阅读说明：本技术 柔性电路板、其制作方法及相关装置 (Flexible circuit board, manufacturing method thereof and related device ) 是由 文慧 刘练彬 梁恒镇 陆旭 刘照仑 于 2020-06-05 设计创作，主要内容包括：本公开实施例公开了柔性电路板、其制作方法及相关装置,柔性电路板包括：基底层,第一导电层,第二导电层,第一覆盖膜,位于第一导电层背离基底层的一侧,第一覆盖膜中与第一导电部交叠的部分具有多个第一镂空部；第二覆盖膜,位于第二导电层背离基底层的一侧,第二覆盖膜中与第二导电部交叠的部分具有多个第二镂空部；每一第一镂空部在基底层上的正投影至少与一个第二镂空部在基底层上的正投影具有交叠区域；第一电磁屏蔽层,位于第一覆盖膜背离基底层一侧,第一电磁屏蔽层通过第一镂空部与第一导电部耦接；第二电磁屏蔽层,位于第二覆盖膜背离基底层一侧,第二电磁屏蔽层通过第二镂空部与第二导电部耦接。(The embodiment of the disclosure discloses a flexible circuit board, a manufacturing method thereof and a related device, wherein the flexible circuit board comprises: the first conductive layer is positioned on one side of the first conductive layer, which is far away from the substrate layer, and the part, overlapped with the first conductive part, of the first covering film is provided with a plurality of first hollow parts; the second covering film is positioned on one side, away from the base layer, of the second conducting layer, and a plurality of second hollow parts are arranged in the part, overlapped with the second conducting part, of the second covering film; the orthographic projection of each first hollow part on the substrate layer at least has an overlapping area with the orthographic projection of one second hollow part on the substrate layer; the first electromagnetic shielding layer is positioned on one side, away from the base layer, of the first covering film and is coupled with the first conductive part through the first hollow part; and the second electromagnetic shielding layer is positioned on one side of the second covering film, which is far away from the base layer, and is coupled with the second conductive part through the second hollow part.)

1. A flexible circuit board, comprising:

a base layer;

the first conducting layer is positioned on the first surface of the substrate layer and comprises a plurality of first wires and a first conducting part which is mutually insulated with the first wires, and the first conducting part is grounded;

the second conducting layer is positioned on a second surface opposite to the first surface in the substrate layer and comprises a plurality of second wires and a second conducting part mutually insulated from the second wires, and the second conducting part is grounded;

the first covering film is positioned on one side, away from the base layer, of the first conducting layer, and a part, overlapped with the first conducting part, of the first covering film is provided with a plurality of first hollow parts;

the second covering film is positioned on one side, away from the base layer, of the second conducting layer, and a part, overlapped with the second conducting part, of the second covering film is provided with a plurality of second hollow parts;

the orthographic projection of each first hollow part on the substrate layer at least has an overlapping area with the orthographic projection of one second hollow part on the substrate layer;

a first electromagnetic shielding layer located on a side of the first cover film away from the base layer, the first electromagnetic shielding layer being coupled to the first conductive portion through the first hollowed-out portion;

the second electromagnetic shielding layer is positioned on one side, away from the base layer, of the second cover film and is coupled with the second conductive part through the second hollow part.

2. The flexible circuit board of claim 1, wherein an orthographic projection of at least one second hollowed-out portion on the substrate layer has an overlapping area with an orthographic projection of two adjacent first hollowed-out portions on the substrate layer.

3. The flexible circuit board of claim 1, wherein an orthographic projection of each first hollowed-out portion on the substrate layer has an overlapping area with an orthographic projection of only one second hollowed-out portion on the substrate layer.

4. The flexible circuit board of claim 3, wherein the first hollowed-out portion corresponds to the second hollowed-out portion one to one.

5. The flexible circuit board of claim 4, wherein an orthographic projection of the first hollowed-out portion on the base layer and an orthographic projection of the second hollowed-out portion on the base layer completely overlap.

6. The flexible circuit board of claim 4, wherein an orthographic projection of the first hollowed-out portion on the base layer and an orthographic projection of the second hollowed-out portion on the base layer only partially overlap.

7. The flexible circuit board of claim 4, wherein the first and second hollowed-out portions are the same size.

8. The flexible circuit board of claim 1, wherein the area of the overlap region occupies 50% to 90% of an orthographic area of the second cutout on the substrate layer.

9. The flexible circuit board of claim 1, wherein the first conductive portion surrounds all of the first traces and the second conductive portion surrounds all of the second traces.

10. The flexible circuit board of claim 9, wherein an orthographic projection of the first conductive portion on the base layer and an orthographic projection of the second conductive portion on the base layer coincide.

11. The flexible circuit board of claim 1, wherein the first and second conductive layers each include a first bonding area and a second bonding area, the first bonding area having a plurality of first pads, the second bonding area having a plurality of second pads, two ends of the first trace being electrically connected to corresponding first and second pads of the first conductive layer, respectively, and two ends of the second trace being electrically connected to corresponding first and second pads of the second conductive layer, respectively; wherein the content of the first and second substances,

the first hollow parts are arranged along the extending direction of the first routing wire, and the second hollow parts are arranged along the extending direction of the second routing wire.

12. The flexible circuit board of claim 11, wherein the first hollow portion has a rectangular structure, and a width along an extending direction of the first trace is greater than a width perpendicular to the extending direction of the first trace.

13. The flexible circuit board of claim 11, wherein the first and second vias having an overlapping area in orthographic projection on the substrate layer are arranged along the extending direction of the first trace.

14. An array substrate comprising the flexible circuit board of any one of claims 1 to 13.

15. A display device comprising the array substrate of claim 14.

16. A manufacturing method of a flexible circuit board comprises the following steps:

forming a first conductive layer on a first surface of the base layer; the first conducting layer comprises a plurality of first wires and a first conducting part mutually insulated from the first wires, and the first conducting part is grounded;

forming a second conductive layer in a second surface of the base layer opposite the first surface; the second conducting layer comprises a plurality of second wires and a second conducting part mutually insulated from the second wires, and the second conducting part is grounded;

forming a first covering film on one side, away from the base layer, of the first conductive layer; the part of the first covering film, which is overlapped with the first conductive part, is provided with a plurality of first hollow parts;

forming a second covering film on one side, away from the base layer, of the second conductive layer; the part of the second covering film, which is overlapped with the second conductive part, is provided with a plurality of second hollow parts; wherein the orthographic projection of each first hollow part on the substrate layer at least has an overlapping area with the orthographic projection of one second hollow part on the substrate layer;

forming a first electromagnetic shielding layer on one side, away from the base layer, of the first covering film; the first electromagnetic shielding layer is coupled with the first conductive part through the first hollow part;

forming a second electromagnetic shielding layer on one side, away from the base layer, of the second covering film; the second electromagnetic shielding layer is coupled with the second conductive part through the second hollow part.

Technical Field

The present disclosure relates to the field of circuit board technologies, and in particular, to a flexible circuit board, a method for manufacturing the same, and a related device.

Background

A Flexible Printed Circuit (FPC) is a Flexible Printed Circuit board that is made of polyimide or polyester film as a base material, has high reliability and excellent flexibility, has the advantages of high wiring density, light weight, thin thickness and good bending property, and is mainly used in many products such as mobile phones, notebook computers, PADs, digital cameras, LCMs, and the like.

Disclosure of Invention

The flexible circuit board that this disclosed embodiment provided includes:

a base layer;

the first conducting layer is positioned on the first surface of the substrate layer and comprises a plurality of first wires and a first conducting part which is mutually insulated with the first wires, and the first conducting part is grounded;

the second conducting layer is positioned on a second surface opposite to the first surface in the substrate layer and comprises a plurality of second wires and a second conducting part mutually insulated from the second wires, and the second conducting part is grounded;

the first covering film is positioned on one side, away from the base layer, of the first conducting layer, and a part, overlapped with the first conducting part, of the first covering film is provided with a plurality of first hollow parts;

the second covering film is positioned on one side, away from the base layer, of the second conducting layer, and a part, overlapped with the second conducting part, of the second covering film is provided with a plurality of second hollow parts;

the orthographic projection of each first hollow part on the substrate layer at least has an overlapping area with the orthographic projection of one second hollow part on the substrate layer;

a first electromagnetic shielding layer located on a side of the first cover film away from the base layer, the first electromagnetic shielding layer being coupled to the first conductive portion through the first hollowed-out portion;

the second electromagnetic shielding layer is positioned on one side, away from the base layer, of the second cover film and is coupled with the second conductive part through the second hollow part.

Optionally, in the flexible circuit board provided by the embodiment of the disclosure, an orthogonal projection of at least one second hollow portion on the substrate layer has an overlapping region with an orthogonal projection of two adjacent first hollow portions on the substrate layer.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, an orthogonal projection of each first hollow portion on the substrate layer has an overlapping area with an orthogonal projection of only one second hollow portion on the substrate layer.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, the first hollow portions correspond to the second hollow portions one to one.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, an orthographic projection of the first hollow portion on the substrate layer and an orthographic projection of the second hollow portion on the substrate layer completely overlap.

Optionally, in the flexible circuit board provided by the embodiment of the present disclosure, an orthographic projection of the first hollow portion on the substrate layer and an orthographic projection of the second hollow portion on the substrate layer only partially overlap.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, the first hollowed-out portion and the second hollowed-out portion have the same size.

Optionally, in the flexible circuit board provided by the embodiment of the disclosure, an area of the overlapping region accounts for 50% to 90% of an area of an orthographic projection of the second hollow portion on the substrate layer.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, the first conductive portion surrounds all of the first traces, and the second conductive portion surrounds all of the second traces.

Optionally, in the flexible circuit board provided in this disclosure, an orthogonal projection of the first conductive portion on the base layer and an orthogonal projection of the second conductive portion on the base layer coincide.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, the first conductive layer and the second conductive layer each include a first bonding region and a second bonding region, the first bonding region has a plurality of first pads, the second bonding region has a plurality of second pads, two ends of the first trace are electrically connected to corresponding first pads and second pads in the first conductive layer, and two ends of the second trace are electrically connected to corresponding first pads and second pads in the second conductive layer, respectively; wherein the content of the first and second substances,

the first hollow parts are arranged along the extending direction of the first routing wire, and the second hollow parts are arranged along the extending direction of the second routing wire.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, the first hollow portion has a rectangular structure, and a width in an extending direction of the first trace is greater than a width in an extending direction perpendicular to the first trace.

Optionally, in the flexible circuit board provided in the embodiment of the present disclosure, the first hollowed-out portion and the second hollowed-out portion, which have overlapping areas in orthographic projection on the substrate layer, are arranged along the extending direction of the first trace.

Based on the same inventive concept, the embodiment of the present disclosure further provides an array substrate, including the flexible circuit board.

Based on the same inventive concept, the embodiment of the present disclosure further provides a display device, including the array substrate.

Based on the same inventive concept, the embodiment of the present disclosure further provides a method for manufacturing a flexible circuit board, including:

forming a first conductive layer on a first surface of the base layer; the first conducting layer comprises a plurality of first wires and a first conducting part mutually insulated from the first wires, and the first conducting part is grounded;

forming a second conductive layer in a second surface of the base layer opposite the first surface; the second conducting layer comprises a plurality of second wires and a second conducting part mutually insulated from the second wires, and the second conducting part is grounded;

forming a first covering film on one side, away from the base layer, of the first conductive layer; the part of the first covering film, which is overlapped with the first conductive part, is provided with a plurality of first hollow parts;

forming a second covering film on one side, away from the base layer, of the second conductive layer; the part of the second covering film, which is overlapped with the second conductive part, is provided with a plurality of second hollow parts; wherein the orthographic projection of each first hollow part on the substrate layer at least has an overlapping area with the orthographic projection of one second hollow part on the substrate layer;

forming a first electromagnetic shielding layer on one side, away from the base layer, of the first covering film; the first electromagnetic shielding layer is coupled with the first conductive part through the first hollow part;

forming a second electromagnetic shielding layer on one side, away from the base layer, of the second covering film; the second electromagnetic shielding layer is coupled with the second conductive part through the second hollow part.

Drawings

Fig. 1A and 1B are schematic top-view structural diagrams of a top surface and a bottom surface of a flexible circuit board provided in an embodiment of the present disclosure, respectively;

FIG. 2 is a schematic cross-sectional view along AA' of FIGS. 1A and 1B;

fig. 3 is a schematic diagram of another top-view structure of a flexible circuit board according to an embodiment of the present disclosure;

FIG. 4 is a schematic cross-sectional view along AA' of FIG. 3;

fig. 5 is a schematic diagram of another top-view structure of a flexible circuit board according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view along AA' of FIG. 5;

fig. 7 is a schematic diagram of another top-view structure of a flexible circuit board according to an embodiment of the present disclosure;

FIG. 8 is a schematic cross-sectional view along AA' of FIG. 7;

fig. 9 is a flowchart of a method for manufacturing a flexible circuit board according to an embodiment of the present disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. And the embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "inner", "outer", "upper", "lower", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

It should be noted that the sizes and shapes of the various figures in the drawings are not to scale, but are merely intended to illustrate the present disclosure. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

Fig. 1A, fig. 1B, fig. 2, fig. 3, fig. 4, fig. 5, and fig. 6 show a flexible circuit board, where fig. 1A, fig. 1B, fig. 3, and fig. 5 are schematic top view structure diagrams of the flexible circuit board, fig. 1A and fig. 1B are schematic top view structure diagrams of two opposite surfaces of the flexible circuit board, fig. 2 is a schematic overall cross-sectional structure diagram of the flexible circuit board along an AA ' direction in fig. 1A and fig. 1B, fig. 4 is a schematic cross-sectional structure diagram along an AA ' direction in fig. 3, and fig. 6 is a schematic cross-sectional structure diagram along an AA ' direction in fig. 5, where the flexible circuit board specifically may include: a base layer 1; the first conductive layer 2 is positioned on the first surface of the substrate layer 1, the first conductive layer 2 comprises a plurality of first wires 21 and a first conductive part 22 mutually insulated from the first wires 21, and the first conductive part 22 is grounded; the second conductive layer 3 is positioned on a second surface opposite to the first surface in the substrate layer 1, the second conductive layer 3 comprises a plurality of second wires 31 and a second conductive part 32 mutually insulated from the second wires 31, and the second conductive part 32 is grounded; a first cover film 4 positioned on one side of the first conductive layer 2 away from the substrate layer 1, wherein a part of the first cover film 4 overlapped with the first conductive part 22 is provided with a plurality of first hollow parts 41; a second cover film 5 located on a side of the second conductive layer 3 away from the substrate layer 1, wherein a part of the second cover film 5 overlapped with the second conductive part 32 has a plurality of second hollow parts 51; the orthographic projection of each first hollow-out part 41 on the substrate layer 1 at least has an overlapping area with the orthographic projection of one second hollow-out part 51 on the substrate layer 1; a first electromagnetic shielding layer 6 located on a side of the first cover film 4 away from the base layer 1, the first electromagnetic shielding layer 6 being coupled to the first conductive part 22 through a first hollow part 41; and a second electromagnetic shielding layer 7 located on a side of the second cover film 5 away from the base layer 1, wherein the second electromagnetic shielding layer 7 is coupled with the second conductive part 32 through a second hollow part 51.

In the flexible circuit board provided by the embodiment of the present disclosure, the plurality of first hollow portions 41 are disposed in the first cover film 4 at the portion overlapping the first conductive portion 22, and the plurality of second hollow portions 51 are disposed in the second cover film 5 at the portion overlapping the second conductive portion 32, and the orthographic projection of each first hollow portion 41 on the base layer 1 has an overlapping area with the orthographic projection of at least one second hollow portion 51 on the base layer 1, so that when the first cover film 4 and the second cover film 5 are regularly windowed (making the hollow portions), and the corresponding first electromagnetic shielding layer 6 and the corresponding second electromagnetic shielding layer 7 are disposed on the two sides of the first cover film 4 and the second cover film 5, the electromagnetic shielding layers are electrically connected to the grounded conductive portions through the corresponding hollow portions, and the electromagnetic shielding layers are also grounded, and tests show that the technical solution of the present disclosure can improve the interference resistance to external electromagnetic interference, the flexible circuit board provided by the disclosure can normally work under a more severe electromagnetic environment, so that the working reliability of a device connected with the flexible circuit board can be improved.

It should be noted that fig. 1A and fig. 1B are schematic top view structures of a complete flexible circuit board, and the first hollow portion 41 in fig. 1A and the second hollow portion 51 in fig. 1B are completely overlapped; fig. 3 and 5 are schematic partial top view structure diagrams of two opposite surfaces of the flexible circuit board, respectively, and the first hollow parts 41 and the second hollow parts 51 in fig. 3 are in one-to-one correspondence and only partially overlapped, and one second hollow part 51 and two first hollow parts 41 in fig. 5 are in correspondence and only partially overlapped.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, the first conductive layer and the second conductive layer are generally made of copper foils, the copper foils are etched to form routing areas according to the arrangement of the routing lines, and the copper foils that are not etched are insulated from the routing lines and grounded.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, since the first conductive layer and the second conductive layer are made of copper foils, the first cover film and the second cover film function to protect the copper foils from being exposed to air, prevent the copper foils from being oxidized, cover areas that do not need gold plating for subsequent surface treatment, such as covering areas with the cover films, and perform a solder mask function in subsequent surface mounting technology.

It should be noted that the first cover film is formed by covering the entire surface of the first conductive layer on the side away from the base layer, the second cover film is formed by covering the entire surface of the second conductive layer on the side away from the base layer, a plurality of first hollow portions are arranged in the area of the first cover film corresponding to the first conductive portion, and a plurality of second hollow portions are arranged in the area of the second cover film corresponding to the second conductive portion.

In practice, in the above flexible circuit board provided in the embodiments of the present disclosure, the base layer may be a flexible resin layer, such as a plastic substrate of polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like, which has excellent heat resistance and durability.

In the specific implementation, the materials of the first cover film and the second cover film are generally made of polyimide.

It should be noted that the first electromagnetic shielding layer and the second electromagnetic shielding layer are used to prevent signals transmitted in the signal line from radiating noise to the outside and shield interference of the outside on the transmitted signals, so as to improve the anti-interference capability.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 2, 4 and 6, an orthogonal projection of each first hollow-out portion 41 on the substrate layer 1 has an overlapping region with an orthogonal projection of only one second hollow-out portion 51 on the substrate layer 1. When the structures of fig. 2, fig. 4 and fig. 6 are adopted, actual verification tests show that the design mode of the flexible circuit board provided by the present disclosure can improve the anti-interference capability to external electromagnetic interference, and the anti-interference test result has 2-3DB benefits.

Fig. 2, 4 and 6 show that the orthographic projection of each first hollow-out part 41 on the substrate layer 1 has an overlapping area with the orthographic projection of only one second hollow-out part 51 on the substrate layer 1. Certainly, in a specific implementation, an orthogonal projection of each first hollow portion 41 on the substrate layer 1 may also have an overlapping region with an orthogonal projection of two second hollow portions 51 on the substrate layer 1, as shown in fig. 7 and 8, fig. 7 is a schematic top view structure diagram of the flexible circuit board, and fig. 8 is a schematic cross-sectional diagram along an AA' direction in fig. 7, and tests show that the structures in fig. 7 and 8 have better interference resistance to external electromagnetic interference.

In specific implementation, in the flexible circuit board provided by the embodiment of the present disclosure, as shown in fig. 5 and fig. 6, an orthogonal projection of at least one second hollow-out portion 51 on the substrate layer 1 has an overlapping region with an orthogonal projection of two adjacent first hollow-out portions 41 on the substrate layer 1. Tests show that the structure of FIG. 6 has good anti-interference capability to external electromagnetic interference.

In specific implementation, in order to improve the anti-interference capability of the first electromagnetic shielding layer and the second electromagnetic shielding layer, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 2 and fig. 4, the first hollowed portions 41 correspond to the second hollowed portions 51 one to one, so that the first electromagnetic shielding layer 6 is coupled to the grounded first conductive portion 22 through each first hollowed portion 41, and the second electromagnetic shielding layer 7 is coupled to the grounded second conductive portion 32 through each second hollowed portion 51, which can improve the electromagnetic anti-interference capability of the first electromagnetic shielding layer 6 and the second electromagnetic shielding layer 7.

In specific implementation, in the flexible circuit board provided by the embodiment of the present disclosure, as shown in fig. 2, an orthogonal projection of the first hollow portion 41 on the substrate layer 1 and an orthogonal projection of the second hollow portion 51 on the substrate layer 1 completely overlap each other. Tests show that the structure of fig. 2 has better anti-interference capability to external electromagnetic interference.

In specific implementation, since the flexible circuit board needs to be bent in the using process, and the thickness of the flexible circuit board corresponding to the hollow area is thinner than that of other areas, when the orthographic projection of the first hollow part 41 on the substrate layer 1 shown in fig. 2 and the orthographic projection of the second hollow part 51 on the substrate layer 1 are overlapped, the area of the thinner part (hollow area) is larger, and the risk of fracture is likely to occur during bending, so in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 4, the orthographic projection of the first hollow part 41 on the substrate layer 1 and the orthographic projection of the second hollow part 51 on the substrate layer 1 are only partially overlapped. Therefore, the area of the thin part (hollow area) is small, the risk of fracture when the thin part is bent is reduced, and therefore the anti-interference capability of the electromagnetic shielding layer can be improved on the basis that the structure shown in fig. 4 of the disclosure is not fractured. The present disclosure preferably employs the structure of fig. 4.

It should be noted that fig. 2, fig. 4, fig. 6, and fig. 8 in the embodiment of the present disclosure are only some exemplary embodiments, and other embodiments are certainly possible, as long as the first hollow portion and the second hollow portion can have an overlapping area, which belongs to the protection content of the present disclosure, and they are not listed here.

In specific implementation, in order to further improve the anti-interference capability of the electromagnetic shielding layer on the basis of no occurrence of fracture, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 4, 6, and 8, an area of an overlapping region where the first hollow portion 41 and the second hollow portion 51 are overlapped with each other may occupy 50% to 90% of an orthographic projection area of the second hollow portion 51 on the substrate layer 1. Preferably, the area of the overlapping region may account for 75% of the orthographic area of the second hollowed-out portion 51 on the substrate layer 1.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, the first hollow portion and the second hollow portion may have the same size. Therefore, the plurality of first hollow parts and the second hollow parts can be manufactured through one-time composition process, and the manufacturing process is uniform. Of course, in specific implementation, the sizes of the first hollow portion and the second hollow portion may be different, and the technical problem of the present disclosure can be solved as long as the orthographic projections of the first hollow portion and the second hollow portion provided by the embodiment of the present disclosure have an overlapping area.

In specific implementation, the size of the first hollow-out portion and the second hollow-out portion is not limited in the embodiments of the present disclosure, for example, the length and the width of the hollow-out portion may be set according to actual needs.

In a possible implementation manner, the lengths of the first hollow-out portion and the second hollow-out portion in the embodiments of the present disclosure may be 3mm to 5mm, respectively, and the widths of the first hollow-out portion and the second hollow-out portion may be 0.5mm to 2mm, respectively. Preferably, the lengths of the first and second hollowed-out portions may be 4mm, respectively, and the widths of the first and second hollowed-out portions may be 2mm, respectively.

In a possible implementation manner, in the embodiment of the present disclosure, the distance between the adjacent first hollow portions may be 0.5mm to 2mm, and the distance between the adjacent second hollow portions may be 0.5mm to 2mm, respectively. Preferably, the distance between adjacent first hollowed-out portions is 2mm, and the distance between adjacent second hollowed-out portions is 2 mm.

In specific implementation, as shown in fig. 1A and 1B, the hollow portions within the dashed line frame C in fig. 1A and the dashed line frame D in fig. 1B are designed in the following manner: the first hollow-out part 41 and the two second hollow-out parts 51 have overlapping regions, and tests show that the anti-interference capability to external electromagnetic interference is better according to the hollow-out design modes of the dotted line frame C and the dotted line frame D in fig. 1A and fig. 1B.

In order to provide the first and second cutouts that overlap at the same position in the first and second cover films, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 1A, 1B, 3, 5, and 7, the first conductive portion 22 surrounds all of the first traces 21, and the second conductive portion 32 surrounds all of the second traces 31. Therefore, when the wiring is etched, the wiring can be arranged towards the middle area of the flexible circuit board as much as possible, the first conductive part 21 and the second conductive part 31 are arranged in the peripheral area, and therefore the wiring arrangement is facilitated, and the first hollow part 41 and the second hollow part 42 can be regularly arranged, so that the flexible circuit board with better anti-interference capability is manufactured.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 1A, 1B, 3, 5, and 7, an orthogonal projection of the first conductive portion 22 on the base layer 1 and an orthogonal projection of the second conductive portion 32 on the base layer 1 are overlapped. Therefore, the hollow parts can be arranged in the areas, corresponding to the corresponding conductive parts, of the first covering film and the second covering film, and the flexible circuit board with better anti-interference capability is manufactured.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 1A, fig. 1B, fig. 3, fig. 5 and fig. 7, each of the first conductive layer 2 and the second conductive layer 3 includes a first bonding region B1 and a second bonding region B2, the first bonding region B1 has a plurality of first pads 01, the second bonding region B2 has a plurality of second pads 02, two ends of the first trace 21 are electrically connected to corresponding first pads 01 and second pads 02 of the first conductive layer 2, two ends of the second trace 31 are electrically connected to corresponding first pads 01 and second pads 02 of the second conductive layer 3, respectively; wherein the content of the first and second substances,

the first hollow portions 41 are arranged along the extending direction of the first trace 21, and the second hollow portions 51 are arranged along the extending direction of the second trace 31. The electromagnetic anti-interference capability test shows that the anti-interference performance is better when the hollow parts are arranged along the extending direction of the routing wire.

In an implementation, the first bonding region B1 is generally electrically connected to a signal line in the display device to provide a signal to the signal line, and the second bonding region B2 is generally connected to an external connector to provide a signal output to the display device to the trace.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 1A, fig. 1B, fig. 3, fig. 5, and fig. 7, the first hollow portion 41 has a rectangular structure, and a width along the extending direction of the first trace 21 is greater than a width along a direction perpendicular to the extending direction of the first trace 21. This reduces the area occupied by the conductive portions, and leaves more space on the surface of the base layer 1 for wiring.

In specific implementation, in the flexible circuit board provided in the embodiment of the present disclosure, as shown in fig. 1A, fig. 1B, fig. 3, fig. 5, and fig. 7, the first hollow portion 41 and the second hollow portion 51 having an overlapped area in a forward projection on the substrate layer 1 are arranged along the extending direction of the first trace 21. This further reduces the area occupied by the conductive portions, leaving more space on the surface of the base layer 1 for wiring.

It should be noted that, the thicknesses of the base layer, the first conductive layer, the second conductive layer, the first cover film, the second cover film, the first electromagnetic shielding layer, and the second electromagnetic shielding layer are not particularly limited in this disclosure.

In specific implementation, the flexible printed circuit board provided in the embodiments of the present disclosure further includes other film layers such as an adhesive layer, a reinforcing layer, and the like, which are the same as those in the related art and will not be described in detail herein.

It should be noted that, since fig. 1A, fig. 1B, fig. 3, fig. 5, and fig. 7 provided in the embodiment of the present disclosure only illustrate a partial film layer structure schematic diagram on a flexible circuit board, in a specific implementation, other functional film layers known to those skilled in the art are also included, for example, structures such as components and the like are disposed in a blank area of an upper portion in fig. 1A, fig. 1B, fig. 3, fig. 5, and fig. 7.

Based on the same inventive concept, the embodiment of the present disclosure provides a method for manufacturing a flexible circuit board, and because the principle of the method for manufacturing the flexible circuit board to solve the problem is similar to the principle of the flexible circuit board to solve the problem, the implementation of the method for manufacturing the flexible circuit board provided by the embodiment of the present disclosure may refer to the implementation of the flexible circuit board provided by the embodiment of the present disclosure, and repeated details are not repeated.

Specifically, the manufacturing method of the flexible circuit board according to the embodiment of the present disclosure, as shown in fig. 9, includes the following steps:

s901, forming a first conductive layer on the first surface of the substrate layer; the first conducting layer comprises a plurality of first wires and a first conducting part mutually insulated from the first wires, and the first conducting part is grounded;

s902, forming a second conductive layer on a second surface, opposite to the first surface, in the substrate layer; the second conducting layer comprises a plurality of second wires and a second conducting part mutually insulated from the second wires, and the second conducting part is grounded;

s903, forming a first covering film on one side, away from the base layer, of the first conducting layer; the part of the first covering film, which is overlapped with the first conductive part, is provided with a plurality of first hollow parts;

s904, forming a second covering film on one side, away from the base layer, of the second conducting layer; the part of the second covering film, which is overlapped with the second conductive part, is provided with a plurality of second hollow parts; the orthographic projection of each first hollow part on the substrate layer at least has an overlapping area with the orthographic projection of one second hollow part on the substrate layer;

s905, forming a first electromagnetic shielding layer on one side, away from the base layer, of the first covering film; the first electromagnetic shielding layer is coupled with the first conductive part through the first hollow part;

s906, forming a second electromagnetic shielding layer on one side, away from the base layer, of the second covering film; the second electromagnetic shielding layer is coupled with the second conductive part through the second hollow part.

In practice, the above-mentioned manufacturing method further includes forming other film layers such as an adhesive layer, a reinforcing layer, and the like, which are the same as those in the related art and will not be described in detail herein.

It should be noted that, in the manufacturing method provided in the embodiment of the present disclosure, the patterning process related to forming each layer structure may include not only some or all of the processes of deposition, photoresist coating, mask masking, exposure, development, etching, and photoresist stripping, but also other processes, and specifically, a pattern to be patterned is formed in an actual manufacturing process, which is not limited herein. For example, a post-bake process may also be included after development and before etching.

The deposition process may be a chemical vapor deposition method, a plasma enhanced chemical vapor deposition method, or a physical vapor deposition method, which is not limited herein; the Mask used in the Mask process may be a Half-Tone Mask (Half Tone Mask), a semi-transparent Mask (modify Single Mask), a Single Slit diffraction Mask (Single Slit Mask) or a Gray Tone Mask (Gray Tone Mask), which is not limited herein; the etching may be dry etching or wet etching, and is not limited herein.

Based on the same inventive concept, the embodiment of the present disclosure further provides an array substrate, including the flexible circuit board provided by the embodiment of the present disclosure. The principle of the array substrate for solving the problems is similar to that of the flexible circuit board, so the implementation of the array substrate can refer to the implementation of the flexible circuit board, and repeated details are not repeated herein.

Based on the same inventive concept, the embodiment of the present disclosure further provides a display device, which includes the flexible array substrate provided by the embodiment of the present disclosure. The principle of the display device to solve the problem is similar to the flexible circuit board, so the implementation of the display device can be referred to the implementation of the flexible circuit board, and repeated details are not repeated herein.

In specific implementation, in the embodiment of the present disclosure, the display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein nor should they be construed as limiting the present disclosure.

In the flexible circuit board, the manufacturing method thereof and the related device provided by the embodiment of the disclosure, the plurality of first hollowed-out portions are arranged at the overlapping part of the first cover film and the first conductive portion, the plurality of second hollowed-out portions are arranged at the overlapping part of the second cover film and the second conductive portion, and the orthographic projection of each first hollowed-out portion on the base layer has an overlapping area with the orthographic projection of at least one second hollowed-out portion on the base layer, so that the electromagnetic shielding layers are electrically connected with the conductive portions through the corresponding hollowed-out portions when the corresponding electromagnetic shielding layers are arranged at two sides of the first cover film and the second cover film sequentially through regular windowing (manufacturing the hollowed-out portions) in the first cover film and the second cover film, and as the electromagnetic shielding layers are grounded, the electromagnetic shielding layers are also grounded, and tests show that the technical scheme of the disclosure can improve the anti-interference capability to external electromagnetic interference, the flexible circuit board provided by the disclosure can normally work under a more severe electromagnetic environment, so that the working reliability of a device connected with the flexible circuit board can be improved.

While preferred embodiments of the present disclosure have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the disclosure.

It will be apparent to those skilled in the art that various changes and modifications may be made to the disclosed embodiments without departing from the spirit and scope of the disclosed embodiments. Thus, if such modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is also intended to encompass such modifications and variations.