阅读说明：本技术 晶圆作业平台及具有其的点胶机 (Wafer operation platform and have its point gum machine ) 是由 冒洋洋 林翔 周典虬 郜福亮 樊建 曲东升 李长峰 于 2020-07-17 设计创作，主要内容包括：本发明公开了一种晶圆作业平台及具有其的点胶机,晶圆作业平台能够用于点胶机本体对晶圆进行点胶,点胶机本体在点胶位置和保温位置之间可活动,点胶机包括：发热支撑台；加热器,上表面形成为加热面,晶圆位于加热面的上方,在点胶机本体位于点胶位置时,点胶机本体位于晶圆的上方；点胶保温平台,设于发热支撑台的一侧,点胶保温平台具有能够对点胶机本体进行加热的保温面,在点胶机本体位于保温位置时,点胶机本体接近于保温面。根据本发明实施例的晶圆作业平台不仅能够确保胶水的温度达到点胶要求,防止胶水冷却不易流出,还能够使点胶机本体的各个位置温度均匀,提升点胶质量。(The invention discloses a wafer operation platform and a dispenser with the same, wherein the wafer operation platform can be used for dispensing a wafer by a dispenser body, the dispenser body can move between a dispensing position and a heat preservation position, and the dispenser comprises: a heat generating support table; the upper surface of the heater is formed into a heating surface, the wafer is positioned above the heating surface, and the dispenser body is positioned above the wafer when the dispenser body is positioned at the dispensing position; the point is glued and is kept warm platform, locates the one side that generates heat a supporting bench, and point is glued and is kept warm platform and has the heat preservation face that can heat to the point gum machine body, and when the point gum machine body was located heat preservation position, the point gum machine body was close to the heat preservation face. According to the wafer operation platform provided by the embodiment of the invention, the temperature of glue can be ensured to meet the glue dispensing requirement, the glue is prevented from being cooled and not easy to flow out, the temperature of each position of the glue dispenser body can be uniform, and the glue dispensing quality is improved.)

1. The utility model provides a wafer operation platform can be used for the point gum machine body to carry out some glue to the wafer, a serial communication port, the point gum machine body is mobile between some glue positions and heat preservation position, wafer operation platform includes:

a heat generating support table;

the heater is arranged on the heating support platform, a heating surface is formed on the upper surface of the heater, the wafer is positioned above the heating surface, and the dispenser body is positioned above the wafer when the dispenser body is positioned at the dispensing position;

the point is glued and is kept warm platform, point is glued and is kept warm platform and locate one side of brace table generates heat, point is glued and is kept warm platform and has can be right the point gum machine body carries out the heat preservation face that heats the point gum machine body is located during the heat preservation position, the point gum machine body is close the heat preservation face.

2. The wafer work platform of claim 1, wherein the upper surface of the dispensing and heat-preserving platform is formed as a heat-preserving surface, and the dispenser body is located above the heat-preserving surface when the dispenser body is located at the heat-preserving position.

3. The wafer handling platform of claim 2, further comprising:

the waste barrel is positioned on one side of the glue dispenser body to receive glue discharged from the glue dispenser body.

4. The wafer work platform of claim 1, further comprising:

a base plate;

the supporting rod is arranged on the bottom plate, and the heating support platform is arranged on the supporting rod and is spaced from the bottom plate;

the height adjusting assembly is arranged between the heating support platform and the support rod to adjust the horizontal height of the heating support platform.

5. The wafer work platform of claim 4, wherein one of said height adjustment assemblies is disposed between each of said support rods and said heat generating support platform.

6. The wafer work platform of claim 4, wherein said height adjustment assembly comprises:

the adjusting seat is arranged at the upper end of the supporting rod;

the adjusting rod is arranged below the heating supporting platform, and the adjusting rod is movably connected with the adjusting seat to adjust the distance between the heating supporting platform and the supporting rod.

7. The wafer handling platform of claim 6, further comprising:

and the height measuring sensor is arranged above the heating support platform to detect whether the heights of all parts of the heating support platform are consistent or not.

8. The wafer work platform of claim 1, further comprising:

the ejector pins are movably arranged on the base of the wafer heating device between a first position and a second position along the axial direction of the ejector pins, when the ejector pins are located at the first position, the upper ends of the ejector pins protrude out of the wafer heating device to receive wafers, and when the ejector pins are located at the second position, the upper ends of the ejector pins do not exceed the wafer heating device;

the thimble driving piece is arranged on the base and is connected with the thimble, and the thimble driving piece drives the thimble to move.

9. A dispenser comprising the wafer handling platform of any of claims 1-8.

Technical Field

The invention belongs to the technical field of dispensing machines, and particularly relates to a wafer operation platform and a dispensing machine with the same.

Background

With the rapid development of economic technology, the demand of the market for semiconductors is increasing, wafers are the basic material for manufacturing semiconductor chips, the dispensing technology of wafers is the most important key technology in the advanced electronic manufacturing industry, and the dispensing technology is widely applied to chip packaging and integrated circuit equipment, and aims to reduce the failure probability of elements caused by cold and heat changes, dropping, vibration and other factors in the use process of products, so as to prolong the service life of the products. Therefore, the dispensing technology is used as the key and core of the electronic packaging technology, and the improvement of the technical level thereof is directly related to the function of a good and bad dispensing machine of the packaging technology as a novel automatic device, mainly completing the function of dripping the glue to the corresponding position through a preset path in a specific mode.

In the prior art, no glue dispensing heat preservation platform is arranged in the glue dispensing area, so that the glue in the glue dispensing machine body cannot be preserved heat, the glue dispensing machine body can keep the optimal glue dispensing temperature, and the glue dispensing effect is influenced. Secondly, the heating mechanism on the operation platform is in direct contact heating with the wafer, the temperature of the heating mechanism is too high, the wafer is heated suddenly and is easy to damage, the temperature of the wafer cannot be raised gradually, the temperature of each position of the wafer is not uniform, the glue dispensing quality is poor, and the product yield is low.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art.

Therefore, the invention provides a wafer operation platform which has the advantages of high flexibility, uniform temperature, high dispensing quality, simple arrangement and the like.

The invention also provides a glue dispenser with the wafer operation platform, and the glue dispenser has the advantages of high quality of wafer production products, high automation degree, high yield and the like.

According to the first aspect of the present invention, a wafer operation platform can be used for dispensing a wafer by a dispenser body, the dispenser body is movable between a dispensing position and a heat-preserving position, and the wafer operation platform includes: a heat generating support table; the heater is arranged on the heating support platform, a heating surface is formed on the upper surface of the heater, the wafer is positioned above the heating surface, and the dispenser body is positioned above the wafer when the dispenser body is positioned at the dispensing position; the point is glued and is kept warm platform, point is glued and is kept warm platform and locate one side of brace table generates heat, point is glued and is kept warm platform and has can be right the point gum machine body carries out the heat preservation face that heats the point gum machine body is located during the heat preservation position, the point gum machine body is close the heat preservation face.

According to the wafer operation platform provided by the embodiment of the invention, the heating support platform, the heater and the glue dispensing and heat insulating platform are matched to dispense glue to the wafer. The heater can heat the wafer to ensure that the temperature of the wafer reaches the dispensing requirement. The glue dispenser body can move between a glue dispensing position and a heating position, and when glue dispensing is needed, the glue dispenser body is located at the glue dispensing position, namely above the wafer; when dispensing is finished, the dispenser body can move to a heating position, namely above the dispensing heat-preservation platform. The glue dispensing heat preservation platform can heat or preserve heat to glue, not only ensures that the temperature of the glue meets the requirement, can perform glue dispensing at the optimal temperature, but also can prevent the glue from cooling and being difficult to flow out to block a glue dispensing head. The heat that heat preservation platform was given off is glued to the point, can also make each position temperature in the district of gluing even, and it is effectual to glue. The wafer operation platform has the advantages of high flexibility, uniform temperature, high dispensing quality, simple arrangement and the like.

According to one embodiment of the invention, the upper surface of the dispensing heat-preservation platform is formed into a heat-preservation surface, and when the dispenser body is located at the heat-preservation position, the dispenser body is located above the heat-preservation surface.

According to an embodiment of the present invention, the wafer operation platform further comprises: the waste barrel is positioned on one side of the glue dispenser body to receive glue discharged from the glue dispenser body.

According to an embodiment of the present invention, the wafer operation platform further comprises: a base plate; the supporting rod is arranged on the bottom plate, and the heating support platform is arranged on the supporting rod and is spaced from the bottom plate; the height adjusting assembly is arranged between the heating support platform and the support rod to adjust the horizontal height of the heating support platform.

According to an embodiment of the present invention, one height adjustment assembly is disposed between each support rod and the heat-generating support platform.

According to one embodiment of the invention, the height adjustment assembly comprises: the adjusting seat is arranged at the upper end of the supporting rod; the adjusting rod is arranged below the heating supporting platform, and the adjusting rod is movably connected with the adjusting seat to adjust the distance between the heating supporting platform and the supporting rod.

According to an embodiment of the present invention, the wafer operation platform further comprises: and the height measuring sensor is arranged above the heating support platform to detect whether the heights of all parts of the heating support platform are consistent or not.

According to an embodiment of the present invention, the wafer operation platform further comprises: the ejector pins are movably arranged on the base of the wafer heating device between a first position and a second position along the axial direction of the ejector pins, when the ejector pins are located at the first position, the upper ends of the ejector pins protrude out of the wafer heating device to receive wafers, and when the ejector pins are located at the second position, the upper ends of the ejector pins do not exceed the wafer heating device; the thimble driving piece is arranged on the base and is connected with the thimble, and the thimble driving piece drives the thimble to move.

The dispenser according to the second aspect of the present invention comprises the wafer operation platform according to any one of the above embodiments.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of an assembly of a wafer handling platform and a dispenser body according to an embodiment of the invention;

FIG. 2 is a schematic perspective view of a wafer handling platform according to an embodiment of the present invention;

FIG. 3 is a front view of a wafer handling platform according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a dispenser body according to an embodiment of the present invention.

Reference numerals:

a wafer heating device 210;

a bottom plate 230;

a support bar 240; a height adjustment assembly 241; an adjustment seat 242; an adjustment lever 243; an altimeter sensor 245;

a heat generating support table 250;

a heater 260;

a thimble 272; a thimble driving member 274;

a dispenser body 400;

a wafer handling platform 410;

and a dispensing and heat-preserving platform 420.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The wafer work platform 410 according to embodiments of the present invention is described in detail below with reference to the drawings.

As shown in fig. 1-4, according to the wafer work platform 410 of the embodiment of the invention, the wafer work platform 410 includes a heat-generating support platform 250, a heater 260, and a glue-dispensing thermal platform 420.

Specifically, the wafer operation platform 410 according to the embodiment of the present invention can be used for dispensing the wafer by the dispenser body, and the dispenser body can move between the dispensing position and the heat preservation position. The heater 260 is arranged on the heating support table 250, the upper surface of the heater 260 forms a heating surface, the wafer is positioned above the heating surface, and when the dispenser body is positioned at the dispensing position, the dispenser body is positioned above the wafer; the glue dispensing heat preservation platform 420 is arranged on one side of the heating support table 250, a part of the glue dispensing heat preservation platform 420 is formed into a heat preservation surface capable of heating the glue dispenser body, and when the glue dispenser body is located at a heat preservation position, the glue dispenser body is located on one side of the heat preservation surface.

In other words, the wafer stage 410 according to the embodiment of the present invention is mainly composed of the heat-generating support table 250, the heater 260, and the adhesive dispensing thermal platform 420. The heater 260 is disposed between the heat-generating support table 250 and the wafer, the heat-generating support table 250 supports the heater 260, the wafer is disposed above the heater 260, and the upper surface of the heater 260 forms a heating surface for heating the wafer. The glue dispenser body can move between a glue dispensing position and a heat preservation position. When the dispensing machine body is located the dispensing position, the dispensing machine body is located the top of wafer, and one side of brace table 250 that generates heat is located to dispensing heat preservation platform 420, and some formation of dispensing heat preservation platform 420 are the heat preservation face that can heat the dispensing machine body, and when the dispensing machine body is located the heat preservation position, the dispensing machine body is located one side of heat preservation face.

That is, the wafer is first heated by the heater 260, and after the wafer reaches the preset temperature, the wafer is adsorbed on the heating surface of the heater 260, and the thermocouple is further disposed inside the wafer heating apparatus 210, and when the thermocouple detects that the temperature of the heating surface is at the preset temperature, the heating of the wafer is stopped, otherwise, when the thermocouple detects that the temperature of the heating surface is lower than the preset temperature, the wafer is heated again. The wafer is glued through the glue dispenser body, and the heating platform can be guaranteed to be in a constant temperature state all the time in the glue dispensing process. Subsequently, after dispensing, the dispenser body can move from above the heater 260 to the position of the dispensing thermal platform 420. The glue dispenser body is located the top of some glue heat preservation platform 420, can heat or keep warm the glue in the glue dispenser body through some glue heat preservation platform 420.

Therefore, according to the wafer operation platform 410 of the embodiment of the present invention, the heating support platform 250, the heater 260 and the dispensing heat preservation platform 420 are used in cooperation to dispense the wafer, the wafer can be heated by the heater 260, and the temperature of the wafer is ensured to meet the dispensing requirement. The glue dispenser body can move between a glue dispensing position and a heating position, and when glue dispensing is needed, the glue dispenser body is located at the glue dispensing position, namely above the wafer; after dispensing, the dispenser body can be moved to a heating position, i.e., above the dispensing heat-preservation platform 420. The glue dispensing heat preservation platform 420 can heat or preserve heat of glue in the glue dispenser body, so that the temperature of the glue can meet requirements, glue can be dispensed at the optimal temperature, and the glue can be prevented from being cooled and not easy to flow out to block a glue dispensing head. The heat that heat preservation platform 420 gived off is glued to the point, can also make each position temperature in the district of gluing of point even, and it is effectual to glue. The wafer operation platform 410 has the advantages of high flexibility, uniform temperature, high dispensing quality, simple arrangement and the like.

According to an embodiment of the present invention, the upper surface of the dispensing insulation platform 420 forms an insulation surface, and when the dispenser body is located at the insulation position, the dispenser body is located above the insulation surface. The point is glued heat preservation platform 420 and can be given off the heat, forms the face that keeps warm, not only can heat and keep warm to the point gum machine body, has ensured that the temperature of glue reaches the requirement, can glue under the optimum temperature to can prevent that the glue cooling is difficult for flowing out, block up the dispensing head, can also make each position temperature in the dispensing district even, promote the effect of gluing.

Further, the wafer operation platform 410 further includes a waste bin located at one side of the dispenser body to receive the glue discharged from the dispenser body. The dispensing head has partly glue that solidifies, can discharge it to the waste material bucket in, not only can retrieve the waste material, can also avoid waste material pollution equipment.

According to an embodiment of the present invention, the wafer stage 410 further includes a bottom plate 230, a support rod 240 and a height adjustment assembly 241, wherein the support rod 240 is disposed on the bottom plate 230, the heating support platform 250 is disposed on the support rod 240 and spaced apart from the bottom plate 230, and the height adjustment assembly 241 is disposed between the heating support platform 250 and the support rod 240 to adjust the height of the heating support platform 250. The support rod 240 is disposed between the base plate 230 and the heat generating support table 250, and the heat generating support table 250 can be supported by the support rod 240. The heater 260 may be located above the heat-generating supporting platform 250, and the height adjustment assembly 241 may be disposed between the heat-generating supporting platform 250 and the supporting rod 240 to adjust a distance between the heat-generating supporting platform 250 and the bottom plate 230, so that the heat-generating supporting platform 250 maintains a horizontal state, thereby ensuring that distances between each portion of the wafer and the heating surface are the same, and ensuring uniformity of heating of the wafer. The height of the heater 260 from the bottom plate 230 is adjustable, the heater 260 can be prevented from being in direct contact with the bottom plate 230, production safety is improved, and the heating device has the advantages of being simple in arrangement, easy to implement and the like.

Preferably, a height adjusting assembly 241 is disposed between each supporting rod 240 and the heat generating support platform 250. Each supporting rod 240 and the heating support platform 250 are arranged with a height adjusting component 241 therebetween, and the distance between each supporting rod 240 and the heating support platform 250 can be rapidly changed by adjusting the height adjusting component 241, so that the heating support platform 250 can be kept horizontal. By providing a plurality of height adjusting members 241, the adjustment efficiency can be improved.

Further, the height adjustment assembly 241 includes an adjustment seat 242 and an adjustment rod 243, the adjustment seat 242 is disposed at the upper end of the support rod 240, the adjustment rod 243 is disposed below the heat-generating support platform 250, and the adjustment rod 243 is movably connected to the adjustment seat 242 to adjust the distance between the heat-generating support platform 250 and the support rod 240. By adopting the structure of matching the adjusting seat 242 and the adjusting rod 243, the height between the heating support platform 250 and the supporting rod 240 can be adjusted, so that the heating support platform 250 is in a horizontal state, and further, the distances between each part of the heating surface of the heater 260 and the wafer are ensured to be the same.

Optionally, the wafer stage 410 further includes an elevation sensor 245, and the elevation sensor 245 is disposed above the heat-generating support table 250 to detect whether heights of various portions of the heat-generating support table 250 are consistent. Specifically, the height measurement sensor can be arranged on the dispenser body, when the heights of all parts of the heating support table 250 are inconsistent, the height measurement sensor 245 can detect and send a signal, so that the height of all parts of the heating support table 250 is consistent by the height adjustable assembly 241, the adjustment accuracy is further improved, and whether the distance from each support rod 240 to the heating support table 250 is consistent or not is easily monitored, and the dispenser is more agile compared with manual monitoring.

In some embodiments of the present invention, the wafer stage 410 further includes a plurality of pins 272 and a pin 272 driving member, the plurality of pins 272 are movably disposed on the base of the wafer heating apparatus 210 between a first position and a second position along the axial direction of the pins 272, when the pins 272 are located at the first position, the upper ends of the pins 272 protrude from the wafer heating apparatus 210 to receive the wafer, and when the pins 272 are located at the second position, the upper ends of the pins 272 do not protrude from the wafer heating apparatus 210; the thimble 272 driving member is disposed on the base and connected to the thimble 272, and the thimble 272 driving member drives the thimble 272 to move. Specifically, the driving member of the thimble 272 is disposed on the base and connected to the thimble 272, the driving member of the thimble 272 can be a motor, and can drive the thimble 272 to move between a first position and a second position, when the thimble 272 is located at the first position, the upper end of the thimble 272 can extend out of the upper surface of the wafer heating apparatus 210 and can receive the wafer, and at this time, the wafer does not contact with the heating surface of the wafer heating apparatus 210. When the top pin 272 is at the second position, the top end of the top pin 272 does not extend beyond the wafer heating apparatus 210, and the wafer is in contact with the heating surface. When the thimble 272 is located at the second position, the upper end of the thimble 272 may be located below the heating surface.

That is, the wafer can move between the first position and the second position along with the thimble 272, so that the distance between the wafer and the heating surface changes, when the wafer is close to the heating surface, the temperature rising speed of the wafer is fast, and when the wafer is far from the heating surface, the temperature rising speed of the wafer is slow. When the thimble 272 driving piece drives the thimble 272 to move from the first position to the second position, the wafer can stop at any position between the first position and the second position and be heated, the heating position can be selected according to the temperature requirement, and when the wafer gradually approaches the heating surface, the temperature of the wafer will gradually rise, thereby realizing uniform and stable heating.

In summary, according to the wafer operation platform 410 of the embodiment of the present invention, the heat-generating support platform 250, the heater 260, the dispensing heat-preserving platform 420, the height adjusting element 241, and the ejector pin 272 are used in cooperation, so that the temperature of the wafer can be gradually increased, the temperature of each portion of the wafer is uniform, the dispensing effect is improved, and the dispensing quality is ensured.

The dispenser according to the embodiment of the present invention includes the wafer operation platform 410 according to any one of the above embodiments, and since the wafer operation platform 410 according to the embodiment of the present invention has the above technical effects, the dispenser according to the embodiment of the present invention also has corresponding technical effects, that is, not only can the temperature of the wafer be gradually raised, but also the temperature of each part of the wafer is uniform, so that the dispensing effect can be effectively improved, and the dispensing quality can be ensured.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.