阅读说明：本技术 一种交流电压电路板用电磁干扰防护装置 (Electromagnetic interference protector for AC voltage circuit board ) 是由 李福� 于 2020-03-26 设计创作，主要内容包括：本发明公开了一种交流电压电路板用电磁干扰防护装置,具体涉及交流电压电路板领域,包括PCB电路基板、EMI遮蔽罩,PCB电路基板的顶面焊接有电子元器件,EMI遮蔽罩的周侧安装有平沿扣板,平沿扣板的底面安装有弹性卡片,EMI遮蔽罩的顶面开设有散热凸点,PCB电路基板的顶面卡接有平沿板扣条,平沿板扣条的底面安装有扣条弹性卡片,EMI遮蔽罩的内部填充有相变介质液。本发明通过利用EMI遮蔽罩内部的相变介质液在受热时,蒸发成蒸汽然后将热量带到EMI遮蔽罩表面,热量向外在环境空气传递,通过相变介质液的液汽二相变化,且散热凸点的设置进一步提高了EMI遮蔽罩表面与空气的接触面积,进一步提高散热效果,保证电子元器件的正常性能。(The invention discloses an electromagnetic interference protection device for an alternating-current voltage circuit board, and particularly relates to the field of the alternating-current voltage circuit board. According to the invention, the phase-change medium liquid in the EMI shielding cover is evaporated into steam when being heated, then the heat is brought to the surface of the EMI shielding cover, the heat is transferred to the outside in the ambient air, the contact area between the surface of the EMI shielding cover and the air is further improved through the liquid-vapor two-phase change of the phase-change medium liquid, the heat dissipation effect is further improved, and the normal performance of the electronic component is ensured.)

1. The utility model provides an electromagnetic interference protector for AC voltage circuit board, includes PCB circuit substrate (1), EMI shields cover (2), the top welding of PCB circuit substrate (1) has electronic components (3), its characterized in that: a flat edge pinch plate (7) is fixedly arranged on the periphery of the EMI shielding cover (2), an elastic clamping sheet (5) is fixedly arranged on the bottom surface of the flat edge buckling plate (7), a plurality of radiating salient points (4) are arranged on the top surface of the EMI shielding cover (2) and are uniformly distributed, the top surface of the PCB circuit substrate (1) is clamped with a flat edge plate buckling strip (8), the bottom surface of the flat edge plate buckling strip (8) is fixedly provided with a buckling strip elastic clamping piece (9), the flat edge buckle plate (7) at one side of the EMI shielding cover (2) is in friction connection with the inner side of the flat edge plate buckle strip (8), the EMI shielding cover (2) is filled with phase-change medium liquid (6), the elastic clamping piece (5) and the buckling strip elastic clamping piece (9) have the same structure, the surface of the PCB circuit substrate (1) is provided with a clamping hole matched with the elastic clamping piece (5) and the buckling strip elastic clamping piece (9).

2. The apparatus according to claim 1, wherein: the PCB circuit board is characterized in that clamping holes in the surface of the PCB circuit board (1) are distributed on the peripheral sides of the electronic components (3), the EMI shielding cover (2) is located right above the electronic components (3), heat-conducting silicone grease (24) is sprayed on the bottom surface of the EMI shielding cover (2), and the bottom surface of the EMI shielding cover (2) is in friction connection with the top surface of the electronic components (3).

3. The apparatus according to claim 1, wherein: EMI shields cover (2), elasticity card (5) and peaceful buckle (7) stamping forming structure as an organic whole, elasticity card (5) are buckled downwards and are followed buckle (7) mutually perpendicular with the peaceful.

4. The apparatus according to claim 1, wherein: the EMI shielding cover (2) comprises a copper base plate (21) and a shielding cover plate (23), a medium liquid cavity (22) is arranged between the copper base plate (21) and the shielding cover plate (23), the peripheral side of the copper base plate (21) is mutually abutted with the inner side of the shielding cover plate (23), and the joint of the copper base plate (21) and the shielding cover plate (23) is sealed by welding.

5. An electromagnetic interference preventing apparatus for an ac voltage circuit board according to claim 1 or 4, wherein: the heat dissipation salient points (4) are cylindrical protrusions, gaps with the same width as the heat dissipation salient points (4) are arranged between the adjacent heat dissipation salient points (4), the heat dissipation salient points (4) are provided with salient point cavities (41), the medium liquid cavities (22) and the salient point cavities (41) are communicated with each other, and the phase-change medium liquid (6) is filled in the medium liquid cavities (22) and the salient point cavities (41).

6. The apparatus according to claim 1, wherein: the elastic clamping pieces (5) are of sheet structures, buckling teeth (51) are arranged on two sides of each elastic clamping piece (5) and are of symmetrical structures, a furling gap (52) and a bending through hole (53) are arranged between the elastic clamping pieces (5), and the top ends of the furling gaps (52) are communicated with the bottom ends of the bending through holes (53).

7. The apparatus according to claim 1, wherein: the flat board profile (8), profile elasticity card (9) of following are stainless steel material component, flat board profile (8), profile elasticity card (9) stamping forming structure as an organic whole along, flat board profile (8) of following are located flat along buckle (7) directly over, one side that EMI shielded the cover (2) is connected with the surperficial friction of PCB circuit substrate (1) through flat board profile (8) of following.

Technical Field

The invention relates to the technical field of alternating-current voltage circuit boards, in particular to an electromagnetic interference protection device for an alternating-current voltage circuit board.

Background

As the performance of ac voltage circuit boards increases, electromagnetic interference (EMI) becomes more and more severe and manifests itself in many ways, to which high speed devices are particularly sensitive, which will therefore receive high speed glitches, while low speed devices ignore such glitches. At the same time, EMI threatens the safety, reliability and stability of electronic equipment. Therefore, in designing an electronic product, the design of the PCB board is very important to solve the EMI problem.

Electromagnetic interference can be divided into radiated interference and conducted interference, and radiated interference is interference in which an interference source interferes its signal to another electrical network with space as a medium. And the conducted interference is to interfere the signal on one electric network to the other electric network by taking the conductive medium as a medium. In the design of a high-speed system, pins of an integrated circuit, high-frequency signal lines and various plugs are common radiation interference sources in the design of a PCB (printed circuit board), electromagnetic waves emitted by the integrated circuit, the high-frequency signal lines and various plugs are electromagnetic interference, and normal work of the integrated circuit and other systems is affected.

At present, the mainstream electromagnetic interference protection mostly adopts an external EMI shielding member as an electromagnetic interference protection facility, which is low in cost, easy to implement, and more stable than establishing a common-mode EMI interference source and reducing a loop, but when an electronic component is operated or used, besides generating electromagnetic waves, in practical use, the electronic component still generates heat during operation, the heat is gathered in the EMI shielding cover body and cannot be dissipated outwards, and the heat conduction speed of the electromagnetic shielding structure made of a metal material is too slow, that is, the cover body cannot effectively transfer the heat generated by the electronic component outwards, which leads to the continuous increase of the heat generated by the electronic component, and causes the short service life or the reduced efficiency of the electronic component covered by the cover body.

Therefore, it is desirable to provide an electromagnetic interference protection device for an ac voltage circuit board.

Disclosure of Invention

In order to overcome the above defects in the prior art, embodiments of the present invention provide an electromagnetic interference protection device for an ac voltage circuit board, in which a phase-change medium liquid and a heat dissipation bump structure are arranged, the phase-change medium liquid inside an EMI shielding cover is heated, and is evaporated into steam, and then the steam brings heat to the surface of the EMI shielding cover, the heat is transferred to the outside ambient air, and the liquid-vapor two-phase change of the phase-change medium liquid is utilized, and the arrangement of the heat dissipation bump further improves the contact area between the surface of the EMI shielding cover and the air, further improves the heat dissipation effect, and ensures the normal performance of electronic components; in addition, the elastic clamping piece is arranged as the installation structure of the EMI shielding cover, the elastic clamping piece is buckled on the surface of the PCB circuit substrate and is used as a shielding or electromagnetic wave interference preventing structure of electronic components, when the circuit board needs to be maintained, only external force needs to be applied to two sides of the elastic clamping piece for pressing, the buckling connection between the EMI shielding cover and the PCB circuit substrate can be easily removed, and the EMI shielding cover can be detached from the PCB circuit substrate, so that the disassembly and the rework of the circuit substrate are facilitated, the maintenance is convenient, and the problems in the background art are solved.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an alternating current is electromagnetic interference protector for voltage circuit board, includes PCB circuit substrate, EMI and shields the cover, PCB circuit substrate's top surface welding has electronic components, EMI shields all sides fixed mounting of cover has flat buckle along, flat bottom surface fixed mounting along the buckle has the elasticity card, a plurality of heat dissipation bumps and evenly distributed have been seted up to EMI shields the top surface of cover, PCB circuit substrate's top surface joint has flat board along and detains the strip, flat bottom surface fixed mounting along board detains the strip has detains strip elasticity card, EMI shields the inboard frictional connection of flat buckle along buckle and flat board along detaining the strip of cover one side, EMI shields the inside packing of cover and has phase change medium liquid, elasticity card, detain strip elasticity card the same structure, PCB circuit substrate surface sets up the card hole with elasticity card, detain strip elasticity card looks adaptation.

In a preferred embodiment, the card holes on the surface of the PCB substrate are distributed around the electronic component, the EMI shielding cover is located right above the electronic component, the bottom surface of the EMI shielding cover is sprayed with a heat-conducting silicone grease, and the bottom surface of the EMI shielding cover is in frictional connection with the top surface of the electronic component.

In a preferred embodiment, the EMI shield, the resilient tabs, and the flat edge clips are integrally stamped and formed, and the resilient tabs are bent downward and perpendicular to the flat edge clips.

In a preferred embodiment, the EMI shield cover comprises a copper base plate and a shield cover plate, wherein a dielectric liquid cavity is arranged between the copper base plate and the shield cover plate, the peripheral side of the copper base plate and the inner side of the shield cover plate are abutted against each other, and the joint of the copper base plate and the shield cover plate is sealed by welding.

In a preferred embodiment, the heat dissipation bumps are cylindrical protrusions, a gap with the same width as the heat dissipation bump is formed between every two adjacent heat dissipation bumps, bump cavities are formed in the heat dissipation bumps, the medium liquid cavities and the bump cavities are communicated with each other, and the phase-change medium liquid is filled in the medium liquid cavities and the bump cavities.

In a preferred embodiment, the elastic clamping pieces are of a sheet structure, two sides of each elastic clamping piece are provided with buckling teeth and are of a symmetrical structure, a drawing gap and a bending through hole are formed between the elastic clamping pieces, and the top end of the drawing gap is communicated with the bottom end of the bending through hole.

In a preferred embodiment, the flat board profile of following, profile elasticity card are stainless steel material component, flat board profile of following, profile elasticity card are stamping forming structure as an organic whole, flat board profile of following is located flat directly over along the buckle, one side that EMI shields the cover is connected through the flat surface friction who follows board profile and PCB circuit substrate.

The invention has the technical effects and advantages that:

1. according to the invention, by arranging the phase-change medium liquid and the heat dissipation salient point structure, when the phase-change medium liquid in the EMI shielding cover is heated, the phase-change medium liquid is evaporated into steam, then the heat is brought to the surface of the EMI shielding cover, the heat is transferred to the outside ambient air, and the liquid-vapor two-phase change of the phase-change medium liquid is utilized, and the arrangement of the heat dissipation salient point further improves the contact area between the surface of the EMI shielding cover and the air, further improves the heat dissipation effect and ensures the normal performance of electronic components;

2. the elastic clamping piece is arranged as the installation structure of the EMI shielding cover, the elastic clamping piece is buckled on the surface of the PCB circuit substrate and is used as a shielding or electromagnetic wave interference preventing structure of electronic components, when the circuit board needs to be maintained, only external force needs to be applied to two sides of the elastic clamping piece for pressing, the buckling connection between the EMI shielding cover and the PCB circuit substrate can be easily released, and the EMI shielding cover can be detached from the PCB circuit substrate, so that the disassembly and rework of the circuit substrate are facilitated, and the maintenance is convenient.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic top view of the present invention.

FIG. 3 is a schematic structural diagram of FIG. 1A according to the present invention.

Fig. 4 is a schematic view of a structure of the elastic card of the present invention.

The reference signs are: 1. a PCB circuit substrate; 2. an EMI shielding cage; 3. an electronic component; 4. heat dissipation salient points; 5. an elastic card; 6. a phase change medium liquid; 7. a flat edge buckle plate; 8. a flat edge plate buckling strip; 9. a buckle elastic card; 21. a copper base plate; 22. a medium liquid cavity; 23. a shield cover plate; 24. heat-conducting silicone grease; 41. a bump cavity; 51. buckling teeth; 52. closing the gap; 53. and bending the through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The electromagnetic interference protection device for the alternating current voltage circuit board as shown in the attached figures 1-4 comprises a PCB circuit substrate 1 and an EMI shielding cover 2, wherein an electronic component 3 is welded on the top surface of the PCB circuit substrate 1, a flat edge buckle plate 7 is fixedly arranged on the peripheral side of the EMI shielding cover 2, an elastic card 5 is fixedly arranged on the bottom surface of the flat edge buckle plate 7, a plurality of radiating convex points 4 are arranged on the top surface of the EMI shielding cover 2 and are uniformly distributed, a flat edge plate buckle strip 8 is clamped on the top surface of the PCB circuit substrate 1, a buckle strip elastic card 9 is fixedly arranged on the bottom surface of the flat edge plate buckle strip 8, the flat edge buckle plate 7 on one side of the EMI shielding cover 2 is in friction connection with the inner side of the flat edge plate buckle strip 8, a phase-change medium liquid 6 and the elastic card 5 are filled in the EMI shielding cover 2, the structure of the elastic buckling strip clamping piece 9 is the same, and the surface of the PCB circuit substrate 1 is provided with clamping holes matched with the elastic clamping piece 5 and the elastic buckling strip clamping piece 9.

The implementation mode is specifically as follows: by arranging the phase-change medium liquid 6 and the heat dissipation salient points 4, when the phase-change medium liquid 6 in the EMI shielding cover 2 is heated, the phase-change medium liquid is evaporated into steam, then the steam carries heat to the surface of the EMI shielding cover 2, the heat is transferred to the outside in the ambient air, and the liquid-steam two-phase change of the phase-change medium liquid 6 is utilized, and the arrangement of the heat dissipation salient points 4 further improves the contact area between the surface of the EMI shielding cover 2 and the air, further improves the heat dissipation effect and ensures the normal performance of the electronic component 3; in addition, the elastic clamping piece 5 is arranged as the installation structure of the EMI shielding cover 23, the elastic clamping piece 23 is buckled on the surface of the PCB circuit substrate 1 to serve as a shielding or electromagnetic wave interference preventing structure of the electronic component 3, when the circuit board needs to be maintained, only external force needs to be applied to two sides of the elastic clamping piece 5 for pressing, the buckling connection between the EMI shielding cover 2 and the PCB circuit substrate 1 can be easily released, the EMI shielding cover 2 can be detached from the PCB circuit substrate 1, and therefore the disassembly and rework of the circuit substrate are facilitated, and the maintenance is convenient.

The clamping holes on the surface of the PCB circuit substrate 1 are distributed on the periphery of the electronic component 3, the EMI shielding cover 2 is positioned right above the electronic component 3, the bottom surface of the EMI shielding cover 2 is sprayed with heat-conducting silicone grease 24, the bottom surface of the EMI shielding cover 2 is in friction connection with the top surface of the electronic component 3, and the heat conduction efficiency of the electronic component 3 and the EMI shielding cover 2 is enhanced.

Wherein, EMI shields cover 2, elasticity card 5 and flat buckle 7 stamping forming structure as an organic whole, and elasticity card 5 is buckled downwards and is followed buckle 7 mutually perpendicular with flat, directly utilizes EMI to shield cover stamping structure's elasticity card 5, and production is simple, saves product manufacturing cost.

The EMI shielding cover 2 comprises a copper-based base plate 21 and a shielding cover plate 23, a medium liquid cavity 22 is arranged between the copper-based base plate 21 and the shielding cover plate 23, the peripheral side of the copper-based base plate 21 is abutted against the inner side of the shielding cover plate 23, and the joint of the copper-based base plate 21 and the shielding cover plate 23 is sealed by welding to prevent the leakage of the phase change medium liquid 6 inside.

The heat dissipation salient points 4 are cylindrical bulges, gaps with the same width as the heat dissipation salient points 4 are arranged between the adjacent heat dissipation salient points 4, the salient point cavities 41 are formed in the heat dissipation salient points 4, the medium liquid cavities 22 and the salient point cavities 41 are communicated with each other, and the phase-change medium liquid 6 is filled in the medium liquid cavities 22 and the salient point cavities 41, so that heat absorbed by the phase-change medium liquid 6 is rapidly led out.

The elastic clamping pieces 5 are of a sheet structure, the two sides of each elastic clamping piece 5 are provided with buckling teeth 51 and are of a symmetrical structure, a drawing gap 52 and a bending through hole 53 are formed between the elastic clamping pieces 5, the top ends of the drawing gap 52 are communicated with the bottom ends of the bending through holes 53, and long-term stable fixation can be achieved by bending the elastic clamping pieces 5 towards the two sides.

Wherein, the flat board profile 8 of following, profile elasticity card 9 is stainless steel material component, the flat board profile 8 of following, profile elasticity card 9 is stamping forming structure as an organic whole, the flat board profile 8 of following is located the flat board profile 7 directly over, EMI shields one side of cover 2 and is connected with PCB circuit substrate 1's surface friction through the flat board profile 8 of following, the direct elasticity card 5 of accessible joint also can be through the flat board profile 8 of following as installation mechanism, can select arbitrary mounting means according to actual need, abundantly use the scene.

The working principle of the invention is as follows:

firstly, a flat edge plate buckle strip 8 is clamped on the surface of a PCB circuit substrate 1 through a buckle strip elastic clamping piece 9, if long-term fixing is needed, the buckle strip elastic clamping piece 9 can be bent towards two sides, one side flat edge buckling plate 7 of an EMI shielding cover 2 is inserted into the buckle strip elastic clamping piece 9, the surface of an electronic component 3 is buckled, an elastic clamping piece 5 at the bottom surface of the other side flat edge buckling plate 7 of the EMI shielding cover 2 is clamped on the surface of the PCB circuit substrate 1, if long-term fixing is needed, the elastic clamping piece 5 can be bent towards two sides, long-term fixing is realized, when a circuit board is required to be maintained, external force is only required to press two sides of the elastic clamping piece 5, the clamping connection between the EMI shielding cover 2 and the PCB circuit substrate 1 can be easily released, the EMI shielding cover 2 can be detached from the PCB circuit substrate 1, so that the circuit substrate is favorable for detachment and rework, when the electronic component 3 is heated, the phase-change medium liquid 6 in the EMI shielding cover 2 is heated, the heat is transferred to the outside ambient air through the liquid-vapor two-phase change of the phase-change medium liquid 6, and the arrangement of the heat dissipation salient points 4 further improves the contact area between the surface of the EMI shielding cover 2 and the air, further improves the heat dissipation effect and ensures the normal performance of the electronic component 3.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.