阅读说明：本技术 一种微带板均衡器 (Microstrip board equalizer ) 是由 潘华府 桑飞 叶宝江 韩洋 钟卉 胡芳 王开伟 刘瑞 张勇 高朝辉 于 2021-08-03 设计创作，主要内容包括：本发明公开一种微带板均衡器,包括微带线和微带板,微带线设置在微带板上,微带线设置有第一微带线、第二微带线、第三微带线、第四微带线和第五微带线,第二微带线的两端分别连接第一微带线和负载,第三微带线连接在第二微带线的一侧,第四微带线和第五微带线设置在第二微带线的另一侧,第四微带线设置在第一微带线和第五微带线之间；本发明微带板均衡器降低了固态组件及功率放大器输出功率起伏,由原来固态组件的100％调试率降低到30％调试率,同时在均衡器上调试有效的降低了主微带的驻波,减少了组件的温升,固态组件的散热效果和质量有了很大的提升,在实际的生产过程中,功率管的损坏率由原来6％降低到2％以下,大大降低了调试成本。(The invention discloses a microstrip board equalizer, which comprises a microstrip line and a microstrip board, wherein the microstrip line is arranged on the microstrip board and is provided with a first microstrip line, a second microstrip line, a third microstrip line, a fourth microstrip line and a fifth microstrip line, two ends of the second microstrip line are respectively connected with the first microstrip line and a load, the third microstrip line is connected with one side of the second microstrip line, the fourth microstrip line and the fifth microstrip line are arranged on the other side of the second microstrip line, and the fourth microstrip line is arranged between the first microstrip line and the fifth microstrip line; the microstrip board equalizer reduces the fluctuation of the output power of the solid component and the power amplifier, reduces the debugging rate from 100 percent to 30 percent of the original debugging rate of the solid component, simultaneously effectively reduces the standing wave of the main microstrip by debugging on the equalizer, reduces the temperature rise of the component, greatly improves the heat dissipation effect and the quality of the solid component, reduces the damage rate of a power tube from 6 percent to below 2 percent in the actual production process, and greatly reduces the debugging cost.)

1. The microstrip board equalizer is characterized by comprising a microstrip line and a microstrip board, wherein the microstrip line is arranged on the microstrip board, the microstrip line is provided with a first microstrip line, a second microstrip line, a third microstrip line, a fourth microstrip line and a fifth microstrip line, two ends of the second microstrip line are respectively connected with the first microstrip line and a load, the third microstrip line is connected to one side of the second microstrip line, the fourth microstrip line and the fifth microstrip line are arranged on the other side of the second microstrip line, and the fourth microstrip line is arranged between the first microstrip line and the fifth microstrip line.

2. The microstrip board equalizer according to claim 1, wherein the second microstrip comprises a first microstrip section, a second microstrip section, and a third microstrip section, wherein one end of the first microstrip section is connected perpendicularly to the first microstrip section, the other end of the first microstrip section is connected perpendicularly to the end of the second microstrip section, one end of the third microstrip section is connected to the load, and the other end of the third microstrip section is connected perpendicularly to the end of the second microstrip section.

3. The microstrip board equalizer according to claim 2, wherein the third microstrip line comprises a fourth microstrip section, a fifth microstrip section, a sixth microstrip section and a seventh microstrip section, one end of the fourth microstrip section is perpendicularly connected to the second microstrip line, the other end of the fourth microstrip section is perpendicularly connected to the end of the fifth microstrip section, and the end of the fifth microstrip section is connected to the end of the seventh microstrip section through the sixth microstrip section.

4. The microstrip board equalizer according to claim 3, wherein the fourth microstrip comprises an eighth microstrip segment, a ninth microstrip segment and a tenth microstrip segment, wherein one end of the eighth microstrip segment is vertically connected to the second microstrip, the other end of the eighth microstrip segment is vertically connected to the end of the ninth microstrip segment, and the end of the tenth microstrip segment is vertically connected to the end of the ninth microstrip segment.

5. The microstrip-board equalizer of claim 4 wherein the fifth microstrip line comprises an eleventh microstrip segment and a twelfth microstrip segment, wherein one end of the eleventh microstrip segment is vertically connected to the second microstrip line, and the other end of the eleventh microstrip segment is vertically connected to an end of the twelfth microstrip segment.

6. The microstrip plate equalizer of claim 5 wherein the fourth microstrip segment, the eighth microstrip segment and the eleventh microstrip segment are each connected perpendicularly to the third microstrip segment.

7. The microstrip plate equalizer of claim 5 wherein the first, second and third microstrip segments have the same width, the fourth, fifth and seventh microstrip segments have the same width, the eighth, ninth and tenth microstrip segments have the same width, the eleventh and twelfth microstrip segments have the same width, and the sixth microstrip segment has a width greater than the seventh microstrip segment.

8. The microstrip plate equalizer of claim 5 wherein equal-linewidth 45 degree chamfers are disposed between the first microstrip segment and the second microstrip segment, between the third microstrip segment and the second microstrip segment, between the fourth microstrip segment and the fifth microstrip segment, between the ninth microstrip segment and the tenth microstrip segment, and between the eleventh microstrip segment and the twelfth microstrip segment.

Technical Field

The invention relates to the technical field of equalizer equipment, in particular to a microstrip board equalizer.

Background

With the rapid development and progress of the modern microwave technology, the radar product is rapidly updated; the all-solid-state microwave component is already applied to a radar transmitting system on a large scale, the size of a radar transmitter is reduced, the power capacity is larger, the key technology for realizing a quasi-phased array and a full-phased array by the radar is realized, and meanwhile, the stability and the service life of the radar transmitter are greatly improved. Power fluctuations of solid state components are an important specification. Excessive power fluctuations in the solid state components can affect the phase parameter correction of the antenna, the combiner and the safe operation of the cable. The index completely depends on the fluctuation of the output power of the microwave power tube, the fluctuation of the output power of the power tube is 1.5dB to 2dB (for example, M/A-COM, NXP, China electrical department 13 and other companies), and the power has the curve characteristic that the output power of high-end frequency is small, the output power of middle frequency is large, and the output power of low-end frequency is between two. Meanwhile, the power fluctuation of the solid components is regulated to be not more than 1.4dB in the technical index of the product (note that if the output power P of one solid component is more than or equal to 1000W, and the output fluctuation of the solid component is not more than 1.4dB, the maximum power output by the solid component can be calculated to be 1380), wherein 95% of the fluctuation of the solid components is more than 1.9dB, and each solid component can meet the technical index requirement after a large amount of debugging.

At present, in order to realize that the fluctuation of the output power of the solid-state component meets the requirement, the debugging is needed to be carried out on a main microstrip (microstrip line for transmitting radio frequency signals), the debugging is to weld a copper foil on the main microstrip to change the matching characteristic of the microstrip line, increase the middle frequency loss of the frequency bandwidth, reduce the output power of the solid-state component, and ensure that the high-end power is increased, so that the fluctuation of the output power of the solid-state component meets the index requirement. In the debugging method, the power of the intermediate frequency point is retained on the microstrip, so that the temperature of the solid-state component is increased, the standing wave of the microstrip is enlarged, the service life of the power tube is shortened, the damage rate of the power tube in the debugging process is about 6 percent, and meanwhile, the power tube belongs to a core valuable device of the solid-state component, so that great loss is caused in the debugging process. The stability of the assembly is also affected.

In view of the above-mentioned drawbacks, the inventors of the present invention have finally obtained the present invention through a long period of research and practice.

Disclosure of Invention

In order to solve the technical defects, a technical solution adopted by the present invention is to provide a microstrip board equalizer, including a microstrip line and a microstrip board, where the microstrip line is disposed on the microstrip board, the microstrip line is provided with a first microstrip line, a second microstrip line, a third microstrip line, a fourth microstrip line and a fifth microstrip line, two ends of the second microstrip line are respectively connected to the first microstrip line and a load, the third microstrip line is connected to one side of the second microstrip line, the fourth microstrip line and the fifth microstrip line are disposed on the other side of the second microstrip line, and the fourth microstrip line is disposed between the first microstrip line and the fifth microstrip line.

Preferably, the second microstrip line includes a first microstrip section, a second microstrip section, and a third microstrip section, one end of the first microstrip section is vertically connected to the first microstrip line, the other end of the first microstrip section is vertically connected to the end of the second microstrip section, one end of the third microstrip section is connected to the load, and the other end of the third microstrip section is vertically connected to the end of the second microstrip section.

Preferably, the third microstrip line includes a fourth microstrip section, a fifth microstrip section, a sixth microstrip section, and a seventh microstrip section, one end of the fourth microstrip section is vertically connected to the second microstrip line, the other end of the fourth microstrip section is vertically connected to the end of the fifth microstrip section, and the end of the fifth microstrip section is connected to the end of the seventh microstrip section through the sixth microstrip section.

Preferably, the fourth microstrip line includes an eighth microstrip section, a ninth microstrip section, and a tenth microstrip section, one end of the eighth microstrip section is vertically connected to the second microstrip line, the other end of the eighth microstrip section is vertically connected to the end of the ninth microstrip section, and the end of the tenth microstrip section is vertically connected to the end of the ninth microstrip section.

Preferably, the fifth microstrip line includes an eleventh microstrip section and a twelfth microstrip section, one end of the eleventh microstrip section is vertically connected to the second microstrip line, and the other end of the eleventh microstrip section is vertically connected to an end of the twelfth microstrip section.

Preferably, the fourth microstrip segment, the eighth microstrip segment and the eleventh microstrip segment are all connected to the third microstrip segment vertically.

Preferably, the widths of the first microstrip segment, the second microstrip segment and the third microstrip segment are the same, the widths of the fourth microstrip segment, the fifth microstrip segment and the seventh microstrip segment are the same, the widths of the eighth microstrip segment, the ninth microstrip segment and the tenth microstrip segment are the same, the widths of the eleventh microstrip segment and the twelfth microstrip segment are the same, and the width of the sixth microstrip segment is greater than the width of the seventh microstrip segment.

Preferably, 45-degree chamfers with equal line widths are arranged between the first microstrip segment and the second microstrip segment, between the third microstrip segment and the second microstrip segment, between the fourth microstrip segment and the fifth microstrip segment, between the ninth microstrip segment and the tenth microstrip segment, and between the eleventh microstrip segment and the twelfth microstrip segment.

Compared with the prior art, the invention has the beneficial effects that: the design and the use of the microstrip board equalizer effectively reduce the fluctuation of the output power of the solid component and the power amplifier, the debugging rate of the original solid component is reduced from 100 percent to 30 percent, meanwhile, the debugging on the equalizer effectively reduces the standing wave of the main microstrip, reduces the temperature rise of the component, greatly improves the heat dissipation effect and the quality of the solid component, reduces the damage rate of a power tube from 6 percent to below 2 percent in the actual production process, and greatly reduces the debugging cost.

Drawings

FIG. 1 is a structural view of the microstrip plate equalizer;

fig. 2 is a structural view of a microstrip line according to an embodiment;

FIG. 3 is a complementary view of the structure of FIG. 2;

fig. 4 is a graph of the output power fluctuation curve and attenuation curve of the solid state device and the power amplifier module.

The figures in the drawings represent:

1-a microstrip line; 2-a microstrip plate; 3-loading; 4-fixing the threaded hole.

Detailed Description

The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.

As shown in fig. 1, fig. 1 is a structural view of the microstrip board equalizer; the microstrip board equalizer comprises a microstrip line 1 and a microstrip board 2, wherein the microstrip line 1 is arranged on the microstrip board 2, the microstrip line 1 is provided with a first microstrip line, a second microstrip line, a third microstrip line, a fourth microstrip line and a fifth microstrip line, two ends of the second microstrip line are respectively connected with the first microstrip line and a load 3, the third microstrip line is connected to one side of the second microstrip line, the fourth microstrip line and the fifth microstrip line are arranged on the other side of the second microstrip line, and the fourth microstrip line is arranged between the first microstrip line and the fifth microstrip line.

The second microstrip line comprises a first microstrip section, a second microstrip section and a third microstrip section, one end of the first microstrip section is vertically connected with the first microstrip line, the other end of the first microstrip section is vertically connected with the end part of the second microstrip section, one end of the third microstrip section is connected with the load 3, and the other end of the third microstrip section is vertically connected with the end part of the second microstrip section.

The third microstrip line comprises a fourth microstrip section, a fifth microstrip section, a sixth microstrip section and a seventh microstrip section, one end of the fourth microstrip section is vertically connected with the second microstrip line, the other end of the fourth microstrip section is vertically connected with the end part of the fifth microstrip section, and the end part of the fifth microstrip section is connected with the end part of the seventh microstrip section through the sixth microstrip section.

The fourth microstrip line comprises an eighth microstrip section, a ninth microstrip section and a tenth microstrip section, one end of the eighth microstrip section is vertically connected with the second microstrip line, the other end of the eighth microstrip section is vertically connected with the end part of the ninth microstrip section, and the end part of the tenth microstrip section is vertically connected with the end part of the ninth microstrip section.

The fifth microstrip line comprises an eleventh microstrip section and a twelfth microstrip section, one end of the eleventh microstrip section is vertically connected with the second microstrip line, and the other end of the eleventh microstrip section is vertically connected with the end part of the twelfth microstrip section.

The fourth microstrip segment, the eighth microstrip segment and the eleventh microstrip segment are all vertically connected with the third microstrip segment.

Preferably, the widths of the first microstrip segment, the second microstrip segment and the third microstrip segment are the same, the widths of the fourth microstrip segment, the fifth microstrip segment and the seventh microstrip segment are the same, the widths of the eighth microstrip segment, the ninth microstrip segment and the tenth microstrip segment are the same, the widths of the eleventh microstrip segment and the twelfth microstrip segment are the same, and the width of the sixth microstrip segment is greater than the width of the seventh microstrip segment.

Preferably, 45-degree chamfers with equal line widths are arranged between the first microstrip segment and the second microstrip segment, between the third microstrip segment and the second microstrip segment, between the fourth microstrip segment and the fifth microstrip segment, between the ninth microstrip segment and the tenth microstrip segment, and between the eleventh microstrip segment and the twelfth microstrip segment.

Preferably, one end face of the microstrip plate 2 is provided with the microstrip line 1, and the other end face is provided with a mounting plate for mounting on equipment.

The mounting panel can set up to aluminum plate, aluminum plate is last to be provided with fixed screw hole 4, fixes on subassembly casing or power amplifier module bottom plate with the screw.

The mounting plate may be provided as a copper foil which is brazed to the solid state component housing or to the base plate of the power amplifier module.

Preferably, the load 3 has a size of 32-1121, a resistance value of 50 Ω, a rated power of 50W, and is in a flange structure and fixed on the metal box or the power amplification module by screws.

In the actual design of a microstrip circuit, the equalizer 2 of the microstrip board is connected in series with the input end of an amplifier, and the equalizer 2 of the microstrip board attenuates microwave signals to meet the requirements of fluctuation of output power of a solid component and a power amplifier module; if the output power fluctuation of the solid-state component and the power amplifier module still can not meet the requirement, debugging can be carried out on the equalizer of the microstrip board 2 until the index requirement is met.

Examples

Take the microstrip board 2 equalizer of S wave band (3.1 GHz-3.4 GHz) as an example. The microstrip board 2 is made of a double-sided double-medium board RT6010(Rogers corporation) with the epsilon gamma of 10.2, the thickness of 0.635mm, copper foil 35um and a bottom lining of 1.6mm aluminum plate.

In this embodiment, the equalizer of the microstrip board 2 may adopt a single-sided design, the front side is the microstrip board 2, the bottom is lined with a 1.6mm aluminum plate structure, and the structural size of the microstrip line is generated by using microwave software and is subjected to engineering optimization.

As shown in fig. 2 and 3, fig. 2 is a structural view of the microstrip line 1 according to the embodiment;

FIG. 3 is a complementary view of the structure of FIG. 2; the specific structure in this embodiment is:

the length L of the first microstrip line₁13.5mm, width W₁＝2mm。

A length L of the first microstrip segment₂10mm, the length L of the second microstrip section₃3mm, the length L of the third microstrip section₄A width W of the first, second, and third microstrip segments of 36mm₆＝1.5mm。

A length L of the fourth microstrip segment₅Length L of the fifth microstrip section being 8mm₆14mm, the length L of the sixth microstrip section₈9.5mm, the length L of the seventh microstrip section₇A width W of the fourth, fifth, and seventh microstrip segments of 3.5mm₂4 mm; a width W of the sixth microstrip segment₃＝10mm。

Length L of the eighth microstrip segment₉4mm, the length L of the ninth microstrip section₁₀7mm, the length L of the tenth microstrip section₁₁4 mm; widths W of the eighth, ninth, and tenth microstrip segments₄＝2mm。

A length L of the eleventh microstrip segment₁₂2mm, the length L of the twelfth microstrip section₁₃4 mm; a width W of the eleventh and twelfth microstrip segments₅＝2mm。

The invention can adopt the structure design of a bottom lining aluminum plate, namely, the bottom is provided with an aluminum plate with the thickness of 1.6mm, and the equalizer of the microstrip plate 2 is fixed on the assembly shell or the bottom plate of the power amplifier module by screws.

The invention can use the copper foil with 0.2mm as the bottom lining to use the brazing mode design, and the equalizer of the microstrip plate 2 is brazed on the solid component shell or the bottom plate of the power amplifier module.

The working principle is as follows: when the microwave signal passes through the first microstrip line, the equalizer attenuates the microwave signal with the working bandwidth of 3.1 GHz-3.4 GHz, the frequency loss of the low end is 0.4dB, the frequency loss of the middle end is 0.7dB, and the frequency loss of the low end is less than 0.2 dB.

Fig. 4 is a graph showing the output power fluctuation curve and attenuation curve of the solid state device and the power amplifier module, as shown in fig. 4. In the figure, the abscissa is the unit GHz of frequency code, the ordinate is the fluctuation of power and the attenuation unit dB of the equalizer, and the actual test data of a certain solid component by the equalizer of the microstrip board 2 according to the present invention.

Theoretically, the design of the microstrip board 2 equalizer of the invention is added to the input end of the amplifier of the solid-state component and the power amplifier module, 60 percent of the components can meet the power fluctuation requirement, and the solid-state component and the power amplifier module which can not meet the power fluctuation requirement are continuously debugged on the microstrip board 2 equalizer (0.3 mm-0.5 mm tinned copper foil is welded on a proper microstrip line), and the attenuation control of the equalizer circuit to microwave signals is changed by changing the matching characteristic of the circuit. Until the fluctuation requirements of the output power of the solid-state component and the power amplifier module are met.

The design and the use of the micro-strip board 2 equalizer effectively reduce the fluctuation of the output power of the solid component and the power amplifier, the debugging rate of the original solid component is reduced from 100 percent to 30 percent, meanwhile, the debugging on the equalizer effectively reduces the standing wave of the main micro-strip, the temperature rise of the component is reduced, the heat dissipation effect and the quality of the solid component are greatly improved, in the actual production process, the damage rate of the power tube is reduced from 6 percent to less than 2 percent, and the debugging cost is greatly reduced.

The foregoing is merely a preferred embodiment of the invention, which is intended to be illustrative and not limiting. It will be understood by those skilled in the art that various changes, modifications and equivalents may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.