阅读说明：本技术 一种多功能电路模块结构 (Multifunctional circuit module structure ) 是由 胡先成 于 2021-06-28 设计创作，主要内容包括：本发明公开一种多功能电路模块结构,具有电路板和供电路板安装的安装板,安装板上开设有贯穿安装板两面的安装孔,上述安装孔内拆卸安装有导热金属件,上述导热金属件的一面与安装板的第二面相齐平,上述导热金属件的另一面上凸设有若干块与电路板相接触的接触凸起。本发明的一种多功能电路模块结构,利用导热金属件的导电物性使整个电路板相当于接地,给电路板提供了电传导路径,使整个电路板具有优佳的电磁兼容性,且整个结构设置无需在原有的电路板上作任何的改变,安整体使用不受任何局限性,使用灵活,结构简易,推广性强,同时,导热金属件利用自身的导热性可将电路板工作产生的热量快速导出散热,提高了电路板的使用寿命。(The invention discloses a multifunctional circuit module structure, which comprises a circuit board and a mounting plate for mounting the circuit board, wherein the mounting plate is provided with mounting holes penetrating through two surfaces of the mounting plate, a heat-conducting metal part is detachably mounted in the mounting holes, one surface of the heat-conducting metal part is flush with the second surface of the mounting plate, and a plurality of contact bulges which are in contact with the circuit board are convexly arranged on the other surface of the heat-conducting metal part. According to the multifunctional circuit module structure, the whole circuit board is grounded equivalently by utilizing the electric conductivity of the heat-conducting metal part, an electric conduction path is provided for the circuit board, the whole circuit board has excellent electromagnetic compatibility, the whole structure is not required to be changed on the original circuit board, the whole use is not limited, the multifunctional circuit module structure is flexible to use, simple and easy in structure and strong in popularization, meanwhile, the heat generated by the work of the circuit board can be quickly led out and dissipated by utilizing the heat conductivity of the heat-conducting metal part, and the service life of the circuit board is prolonged.)

1. A multifunctional circuit module structure comprises a circuit board and a mounting plate for mounting the circuit board, wherein the circuit board is mounted on one surface of the mounting plate; use the one side that the mounting panel has the circuit board to be first face, relative another side for the second face, its characterized in that: the mounting plate is provided with mounting holes penetrating through two surfaces of the mounting plate, the heat-conducting metal part is detachably mounted in the mounting holes, one surface of the heat-conducting metal part is flush with the second surface of the mounting plate, and a plurality of contact protrusions which are in contact with the circuit board are arranged on the other surface of the heat-conducting metal part in a protruding mode.

2. The multi-function circuit module structure of claim 1, wherein: the number of the mounting holes is at least two, and the heat-conducting metal piece is arranged corresponding to the mounting holes.

3. A multifunctional circuit module structure according to claim 1 or 2, characterized in that: the first surface of the mounting plate is concavely provided with a first cavity, the second surface of the mounting plate is concavely provided with a second cavity, the cavity bottom of the first cavity is convexly provided with a plurality of reinforcing ribs which are vertically crossed and convexly provided with mounting columns for locking and mounting the circuit board, the cavity bottom of the second cavity is concavely provided with a mounting cavity for mounting the heat-conducting metal piece, the mounting cavity is the mounting hole, and the mounting cavity is provided with through holes communicated with the first cavity corresponding to the contact bulges.

4. A multi-function circuit module structure according to claim 3, wherein: the mounting chamber is provided with an outer chamber and an inner chamber positioned in the outer chamber, the bottom of the first chamber is convexly provided with a bulge matched with the outline of the inner chamber, the inner chamber extends into the bulge, and the heat-conducting metal piece is mounted in the inner chamber.

5. A multi-function circuit module structure according to claim 3, wherein: the above-mentioned exit hole is the bar hole, and the both ends in above-mentioned bar hole are the arc structure, and the protruding correspondence of above-mentioned contact is with bar hole assorted bar piece.

6. The multi-function circuit module structure of claim 4, wherein: the cavity bottom of the inner cavity is provided with a positioning through hole, and the heat-conducting metal piece is convexly provided with a positioning column clamped in the positioning through hole.

7. The multi-function circuit module structure of claim 4, wherein: the heat-conducting metal piece is an aluminum block or a copper block.

8. The multi-function circuit module structure of claim 7, wherein: the outer side wall of the heat-conducting metal piece is closely matched with the inner side wall of the inner cavity, and one surface of the heat-conducting metal piece, which is back to the circuit board, protrudes out of the cavity of the inner cavity to the space range of the outer cavity.

9. The multi-function circuit module structure of claim 8, wherein: the outer cavity is located at the periphery of the inner cavity and provided with a buckling hole communicated with the first cavity, a limiting piece is arranged on the inner hole wall of one side of the buckling hole in a protruding mode, a buckling block stretching into the buckling hole is arranged on the heat-conducting metal piece in a protruding mode, a buckling block which is used for crossing the limiting piece and the limiting piece to be buckled mutually is arranged on the buckling block in a protruding mode, and a guide inclined plane which is used for guiding the buckling block to cross the limiting piece is arranged on the buckling block.

10. The multi-function circuit module structure of claim 8, wherein: the first cavity is provided with a communicating notch which is communicated with the buckle hole along the buckle hole, and the communicating notch and the limiting piece are positioned on the same side.

Technical Field

The present invention relates to the field of circuit components, and in particular, to a circuit module structure.

Background

As is known, electronic products are generally required to have electromagnetic compatibility (EMC), that is, the ability of an electronic product to operate in its electromagnetic environment without generating intolerable electromagnetic interference to any device in its environment. Therefore, in order to make the electronic product capable of meeting the electromagnetic compatibility, a common measure is to add a shielding box to the printed circuit board to shield the product, thereby meeting the requirement of meeting the electromagnetic compatibility. However, users want the electronic products to have good appearance and low price. Therefore, the electronic product can meet the requirement of electromagnetic compatibility on the circuit board only under the condition of not taking any shielding measures.

At present, the simplest way for the requirement of electromagnetic compatibility on a circuit board is to change the wiring of the circuit board, that is, a plurality of ground wires are arranged on the circuit board, and a ground return path is provided for signal return by using the ground wires, so that the electromagnetic compatibility of the circuit board is realized. However, this method is more practical for circuit boards with smaller size or smaller space left for wiring, and is not suitable for providing a free position for ground wiring after printing is completed for each circuit board.

In view of the above, the present inventors have conducted extensive studies to solve the above problems.

Disclosure of Invention

The invention aims to provide a functional circuit module structure which can improve the electromagnetic compatibility of the whole circuit board, does not need to change the original circuit board wiring and has small application limitation.

In order to achieve the purpose, the invention adopts the following technical scheme:

a multifunctional circuit module structure comprises a circuit board and a mounting plate for mounting the circuit board, wherein the circuit board is mounted on one surface of the mounting plate; the one side that uses the mounting panel to have the circuit board is first face, relative another side is the second face, sets up the mounting hole that runs through the mounting panel two sides on the above-mentioned mounting panel, and the dismantlement is installed heat conduction metalwork in the above-mentioned mounting hole, and the one side of above-mentioned heat conduction metalwork flushes with the second face of mounting panel mutually, and the another side epirelief of above-mentioned heat conduction metalwork is equipped with the contact arch that a plurality of and circuit board contacted.

The number of the mounting holes is at least two, and the heat-conducting metal piece is arranged corresponding to the mounting holes.

The first surface of the mounting plate is concavely provided with a first cavity, the second surface of the mounting plate is concavely provided with a second cavity, the cavity bottom of the first cavity is convexly provided with a plurality of mutually crossed and vertically arranged reinforcing ribs and convexly provided with mounting columns for locking and mounting the circuit board, the cavity bottom of the second cavity is concavely provided with a mounting cavity for mounting the heat-conducting metal piece therein, and the mounting cavity is provided with through holes corresponding to the contact bulges and communicated with the first cavity.

The mounting chamber is provided with an outer chamber and an inner chamber positioned in the outer chamber, the bottom of the first chamber is convexly provided with a bulge matched with the outline of the inner chamber, the inner chamber extends into the bulge, and the heat-conducting metal piece is mounted in the inner chamber.

The above-mentioned exit hole is the bar hole, and the both ends in above-mentioned bar hole are the arc structure, and the protruding correspondence of above-mentioned contact is with bar hole assorted bar piece.

The cavity bottom of the inner cavity is provided with a positioning through hole, and the heat-conducting metal piece is convexly provided with a positioning column clamped in the positioning through hole.

The heat-conducting metal piece is an aluminum block or a copper block.

The outer side wall of the heat-conducting metal piece is closely matched with the inner side wall of the inner cavity, and one surface of the heat-conducting metal piece, which is back to the circuit board, protrudes out of the cavity of the inner cavity to the space range of the outer cavity.

The outer cavity is located at the periphery of the inner cavity and provided with a buckling hole communicated with the first cavity, a limiting piece is arranged on the inner hole wall of one side of the buckling hole in a protruding mode, a buckling block stretching into the buckling hole is arranged on the heat-conducting metal piece in a protruding mode, a buckling block which is used for crossing the limiting piece and the limiting piece to be buckled mutually is arranged on the buckling block in a protruding mode, and a guide inclined plane which is used for guiding the buckling block to cross the limiting piece is arranged on the buckling block.

The first cavity is provided with a communicating notch which is communicated with the buckle hole along the buckle hole, and the communicating notch and the limiting piece are positioned on the same side.

After the technical scheme is adopted, the multifunctional circuit module structure of the invention utilizes the electric conductivity of the heat-conducting metal piece to lead the whole circuit board to be equivalent to the grounding, provides an electric conduction path for the circuit board, leads the whole circuit board to have excellent electromagnetic compatibility, the whole structure does not need to be changed on the original circuit board, the structure of the mounting plate is only locally changed and does not influence the use, the whole use is not limited, the use is flexible, the structure is simple and easy, the popularization is strong, meanwhile, the heat conducting metal piece can rapidly conduct and dissipate heat generated by the work of the circuit board by utilizing the heat conductivity of the heat conducting metal piece, thereby prolonging the service life of the circuit board, reducing the generation of electromagnetic interference, and finally, the multipoint contact is realized by the arrangement of the contact bulges, so that the heat dissipation speed of the circuit board is higher, a grounding grid can be formed, and the electromagnetic compatibility is better.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic structural view of the present invention with the circuit board omitted;

FIG. 3 is another schematic diagram of the present invention without a circuit board

FIG. 4 is a perspective view of a thermally conductive metallic article of the present invention;

fig. 5 is a perspective view of a mounting plate of the present invention.

Detailed Description

In order to further explain the technical scheme of the invention, the following detailed description is combined with the accompanying drawings.

A multifunctional circuit module structure of the present invention, as shown in fig. 1 to 5, has a circuit board 1 and a mounting plate 2 for mounting the circuit board 1, the circuit board 1 being mounted on one side of the mounting plate 2; the one side that the mounting panel has the circuit board is first face, relative another side is the second face, this embodiment uses first face as last, the second face is down, set up the mounting hole that runs through the mounting panel upper and lower two sides on the mounting panel 2, the dismantlement is installed in the mounting hole and is conducted metal spare 3, the one side of heat conduction metal spare 3 (the bottom surface of heat conduction metal spare 3 promptly) flushes with the second face of mounting panel mutually, the another side epirelief of heat conduction metal spare 3 is equipped with the contact arch 31 that a plurality of blocks contacted with circuit board 1.

Excellent is, mounting panel and circuit board are a rectangle structure, the first face (being the top surface) undercut of mounting panel 2 has first cavity 21, the second face (being the bottom surface) of mounting panel 2 goes up the concave second cavity 22 that is equipped with, the chamber end epirelief of first cavity 21 is equipped with the strengthening rib 22 and the protruding erection column 23 that is equipped with the power supply circuit board lock solid installation of a plurality of intercrossing vertical settings, each strengthening rib 22 is the perpendicular grid structure of formation of setting up of crossing anyhow, utilize each reinforcing wire rod 22 can be to the installation intensity who provides mounting panel 2, erection column 23 is the cylinder, the top surface of erection column 23 is recessed to have the screw hole that has the internal thread, erection column 23 is provided with a plurality of, realize the installation to circuit board 1 through each erection column 23.

The installation cavity 221 for installing the heat-conducting metal piece is concavely arranged at the bottom of the second cavity 22 and is provided with a through hole communicated with the first cavity corresponding to each contact protrusion, specifically, the installation cavity is provided with an outer cavity 2211 and an inner cavity 2212 in the outer cavity, the size of the inner cavity 2212 is matched with that of the heat-conducting metal piece 3, the outline of the outer cavity 2211 is the same as that of the inner cavity, and the size of the outer cavity 2211 is larger than that of the inner cavity.

The heat-conducting metal piece 3 is an aluminum piece processed by adopting an aluminum material or a copper piece processed by adopting a copper material, the shape of the heat-conducting metal piece 3 is a lightning shape with a wide middle and sharp two ends, the heat-conducting metal piece 3 is embedded in the inner cavity, namely, the outer side wall of the heat-conducting metal piece 3 is tightly matched with the inner side wall of the inner cavity 2212 in a fitting manner, the bottom of the heat-conducting metal piece 3 protrudes downwards out of the inner cavity to the outer cavity and is flush with the bottom surface of the mounting plate 2 or slightly protrudes out of the outer cavity, and the bottom of the inner cavity 2212 is provided with through holes 222 which are matched with the contact protrusions 31 in a tight manner and penetrate through the through holes in a one-to one correspondence manner corresponding to the contact protrusions 31.

The invention relates to a multifunctional circuit module structure, which utilizes the electric conductivity of a heat-conducting metal piece 3 to ensure that the whole circuit board is equivalent to a grounding loop, provides an electric conduction path for the circuit board, ensures that the whole circuit board has excellent electromagnetic compatibility, does not need to be changed on the original circuit board in the arrangement of the whole structure, only partially changes the structure of a mounting plate without influencing the use, is not limited in the whole use, is flexible to use, simple in structure and strong in popularization, simultaneously utilizes the heat conductivity of the heat-conducting metal piece per se to quickly guide out and dissipate the heat generated by the work of the circuit board, prolongs the service life of the circuit board, reduces the generation of electromagnetic interference, finally utilizes the arrangement of contact bulges to realize multi-point contact, ensures that the heat dissipation speed of the circuit board is higher, can also form a ground grid, has better electromagnetic compatibility, and utilizes the arrangement of inner and outer cavities, make things convenient for the heat conduction metalwork to take out, the heat conduction metalwork still plays decorative effect, and the function is various.

In the invention, preferably, two mounting cavities are arranged, the two mounting cavities are arranged at intervals along the length direction of the mounting plate, and the two heat-conducting metal pieces 3 are correspondingly arranged, so that the heat-radiating effect is enhanced by utilizing the two heat-conducting metal pieces 3, the heat-radiating speed of the circuit board is high, and the whole circuit board is provided with two ground meshes, so that the electromagnetic compatibility is better.

In the invention, the bottom of the first chamber 21 is convexly provided with a bulge 211 matched with the contour of the inner chamber, the inner chamber extends into the bulge, and the bulge 211 can ensure that the thickness of the heat-conducting metal piece 3 is not increased by the thickness of the whole mounting plate.

In the present invention, the through hole 222 is a bar-shaped hole, two end portions of the bar-shaped hole are arc-shaped, the upper contact protrusion 21 is a bar-shaped block correspondingly matched with the bar-shaped hole 222, the contact protrusions 21 are preferably distributed along the length direction of the heat-conducting metal member 3, and the contact protrusions 21 are irregularly arranged in a horizontal manner, so that the contact area can be increased by the bar-shaped contact protrusions 21, and more contact protrusions can be arranged on the heat-conducting metal member 3 with an effective area.

In the invention, the bottom of the inner cavity 2212 is provided with a positioning through hole 223, the positioning through hole 223 is a circular hole, the top surface of the heat-conducting metal piece 3 is convexly provided with a positioning column 32 clamped in the positioning through hole, the heat-conducting metal piece 3 can be guided and installed by matching the positioning through hole and the positioning column, and the installation stability is improved.

In the invention, the outer cavity 2211 is provided with a buckling hole 224 communicated with the first cavity at the peripheral edge of the inner cavity 2212, a local part of the buckling hole 224 extends into the inner cavity, a limiting piece 225 is convexly arranged on the inner hole wall at one side of the buckling hole, a buckling block 33 which extends downwards into the buckling hole is convexly arranged at the top surface edge of the heat-conducting metal piece 3 corresponding to the buckling hole 224, a buckling block 331 which is buckled with the limiting piece over the limiting piece is convexly arranged on the buckling block 33, a guiding inclined plane which guides the buckling block to cross the limiting piece is arranged on the buckling block 331, that is, the top surface of the locking block 331 is inclined downward, so that when the locking block 33 extends upward into the locking hole 224, utilize inclined plane guide buckle piece upwards to cross spacing piece 225 to spacing piece 225 top, realize buckle piece 33 and spacing piece 225 spacing lock each other, this kind of buckle piece makes things convenient for the dismouting of heat conduction sheetmetal 3 with spacing cooperation of piece. Furthermore, the first cavity 21 is positioned in the buckling hole 224, a communicating notch communicated with the buckling hole is concavely arranged along the position, the communicating notch and the limiting piece are positioned on the same side, and the communicating notch extends to the side of the limiting piece, so that the communicating notch is convenient for a maintainer to translate the buckling block 33, the buckling block is convenient to operate to be separated from the limiting piece, and the disassembly and the assembly are convenient.

The product form of the present invention is not limited to the embodiments and examples shown in the present application, and any suitable changes or modifications of the similar ideas should be made without departing from the patent scope of the present invention.