阅读说明：本技术 一种基于铜基板的扦插式绝缘胶压合工艺 (Cuttage type insulating glue pressing process based on copper substrate ) 是由 罗志敏 于 2021-05-19 设计创作，主要内容包括：本发明公开了一种基于铜基板的扦插式绝缘胶压合工艺,属于铜基板技术领域,本发明可以在铜箔和金属基层压合前,利用扦插柱沾上蜡液后于铜箔背面固化吸附的方式,使得铜箔背面均匀吸附有多个扦插柱,然后对铜箔和金属基层进行压合,扦插柱插入至绝缘胶内形成漏气通道,绝缘胶内含有的气体绝大部分会释放出去,同时在绝缘胶加热固化的过程中,固化的蜡重新熔化并进入到漏气通道的缝隙内,利用其表面张力较大的特性赶走剩余的气体至上侧,另外在金属基层下方施加的磁场,也会同步触发扦插柱的底端膨胀动作,继续深化气体挤压的同时,释放出预存的绝缘胶来保证其密度和充实度,并提高扦插柱与绝缘胶层的结合强度。(The invention discloses a cutting type insulating adhesive pressing process based on a copper substrate, which belongs to the technical field of copper substrates and can ensure that a plurality of cutting columns are uniformly adsorbed on the back surface of a copper foil in a mode of solidifying and adsorbing the cutting columns after the wax liquid is adhered to the cutting columns before the copper foil and a metal base layer are pressed, then the copper foil and the metal base layer are pressed, the cutting columns are inserted into insulating adhesive to form air leakage channels, most of gas contained in the insulating adhesive can be released out, meanwhile, in the process of heating and solidifying the insulating adhesive, the solidified wax is re-melted and enters gaps of the air leakage channels, the residual gas is driven to the upper side by utilizing the characteristic of larger surface tension, in addition, a magnetic field applied below the metal base layer can synchronously trigger the bottom expansion action of the cutting columns, the pre-stored insulating adhesive is released to ensure the density and the degree of fullness of the insulating adhesive while the gas extrusion is further deepened, and the bonding strength of the cuttage column and the insulation glue layer is improved.)

1. A cuttage type insulating glue laminating process based on a copper substrate is characterized in that: the method comprises the following steps:

s1, taking a plurality of inserting columns, immersing one end of each inserting column into the wax liquid, quickly transferring the inserting columns to the back of the copper foil for uniform adsorption, and forming temporary connection after the wax liquid is cooled and solidified;

s2, coating the insulating glue on the surface of the metal base layer to ensure uniform thickness, and aligning and laminating the copper foil connected with the inserting column with the metal base layer;

s3, heating the metal base layer to 150-200 ℃, applying a magnetic field below the metal base layer, triggering the expansion and exhaust actions of the cuttage column, eliminating bubbles in the insulation paste, and ensuring the uniform stress of the insulation paste;

s4, heating for 3-5h until the insulating glue is fully solidified, and then standing for natural cooling;

and S5, cleaning the redundant glue at the edge, testing the pressing strength, and packaging and warehousing after the bonding strength is qualified.

2. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 1, characterized in that: the length of the cuttage post is less than the thickness of the insulation paste, and the thickness of the insulation paste is ensured to be unchanged during pressing.

3. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 1, characterized in that: the density of the wax liquid is greater than that of the insulating glue.

4. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 1, characterized in that: the cuttage post is including extension cylinder (1) and the inflation hemisphere (2) of body coupling, extend cylinder (1) and be the wax dipping end, the width of extending cylinder (1) keeps unanimous with the diameter of inflation hemisphere (2).

5. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 4, wherein: the expansion hemisphere (2) comprises an expansion layer (21), an internal heat magnetic bag (22) and a plurality of shaping support rods (23), wherein the expansion layer (21) comprises a plurality of expansion sheets which are distributed densely, the expansion sheets are combined into a complete hemisphere shape, the shaping support rods (23) are uniformly connected between the internal heat magnetic bag (22) and the expansion sheets, and insulating glue is filled between the expansion layer (21) and the internal heat magnetic bag (22).

6. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 5, wherein: the expansion magnetic bag is characterized in that a plurality of uniformly distributed guide and extension ball points (3) are embedded and connected on the expansion hemisphere (2), the connection positions between the guide and extension ball points (3) and the expansion sheet correspond to each other, and a compression pull wire (4) is connected between the guide and extension ball points (3) and one end face, close to the extension column body (1), of the inner heat magnetic bag (22).

7. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 6, wherein: the inner heat magnetic capsule (22) is filled with heat conduction oil and a plurality of magnetic particles (5), and the magnetic particles (5) are of spherical structures.

8. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 5, wherein: the extension cylinder (1) and the expansion layer (21) are both made of hard insulating heat conduction materials, and the inner thermal magnetic capsule (22) is made of elastic insulating heat conduction materials.

9. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 1, characterized in that: and the pressing pressure in the step S2 is 0.5-2 MPa.

10. The cuttage type insulating glue laminating process based on the copper substrate as claimed in claim 1, characterized in that: in the step S4, the maximum heating temperature is kept for 1-2h by a heat preservation wheel after the insulating glue is cured.

Technical Field

The invention relates to the technical field of copper substrates, in particular to a cuttage type insulating glue laminating process based on a copper substrate.

Background

The copper substrate is the most expensive one of the metal substrates, has a heat conduction effect many times better than that of the aluminum substrate and the iron substrate, and is suitable for high-frequency circuits, areas with large high and low temperature changes and the heat dissipation and architectural decoration industries of precision communication equipment.

Generally, there are gold immersion copper substrate, silver plating copper substrate, tin spraying copper substrate, oxidation resistant copper substrate, etc. The copper substrate circuit layer is required to have great current carrying capacity, so that thicker copper foil is used, and the thickness is generally 35-280 μm; the heat conducting insulating layer is the core technology of the copper substrate, the core heat conducting component is composed of aluminum oxide and silicon powder and a polymer filled with epoxy resin, the heat resistance is small (0.15), the viscoelastic property is excellent, the heat aging resistance is realized, and the heat conducting insulating layer can bear mechanical and thermal stress. The copper substrate metal base layer is a supporting member of a copper substrate, which is required to have high thermal conductivity, and is generally a copper plate, and a copper plate (wherein the copper plate can provide better thermal conductivity) can be used, and is suitable for conventional machining such as drilling, punching, cutting and the like.

However, in the actual pressing process of the copper substrate, a small amount of gas is inevitably mixed into the insulating adhesive, and bubbles are easily generated in the insulating adhesive layer or the appearance is poor due to the problem of uneven pressure, so that the yield is low, the strength of the copper substrate is low, and the heat conduction efficiency is also seriously reduced.

Disclosure of Invention

1. Technical problem to be solved

Aiming at the problems in the prior art, the invention aims to provide a cutting type insulating adhesive laminating process based on a copper substrate, which can utilize the mode that a plurality of cutting columns are uniformly adsorbed on the back surface of a copper foil after the cutting columns are dipped with wax liquid before the copper foil and a metal base layer are laminated, then the copper foil and the metal base layer are laminated, the cutting columns are inserted into the insulating adhesive to form a gas leakage channel, most of gas contained in the insulating adhesive can be released out, meanwhile, in the process of heating and solidifying the insulating adhesive, the solidified wax is remelted and enters the gap of the gas leakage channel, the residual gas is driven to the upper side by utilizing the characteristic of larger surface tension, in addition, a magnetic field applied below the metal base layer can synchronously trigger the bottom expansion action of the cutting columns, the pre-stored insulating adhesive is released to ensure the density and the degree of fullness of the insulating adhesive while the gas extrusion is further deepened, and the bonding strength of the cuttage column and the insulation adhesive layer is improved, and the cuttage column can be contacted with the metal base layer during expansion to assist in improving the heat conduction efficiency.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

A cuttage type insulating glue laminating process based on a copper substrate comprises the following steps:

s1, taking a plurality of inserting columns, immersing one end of each inserting column into the wax liquid, quickly transferring the inserting columns to the back of the copper foil for uniform adsorption, and forming temporary connection after the wax liquid is cooled and solidified;

s2, coating the insulating glue on the surface of the metal base layer to ensure uniform thickness, and aligning and laminating the copper foil connected with the inserting column with the metal base layer;

s3, heating the metal base layer to 150-200 ℃, applying a magnetic field below the metal base layer, triggering the expansion and exhaust actions of the cuttage column, eliminating bubbles in the insulation paste, and ensuring the uniform stress of the insulation paste;

s4, heating for 3-5h until the insulating glue is fully solidified, and then standing for natural cooling;

and S5, cleaning the redundant glue at the edge, testing the pressing strength, and packaging and warehousing after the bonding strength is qualified.

Furthermore, the length of the cuttage post is less than the thickness of the insulating cement, the thickness of the insulating cement is guaranteed to be unchanged during pressing, the cuttage post is guaranteed to have a certain expansion space in the follow-up process, meanwhile, the cuttage post is not in direct contact with the metal base layer in the initial stage, and the phenomenon that the surface of the metal base layer is not easy to extrude due to the fact that partial gas exists can be effectively avoided.

Furthermore, the density of the wax liquid is greater than that of the insulating glue, the wax can be filled along a formed air leakage channel due to the density relationship after being melted, and residual air is extruded to the copper foil formula to be discharged.

Further, the cuttage post includes the extension cylinder and the inflation hemisphere of body coupling, extend the cylinder and be the wax dipping end, the width that extends the cylinder keeps unanimous with the diameter of inflation hemisphere, extends the cylinder and plays the effect that extends the inflation hemisphere on the one hand, and on the other hand can directly carry out the heat conduction with the copper foil contact, and the inflation hemisphere then can bury in the insulating cement, continues deepening two kinds of effects of exhaust and heat conduction.

Furthermore, the expansion hemisphere comprises an expansion layer, an inner thermal magnetic capsule and a plurality of shaping support rods, the expansion layer comprises a plurality of expansion sheets which are distributed densely, the expansion sheets are combined into a complete hemispherical shell, the shaping support rods are uniformly connected between the inner thermal magnetic capsule and the expansion sheets, insulating glue is filled between the expansion layer and the inner thermal magnetic capsule, the expansion layer is closed in a normal state, when the inner thermal magnetic capsule is attracted by a magnetic field, the expansion sheets are separated by the aid of the extrusion of the shaping support rods, gaps are formed between the expansion layers, the insulating glue can permeate out to supplement and compact original insulating glue, meanwhile, the inner thermal magnetic capsule can also partially extend out of the gaps and is in contact with the metal base layer, and a complete heat conduction channel from the copper foil, the extension column body, the expansion hemisphere to the metal base layer is realized.

Furthermore, inlay on the inflation hemisphere and be connected with a plurality of evenly distributed's the ball point that stretches, and the junction between ball point and the dilatation piece is corresponding to the guidance, it draws the line to stretch to be connected with the compression between the terminal surface that the ball point and interior heat magnetic cell are close to the extension cylinder, and the ball point that stretches can improve the expansion layer to the expansion effect in gap between the dilatation piece to after the ball point that stretches is stretched in the guidance extends the inflation layer, rely on the effect of dragging of compression drawing a line to force interior heat magnetic cell synchronous compression, and then oppress the conduction oil and fully follow the ball point that stretches and fill, guarantee the continuity of heat conduction effect.

Further, interior hot magnetic bag intussuseption is filled with conduction oil and a plurality of magnetic particle, magnetic particle is spherical structure, and the conduction oil can follow the extension of leading and stretch the ball point and fill in step, and magnetic particle drives after receiving the adsorption in magnetic field and leads and stretch the ball point and deform to finally tile on metal base layer surface, improve the area of contact with metal base layer, thereby improve heat conduction effect, the magnetic particle of spherical structure is difficult for appearing piling up the phenomenon, has certain space each other simultaneously and holds the conduction oil and guarantee heat conduction effect.

Furthermore, the extension cylinder and the expansion layer are both made of hard insulating heat conduction materials, and the inner thermal magnetic capsule is made of elastic insulating heat conduction materials.

Further, the pressing pressure in the step S2 is 0.5 to 2 MPa.

Further, in the step S4, after the insulating glue is cured, the maximum heating temperature is kept for 1-2 hours by a heat preservation wheel.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

(1) the scheme can ensure that a plurality of cuttage columns are uniformly adsorbed on the back surface of the copper foil by utilizing the mode that the cuttage columns are adhered with the wax liquid and then are solidified and adsorbed on the back surface of the copper foil before the copper foil is pressed with the metal base layer, then the copper foil and the metal base layer are pressed, the cutting column is inserted into the insulating glue to form a gas leakage channel, most of gas contained in the insulating glue is released, meanwhile, in the process of heating and curing the insulating glue, the cured wax is re-melted and enters the gap of the air leakage channel, the residual air is driven away to the upper side by utilizing the characteristic of larger surface tension, in addition, the magnetic field applied below the metal base layer can synchronously trigger the expansion action of the bottom end of the cuttage column, and release the pre-stored insulating glue to ensure the density and the compactness of the cuttage column while continuing to deepen the gas extrusion, and the bonding strength of the cuttage column and the insulation adhesive layer is improved, and the cuttage column can be contacted with the metal base layer during expansion to assist in improving the heat conduction efficiency.

(2) The length of cuttage post is less than the thickness of insulating cement, ensures that insulating cement thickness is unchangeable during the pressfitting, guarantees that the cuttage post has certain expansion space in follow-up, does not contact with metal substrate direct contact at the initial stage simultaneously, also can effectively avoid partial gas to exist the metal substrate surface and be difficult for extruding.

(3) The density of the wax liquid is greater than that of the insulating glue, the wax can be filled along a formed air leakage channel due to the density relation after being melted, and residual gas is extruded to the copper foil formula to be discharged.

(4) The cuttage post includes extension cylinder and the inflation hemisphere of body coupling, extends the cylinder and is the wax dipping end, and the width that extends the cylinder keeps unanimous with the diameter of inflation hemisphere, extends the cylinder and plays the effect of extending the inflation hemisphere on the one hand, and on the other hand can directly carry out the heat conduction with the copper foil contact, and the inflation hemisphere then can bury in the insulating cement, continues deepening the two kinds of effects of exhaust and heat conduction.

(5) The expansion hemisphere comprises an expansion layer, an inner thermal magnetic capsule and a plurality of shaping support rods, the expansion layer comprises a plurality of expansion sheets which are distributed densely, the expansion sheets are combined into a complete hemispherical shell, the shaping support rods are uniformly connected between the inner thermal magnetic capsule and the expansion sheets, insulating glue is filled between the expansion layer and the inner thermal magnetic capsule, the expansion layer is closed in a normal state, when the inner thermal magnetic capsule is attracted by a magnetic field, the expansion sheets are separated by extruding the shaping support rods to form gaps, the insulating glue can permeate out to supplement and compact original insulating glue, meanwhile, the inner thermal magnetic capsule can also partially extend out of the gaps and is in contact with a metal base layer, and a complete heat conduction channel from a copper foil, an extension cylinder and the expansion hemisphere to the metal base layer is realized.

(6) Inlay the ball point that stretches that is connected with a plurality of evenly distributed's of leading on the inflation hemisphere, and it is corresponding to lead the junction of stretching between ball point and the dilatation piece, it draws the line to lead to stretch being connected with the compression between the terminal surface that ball point and interior heat magnetic cell are close to the extension cylinder, it can improve the expansion effect in inflation layer to the gap between the dilatation piece to lead to stretch the ball point, and after stretching the inflation layer at the lead, rely on the effect of dragging of compression drawing a line to force interior heat magnetic cell synchronous compression, and then the conduction oil of oppression is fully followed and is led to stretch the ball point and fill, guarantee the continuity of heat conduction effect.

(7) The intussuseption of interior hot magnetic cell is filled with conduction oil and a plurality of magnetic particle, magnetic particle is spherical structure, the extension that the conduction oil can follow the conduction ball point is filled in step, and magnetic particle drives the conduction ball point and deforms after receiving the adsorption in magnetic field, and finally tile on metal base layer surface, improve the area of contact with metal base layer, thereby improve heat conduction effect, spherical structure's magnetic particle is difficult for appearing piling up the phenomenon, it holds the conduction oil to have certain space to guarantee heat conduction effect simultaneously each other.

Drawings

FIG. 1 is a schematic flow diagram of the present invention;

FIG. 2 is a schematic structural view of the skewer post of the present invention;

FIG. 3 is a cross-sectional view of an expanded hemispherical section of the present invention;

FIG. 4 is a cross-sectional view of the inflated hemisphere of the present invention after inflation;

fig. 5 is a schematic structural view of the expanded hemisphere with the point of the sphere extended.

The reference numbers in the figures illustrate:

1 extending column, 2 expanding hemispheres, 21 expanding layers, 22 inner thermomagnetic capsules, 23 shaping support rods, 3 extending ball points, 4 compressing pull wires and 5 magnetic particles.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1, a cutting type insulating adhesive laminating process based on a copper substrate includes the following steps:

s1, taking a plurality of inserting columns, immersing one end of each inserting column into the wax liquid, quickly transferring the inserting columns to the back of the copper foil for uniform adsorption, and forming temporary connection after the wax liquid is cooled and solidified;

s2, coating the insulating glue on the surface of the metal base layer to ensure uniform thickness, and aligning and laminating the copper foil connected with the inserting column with the metal base layer;

s3, heating the metal base layer to 150-200 ℃, applying a magnetic field below the metal base layer, triggering the expansion and exhaust actions of the cuttage column, eliminating bubbles in the insulation paste, and ensuring the uniform stress of the insulation paste;

s4, heating for 3-5h until the insulating glue is fully solidified, and then standing for natural cooling;

and S5, cleaning the redundant glue at the edge, testing the pressing strength, and packaging and warehousing after the bonding strength is qualified.

The pressing pressure in the step S2 is 0.5-2 MPa.

In step S4, the maximum heating temperature is kept for 1-2h by a heat preservation wheel after the insulating glue is cured.

The length of cuttage post is less than the thickness of insulating cement, ensures that insulating cement thickness is unchangeable during the pressfitting, guarantees that the cuttage post has certain expansion space in follow-up, does not contact with metal substrate direct contact at the initial stage simultaneously, also can effectively avoid partial gas to exist the metal substrate surface and be difficult for extruding.

The density of the wax liquid is greater than that of the insulating glue, the wax can be filled along a formed air leakage channel due to the density relation after being melted, and residual gas is extruded to the copper foil formula to be discharged.

Referring to fig. 2, the cutting column includes an extension column body 1 and an expansion hemisphere 2 which are integrally connected, the extension column body 1 is a wax-dipped end, the width of the extension column body 1 is consistent with the diameter of the expansion hemisphere 2, the extension column body 1 plays a role of extending the expansion hemisphere 2 on one hand, and can directly contact with a copper foil to conduct heat on the other hand, and the expansion hemisphere 2 can be embedded into an insulating adhesive to continue to deepen exhaust and heat conduction effects.

Referring to fig. 3-4, the expansion hemisphere 2 includes an expansion layer 21, an internal thermal magnetic capsule 22 and a plurality of shaping support rods 23, the expansion layer 21 includes a plurality of expansion sheets densely distributed, and the expansion sheets are combined into a complete hemispherical shell, the shaping support rods 23 are uniformly connected between the internal thermal magnetic capsule 22 and the expansion sheets, an insulating glue is filled between the expansion layer 21 and the internal thermal magnetic capsule 22, the expansion layer 21 is closed in a normal state, when the internal thermal magnetic capsule 22 is attracted by a magnetic field, the expansion sheets are separated by being squeezed by the shaping support rods 23, and the insulating glue penetrates to supplement and compact the original insulating glue, and meanwhile, the internal thermal magnetic capsule 22 also partially extends out of the gap and contacts with the metal base layer, so as to realize a complete heat conduction channel from the copper foil, the extension column 1, the expansion hemisphere 2 to the metal base layer.

Inlay on the expansion hemisphere 2 and be connected with a plurality of evenly distributed's the ball point 3 that stretches of leading, and it is corresponding to lead the junction between ball point 3 and the dilatation piece, it acts as go-between to lead to stretch ball point 3 and interior heat magnetic cell 22 to be close to the compression between the terminal surface that extends cylinder 1 and be connected with 4, it can improve the expansion effect in expansion layer 21 gap between to the dilatation piece to lead to stretch ball point 3, and stretch ball point 3 and extend behind expansion layer 21 at the lead, rely on the compression to act as go-between 4 to drag the effect and force interior heat magnetic cell 22 synchronous compression, and then the oppression conduction oil is fully followed and is stretched ball point 3 and fill, guarantee the continuity of heat conduction effect.

Please refer to fig. 5, the interior hot magnetic bag 22 is filled with conduction oil and a plurality of magnetic particles 5, magnetic particles 5 are spherical structure, the conduction oil can be filled synchronously along with the extension of the extension ball point 3, and magnetic particles 5 drive the extension ball point 3 to deform after receiving the adsorption of the magnetic field, and finally tile on the surface of the metal base layer, improve the contact area with the metal base layer, thereby improve the heat conduction effect, the magnetic particles 5 of spherical structure are difficult for appearing piling up the phenomenon, have certain space each other simultaneously and hold the conduction oil to guarantee the heat conduction effect.

The extension cylinder 1 and the expansion layer 21 are both made of hard insulating heat conduction materials, and the inner thermomagnetic capsule 22 is made of elastic insulating heat conduction materials.

The invention can make the back of the copper foil uniformly adsorb a plurality of cuttage columns by utilizing the mode that the cuttage columns are dipped with the wax liquid and then are solidified and adsorbed on the back of the copper foil before the copper foil is pressed with the metal base layer, then the copper foil and the metal base layer are pressed, the cutting column is inserted into the insulating glue to form a gas leakage channel, most of gas contained in the insulating glue is released, meanwhile, in the process of heating and curing the insulating glue, the cured wax is re-melted and enters the gap of the air leakage channel, the residual air is driven away to the upper side by utilizing the characteristic of larger surface tension, in addition, the magnetic field applied below the metal base layer can synchronously trigger the expansion action of the bottom end of the cuttage column, and release the pre-stored insulating glue to ensure the density and the compactness of the cuttage column while continuing to deepen the gas extrusion, and the bonding strength of the cuttage column and the insulation adhesive layer is improved, and the cuttage column can be contacted with the metal base layer during expansion to assist in improving the heat conduction efficiency.

The above are merely preferred embodiments of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.