阅读说明：本技术 温度测量方法、装置及系统、计算机可读存储介质 (Temperature measuring method, device and system, and computer readable storage medium ) 是由 苏子慕 李兵 顾艳庆 刘炯 李赏 于 2021-09-09 设计创作，主要内容包括：本申请提供了一种温度测量方法、装置及系统、计算机可读存储介质,涉及测量技术领域。该温度测量方法包括：基于待测温器件对应的接触式测温设备,确定待测温器件对应的接触温度数据；基于待测温器件对应的非接触式测温设备,确定待测温器件对应的非接触温度数据；基于接触温度数据和非接触温度数据,确定接触式测温设备与非接触式测温设备之间的温度测量关系；获取非接触式测温设备测得的待校准非接触温度值；根据温度测量关系和待校准非接触温度值,确定待校准非接触温度值对应的校准温度值。该温度测量方法实用性、可操作性强。(The application provides a temperature measurement method, a temperature measurement device, a temperature measurement system and a computer readable storage medium, and relates to the technical field of measurement. The temperature measuring method comprises the following steps: determining contact temperature data corresponding to a device to be measured based on contact temperature measuring equipment corresponding to the device to be measured; determining non-contact temperature data corresponding to the device to be measured based on the non-contact temperature measuring equipment corresponding to the device to be measured; determining a temperature measurement relation between the contact temperature measurement equipment and the non-contact temperature measurement equipment based on the contact temperature data and the non-contact temperature data; acquiring a non-contact temperature value to be calibrated, which is measured by non-contact temperature measuring equipment; and determining a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relation and the non-contact temperature value to be calibrated. The temperature measuring method is high in practicability and operability.)

1. A method of measuring temperature, comprising:

determining contact temperature data corresponding to a device to be measured based on contact temperature measuring equipment corresponding to the device to be measured;

determining non-contact temperature data corresponding to the device to be measured based on the non-contact temperature measuring equipment corresponding to the device to be measured;

and determining a temperature measurement relation between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data so as to determine a calibration temperature value corresponding to a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment, based on the temperature measurement relation.

2. The method of claim 1, wherein determining the temperature measurement relationship between the contact thermometry device and the non-contact thermometry device based on the contact temperature data and the non-contact temperature data comprises:

determining a correction coefficient between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data;

determining the temperature measurement relationship based on the correction factor.

3. The method of claim 2, wherein determining a correction factor between the contact thermometry device and the non-contact thermometry device based on the contact temperature data and the non-contact temperature data comprises:

and determining the correction coefficient by using a data fitting mode based on the contact temperature data and the non-contact temperature data, wherein the data fitting mode comprises a linear fitting mode and/or a non-linear fitting mode.

4. The temperature measurement method according to any one of claims 1 to 3, wherein the device to be measured comprises a turbine of a magnetically levitated molecular pump, and a surface of the turbine is covered with a coating.

5. The temperature measurement method according to claim 4, wherein the determining the contact temperature data corresponding to the device to be measured based on the contact temperature measurement device corresponding to the device to be measured comprises:

starting the magnetic suspension molecular pump to increase the temperature of the turbine to a preset temperature;

reducing the rotating speed of the magnetic suspension molecular pump to zero so that the magnetic suspension molecular pump is in a shutdown state;

and under the shutdown state, measuring the temperature of the end face of the turbine rotor by using the contact temperature measuring equipment to obtain the contact temperature data.

6. The temperature measurement method according to claim 4, wherein the determining non-contact temperature data corresponding to the device to be measured based on the non-contact temperature measurement device corresponding to the device to be measured comprises:

starting the magnetic suspension molecular pump to increase the temperature of the turbine to a preset temperature;

reducing the rotating speed of the magnetic suspension molecular pump to zero so that the magnetic suspension molecular pump is in a shutdown state;

and under the shutdown state, measuring the temperature of the end face of the turbine rotor by using the non-contact temperature measuring equipment to obtain non-contact temperature data.

7. The temperature measurement method according to claim 5 or 6, wherein the inside of the magnetic levitation molecular pump is maintained in a vacuum state.

8. The temperature measuring method according to any one of claims 1 to 3, wherein the non-contact temperature measuring device comprises an infrared ray temperature measuring device, and/or,

the contact temperature measuring device includes:

the temperature measuring probe is loaded with a temperature sensor;

and the driver is used for driving the temperature measuring probe.

9. A method of measuring temperature, comprising:

determining a temperature measurement relationship between contact temperature measurement equipment and non-contact temperature measurement equipment corresponding to a device to be measured, wherein the temperature measurement relationship is obtained according to the method of any one of claims 1 to 8;

acquiring a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment;

and determining a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relation and the non-contact temperature value to be calibrated.

10. A temperature measuring device, comprising:

the first determining module is used for determining contact temperature data corresponding to a device to be measured based on contact temperature measuring equipment corresponding to the device to be measured;

the second determination module is used for determining non-contact temperature data corresponding to the device to be measured based on the non-contact temperature measurement equipment corresponding to the device to be measured;

and the third determining module is used for determining the temperature measurement relation between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data so as to determine a calibration temperature value corresponding to a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment, based on the temperature measurement relation.

11. A temperature measuring device, comprising:

a fourth determining module, configured to determine a temperature measurement relationship between a contact temperature measurement device and a non-contact temperature measurement device corresponding to a device to be measured, where the temperature measurement relationship is obtained according to the method of any one of claims 1 to 8;

the acquisition module is used for acquiring a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment;

and the fifth determining module is used for determining a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relation and the non-contact temperature value to be calibrated.

12. A temperature measurement system, comprising:

a contact temperature measuring device;

a non-contact temperature measuring device;

a processor for performing the temperature measurement method of any one of claims 1 to 9 above.

13. A computer-readable storage medium, characterized in that the storage medium stores a computer program for executing the temperature measurement method of any one of the preceding claims 1 to 9.

Technical Field

The present application relates to the field of measurement technologies, and in particular, to a temperature measurement method, device, and system, and a computer-readable storage medium.

Background

The magnetic suspension molecular pump is a novel high-performance molecular pump which utilizes a magnetic bearing to generate electromagnetic force to enable a rotor to be suspended in the air, so that the rotor and a stator are not in mechanical contact, and the position of the rotor can be actively controlled.

At present, aiming at a common turbine high-speed rotor in the running process of a molecular pump, an infrared ray thermometer is generally used for non-contact temperature measurement. The non-contact temperature measurement does not damage the temperature field, and has wide temperature measurement range and high response speed. However, when the turbine is covered with a coating or the surface is subjected to other treatment, the reflection of infrared rays changes, and the temperature of the turbine measured by the infrared ray thermometer is greatly different from the actual temperature.

Disclosure of Invention

The present application is proposed to solve the above-mentioned technical problems. The embodiment of the application provides a temperature measuring method, a temperature measuring device, a temperature measuring system and a computer readable storage medium.

In a first aspect, an embodiment of the present application provides a temperature measurement method, including determining contact temperature data corresponding to a device to be measured based on contact temperature measurement equipment corresponding to the device to be measured; determining non-contact temperature data corresponding to the device to be measured based on the non-contact temperature measuring equipment corresponding to the device to be measured; and determining the temperature measurement relation between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data so as to determine a calibration temperature value corresponding to the non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment, based on the temperature measurement relation.

With reference to the first aspect, in certain implementations of the first aspect, determining a temperature measurement relationship between the contact thermometry device and the non-contact thermometry device based on the contact temperature data and the non-contact temperature data includes: determining a correction coefficient between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data; a temperature measurement relationship is determined based on the correction factor.

With reference to the first aspect, in certain implementations of the first aspect, determining a correction factor between the contact thermometry device and the non-contact thermometry device based on the contact temperature data and the non-contact temperature data comprises: and determining a correction coefficient by using a data fitting mode based on the contact temperature data and the non-contact temperature data, wherein the data fitting mode comprises a linear fitting mode and/or a non-linear fitting mode.

With reference to the first aspect, in certain implementations of the first aspect, the device under test includes a turbine of a magnetically levitated molecular pump, and a surface of the turbine is covered with a coating.

With reference to the first aspect, in some implementation manners of the first aspect, determining, based on the contact temperature measurement device corresponding to the device to be measured, contact temperature data corresponding to the device to be measured includes: starting the magnetic suspension molecular pump to raise the temperature of the turbine to a preset temperature; reducing the rotating speed of the magnetic suspension molecular pump to zero so as to enable the magnetic suspension molecular pump to be in a shutdown state; and under the shutdown state, measuring the temperature of the end face of the turbine rotor by using contact temperature measuring equipment to obtain contact temperature data.

With reference to the first aspect, in some implementation manners of the first aspect, determining non-contact temperature data corresponding to a temperature device to be measured based on a non-contact temperature measurement device corresponding to the temperature device to be measured includes: starting the magnetic suspension molecular pump to raise the temperature of the turbine to a preset temperature; reducing the rotating speed of the magnetic suspension molecular pump to zero so as to enable the magnetic suspension molecular pump to be in a shutdown state; and under the shutdown state, measuring the temperature of the end face of the turbine rotor by using non-contact temperature measuring equipment to obtain non-contact temperature data.

With reference to the first aspect, in certain implementations of the first aspect, an interior of the magnetically levitated molecular pump is maintained in a vacuum state.

With reference to the first aspect, in certain implementations of the first aspect, the non-contact thermometry device comprises an infrared ray thermometry device, and/or the contact thermometry device comprises: the temperature measuring probe is loaded with a temperature sensor; and the driver is used for driving the temperature measuring probe.

In a second aspect, an embodiment of the present application provides a temperature measurement method, where the method includes determining a temperature measurement relationship between a contact temperature measurement device and a non-contact temperature measurement device corresponding to a device to be measured, where the temperature measurement relationship is obtained according to the method mentioned in the first aspect; acquiring a non-contact temperature value to be calibrated, which is measured by non-contact temperature measuring equipment; and determining a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relation and the non-contact temperature value to be calibrated.

In a third aspect, an embodiment of the present application provides a temperature measurement apparatus, including a first determining module, configured to determine, based on a contact temperature measurement device corresponding to a device to be measured, contact temperature data corresponding to the device to be measured; the second determination module is used for determining non-contact temperature data corresponding to the temperature device to be measured based on the non-contact temperature measurement equipment corresponding to the temperature device to be measured; and the third determining module is used for determining the temperature measurement relation between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data so as to determine the calibration temperature value corresponding to the non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment based on the temperature measurement relation.

In a fourth aspect, an embodiment of the present application provides a temperature measurement apparatus, including a fourth determining module, configured to determine a temperature measurement relationship between a contact temperature measurement device and a non-contact temperature measurement device corresponding to a device to be measured, where the temperature measurement relationship is obtained according to the method in the first aspect; the acquisition module is used for acquiring a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measurement equipment; and the fifth determining module is used for determining a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relation and the non-contact temperature value to be calibrated.

In a fifth aspect, an embodiment of the present application provides a temperature measurement system, including: a contact temperature measuring device; a non-contact temperature measuring device; a processor for performing the temperature measurement method mentioned in the first aspect.

In a sixth aspect, an embodiment of the present application provides a computer-readable storage medium, where the storage medium stores a computer program for executing the temperature measurement method mentioned in the first aspect.

The temperature measuring method provided by the embodiment of the application realizes the purpose of calibrating inaccurate temperature obtained by using a non-contact temperature measuring method, for example, the method is used for calibrating the temperature of a magnetic suspension molecular pump turbine with a coating or other treatments on the surface of the turbine running at a high speed by using infrared rays, and the method can realize real-time and accurate measurement, has strong practicability and operability, and does not need manual measurement.

Drawings

Fig. 1 is a schematic flow chart of a temperature measurement method according to an embodiment of the present disclosure.

Fig. 2 is a schematic flow chart illustrating a process of determining a temperature measurement relationship according to an embodiment of the present application.

Fig. 3 is a schematic flow chart illustrating a process of determining a correction coefficient by using a data fitting method according to an embodiment of the present application.

Fig. 4 is a schematic flow chart illustrating a process of determining contact temperature data corresponding to a device to be measured according to an embodiment of the present application.

Fig. 5 is a schematic flow chart illustrating a process of determining non-contact temperature data corresponding to a device to be measured according to an embodiment of the present application.

Fig. 6 is a schematic flow chart of a temperature measurement method according to another embodiment of the present application.

Fig. 7 is a schematic structural diagram of a temperature measuring device according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of a temperature measuring device according to another embodiment of the present application.

Fig. 9 is a schematic structural diagram of a temperature measurement system according to an embodiment of the present application.

Fig. 10 is a schematic diagram illustrating an installed temperature measurement system according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The magnetic suspension molecular pump is a novel high-performance molecular pump which utilizes a magnetic bearing to generate electromagnetic force to enable a rotor to be suspended in the air, so that the rotor and a stator are not in mechanical contact, and the position of the rotor can be actively controlled.

At present, aiming at a common turbine high-speed rotor in the running process of a molecular pump, an infrared ray thermometer is generally used for non-contact temperature measurement. The non-contact temperature measurement does not damage the temperature field, and has wide temperature measurement range and high response speed. However, when the turbine is covered with a coating or the surface is subjected to other treatment, the reflection of infrared rays changes, and the temperature of the turbine measured by the infrared ray thermometer is greatly different from the actual temperature.

In order to solve the above technical problem, embodiments of the present application provide a temperature measurement method, an apparatus and a system, and a computer-readable storage medium, so as to achieve the purpose of calibrating an inaccurate temperature obtained by using a non-contact temperature measurement method. For example, the method mentioned in the embodiment of the application is used for calibrating the temperature of the magnetic suspension molecular pump turbine with nickel-plated surface-polished metal which runs at a high speed by infrared ray measurement. The embodiment of the application can achieve real-time and accurate measurement, is high in practicability and operability, and does not need manual measurement participation. The temperature measurement method according to the embodiment of the present application will be described in detail with reference to fig. 1 to 6.

Fig. 1 is a schematic flow chart of a temperature measurement method according to an embodiment of the present disclosure. As shown in fig. 1, a temperature measurement method provided in an embodiment of the present application includes the following steps.

And step S11, determining contact temperature data corresponding to the device to be measured based on the contact temperature measuring equipment corresponding to the device to be measured.

The temperature measuring device is not limited in the embodiment of the application. For example, the device to be measured can be a magnetic suspension molecular pump turbine with a nickel plating or other coatings on the surface, which runs at high speed.

For example, the contact temperature measuring device refers to a temperature measuring device which needs the device to contact a device to be measured to obtain the temperature of the device to be measured during the measurement process, such as a thermal resistance sensor made of a metal material, a semiconductor material, or the like, or a thermocouple sensor, or the like.

And step S12, determining non-contact temperature data corresponding to the temperature device to be measured based on the non-contact temperature measuring equipment corresponding to the temperature device to be measured.

Illustratively, the non-contact temperature measuring device refers to a temperature measuring device which can obtain the temperature of a device to be measured without the device contacting the device to be measured during the measurement process, such as an optical pyrometer, a radiation pyrometer, a colorimetric thermometer, and the like, and such as a visible light sensor or an infrared ray sensor, and the like.

And step S13, determining the temperature measurement relation between the contact temperature measurement equipment and the non-contact temperature measurement equipment based on the contact temperature data and the non-contact temperature data.

According to the temperature measuring method provided by the embodiment of the application, the temperature measuring relation between the contact temperature measuring equipment and the non-contact temperature measuring equipment can be determined by means of the contact temperature data and the non-contact temperature data, so that the calibration temperature value corresponding to the non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment, can be determined based on the temperature measuring relation. The process is simple, and the practicability and the operability are strong.

Fig. 2 is a schematic flow chart illustrating a process of determining a temperature measurement relationship according to an embodiment of the present application. The embodiment shown in fig. 2 is extended based on the embodiment shown in fig. 1, and the differences between the embodiment shown in fig. 2 and the embodiment shown in fig. 1 will be emphasized below, and the descriptions of the same parts will not be repeated.

As shown in fig. 2, in the temperature measurement method provided in the embodiment of the present application, determining the temperature measurement relationship between the contact thermometric device and the non-contact thermometric device based on the contact temperature data and the non-contact temperature data includes the following steps.

And S131, determining a correction coefficient between the contact temperature measuring equipment and the non-contact temperature measuring equipment based on the contact temperature data and the non-contact temperature data.

The correction coefficient is quantized data that needs to be corrected for adjustment based on the standard index.

In step S132, the temperature measurement relation is determined based on the correction coefficient.

The step of determining the temperature measurement relation provided by the embodiment of the application determines the temperature measurement relation between the contact temperature measurement equipment and the non-contact temperature measurement equipment based on the correction coefficient, and achieves scientific and effective development of practical application through quantification.

Illustratively, the correction coefficient between the contact temperature measuring device and the non-contact temperature measuring device is determined by utilizing a data fitting mode based on the contact temperature data and the non-contact temperature data. The data fitting method can adopt a linear fitting method and/or a nonlinear fitting method.

Fig. 3 is a schematic flow chart illustrating a process of determining a correction coefficient by using a data fitting method according to an embodiment of the present application. The embodiment shown in fig. 3 is extended based on the embodiment shown in fig. 2, and the differences between the embodiment shown in fig. 3 and the embodiment shown in fig. 2 will be emphasized below, and the descriptions of the same parts will not be repeated.

As shown in FIG. 3, in the embodiment of the present application, determining the correction factor between the contact temperature measurement device and the non-contact temperature measurement device based on the contact temperature data and the non-contact temperature data includes the following steps.

Step S1311, setting the temperature measured by the contact temperature measuring equipment and the temperature measured by the non-contact temperature measuring equipment to have the following linear relation: t is_pt＝A×T_ir+B。

Wherein, T_ptRepresenting the temperature measured by the contact temperature measuring equipment; t is_irRepresenting the temperature measured by the non-contact temperature measuring equipment; A. and B is a correction coefficient obtained by linear fitting.

In step S1312, fitting is performed using the contact temperature data and the non-contact temperature data, and correction coefficients a and B are determined.

In step S1313, a relational expression of the temperature measurement, that is, the temperature measurement relationship after a and B are determined, is determined based on the correction coefficient.

The step of determining the correction coefficient between the contact temperature measuring equipment and the non-contact temperature measuring equipment provided by the embodiment of the application adopts linear fitting to determine the correction coefficient, and is more visual and convenient.

Optionally, to improve accuracy, a non-linear fit may also be used to determine the correction coefficients to determine the relationship for the temperature measurement.

Fig. 4 is a schematic flow chart illustrating a process of determining contact temperature data corresponding to a device to be measured according to an embodiment of the present application. The embodiment shown in fig. 4 is extended based on the embodiment shown in fig. 1, and the differences between the embodiment shown in fig. 4 and the embodiment shown in fig. 1 will be emphasized below, and the descriptions of the same parts will not be repeated.

Specifically, in the embodiment of the application, the device to be measured in temperature comprises a turbine of a magnetic suspension molecular pump, and the surface of the turbine is covered with a coating. As shown in fig. 4, in the embodiment of the present application, determining contact temperature data corresponding to a device to be measured based on a contact temperature measuring device corresponding to the device to be measured includes the following steps.

And step S111, starting the magnetic suspension molecular pump to increase the temperature of the turbine to a preset temperature.

For example, the preset temperature may be set as a material tolerance limit temperature.

And step S112, reducing the rotating speed of the magnetic suspension molecular pump to zero so as to enable the magnetic suspension molecular pump to be in a stop state.

It will be appreciated that the rotational speed drops to zero and the turbine enters a natural cooling state.

And step S113, measuring the temperature of the end face of the turbine rotor by using contact type temperature measuring equipment in a shutdown state to obtain contact temperature data.

Illustratively, the push-pull type electromagnet is started, the bottom end of the contact type temperature measuring probe is sunk to be in contact with the end face of the turbine rotor through energization of the coil, and the temperature sensor located on the bottom face of the probe measures the temperature of the turbine to obtain a plurality of temperature values at a certain time point. Then the electromagnet can be powered off, and the contact temperature measuring probe is separated from the end face of the rotor.

Similarly, fig. 5 is a schematic flow chart illustrating the determination of non-contact temperature data corresponding to a device to be measured according to an embodiment of the present application. As shown in fig. 5, in the embodiment of the present application, determining non-contact temperature data corresponding to a device to be measured based on a non-contact temperature measuring device corresponding to the device to be measured includes the following steps.

And step S121, starting the magnetic suspension molecular pump to increase the temperature of the turbine to a preset temperature.

As described above, the preset temperature may be set to a material withstand limit temperature, for example.

And step S122, reducing the rotating speed of the magnetic suspension molecular pump to zero so as to enable the magnetic suspension molecular pump to be in a stop state.

And S123, measuring the temperature of the end face of the turbine rotor by using non-contact temperature measuring equipment in a shutdown state to obtain non-contact temperature data.

And acquiring a plurality of temperature values of the end face of the rotor measured by the infrared ray temperature measuring component at the same time point as the step S113. Optionally, the infrared ray temperature measurement component may measure the temperature of a symmetrical portion of the portion measured by the contact temperature measurement probe, so as to avoid mutual influence of temperature fields caused by the contact temperature measurement component and the infrared ray temperature measurement component measuring the same portion or a close portion.

The step of the contact temperature data and the non-contact temperature data that the definite temperature measuring device of treating that provides of above application embodiment leads to the temperature fast to fall to be unfavorable for accurate measurement in order to prevent the emergence of broken vacuum phenomenon, can carry out above step under the vacuum state, has avoided the entering of pollutant when promoting the degree of accuracy. That is, the inside of the magnetic levitation molecular pump is maintained in a vacuum state.

After the contact temperature data and the non-contact temperature data corresponding to the device to be measured are determined according to the above steps, data fitting can be performed according to the steps S1311 to S1313, and the temperature measurement relationship between the contact temperature measurement device and the non-contact temperature measurement device is determined, so that the calibration temperature value corresponding to the non-contact temperature value to be calibrated, which is measured by the non-contact temperature measurement device, is determined based on the temperature measurement relationship.

Fig. 6 is a schematic flow chart of a temperature measurement method according to another embodiment of the present application. As shown in fig. 6, the temperature measurement method provided by the embodiment of the present application includes the following steps.

And step S1, determining the temperature measurement relation between the contact temperature measurement equipment and the non-contact temperature measurement equipment corresponding to the device to be measured.

For example, the temperature measurement relationship mentioned in step S1 may be obtained based on the temperature measurement method mentioned in any of the above embodiments.

And step S2, acquiring a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring equipment.

For example, an infrared ray temperature measurement component can be used for measuring the real-time non-contact temperature value of the end face of the rotor. In this case, the pump may be stopped or operated.

And step S3, determining a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relation and the non-contact temperature value to be calibrated.

For example, this step is to obtain the temperature value, i.e. T, from step S2_irSubstituting into the relation determined in step S1313 to obtain corresponding T_ptI.e. the calibrated temperature value.

Alternatively, for convenience, the steps S11 to S13 may be performed only for the first time to determine the temperature measurement relationship between the contact thermometric apparatus and the non-contact thermometric apparatus. Alternatively, the next temperature measurement steps, i.e., steps S1 through S3, may be performed thereafter according to the first obtained relationship. I.e. the turbine temperature can be measured at any time as long as the relationship is determined, without preventing the pump from working properly.

Method embodiments of the present application are described in detail above in conjunction with fig. 1-6, and apparatus embodiments of the present application are described in detail below in conjunction with fig. 7 and 8. It is to be understood that the description of the method embodiments corresponds to the description of the apparatus embodiments, and therefore reference may be made to the preceding method embodiments for parts not described in detail.

Fig. 7 is a schematic structural diagram of a temperature measuring device according to an embodiment of the present application. As shown in fig. 7, the temperature measuring apparatus provided in the embodiment of the present application includes a first determining module 10, a second determining module 20, and a third determining module 30.

Specifically, the first determining module 10 is configured to determine, based on the contact temperature measuring device corresponding to the device to be measured, contact temperature data corresponding to the device to be measured. The second determining module 20 is configured to determine non-contact temperature data corresponding to the temperature measuring device based on the non-contact temperature measuring device corresponding to the temperature measuring device. The third determining module 30 is configured to determine a temperature measurement relationship between the contact temperature measuring device and the non-contact temperature measuring device based on the contact temperature data and the non-contact temperature data, so as to determine a calibration temperature value corresponding to a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring device, based on the temperature measurement relationship.

In some embodiments, the third determination module 30 is further configured to determine a correction factor between the contact thermometry device and the non-contact thermometry device based on the contact temperature data and the non-contact temperature data, and determine the temperature measurement relationship based on the correction factor.

In some embodiments, the third determining module 30 is further configured to set the temperature measured by the contact thermometry device and the temperature measured by the non-contact thermometry device to have the following linear relationship: t is_pt＝A×T_irAnd+ B, fitting by using the contact temperature data and the non-contact temperature data, determining correction coefficients A and B, and determining a temperature measurement relation formula based on the correction coefficients, namely determining the temperature measurement relation after A and B.

In some embodiments, the device to be measured comprises a turbine of a magnetically levitated molecular pump, and a surface of the turbine is covered with a coating. The first determining module 10 is further configured to start the magnetic suspension molecular pump to raise the temperature of the turbine to a preset temperature, reduce the rotation speed of the magnetic suspension molecular pump to zero, so that the magnetic suspension molecular pump is in a shutdown state, and measure the temperature of the end face of the turbine rotor by using the contact temperature measuring device in the shutdown state to obtain contact temperature data.

In some embodiments, the device to be measured comprises a turbine of a magnetically levitated molecular pump, and a surface of the turbine is covered with a coating. The second determining module 20 is further configured to start the magnetic suspension molecular pump to raise the temperature of the turbine to a preset temperature, reduce the rotation speed of the magnetic suspension molecular pump to zero, so that the magnetic suspension molecular pump is in a shutdown state, and measure the temperature of the end face of the turbine rotor by using the non-contact temperature measuring device in the shutdown state to obtain non-contact temperature data.

Fig. 8 is a schematic structural diagram of a temperature measuring device according to another embodiment of the present application. As shown in fig. 8, the temperature measuring apparatus provided in the embodiment of the present application includes a fourth determining module 40, a fifth determining module 50, and an obtaining module 60.

Specifically, the fourth determining module 40 is configured to determine a temperature measurement relationship between a contact temperature measuring device and a non-contact temperature measuring device corresponding to the device to be measured.

The obtaining module 60 is configured to obtain a non-contact temperature value to be calibrated, which is measured by the non-contact temperature measuring device.

The fifth determining module 50 is configured to determine a calibration temperature value corresponding to the non-contact temperature value to be calibrated according to the temperature measurement relationship and the non-contact temperature value to be calibrated.

Next, a temperature measurement system according to an embodiment of the present application is described with reference to fig. 9. Fig. 9 is a schematic structural diagram of a temperature measurement system according to an embodiment of the present application. As shown in FIG. 9, the temperature measurement system 80 includes a processor 810, a contact thermometry device 820, and a non-contact thermometry device 830.

Further, in some embodiments, the contact temperature measurement device employs a contact temperature measurement probe, and the non-contact temperature measurement device employs an infrared ray temperature measurement component, which can be manufactured to have the same size as the inlet flange of the molecular pump, is convenient to install, and can be installed once without repeated assembly and disassembly, and does not affect the normal use of the magnetic suspension molecular pump, as shown in fig. 10. Fig. 10 is a schematic diagram illustrating an installed temperature measurement system according to an embodiment of the present application. Wherein 100 represents a magnetic suspension molecular pump, 200 represents a contact temperature measuring probe, and 300 represents an infrared ray temperature measuring component. The infrared ray temperature measurement component is responsible for measuring the temperature of the end face of the rotor when the pump runs and stops; the contact type temperature measuring component measures the temperature of the end face of the rotor opposite to the infrared ray temperature measuring position in the shutdown state of the pump.

Processor 810 may be a Central Processing Unit (CPU) or other form of Processing Unit having data Processing capabilities and/or instruction execution capabilities, and may control other components in the temperature measurement device to perform desired functions.

In one example, the temperature measurement system 80 may further include: an input device 840 and an output device 850, which are interconnected by a bus system and/or other form of connection mechanism (not shown).

The input device 840 may include, for example, a keyboard, a mouse, and the like. The method is used for selecting or inputting a temperature measurement relational expression between the contact temperature measurement equipment and the non-contact temperature measurement equipment, or inputting some data to be calibrated and the like.

The output device 850 may output various information including a real-time calibrated temperature value, etc. to the outside. The output devices 850 may include, for example, a display, speakers, a printer, and a communication network and its connected remote output devices, among others.

Of course, for simplicity, only some of the components of the temperature measurement system 80 relevant to the present application are shown in fig. 9, omitting components such as buses, input/output interfaces, and the like. In addition, the temperature measurement system 80 may include any other suitable components depending on the particular application.

In addition to the above-described methods and apparatus, embodiments of the present application may also be a computer program product comprising computer program instructions that, when executed by a processor, cause the processor to perform the steps in the temperature measurement methods according to the various embodiments of the present application described above in this specification.

The computer program product may include program code for carrying out operations for embodiments of the present application in any combination of one or more programming languages, including an object oriented programming language such as Java, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server.

Furthermore, embodiments of the present application may also be a computer-readable storage medium having stored thereon computer program instructions that, when executed by a processor, cause the processor to perform the steps in the temperature measurement method according to various embodiments of the present application described above in this specification.

A computer-readable storage medium may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may include, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium include: an electrical connection having one or more wires, a portable disk, a hard disk, a Random Access Memory (RAM), a Read-Only Memory (ROM), an Erasable Programmable Read-Only Memory (EPROM or flash Memory), an optical fiber, a portable Compact Disc Read-Only Memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.