阅读说明：本技术 移相器及其制作方法、天线 (Phase shifter, manufacturing method thereof and antenna ) 是由 贾振宇 席克瑞 林柏全 秦锋 于 2020-06-01 设计创作，主要内容包括：本发明实施例提供了一种移相器及其制作方法、天线,涉及电磁波技术领域,提高了移相器的集成度,且降低了功耗。移相器包括：第一基板,第一基板上设置有接地电极,接地电极与接地信号端电连接；与第一基板相对设置的第二基板,第二基板朝向第一基板的一侧设置有多个驱动电极；封框胶,封框胶位于第一基板与第二基板之间,封装于第一基板与第二基板之间的液晶；多个驱动电路,驱动电路位于第二基板背向第一基板的一侧,至少一个驱动电路与一个驱动电极对应,驱动电路和与其对应的驱动电极电连接。(The embodiment of the invention provides a phase shifter, a manufacturing method thereof and an antenna, relates to the technical field of electromagnetic waves, and aims to improve the integration level of the phase shifter and reduce the power consumption. The phase shifter includes: the first substrate is provided with a grounding electrode, and the grounding electrode is electrically connected with a grounding signal end; the second substrate is arranged opposite to the first substrate, and one side of the second substrate, which faces the first substrate, is provided with a plurality of driving electrodes; the frame sealing glue is positioned between the first substrate and the second substrate and is packaged in the liquid crystal between the first substrate and the second substrate; the driving circuits are positioned on one side, back to the first substrate, of the second substrate, at least one driving circuit corresponds to one driving electrode, and the driving circuits are electrically connected with the driving electrodes corresponding to the driving circuits.)

1. A phase shifter, comprising:

the first substrate is provided with a grounding electrode, and the grounding electrode is electrically connected with a grounding signal end;

the second substrate is arranged opposite to the first substrate, and one side, facing the first substrate, of the second substrate is provided with a plurality of driving electrodes;

the frame sealing glue is positioned between the first substrate and the second substrate and used for packaging the liquid crystal between the first substrate and the second substrate;

the driving circuits are positioned on one side, back to the first substrate, of the second substrate, at least one driving circuit corresponds to one driving electrode, and the driving circuits are electrically connected with the corresponding driving electrodes.

2. The phase shifter according to claim 1, wherein a plurality of first through holes are provided on the second substrate, first conductive structures are provided in the first through holes, and the first conductive structures are electrically connected to the driving electrodes;

and a rewiring layer is arranged on one side of the second substrate, which is opposite to the driving electrode, and is positioned between the driving circuit and the second substrate, and the driving circuit is electrically connected with the first conductive structure through the rewiring layer.

3. The phase shifter according to claim 1, wherein a plurality of first through holes are provided on the second substrate, first conductive structures are provided in the first through holes, and the first conductive structures are electrically connected to the driving electrodes;

the phase shifter further comprises a third substrate, the third substrate is positioned on one side, back to the first substrate, of the second substrate, a plurality of second through holes are formed in the third substrate, second conductive structures are arranged in the second through holes, and the second conductive structures are electrically connected with the first conductive structures;

and a rewiring layer is arranged on one side of the third substrate, which is opposite to the second substrate, and is positioned between the driving circuit and the third substrate, and the driving circuit is electrically connected with the second conductive structure through the rewiring layer.

4. The phase shifter according to claim 2 or 3, further comprising a port to which a detection device is connected, the port being electrically connected to the rewiring layer.

5. The phase shifter as claimed in claim 4, wherein a surface of the rewiring layer facing the driving circuit is provided with solder balls, and the ports are soldered to the solder balls.

6. The phase shifter of claim 1, further comprising an encapsulation structure encasing the driving circuit.

7. Phase shifter as in claim 1, characterized in that the driving circuit comprises driving chips and/or passive devices.

8. The phase shifter according to claim 1, wherein the first substrate and the second substrate are glass substrates, printed circuit boards, or high-frequency substrates.

9. A method for manufacturing a phase shifter, the method being used for manufacturing the phase shifter according to claim 1, comprising:

providing a first substrate, and forming a grounding electrode on the first substrate, wherein the grounding electrode is electrically connected with a grounding signal end;

providing a second substrate on which a plurality of driving electrodes are formed; forming a plurality of driving circuits, at least one of the driving circuits corresponding to one of the driving electrodes, the driving circuits being electrically connected to the corresponding driving electrodes; forming frame sealing glue on the first substrate or the second substrate, aligning the first substrate and the second substrate, and pouring liquid crystal into the frame sealing glue; after the first substrate and the second substrate are aligned, the driving electrode is located on one side of the second substrate facing the first substrate, and the driving circuit is located on one side of the second substrate facing away from the first substrate.

10. The method of manufacturing according to claim 9, wherein a second substrate is provided, and a plurality of driving electrodes are formed on the second substrate; forming a plurality of driving circuits, at least one of the driving circuits corresponding to one of the driving electrodes, the driving circuits being electrically connected to the corresponding driving electrodes; forming frame sealing glue on the first substrate or the second substrate, and aligning the first substrate and the second substrate, wherein the process of filling liquid crystal in the frame sealing glue comprises the following steps:

providing the second substrate, arranging a plurality of first through holes on the second substrate, and forming a first conductive structure and a plurality of driving electrodes, wherein the first conductive structure is positioned in the first through holes, the driving electrodes are positioned on the first side of the second substrate, and the driving electrodes are electrically connected with the first conductive structure;

arranging a rewiring layer on a second side of the second substrate, wherein the rewiring layer is electrically connected with the first conductive structure, and the second side is opposite to the first side;

arranging a plurality of driving circuits on one side of the rewiring layer, which is opposite to the second substrate, and bonding the driving circuits with the rewiring layer;

and arranging frame sealing glue on the first substrate or the second substrate, aligning the first substrate and the second substrate, enabling the driving circuit to be positioned on one side of the driving electrode, which is back to the first substrate, and pouring liquid crystal in the frame sealing glue.

11. The method of manufacturing according to claim 9, wherein a second substrate is provided, and a plurality of driving electrodes are formed on the second substrate; forming a plurality of driving circuits, at least one of the driving circuits corresponding to one of the driving electrodes, the driving circuits being electrically connected to the corresponding driving electrodes; forming frame sealing glue on the first substrate or the second substrate, and aligning the first substrate and the second substrate, wherein the process of filling liquid crystal in the frame sealing glue comprises the following steps:

providing the second substrate, arranging a plurality of first through holes on the second substrate, and forming a first conductive structure and a plurality of driving electrodes, wherein the first conductive structure is positioned in the first through holes, the driving electrodes are positioned on one side of the second substrate, and the driving electrodes are electrically connected with the first conductive structure;

forming frame sealing glue on the first substrate or the second substrate, aligning the first substrate and the second substrate, enabling the driving electrode to be located on one side, facing the first substrate, of the second substrate, and pouring liquid crystal into the frame sealing glue;

providing a third substrate, wherein a plurality of second through holes are formed in the third substrate, and a second conductive structure and a rewiring layer are formed on the third substrate, wherein the second conductive structure is located in the second through holes, the rewiring layer is located on one side of the third substrate, and the rewiring layer is electrically connected with the second conductive structure;

arranging a plurality of driving circuits on one side, opposite to the third substrate, of the rewiring layer, and bonding the driving circuits with the rewiring layer;

and attaching the third substrate to the second substrate to electrically connect the first conductive structure and the second conductive structure.

12. The method of manufacturing according to claim 9, wherein a second substrate is provided, and a plurality of driving electrodes are formed on the second substrate; forming a plurality of driving circuits, at least one of the driving circuits corresponding to one of the driving electrodes, the driving circuits being electrically connected to the corresponding driving electrodes; forming frame sealing glue on the first substrate or the second substrate, and aligning the first substrate and the second substrate, wherein the process of filling liquid crystal in the frame sealing glue comprises the following steps:

providing the second substrate, arranging a plurality of first through holes on the second substrate, and forming a first conductive structure and a plurality of driving electrodes, wherein the first conductive structure is positioned in the first through holes, the driving electrodes are positioned on one side of the second substrate, and the driving electrodes are electrically connected with the first conductive structure;

forming frame sealing glue on the first substrate or the second substrate, aligning the first substrate and the second substrate, enabling the driving electrode to be located on one side, facing the first substrate, of the second substrate, and pouring liquid crystal into the frame sealing glue;

providing a fourth substrate, and arranging a rewiring layer on the fourth substrate;

peeling off the fourth substrate, and attaching the second substrate to the rewiring layer to electrically connect the first conductive structure with the rewiring layer;

and arranging a plurality of driving circuits on one side of the rewiring layer, which is opposite to the second substrate, and bonding the driving circuits with the rewiring layer.

13. The manufacturing method according to any one of claims 10 to 12, wherein after the formation of the rewiring layer, the manufacturing method further comprises:

forming a port electrically connected to the rewiring layer;

and electrically connecting a detection device with the port, and detecting the open circuit condition of the rewiring layer by using the detection device.

14. The manufacturing method according to any one of claims 10 to 12, wherein after bonding the driver circuit and the rewiring layer, the manufacturing method further comprises: and forming a packaging structure for coating the driving circuit.

15. An antenna, comprising:

a phase shifter according to any one of claims 1 to 8;

the radiators are arranged on the first substrate in the phase shifter;

the feed parts are arranged on the first substrate and are electrically connected with the radio-frequency signal end.

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of electromagnetic waves, in particular to a phase shifter, a manufacturing method thereof and an antenna.

[ background of the invention ]

With the gradual evolution of communication systems, phase shifters have been widely used, for example, liquid crystal phase shifters, when controlling the phase shift of the liquid crystal phase shifter, a driving circuit is used to control the liquid crystal in the liquid crystal box to turn over, so as to change the dielectric constant of the liquid crystal, thereby shifting the phase of the radio frequency signal transmitted in the liquid crystal phase shifter.

As shown in fig. 1, fig. 1 is a schematic structural diagram of a phase shifter in the prior art, a driving circuit 1 'of the phase shifter is usually disposed on an external driving board 2', and the external driving board 2 'is disposed at one side of a liquid crystal cell 3', so that the driving circuit 1 'and the liquid crystal cell 3' are in a discrete state, and further the phase shifter has a low integration level and high power consumption.

[ summary of the invention ]

In view of this, embodiments of the present invention provide a phase shifter, a method for manufacturing the phase shifter, and an antenna, so that the integration level of the phase shifter is improved, and the power consumption is reduced.

In one aspect, an embodiment of the present invention provides a phase shifter, including:

the first substrate is provided with a grounding electrode, and the grounding electrode is electrically connected with a grounding signal end;

the second substrate is arranged opposite to the first substrate, and one side, facing the first substrate, of the second substrate is provided with a plurality of driving electrodes;

the frame sealing glue is positioned between the first substrate and the second substrate and used for packaging the liquid crystal between the first substrate and the second substrate;

the driving circuits are positioned on one side, back to the first substrate, of the second substrate, at least one driving circuit corresponds to one driving electrode, and the driving circuits are electrically connected with the corresponding driving electrodes.

In another aspect, an embodiment of the present invention provides a method for manufacturing a phase shifter, where the method is used to manufacture the phase shifter, and includes:

providing a first substrate, and forming a grounding electrode on the first substrate, wherein the grounding electrode is electrically connected with a grounding signal end;

providing a second substrate on which a plurality of driving electrodes are formed; forming a plurality of driving circuits, at least one of the driving circuits corresponding to one of the driving electrodes, the driving circuits being electrically connected to the corresponding driving electrodes; forming frame sealing glue on the first substrate or the second substrate, aligning the first substrate and the second substrate, and pouring liquid crystal into the frame sealing glue; after the first substrate and the second substrate are aligned, the driving electrode is located on one side of the second substrate facing the first substrate, and the driving circuit is located on one side of the second substrate facing away from the first substrate.

In another aspect, an embodiment of the present invention provides an antenna, including:

the phase shifter;

the radiators are arranged on the first substrate in the phase shifter;

a plurality of feeding portions, the feeding portions are arranged on the first substrate and electrically connected with the radio frequency signal end

One of the above technical solutions has the following beneficial effects:

in the technical scheme provided by the embodiment of the invention, the driving circuit is arranged on the side of the second substrate, which is back to the first substrate, and the driving circuit and the liquid crystal box can be integrated and packaged together. In addition, by adopting the arrangement mode of the embodiment of the invention, the connecting wire electrically connected with the driving electrode is only electrically connected with the driving circuit through the second substrate without extending to the external driving board, so that the length of the connecting wire between the driving circuit and the driving electrode is reduced, the arrangement space of the connecting wire is saved, the load of the connecting wire is reduced, and the reduction of the power consumption of the phase shifter is realized.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a phase shifter in the prior art;

FIG. 2 is a schematic diagram of a phase shifter according to an embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along line A1-A2 of FIG. 2;

FIG. 4 is a top view of a phase shifter according to an embodiment of the present invention;

FIG. 5 is another cross-sectional view taken along line A1-A2 of FIG. 2;

FIG. 6 is a further cross-sectional view taken along line A1-A2 of FIG. 2;

FIG. 7 is a further cross-sectional view taken along line A1-A2 of FIG. 2;

fig. 8 is a schematic structural diagram of a package structure according to an embodiment of the invention;

FIG. 9 is a flow chart of a manufacturing method according to an embodiment of the present invention;

FIG. 10 is another flow chart of a method of fabricating a semiconductor device according to an embodiment of the present invention;

FIG. 11 is a flow chart of a structure corresponding to FIG. 10;

fig. 12 is a structural diagram corresponding to a manufacturing process of a redistribution layer according to an embodiment of the present invention;

fig. 13 is a structural diagram corresponding to another manufacturing process of the redistribution layer according to the embodiment of the present invention;

FIG. 14 is a flowchart illustrating a method of fabricating a semiconductor device according to an embodiment of the present invention;

FIG. 15 is a flow chart of the structure corresponding to FIG. 14;

FIG. 16 is a flowchart illustrating a method of fabricating a semiconductor device according to an embodiment of the present invention;

FIG. 17 is a flow chart of a structure corresponding to FIG. 16;

fig. 18 is a schematic structural diagram of an antenna according to an embodiment of the present invention;

FIG. 19 is a cross-sectional view taken along line B1-B2 of FIG. 18;

fig. 20 is a top view of an antenna provided in an embodiment of the invention.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.

It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that although the terms first and second may be used to describe the substrate, the via and the conductive structure in the embodiments of the present invention, the substrate, the via and the conductive structure should not be limited to these terms, which are used only to distinguish the substrate, the via and the conductive structure from each other. For example, the first substrate may also be referred to as a second substrate, and similarly, the second substrate may also be referred to as a first substrate, without departing from the scope of embodiments of the present invention.

An embodiment of the present invention provides a phase shifter, as shown in fig. 2 to 4, fig. 2 is a schematic structural diagram of the phase shifter provided in the embodiment of the present invention, fig. 3 is a cross-sectional view taken along a direction a1-a2 of fig. 2, and fig. 4 is a top view of the phase shifter provided in the embodiment of the present invention, the phase shifter includes: the circuit comprises a first substrate 1, wherein a grounding electrode 2 is arranged on the first substrate 1, and the grounding electrode 2 is electrically connected with a grounding signal terminal 3; a second substrate 4 disposed opposite to the first substrate 1, the second substrate 4 having a plurality of driving electrodes 5 disposed on a side facing the first substrate 1; the frame sealing glue 6 is positioned between the first substrate 1 and the second substrate 4, and the frame sealing glue 6 is packaged in the liquid crystal 7 between the first substrate 1 and the second substrate 4; and the driving circuits 8 are positioned on one side, opposite to the first substrate 1, of the second substrate 4, at least one driving circuit 8 corresponds to one driving electrode 5, and the driving circuit 8 is electrically connected with the corresponding driving electrode 5.

It is understood that, referring to fig. 3 again, the alignment films 9 are disposed on the side of the second substrate 4 facing the first substrate 1 and on the side of the first substrate 1 facing the second substrate 4, and the applied voltage between the ground electrode 2 and the driving electrode 5 drives the liquid crystal 7 to normally deflect.

With reference to fig. 19 and 20, a feeding portion 10 and a radiating body 11 are further disposed on a side of the first substrate 1 facing away from the second substrate 4, the feeding portion 10 is electrically connected to a radio frequency signal end 32, when the phase shifter shifts a phase of a radio frequency signal, the radio frequency signal end 32 provides the radio frequency signal to the feeding portion 10, the ground signal end 3 provides a ground signal to the ground electrode 2, and the driving circuit 8 provides a driving signal to the driving electrode 5 electrically connected thereto; the rf signal transmitted in the feeding portion 10 is coupled to the driving electrode 5 through the first opening 12 of the ground electrode 2, the liquid crystal 7 in the phase shifter is deflected under the action of the electric field formed by the ground electrode 2 and the driving electrode 5, so that the dielectric constant of the liquid crystal 7 is changed, the phase of the rf signal transmitted on the driving electrode 5 is shifted, and the phase-shifted rf signal is coupled to the radiator 11 through the second opening 13 of the ground electrode 2 and radiated out through the radiator 11 (the transmission path of the rf signal is shown by the arrow in fig. 19). In order to increase the transmission path of the rf signal on the driving electrode 5, so as to shift the phase more sufficiently and improve the accuracy of the phase shift, please refer to fig. 4 again, the driving electrode 5 may be configured as a serpentine strip-shaped routing structure.

In the phase shifter provided by the embodiment of the invention, the driving circuit 8 is arranged on the side of the second substrate 4 opposite to the first substrate 1, and the driving circuit 8 and the liquid crystal box can be integrated and packaged together. Moreover, by adopting the arrangement mode of the embodiment of the invention, the connecting wire electrically connected with the driving electrode 5 is only electrically connected with the driving circuit 8 through the second substrate 4, and does not need to extend to the external driving board, so that the length of the connecting wire between the driving circuit 8 and the driving electrode 5 is reduced, the arrangement space of the connecting wire is saved, the load of the connecting wire is also reduced, and the reduction of the power consumption of the phase shifter is realized.

It should be noted that the driving circuit 8 may specifically be formed by a driving chip or a passive device, and since the thicknesses of the driving chip and the passive device are both small, even if the driving circuit 8 is disposed on the side of the second substrate 4 facing away from the first substrate 1, the driving circuit 8 does not have a large influence on the overall thickness of the phase shifter, that is, in the arrangement manner of the embodiment of the present invention, the influence of the driving circuit 8 on the overall area and volume of the phase shifter is much smaller than the influence of the external connection driving board on the overall area and volume of the phase shifter, and therefore, the occupied space of the phase shifter can be effectively reduced by using the arrangement manner provided by the embodiment of the present invention.

Alternatively, as shown in fig. 5, fig. 5 is another cross-sectional view taken along a1-a2 direction in fig. 2, a plurality of first through holes 14 are formed on the second substrate 4, first conductive structures 15 are formed in the first through holes 14, and the first conductive structures 15 are electrically connected to the driving electrodes 5; a rewiring layer 16 is arranged on the side, opposite to the driving electrode 5, of the second substrate 4, the rewiring layer 16 is located between the driving circuit 8 and the second substrate 4, and the driving circuit 8 is electrically connected with the first conductive structure 15 through the rewiring layer 16.

The rewiring layer 16 may include a plurality of metal layers, and the rewiring layer 16 may not only achieve interconnection of a plurality of pins in the driving circuit 8, but also achieve electrical connection between the driving circuit 8 and the first conductive structure 15, so that the driving circuit 8 is electrically connected to the driving electrode 5, and effective integrated packaging of the driving circuit 8 and the liquid crystal cell is achieved by using a panel-level fan-out packaging technology. Moreover, based on the structure, the driving electrode 5 and the driving circuit 8 are directly arranged on the opposite side of the second substrate 4, and an additional substrate for bearing the driving circuit 8 is not required to be arranged in the phase shifter, so that the thickness of the phase shifter is reduced, and the manufacturing cost of the phase shifter is reduced.

In addition, it should be noted that, in order to simplify the process flow and reduce the manufacturing cost, the driving electrode 5 and the first conductive structure 15 may be formed by using the same patterning process.

Alternatively, as shown in fig. 6, fig. 6 is another cross-sectional view taken along a1-a2 direction in fig. 2, a plurality of first through holes 14 are formed on the second substrate 4, first conductive structures 15 are formed in the first through holes 14, and the first conductive structures 15 are electrically connected with the driving electrodes 5; the phase shifter further comprises a third substrate 17, the third substrate 17 is located on one side, back to the first substrate 1, of the second substrate 4, a plurality of second through holes 18 are formed in the third substrate 17, second conductive structures 19 are arranged in the second through holes 18, and the second conductive structures 19 are electrically connected with the first conductive structures 15; a rewiring layer 16 is arranged on the side, opposite to the second substrate 4, of the third substrate 17, the rewiring layer 16 is located between the driving circuit 8 and the third substrate 17, and the driving circuit 8 is electrically connected with the second conductive structure 19 through the rewiring layer 16.

The rewiring layer 16 may include a plurality of metal layers, and the rewiring layer 16 may not only achieve interconnection of a plurality of pins in the driving circuit 8, but also achieve electrical connection between the driving circuit 8 and the second conductive structure 19, so that the driving circuit 8 is electrically connected to the driving electrode 5, and effective integrated packaging of the driving circuit 8 and the liquid crystal cell is achieved by using a panel-level fan-out packaging technology. Moreover, by arranging the third substrate 17 for carrying the driving circuit 8 in the phase shifter, the driving electrode 5 and the driving circuit 8 can be independently formed on the second substrate 4 and the third substrate 17 respectively in the manufacturing process of the phase shifter, and the manufacturing processes of the driving electrode 5 and the driving circuit 8 can be synchronously performed, thereby saving the process time and improving the efficiency.

In addition, in order to simplify the process flow and reduce the manufacturing cost, the driving electrode 5 and the first conductive structure 15 may be formed by using the same patterning process, and the redistribution layer 16 and the second conductive structure 19 may be formed by using the same patterning process.

Alternatively, as shown in fig. 7, fig. 7 is a further cross-sectional view taken along a1-a2 of fig. 2, and the phase shifter further includes a port 20 for connecting a detection device, wherein the port 20 is electrically connected to the redistribution layer 16, and the detection device may be an external detection device or a signal source inside the phase shifter. With this arrangement, after the driving circuit 8 is bonded to the redistribution layer 16, the detection device is connected to the port 20, so that the detection device can detect the disconnection of the redistribution layer 16, and detect whether the redistribution layer 16 can normally transmit signals, thereby improving the operation stability of the phase shifter.

Further, a solder ball 21 is disposed on a surface of the redistribution layer 16 facing the driving circuit 8, and the port 20 is soldered on the solder ball 21, so as to achieve stable connection between the port 20 and the redistribution layer 16, and specifically, the solder ball 21 may be formed by ball-mounting.

Optionally, as shown in fig. 8, fig. 8 is a schematic structural diagram of a package structure 22 provided in the embodiment of the present invention, and the phase shifter further includes the package structure 22 covering the driving circuit 8, so as to protect the driving circuit 8 and prevent the driving circuit 8 from being damaged in a subsequent process flow, thereby improving stability and reliability of the driving circuit 8 providing the driving signal to the driving electrode 5. Specifically, the package structure 22 may be formed by an injection Molding process from an Epoxy Molding Compound (EMC) material.

Optionally, to implement the normal operation of the driving circuit 8, the driving circuit 8 includes a driving chip and/or a passive device, where the passive device may specifically include a capacitor, an inductor, a resistor, and the like.

Alternatively, the first substrate 1 and the second substrate 4 may be glass substrates, printed circuit boards, or high-frequency substrates, wherein when the first substrate 1 and the second substrate 4 are high-frequency substrates, an RF4 substrate, a ceramic substrate, a teflon-based substrate, or the like may be specifically employed.

An embodiment of the present invention further provides a method for manufacturing a phase shifter, which is used to manufacture the phase shifter, and as shown in fig. 9 with reference to fig. 2 to 4, fig. 9 is a flowchart of a manufacturing method according to an embodiment of the present invention, where the manufacturing method includes:

step S1: a first substrate 1 is provided, a grounding electrode 2 is formed on the first substrate 1, and the grounding electrode 2 is electrically connected with a grounding signal terminal 3.

Step S2: providing a second substrate 4, and forming a plurality of driving electrodes 5 on the second substrate 4; forming a plurality of driving circuits 8, wherein at least one driving circuit 8 corresponds to one driving electrode 5, and the driving circuit 8 is electrically connected with the corresponding driving electrode 5; forming frame sealing glue 6 on the first substrate 1 or the second substrate 4, aligning the first substrate 1 and the second substrate 4, and filling liquid crystal 7 in the frame sealing glue 6; after the first substrate 1 and the second substrate 4 are aligned, the driving electrode 5 is located on one side of the second substrate 4 facing the first substrate 1, and the driving circuit 8 is located on one side of the second substrate 4 facing away from the first substrate 1.

By adopting the manufacturing method provided by the embodiment of the invention, the driving circuit 8 is arranged on the side of the second substrate 4 opposite to the first substrate 1, and the driving circuit 8 and the liquid crystal box can be integrally packaged together, so that compared with the prior art, the integration level of the phase shifter is improved, the area and the volume of the phase shifter are reduced, the length of a connecting line between the driving circuit 8 and the driving electrode 5 is also reduced, the load of the connecting line is reduced, and the power consumption of the phase shifter is reduced.

Optionally, with reference to fig. 5, as shown in fig. 10 and fig. 11, fig. 10 is another flowchart of the manufacturing method according to the embodiment of the present invention, fig. 11 is a flowchart of a structure corresponding to fig. 10, and step S2 may specifically include:

step S21: providing a second substrate 4, providing a plurality of first through holes 14 on the second substrate 4, and forming a first conductive structure 15 and a plurality of driving electrodes 5, wherein the first conductive structure 15 is located in the first through holes 14, the driving electrodes 5 are located on a first side of the second substrate 4, and the driving electrodes 5 are electrically connected with the first conductive structure 15. The first conductive structure 15 and the driving electrode 5 may be formed by the same patterning process, or the first conductive structure 15 may be formed in the first via hole 14 and then the driving electrode 5 may be formed.

In addition, in step S21, a carrier substrate for carrying the second substrate 4 may also be provided, so that the metal material forming the first conductive structure 15 is filled in the first via hole 14, and the carrier substrate only needs to be peeled off after the driving electrode 5 is formed, or a buffer layer, such as a PI layer, may be provided on the carrier substrate in advance for the purpose of peeling off later.

Step S22: a re-wiring layer 16 is provided on a second side of the second substrate 4, the re-wiring layer 16 being electrically connected to the first conductive structure 15, the second side being the opposite side of the first side.

Step S23: a plurality of drive circuits 8 are provided on the side of the rewiring layer 16 facing away from the second substrate 4, and the drive circuits 8 are bonded to the rewiring layer 16.

Step S24: the frame sealing glue 6 is arranged on the first substrate 1 or the second substrate 4, the first substrate 1 and the second substrate 4 are paired, the driving circuit 8 is positioned on one side of the driving electrode 5, which is back to the first substrate 1, and the frame sealing glue 6 is filled with liquid crystal 7.

By arranging the rewiring layer 16 on one side of the second substrate 4, not only can interconnection of a plurality of pins in the driving circuit 8 be realized, but also the driving circuit 8 and the driving electrode 5 can be electrically connected, so that effective integrated packaging of the driving circuit 8 and a liquid crystal box is realized by utilizing a panel-level fan-out packaging technology. Moreover, the driving electrode 5 and the driving circuit 8 are directly arranged on the opposite side of the second substrate 4, and an additional substrate for bearing the driving circuit 8 is not required to be arranged in the phase shifter, so that the thickness of the phase shifter is reduced, and the manufacturing cost of the phase shifter is reduced.

Further, the redistribution layer 16 may include multiple metal layers formed of copper material, and taking the example that the redistribution layer 16 includes three copper layers, as follows, the embodiment of the present invention provides two formation methods of the redistribution layer 16:

the first method comprises the following steps: as shown in fig. 12, fig. 12 is a structural diagram corresponding to the manufacturing flow of the redistribution layer according to the embodiment of the present invention, and step Q1: sputtering on the second substrate 4 to form a seed layer 23, coating a photoresist 24 on the seed layer 23, and exposing and developing the photoresist 24; step Q2: electroplating a first layer of copper 25, removing the photoresist 24, and etching the seed layer 23; step Q3: coating to form a first insulating layer 26, and exposing and developing the first insulating layer 26; step Q4: electroplating a second layer of copper metal 27; step Q5: coating to form a second insulating layer 28, and exposing and developing the second insulating layer 28; step Q6: a third layer of copper metal 29 is electroplated to form the re-wiring layer 16.

Secondly, as shown in fig. 13, fig. 13 is a structural diagram corresponding to another manufacturing flow of the redistribution layer according to the embodiment of the present invention, and step K1: depositing a first layer of copper metal 25 on the second substrate 4 and patterning; step K2: coating to form a first insulating layer 26, and exposing and developing the first insulating layer 26; step K3: depositing a second layer of copper metal 27 and patterning; step K4: coating to form a second insulating layer 28, and exposing and developing the second insulating layer 28; step K5: a third layer of copper metal 29 is deposited and patterned to form the re-wiring layer 16.

Alternatively, with reference to fig. 6, as shown in fig. 14 and fig. 15, fig. 14 is a flowchart of a manufacturing method according to an embodiment of the present invention, fig. 15 is a flowchart of a structure corresponding to fig. 14, and step S2 may specifically include:

step S21': providing a second substrate 4, providing a plurality of first through holes 14 on the second substrate 4, and forming a first conductive structure 15 and a plurality of driving electrodes 5, wherein the first conductive structure 15 is located in the first through holes 14, the driving electrodes 5 are located on one side of the second substrate 4, and the driving electrodes 5 are electrically connected with the first conductive structure 15. The first conductive structure 15 and the driving electrode 5 may be formed by the same patterning process, or the first conductive structure 15 may be formed in the first via hole 14 and then the driving electrode 5 may be formed.

Step S22': forming frame sealing glue 6 on the first substrate 1 or the second substrate 4, aligning the first substrate 1 and the second substrate 4, enabling the driving electrode 5 to be positioned on one side of the second substrate 4 facing the first substrate 1, and filling liquid crystal 7 into the frame sealing glue 6;

step S23': providing a third substrate 17, wherein a plurality of second through holes 18 are formed in the third substrate 17, and a second conductive structure 19 and a redistribution layer 16 are formed, wherein the second conductive structure 19 is located in the second through holes 18, the redistribution layer 16 is located on one side of the third substrate 17, and the redistribution layer 16 is electrically connected with the second conductive structure 19. The second conductive structure 19 and the rewiring layer 16 may be formed by the same patterning process, or the second conductive structure 19 may be formed in the second via 18 and the rewiring layer 16 may be formed.

Step S24': a plurality of drive circuits 8 are provided on the side of the rewiring layer 16 facing away from the third substrate 17, and the drive circuits 8 are bonded to the rewiring layer 16.

Step S25': the third substrate 17 is bonded to the second substrate 4, and the first conductive structure 15 and the second conductive structure 19 are electrically connected. Specifically, the second substrate 4 or the third substrate 17 is provided with an alignment mark, and the third substrate 17 and the second substrate 4 are aligned and attached by using the alignment mark, so as to ensure stable electrical connection between the first conductive structure 15 and the second conductive structure 19.

By forming the rewiring layer 16 on the third substrate 17, not only can interconnection of a plurality of pins in the driving circuit 8 be realized, but also the driving circuit 8 and the driving electrode 5 can be electrically connected, so that effective integrated packaging of the driving circuit 8 and the liquid crystal box is realized by utilizing a panel-level fan-out packaging technology. Moreover, by arranging the third substrate 17 for carrying the driving circuit 8, the driving electrode 5 and the driving circuit 8 can be respectively and independently formed on the second substrate 4 and the third substrate 17, and the manufacturing processes of the driving electrode 5 and the driving circuit 8 can be synchronously performed, so that the process time is saved, and the efficiency is improved.

Alternatively, referring to fig. 5, as shown in fig. 16 and fig. 17, fig. 16 is a flowchart of a further manufacturing method according to an embodiment of the present invention, fig. 17 is a flowchart of a structure corresponding to fig. 16, and step S2 may specifically include:

step S21 ″: providing a second substrate 4, providing a plurality of first through holes 14 on the second substrate 4, and forming a first conductive structure 15 and a plurality of driving electrodes 5, wherein the first conductive structure 15 is located in the first through holes 14, the driving electrodes 5 are located on one side of the second substrate 4, and the driving electrodes 5 are electrically connected with the first conductive structure 15. The first conductive structure 15 and the driving electrode 5 may be formed by the same patterning process, or the first conductive structure 15 may be formed in the first via hole 14 and then the driving electrode 5 may be formed.

Step S22 ″: forming frame sealing glue 6 on the first substrate 1 or the second substrate 4, aligning the first substrate 1 and the second substrate 4, positioning the driving electrode 5 at one side of the second substrate 4 facing the first substrate 1, and filling liquid crystal 7 in the frame sealing glue 6.

Step S23 ″: a fourth substrate 30 is provided, and a rewiring layer 16 is provided on the fourth substrate 30.

Step S24 ″: the fourth substrate 30 is peeled off, and the second substrate 4 is bonded to the rewiring layer 16, so that the first conductive structure 15 is electrically connected to the rewiring layer 16.

Step S25 ″: a plurality of drive circuits 8 are provided on the side of the rewiring layer 16 facing away from the second substrate 4, and the drive circuits 8 are bonded to the rewiring layer 16.

Based on the manufacturing method, by arranging the fourth substrate 30 for carrying the driving circuit 8, the driving electrode 5 and the driving circuit 8 can be respectively and independently formed on the second substrate 4 and the fourth substrate 30, and the manufacturing processes of the driving electrode 5 and the driving circuit 8 can be synchronously performed, so that the process time is saved, and the efficiency is improved; moreover, the fourth substrate 30 is peeled off later, so that the fourth substrate 30 can be prevented from occupying space in the phase shifter, and the thickness of the phase shifter is reduced.

In addition, compared with the method that the driving circuit 8 is formed on the fourth substrate 30 and then the fourth substrate 30 is peeled off, in the embodiment of the present invention, the fourth substrate 30 is peeled off first, so that the second substrate 4 is bonded to the rewiring layer 16, and then the driving circuit 8 is bonded to the rewiring layer 16, so that damage to the driving circuit 8 in the peeling and bonding process can be avoided, and reliability and stability of the driving circuit 8 for providing the driving signal to the driving motor can be improved.

Optionally, with reference to fig. 7, after forming the redistribution layer 16, the manufacturing method further includes: forming a port 20 electrically connected to the rewiring layer 16; the detection device is electrically connected with the port 20, and the detection device is used for detecting the open circuit condition of the rewiring layer 16 so as to detect whether the rewiring layer 16 can normally transmit signals, thereby improving the working stability of the phase shifter.

Optionally, with reference to fig. 8, after bonding the driving circuit 8 and the redistribution layer 16, the manufacturing method further includes: a package structure 22 for covering the driving circuit 8 is formed to protect the driving circuit 8, so as to prevent the driving circuit 8 from being damaged in the subsequent process flow, thereby improving the stability and reliability of the driving circuit 8 for providing the driving signal to the driving electrode 5. Specifically, the package structure 22 may be formed by an injection Molding process from an Epoxy Molding Compound (EMC) material.

Fig. 18 to 20 show that fig. 18 is a schematic structural diagram of the antenna provided in the embodiment of the present invention, fig. 19 is a sectional view of fig. 18 taken along a direction B1-B2, and fig. 20 is a top view of the antenna provided in the embodiment of the present invention, where the antenna includes: the phase shifter 100 described above; a plurality of radiators 11, the radiators 11 being disposed on the first substrate 1 in the phase shifter 100; and a plurality of power feeding units 10, wherein the power feeding units 10 are arranged on the first substrate 1, and the power feeding units 10 are electrically connected with the radio frequency signal end 32. The working principle of the antenna has been described in the above embodiments, and is not described herein again.

Since the antenna provided by the embodiment of the present invention includes the phase shifter 100, compared with the prior art, the antenna occupies a smaller space and consumes less power, which is not only beneficial to the light and thin design of the antenna, but also can reduce the application cost of the antenna.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.