various additives for adjusting viscosity may be added as needed.

By heating and drying the resin composition obtained as described above, the solvent can be evaporated and cured, thereby obtaining the insulating layer of the present embodiment.

The method and apparatus for heating and drying the resin composition, and the conditions therefor may be various means or modified means similar to those of the conventional ones. The specific heating temperature and time may be set as appropriate depending on the crosslinking agent, solvent, etc. used, and for example, the resin composition may be cured by heating and drying at 50 to 200 ℃ for about 60 to 180 minutes.

The thus obtained insulating layer (molded body which is a cured product of the above resin composition or the like) can be subjected to a surface treatment to stably form a wiring (conductive layer) on one surface thereof. In addition, various additives such as an antioxidant, a weather-resistant stabilizer, a flame retardant, an antistatic agent, and the like may be added within a range not to impair the characteristics thereof.

[ conductor layer ]

The circuit mounted product may further include a conductive layer on the side opposite to the fabric of the circuit board. Examples of the conductor layer include a metal foil, a wiring formed of a conductive composition, an extremely thin conductive layer to be coated, a conductive wire, and a metal molded product (metal molded product).

[ Metal foil ]

Examples of the metal foil include copper foil (plating), aluminum foil, and stainless steel foil, and these metal foils may be surface-treated with a silane coupling agent or the like.

When the conductor layer is formed using the metal foil, a laminate can be produced by stacking metal foils such as copper foils on the opposite sides of the fabric of the insulating layer, and then heating and pressing the stacked metal foils to form a laminate. Then, by forming a circuit (wiring) by etching or the like on the metal foil, a conductor layer (wiring) as a circuit can be provided on the surface of the insulating layer of the present embodiment. Examples of the circuit forming method include, in addition to the above-described methods, circuit formation by a Semi-Additive Process (SAP) or a Modified Semi-Additive Process (MSAP).

[ stretchable Wiring ]

The stretchable wiring is not particularly limited as long as it is a wiring having stretchability. Examples of the conductive stretchable material constituting the stretchable wiring include a conductive composition containing a conductive filler and a stretchable binder.

Specific examples of the conductive composition include the following resin compositions: comprising a resin (D) which is a stretchable binder, a curing agent (E) which reacts with the resin (D), and a conductive filler (F), wherein the resin (D) has a functional group equivalent of 400g/eq or more and 10000g/eq or less, and the cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) or a softening point of 40 ℃ or less, or an elastic modulus of less than 1.0GPa at 30 ℃, and the conductive filler (F) has an inherent volume resistivity of 1 x 10 at room temperature^-4And a conductive material having a thickness of not more than Ω · cm.

The respective components will be described below.

Specific examples of the conductive composition include the following resin compositions: comprising a resin (D) which is a stretchable binder, a curing agent (E) which reacts with the resin (D), and a conductive filler (F), wherein the resin (D) has a functional group equivalent of 400g/eq or more and 10000g/eq or less, and the cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) or a softening point of 40 ℃ or less, or an elastic modulus of less than 1.0GPa at 30 ℃, and the conductive filler (F) has an inherent volume resistivity of 1 x 10 at room temperature^-4And a conductive material having a thickness of not more than Ω · cm.

The weight average molecular weight of the resin (D) is preferably 5 ten thousand or more. Consider that: thus, when a conductive pattern or the like is printed using the conductive composition, bleeding is less likely to occur. On the other hand, the upper limit of the weight average molecular weight is not particularly limited, and when the molecular weight exceeds 300 ten thousand, the viscosity may be increased to lower the handling property, and therefore, the weight average molecular weight range of the resin (D) is preferably 5 ten thousand to 300 ten thousand, more preferably 10 ten thousand to 100 ten thousand.

As the curing agent (E), various curing agents can be used without particular limitation as long as they are reactive with the resin (D) as described above. Specific examples of the curing agent (E) include imidazole compounds, amine compounds, phenol compounds, acid anhydride compounds, isocyanate compounds, mercapto compounds, onium salts, radical acid generators such as peroxides, and photoacid generators.

The conductive filler (F) has an intrinsic volume resistivity of 1X 10 at room temperature^-4And a conductive material having a thickness of not more than Ω · cm. Intrinsic volume resistivity at room temperature of use exceeds 1 x 10^-4In the case of the material of Ω · cm, the volume resistivity of the conductive composition is about 1 × 10, although it depends on the amount of the material to be blended^-3Ω·cm～1×10^-2Omega cm. Therefore, when a circuit is formed, the resistance value increases, and the power loss increases.

As the above-mentioned conductive substance (intrinsic volume resistivity at room temperature is 1X 10)^-4Conductive material of Ω · cm or less), there can be exemplified: simple substances composed of metal elements such as silver, copper, and gold; compounds such as oxides, nitrides, carbides, alloys containing these elements, and the like. In the above-mentioned conductive composition, in addition to the conductive filler (F), a conductive assistant having conductivity or semiconductivity may be added for the purpose of further improving the conductivity. As the conductive or semiconductive auxiliary agent, a conductive polymer, an ionic liquid, carbon black, acetylene black, a carbon nanotube, an inorganic compound used for an antistatic agent, or the like can be used, and 1 kind or 2 or more kinds can be used at the same time.

The conductive filler (F) is preferably flat, and preferably has a thickness to length-thickness ratio of 10 or more in the in-plane longitudinal direction. When the aspect ratio is 10 or more, the surface area to mass ratio of the conductive filler is increased, and not only the conductivity efficiency is improved, but also the adhesion to the resin component is improved and the stretchability is improved. From the viewpoint that the length-thickness ratio is 1000 or less, and thus more favorable conductivity and printability can be ensured, it is preferably 10 or more and 1000 or less, and more preferably 20 or more and 1000 or lessBelow 500 a. As an example of the conductive filler having such an aspect ratio, a tap density of 6.0g/cm as measured by a tap method is mentioned³The following conductive fillers. And has a tap density of 2.0g/cm³In the following case, the length-thickness ratio is more preferably increased.

The blending ratio of the conductive filler (F) in the conductive composition is preferably 40 to 95% by mass, and more preferably 60 to 85% by mass, in terms of conductivity, cost, and printability, relative to the total amount of the conductive composition.

In addition to the above components, additives and the like may be added to the conductive composition according to the purpose. Examples of the additives include elastomers, surfactants, dispersants, colorants, fragrances, plasticizers, pH adjusters, viscosity modifiers, ultraviolet absorbers, antioxidants, and lubricants.

The particle size of the conductive filler (F) is not particularly limited, and the average particle diameter (particle diameter at 50% volume accumulation; D50) measured by a laser beam scattering method is preferably 0.5 to 30 μm, more preferably 1.5 to 20 μm, from the viewpoint of printability at the time of screen printing and achieving an appropriate viscosity in kneading of a compound.

The conductive filler (F) is preferably a conductive filler whose surface is subjected to a coupling treatment. Alternatively, the conductive composition may contain a coupling agent. This has the advantage of further improving the adhesion between the binder resin and the conductive filler.

The coupling agent added to the conductive composition or used for coupling the conductive filler may be used without any particular limitation as long as it is adsorbed on or reacts with the surface of the filler. Specific examples of the coupling agent include a silane coupling agent, a titanate coupling agent, and an aluminum coupling agent.

When the coupling agent is used in the conductive composition, the amount of the coupling agent added is preferably about 1 to 20% by mass based on the entire resin composition.

The ratio of each component in the conductive composition is not particularly limited as long as the effects of the present invention can be exerted, and the resin (D): the compounding ratio of the curing agent (E) may be appropriately determined in consideration of the equivalent ratio and the like, depending on the types of the resin and the curing agent.

In addition to the above components, additives and the like may be added to the conductive composition according to the purpose. Examples of the additives include elastomers, surfactants, dispersants, colorants, fragrances, plasticizers, pH adjusters, viscosity modifiers, ultraviolet absorbers, antioxidants, and lubricants.

The method for forming the stretchable wiring is not particularly limited, and examples thereof include a method in which the conductive composition is applied or printed on the insulating layer to form a coating film of the conductive composition, thereby forming a desired wiring (conductive pattern).

The conductive pattern formed by the wiring may be formed on the surface of the insulating layer by the following steps. That is, the conductive composition is first applied or printed on the insulating layer to form a coating film, and volatile components contained in the coating film are removed by drying. The conductive pattern composed of the stretchable wiring can be formed by a step of curing the resin (D) and the curing agent (E) (for example, a subsequent curing step such as heating, electron beam, or light irradiation) and a step of reacting the coupling agent with the conductive filler (F) and reacting the resin (D) and the curing agent (E). The conditions in the curing step and the reaction step are not particularly limited, and may be appropriately set according to the type of the resin, the curing agent, the filler, and the like, and the desired form.

The step of applying the conductive composition onto a substrate (on the stretchable insulating layer) is not particularly limited, and for example: coating methods for applicators, wire bars, comma rollers, gravure rollers, and the like; printing methods using silk screen, offset lithography, flexography, inkjet, stamping, dispensers, squeegees and the like.

In the circuit mounted product 11, as shown in fig. 6, at least a part of the electronic component 15 may be covered with a coating agent 17. Fig. 6 is a cross-sectional view showing another example of the circuit mounted product 11 according to the present embodiment. The circuit mounted product 11 shown in fig. 6 includes the circuit mounted product 11 shown in fig. 1 and a coating agent 17 for covering the electronic component 15. The coating agent 17 may be configured to cover a part of the electronic component 15, or may be configured to cover the whole electronic component 15. In the case where a plurality of electronic components are mounted on the circuit board, only a part of the plurality of electronic components may be covered with the coating agent, or all of the plurality of electronic components may be covered with the coating agent. With this configuration, at least a partial region of the irregularities on the outer surface of the electronic component is covered with the coating agent and smoothed, and therefore the fabric to which the circuit-mounted product is fixed is improved in skin touch and wearing feeling when it comes into contact with a human body. In addition, since at least a part of the electronic component is covered with the coating agent, the circuit mounted product has improved water resistance, for example, water resistance at the time of washing. In addition, since the electronic component is covered with the coating agent using the circuit board as a base, the connection strength between the electronic component and the circuit board can be improved.

The coating agent 17 is not particularly limited as long as it is used as a coating agent for covering electronic parts, and for example, the same material as the reinforcing portion can be used as the coating agent. By adopting this configuration, the reinforcing portion may be formed in a manufacturing process (assuming a printing process, a coating agent forming process using a dispenser, or the like) in which at least a part of the electronic component is covered with a coating agent. The cover portion and the reinforcing portion may be formed at the same time by, for example, printing, and the like, so that the production process can be made efficient. In addition, when the coating agent is in contact with and connected to a portion covering a covering portion of the electronic component and the reinforcing portion formed of the coating agent, both the covering portion and the reinforcing portion are firmly joined and fixed to the circuit board, and therefore, the risk of the covering portion or the reinforcing portion peeling off from the circuit board can be reduced.

Examples of the coating agent 17 include a curable resin composition and a thermoplastic resin composition. The curable resin composition is preferably a thermosetting resin composition, and examples thereof include silicone resins, urethane resins, epoxy resins, acrylic resins, fluororubbers, and the like. Examples of the thermoplastic resin contained in the thermoplastic resin composition include various rubbers such as ethylene-propylene-diene rubber, isoprene rubber, butadiene rubber, and chloroprene rubber, urethane resins, acrylic resins, and olefin resins. For the coating agent that can be used in the present embodiment, olefin resins, acrylic resins, epoxy resins, and the like are preferable.

The circuit mounted product 11 may be configured as follows: the coating agent 17 has an elastic modulus higher than that of the circuit board 12 and lower than that of the electronic component 15. Fig. 3 shows a configuration in the apparatus 4l in which the coating agent 17 is not applied to the electronic component 15. In fig. 3, X and Y areas indicate the vicinity of the end position of the electronic component on the side of the circuit board where a person or the like touches the setting surface. When the skin touches the X region and/or the Y region, the uneven feeling at the end of the electronic component is transmitted through the flexible circuit board, and there is a case where a sense of discomfort is given. On the other hand, in the apparatus 41, when at least a part of the area of the electronic component 15 is covered with the coating agent 17, the coating agent is disposed around the X area and the Y area as shown in fig. 7, and therefore, the apparatus functions as a buffer material that absorbs the concave-convex feeling of the end portions of the electronic component, and the uncomfortable feeling when a person comes into contact with the X area and/or the Y area can be reduced. If the elastic modulus of the coating agent is higher than that of the electronic component, the uneven feeling at the end of the covering portion formed by the coating agent is remarkably exhibited, and it is estimated that the skin feel is deteriorated, as in the electronic component. On the other hand, if the modulus of elasticity of the coating agent is lower than that of the circuit board, the function as a buffer material for absorbing the uneven feeling at the end of the electronic component is reduced, and it is estimated that the skin feel is deteriorated. Fig. 7 is a cross-sectional view showing another example of the apparatus 41 according to another embodiment of the present invention.

Here, the elastic modulus means: storage modulus at 25 ℃ measured by temperature-dependent measurement of a compression test, a shear test, a tensile test, or a bending test using a dynamic viscoelasticity measuring apparatus. Examples of the dynamic viscoelasticity measuring apparatus include DMS6100 manufactured by Seiko electronic Co.

The "elastic modulus of an electronic component" in the present application means: an elastic modulus of a portion of the electronic component having a lowest elastic modulus (in the case where there are a plurality of electronic components mounted on the circuit board, the elastic modulus of the portion of the electronic component having the lowest elastic modulus is referred to). As a specific example, the elastic modulus of a resin package of an electronic component or the like may correspond to "the elastic modulus of an electronic component" in the present application.

The "elastic modulus of the circuit board" in the present application means: and an elastic modulus of an insulating layer constituting the circuit board. Specifically, when the insulating layer is the stretchable insulating layer, the tensile modulus of the stretchable insulating layer can be mentioned.

The "elastic modulus of the coating agent" in the present application means: the modulus of elasticity of the coating agent used in the aforementioned coverage area.

The circuit mounted product 11 may be configured as follows: the distance between the reinforcing part and the electronic component is larger than the height of the electronic component. In the present application, the "distance between the reinforcing portion and the electronic component" means: a shortest distance between an end of the electronic component and an end of the reinforcing portion.

Fig. 8 is a plan view (a view from the opposite side of the fabric) showing another example of the circuit mounted product 11 according to the embodiment of the present invention, and is a view for explaining a distance between the reinforcing part and the electronic component. In fig. 8, a line segment connecting an end of the electronic component and an end of the reinforcing part may be drawn infinitely (L4, L5, L6, L7, and the like in fig. 8), but "the distance between the reinforcing part 16 and the electronic component 15" in the present application corresponds to L4 which is the shortest distance between the end of the electronic component 15 and the end of the reinforcing part 16. As shown in fig. 8, in the case where a plurality of electronic components are mounted on the circuit board, the "distance between the reinforcing portion 16 and the electronic component 15" in the present application means: and a length of a shortest line segment (L4) among line segments (L4, L7, and the like) connecting the end portions of the electronic components and the end portions of the reinforcing parts. Note that the above definition (starting from the end of the electronic component) is adopted even if the electronic component is covered with the coating agent.

The "height of the electronic component" in the present application means: in a circuit board on which an electronic component is mounted, the distance from a surface opposite to a fabric to a farthest position on the surface of the electronic component is measured in a vertical direction.

Fig. 9 is a cross-sectional view of the circuit mounted product 11 shown in fig. 8, as viewed from a cross-sectional line IX-IX, and is a view for explaining the height of the electronic component and the reinforcement portion. As the height of the electronic component in fig. 9, various lengths such as H1 and H2 can be measured, but the "height of the electronic component" in the present application corresponds to H2 which is the maximum height of the electronic component 15. Note that the above definition (starting from the position of the electronic component) is adopted even if the electronic component is covered with the coating agent.

In the case where the structure is adopted in which the distance between the reinforcement portion and the electronic component is greater than the height of the electronic component (for example, in the case where L4 is greater than H2 in fig. 9), the distance G between the electronic component and the fabric in the device (for example, the device shown in fig. 3, 7, and 11) can be easily ensured, and it is possible to avoid the situation in which the electronic component and the fabric are excessively brought into contact with each other and an excessive load is applied to the connection structure between the electronic component and the circuit board.

The circuit mounted product 11 may have a structure in which the height of the reinforcement portion 16 is larger than the height of the electronic component 15. The "height of the reinforcement" in the present application means: in the circuit board having the reinforcement unit mounted thereon, the distance from the surface opposite to the fabric to the farthest part on the surface of the reinforcement unit is measured in the vertical direction (the same concept as the height of the electronic component). As the height of the reinforcement in fig. 9, various lengths such as H3, H4, and H5 can be measured, but the "height of the reinforcement" in the present application corresponds to the maximum height of the reinforcement 16, i.e., H5.

By adopting the configuration in which the circuit mounted product has the portion where the height of the reinforcement portion 16 is larger than the height of the electronic component 15 (for example, in fig. 9, when H5 is larger than H2), even when the circuit mounted product is fixed to the fabric, the electronic component can be prevented from being strongly pressed against the fabric. This can prevent the electronic component from excessively adhering to the fabric and damaging the circuit mounted product.

The circuit board 12 may have the following configuration: as shown in fig. 10, the circuit board includes an insulating layer 13 and a wiring pattern 14 formed of a conductor and provided on the insulating layer 13, and the wiring pattern is present in at least a part of a region α of the circuit board 12 where the reinforcing portion 16 is formed. With this configuration, the strength of the region where the reinforcing portion is formed can be increased, and the risk of damage such as circuit board breakage when the reinforcing portion and the fabric are fixed by the fixing member can be reduced. Fig. 10 is a cross-sectional view showing another example of the circuit mounted product 11 according to the embodiment of the present invention.

The above-described apparatus 41 may take the following configuration: as shown in fig. 11, the wiring pattern 14 is present in the region α. In addition, the apparatus 41 may adopt the following manner: the fabric 42 and the circuit board 12 are fixed to each other via the reinforcing portion 16 by a fixing member (assumed to be, for example, a wire having conductivity or a metal member) having conductivity. In this case, a part of the fixing member having conductivity is exposed on the side of the circuit board where a person or the like touches the setting surface. In addition, a part of the fixing member having conductivity is also exposed on the a-side (see fig. 11) of the fabric. For example, by fixing the circuit-mounted product at a position of the circuit board of fig. 11 where the person or the like touches the setting surface and contacts the skin of the human body (assuming, for example, that the circuit-mounted product is fixed to the inside of the garment), it is also possible to use a fixing member exposed on the person or the like touch the setting surface as a probe for acquiring the human body information. In this case, the following configuration is adopted: the wiring pattern electrically connected to the fixing member having conductivity is also electrically connected to an electronic component for acquiring and processing a human body signal. Fig. 11 is a cross-sectional view showing another example of the device 41 according to another embodiment of the present invention.

As shown in fig. 12, a circuit mounted product 11 according to another embodiment of the present invention is a circuit mounted product fixed to a fabric, and includes: a flexible circuit board 12, an electronic component 15 mounted on the opposite side of the fabric of the circuit board 12 to the fabric, and a reinforcing portion 31(16) for fixing the circuit board 12 to the fabric. The reinforcement portion 31 is connected to the circuit board 12 and is used for fixing to the fabric. Fig. 12 is a cross-sectional view showing an example of a circuit mounted product 11 according to another embodiment of the present invention.

The reinforcing portion 31 is formed of a material having a higher elastic modulus than the insulating layer 13 of the circuit board 12. As a specific example of the circuit mounted product 11, first, the insulating layer 13 of the circuit board 12 is formed of a fiber base material and a resin impregnated into the fiber base material. Next, the reinforcing portion 31 is also formed of a fiber base material and a resin impregnated into the fiber base material, as in the insulating layer 13. And is set as: the fiber base material of the insulating layer 13 and the fiber base material of the reinforcing part 31 are continuously formed; as the resin used for the reinforcing portion 31 (resin impregnated into the fiber base material), a resin having a higher elastic modulus than the resin impregnated into the insulating layer 13 is used. With this configuration, when the circuit mounted product is fixed to the fabric via the reinforcing portion, the risk of damage to the reinforcing portion and thus damage to the circuit board can be reduced.

Examples of the resin used for the reinforcement portion 31 include a curable resin composition and a thermoplastic resin composition. The curable resin composition is preferably a thermosetting resin composition, and examples thereof include silicone resins, urethane resins, epoxy resins, acrylic resins, fluororubbers, and the like. Examples of the thermoplastic resin contained in the thermoplastic resin composition include various rubbers such as ethylene-propylene-diene rubber, isoprene rubber, butadiene rubber, and chloroprene rubber, urethane resins, acrylic resins, and olefin resins. For the coating agent that can be used in the present embodiment, olefin resins, acrylic resins, epoxy resins, and the like are preferable.

As shown in fig. 3, a device 41 according to another embodiment of the present invention includes: the circuit mounted product 11, the fabric 42, and a fixing member 43 for fixing the circuit mounted product 11 and the fabric 42. The reinforcing portion 16 and the fabric 42 are fixed to each other by a fixing member 43 so that the surface of the circuit mounted product 11 on which the electronic component 15 is mounted (fabric-facing surface) faces the fabric 42.

The fabric 42 is not particularly limited, and examples thereof include clothes. When the fabric 42 is a fabric constituting clothes, as an example of a position for fixing the circuit mounted product 11, it is assumed that: as shown in fig. 13 (a position which is located inside the garment and which is located near the back of the wearer's neck when the garment is worn by a person).

As an application target of the clothes 51 to which the circuit mounted article 11 is fixed, the following is conceived: the movement trajectory of the salesperson in the shop is obtained by wearing the clothing 51, and the movement state data of the athlete is obtained by wearing the clothing 51. Fig. 13 is a schematic view showing an example of the clothes to which the circuit mounted product of the present embodiment is fixed, and the fixing position of the circuit mounted product is not limited to this. For example, it is possible to envisage: the tag of the clothing may be replaced with the circuit mounted product, and the tag may be a candidate for the fixing position of the circuit mounted product, as long as the tag is located inside the clothing and the position is not likely to cause discomfort when worn.

The fixing member is not particularly limited in kind as long as it can fix the reinforcing portion and the fabric. Examples of the fixing member include an adhesive, a wire, and a metal fitting. As the wire used as the fixing member, a wire having conductivity (hereinafter, referred to as a conductive wire) may be used. In the case of the conductive wire, the fixing member may be used as an electrode, or may be used as a probe for obtaining human body state information by bringing the fixing member into contact with a human body or the like.

The device 41 may have 2 or more fixing positions at which the reinforcing part and the fabric are fixed by the fixing member, as shown in fig. 3, and may be configured to have a selection method of 2 fixing positions satisfying a condition that the length of the fabric existing between the arbitrarily selected 2 fixing positions is shorter than the length of the circuit mounted product existing between the selected 2 fixing positions.

In the present application, "the length of the fabric present between 2 arbitrarily selected fixed positions" means: the shortest line L1a is a length obtained by connecting 2 arbitrarily selected fixed positions to the surface along the surface side facing the circuit mounted product of the fabric (hereinafter referred to as the opposite side of the circuit mounted product). Here, since the fixed position of the surface of the fabric facing the circuit mounted product is not strictly point-like but planar, a position where the line segment connecting 2 fixed positions on the surface is shortest is selected. In the device shown in fig. 3, since 4 fixed positions (F1, F2, F3, and F4) exist on the side of the fabric facing the circuit mounted product, there are 6 candidates as the length of the fabric (the length on the surface of the fabric facing the circuit substrate) existing between 2 arbitrarily selected fixed positions out of the 4 fixed positions: a length from F1 to F3, a length from F1 to F4, a length from F2 to F3, a length from F2 to F4, a length from F1 to F2, and a length from F3 to F4.

In the present application, the term "length of the circuit mounted product existing between the selected 2 fixed positions" means: focusing on the 2 fixed positions selected when calculating the length of the fabric, the length of the shortest line L1b when the 2 fixed positions are connected along the surface on the fabric opposite side of the circuit board. Here, since the fixed position on the surface of the fabric facing the circuit board is not strictly point-like but planar, a position where the line segment connecting 2 fixed positions on the surface is shortest is selected. In fig. 3, since 4 fixed positions (f1, f2, f3, f4) exist on the fabric opposite surface side of the circuit board, there are 6 candidates as the length of the circuit mounted product (the length on the fabric opposite surface of the circuit board) existing between 2 arbitrarily selected ones of the 4 fixed positions, that is: a length from f1 to f3, a length from f1 to f4, a length from f2 to f3, a length from f2 to f4, a length from f1 to f2, and a length from f3 to f 4.

Based on the above definition, "a method of selecting 2 fixed positions that satisfy the condition that the length of the fabric present between arbitrarily selected 2 fixed positions is shorter than the length of the circuit mounted product present between the selected 2 fixed positions" means that: when 2 fixed positions are arbitrarily selected from a plurality of fixed positions, there is a method of selecting a fixed position in which the length of the fabric present between the 2 fixed positions is shorter than the length of the circuit mounted product. Hereinafter, the above definition will be described based on the apparatus shown in fig. 3. For example, focusing on the fixing positions F1 and F3 and the fixing positions F1 and F3 corresponding thereto, the lengths of the fabric at the fixing positions F1 to F3 and the lengths of the circuit mounted products at the fixing positions F1 to F3 are compared. Similarly, the lengths of the fabrics at the fixing positions F1 to F4 and the lengths of the circuit packages at the fixing positions F1 to F4 are compared. The length of the fabric and the length of the circuit mounted product were compared between all combinations thereof (in addition, the combination of F2 to F3 and F2 to F3, the combination of F2 to F4 and F2 to F4, the combination of F1 to F2 and F1 to F2, and the combination of F3 to F4 and F3 to F4, 6 combinations in total). Comparison of the lengths was made among all the combinations, and as a result, the length of the fabric was shorter than that of the circuit mounted product in 4 combinations of the combination of F1 to F3 and F1 to F3, the combination of F1 to F4 and F1 to F4, the combination of F2 to F3 and F2 to F3, and the combination of F2 to F4 and F2 to F4. It can therefore be said that: the configuration shown in fig. 3 is configured in such a manner that there is a selection method of 2 fixed positions, where the 2 fixed positions satisfy a condition that the length of the fabric existing between the arbitrarily selected 2 fixed positions is shorter than the length of the circuit mounted product existing between the selected 2 fixed positions. The device thus configured does not press the electronic component against the fabric so much, and therefore, it is possible to suppress occurrence of a conduction failure or the like between the electronic component and a wiring pattern on a circuit board.

The position of the circuit mounted product fixed to the clothing is not particularly limited as long as the electronic component of the circuit mounted product can operate satisfactorily. As the fixing position of the circuit mounted product 11 in the clothing 51, it is assumed that: for example, any position of the inner region of the clothing 51 when the clothing is worn. By fixing the circuit-mounted component to the region, the circuit-mounted component is not exposed to the outside when a person wears the clothes, and the design of the clothes is not impaired. In the inner area of the clothes, particularly, the area where the display target such as the material of the clothes is fixed at present, for example, the upper area or the lower area on the back side, may be a candidate position for the fixed position. As an example, as shown in fig. 13, assume that: and fixing the circuit installation article on the inner side area of the clothes and hanging the clothes on the clothes hanger to approach the position of the clothes hanger.

The above apparatus may be configured as follows: in the case where the fabric is a fabric constituting clothes (see fig. 13), the circuit mounted article is fixed at a position such that: when the clothes are hung on a clothes hanger having an electronic component for power transmission capable of performing non-contact communication or non-contact power supply with the electronic component of the circuit mounted product, the electronic component of the circuit mounted product can perform non-contact communication or non-contact power supply with the electronic component for power transmission. In this case, the clothes hanger may be configured as follows: the electronic component of the circuit mounted product is provided with the electronic component for power transmission at a position where the electronic component can perform non-contact communication or non-contact power supply with the electronic component for power transmission. Specifically, as shown in fig. 14, the clothes hanger 61 is configured such that the power transmitting electronic part 62 is disposed in a partial region of a frame portion of the clothes hanger. With this configuration, it is possible to realize non-contact communication between the electronic component provided in the circuit-mounted product and the power transmission electronic component provided in the clothes hanger only by hanging the clothes provided with the circuit-mounted product on the clothes hanger. In this case, the device can transmit data held in the electronic component included in the circuit mounted product to the power transmitting electronic component, or can transmit data from the power transmitting electronic component to the electronic component of the circuit mounted product. The device may be configured to transmit electric power from the power transmission electronic component to the electronic component of the circuit mounted product. It is needless to say that the power transmission electronic component and the electronic component of the circuit mounted product include modules (e.g., an antenna and the like) necessary for wireless communication and wireless power transmission. Fig. 14 is a schematic view showing an example of a clothes hanger for hanging clothes to which the circuit mounted product according to the embodiment of the present invention is fixed.

The clothes hanger may be configured such that the power transmission electronic component is detachable. This can improve the convenience of operations such as charging the power transmitting electronic component and transferring data (data received from the circuit mounted product) accumulated in the power transmitting electronic component to another device. For example, when the clothes are wet by sweat or the like after exercise or the like, which hinders the clothes from being hung on the clothes hanger, the power transmission electronic component may be detached from the clothes hanger and disposed only in the vicinity of a circuit mounted product fixed to the clothes. This makes it possible to transfer necessary data from the electronic component constituting the circuit mounted product. As a result, the user can confirm the activity data such as the amount of exercise immediately after the exercise.

The application is based on Japanese patent application laid-open at 2019, 4 and 18, and the contents of the Japanese patent application laid-open at 2019 and 079143 are included in the application.

The present invention has been described in terms of embodiments in order to describe the present invention, but it should be understood that modifications and/or improvements to the embodiments described above will be readily apparent to those skilled in the art. Therefore, a modified embodiment or an improved embodiment that a person skilled in the art carries out is to be construed as being included in the scope of the claims as long as the modified embodiment or the improved embodiment does not depart from the scope of the claims described in the claims.

Industrial applicability

According to the present invention, a circuit mounted product capable of being favorably fixed to a fabric and a device in which the circuit mounted product is favorably fixed to a fabric can be provided.