阅读说明：本技术 一种无极性电容器及其制造方法 (Non-polar capacitor and manufacturing method thereof ) 是由 陈绪鑫 张海明 崔华楠 曹瑞 陈雁 潘齐凤 陈琛 靳博 王艳 于 2021-09-01 设计创作，主要内容包括：本申请提供了一种无极性电容器及其制造方法,涉及电容器技术领域。无极性电容器制造方法包括：提供多个电容芯子,电容芯子的数量为偶数,每个电容芯子均包括正极和负极；堆叠设置所述多个电容芯子形成堆叠体,其中,在所述堆叠体中,所有的所述电容芯子的负极相互之间电导通,半数的电容芯子的正极朝向第一方向设置,半数的电容芯子的正极朝向第二方向设置,所述第二方向不同于所述第一方向；将朝向第一方向设置的正极与第一引线框架电连接,将朝向第二方向设置的正极与第二引线框架电连接,得到无极性电容器。通过特定的堆叠方式设置电容芯子,由于引线框架连接的都是电容芯子正极,因此电容器无极性之分,能够在更多的电路中使用。(The application provides a non-polar capacitor and a manufacturing method thereof, and relates to the technical field of capacitors. The manufacturing method of the non-polar capacitor comprises the following steps: providing a plurality of capacitor cores, wherein the number of the capacitor cores is even, and each capacitor core comprises an anode and a cathode; stacking the plurality of capacitor cores to form a stacked body in which cathodes of all the capacitor cores are electrically conducted to each other, anodes of a half number of the capacitor cores are arranged toward a first direction, and anodes of a half number of the capacitor cores are arranged toward a second direction different from the first direction; the positive electrode facing the first direction is electrically connected to the first lead frame, and the positive electrode facing the second direction is electrically connected to the second lead frame, thereby obtaining a nonpolar capacitor. The capacitor cores are arranged in a specific stacking mode, and the lead frames are connected with the positive electrodes of the capacitor cores, so that the capacitor is nonpolar and can be used in more circuits.)

1. A method of fabricating a non-polar capacitor, comprising:

providing a plurality of capacitor cores, wherein the number of the capacitor cores is even, and each capacitor core comprises a positive electrode and a negative electrode;

stacking the plurality of capacitor cores to form a stacked body in which cathodes of all the capacitor cores are electrically conducted to each other, and anodes of a half number of the capacitor cores are arranged in a first direction and anodes of a half number of the capacitor cores are arranged in a second direction different from the first direction;

and electrically connecting the positive electrode arranged towards the first direction with a first lead frame, and electrically connecting the positive electrode arranged towards the second direction with a second lead frame to obtain the non-polar capacitor.

2. The method of claim 1, wherein after obtaining the non-polar capacitor, the method further comprises: and packaging the non-polar capacitor.

3. The method of claim 2, wherein after said encapsulating said non-polar capacitor, said method further comprises: and applying voltage to the non-polar capacitor at a preset temperature for aging.

4. The method of claim 3, wherein aging the non-polar capacitor comprises: applying a first voltage to the non-polar capacitor for carrying out primary aging; and applying a second voltage to the non-polar capacitor for the second aging, wherein the voltage directions of the first voltage and the second voltage are opposite.

5. The method of claim 1, wherein electrically connecting the positive electrode facing the first direction to a first lead frame and the positive electrode facing the second direction to a second lead frame to obtain a non-polar capacitor, comprises:

when a first minimum distance between a positive electrode arranged in the first direction and the first lead frame exceeds a first preset threshold value, arranging a first connecting conductor between the positive electrode arranged in the first direction corresponding to the first minimum distance and the first lead frame, wherein the first connecting conductor is electrically connected with the positive electrode and the first lead frame respectively; and/or when the distance between two adjacent anodes arranged towards the first direction exceeds a second preset threshold value, arranging a second connecting conductor between the two adjacent anodes, wherein the second connecting conductor is electrically connected with the two adjacent anodes respectively; and/or when a second minimum distance between the positive electrode arranged towards the second direction and the second lead frame exceeds a third preset threshold value, a third connecting conductor is arranged between the positive electrode arranged towards the second direction and the second lead frame corresponding to the second minimum distance, and the third connecting conductor is electrically connected with the positive electrode and the second lead frame respectively; and/or when the distance between two adjacent anodes arranged towards the second direction exceeds a fourth preset threshold value, a fourth connecting conductor is arranged between the two adjacent anodes, and the fourth connecting conductor is electrically connected with the two adjacent anodes respectively.

6. A non-polar capacitor, comprising:

a plurality of capacitor cores, the number of the capacitor cores being an even number, each of the capacitor cores including a positive electrode and a negative electrode, wherein the capacitor cores are stacked to form a stacked body in which the negative electrodes of all the capacitor cores are electrically connected to each other, a half of the positive electrodes of the capacitor cores are disposed toward a first direction, and a half of the positive electrodes of the capacitor cores are disposed toward a second direction, the second direction being different from the first direction;

the lead frame comprises a first lead frame and a second lead frame, wherein the positive pole arranged towards the first direction is electrically connected with the first lead frame, and the positive pole arranged towards the second direction is electrically connected with the second lead frame.

7. The non-polar capacitor of claim 6, further comprising: a connection conductor configured to, when a first minimum distance between a positive electrode disposed in the first direction and the first lead frame exceeds a first preset threshold, dispose a first connection conductor between the positive electrode disposed in the first direction corresponding to the first minimum distance and the first lead frame, the first connection conductor being electrically connected to the positive electrode and the first lead frame, respectively;

the connecting conductor is also used for arranging a second connecting conductor between two adjacent anodes when the distance between the two adjacent anodes arranged towards the first direction exceeds a second preset threshold value, and the second connecting conductor is electrically connected with the two adjacent anodes respectively;

the connecting conductor is further used for arranging a third connecting conductor between the anode arranged towards the second direction and the second lead frame corresponding to a second minimum distance when the second minimum distance between the anode arranged towards the second direction and the second lead frame exceeds a third preset threshold value, and the third connecting conductor is electrically connected with the anode and the second lead frame respectively;

the connecting conductor is further used for arranging a fourth connecting conductor between the two adjacent anodes when the distance between the two adjacent anodes arranged towards the second direction exceeds a fourth preset threshold value, and the fourth connecting conductor is electrically connected with the two adjacent anodes respectively.

8. The non-polar capacitor according to claim 6, wherein the capacitor core comprises:

forming a foil, wherein the surface of the formed foil is an oxide film;

the isolating glue is arranged at a preset position on the formed foil and is used for separating the formed foil into the anode and the cathode;

the electrolyte layer covers the surface of the oxide film of the cathode;

the graphite layer covers the surface of the electrolyte layer;

and the silver paste layer covers the surface of the graphite layer.

9. The non-polar capacitor of claim 8, wherein the oxide film structure of the stack comprises: a first oxide film and a second oxide film; wherein, in the capacitor element having a positive electrode provided in the first direction, the oxide film connected to the electrolyte layer in the negative electrode is the first oxide film; and a second oxide film of the oxide film connected to the electrolyte layer in the negative electrode in the capacitor element in which the positive electrode is provided in the second direction.

10. The non-polar capacitor of claim 6, further comprising: and the plastic package body shell is used for wrapping the stacked body in the plastic package body shell, and the plastic package body shell is also used for wrapping the lead frame connected with the positive electrode in the plastic package body shell.

Technical Field

The invention relates to the technical field of capacitors, in particular to a non-polar capacitor and a manufacturing method thereof.

Background

The conductive polymer sheet type laminated aluminum electrolytic capacitor is an electronic component using a conductive polymer material with high conductivity as a solid electrolyte. The aluminum electrolytic capacitor has the characteristics of low equivalent series resistance, excellent frequency characteristic, benign failure mode (difficult to burn), miniaturization and the like due to the characteristics of structure and material, and is widely applied to various fields of communication infrastructure, servers, CPU/FPGA/CPU power circuits and the like.

The existing conductive polymer chip type laminated aluminum electrolytic capacitor also has the characteristic of large capacity, so that the capacitor can play the roles of energy storage and filtering after being connected with a circuit of a low frequency band or a medium frequency band. However, because the existing chip-type laminated aluminum electrolytic capacitor has polarity, i.e. has a positive electrode and a negative electrode, the aluminum electrolytic capacitor needs to be correspondingly installed according to the positive electrode and the negative electrode in the using process, and the breakdown failure of the aluminum electrolytic capacitor can be caused after the positive electrode and the negative electrode are connected reversely, so that great potential safety hazard is generated. This limits the range of use of the chip-type laminated aluminum electrolytic capacitor, making it unusable in some circuits. For example, in a circuit for transmitting an alternating current signal, due to polarity, alternating current generates current and voltage in different directions in the use process, and once the direction of the current and voltage is changed, the chip type laminated aluminum electrolytic capacitor is broken down and fails. Therefore, the chip-type laminated aluminum electrolytic capacitor cannot be applied to some fields or circuits, only a non-polar capacitor can be used in a circuit for transmitting alternating current signals such as a coupler or a pure alternating current circuit, and the existing non-polar capacitor generally has a small capacitance value and cannot be applied to a circuit of a low frequency band or a medium frequency band.

Disclosure of Invention

In view of the above, the present invention provides a non-polar capacitor and a manufacturing method thereof, which can expand the application range of the chip-type laminated aluminum electrolytic capacitor and make the chip-type laminated aluminum electrolytic capacitor well usable in the reverse connection of power supplies or in the ac circuits of different frequency bands, aiming at the problems that the conductive polymer chip-type laminated aluminum electrolytic capacitor in the prior art cannot be used in a part of circuits due to the polarity, and the conventional non-polar capacitor has a small capacitance value and cannot be used at frequencies of medium and low frequency bands.

In order to achieve the above object, embodiments of the present application are implemented as follows:

in a first aspect, an embodiment of the present application provides a method for manufacturing a non-polar capacitor, including: providing a plurality of capacitor cores, wherein the number of the capacitor cores is even, and each capacitor core comprises a positive electrode and a negative electrode; stacking the plurality of capacitor cores to form a stacked body in which cathodes of all the capacitor cores are electrically conducted to each other, and anodes of a half number of the capacitor cores are arranged in a first direction and anodes of a half number of the capacitor cores are arranged in a second direction different from the first direction; and electrically connecting the positive electrode facing to the first direction with a first lead frame, and electrically connecting the positive electrode facing to the second direction with a second lead frame to obtain the non-polar conductive polymer sheet type laminated aluminum capacitor, namely the non-polar capacitor.

In this embodiment, a stacked body is formed by changing the stacking manner of the capacitor cores of the conductive polymer sheet type stacked aluminum electrolytic capacitor, and the positive electrode of the capacitor core in the stacked body is connected by the lead frame, so that not only the characteristics of the conductive polymer sheet type stacked aluminum electrolytic capacitor are retained, but also the manufactured capacitor is changed into a non-polar capacitor.

In an embodiment, after the obtaining the non-polar capacitor, the method further includes: and packaging the non-polar capacitor.

In the embodiment, the non-polar capacitor is packaged, so that the non-polar capacitor can be protected, and good effects can be achieved in different working environments.

In an embodiment, after said encapsulating said non-polar capacitor, said method further comprises: and applying voltage to the non-polar capacitor at a preset temperature for aging.

In this embodiment, the capacitor core has an oxide film dielectric layer, the formed stacked body also has an oxide film dielectric layer at a corresponding position, and the non-polar capacitor is aged, so that damage to the oxide film dielectric layer which may occur when the capacitor core is stacked to form the stacked body or packaged can be repaired, and defective products can be removed.

In one embodiment, the applying the voltage to the non-polar capacitor for aging includes: applying a first voltage to the non-polar capacitor for carrying out primary aging; and applying a second voltage to the non-polar capacitor for the second aging, wherein the voltage directions of the first voltage and the second voltage are opposite.

In this example, a unidirectional aging only repairs the capacitor core dielectric layer in the stack in the direction of the applied voltage. After the plurality of capacitor cores are stacked, the anodes of half of the capacitor cores face the first direction, the anodes of half of the capacitor cores face the second direction, namely, the anodes are arranged in the first direction and the second direction, the formed stacked body structure is nonpolar, and the anodes are arranged at two ends, so that aging voltage is applied to two ends to repair the capacitor core dielectric layers, therefore, the anodes at the two ends of the nonpolar capacitor are aged by applying voltages in different directions, so that two oxide film dielectric layers in the stacked body in the nonpolar capacitor can be repaired, the oxide film dielectric layers are more stable, and defective products can be removed.

In one embodiment, the electrically connecting the positive electrode facing the first direction to the first lead frame and the electrically connecting the positive electrode facing the second direction to the second lead frame to obtain the non-polar capacitor includes: when a first minimum distance between a positive electrode arranged in the first direction and the first lead frame exceeds a first preset threshold value, arranging a first connecting conductor between the positive electrode arranged in the first direction corresponding to the first minimum distance and the first lead frame, wherein the first connecting conductor is electrically connected with the positive electrode and the first lead frame respectively; and/or when the distance between two adjacent positive electrodes arranged towards the first direction exceeds the second preset threshold value, arranging a second connecting conductor between the two adjacent positive electrodes, wherein the second connecting conductor is electrically connected with the two adjacent positive electrodes respectively; and/or when a second minimum distance between the positive electrode arranged towards the second direction and the second lead frame exceeds a third preset threshold value, a third connecting conductor is arranged between the positive electrode arranged towards the second direction and the second lead frame corresponding to the second minimum distance, and the third connecting conductor is electrically connected with the positive electrode and the second lead frame respectively; and/or when the distance between two adjacent positive electrodes arranged towards the second direction exceeds a fourth preset threshold value, arranging a fourth connecting conductor between the two adjacent positive electrodes, wherein the fourth connecting conductor is electrically connected with the two adjacent positive electrodes respectively.

In this embodiment, because the capacitor core has a certain thickness, the two anodes in the same direction of the stacked body may have a longer distance, or the lead frame may be arranged at a position farther from the anodes, so that the electrical connection between the anodes and the lead frame may be realized by arranging the connecting conductor, and on the other hand, the height difference between the anodes and the lead frame may be reduced, thereby preventing the capacitor core from being bent to affect the electrical performance.

In a second aspect, an embodiment of the present application provides a non-polar capacitor, including: a plurality of capacitor cores, the number of the capacitor cores being an even number, each of the capacitor cores including a positive electrode and a negative electrode, wherein the capacitor cores are stacked to form a stacked body in which the negative electrodes of all the capacitor cores are electrically connected to each other, a half of the positive electrodes of the capacitor cores are disposed toward a first direction, and a half of the positive electrodes of the capacitor cores are disposed toward a second direction, the second direction being different from the first direction; the lead frame comprises a first lead frame and a second lead frame, wherein the positive pole arranged towards the first direction is welded with the first lead frame, and the positive pole arranged towards the second direction is welded with the second lead frame.

In the embodiment, the negative electrodes of the capacitor cores are electrically connected, half of the positive electrodes of the capacitor cores are in the first direction, and half of the positive electrodes of the capacitor cores are in the second direction and are respectively connected with the electrodes formed by the lead frames, so that the led-out electrodes are connected with the positive electrodes of the capacitor cores, the capacitor has no polarity, and the capacitor can normally work no matter the capacitor is connected into a circuit from the first direction or the second direction. Because the used capacitor core has the same characteristics of the capacitor core of the conductive polymer sheet type laminated aluminum electrolytic capacitor, the formed stacked body also has the characteristics of the conductive polymer sheet type laminated aluminum electrolytic capacitor, namely the non-polar capacitor is a non-polar laminated aluminum capacitor with large capacity, the application frequency range and the circuit application range of the laminated aluminum capacitor are widened, and the failure caused by reverse connection is avoided.

In one embodiment, the non-polar capacitor further comprises: a connection conductor configured to, when a first minimum distance between a positive electrode disposed in the first direction and the first lead frame exceeds a first preset threshold, dispose a first connection conductor between the positive electrode disposed in the first direction corresponding to the first minimum distance and the first lead frame, the first connection conductor being electrically connected to the positive electrode and the first lead frame, respectively; the connecting conductor is also used for arranging the second connecting conductor between two adjacent anodes when the distance between the two adjacent anodes arranged towards the first direction exceeds the second preset threshold value, and the second connecting conductor is respectively electrically connected with the two adjacent anodes; the connecting conductor is further used for arranging a third connecting conductor between the anode arranged towards the second direction and the second lead frame corresponding to a second minimum distance when the second minimum distance between the anode arranged towards the second direction and the second lead frame exceeds a third preset threshold value, and the third connecting conductor is electrically connected with the anode and the second lead frame respectively; the connecting conductor is further configured to set the fourth connecting conductor between the two adjacent anodes when a distance between the two adjacent anodes disposed toward the second direction exceeds the fourth preset threshold, and the fourth connecting conductor is electrically connected to the two adjacent anodes, respectively.

In this embodiment, the capacitor core has a certain thickness, and the preset position of the lead frame may not be changed at will due to reasons such as manufacturing process, so that the anodes in the same direction may be far away from the lead frame due to different stacking sequences, and the electrical connection between the anodes and the lead frame is realized through the connecting conductors.

In one embodiment, the capacitor core comprises a formed foil, wherein the surface of the formed foil is an oxide film; the isolating glue is arranged at a preset position on the formed foil and is used for separating the formed foil into the anode and the cathode; the electrolyte layer covers the surface of the oxide film of the cathode; the graphite layer covers the surface of the electrolyte layer; and the silver paste layer covers the surface of the graphite layer.

In this embodiment, a capacitor core is provided, where the capacitor core includes a formed foil made of an anodized formed foil material, the formed foil is oxidized by treatment to form an oxide film on the surface, the positive electrode and the negative electrode of the formed foil are separated by an isolating glue, so that a capacitance value of the capacitor core can be changed, an electrolyte layer covers the oxide film, and a graphite layer and a silver paste layer cover the oxide film to protect the electrolyte layer, and at the same time, the negative electrode has good conductivity.

In one embodiment, the oxide film structure of the stack includes: and a first oxide film and a second oxide film, wherein the oxide film connected to the electrolyte layer in the negative electrode is the first oxide film in the capacitor element in which the positive electrode is provided in the first direction, and wherein the oxide film connected to the electrolyte layer in the negative electrode is the second oxide film in the capacitor element in which the positive electrode is provided in the second direction.

In this embodiment, after the foil formation surface of the capacitor element in the stacked body is treated, the surface is covered with an oxide film, so that the surface of the negative electrode part also has an oxide film, and the electrolyte layer covers the surface of the oxide film, and since the capacitor element is divided into two parts, the positive electrodes respectively face the first direction and the second direction, so that the pair of capacitor elements, the positive electrodes respectively face the first direction and the second direction, and the negative electrodes are connected to form the stacked body, and at least two oxide films thereof are respectively a first oxide film and a second oxide film, so that the capacitor formed after being connected to the electrodes is non-polar.

In one embodiment, the non-polar capacitor further comprises a plastic package housing for enclosing the stacked body in the plastic package housing, and the plastic package housing is further used for enclosing a portion of the lead frame connected to the positive electrode in the plastic package housing.

In this embodiment, the plastic package housing manufactured by using the package protects the non-polar capacitor, specifically, protects the stacked body and a part of the lead frame connected to the stacked body from directly contacting with the outside air, so that the capacitor can be used in different working environments.

Additional features and advantages of the disclosure will be set forth in the description which follows, or in part may be learned by the practice of the above-described techniques of the disclosure, or may be learned by practice of the disclosure.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a structural diagram of a non-polar capacitor provided in an embodiment of the present application;

FIG. 2 is a cross-sectional view of a capacitor core according to an embodiment of the present application;

fig. 3 is a simplified cross-sectional structure of a non-polar capacitor according to an embodiment of the present disclosure;

FIG. 4 is a circuit diagram of a non-polar capacitor according to an embodiment of the present disclosure;

fig. 5 is a flowchart of a method for manufacturing a non-polar capacitor according to an embodiment of the present disclosure.

Icon: a capacitor core 100; a positive electrode 110; a negative electrode 120; an electrolyte layer 121; a graphite layer 122; a silver paste layer 123; a release adhesive 130; a lead frame 200; a first lead frame 210; a second lead frame 220; a connecting conductor 300; the plastic package body case 400.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1, fig. 1 is a structural diagram of a non-polar capacitor according to an embodiment of the present disclosure, the non-polar capacitor includes: capacitor core 100, lead frame 200.

In one embodiment, the number of the capacitor cores 100 is plural and even. Each capacitor core 100 includes a positive electrode 110 and a negative electrode 120.

In this embodiment, the structure of each capacitor core 100 is the same, and the electrical properties of each capacitor core 100 may be the same. The electrical properties here include capacitance, rated voltage, etc. The electrical properties of each capacitor core 100 may have a certain error due to manufacturing reasons, and the like, the electrical properties being the same in this application means that the electrical properties of each capacitor core 100 have an error within a certain range, for example, the capacitance value error range of the capacitor is XXX, and the error range of the rated voltage is XXX. It is understood that one skilled in the art can set the error range according to actual requirements and required product performance, and the application is not limited thereto.

In one embodiment, the lead frame 200 includes a first lead frame 210 and a second lead frame 220, which are connected to the capacitor core positive electrode 110 in the first direction and the capacitor core positive electrode 110 in the second direction, respectively.

Referring to fig. 2, fig. 2 is a cross-sectional view of a capacitor core according to an embodiment of the present application.

In one embodiment, capacitor core 100 comprises a foil; the isolating glue 130 is arranged at a preset position on the formed foil, and the isolating glue 130 is used for separating the formed foil into the anode 110 and the cathode 120; an electrolyte layer 121 covering the surface of the negative electrode; the graphite layer 122 covers the surface of the electrolyte layer 121, and the silver paste layer 123 covers the surface of the graphite layer 122.

In this embodiment, the monolithic capacitor core 100 is manufactured by foil formation, and the manufacturing method will be described later, and only the structure of the capacitor core 100 will be described here. The formed foil can be made of anode aluminum foil, and after the formed foil is treated, the surface of the formed foil is provided with an oxide film dielectric layer, namely the formed foil comprises an aluminum core and the oxide film dielectric layer on the surface of the aluminum core. The monolithic formed foil may be a formed aluminum foil having a certain width, which is set according to a capacity value of the capacitor. The singulated foils include a positive electrode 110 and a negative electrode 120 separated by a separator paste 130. The isolation glue 130 is disposed (for example, by coating) at a predetermined position on the surface of the formed foil, so as to divide the formed foil into a positive electrode and a negative electrode, and the predetermined position is set according to the requirement or the capacitance value of the capacitor. It is understood that the separator paste 130 is applied at one end to serve as the positive electrode 110 and at the other end to form the negative electrode 120 after being processed (e.g., covered with an electrolyte). The negative electrode 120 includes an electrolyte layer 121, a graphite layer 122, and a silver paste layer 123, wherein the electrolyte layer is a cathode electrolyte of a highly conductive molecular polymer and has high conductivity, and wherein the negative electrode is coated on a surface of the formed foil, i.e., an oxide film surface. The surface of the electrolyte layer 121 is covered with the graphite layer 122, the surface of the graphite layer 122 is covered with the silver paste layer 123 with high conductivity, both graphite and silver paste have good conductivity and stability, and the performance of conductivity and stress resistance of the monolithic capacitor core 100 can be improved by covering the graphite layer 122 and the silver paste layer 123.

With continued reference to fig. 1, in one embodiment, the stacked arrangement of capacitor cores 100 forms a stack in which all of the capacitor cores ' cathodes 120 are in electrical communication with each other, half of the capacitor cores ' anodes 110 are oriented in a first direction, and half of the capacitor cores ' anodes 110 are oriented in a second direction, the second direction being different from the first direction.

In this embodiment, the number of the positive electrodes of the capacitor cores disposed in the first direction and the second direction is the same as the number of the positive electrodes of the capacitor cores disposed in the first direction and the second direction, so that the number of the capacitor cores is even, and the positive electrodes 110 of half of the capacitor cores 100 face the first direction and the positive electrodes 110 of half of the capacitor cores 100 face the second direction. It is understood that the present embodiment has no requirement for the stacking order of the capacitor cores 100, as long as each half of the positive electrodes in different directions is satisfied.

In this embodiment, the capacitance of the non-polar capacitor is determined by the capacitance and the number of capacitor cores 100 in the stack. Specifically, the capacitance of the non-polar capacitor is calculated as:

C＝1/(1/C1+1/C2+…1/Cn)

wherein, C1 and C2 … Cn are capacitance values of each capacitor core, respectively, n in Cn is an even number, the smaller n is, the larger capacitance value is, and the specific capacitance value can be specifically set according to actual requirements. Since the capacitor cores 100 of the same voltage are stacked, the rated voltage of the final stacked body or non-polar capacitor is the same as the voltage of the monolithic capacitor core 100.

Referring to fig. 3, fig. 3 is a simplified structure of a non-polar capacitor according to an embodiment of the present disclosure.

In one embodiment, the physical structure of the stack comprises: a first oxide film and a second oxide film, wherein, in the capacitor core provided with the positive electrode in the first direction, the oxide film connected with the electrolyte layer in the negative electrode is the first oxide film; in the capacitor element in which the positive electrode is provided in the second direction, the oxide film connected to the electrolyte layer in the negative electrode is the second oxide film.

Referring to fig. 2, in the present embodiment, a single capacitor core is divided into a positive electrode 110 and a negative electrode 120, which are separated by an isolating glue 130, and in the region of the negative electrode 120, since the capacitor core 100 is made of an anodized foil, and the positive electrode 110 is connected to the negative electrode 120, it can be understood that the core of the anodized foil is the positive electrode, and the surface of the anodized foil is an oxide film, therefore, in the region of the negative electrode 120, the core of the anodized foil is the positive electrode, and is connected to an electrolyte layer 121, and there is an oxide film in the middle connection. Referring to fig. 3, the conductive electrode is a material of the formed foil, the electrolyte layer is composed of cathode electrolyte, and the oxide film is a surface oxide film of the formed foil, since the positive electrodes are disposed in different directions, the positive electrodes (i.e., the conductive electrodes) of the two capacitor cores 100 connected by the negative electrode 120 face in different directions, and the connection portions of the conductive electrodes and the electrolyte layer are oxide films, respectively. Specifically, the joints of the positive electrode and the negative electrode at the two ends are respectively an oxide film, namely a first oxide film and a second oxide film, wherein the electrolyte layer is the negative electrode, and the electrolyte layer further comprises a graphite layer and a silver paste layer.

Referring to fig. 3 and 4, in the present embodiment, when one end of the capacitor is increased in voltage and the other end is decreased in voltage, the circuit structure is from high voltage to low voltage, the circuit structure includes the conductive electrode 1(N), the oxide dielectric layer (i) and the electrolyte layer (P), and the circuit structure includes the electrolyte layer (P), the oxide dielectric layer (i) and the conductive electrode 2(N), and the circuit structure corresponds to a P-type semiconductor. Therefore, after the non-polar capacitor is electrified, the circuit structure is a pin structure and an nip structure, wherein N is an N-type semiconductor, P is a P-type semiconductor, and i is an oxide film dielectric layer. It can be understood that the circuit structure formed by the capacitor is a nip and pin structure no matter which direction the power is applied, and the circuit structure is equivalent to two PN junctions which are back to back.

In one embodiment, the non-polar capacitor further comprises a lead frame 200, wherein the lead frame 200 is an electrode of the non-polar capacitor.

In one embodiment, the lead frame 200 includes a first lead frame 210 and a second lead frame 220, wherein a positive electrode facing the first direction is electrically connected to the first lead frame 210, and a positive electrode facing the second direction is electrically connected to the second lead frame 220.

In this embodiment, the lead frame 200 may be made of nickel-plated copper, tin or other materials with good conductivity, and different materials may be selected according to requirements, and used as electrodes of the non-polar capacitor. The first lead frame and the second lead frame have no great difference in material or performance, and the only difference is that the two lead frames 200 are connected to the positive electrodes 110 in different directions. Since the positive electrodes 100 are connected, the electrodes of the non-polar capacitor have no difference between the positive and negative electrodes, i.e., no polarity, and the circuit can be used by connecting the electrodes from different directions.

Referring to fig. 4, fig. 4 is a circuit schematic diagram of the non-polar capacitor provided in the present embodiment.

In this embodiment, since the circuit structures formed by energizing the stacked body are pin structures or nip structures, respectively, and the negative electrode regions are electrically connected at both ends, the non-polar capacitor can be connected as in fig. 4, and thus, when the non-polar capacitor is connected to a circuit, when a high potential is applied to one of the first lead frame and the second lead frame and a low potential is applied to the other lead frame, one of the two oxide films is always in a through-flow state and the other oxide film is in a current blocking state, and therefore, a large current does not flow between the two electrodes, and the defect that the two leads of the polar capacitor have positive and negative electrodes is overcome.

In one embodiment, the non-polar capacitor further comprises: a connection conductor 300 for, when a first minimum distance between a positive electrode disposed toward the first direction and the first lead frame 210 exceeds a first preset threshold, disposing a first connection conductor between the positive electrode disposed toward the first direction corresponding to the first minimum distance and the first lead frame 210, the first connection conductor being electrically connected to the positive electrode and the first lead frame 210, respectively; the connecting conductor 300 is further configured to, when a distance between two adjacent positive electrodes arranged in the first direction exceeds a second preset threshold, arrange a second connecting conductor between the two adjacent positive electrodes, where the second connecting conductor is electrically connected to the two adjacent positive electrodes, respectively; the connecting conductor 300 is further configured to, when a second minimum distance between the positive electrode disposed toward the second direction and the second lead frame exceeds a third preset threshold, dispose a third connecting conductor between the positive electrode disposed toward the second direction and the second lead frame 220 corresponding to the second minimum distance, where the third connecting conductor is electrically connected to the positive electrode and the second lead frame 220, respectively; the connection conductor is further configured to, when a distance between two adjacent positive electrodes arranged toward the second direction exceeds a fourth preset threshold, arrange a fourth connection conductor between the two adjacent positive electrodes, where the fourth connection conductor is electrically connected to the two adjacent positive electrodes, respectively, it is understood that fig. 1 is only one example provided by an embodiment of the present application, and there are many practical situations, and the connection manner of fig. 1 should not be a limitation of the present application.

In this embodiment, since the capacitor core 100 has a certain thickness, when the capacitor cores are stacked in different ways, the anodes in the same direction may be far away from each other, so that the lead frame 200 cannot be directly electrically connected to the anode in the direction, and therefore, the connecting conductor 300 is disposed between the anode 110 and the lead frame 200, so that the anode 110 and the lead frame 200 are electrically connected. Illustratively, the connection conductor may be a material having high electrical conductivity, such as graphite or the like.

In one embodiment, the non-polar capacitor further includes a mold housing 400, the stacked body and a portion of the lead frame 200 connected to the positive electrode 110 are in the mold housing 400, and the mold housing 400 is used to protect the non-polar capacitor.

In this embodiment, the mold housing 400 protects the stacked body and a part of the lead frame, and the remaining part of the lead frame leads out electrodes serving as connection circuits from the mold housing. It can be understood that the non-polar capacitor without the plastic package body shell can be connected with a circuit to realize functions in specific environments such as vacuum and the like, and the non-polar capacitor can adapt to the working environment after being protected by the plastic package body shell.

Based on the same inventive concept, the embodiment of the application also provides a manufacturing method of the non-polar capacitor. Referring to fig. 5, fig. 5 is a flowchart illustrating a method for manufacturing a non-polar capacitor according to an embodiment of the present disclosure, where the method includes the following steps:

and S110, providing a plurality of capacitor cores.

In one embodiment, the number of capacitor cores is even, and each capacitor core comprises a positive electrode and a negative electrode.

In this embodiment, a method for manufacturing a capacitor core is provided, where the method for manufacturing a capacitor core includes:

the method comprises the steps of cutting an aluminum formed foil into formed foils with required widths, and welding the cut formed foils on a stainless steel bar through resistance welding or laser welding, so that the mass production is facilitated. And then coating an isolating glue on a certain position of the formed foil, separating the positive and negative regions of the product, designing the position according to the capacitance of the capacitor core, immersing the formed foil coated with the isolating glue into the forming liquid at a certain temperature for forming for a certain time, and selecting the position coated with the isolating glue according to the designed capacitance value of the capacitor core so as to determine the sizes of the positive electrode and the negative electrode.

Secondly, manufacturing a negative electrode of the capacitor core, and preparing a conductive high molecular polymer on the surface of the negative electrode as a cathode electrolyte of a product, namely an electrolyte layer, in a mode of chemical polymerization, electrochemical polymerization or physical impregnation of dispersion liquid, a coating method and the like in a pre-designed negative electrode area of a formed foil, wherein the manufacturing of the cathode electrolyte can be one or combination of the methods; and a graphite layer is sequentially coated on the surface of the electrolyte layer, and a silver paste layer with high conductivity is coated on the graphite layer, so that the conductivity and the stress resistance of the product are improved. The manufacture of the monolithic capacitor core is completed by coating graphite and silver paste on the conductive polymer to be used as the cathode of the capacitor core.

Finally, the possible damage of the chip capacitor core in the manufacturing process is repaired. The method comprises the following steps of carrying out aging process on a single capacitor core, wherein the aging voltage is within the range from the rated voltage of a product to the formation voltage, and is generally 1.0-1.5 times of the rated voltage of the product, so that the purpose is to repair an oxide film damaged in the manufacturing process, make an oxide film dielectric layer more stable, and simultaneously remove the capacitor core with defects in the oxide film dielectric layer. The aging process is explained in the following, and the aging process refers to applying a voltage across the target object, wherein the voltage is from zero to a preset voltage value.

And S120, stacking a plurality of capacitor cores to form a stacked body.

In one embodiment, in the stacked body, the cathodes of all the capacitor cores are electrically conducted to each other, and half of the anodes of the capacitor cores are disposed toward a first direction, and half of the anodes of the capacitor cores are disposed toward a second direction different from the first direction.

Referring to fig. 1, fig. 1 is a structural diagram of a non-polar capacitor provided in an embodiment of the present application, it can be understood that the stacked body in fig. 1 is only an example, and the present application does not limit the arrangement order of the capacitor cores, and only the stacking manner provided by the present application is required, that is, the cathodes of all the capacitor cores are electrically connected, half of the anodes of the capacitor cores are arranged toward a first direction, and half of the anodes of the capacitor cores are arranged toward a second direction, where the second direction is different from the first direction.

In this embodiment, it should be noted that the number of the capacitor cores in fig. 1 is only one example, and the number of the capacitor cores may be an even number, such as 2, 4, 6, etc., and the specific number is selected according to the designed capacity of the capacitor. Here, only the direction of the positive electrode in the stacking system is limited, and it is required that the positive electrodes of the half capacitor cores face the first direction and the positive electrodes of the half capacitor cores face the second direction. The first direction and the second direction may be opposite to each other, or may form a certain angle. The cathode portions are also fully electrically connected when the first direction and the second direction form an angle.

In this embodiment, because the capacitor cores are dislocated or bent by external force, the capacitor core cathodes cannot be in complete contact with each other, and the performance of the capacitor is affected, therefore, the capacitor core cathodes and the cathodes are bonded by using highly conductive bonding silver paste, so that the cathodes are completely attached, the stability of the stacked body is increased, and meanwhile, the cathodes which are not connected are electrically connected.

S130, the positive electrode facing the first direction is electrically connected to the first lead frame, and the positive electrode facing the second direction is electrically connected to the second lead frame, thereby obtaining the non-polar capacitor.

In this embodiment, the positive electrode of the capacitor core and the lead frame may be directly welded by resistance welding or laser welding to achieve electrical connection.

In one embodiment, when the connection point of the positive electrode and the lead frame exceeds a preset threshold value, a connection conductor is arranged between the capacitor electrode and the positive electrode; welding the positive electrode with the connecting conductor; the lead frame is soldered to the connection conductor, and the connection conductor is electrically connected to the lead frame.

Referring to the positive electrode and the connecting conductor in fig. 1, in this embodiment, due to the excessive number of the capacitor cores or the stacking manner, a long distance may exist between a part of the positive electrode and the lead frame, and the use of the welding manner may affect the electrical connection between the positive electrode and the lead frame, thereby causing poor conduction, i.e., when the connection point between the positive electrode and the lead frame exceeds a preset threshold, the preset threshold is the maximum distance when the welding manner does not affect the electrical connection performance. In this case, a connection conductor having good conductivity is additionally provided between the positive electrode and the lead frame, and the positive electrode and the lead frame are connected by welding the positive electrode and the connection conductor and welding the lead frame and the same connection conductor. Specifically, when a first minimum distance between a positive electrode disposed toward the first direction and the first lead frame 210 exceeds a first preset threshold, a first connection conductor is disposed between the positive electrode disposed toward the first direction corresponding to the first minimum distance and the first lead frame 210, and the first connection conductor is electrically connected to the positive electrode and the first lead frame 210, respectively; and/or when the distance between two adjacent anodes arranged towards the first direction exceeds a second preset threshold value, arranging a second connecting conductor between the two adjacent anodes, wherein the second connecting conductor is electrically connected with the two adjacent anodes respectively; and/or when a second minimum distance between the positive electrode arranged in the second direction and the second lead frame exceeds a third preset threshold, a third connecting conductor is arranged between the positive electrode arranged in the second direction and the second lead frame 220 corresponding to the second minimum distance, and the third connecting conductor is electrically connected with the positive electrode and the second lead frame 220 respectively; and/or when the distance between two adjacent anodes arranged towards the second direction exceeds a fourth preset threshold value, a fourth connecting conductor is arranged between the two adjacent anodes, and the fourth connecting conductor is electrically connected with the two adjacent anodes respectively. The first preset threshold, the second preset threshold, the third preset threshold and the fourth preset threshold are the maximum connection distances of connection modes such as laser welding and resistance welding under the condition that the electrical performance is not influenced.

In this embodiment, the non-polar capacitor connected to the circuit can already realize the function of the capacitor itself, but is easily affected by external factors, and therefore, the method for manufacturing the non-polar capacitor provided by the present application further includes the following steps.

And S140, packaging the non-polar capacitor.

In this embodiment, the nonpolar capacitor is plastically packaged by using epoxy resin to form a plastic package housing for protecting the capacitor, so that the nonpolar capacitor is fixed in the plastic package housing, does not contact with air, and is not interfered by external factors.

And S150, applying voltage to the non-polar capacitor for aging.

In one embodiment, the non-polar capacitor is aged by applying a voltage to the non-polar capacitor at a predetermined temperature to obtain a finished non-polar capacitor. Wherein the aging process comprises applying a first voltage to the non-polar capacitor to perform a first aging; and applying a second voltage to the non-polar capacitor for the second aging, wherein the voltage directions of the first voltage and the second voltage are opposite.

In the present embodiment, since the non-polar capacitor has two or even number of oxide films, for example, when there are only two capacitor cores, the non-polar capacitor formed by stacking and connecting the two capacitor cores to the lead frame has only two oxide films, and when there are four or more even number of capacitor cores, the capacitor formed by stacking has four or more even number of oxide films. Because the voltage in a single direction is applied during aging, the oxide film dielectric layer conducted in the direction can only be repaired, so that the non-polar capacitor is aged twice, the voltage applied during aging twice is opposite in direction, the oxide film dielectric layers in two directions are repaired, the oxide film dielectric layers are more stable, defective products which do not meet requirements are removed, and the obtained finished non-polar capacitor can be safely and stably used in a working environment.

In the embodiment, the voltage applied by aging is within the range from the rated voltage of the monolithic capacitor core to the formation voltage, and is generally 1.0-1.5 times of the rated voltage, the preset temperature is generally 50-135 ℃, and the voltage can be set and selected according to actual conditions and requirements.

The capacitor cores are stacked in the capacitor core stacking mode provided by the embodiment of the application and connected with the lead frame, so that the non-polar capacitor is obtained. In addition, the capacitor core has all the characteristics of the capacitor core of the conductive polymer sheet type laminated aluminum electrolytic capacitor, so the non-polar capacitor also has the characteristics of the conductive polymer sheet type laminated aluminum electrolytic capacitor and can be used in circuits with different frequency bands, in particular circuits for transmitting alternating current signals.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.