阅读说明：本技术 电路板的制作方法 (Method for manufacturing circuit board ) 是由 魏豪毅 李艳禄 于 2020-05-25 设计创作，主要内容包括：一种电磁屏蔽效果好的电路板的制作方法,其包括以下步骤：将第一单面板压合至绝缘体的第一表面以及连接第一表面相对两侧的侧面形成第一压合基板；将第二单面板压合至第三单面板的绝缘层的顶壁以及连接顶壁相对两侧的侧壁形成第二压合基板；对第二压合基板进行线路制作使得第三单面板中的金属层对应形成内层线路层；将第一压合基板与线路制作后的第二压合基板压合形成中间结构,其中,内层线路层内埋于中间结构中；对中间结构进行线路制作形成外层线路层,且外层线路层与内层线路层电连接；在外层线路层上设置覆盖膜,且覆盖膜设有开口以露出部分外层线路层；在覆盖膜上设置电磁屏蔽层,且电磁屏蔽层填满开口以电连接外层线路层。(A manufacturing method of a circuit board with good electromagnetic shielding effect comprises the following steps: pressing a first single-sided board to a first surface of the insulator and connecting side surfaces of two opposite sides of the first surface to form a first pressed substrate; pressing the second single-panel to the top wall of the insulating layer of the third single-panel and connecting the side walls on the two opposite sides of the top wall to form a second pressed substrate; carrying out circuit manufacturing on the second laminated substrate to enable the metal layer in the third single-sided board to correspondingly form an inner-layer circuit layer; pressing the first pressed substrate and the second pressed substrate after the circuit is manufactured to form an intermediate structure, wherein the inner layer circuit layer is embedded in the intermediate structure; carrying out circuit manufacturing on the intermediate structure to form an outer layer circuit layer, wherein the outer layer circuit layer is electrically connected with the inner layer circuit layer; arranging a covering film on the outer layer circuit layer, wherein the covering film is provided with an opening to expose part of the outer layer circuit layer; the electromagnetic shielding layer is arranged on the covering film, and the opening is filled with the electromagnetic shielding layer so as to be electrically connected with the outer layer circuit layer.)

1. A manufacturing method of a circuit board comprises the following steps:

providing a first single-sided board and an insulator, wherein the first single-sided board is divided into a first body area and a first turnover area connected with two opposite sides of the first body area, the insulator comprises a first surface and side faces connected with two opposite sides of the first surface, and the first single-sided board comprises a first metal layer and a first insulating layer which are arranged in a stacked mode;

pressing the first single-sided board onto the insulator in a manner that the first insulating layer faces the insulator, so as to form a first pressed substrate, wherein the first body region is bonded to the first surface, the two first folding regions are respectively bent to the two side surfaces to be bonded to the side surfaces, and the first insulating layer and the insulator are bonded to form a first dielectric layer;

providing a second single-sided board and a third single-sided board, wherein the second single-sided board is divided into a second body area and a second turnover area connected with two opposite sides of the second body area, the second single-sided board comprises a second metal layer and a second insulating layer which are arranged in a stacked mode, the third single-sided board comprises a third metal layer and a third insulating layer, the third insulating layer comprises a top wall and a bottom wall which are arranged in a reverse mode, and two side walls which are connected with the top wall and the bottom wall and are arranged in a reverse mode, and the third metal layer is arranged on the bottom wall;

pressing the second single-sided board to the third insulating layer in a manner that the second insulating layer faces the third insulating layer, so as to form a second pressed substrate, wherein the second body region is combined with the top wall, the two second folding regions are respectively bent to the two side walls to be combined with the side walls, and the second insulating layer and the third insulating layer form a second dielectric layer;

carrying out circuit manufacturing on the second laminated substrate to enable the third metal layer to correspondingly form an inner circuit layer;

pressing the first pressed substrate and the second pressed substrate after the circuit is manufactured so as to form an intermediate structure, wherein the inner circuit layer is wrapped in the first dielectric layer and the second dielectric layer;

performing circuit manufacturing on the intermediate structure, so that an outer layer circuit layer is formed on the part, corresponding to the first body region, of the first metal layer and the part, corresponding to the second body region, of the second metal layer, and the outer layer circuit layer is electrically connected with the inner layer circuit layer;

arranging a covering film on the surface of the outer layer circuit layer, which is far away from the inner layer circuit layer, wherein the covering film is provided with an opening to expose part of the outer layer circuit layer; and

and arranging an electromagnetic shielding layer on the covering film, wherein the electromagnetic shielding layer fills the opening to be electrically connected with the outer layer circuit layer.

2. The method of manufacturing a circuit board according to claim 1, wherein a thickness of the first single face is smaller than a thickness of the insulator, and a thickness of the second single face is smaller than a thickness of the third single face.

3. The method for manufacturing a circuit board according to claim 1, wherein the two first flip-flop areas completely cover the two side surfaces, and the two second flip-flop areas completely cover the two side walls.

4. The method for manufacturing a circuit board according to claim 1, wherein when the first bonded substrate and the second bonded substrate after the circuit is manufactured are bonded to form the intermediate structure, a first adhesive layer is further disposed between the first bonded substrate and the second bonded substrate; and when the circuit of the intermediate structure is manufactured, a metal deposition layer is formed at the end part of the first adhesive layer, which is close to the first turnover area and the second turnover area, so as to connect the first metal layer and the second metal layer.

5. The method for manufacturing a circuit board according to any one of claims 1 to 4, wherein when the first single-sided board is laminated to the insulator to form the first laminated substrate, a second adhesive layer is further disposed between the first single-sided board and the insulator, or/and when the second single-sided board is laminated to the third insulating layer to form the second laminated substrate, a third adhesive layer is further disposed between the second single-sided board and the third insulating layer.

6. A manufacturing method of a circuit board comprises the following steps:

providing a first single-sided board and an insulator, wherein the first single-sided board is divided into a first body area and a first turnover area connected with two opposite sides of the first body area, the insulator comprises a first surface and side faces connected with two opposite sides of the first surface, and the first single-sided board comprises a first metal layer and a first insulating layer which are arranged in a stacked mode;

pressing the first single-sided board onto the insulator in a manner that the first insulating layer faces the insulator, so as to form a first pressed substrate, wherein the first body region is bonded to the first surface, the two first folding regions are respectively bent to the two side surfaces to be bonded to the side surfaces, and the first insulating layer and the insulator are bonded to form a first dielectric layer;

providing a second single-sided board and a third single-sided board, wherein the second single-sided board is divided into a second body area and a second turnover area connected with two opposite sides of the second body area, the second single-sided board comprises a second metal layer and a second insulating layer which are arranged in a stacked mode, the third single-sided board comprises a third metal layer and a third insulating layer, the third insulating layer comprises a top wall and a bottom wall which are arranged in a reverse mode, and two side walls which are connected with the top wall and the bottom wall and are arranged in a reverse mode, and the third metal layer is arranged on the bottom wall;

pressing the second single-sided board to the third insulating layer in a manner that the second insulating layer faces the third insulating layer, so as to form a second pressed substrate, wherein the second body region is combined with the top wall, the two second folding regions are respectively bent to the two side walls to be combined with the side walls, and the second insulating layer and the third insulating layer form a second dielectric layer;

carrying out circuit manufacturing on the second laminated substrate, so that a first inner layer circuit layer is correspondingly formed on the part, corresponding to the second body area, of the second metal layer, a second inner layer circuit layer is correspondingly formed on the third metal layer, and the first inner layer circuit layer is electrically connected with the second inner layer circuit layer;

sequentially laminating and laminating the first laminated substrate, the second laminated substrate after circuit manufacturing and the other first laminated substrate to form an intermediate structure, wherein the first inner circuit layer is wrapped in the second dielectric layer and the first dielectric layer in the first laminated substrate, and the second inner circuit layer is wrapped in the second dielectric layer and the first dielectric layer in the other first laminated substrate;

performing circuit manufacturing on the intermediate structure, so that an outer layer circuit layer is formed on the parts, corresponding to the first body area, of the two first metal layers, and the outer layer circuit layer is electrically connected with the first inner layer circuit layer and the second inner layer circuit layer;

arranging a covering film on the surface of the outer layer circuit layer, which is far away from the first inner layer circuit layer, wherein the covering film is provided with an opening to expose part of the outer layer circuit layer; and

and arranging an electromagnetic shielding layer on the covering film, wherein the electromagnetic shielding layer fills the opening to be electrically connected with the outer layer circuit layer.

7. The method of manufacturing a circuit board according to claim 6, wherein a thickness of the first single face is smaller than a thickness of the insulator, and a thickness of the second single face is smaller than a thickness of the third single face.

8. The method for manufacturing a circuit board according to claim 6, wherein the two first flip-flop areas completely cover the two side surfaces, and the two second flip-flop areas completely cover the two side walls.

9. The method for manufacturing a circuit board according to claim 6, wherein when the first laminated substrate, the second laminated substrate after the circuit is manufactured, and the other first laminated substrate are sequentially stacked and laminated to form an intermediate structure, a first adhesive layer is further disposed between each first laminated substrate and the second laminated substrate; and when the circuit of the intermediate structure is manufactured, a metal deposition layer is formed at the end part of each first adhesive layer, which is close to the first turnover area and the second turnover area, so as to connect the first metal layer and the second metal layer.

10. The method for manufacturing a circuit board according to any one of claims 6 to 9, wherein when the first single-sided board is laminated to the insulator to form the first laminated substrate, a second adhesive layer is further disposed between the first single-sided board and the insulator, or/and when the second single-sided board is laminated to the third insulating layer to form the second laminated substrate, a third adhesive layer is further disposed between the second single-sided board and the third insulating layer.

Technical Field

The invention relates to a manufacturing method of a circuit board.

Background

Under the upgrading requirements of high-frequency high-speed and MIMO (multiple input multiple output) technology and the like, the 5G antenna is widely applied to electronic products with high-frequency high-speed requirements, such as a 5G smart phone and the like. Therefore, how to further improve the anti-interference capability of the electronic product signal is an urgent problem to be solved.

Disclosure of Invention

In view of the above, it is desirable to provide a method for manufacturing a circuit board with improved electromagnetic shielding effect.

The manufacturing method of the circuit board comprises the following steps:

providing a first single-sided board and an insulator, wherein the first single-sided board is divided into a first body area and a first turnover area connected with two opposite sides of the first body area, the insulator comprises a first surface and side faces connected with two opposite sides of the first surface, and the first single-sided board comprises a first metal layer and a first insulating layer which are arranged in a stacked mode;

pressing the first single-sided board onto the insulator in a manner that the first insulating layer faces the insulator, so as to form a first pressed substrate, wherein the first body region is bonded to the first surface, the two first folding regions are respectively bent to the two side surfaces to be bonded to the side surfaces, and the first insulating layer and the insulator are bonded to form a first dielectric layer;

providing a second single-sided board and a third single-sided board, wherein the second single-sided board is divided into a second body area and a second turnover area connected with two opposite sides of the second body area, the second single-sided board comprises a second metal layer and a second insulating layer which are arranged in a stacked mode, the third single-sided board comprises a third metal layer and a third insulating layer, the third insulating layer comprises a top wall and a bottom wall which are arranged in a reverse mode, two side walls which are connected with the top wall and the bottom wall and are arranged in a reverse mode, and the third metal layer is arranged on the bottom wall;

pressing the second single-sided board to the third insulating layer in a manner that the second insulating layer faces the third insulating layer, so as to form a second pressed substrate, wherein the second body region is combined with the top wall, the two second folding regions are respectively bent to the two side walls to be combined with the side walls, and the second insulating layer and the third insulating layer form a second dielectric layer;

carrying out circuit manufacturing on the second laminated substrate to enable the third metal layer to correspondingly form an inner circuit layer;

pressing the first pressed substrate and the second pressed substrate after the circuit is manufactured so as to form an intermediate structure, wherein the inner circuit layer is wrapped in the first dielectric layer and the second dielectric layer;

performing circuit manufacturing on the intermediate structure, so that an outer layer circuit layer is formed on the part, corresponding to the first body region, of the first metal layer and the part, corresponding to the second body region, of the second metal layer, and the outer layer circuit layer is electrically connected with the inner layer circuit layer;

arranging a covering film on the surface of the outer layer circuit layer, which is far away from the inner layer circuit layer, wherein the covering film is provided with an opening to expose part of the outer layer circuit layer; and

and arranging an electromagnetic shielding layer on the covering film, wherein the electromagnetic shielding layer fills the opening to be electrically connected with the outer layer circuit layer.

The manufacturing method of the circuit board comprises the following steps:

providing a first single-sided board and an insulator, wherein the first single-sided board is divided into a first body area and a first turnover area connected with two opposite sides of the first body area, the insulator comprises a first surface and side faces connected with two opposite sides of the first surface, and the first single-sided board comprises a first metal layer and a first insulating layer which are arranged in a stacked mode;

pressing the first single-sided board onto the insulator in a manner that the first insulating layer faces the insulator, so as to form a first pressed substrate, wherein the first body region is bonded to the first surface, the two first folding regions are respectively bent to the two side surfaces to be bonded to the side surfaces, and the first insulating layer and the insulator are bonded to form a first dielectric layer;

providing a second single-sided board and a third single-sided board, wherein the second single-sided board is divided into a second body area and a second turnover area connected with two opposite sides of the second body area, the second single-sided board comprises a second metal layer and a second insulating layer which are arranged in a stacked mode, the third single-sided board comprises a third metal layer and a third insulating layer, the third insulating layer comprises a top wall and a bottom wall which are arranged in a reverse mode, two side walls which are connected with the top wall and the bottom wall and are arranged in a reverse mode, and the third metal layer is arranged on the bottom wall;

pressing the second single-sided board to the third insulating layer in a manner that the second insulating layer faces the third insulating layer, so as to form a second pressed substrate, wherein the second body region is combined with the top wall, the two second folding regions are respectively bent to the two side walls to be combined with the side walls, and the second insulating layer and the third insulating layer form a second dielectric layer;

carrying out circuit manufacturing on the second laminated substrate, so that a first inner layer circuit layer is correspondingly formed on the part, corresponding to the second body area, of the second metal layer, a second inner layer circuit layer is correspondingly formed on the third metal layer, and the first inner layer circuit layer is electrically connected with the second inner layer circuit layer;

sequentially laminating and laminating the first laminated substrate, the second laminated substrate after circuit manufacturing and the other first laminated substrate to form an intermediate structure, wherein the first inner circuit layer is wrapped in the second dielectric layer and the first dielectric layer in the first laminated substrate, and the second inner circuit layer is wrapped in the second dielectric layer and the first dielectric layer in the other first laminated substrate;

performing circuit manufacturing on the intermediate structure, so that an outer layer circuit layer is formed on the parts, corresponding to the first body area, of the two first metal layers, and the outer layer circuit layer is electrically connected with the first inner layer circuit layer and the second inner layer circuit layer;

arranging a covering film on the surface of the outer layer circuit layer, which is far away from the first inner layer circuit layer, wherein the covering film is provided with an opening to expose part of the outer layer circuit layer; and

and arranging an electromagnetic shielding layer on the covering film, wherein the electromagnetic shielding layer fills the opening to be electrically connected with the outer layer circuit layer.

According to the manufacturing method of the circuit board, the side face shielding of the circuit board is not needed to be achieved through the mode of arranging the shielding holes, so that the wiring space of the circuit board is increased, and the risk of poor products caused by punching is avoided. In addition, according to the manufacturing method of the circuit board, the shielding of the side face of the circuit board is realized while the layer is added in a pressing mode, and compared with a simple side wall copper plating mode, the method can effectively prevent the side face shielding structure from falling off.

Drawings

Fig. 1 is a schematic view of a first single panel and an insulator according to a first embodiment of the present invention.

Fig. 2 is a schematic view illustrating a first single-sided board and an insulator shown in fig. 1 being bonded to form a first bonded substrate.

Fig. 3 is a schematic view of a second single panel and a third single panel of the first embodiment provided by the present invention.

Fig. 4 is a schematic view illustrating the second single-sided board and the third single-sided board shown in fig. 3 being laminated to form a second laminated substrate.

Fig. 5 is a schematic diagram illustrating a circuit fabrication process performed on the second bonded substrate shown in fig. 4.

Fig. 6 is a schematic diagram of the second bonded substrate shown in fig. 5 and the first bonded substrate shown in fig. 2 being bonded to form an intermediate structure.

Fig. 7A-7C are schematic diagrams of the intermediate structure shown in fig. 6 subjected to wiring to form an outer wiring layer.

Fig. 8 is a schematic view of a coverlay film disposed over the outer wiring layer of fig. 7.

Fig. 9 is a schematic view of providing an electromagnetic shielding layer on the cover film shown in fig. 8.

Fig. 10 is a schematic diagram of an intermediate structure of a second embodiment provided by the present invention.

Fig. 11 is a schematic diagram of the intermediate structure shown in fig. 10 after wiring is formed.

Fig. 12 is a schematic diagram of a circuit board of a second embodiment provided by the present invention.

Fig. 13 is a schematic view of a first bonded substrate according to a third embodiment of the invention.

Fig. 14 is a schematic view of a second bonded substrate according to a third embodiment of the invention.

Fig. 15 is a schematic diagram of a circuit board of a third embodiment provided by the present invention.

Fig. 16 is a schematic view of a second bonded substrate after a circuit is fabricated according to a fourth embodiment of the invention.

Fig. 17 is a schematic diagram of an intermediate structure of a fourth embodiment provided by the present invention.

Fig. 18 is a schematic view of the intermediate structure shown in fig. 17 after forming an outer wiring layer by wiring.

Fig. 19 is a schematic view of a coverlay film disposed over the outer wiring layer of fig. 18.

Fig. 20 is a schematic view of providing an electromagnetic shielding layer on the cover film shown in fig. 19.

Fig. 21 is a schematic diagram of an intermediate structure of a fifth embodiment provided by the present invention.

Fig. 22 is a schematic diagram of the intermediate structure shown in fig. 21 after wiring is formed.

Fig. 23 is a schematic diagram of a circuit board of a fifth embodiment provided by the present invention.

Fig. 24 is a schematic diagram of a circuit board of a sixth embodiment provided by the present invention.

Description of the main elements

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The features of the following examples/embodiments and examples/embodiments may be combined with each other without conflict.

Referring to fig. 1 to 9, a method for manufacturing a circuit board according to a first embodiment of the present invention includes the following steps:

step S101, please refer to fig. 1, providing a first single panel 11 and an insulator 13, where the first single panel 11 is divided into a first body region 11a and a first flip region 11b connected to two opposite sides of the first body region 11 a. The insulator 13 corresponds to the first body region 11 a.

In the present embodiment, the first single panel 11 includes a first metal layer 111 and a first insulating layer 113 which are stacked.

The insulator 13 includes a first surface 131 and a second surface 132 opposite to each other, and two opposite surfaces 133 and 134 connecting the first surface 131 and the second surface 132 and opposite to each other.

Preferably, the thickness of the first single face plate 11 is smaller than the thickness of the insulator 13.

Step S102, referring to fig. 2, the first single-sided board 11 is laminated to the insulator 13 in a manner that the first insulating layer 113 faces the insulator 13, so as to form a first laminated substrate 10, and the insulator 13 and the first insulating layer 113 are combined to form a first dielectric layer 101. The first body region 11a is combined with the first surface 131, and the two first folding regions 11b are respectively bent to the two side surfaces 133 and 134 to be combined with the two side surfaces 133 and 134.

Preferably, the first folded region 11b completely covers the side faces 133, 134.

Step S103, please refer to fig. 3, providing a second single panel 21 and a third single panel 23, where the second single panel 21 is divided into a second body region 21a and a second flip region 21b connected to two opposite sides of the second body region 21 a. The third single panel 23 corresponds to the second body region 21 a.

In this embodiment, the second single panel 21 includes a second metal layer 211 and a second insulating layer 213, which are stacked. The third single panel 23 includes a third metal layer 231 and a third insulating layer 233 which are stacked. The third insulating layer 233 includes a top wall 233a and a bottom wall 233b that are opposite to each other, and two side walls 233c and 233d that connect the top wall 233a and the bottom wall 233b and are opposite to each other. The third metal layer 231 is disposed on the bottom wall 233 b.

Preferably, the thickness of the second single-sided board 21 is smaller than the thickness of the third single-sided board 23.

Step S104, referring to fig. 4, the second single panel 21 is laminated onto the third insulating layer 233 in a manner that the second insulating layer 213 faces the third insulating layer 233, so as to form a second laminated substrate 20, the second insulating layer 213 and the third insulating layer 233 are combined to form a second dielectric layer 201, and the second metal layer 211 and the third metal layer 231 are matched to surround the second dielectric layer 201. The second body region 21a is combined with the top wall 233a, and the two second folding regions 21b are respectively bent to the two side walls 233c and 233d to be combined with the two side walls 233c and 233 d.

Preferably, the second folding region 21b completely covers the side walls 233c and 233 d.

In step S105, referring to fig. 5, a circuit is formed on the second laminated substrate 20, such that the third metal layer 231 correspondingly forms an inner circuit layer 230.

Step S106, referring to fig. 6, the first laminated substrate 10 and the second laminated substrate 20 after the circuit fabrication are laminated to form an intermediate structure 30, wherein the inner circuit layer 230 is wrapped in the first dielectric layer 101 and the second dielectric layer 201.

In step S107, referring to fig. 7A to 7C, a circuit is formed on the intermediate structure 30, such that an outer circuit layer 310 is formed on a portion of the first metal layer 111 corresponding to the first body region 11a and a portion of the second metal layer 211 corresponding to the second body region 21a, and the outer circuit layer 310 is electrically connected to the inner circuit layer 230.

In step S108, referring to fig. 8, a cover film 41 is disposed on a surface of the outer circuit layer 310 away from the inner circuit layer 230, and the cover film 41 has an opening 410 to expose a portion of the outer circuit layer 310.

In step S109, referring to fig. 9, an electromagnetic shielding layer 43 is disposed on the cover film 41, and the electromagnetic shielding layer 43 fills the opening 410 to be electrically connected to the outer circuit layer 310.

Compared with the method for manufacturing a circuit board of the first embodiment, in the method for manufacturing a circuit board of the second embodiment, referring to fig. 10 to 12, when the first bonded substrate 10 and the second bonded substrate 20 after the circuit is manufactured are bonded to form the intermediate structure 30 in step S106, a first adhesive layer 51 (as shown in fig. 10) may be further disposed between the first bonded substrate 10 and the second bonded substrate 20 after the circuit is manufactured. When the intermediate structure 30 is subjected to the circuit manufacturing in step S107, a metal deposition layer (not shown, as shown in fig. 11) is formed at an end of the first adhesive layer 51 close to the first flip area 11b and the second flip area 21b to connect the first metal layer 111 and the second metal layer 211. The circuit board manufactured by the method for manufacturing a circuit board according to the second embodiment can be as shown in fig. 12.

Compared with the method for manufacturing a circuit board according to the second embodiment, in the method for manufacturing a circuit board according to the third embodiment, referring to fig. 13 to fig. 15, when the first single-sided board 11 is pressed onto the insulator 13 to form the first pressed substrate 10 in step S102, a second adhesive layer 53 (as shown in fig. 13) may be further disposed between the first single-sided board 11 and the insulator 13. When the second single-sided board 21 is laminated on the third insulating layer 233 to form the second laminated substrate 20 in step S104, a third glue layer 55 may be further disposed between the second single-sided board 21 and the third insulating layer 233 (as shown in fig. 14). The circuit board manufactured by the method for manufacturing a circuit board according to the third embodiment can be as shown in fig. 15.

Referring to fig. 16 to fig. 20, a method for manufacturing a circuit board according to a fourth embodiment of the present invention includes the following steps:

in step S201, referring to fig. 16, a circuit is fabricated on the second laminated substrate 20, such that a portion of the second metal layer 211 corresponding to the second body region 21a forms a first inner circuit layer 230a, the third metal layer 231 forms a second inner circuit layer 230b, and the first inner circuit layer 230a is electrically connected to the second inner circuit layer 230 b.

Step S202, referring to fig. 17, sequentially stacking and laminating one of the first laminated substrates 10, the second laminated substrate 20 after circuit fabrication, and the other first laminated substrate 10 to form an intermediate structure 30a, wherein the first inner circuit layer 230a is wrapped in the second dielectric layer 201 and the first dielectric layer 101 of the first laminated substrate 10, and the second inner circuit layer 230b is wrapped in the second dielectric layer 201 and the first dielectric layer 101 of the other first laminated substrate 10.

In step S203, referring to fig. 18, a circuit is formed on the intermediate structure 30a, so that an outer circuit layer 310a is formed on portions of the two first metal layers 111 corresponding to the first body region 11a, and the outer circuit layer 310a is electrically connected to the first inner circuit layer 230a and the second inner circuit layer 230 b.

In step S204, referring to fig. 19, a cover film 41 is disposed on a surface of the outer circuit layer 310a away from the first inner circuit layer 230a, and the cover film 41 is provided with an opening 410 to expose a portion of the outer circuit layer 310 a.

In step S205, referring to fig. 20, an electromagnetic shielding layer 43 is disposed on the cover film 41, and the electromagnetic shielding layer 43 fills the opening 410 to be electrically connected to the outer circuit layer 310 a.

Compared with the method for manufacturing a circuit board according to the fourth embodiment, in the method for manufacturing a circuit board according to the fifth embodiment, referring to fig. 21 to 23, when the first bonded substrate 10, the second bonded substrate 20 after circuit manufacturing, and the other first bonded substrate 10 are sequentially stacked and bonded to form the intermediate structure 30a in step S202, a first adhesive layer 51 (as shown in fig. 21) may be further disposed between the first bonded substrate 10 and the second bonded substrate 20 after circuit manufacturing. When the intermediate structure 30a is subjected to the circuit fabrication in step S203, a metal deposition layer (not shown, as shown in fig. 22) is formed at an end of the first adhesive layer 51 close to the first flip area 11b and the second flip area 21b to connect the first metal layer 111 and the second metal layer 211. The circuit board manufactured by the method for manufacturing a circuit board according to the fifth embodiment can be as shown in fig. 23.

Compared with the method for manufacturing a circuit board of the fifth embodiment, in the method for manufacturing a circuit board of the sixth embodiment, referring to fig. 13, 14 and 24, when the first bonded substrate 10 is formed, a second adhesive layer 53 (as shown in fig. 13) may be further disposed between the first single-sided board 11 and the insulator 13. When the second bonded substrate 20 is formed, a third glue layer 55 (as shown in fig. 14) may be further disposed between the second single-sided board 21 and the third insulating layer 233. The circuit board manufactured by the method for manufacturing a circuit board according to the sixth embodiment can be as shown in fig. 24.

According to the manufacturing method of the circuit board, the side face shielding of the circuit board is not needed to be achieved through the mode of arranging the shielding holes, so that the wiring space of the circuit board is increased, and the risk of poor products caused by punching is avoided. In addition, according to the manufacturing method of the circuit board, the shielding of the side face of the circuit board is realized while the layer is added in a pressing mode, and compared with a simple side wall copper plating mode, the method can effectively prevent the side face shielding structure from falling off.

Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.