阅读说明：本技术 接触件的制造方法、接触件以及断续器 (Contact manufacturing method, contact, and interrupter ) 是由 山崎浩次 横井悠马 草野文彦 于 2019-06-04 设计创作，主要内容包括：本公开的目的在于提供一种在底座和接点的接合面不隔着氧化膜且接点和底座的接合性提高的接触件。本公开的接触件的制造方法的特征在于具备：在接点的表面形成从接点的表面起的深度比宽度更长的槽部的步骤；将底座放置在超声波接合器的载置台的步骤；在载置台上的底座之上以底座和形成槽部的表面接触的方式放置接点的步骤；使超声波接合器具有的超声波喇叭接触到接点的步骤；以及从超声波喇叭施加超声波能量,将接点和底座接合的步骤。(The purpose of the present disclosure is to provide a contact in which an oxide film is not interposed between a base and a contact bonding surface, and the bondability between the contact and the base is improved. The disclosed method for manufacturing a contact is characterized by comprising: forming a groove portion having a depth larger than a width from a surface of the contact on the surface of the contact; placing a base on a mounting table of an ultrasonic bonding apparatus; placing a contact on the base on the mounting table so that the base contacts a surface on which the groove is formed; a step of bringing an ultrasonic horn of an ultrasonic bonding tool into contact with the contact; and applying ultrasonic energy from the ultrasonic horn to bond the contact and the base.)

1. A method for manufacturing a contact, comprising:

forming a groove portion having a depth longer than a width from a surface of the contact on the surface of the contact;

placing a base on a mounting table of an ultrasonic bonding apparatus;

placing the contact on the pedestal on the mounting table so that the pedestal is in contact with the surface on which the groove portion is formed;

a step of bringing an ultrasonic horn provided in the ultrasonic bonder into contact with the contact; and

applying ultrasonic energy from the ultrasonic horn to bond the contact and the base.

2. The method of manufacturing a contact according to claim 1,

the width of the groove is 5-15 μm.

3. The method of manufacturing a contact according to claim 1 or 2,

the plurality of grooves are formed on the surface of the contact at intervals in the width direction of the grooves.

4. The method of manufacturing a contact according to claim 3,

if the depth of the groove is t and the length of the contact in the depth direction of the groove is ta, ta/20 is not less than t < ta/8,

if the length of the contact in the width direction of the groove is wa and the interval between the grooves is w, wa/5 is not more than w < wa/2.

5. The method of manufacturing a contact according to any one of claims 1 to 4,

the base is made of Cu as a main component and comprises W and C.

6. The method of manufacturing a contact according to any one of claims 1 to 5,

when the surface roughness of the surface of the contact is Ra, 5 [ mu ] m & lt, Ra <20 [ mu ] m.

7. The method of manufacturing a contact according to any one of claims 1 to 6,

the groove portion has a slit shape.

8. The method of manufacturing a contact according to any one of claims 1 to 7,

a depth direction length of the groove portion, which is a direction perpendicular to a depth direction of the groove portion and a width direction of the groove portion, is equal to a length of the contact in the depth direction of the groove portion.

9. The method of manufacturing a contact according to any one of claims 1 to 7,

the length of the groove in the depth direction is smaller than the length of the contact in the depth direction.

10. A contact having a base and a contact ultrasonically bonded to the base,

a groove portion is formed on a surface of the contact, and the groove portion includes: a portion buried with a material of the contact on the surface side; and a portion in which the materials of the contact and the base and the oxide are mixed inside compared with the surface side.

11. The contact of claim 10,

if the depth of the groove is set to t and the portion of the groove filled with the material is set to t1, 0.1 × t ≦ t1<0.5 × t.

12. An interrupter includes:

the contact of claim 10;

a contact table which is contacted with the contact point in a closed state; and

and a drive control device that drives the base to open and close the contact.

Technical Field

The present disclosure relates to a method for manufacturing a contact having a base and a contact, and a contact.

Background

A contactor including a circuit breaker and an interrupter includes contacts serving as a movable contact and a fixed contact, and the contacts include a contact and a base to which the contact is joined.

Conventionally, a brazing method using a brazing material has been used as a method for joining a base and a contact. In recent years, ultrasonic bonding is used. The ultrasonic bonding method is as follows: the contact is overlapped to a predetermined position of the upper surface of the base including the metal plate and is pressed against the ultrasonic horn, whereby the oxide film covering the joint surface of the contact and the base is removed by the vibration of the ultrasonic wave, and the contact and the base are temporarily fixed. For example, if an ultrasonic bonding method is used for bonding a contact mainly composed of Ag and a base mainly composed of Cu, an oxide film covering the bonding surface of the contact and the base is removed by ultrasonic vibration, and an alloy of Ag and Cu is formed by a metal diffusion reaction to perform bonding. Further, among a base and a contact joined by ultrasonic, a contact having a concave portion formed on a joining surface side with the base is disclosed (for example, refer to patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 3-156815

Disclosure of Invention

Problems to be solved by the invention

However, if the recess is formed in the contact, the timing of contact with the base is different between the bottom surface of the recess and the upper surface of the recess. Since the upper surface of the concave portion contacts the base earlier than the bottom surface of the concave portion, the ultrasonic energy by the ultrasonic vibration is concentrated, and the oxide film is easily removed. On the other hand, since the ultrasonic energy is not sufficiently transmitted to the bottom surface of the recess, it is necessary to abut the ultrasonic horn until the upper surface of the recess is softened and the bottom surface of the recess comes into contact with the base. While the bottom surface of the recess is in contact with the base and the ultrasonic horn is in contact with the base, frictional heat on the upper surface of the recess is transferred to the bottom surface of the recess, whereby the bottom surface of the recess is oxidized to form an oxide film, and the oxide film is interposed between the bonding surface of the contact and the base, resulting in a decrease in bonding strength or a non-bonded state.

The present disclosure has been made to solve the above problems, and an object of the present disclosure is to provide a contact in which an oxide film is prevented from being interposed between a contact and a bonding surface of a base, and the bondability of the contact and the base is improved.

Means for solving the problems

The disclosed method for manufacturing a contact is characterized by comprising: forming a groove portion having a depth larger than a width from a surface of the contact on the surface of the contact; placing a base on a mounting table of an ultrasonic bonding apparatus; placing a contact on the base on the mounting table so that the base contacts the surface on which the groove is formed; a step of bringing an ultrasonic horn of an ultrasonic bonding tool into contact with the contact; and applying ultrasonic energy from the ultrasonic horn to bond the contact and the base.

In a contact provided with a base and a contact point ultrasonically bonded to the base, a groove portion is formed in a surface of the contact point, and the groove portion includes: a portion buried in a material of at least one of the contact and the base on the front surface side; and a portion where the material and the oxide are mixed more inside than the surface side.

The interrupter of the present disclosure is characterized by comprising: a contact including a base and a contact ultrasonically bonded to the base, wherein a groove is formed in a surface of the contact, the groove including a portion buried with a material of at least one of the contact and the base on a front surface side and a portion in which the material and an oxide are mixed inside the contact than the front surface side; a contact table for contacting the contact point in a closed state; and a drive control device that drives the base to open and close the contact.

Effects of the invention

According to the method for manufacturing a contact of the present disclosure, the groove portion having a depth greater than the width from the surface of the contact is formed on the surface of the contact, so that the bonding strength between the base and the contact can be improved, and the contact can be manufactured efficiently.

According to the contact of the present disclosure, the groove portion is formed on the surface of the contact, and the portion where the material portion of the contact is buried in the surface side of the contact and the portion where the materials of the contact and the base are mixed with the oxide are included in the portion more inside than the surface side, whereby the bonding strength between the base and the contact can be improved.

According to the interrupter of the present disclosure, the groove portion is formed on the surface of the contact, and the portion buried with the material portion of the contact is included on the surface side of the contact and the portion where the materials of the contact and the base are mixed with the oxide is included more inside than the surface side, whereby the bonding strength of the base and the contact can be improved and more stable.

Drawings

Fig. 1 is an example showing a schematic view of a contact including a contact and a base of embodiment 1 before ultrasonic bonding.

Fig. 2 is an example of a flowchart showing a manufacturing process of a contact including a contact and a base according to embodiment 1.

Fig. 3 is an example of a schematic diagram corresponding to the manufacturing process of the contact shown in fig. 2.

Fig. 4 is a view showing only 1 groove portion in a T-T sectional view after ultrasonic bonding viewed from the z direction of fig. 1.

Fig. 5 is an S-S sectional view after ultrasonic bonding as viewed from the x direction of fig. 1.

Fig. 6 is a table showing the measurement results of the bonding strength between the contact and the base after ultrasonic bonding in each mode in which the length of the groove portions and the distance between the groove portions are changed.

Fig. 7 is a graph showing the vertical axis as the bonding strength (MPa) and the horizontal axis as ta/t based on the table shown in fig. 6.

FIG. 8 is a T-T sectional view after ultrasonic bonding as viewed in the direction of the arrow z in FIG. 1 in the case of modes 1 to 5.

FIG. 9 is an S-S sectional view after ultrasonic bonding as viewed in the direction of the arrow x in FIG. 1 in the case of modes 1 to 5.

FIG. 10 is a T-T cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow z in FIG. 1 in the case of modes 6 to 10.

Fig. 11 is an S-S cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1 in the case of mode 6.

Fig. 12 is an S-S cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1 in the case of mode 10.

FIG. 13 is a T-T sectional view after ultrasonic bonding as viewed in the direction of the arrow z in FIG. 1 in the case of modes 11 to 15.

Fig. 14 is an S-S cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1 in the case of mode 15.

FIG. 15 is a T-T cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in FIG. 1 in the case of modes 16 to 20.

FIG. 16 is an S-S sectional view after ultrasonic bonding as viewed in the direction of the arrow z in FIG. 1 in the cases of modes 16 to 20.

FIG. 17 is a T-T sectional view, as viewed in the direction of the arrow "z" in FIG. 1, of an example of a shape different from the groove parts in the patterns 1 to 20.

FIG. 18 is an S-S sectional view after ultrasonic bonding, as seen in the direction of the arrow x in FIG. 1, of another example different from the groove shape in modes 1 to 20.

Fig. 19 is a schematic view of an example of an interrupter in which the contact of the present embodiment is mounted.

(description of reference numerals)

1: a contact point; 1 a: a groove part; 2: a base; 5: a bonding surface; 6: a contact member; 8: a contact stage; 9: a drive control device.

Detailed Description

Embodiment 1.

The contact of the present embodiment will be described. Fig. 1 shows an example of a schematic view of a contact 6 according to the present embodiment before ultrasonic bonding.

As shown in fig. 1, the contact 6 includes a contact 1 and a base 2.

The material of the contact 1 is, for example, Ag as a main component and contains W and C. The base 2 is made of a material containing, for example, Cu as a main component and containing Sn, Zn, Cr, Fe, W, and C.

On the surface of the contact 1, a groove portion 1a having a depth longer than the width from the surface of the contact 1 is formed. Fig. 1 shows a case where a plurality of groove portions 1a are formed with a space therebetween in the width direction of the groove portions 1 a. The surface of contact 1 on which groove 1a is formed is bonding surface 5 which is a surface where contact 1 and base 2 are bonded.

In the present embodiment, wa represents the length of the contact 1 in the x direction, which is the width direction of the groove portion 1a, ta represents the length of the contact 1 in the y direction, which is the depth direction of the groove portion 1a, and ha represents the length of the contact 1 in the z direction, which is the depth direction of the groove portion 1a, which is the direction perpendicular to the depth direction of the groove portion 1a and the width direction of the groove portion 1 a. The depth of the groove 1a is denoted by t. The interval between the groove portions 1a in the width direction of the groove portions 1a is denoted by w. The length of the base 2 in the x direction is denoted by wb, the length of the base 2 in the y direction is denoted by tb, and the length of the base 2 in the z direction is denoted by hb.

The process of manufacturing the contact 6 according to the present embodiment using the ultrasonic bonder will be described with reference to fig. 2 and 3.

Fig. 2 is an example of a flowchart showing a manufacturing process of the contact 6 of the present embodiment using the ultrasonic bonder. Fig. 3 is an example of a schematic diagram corresponding to the manufacturing process of the contact 6 shown in fig. 2. When the manufacturing process of fig. 2 is completed, the contact 6 shown in fig. 1 is manufactured.

An ultrasonic bonding apparatus used in a manufacturing process includes a mounting table 3 and an ultrasonic horn 4. The mounting table 3 and the ultrasonic horn 4 are made of, for example, SUS material. The mounting table 3 and the ultrasonic horn 4 may be coated with a high-melting-point material containing carbon, DLC (Diamond Like carbon Coating), Ti, W, and Mo so as not to adhere to the contact 6 due to a metal diffusion reaction at the time of ultrasonic bonding.

In step S101 of fig. 2, as shown in a of fig. 3, a groove portion 1a having a depth from the surface of the contact 1 longer than the width is formed in the surface of the contact 1.

In step S102 of fig. 2, as shown in b of fig. 3, the base 2 is placed on and fixed to the mounting table 3 of the ultrasonic bonding apparatus.

In step S103 of fig. 2, as shown in c of fig. 3, contact 1 is placed on base 2 on mounting table 3 of the ultrasonic bonder so that base 2 contacts the surface of contact 1 on which groove 1a is formed.

In step S104 of fig. 2, the ultrasonic horn 4 of the ultrasonic bonding tool is brought into contact with the contact 1 as shown in d of fig. 3.

In step S105 of fig. 2, ultrasonic energy is applied from the ultrasonic horn 4 at an arbitrary load and an arbitrary time to join the contact 1 and the base 2, as shown in e of fig. 3. Arrow Y in fig. 3 e shows the operation of the ultrasonic horn 4. By bringing the ultrasonic horn 4 into contact and operating, a joint surface 5 is formed between the contact 1 and the base 2.

In step S106 of fig. 2, as shown in f of fig. 3, the ultrasonic horn 4 is lifted, and the contact 6 in which the contact 1 and the base 2 are joined via the joining surface 5 is taken out from the mounting table 3 of the ultrasonic bonder, thereby completing the process.

Next, the groove portion 1a after ultrasonic bonding will be described.

Fig. 4 shows only one groove portion 1a in a T-T cross-sectional view after ultrasonic bonding as viewed in the z direction of fig. 1. Fig. 5 is an S-S sectional view after ultrasonic bonding as viewed from the x direction of fig. 1.

The portion t1 on the surface side of the contact 1 shown in fig. 4 and 5 is filled with a material of a metal component contained in the material of the contact 1 without a gap due to the plastic flow of the contact 1. On the other hand, in a portion t2 located more inward than the front surface side, a material containing a metal component contained in the material of the contact 1 and the base 2 and the oxide 7 are mixed.

That is, the groove portion 1a after ultrasonic bonding includes: a t1 portion filled with a material containing a metal component contained in the material of the contact 1; and a t2 portion in which a material containing a metal component contained in the material of the contact 1 and the base 2 and the oxide 7 are mixed.

The oxide 7 present in part t2 is formed from: natural oxide films of the contact 1 and the base 2 before ultrasonic bonding; and an oxide film formed on the joining surface 5 due to frictional heat at the time of ultrasonic joining, the joining surface 5 being repelled by plastic flow due to minute sliding caused by ultrasonic energy.

In order to measure the bonding strength corresponding to the groove portions 1a formed before ultrasonic bonding, the number and depth t of the groove portions 1a and the interval w between the groove portions 1a were changed, and experiments of modes 1 to 20 were performed.

In the experiments in modes 1 to 20, the groove portion 1a formed in the contact 1 before the ultrasonic bonding was shaped like a slit having a straight line in the depth direction of the groove portion 1 a. The length of the groove portion 1a in the depth direction is equal to the length ha of the contact 1 in the z direction, which is the depth direction of the groove portion 1 a.

In the experiments in modes 1 to 20, the length wa of the contact 1 in the x direction is 10mm, the length ta in the y direction is 1mm, and the length ha in the z direction is 5 mm. The base 2 has a length wb in the x direction of 15mm, a length tb in the y direction of 5mm, and a length hb in the z direction of 10 mm.

The width of the groove 1a is, for example, about 10 μm.

The bonding strength was measured by pressing a tool with a load detector of a load cell against the side surface of the contact 1 after the contact 1 and the base 2 were ultrasonically bonded. After the fracture, the bonding strength (N) was divided by the area of the bonding surface 5, and the bonding strength (MPa) per unit area was calculated.

In the experiments in modes 1 to 20, the area of the bonding surface 5 was wa × ha, 5mm × 10mm, 50mm²。

The joint between the contact 1 and the base 2 is performed in the atmosphere. In the experiments in the modes 1 to 20, the ultrasonic bonding tool used has a frequency of 50KHz or more and 200KHz or less, for example. The engagement time can be arbitrarily changed according to the frequency and the output.

In the present embodiment, the surface roughness Ra of the bonding surface 5 is 5 μm or less Ra <20 μm. The surface roughness Ra means an index of surface roughness as made in JIS B0601-2001 (ISO 4287-1997), meaning arithmetic average roughness.

The criterion for the quality of the bonding strength was 50 MPa. If the measured bonding strength is a value less than 50MPa, it is determined that the strength is insufficient, and if it is 50MPa or more, it is determined that the strength is sufficient. The judgment standard 50MPa is the average bonding strength in the case of bonding with a brazing material which has been conventionally performed.

Further, if the bonding strength is 70MPa or more, it is judged to have excellent bonding strength. 70MPa, which is a criterion for determining excellent bonding strength, is a value obtained by performing experiments in modes 1 to 20.

Fig. 6 is a table showing the results of measuring the bonding strength between the contact 1 and the base 2 after ultrasonic bonding in each mode in which the depth t of the groove portion 1a before ultrasonic bonding and the interval w between the groove portions 1a are changed. In the table of fig. 6, the results are "x" when the bonding strength is less than 50MPa, 50MPa or more and less than 70MPa, and "excellent" when the bonding strength is excellent, 70MPa or more.

Fig. 7 is a graph showing the bonding strength (MPa) on the vertical axis and ta/t on the horizontal axis based on the table shown in fig. 6. The range A in FIG. 7 shows a range of ta/t of 70MPa or more, which is an excellent bonding strength. Boundary B of fig. 7 shows a criterion of excellent bonding strength.

For comparison, the results obtained when the number of the groove portions 1a is 0, that is, when there are no groove portions 1a, are shown in the table of fig. 6 as comparative example 1. The bonding strength without the groove portion 1a was 31MPa, which was lower than 50MPa, which is the standard for quality determination.

For convenience of understanding, each mode will be described with reference to fig. 8 to 14 while referring to the table of fig. 6.

First, modes 1 to 5 will be described with reference to fig. 8 and 9.

FIG. 8 is a T-T sectional view after ultrasonic bonding, as viewed in the direction of the arrow "z" in FIG. 1, in which groove portions 1a of patterns 1 to 5 are formed before ultrasonic bonding, as in the schematic view of the contact shown in FIG. 1. FIG. 9 is an S-S sectional view after ultrasonic bonding, as viewed in the direction of the arrow x in FIG. 1, in which groove portions 1a of patterns 1 to 5 are formed before ultrasonic bonding, as in the schematic view of the contact shown in FIG. 1. In the explanation of the experimental results of the mode to be described later, the explanation will be made using the sectional views similarly.

In modes 1 to 5, w is 1.7mm and wa/w is 5.9 before ultrasonic bonding. ta/t is 21.3 in mode 1, 20.0 in mode 2, 12.5 in mode 3, 8.5 in mode 4, and 8.0 in mode 5.

The results of measuring the bonding strength of modes 1 to 5 are described in order.

The modes 1 to 5 are all 50MPa or more and less than 70MPa, and have sufficient strength.

Although 50MPa or more and less than 70MPa, the reason why 70MPa or more is not considered is that the number of the grooves 1a is larger than that in the other modes, and the grooves 1a are not filled with the oxide 7 to form a part of the space, so that the unbonded portion P with the base 2 increases.

Modes 6 to 10 will be described with reference to fig. 10 to 12.

Fig. 10 is a T-T sectional view after ultrasonic bonding as viewed in the direction of the arrow z in fig. 1.

In modes 6 to 10, w is 2.0mm and wa/w is 5.0 before ultrasonic bonding. Let ta/t be 21.3 in mode 6, 20.0 in mode 7, 12.5 in mode 8, 8.5 in mode 9, and 8.0 in mode 10.

The results of measuring the bonding strength of modes 6 to 10 are described in order.

In modes 7 to 9, the bonding strength is 70MPa or more, and the strength is high. This is considered to be because the interior of the groove portion 1a is filled with the oxide 7, and therefore the oxide 7 does not remain on the bonding surface 5.

In mode 6, the bonding strength is 50MPa or more and less than 70MPa, and is sufficient strength, but not 70MPa or more. Fig. 11 is an S-S cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1 in the case of mode 6.

It is considered that if the depth t of the groove portion 1a formed before ultrasonic bonding is too small, the oxide 7 fills the groove portion 1a after ultrasonic bonding, and further, the oxide 7 remains above the bonding surface 5, and therefore, the bonding strength is not 70MPa or more, but is less than 70MPa although 50MPa or more.

In mode 10, the bonding strength is 50MPa or more and less than 70MPa, which is sufficient strength. Fig. 12 is an S-S cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1 in the case of mode 10.

It is considered that if the depth t of the groove portion 1a formed before ultrasonic bonding is too large compared to the other modes, the groove portion 1a is not filled with the oxide 7 after ultrasonic bonding and a partial space is formed, and therefore the unbonded portion P with the base 2 is increased, and the bonding strength is not 70MPa or more but 50MPa or more and less than 70 MPa.

Next, modes 11 to 15 will be described with reference to fig. 13 and 14.

Fig. 13 is a T-T sectional view after ultrasonic bonding as viewed in the direction of the arrow z in fig. 1.

In modes 11 to 15, w is 4.5mm and wa/w is 2.2 before ultrasonic bonding. Let ta/t be 21.3 in mode 11, 20.0 in mode 12, 12.5 in mode 13, 8.5 in mode 14, and 8.0 in mode 15.

The results of measuring the bonding strength of the modes 11 to 15 are described in order.

The excellent bonding strength is 70MPa or more in modes 12 to 14.

In mode 11, 50MPa or more and less than 70MPa is sufficient bonding strength. Fig. 14 is an S-S cross-sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1 in the case of mode 11.

It is considered that if the depth t of the groove portion 1a formed before ultrasonic bonding is too small compared to the other modes, the oxide 7 fills the groove portion 1a, and further, the oxide 7 of the above remains on the bonding surface 5, so that the bonding strength becomes 50MPa or more and less than 70 MPa.

50MPa or more and less than 70MPa in the mode 15. It is considered that if the depth t of the groove portion 1a formed before ultrasonic bonding is too large as compared with the other modes, the groove portion 1a is not filled with the oxide 7 and a partial space is formed, and therefore, the unbonded portion with the base 2 is increased, and the bonding strength is 50MPa or more and less than 70 MPa.

Next, modes 16 to 20 will be described with reference to fig. 15 and 16.

Fig. 15 is a T-T sectional view after ultrasonic bonding as viewed in the direction of the arrow z in fig. 1. Fig. 16 is an S-S sectional view after ultrasonic bonding as viewed in the direction of the arrow x in fig. 1.

In modes 16 to 20, w is 5.0mm and wa/w is 2.0 before ultrasonic bonding. Let ta/t be 21.3 in mode 16, 20.0 in mode 17, 12.5 in mode 18, 8.5 in mode 19, and 8.0 in mode 20.

The results of measuring the bonding strength of the modes 16 to 20 are described in turn.

In the modes 16 to 20, the strength is sufficient when the value is 50MPa or more and less than 70 MPa. This is considered to be because if the number of the groove portions 1a is smaller than that in the other modes, the oxide 7 is present on the surface of the bonding surface 5 in an amount equal to or larger than the portion filled in the groove portions 1a, and therefore the oxide 7 remains on the bonding surface 5 in the portion not filled in the groove portions 1 a.

As a result of the experiments in the above modes 1 to 20, in order to increase the bonding strength to 50MPa or more, it is preferable that the depth t of the groove portion 1a formed before ultrasonic bonding be ta/20. ltoreq. t < ta/8, and the interval w between the plurality of groove portions 1a be wa/5. ltoreq. w < wa/2. After ultrasonic bonding, the t1 portion filled with a material of a metal component, which is the material of the contact 1, is 0.1 × t ≦ t1<0.5 × t due to plastic flow.

After ultrasonic bonding, t1 portions of the groove portions 1a on the front surface side of the contact 1 are filled with a material of a metal component contained in the material of the contact 1 by plastic flow, and the oxide film formed on the bonding surface 5 is contained as an oxide 7 in t2 portions of the groove portions 1a more inside than the front surface side of the contact 1, thereby being efficiently repelled.

Therefore, the contact 6 of the present embodiment does not have an oxide film remaining on the bonding surface 5, and the bonding strength is improved.

In addition, when the contact 1 and the base 2 are joined, since the time required for the contact having the concave portion to abut against the ultrasonic horn 4 until the bottom surface of the concave portion of the contact comes into contact with the base can be reduced, the manufacturing can be performed efficiently.

In the present embodiment, in the experiments in modes 1 to 20, the groove portion 1a formed in the contact 1 before ultrasonic bonding was formed in a slit shape. The slit-shaped groove portion 1a is easy to manufacture in the contact 1, and the oxide 7 is easily taken into the groove portion 1a because the slit shape is linear in the depth direction of the groove portion 1a before ultrasonic bonding. Therefore, the groove portion 1a is preferably in a slit shape, but is not limited thereto. The groove portion 1a may be formed along a predetermined pattern, and may be arbitrarily changed. For example, fig. 17 and 18 show other example shapes of the groove portion 1a after ultrasonic bonding.

For example, FIG. 17 is an S-S cross-sectional view after ultrasonic bonding as viewed from the x-direction of FIG. 1, and FIG. 18 is a T-T cross-sectional view after ultrasonic bonding as viewed from the z-direction. As shown in fig. 17, the groove portion 1a before ultrasonic bonding may not be linear, but may be curved in the width direction of the groove portion 1 a. As shown in fig. 18, the length in the z direction of the groove portion 1a before ultrasonic bonding may be formed to be smaller than the length of the contact 1 in the depth direction of the groove portion 1 a.

Fig. 19 shows an example of a schematic diagram of an interrupter in which the contact 6 of the present embodiment is mounted. The interrupter shown in fig. 19 is provided with a contact base 8 which comes into contact with the contact 1 in a closed state, and a drive control device 9 which drives the base 2 engaged with the contact 1. Further, the contact 1 may be bonded to the contact base 8.

In addition, the range in which the current flowing through the interrupter is concentrated varies depending on the parallelism and flatness of the contact base 8 and the contact 1. As a result, the amount of heat generation and the amount of impact applied to the contact 1 vary depending on the range in which the current is concentrated. Therefore, the depth t of the groove portion 1a before ultrasonic bonding can be arbitrarily changed according to the contact surface with the contact base 8 that contacts the contact 1 during the operation of the interrupter.

The interrupter using the contact 6 according to the present embodiment is a contact 6 in which the bonding strength between the contact 1 and the base 2 is improved by introducing the oxide 7 into the groove portion 1a formed on the surface of the contact 1 before ultrasonic bonding, and thus is more stable.