Cutting mechanism of PCB base plate

文档序号:364 发布日期:2021-09-17 浏览:61次 中文

阅读说明:本技术 一种pcb基板的切割机构 (Cutting mechanism of PCB base plate ) 是由 张仁虎 于 2021-06-20 设计创作,主要内容包括:本发明公开了一种PCB基板的切割机构,包括基座和切割装置,所述基座的上方滑动连接有切割装置,所述基座顶部一侧对称固定安装有放置架,所述基座顶部位于两放置架之间固定安装有安装盒,且安装盒内部安装有水平驱动装置,所述安装盒内部滑动连接有滑动板,所述滑动板顶部一侧对称固定安装有电动推杆,所述滑动板两侧对称滑动连接有滑动块,所述电动推杆的输出端和滑动块的顶端均固定安装有电动吸盘,所述滑动板底部设置有顶出机构,本发明通过需要进行切割的PCB基板的大小,调整第二电机带动弹性机构运动到需要进行切割的PCB基板的边缘位置进行顶起滑动块从而实现对于切割的边缘位置的力的支撑,从而避免了切割位置的损坏。(The invention discloses a cutting mechanism of a PCB (printed circuit board) substrate, which comprises a base and a cutting device, wherein the cutting device is connected above the base in a sliding manner, placing racks are symmetrically and fixedly arranged on one side of the top of the base, a mounting box is fixedly arranged between the two placing racks on the top of the base, a horizontal driving device is arranged in the mounting box, a sliding plate is connected in the mounting box in a sliding manner, electric push rods are symmetrically and fixedly arranged on one side of the top of the sliding plate, sliding blocks are symmetrically and slidably connected on two sides of the sliding plate, electric suckers are fixedly arranged at the output end of each electric push rod and the top end of each sliding block, and an ejection mechanism is arranged at the bottom of each sliding plate. Thereby avoiding damage to the cutting site.)

1. The utility model provides a cutting mechanism of PCB base plate, includes base (1) and cutting device (2), the top sliding connection of base (1) has cutting device (2), its characterized in that: the placing racks (3) are symmetrically and fixedly installed on one side of the top of the base (1), the installation box (4) is fixedly installed between the two placing racks (3) on the top of the base (1), a horizontal driving device (5) is arranged in the mounting box (4), a sliding plate (6) is connected in the mounting box (4) in a sliding way, and the sliding plate (6) is connected with the mounting box (4) in a sliding way through a horizontal driving device (5), electric push rods (7) are symmetrically and fixedly arranged on one side of the top of the sliding plate (6), sliding blocks (8) are symmetrically connected with the two sides of the sliding plate (6) in a sliding manner, electric suckers (9) are fixedly arranged at the output end of the electric push rod (7) and the top end of the sliding block (8), the bottom of the sliding plate (6) is provided with an ejection mechanism (10), and the ejection mechanism (10) is in extrusion contact with the sliding block (8).

2. The cutting mechanism for the PCB substrate as recited in claim 1, wherein: cutting device (2) include carriage (201), guide rail (202), slider (203) and cutter (204), base (1) top fixedly connected with carriage (201), sliding connection has guide rail (202) on one side of carriage (201), and sliding connection has slider (203) on guide rail (202), one side fixedly connected with cutter (204) on slider (203).

3. The cutting mechanism for the PCB substrate as recited in claim 1, wherein: the horizontal driving device (5) comprises a first motor (501), a first belt wheel (502), a second belt wheel (503), a first belt (504) and a mounting seat (505), a first belt wheel (502) and a second belt wheel (503) are symmetrically and rotatably connected with the two sides in the mounting box (4), a first belt (504) is sleeved on the outer sides of the first belt wheel (502) and the second belt wheel (503), the first belt wheel (502) and the second belt wheel (503) are in transmission connection through a first belt (504), the first belt (504) is fixedly connected with the sliding plate (6), a mounting seat (505) is fixedly mounted at one side of the first belt wheel (502) in the mounting box (4), and a first motor (501) is fixedly mounted on the mounting seat (505), and an output shaft of the first motor (501) is fixedly connected with a rotating shaft of a first belt wheel (502) on one side inside the mounting box (4).

4. The cutting mechanism for the PCB substrate as recited in claim 1, wherein: the ejection mechanism (10) comprises a second motor (101), a third belt wheel (102), a fourth belt wheel (103), a second belt (104), a groove (405), a connecting roller (406), a round roller (407) and an elastic mechanism (11), the bottom of the sliding plate (6) is fixedly connected with the second motor (101), the third belt wheel (102) and the fourth belt wheel (103) are symmetrically and rotatably connected to the two sides of the bottom of the sliding plate (6), the output end of the second motor (101) is fixedly connected with the rotating shaft of the third belt wheel (102), the second belt (104) is sleeved on the outer sides of the third belt wheel (102) and the fourth belt wheel (103), the third belt wheel (102) and the fourth belt wheel (103) are in transmission connection through the second belt (104), the connecting roller (406) is fixedly connected between the second belts (104) on the two sides, the round roller (407) is rotatably connected to the two sides of the connecting roller (406) under the sliding block (8), and the circumference of the outer side of the round roller (407) is equidistantly provided with elastic mechanisms (11), the bottom of the sliding plate (6) is provided with a groove (405) at the sliding insertion position of the sliding block (8), and the elastic mechanisms (11) are in extrusion contact with the sliding block (8) through the groove (405).

5. The cutting mechanism for PCB substrate as claimed in claim 4, wherein: elastic mechanism (11) includes dead lever (1101), compression spring (1102) and ejector pin (1103), circle roller (407) circumference equidistance fixed mounting has dead lever (1101), and inside slip grafting of dead lever (1101) has ejector pin (1103), ejector pin (1103) and sliding block (8) extrusion contact, the inside fixedly connected with compression spring (1102) of dead lever (1101), ejector pin (1103) are through compression spring (1102) and dead lever (1101) elastic connection.

6. The cutting mechanism for PCB substrate as claimed in claim 5, wherein: the arc length between two adjacent fixing rods (1101) on the outer side of the round roller (407) is equal to the linear distance between two adjacent sliding blocks (8) on the sliding plate (6).

7. A method for using a cutting mechanism of a PCB substrate according to any one of claims 1 to 6, comprising the steps of:

the first step is as follows: when the device is in an initial state, the output end of the electric push rod (7) does not extend out, then the top end of the sliding block (8) and the output end of the electric push rod (7) are kept in a horizontal state, the electric suckers (9) are kept in the same state at the moment, and the sliding plate (6) is located in the middle of the placing rack (3);

the second step is that: when a user needs to cut the PCB substrate, the PCB substrate is placed right above the placing frame (3), two ends of the PCB substrate and the placing frame (3) are kept in a horizontal state, then, according to the position needing to be cut, two rings at the rightmost end of a B area of the PCB substrate are aligned to the electric push rod (7), the output end of the electric push rod (7) moves upwards, so that the electric suction disc (9) fixedly connected with the output end of the electric push rod (7) is in contact with the PCB substrate and works, the electric suction disc (9) adsorbs the PCB substrate, meanwhile, the second motor (101) is started according to a cutting line between the PCB substrate A and the PCB substrate B needing to be cut, the output end of the second motor (101) drives the fixedly connected third belt wheel (102) to rotate, and the third belt wheel (102) is in transmission connection with the fourth belt wheel (103) through a second belt (104), therefore, when the third belt wheel (102) rotates, the fourth belt wheel (103) can synchronously rotate by driving the second belt (104) to rotate, so that the second belt (104) can rotate between the third belt wheel (102) and the fourth belt wheel (103) in a reciprocating manner, and because the connecting roller (406) is fixedly connected between the two second belts (104), when the second belt (104) rotates, the connecting roller (406) can also linearly move, and because the elastic mechanism (11) rotationally connected with the rotating roller (406) is in pressing contact with the bottom of the sliding plate (6), when the rotating roller (406) linearly moves, the elastic mechanism (11) can drive the round roller (407) to rotate, when the elastic mechanism (11) rotates, the push rod (1103) can be pressed by the sliding plate (6), so that the push rod (1103) can slide into the fixed cylinder (1102) by pressing the compression spring, when the elastic mechanism (11) moves to the position below the sliding block (8) at the position where the PCB substrate needs to be cut at the edge, due to the action of the groove (405), the ejector rod (1103) at the top of the round roller (407) cannot extrude the sliding plate (6), and the ejector rod (1103) can extrude the sliding block (8) to move upwards, so that the sliding block (8) drives the electric sucker (9) to move upwards, and when the electric sucker (9) on the sliding block (8) is in contact with the PCB substrate, the electric sucker (9) works, so that the electric sucker (9) can adsorb the PCB substrate, and the phenomenon that the PCB substrate is poor in cutting effect due to the fact that the PCB substrate cutting position is not strongly supported in the prior art is avoided, and the device passes through the size of the PCB substrate needing to be cut, adjusting a second motor (101) to drive an elastic mechanism (11) to move to the edge position of the PCB substrate to be cut to jack up a sliding block (8), so that the force support on the edge position of the cutting is realized, and the damage of the cutting position is avoided;

the third step: after the electric sucker (9) adsorbs the PCB substrate, the first motor (501) works, the output end of the first motor (501) drives the first belt wheel (502) to rotate, the first belt wheel (502) is in transmission connection with the second belt wheel (503) through the first belt (504), the first belt wheel (502) drives the first belt (504) and the second belt wheel (503) to rotate, the first belt (504) drives the sliding plate (6) to move under the rotating condition, so that the PCB substrate moves under the cutting device 2, then the sliding rail (202) horizontally slides on the sliding frame (201), and the sliding block (203) is matched with the linear motion on the sliding rail (202), so that the cutter (204) works, and the PCB substrate is cut.

Technical Field

The invention relates to the technical field of PCB (printed circuit board) substrates, in particular to a cutting mechanism of a PCB substrate.

Background

The substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, a single-sided printed board and a double-sided printed board are manufactured by selectively processing hole processing, chemical copper plating, electrolytic copper plating, etching and the like on the substrate material-the copper clad laminate to obtain a required circuit pattern, the other type of multilayer printed board is manufactured by using an inner core thin copper clad laminate as a base and alternately laminating and bonding a conductive pattern layer and a prepreg together at one time to form interconnection among more than 3 conductive pattern layers, and the multilayer printed board has the functions of conduction, insulation and support, and the performance, quality, processability, manufacturing cost, manufacturing level and the like of the printed board depend on the substrate material to a great extent.

The PCB base plate of prior art all carries out the centre gripping to the one end of PCB base plate when cutting to accomplish the cutting to the PCB base plate, however, because when the cutting of PCB base plate, the PCB base plate only supports on one side, thereby leads to when the cutting, and the deformation tearing force of PCB base plate is great, thereby makes the cutting department unstable, for this reason, we provide a cutting mechanism of PCB base plate.

Disclosure of Invention

The invention aims to provide a PCB substrate cutting mechanism which has the advantage that when a PCB substrate is cut, the PCB substrate can be supported at the cut part, and the problem that the cut part of the PCB substrate has no supporting force during cutting is solved.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a cutting mechanism of PCB base plate, includes base and cutting device, the top sliding connection of base has cutting device, base top one side symmetry fixed mounting has the rack, the base top is located fixed mounting between two racks has the mounting box, and mounting box internally mounted has horizontal drive device, the inside sliding connection of mounting box has the sliding plate, and the sliding plate passes through horizontal drive device and mounting box sliding connection, sliding plate top one side symmetry fixed mounting has electric putter, the sliding plate bilateral symmetry sliding connection has the sliding block, the equal fixed mounting in output of electric putter and the top of sliding block has electric sucker, the sliding plate bottom is provided with ejection mechanism, ejection mechanism and sliding block extrusion contact.

Preferably, cutting device includes carriage, guide rail, slider and cutter, base top fixedly connected with carriage, sliding connection has the guide rail on one side of the carriage, and sliding connection has the slider on the guide rail, one side fixedly connected with cutter on the slider.

Preferably, the horizontal driving device comprises a first motor, a first belt wheel, a second belt wheel, a first belt and a mounting seat, the first belt wheel and the second belt wheel are connected to the mounting box in a symmetrical and rotating manner, the first belt is sleeved on the outer sides of the first belt wheel and the second belt wheel, the first belt wheel and the second belt wheel are connected through the first belt in a transmission manner, the first belt is fixedly connected with the sliding plate, the mounting seat is fixedly mounted on one side, located on the first belt wheel, of the mounting box, the first motor is fixedly mounted on the mounting seat, and an output shaft of the first motor is fixedly connected with a rotating shaft of the first belt wheel on one side of the mounting box.

Preferably, the ejection mechanism comprises a second motor, a third belt wheel, a fourth belt wheel, a second belt, a groove, a connecting roller, a round roller and an elastic mechanism, the bottom of the sliding plate is fixedly connected with a second motor, the two sides of the bottom of the sliding plate are symmetrically and rotatably connected with a third belt wheel and a fourth belt wheel, the output end of the second motor is fixedly connected with the rotating shaft of the third belt wheel, the outer sides of the third belt wheel and the fourth belt wheel are sleeved with a second belt, the third belt wheel and the fourth belt wheel are in transmission connection through a second belt, a connecting roller is fixedly connected between the second belts on the two sides, the two sides of the connecting roller are positioned right below the sliding block and are rotatably connected with a round roller, and the circumference of the outer side of the round roller is equidistantly provided with elastic mechanisms, the sliding plate bottom is provided with grooves at the sliding insertion positions of the sliding blocks, and the elastic mechanisms are in extrusion contact with the sliding blocks through the grooves.

Preferably, the elastic mechanism comprises a fixing rod, a compression spring and an ejector rod, the fixing rod is fixedly installed on the circumference of the round roller at equal intervals, the ejector rod is inserted into the fixing rod in a sliding mode, the ejector rod is in extrusion contact with the sliding block, the compression spring is fixedly connected inside the fixing rod, and the ejector rod is elastically connected with the fixing rod through the compression spring.

Preferably, the arc length between two adjacent fixed rods outside the round roller is equal to the linear distance between two adjacent sliding blocks on the sliding plate.

A method of a cutting mechanism of a PCB substrate, comprising the steps of:

the first step is as follows: when the device is in an initial state, the output end of the electric push rod does not extend out, then the top end of the sliding block and the output end of the electric push rod are kept in a horizontal state, the electric suckers are kept in the same state at the moment, and the sliding plate is positioned in the middle of the placing frame;

the second step is that: when a user needs to cut the PCB substrate, the PCB substrate is firstly placed right above the placing frame, two ends of the PCB substrate are kept in a horizontal state with the placing frame, then, the position needing to be cut is adjusted according to the figure 8, two rings at the rightmost end of a B area of the PCB substrate are aligned with an electric push rod, the output end of the electric push rod moves upwards, so that an electric suction disc fixedly connected with the output end of the electric push rod contacts the PCB substrate and works, the electric suction disc adsorbs the PCB substrate, meanwhile, a second motor is started according to a cutting line between A and B of the PCB substrate needing to be cut, the output end of the second motor drives a third belt wheel fixedly connected with the second motor to rotate, and the third belt wheel is in transmission connection with a fourth belt wheel through a second belt, therefore, when the third belt wheel rotates, the fourth belt wheel can synchronously rotate by driving the second belt to rotate, so that the second belt can reciprocally rotate between the third belt wheel and the fourth belt wheel, the connecting roller is fixedly connected between the two second belts, when the second belts rotate, the connecting roller can also linearly move, and the elastic mechanism connected by the rotating roller is in extrusion contact with the bottom of the sliding plate, so that when the rotating roller linearly moves, the elastic mechanism can drive the round roller to rotate, when the elastic mechanism rotates, the ejector rod can be extruded by the sliding plate, so that the ejector rod can slide into the fixed cylinder through the extrusion compression spring, when the elastic mechanism moves to the position below the sliding block at the position where the PCB substrate needs to be cut at the edge position, the ejector rod at the top of the round roller can not extrude the sliding plate due to the effect of the groove, and the ejector rod can extrude the sliding block to move upwards, the device adjusts the second motor to drive the elastic mechanism to move to the edge position of the PCB substrate to be cut to jack up the sliding block so as to realize the support of the force of the edge position to be cut through the size of the PCB substrate to be cut, thereby avoiding the damage of the cutting position;

the third step: after the electric suction disc adsorbs the PCB base plate, first motor works, output through first motor drives first band pulley and rotates, and carry out the transmission through first belt between first band pulley and the second band pulley and connect, thereby drive first belt and second band pulley and rotate under first band pulley rotates, first belt drives the sliding plate under the pivoted condition and moves, thereby make the PCB base plate move under cutting device, then, through the horizontal slip of guide rail on the carriage, the linear motion of cooperation slider on the guide rail, thereby make the cutter work, thereby realize the cutting to the PCB base plate.

Compared with the prior art, the invention has the following beneficial effects:

firstly, the invention aligns the extreme end of the PCB substrate with the electric push rod by adjusting the position to be cut, the output end of the electric push rod moves upwards, so that the electric sucker fixedly connected with the output end of the electric push rod contacts the PCB substrate and works, the electric sucker adsorbs the PCB substrate, meanwhile, the second motor is started according to the size of the PCB substrate to be cut, the output end of the second motor drives the third belt wheel fixedly connected with the second motor to rotate, and the third belt wheel is in transmission connection with the fourth belt wheel through the second belt, therefore, when the third belt wheel rotates, the fourth belt wheel synchronously rotates by driving the rotation of the second belt, so that the second belt rotates back and forth between the third belt wheel and the fourth belt wheel, because the connecting roller is fixedly connected between the two second belts, when the second belt rotates, the connecting roller also performs linear motion, and the elastic mechanism connected by the rotation of the rotating roller is in extrusion contact with the bottom of the sliding plate, so when the rotating roller performs linear motion, the elastic mechanism can drive the round roller to rotate, when the elastic mechanism rotates, the ejector rod can be extruded by the sliding plate, so that the ejector rod can slide into the fixed cylinder through an extrusion compression spring, when the elastic mechanism moves to the position below the sliding block at the position of the edge of the PCB substrate to be cut, the ejector rod at the top of the round roller cannot be extruded with the sliding plate due to the effect of the groove, so that the ejector rod can extrude the sliding block to move upwards, so that the sliding block drives the electric sucker to move upwards, and when the electric sucker on the PCB substrate is in contact with the electric sucker on the PCB substrate, the electric sucker works, so that the electric sucker can realize the adsorption on the PCB substrate, thereby avoided original when we cut the PCB base plate, only carry out the centre gripping to the both ends of PCB, thereby the relatively poor phenomenon of cutting effect that the position of the PCB base plate cutting that leads to does not have the strong support to lead to takes place, the device, through the size of the PCB base plate that needs cut, thereby the adjustment second motor drives elastic mechanism and moves the border position of the PCB base plate that needs cut and carry out the support that the power of jack-up sliding block realization to the border position of cutting, thereby the damage of cutting position has been avoided.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic diagram of a semi-sectional structure of a base according to the present invention;

FIG. 3 is a schematic structural diagram of a horizontal driving device according to the present invention;

FIG. 4 is a schematic view of a cutting device according to the present invention;

fig. 5 is a first perspective structural view of the ejection mechanism of the present invention;

FIG. 6 is a second perspective structural view of the ejection mechanism of the present invention;

FIG. 7 is a schematic structural diagram of the elastic mechanism of the present invention;

FIG. 8 is a schematic diagram of a PCB substrate dividing structure according to the present invention;

in the figure: 1. a base; 2. a cutting device; 201. a carriage; 202. a guide rail; 203. a slider; 204. a cutter; 3. placing a rack; 4. mounting a box; 5. a horizontal driving device; 501. a first motor; 502. a first pulley; 503. a second pulley; 504. a first belt; 505. a mounting seat; 6. a sliding plate; 7. an electric push rod; 8. a slider; 9. an electric suction cup; 10. an ejection mechanism; 101. a second motor; 102. a third belt pulley; 103. a fourth pulley; 104. a second belt; 405. a groove; 406. a connecting roller; 407. a round roller; 11. an elastic mechanism; 1101. fixing the rod; 1102. a compression spring; 1103. and a push rod.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 8, the present invention provides a technical solution: a cutting mechanism of a PCB substrate comprises a base 1 and a cutting device 2, wherein the cutting device 2 is connected above the base 1 in a sliding way, the placing racks 3 are symmetrically and fixedly arranged on one side of the top of the base 1, the mounting box 4 is fixedly arranged between the two placing racks 3 on the top of the base 1, and a horizontal driving device 5 is arranged in the mounting box 4, a sliding plate 6 is connected in the mounting box 4 in a sliding way, and the sliding plate 6 is connected with the mounting box 4 in a sliding way through the horizontal driving device 5, one side of the top of the sliding plate 6 is symmetrically and fixedly provided with electric push rods 7, sliding blocks 8 are symmetrically and slidably connected with the two sides of the sliding plate 6, electric suckers 9 are fixedly arranged at the output end of the electric push rod 7 and the top end of the sliding block 8, the bottom of the sliding plate 6 is provided with an ejection mechanism 10, and the ejection mechanism 10 is in pressing contact with the sliding block 8.

Cutting device 2 includes carriage 201, guide rail 202, slider 203 and cutter 204, 1 top fixedly connected with carriage 201 of base, sliding connection has guide rail 202 on one side of carriage 201, and sliding connection has slider 203 on guide rail 202, one side fixedly connected with cutter 204 on the slider 203.

The horizontal driving device 5 comprises a first motor 501, a first belt wheel 502, a second belt wheel 503, a first belt 504 and a mounting seat 505, the first belt wheel 502 and the second belt wheel 503 are symmetrically and rotatably connected to two sides inside the mounting box 4, the first belt 504 is sleeved on the outer sides of the first belt wheel 502 and the second belt wheel 503, the first belt wheel 502 and the second belt wheel 503 are in transmission connection through the first belt 504, the first belt 504 is fixedly connected with the sliding plate 6, the mounting seat 505 is fixedly mounted on one side of the first belt wheel 502 inside the mounting box 4, the first motor 501 is fixedly mounted on the mounting seat 505, and an output shaft of the first motor 501 is fixedly connected with a rotating shaft of the first belt wheel 502 on one side inside the mounting box 4.

The ejection mechanism 10 comprises a second motor 101, a third belt pulley 102, a fourth belt pulley 103, a second belt 104, a groove 405, a connecting roller 406, a circular roller 407 and an elastic mechanism 11, the bottom of the sliding plate 6 is fixedly connected with the second motor 101, the third belt pulley 102 and the fourth belt pulley 103 are symmetrically and rotatably connected to two sides of the bottom of the sliding plate 6, the output end of the second motor 101 is fixedly connected with the rotating shaft of the third belt pulley 102, the second belt 104 is sleeved on the outer sides of the third belt pulley 102 and the fourth belt pulley 103, the third belt pulley 102 and the fourth belt pulley 103 are in transmission connection through the second belt 104, the connecting roller 406 is fixedly connected between the second belt 104 on two sides, the circular roller 407 is rotatably connected to two sides of the connecting roller 406 under the sliding block 8, the elastic mechanism 11 is arranged on the outer circumference of the circular roller 407 at equal intervals, the groove 405 is arranged at the sliding insertion position of the bottom of the sliding plate 6 on the sliding block 8, and the elastic means 11 is in pressing contact with the sliding block 8 through the groove 405.

The elastic mechanism 11 comprises a fixing rod 1101, a compression spring 1102 and a push rod 1103, the fixing rod 1101 is fixedly installed on the circumference of the round roller 407 at equal intervals, the push rod 1103 is inserted into the fixing rod 1101 in a sliding mode, the push rod 1103 is in pressing contact with the sliding block 8, the compression spring 1102 is fixedly connected inside the fixing rod 1101, and the push rod 1103 is elastically connected with the fixing rod 1101 through the compression spring 1102.

The arc length between two adjacent fixed rods 1101 on the outer side of the round roller 407 is equal to the linear distance between two adjacent sliding blocks 8 on the sliding plate 6.

A method of a cutting mechanism of a PCB substrate, comprising the steps of:

the first step is as follows: when the device is in an initial state, the output end of the electric push rod 7 does not extend out, then the top end of the sliding block 8 and the output end of the electric push rod 7 are kept in a horizontal state, the electric suckers 9 are kept in the same state at the moment, and the sliding plate 6 is located in the middle of the placing frame 3;

the second step is that: when a user needs to cut the PCB substrate, the PCB substrate is firstly placed right above the placing frame 3, two ends of the PCB substrate are kept in a horizontal state with the placing frame 3, then, according to the position needing to be cut, the position needing to be cut is adjusted, two rings at the rightmost end of a B area of the PCB substrate are aligned with the electric push rod 7, the output end of the electric push rod 7 moves upwards, so that the electric suction cup 9 fixedly connected with the output end of the electric push rod 7 is contacted with the PCB substrate and works, the electric suction cup 9 adsorbs the PCB substrate, meanwhile, the second motor 101 is started according to a cutting line between the PCB substrate A and the PCB substrate B needing to be cut, the output end of the second motor 101 drives the third belt wheel 102 fixedly connected with the second motor to rotate, and the third belt wheel 102 is in transmission connection with the fourth belt wheel 103 through the second belt 104, therefore, when the third pulley 102 rotates, the fourth pulley 103 rotates synchronously by driving the second belt 104 to rotate, so that the second belt 104 reciprocates between the third pulley 102 and the fourth pulley 103, because the connection roller 406 is fixedly connected between the two second belts 104, when the second belt 104 rotates, the connection roller 406 also moves linearly, and because the elastic mechanism 11 rotationally connected with the rotation roller 406 is in pressing contact with the bottom of the sliding plate 6, when the rotation roller 406 moves linearly, the elastic mechanism 11 rotates by driving the round roller 407, when the elastic mechanism 11 rotates, the push rod 1103 is pressed by the sliding plate 6, so that the push rod 1103 slides into the fixed cylinder 1101 by pressing the compression spring 1102, when the elastic mechanism 11 moves to a position below the sliding block 8 at which the PCB substrate needs to be cut, due to the function of the groove 405, the ejector 1103 at the top of the round roller 407 cannot extrude the sliding plate 6, so that the ejector 1103 can extrude the sliding block 8 to move upwards, the sliding block 8 drives the electric sucker 9 to move upwards, and when the electric sucker 9 on the sliding block 8 contacts with the PCB substrate, the electric sucker 9 works, so that the electric sucker 9 can suck the PCB substrate, thereby avoiding the phenomenon that the original PCB substrate is not cut because only the two ends of the PCB are clamped when the PCB substrate is cut, and the cutting position of the PCB substrate is not strongly supported, so that the cutting effect is poor, and the device adjusts the second motor 101 to drive the elastic mechanism 11 to move to the edge position of the PCB substrate to be cut to jack up the sliding block 8 to support the force of the edge position to be cut through the size of the PCB substrate to be cut, thereby avoiding damage to the cutting position;

the third step: after the electric suction cup 9 adsorbs the PCB substrate, the first motor 501 works, the output end of the first motor 501 drives the first belt wheel 502 to rotate, and the first belt wheel 502 and the second belt wheel 503 are in transmission connection through the first belt 504, so that the first belt wheel 502 drives the first belt 504 and the second belt wheel 503 to rotate, the first belt 504 drives the sliding plate 6 to move under the rotating condition, so that the PCB substrate moves right under the cutting device 2, then, the sliding rail 202 horizontally slides on the sliding frame 201, the sliding block 203 is matched with the linear motion on the guide rail 202, so that the cutter 204 works, and the cutting of the PCB substrate is realized.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

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