阅读说明：本技术 一种用于微波窗的封装组件、焊接方法及微波窗 (Packaging assembly for microwave window, welding method and microwave window ) 是由 耿志辉 张瑞 杨修东 廖云峰 徐寿喜 于 2021-09-27 设计创作，主要内容包括：本公开提供了一种用于微波窗的封装组件,其特征在于,包括：至少一个一体成型的工字型介质窗片,用于保证微波源器件内部的密封性；和/或至少一个一体成型的C字型介质窗片,用于增加微波窗的带宽；其中,每个工字型介质窗片和每个C字型介质窗片的两端均设置至少一个焊料槽,焊料槽用于放置焊料丝以使介质窗片与所述微波窗的窗框进行焊接。本公开还提供了一种用于微波窗的封装组件的焊接方法、微波窗。(The present disclosure provides a package assembly for a microwave window, comprising: at least one integrally formed I-shaped dielectric window sheet for ensuring the sealing property inside the microwave source device; and/or at least one integrally formed C-shaped dielectric window piece for increasing the bandwidth of the microwave window; and at least one solder groove is formed at two ends of each I-shaped medium window piece and each C-shaped medium window piece, and the solder grooves are used for placing solder wires so as to weld the medium window pieces and the window frames of the microwave windows. The present disclosure also provides a welding method for a packaging component of a microwave window and the microwave window.)

1. A package assembly for a microwave window, comprising:

at least one integrally formed I-shaped dielectric window sheet for ensuring the sealing property inside the microwave source device; and/or

At least one integrally formed C-shaped dielectric window piece for increasing the bandwidth of the microwave window;

and at least one solder groove is formed in each I-shaped medium window piece and each C-shaped medium window piece, and the solder grooves are used for placing solder wires to enable the medium window pieces to be welded with the window frames of the microwave windows.

2. The packaging assembly for a microwave window of claim 1, wherein the horizontal width of each i-shaped dielectric louver is positively correlated to the welding area of the window frame; the horizontal width of each C-shaped medium window sheet is positively correlated with the welding area of the window frame.

3. The packaging assembly for a microwave window of claim 1, wherein the outer surfaces of both ends of each i-shaped dielectric louver and each C-shaped dielectric louver are metalized layers for good welding with the window frame.

4. The package assembly of claim 1, wherein each of the C-shaped dielectric louvers is centrally disposed with a vent for venting gas between the louvers.

5. The package for microwave windows of claim 1, wherein each i-shaped dielectric louver and each C-shaped dielectric louver are symmetrically structured and coaxially disposed.

6. The package assembly for a microwave window of claim 1, wherein the at least one integrally formed C-shaped dielectric louver is disposed on both sides of the i-shaped dielectric louver, respectively.

7. The package assembly for a microwave window of claim 1, wherein the thickness of each i-shaped dielectric louver and each C-shaped dielectric louver is inversely proportional to the microwave operating frequency of the microwave window.

8. A package assembly for a microwave window as claimed in claim 1 wherein the solder wire is a silver copper alloy solder wire or a gold copper alloy solder wire.

9. A method of soldering a microwave window package assembly according to any one of claims 1 to 8, comprising:

and placing the window frame of the microwave window and the packaging assembly in a brazing furnace for welding, so that the packaging assembly and the window frame of the microwave window are welded through the solder wires.

10. A microwave window, comprising: a package for a microwave window according to any one of claims 1 to 8.

Technical Field

The disclosure relates to the technical field of vacuum electronics in the electronic industry, in particular to a packaging assembly for a microwave window, a welding method and the microwave window.

Background

The gyrotron is a novel coherent microwave radiation source device, can work in a high-frequency wave band, has high power capacity and working bandwidth, and has wide application prospect in the fields of imaging radar, electronic countermeasure, directional energy weapons, material treatment, plasma heating and the like. The gyrotron can be divided into a gyrotron oscillator and a gyrotron amplifier according to the existence of the feed-in excitation; for low power gyrotron and most gyrotron amplifiers, the operation mode is TEon mode.

The microwave window is an important part of a microwave vacuum device, and mainly comprises a dielectric window sheet, a window frame, a flange and the like. The microwave window has two functions: the microwave feeding or microwave outputting channel and the barrier for isolating the vacuum inside the microwave tube from the outside atmosphere. In the microwave window, the vacuum sealing performance of the dielectric window sheet is crucial, and the dielectric window sheet is not only a window of a microwave channel, but also a barrier between the vacuum in the microwave tube and the external atmosphere; to accomplish metal brazing between the dielectric sheet and the window frame, the circumferential sides of the dielectric sheet (the sealing surfaces of the dielectric sheet) need to be metallized to ensure the vacuum sealing performance and sealing strength of the braze. Under the condition that the microwave window meets the transmission characteristic, the thickness of the dielectric window sheet of the microwave window is inversely proportional to the working frequency of the microwave, namely, the thickness of the dielectric window sheet is thinner and thinner along with the increase of the working frequency; the sealing surface of the dielectric window is smaller and smaller, which is likely to cause the decrease of the sealing performance of the dielectric window.

In the prior art, in order to expand the bandwidth of a gyrotron microwave window, a multi-window microwave window structure is adopted, and in the multi-medium window structure, the transmission performance of the microwave window is sensitive to gaps among windows; in order to ensure the gap between the window sheets, a thin copper ring is usually arranged between the dielectric window sheets, the thickness of the thin copper sheet needs to ensure the processing strength and also needs to consider the disturbance of the thin copper sheet on an electric field, and the method is not suitable for simplifying the welding process of the dielectric window sheets and improving the high-frequency performance of the microwave window.

Disclosure of Invention

In order to solve the above problems in the prior art, the present disclosure provides a packaging assembly for a microwave window, a welding method and a microwave window, and aims to solve the technical problems of simplifying the welding process of a dielectric window piece and improving the high-frequency performance of the microwave window in the prior art.

A first aspect of the present disclosure provides a package assembly for a microwave window, comprising: at least one integrally formed I-shaped dielectric window sheet for ensuring the sealing property inside the microwave source device; and/or at least one integrally formed C-shaped dielectric window piece for increasing the bandwidth of the microwave window; and at least one solder groove is formed at two ends of each I-shaped medium window piece and each C-shaped medium window piece, and the solder grooves are used for placing solder wires so as to weld the medium window pieces and the window frames of the microwave windows.

Further, the horizontal width of each I-shaped medium window sheet is positively correlated with the welding area of the window frame; the horizontal width of each C-shaped medium window sheet is positively correlated with the welding area of the window frame.

Furthermore, the outer surfaces of the two ends of each I-shaped dielectric window sheet and the outer surface of the two ends of each C-shaped dielectric window sheet are metalized layers, and the metalized layers are used for being well welded with the window frame.

Furthermore, the center position of each C-shaped medium window is provided with an exhaust hole, and the exhaust holes are used for guiding out gas between the windows.

Furthermore, each I-shaped medium window sheet and each C-shaped medium window sheet are of symmetrical structures and are coaxially arranged.

Furthermore, at least one C-shaped medium window sheet which is integrally formed is arranged on two sides of the I-shaped medium window sheet respectively.

Furthermore, the thickness of each I-shaped dielectric window sheet and the thickness of each C-shaped dielectric window sheet are in inverse proportion to the microwave working frequency of the microwave window.

Further, the solder wire is a silver-copper alloy solder wire or a gold-copper alloy solder wire.

A second aspect of the present disclosure provides a soldering method for a package assembly for a microwave window provided based on the first aspect of the present disclosure, including: and placing the window frame of the microwave window and the packaging assembly in a brazing furnace for welding, so that the packaging assembly and the window frame of the microwave window are welded through the solder wires.

A third aspect of the present disclosure provides a microwave window comprising: a first aspect of the present disclosure provides a package assembly for a microwave window.

According to the packaging assembly for the microwave window, the welding method and the microwave window, the packaging assembly is formed by adopting an I-shaped or C-shaped medium window sheet structure, the sealing area between the medium window sheet and a window frame is effectively increased, and therefore the sealing performance and the sealing strength of the microwave window and the heat dissipation capacity of the medium window sheet are improved; the solder groove is additionally arranged on the circumferential side surface of the dielectric window sheet, and the solder wire is placed in the solder groove, so that the free running property of the solder on the sealing surface can be ensured, and the improvement of the welding stability and reliability of the dielectric window sheet is facilitated. For the multi-medium window sheet structure, the d1 or d2 of the I-shaped or C-shaped medium window sheet structure can accurately position and ensure the spacing of the medium window sheets, thereby simplifying the welding process of the medium window sheets and improving the high-frequency performance of the microwave window.

Drawings

For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

FIG. 1 schematically illustrates a schematic view of an I-shaped and C-shaped dielectric louver configuration according to an embodiment of the present disclosure;

FIG. 2 schematically illustrates a schematic view of a microwave window of a single dielectric louver structure according to an embodiment of the present disclosure;

FIG. 3 schematically illustrates an enlarged view of portion A of FIG. 2 in accordance with an embodiment of the present disclosure;

FIG. 4 schematically illustrates a schematic view of a packaging assembly of a microwave window of a dual-layer dielectric louver structure according to an embodiment of the present disclosure;

FIG. 5 schematically illustrates a block diagram view of a packaging assembly for a microwave window of a three-layer dielectric louver structure according to an embodiment of the present disclosure;

fig. 6 schematically illustrates a schematic view of a packaging assembly for a microwave window of a multilayer dielectric louver structure according to an embodiment of the present disclosure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.

Embodiments of the present disclosure provide a package assembly for a microwave window, comprising: at least one integrally formed I-shaped dielectric window sheet for ensuring the sealing property inside the microwave source device; and/or at least one integrally formed C-shaped dielectric window piece for increasing the bandwidth of the microwave window; and at least one solder groove is formed at two ends of each I-shaped medium window piece and each C-shaped medium window piece, and the solder grooves are used for placing solder wires so as to weld the medium window pieces and the window frames of the microwave windows.

The embodiment of the disclosure provides a packaging assembly for a microwave window, which utilizes an integrally formed I-shaped medium window sheet and/or C-shaped medium window sheet to effectively improve the sealing area between the medium window sheet and a window frame, thereby improving the sealing performance and the sealing strength of the microwave window and the heat dissipation capacity of the medium window sheet; the solder groove is additionally arranged on the circumferential side surface of the dielectric window sheet, and the solder wire is placed in the solder groove, so that the free running property of the solder on the sealing surface can be ensured, and the improvement of the welding stability and reliability of the dielectric window sheet is facilitated. For the microwave window structure of the multi-medium window sheet, the d1 or d2 of the I-shaped or C-shaped medium window sheet structure can accurately position and ensure the distance between the medium window sheets, thereby simplifying the welding process of the medium window sheets and improving the high-frequency performance of the microwave window.

FIG. 1 schematically illustrates a schematic view of an I-shaped and C-shaped dielectric louver configuration according to an embodiment of the present disclosure.

As shown in fig. 1, fig. 1a is a schematic structural view of an i-shaped dielectric window 10, and it can be seen that the i-shaped dielectric window 10 has a left-right and up-down symmetrical structure; fig. 1b is a schematic structural diagram of the C-shaped dielectric window 20, and it can be seen that the C-shaped dielectric window 20 has an up-down symmetrical structure, and each i-shaped dielectric window and each C-shaped dielectric window are designed as an integrally formed structure, and the preparation materials are metal materials, metal oxide materials, ceramic materials, and the like.

In the embodiment of the disclosure, the outer surfaces of the two ends of each I-shaped dielectric window sheet and each C-shaped dielectric window sheet are metalized layers, and the metalized layers are used for being well welded with the window frame of the microwave window. Specifically, the horizontal width of each i-shaped dielectric window piece 10 is positively correlated with the welding area of the window frame, and the horizontal width of each C-shaped dielectric window piece 20 is also positively correlated with the welding area of the window frame, that is, as the horizontal width of the i-shaped dielectric window piece 10 and the horizontal width of the C-shaped dielectric window piece 20 increase, the welding area of the i-shaped dielectric window piece and the window frame of the microwave window increases. And each I-shaped dielectric window sheet and each C-shaped dielectric window sheet are coaxially arranged in the cylindrical inner cylinder wall of the microwave window.

Specifically, the center position of each C-shaped medium window is provided with an exhaust hole, and the exhaust holes are used for guiding out gas between the windows. In the embodiment of the present disclosure, the shape and the number of the vent holes may be set according to the actual application requirements, which is not limited in the embodiment of the present disclosure.

As shown in fig. 1, at least one solder groove 11 is disposed at the upper and lower ends of each i-shaped dielectric window piece 10 and each C-shaped dielectric window piece 20, and the solder groove 11 may be a circular hole or a square hole for placing solder wire to solder the dielectric window piece to the window frame of the microwave window. The solder groove 11 is additionally arranged on the circumferential side surface of the dielectric window piece, and the solder wire is placed in the solder groove 11, so that the free-running property of the solder on the sealing surface can be ensured, and the stability and the reliability of the welding of the dielectric window piece can be improved. Preferably, the solder wire may be a silver copper alloy solder wire or a gold copper alloy solder wire or other metal alloy solder wire or the like.

In the embodiment of the disclosure, as shown in fig. 1, the widths d1 and d2 of the blank spaces at the two sides of each i-shaped dielectric louver 10 and each C-shaped dielectric louver 20 are reasonably controlled to accurately position and ensure the spacing of the dielectric louvers, so that the welding process of the dielectric louvers can be simplified and the high-frequency performance of the microwave window can be improved.

According to the embodiment of the disclosure, in the microwave window with the multi-layer dielectric louver structure, the microwave window may include an i-shaped dielectric louver 10 and an even-numbered multiple of C-shaped dielectric louvers 20, wherein each C-shaped dielectric louver 20 is respectively disposed on two sides of the i-shaped dielectric louver 10, so that the package assembly is integrally designed in a symmetrical structure to meet practical application requirements.

It should be noted that the i-shaped dielectric window, the C-shaped dielectric window, and the solder grooves in the embodiments of the present disclosure are only exemplary illustrations, and can be adjusted and optimized according to practical applications, for example, a plurality of solder grooves are provided at two ends of the upper and lower covers of each i-shaped dielectric window and each C-shaped dielectric window according to the increase of the size of the dielectric window, so as to ensure a better soldering effect.

Another aspect of the present disclosure is to provide a method for welding a package assembly for a microwave window, in which a structure of the package assembly for the microwave window is as described above, and thus, a detailed description thereof is omitted. The welding method comprises the following steps: and placing the window frame of the microwave window and the packaging assembly in a brazing furnace for welding, so that the packaging assembly and the window frame of the microwave window are welded through the solder wires.

Specifically, the welding of the package assembly to the microwave window frame is accomplished in a high temperature brazing furnace. The brazing furnace is mainly divided into a vacuum furnace and a hydrogen furnace, and the vacuum furnace is mainly used for welding products with high quality and easily-oxidizable materials; the hydrogen furnace has the advantages that the furnace is filled with reducing gas or inert gas for protection, and the heating is relatively uniform.

In the embodiment of the disclosure, the main process parameters of the brazing process are brazing temperature and holding time, and the brazing temperature is usually selected to be about 40 ℃ higher than the liquidus temperature of the brazing filler metal so as to ensure that the brazing filler metal can fill the gap. The brazing heat preservation time is determined according to the size of the workpiece and the interaction intensity of the brazing filler metal and the base metal. The parts with larger size and heat capacity are kept warm for a longer time to ensure uniform heating. The brazing filler metal has strong action with the base metal, and the heat preservation time is short. In general, a certain holding time may be necessary to promote interdiffusion of the braze and the base material to form a strong bond. Specifically, for a silver copper solder wire (AgCu28), the solidus and liquidus of this type of solder are 779 ℃ and 875 ℃, respectively, and for a gold copper solder wire (Au80Cu20), the melting point is 910 ℃.

A further aspect of the present disclosure provides a microwave window including the enclosure assembly for a microwave window as set forth in the above embodiments, wherein the enclosure assembly is soldered to a window frame of the microwave window by solder wires.

The technical solution of the present disclosure will be described in detail below with reference to the structure of the microwave window in the specific embodiment of the present disclosure. It should be understood that the structures of the microwave window and package assembly shown in fig. 2-6 are merely exemplary to assist those skilled in the art to understand the technical solutions of the present disclosure, and are not intended to limit the scope of the present disclosure.

Example 1

Fig. 2 is a schematic structural view of a microwave window having a single-layer dielectric louver structure. The microwave window 30 with the single-medium window sheet structure at least comprises a window frame 31, a water jacket 32, a water nozzle 33, a flange 34 and an I-shaped medium window sheet 10. The I-shaped dielectric window piece 10 is welded with the window frame 31 of the microwave window 30, so that the sealing area between the dielectric window piece and the window frame can be effectively increased, and the sealing strength and the heat dissipation area are improved. As shown in fig. 3, solder wires are placed in the solder grooves 11 on the i-shaped dielectric window 10, so that the fluidity and uniformity of solder can be improved, and the success rate of sealing the window can be improved. In addition, the excessive solder can be prevented from infiltrating the front surface of the window, so that the risk of secondary electron bombardment on the window is reduced.

For the microwave window with single-dielectric-window-plate structure, from the symmetry point of view, the i-shaped dielectric window plate 10 is usually adopted, and the C-shaped dielectric window plate 20 can also be adopted to replace the i-shaped dielectric window plate 10 for welding.

Example 2

Fig. 4 is a schematic diagram of a packaging assembly for a microwave window with a dual-layer dielectric window sheet structure in this embodiment, and the structure of the microwave window in this embodiment is shown in fig. 2. The packaging assembly for a microwave window of a dual dielectric louver structure includes: an i-shaped dielectric louver 10 and a C-shaped dielectric louver 20. The I-shaped dielectric window 10 is used as a main window and is used for guaranteeing good sealing performance of a vacuum environment in the microwave source device; the C-shaped dielectric louver 20 acts as an auxiliary louver to increase the bandwidth of the microwave window. Specifically, the welding material groove is arranged on the side wall of the C-shaped medium window piece 20, and in order to avoid air pockets between the window pieces, the center of the auxiliary window piece is provided with an exhaust hole 21 which is used for guiding out air between the window pieces.

Due to the structural improvement of the I-shaped dielectric window piece 10 and the C-shaped dielectric window piece 20, the structural form of the window pieces has a positioning function, and the welding flux is arranged in the welding flux groove 11, so that the microwave window pieces can be welded at one time. For the double-layer dielectric window structure, the main window may also be a C-shaped dielectric window 20, and the auxiliary window may also be an i-shaped dielectric window 10.

Example 3

Fig. 5 is a schematic diagram of a packaging assembly for a microwave window with a three-layer dielectric window structure in this embodiment, and the structure of the microwave window in this embodiment is shown in fig. 2. The packaging assembly for a microwave window of a three-layer dielectric louver structure includes: an i-shaped dielectric louver 10 and two C-shaped dielectric louvers 20. In consideration of the symmetry of the microwave window structure, the i-shaped dielectric window piece 10 is disposed at the center, and each C-shaped dielectric window piece 20 is disposed on two sides of the i-shaped dielectric window piece 10. To avoid cavitation between the louvers, each C-shaped dielectric louver 20 is provided with a vent 21 in the center to vent gas between the louvers. Because the window piece structure form has a positioning function and the solder is arranged in the solder groove, the microwave window piece with the three-layer medium window piece structure can complete welding at one time, thereby improving the welding efficiency of the window piece and simplifying the welding process.

Example 4

Referring to fig. 6, a schematic diagram of a packaging assembly for a microwave window of a multi-layer dielectric louver structure is shown in this embodiment, where the structure of the microwave window is shown in fig. 2. The packaging assembly for a microwave window of a multilayer dielectric louver structure includes: the microwave window packaging assembly comprises an I-shaped dielectric window sheet 10 and at least 4C-shaped dielectric window sheets 20, wherein in order to ensure the symmetry of the microwave window structure, in the microwave window packaging assembly with the multilayer dielectric window sheet structure, the number of the C-shaped dielectric window sheets 20 is even times of 2, and the C-shaped dielectric window sheets are symmetrically distributed on two sides of the I-shaped dielectric window sheet 10. Because the structural forms of the I-shaped dielectric window piece 10 and the C-shaped dielectric window piece 20 have the accurate positioning function, and the welding flux is arranged in the welding flux groove 11, the installation and the positioning of the dielectric window pieces are not influenced, the microwave window pieces of the multi-layer dielectric window piece structure can be welded at one time, thereby improving the welding efficiency of the window pieces, simplifying the welding process and avoiding the problems of deformation of an output window and leakage of a sealing surface caused by multiple times of welding.

While the present disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive, and fig. 2-6 show schematic structural views of a package assembly according to an embodiment of the present disclosure, in which window sheet structures or designs that may be provided for other shapes are easier in practical use, which embodiment does not constitute a limitation of the package assembly in microwave windows.

Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the disclosure can be made to the extent not expressly recited in the disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.

While the disclosure has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Accordingly, the scope of the present disclosure should not be limited to the above-described embodiments, but should be defined not only by the appended claims, but also by equivalents thereof.