阅读说明：本技术 成像设备和电子设备 (Imaging apparatus and electronic apparatus ) 是由 张洪伟 于 2018-09-26 设计创作，主要内容包括：一种成像设备,包括：显示器(20),包括布线层(24)；以及相机(30),位于显示器(20)的背面,其中相机(30)包括光学透镜(32)和成像传感器(34),成像传感器(34)感测通过显示器(20)的光以产生图像；光学元件(40),位于显示器(20)和相机(30)之间,其中光学元件(40)过滤穿过显示器(20)的光并将过滤后的光传递到相机(30),光学元件(40)减少由于布线层(24)引起的衍射。(An image forming apparatus comprising: a display (20) comprising a wiring layer (24); and a camera (30) located at a back of the display (20), wherein the camera (30) comprises an optical lens (32) and an imaging sensor (34), the imaging sensor (34) sensing light passing through the display (20) to produce an image; an optical element (40) positioned between the display (20) and the camera (30), wherein the optical element (40) filters light passing through the display (20) and passes the filtered light to the camera (30), the optical element (40) reducing diffraction due to the wiring layer (24).)

1. An image forming apparatus comprising:

a display including a wiring layer;

a camera located on a back side of the display, the camera including an optical lens and an imaging sensor that senses light passing through the display to produce an image;

an optical element between the display and the camera, wherein the optical element filters light passing through the display and passes the filtered light to the camera, and the optical element reduces diffraction due to the wiring layer.

2. The imaging apparatus of claim 1, wherein the optical element comprises an optical mask having a mask area to mask light from the display to the camera, and a mask pattern of the mask area corresponds to a wiring pattern of wires of the wiring layer.

3. The imaging device of claim 2, wherein the optical mask further comprises a transparent region that passes light from the display to the camera and a graded region that partially passes light from the display to the camera, wherein the transmittance of light in the graded region gradually increases as the transparent region is approached from the mask region.

4. The image forming apparatus as claimed in claim 2, wherein a mask pattern of the mask region coincides with a wiring pattern of the wires.

5. The imaging apparatus according to claim 2, wherein a mask region of the mask pattern is provided for every other row of the wires of the wiring pattern.

6. The imaging apparatus according to claim 2, wherein a mask region of the mask pattern is provided for a plurality of wires of the wiring pattern of the wiring layer.

7. The imaging apparatus according to claim 3, wherein the mask region is enlarged in a rear region around the intersection of the wirings.

8. The imaging apparatus according to claim 3, wherein a mask region is formed in a rear region around the intersection of the wires, and no mask region is formed in the other region.

9. The imaging device of claim 2, the optical element being attached to the display.

10. The imaging device of claim 2, the optical element being incorporated in a display.

11. The imaging device of claim 1, the optical element comprising a diffuser to diffuse light from the display to the camera.

12. The imaging device of claim 2, the optical element further comprising a diffuser to diffuse light from the display to the camera.

13. The imaging apparatus of claim 1, the optical element flattening a back surface of the wiring layer of the display.

14. The imaging apparatus according to claim 13, the optical element is filled into the recessed portion of the wiring layer.

15. The imaging device of claim 1, the camera being positioned in a middle region of the display.

16. An electronic device, comprising:

the imaging apparatus according to claim 1; and

an image correction circuit for correcting an image created by the camera.

17. The electronic device of claim 16, wherein the image correction circuitry performs image correction processing to improve sharpness of an image.

18. The electronic device of claim 17, wherein the image correction circuit is integrated in an imaging sensor.

19. The electronic device of claim 17, wherein the image correction circuitry is incorporated in a wiring layer.

Technical Field

The present disclosure relates to an imaging apparatus and an electronic apparatus.

Background

Today, the display of the electronic device may be transparent, and therefore the camera to be photographed may also be placed behind the display to provide a larger area for the display on the front surface of the electronic device. However, the light from the display to the camera is affected by the optical characteristics of the display. Therefore, if a picture is taken by a camera behind the display, the image quality of the picture will be degraded due to optical interference caused by the display.

The disturbance is mainly reflection at the display or diffraction due to wiring of wiring layers of the display. In particular, diffraction causes severe ugly artifacts on images captured by cameras, and there is no effective solution to this problem today.

Disclosure of Invention

The present disclosure is directed to solving at least one of the above technical problems. Accordingly, the present disclosure needs to provide an imaging apparatus and an electronic apparatus.

The image forming apparatus may include:

a display including a wiring layer;

a camera located on a back side of the display, the camera including an optical lens and an imaging sensor that senses light passing through the display to produce an image;

an optical element between the display and the camera, wherein the optical element filters light passing through the display and passes the filtered light to the camera, and the optical element reduces diffraction due to the wiring layer.

In some embodiments, the optical element may include an optical mask having a mask region for shielding light from the display to the camera, and a mask pattern of the mask region corresponds to a wiring pattern of the wires of the wiring layer.

In some embodiments, the optical mask may further include: a transparent region to pass light from the display to the camera; and a gradation region partially passing light from the display to the camera, wherein a transmittance of the light in the gradation region gradually increases as approaching the transparent region from the mask region.

In some embodiments, the mask pattern of the mask region may coincide with the wiring pattern of the wire.

In some embodiments, the mask region of the mask pattern may be provided for every other row of the wires of the wiring pattern.

In some embodiments, a mask region of a mask pattern may be provided for a plurality of wires of a wiring pattern of a wiring layer.

In some embodiments, the mask area may be enlarged in the latter area around the intersection of the wires.

In some embodiments, the mask region may be formed in a rear region around the intersection of the conductive lines, and the mask region may not be formed in other regions.

In some embodiments, the optical element may be attached to the display.

In some embodiments, the optical element may be incorporated into a display.

In some embodiments, the optical element may include a diffuser to diffuse light from the display to the camera.

In some embodiments, the optical element may further comprise a diffuser to diffuse light from the display to the camera.

In some embodiments, the optical element may flatten the back of the wiring layer of the display.

In some embodiments, the optical element may be filled into the recessed portion of the wiring layer.

In some embodiments, the camera may be placed in a middle region of the display.

The electronic device may include:

the image forming apparatus according to the above disclosure; and

an image correction circuit for correcting an image created by the camera.

In some embodiments, the image correction circuitry may perform image correction processing to improve the sharpness of the image.

In some embodiments, the image correction circuitry may be integrated in the imaging sensor.

In some embodiments, the image correction circuitry may be incorporated in the routing layer.

Drawings

These and/or other aspects and advantages of embodiments of the present disclosure will become apparent and more readily appreciated from the following description, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the invention;

FIG. 2 is a cross-sectional view taken along line II-II of the electronic device of FIG. 1;

FIG. 3 is a cross-sectional view taken along line II-II of the electronic device of FIG. 1 and showing an example of incorporating image correction circuitry in a wiring layer of a display;

FIG. 4 is a cross-sectional view taken along line II-II of the electronic device of FIG. 1 and illustrates an example of integrating an image correction circuit in an image sensor of a camera;

fig. 5 shows an example of a wiring pattern of a wiring layer of a display;

FIG. 6 shows a partial cross-sectional view of a display to illustrate the light diffraction phenomenon;

fig. 7 shows a partial cross-sectional view of the wiring and optical elements of the wiring layer of the display according to the first embodiment to illustrate the reduction of light diffraction;

fig. 8 shows a partial enlarged sectional view of an optical element according to the first embodiment;

FIG. 9 is an enlarged partial plan view showing the routing of the routing layers of the optical element and the display;

FIG. 10 shows a graph of the transmittance of light for the optical element shown in FIG. 8;

FIG. 11 shows a partially enlarged plan view of another example of an optical element;

FIG. 12 shows a partial enlarged plan view of another example of an optical element;

FIG. 13 shows a partially enlarged plan view of another example of an optical element;

FIG. 14 shows an example of attaching an optical element to a display;

FIG. 15 shows an example of printing an optical element on the back side of a display;

fig. 16 shows a cross-sectional view of an electronic device according to a second embodiment;

fig. 17 shows a partial cross-sectional view of a wiring and an optical element according to the second embodiment to illustrate reduction of light diffraction;

fig. 18 shows a cross-sectional view of a combined electronic device according to the first and second embodiments;

fig. 19 shows a cross-sectional view of an electronic device according to another combination of the first and second embodiments;

fig. 20 shows a cross-sectional view of an electronic device according to a third embodiment;

FIG. 21 shows an enlarged partial cross-sectional view of a display and an optical element according to a third embodiment;

FIG. 22 shows an enlarged partial cross-sectional view of a display and modified optical element according to a third embodiment; and

fig. 23 shows a schematic plan view of an electronic apparatus according to a modification of the first to third embodiments.

Detailed Description

Embodiments of the present disclosure will be described in detail, and examples of the embodiments will be shown in the accompanying drawings. Throughout the specification, the same or similar elements and elements having the same or similar functions are denoted by the same reference numerals. The embodiments described herein with reference to the drawings are illustrative and are intended to be exemplary of the present disclosure, but should not be construed as limiting the present disclosure.

Fig. 1 shows an electronic device 10 according to an embodiment of the disclosure, and fig. 2 shows a cross-sectional view taken along line II-II of the electronic device of fig. 1. In other words, fig. 1 shows a layout of a front view of the electronic device 10.

As shown in fig. 1 and 2, the electronic device 10 may include a display 20, a camera 30, and an optical element 40 between the display 20 and the camera 30.

In an embodiment of the present disclosure, the electronic device 10 is a mobile device, in particular a smartphone device. However, the electronic device 10 may be a variety of devices, such as a multi-function mobile device, a laptop computer, a desktop computer, a tablet computer, and so forth.

In an embodiment, the display 20 may be made of an Organic Light Emitting Diode (OLED). The display 20 is substantially transparent and covers substantially all of the area of the front surface of the electronic device 10. Display 20 may include a light emitting layer 22 and a wiring layer 24. The light emitting layer 22 emits red, green, and blue light to produce various images and characters on the front surface of the display 20. The front surface of the display 20 may be coated with an anti-reflective material. That is, an anti-reflection layer may be formed on the front surface of the display 20.

The wiring layer 24 is a substrate forming the display 20, and includes a plurality of wirings in a predetermined wiring pattern. That is, the electric wire is arranged in the wiring layer 24 to supply power to the organic light emitting diode of the light emitting layer 22. In an embodiment, the wires are arranged in a lattice.

The display 20 is not limited to a display formed of an organic light emitting diode, but may be formed of other kinds of transparent displays such as a Liquid Crystal Display (LCD) and the like.

The camera 30 is located behind the display 20. Thus, the camera 30 is an embedded camera that is not visible to the user of the electronic device 10. The camera 30 may be placed anywhere below the display 20. In an embodiment, the camera is located on the back of the display 20 and is located in the center of the upper region of the electronic device 10 of fig. 1.

The camera 30 includes an optical lens 32 and an imaging sensor 34. The optical lens 32 collects light that has passed through the display 20 and focuses the light on the imaging sensor 34. The imaging sensor 34 senses the light to create an image.

In addition, the electronic device 10 according to the embodiment may further include an optical element 40 between the display 20 and the camera 30. In other words, the optical element 40 is interposed between the display 20 and the camera 30. The optical element 40 filters light passing through the display 20 and passes the filtered light to the camera 30. Furthermore, the optical element 40 reduces optical interference based on the display 20. More particularly, in embodiments, optical element 40 has an optical mask with a particular mask pattern or optical characteristics to attenuate diffraction due to wiring layer 24 of display 20. The display 20, the camera 30 and the optical element 40 constitute an imaging device in an embodiment. Of course, the imaging device may include other elements besides the display 20, the camera 30, and the optical element 40.

In addition, the electronic device 10 according to the embodiment may further include an image processing circuit 50 that processes an image acquired by the imaging sensor 34 of the camera 30. That is, the image acquired from the camera 30 is subjected to the image correction processing by the image processing circuit 50.

The sharpness of the image will be reduced due to the optical element 40, the optical lens 32 and/or the display 20. In the embodiment, the image correction process of the image processing circuit 50 recovers the deterioration of the image to improve the sharpness.

The image correction circuit 50 may be placed inside the electronic device 10 or outside the electronic device 10. When the image correction circuit 50 is internal to the electronic device 10, the image correction circuit 50 may be incorporated in the wiring layer 24, as shown in fig. 3, or the image correction circuit 50 may also be integrated in the imaging sensor 34, as shown in fig. 4. When the image correction circuit 50 is incorporated in the wiring layer 24, as shown in fig. 3, an image processing unit for processing an image captured by the camera 30 may perform the image correction processing, or a main CPU (central processing unit) for processing various programs may perform the image correction processing. That is, the image correction circuit 50 may be realized by various circuits such as a main processing unit, a main CPU, and the like.

When the image correction circuit 50 is external to the electronic device 10, a computer connected to the electronic device 10 may perform the image correction process. In this case, the computing mechanism connected to the electronic device 10 is the image correction circuit 50.

During the image correction process, in order to improve the sharpness of the image generated by the camera 30, a sharpening process is performed by using a PSF (point spread function) also called an inverse filter process. In more detail, the image correction circuit 50 may perform the image sharpening process based on the optical characteristics of the optical element 40, which may be represented by the PSF. The blur of the image captured by the camera 30 can be improved by the image sharpening process. For example, the image sharpening process emphasizes the edge of the image by using an inverse filter made of a PSF based on the optical characteristics of the optical element 40. Further, during the image correction process, in order to increase the brightness of the image generated by the camera 30, global contrast adjustment is also performed.

In the embodiment of the present disclosure, the image correction circuit 50 is not always required. That is, the image circuit 50 may be omitted in the embodiment of the present disclosure. For example, if the degradation of the image generated by the imaging sensor 34 is not so strong and the image quality is good enough for the user, the image correction circuit 50 may be omitted. Having described the basic structure of the electronic device 10 according to embodiments of the present disclosure, next, several embodiments of the optical element 40 for the electronic device 10 will be described below.

[ first embodiment ]

In the first embodiment, the optical element 40 of the electronic device 10 is configured to include an optical mask having a transparent region, a gradation region, and a mask pattern corresponding to a wiring pattern of the wires of the wiring layer 24. As will be described in more detail below.

Fig. 5 shows an example of a wiring pattern of the wiring layer 24, and fig. 6 shows a partial cross-sectional view of the display 20 to explain a diffraction phenomenon when light passes through the wiring layer 24.

As shown in fig. 5 and 6, the light emitting layer 22 and the wiring layer 24 are substantially transparent, but the wiring layer 24 has wires 26 in a lattice shape. The function of the wires 26 is to provide power to the electronic components in the light-emitting layer 22. Although the wires 26 are also substantially transparent, the wires 26 are an obstacle for light to pass through the wiring layer 24 when the camera 30 captures an image through the display 20.

Naturally, the light passing through the display 20 is affected by the optical characteristics of the display 20, in particular the obstruction of the wires 26. That is, the light has the characteristics of waves, and the waves interfere with each other after passing through the wiring layer 24 including the wires 26. The interference causes diffraction artifacts on the image produced by the camera 30. That is, if the user takes a picture through the camera 30 behind the display 20, the quality of the image will unfortunately deteriorate due to light interference caused by the display 20.

Under normal conditions, the disturbance is mainly diffraction at the obstacles of the wires 26 in the wiring layer 24. This diffraction causes severe ugly artifacts on the image produced by the camera 30. Therefore, it would be technically advantageous to improve the quality of the image captured by the camera 30 if the diffraction of the light could be reduced before the camera 30 senses the light.

Thus, the electronic device 10 according to the first embodiment includes the optical element 40, filters light passing through the display 20, and passes the filtered light to the camera 30. The optical element 40 reduces diffraction of light due to the wires 26 of the wiring layer 24.

Fig. 7 shows a partial sectional view of the wire 26 and the optical element 40 according to the first embodiment, fig. 8 shows an enlarged sectional view of the optical element 40, and fig. 9 shows a partial enlarged plan view of the optical element 40. Furthermore, fig. 10 shows a graph of the transmittance of light of the optical element 40 according to the first embodiment.

As shown in fig. 7 to 10, the mask pattern of the optical element 40 corresponds to the wiring pattern of the wires 26 of the wiring layer 24. More particularly, optical element 40 may be an optical mask that includes a clear region 42, a gradation region 44, and a mask region 46. The transparent region 42 passes light from the display 20 to the camera 30. The mask area 46 shields light from the display 20 so the mask area 46 does not pass light from the display 20 to the camera 30. The fade area 44 partially passes light from the display 20 to the camera 30. In addition, the transmittance of light in gradation region 44 gradually changes from transparent region 42 to mask region 46.

In particular, as shown in fig. 10, in gradation region 44, the transmittance of the portion adjacent to mask region 46 is substantially zero, i.e., the transmittance thereof is equal to the transmittance of the mask region. The transmittance of light of gradation region 44 gradually increases as it approaches transparent region 42 from mask region 46. Then, in the gradation region 44, the transmittance of a portion adjacent to the transparent region 42 is substantially 100%, that is, the transmittance thereof is equal to that of the transparent region. Fig. 10 shows only the ideal characteristics of the optical element 40, and thus the actual characteristics of the optical element 40 may be different from the graph of fig. 10.

Further, as shown in fig. 9, the mask pattern of the mask region 46 of the first embodiment corresponds to the wiring pattern of the wires 26 in the wiring layer 24. In other words, the mask pattern of the mask region 46 of the optical element 40 coincides with the wiring pattern of the wires 26 of the wiring layer 24. Therefore, the mask pattern of the mask region 46 is a lattice pattern, and the same manner as the wiring pattern of the wires 26. That is, in the first embodiment, the optical element 40 is aligned to cover the wire 26 with the masked region 46.

As shown in fig. 7, diffraction is reduced due to the optical element 40. That is, when light is transmitted between the wires 26, interference of the waves of the light is reduced, and thus less diffraction can be expected.

The mask pattern of the optical element 40 is not limited to the mask pattern of fig. 9, but various mask patterns of the optical element 40 may be employed. For example, as shown in fig. 11, which corresponds to a plan view of the optical element 40 of fig. 9, a portion of the mask region 46 may be omitted. In the example of fig. 11, mask regions 46 are provided for every other row of wires 26 in wiring layer 24. The optical element 40 of fig. 11 can also attenuate diffraction in the same manner as the optical element 40 of fig. 9. Although the attenuation effect on the diffraction of the optical element 40 of fig. 11 is smaller than that of fig. 9, the degradation of the image due to the optical element 40 of fig. 11 may be smaller than that of fig. 9.

In general, the plurality of wires 26 of the wiring pattern of the wiring layer 24 may be provided with a mask region 46 of a mask pattern. That is, one row of the mask region 46 of the mask pattern may be provided for every three, four, and more wires 26 of the wiring pattern of the wiring layer 24.

For another example, as shown in FIG. 12, which corresponds to a plan view of optical element 40 of FIG. 9, mask region 46 may be enlarged in the posterior region around the intersection of wires 26. In other words, the transparent regions 42 are circular, and the regions between the circular transparent regions 42 are mask regions 46.

It is believed that the crossing points of the wires 26 cause more significant diffraction than other portions of the wires 26. Thus, the optical element 40 of FIG. 12 may reduce more diffraction than the optical element 40 of FIG. 9.

For another example, as shown in fig. 13, corresponding to the plan view of optical element 40 of fig. 12, mask regions 46 of optical element 40 may be formed in the rear regions around the intersection of wires 26, but mask regions 46 of optical element 40 are not formed in other regions. That is, the mask region 46 of the optical element 40 is not formed in the region behind the other portions of the wires 26 except for the intersection.

Although the reduction in diffraction caused by the optical element 40 of fig. 13 will be less than the reduction in diffraction caused by the optical element 40 of fig. 12, the sharpness of the image filtered by the optical element 40 of fig. 13 is better than that filtered by the optical element 40 of fig. 12. Since the intersections of the wires 26 generate significant diffraction, the optical element 40 can reduce diffraction and suppress the side effect of the decrease in definition on the image.

As understood from the above description of the optical element 40, the mask pattern of the mask region 46 corresponding to the wiring pattern of the wires 26 does not mean that the mask pattern of the mask region 46 completely coincides with the wiring pattern of the wires 26. In the present disclosure, the mask pattern of the mask region 46 corresponding to the wiring pattern of the wires 26 means that the mask pattern of the mask region 46 is associated with the wiring pattern of the wires 26 to attenuate diffraction.

Further, in the embodiments of the present disclosure, although the optical element 40 is located between the display 20 and the camera 30, the location of the optical element 40 between the display 20 and the camera 30 is optional. For example, as shown in fig. 14, an optical element 40 may be attached to the display 20. In fig. 14, optical element 40 is attached to and behind wiring layer 24 of display 20. In this case, the optical element 40 may be placed as close as possible to the wire 26. In addition to this, the display 20 and the optical element 40 are produced separately, and the optical element 40 may be attached to the display 20 afterwards.

Alternatively, as shown in FIG. 15, the optical element 40 may be incorporated into the display 20. For example, optical element 40 may be fabricated by printing a mask pattern on the back side of wiring layer 24 of display 20. That is, the mask region 46 and the gradation region 44 of the mask pattern of the optical element 40 may be made of printing ink. For example, the mask area 46 may be printed by a dark black ink. The gradation region 44 is printed by a combination of light black ink and transparent ink such that the transmittance of light gradually increases as it approaches the transparent region 42 from the mask region 46. Otherwise, mask region 46 and gradation region 44 may be made of a material that replaces black ink to absorb light passing through display 20.

In addition, the transparent regions 42 may be constituted by spaces between the gradation regions 44. That is, nothing is printed on the back surface of the wiring layer 24 in the transparent region 42.

In the optical element 40 of fig. 15, the manufacturer needs to produce the display 20 on which the optical element 40 is combined, but an assembly process of inserting the optical element 40 between the display 20 and the camera 30 may be omitted. In addition, if the transparent area 42 is composed of space, i.e., air, the transparent area 42 may perfectly transmit light from the display 20 to the camera 30. However, the transparent region 42 may be made of any transparent material. For example, the transparent region 42 may be formed by printing a transparent ink on the back surface of the wiring layer 24. Otherwise, the transparent region 42 in fig. 15 may be created using the same material as the transparent region 42 of the optical element 40 of fig. 14.

As described above, since the optical mask of the optical element 40 is interposed between the display 20 and the camera 30, diffraction due to the wires 26 of the wiring layer 24 can be reduced. Thus, it is possible to reduce diffraction artifacts generated on the image obtained by the camera 30.

Incidentally, the number of layers of the optical element 40 is not limited to one layer. That is, optical element 40 may include a plurality of stacked photomasks, each photomask having a clear region 42, a graded region 44, and a mask region 46.

[ second embodiment ]

In the electronic device 10 according to the second embodiment, the optical element 40 comprises a diffraction reducing diffuser instead of an optical mask whose mask pattern corresponds to the pattern of the conductive lines 26. Hereinafter, differences from the first embodiment will be explained.

Fig. 16 shows a cross-sectional view taken along line II-II of the electronic device 10 of fig. 1, corresponding to fig. 2 of the first embodiment. As shown in fig. 16, the camera 30 includes an optical element 40, and the optical element 40 includes a diffuser for attenuating diffraction. That is, the diffuser of the optical element 40 is located between the display 20 and the camera 30. As mentioned in the first embodiment, the image correction circuit 50 may be placed inside the electronic device 10 or outside the electronic device 10. The structure of the electronic device 10 other than the optical element 40 is substantially the same as that of the first embodiment described above.

Fig. 17 shows a partial cross-sectional view of a wire 26 and an optical element 40 according to a second embodiment, corresponding to fig. 7 of the first embodiment.

As shown in fig. 17, the optical element 40 is used to diffuse light from the display 20 to the camera 30. In this embodiment, the optical element 40 is formed by a ground glass filter to scatter light waves passing through the display 20. As a result, diffraction of light can be prevented.

On the other hand, according to the optical element 40 shown in fig. 17, the image produced by the camera 30 will become blurred due to the diffusion of the optical element 40. That is, the diffuser of the optical element 40 reduces the sharpness of the image. This is a side effect of the diffuser of the optical element 40. Therefore, the image correction circuit 50 needs to compensate for a blurred image by the image correction processing.

More specifically, the image correction circuit 50 performs a sharpening process by using a PSF, which is an inverse filter process. In addition, the image correction circuit 50 also performs global contrast adjustment on the image. In other words, in the second embodiment, a combination of the diffuser of the optical element 40 and the compensation process of the image correction circuit 50 is necessary for creating a clear image.

However, if the diffusion of the optical element 40 is not significant, the compensation process of the image correction circuit 50 may be omitted.

As described above, since the optical element 40 includes the diffuser, the optical element 40 can prevent diffraction due to the wires 26 of the wiring layer 24. Accordingly, diffraction artifacts generated on the image obtained by the camera 30 can be reduced.

Incidentally, the number of layers of the optical element 40 is not limited to one layer. That is, optical element 40 may include a plurality of diffusion layers superimposed, each diffusion layer diffusing light passing through display 20.

In addition, the image forming apparatus of the second embodiment may be combined with the image forming apparatus of the first embodiment. As shown in fig. 18, in the combination of the first embodiment and the second embodiment, the optical element 40 may include a diffuser 40a according to the second embodiment and an optical mask 40b according to the first embodiment. Diffuser 40a is located on the front side of display 20 and photomask 40b is located on the back side of display 20.

As shown in fig. 19, in comparison with the electronic device 10 of fig. 18, the optical mask 40b according to the first embodiment may be located at the front side of the display 20, and the diffuser 40a according to the second embodiment may be located at the rear side of the display 20.

[ third embodiment ]

In the electronic apparatus 10 according to the third embodiment, the optical element 40 is incorporated in the wiring layer 24 of the display 20. Hereinafter, differences from the first embodiment will be explained.

Fig. 20 shows a cross-sectional view taken along line II-II of the electronic device 10 of fig. 1, corresponding to fig. 2 of the first embodiment. As shown in fig. 20, a diffraction-reducing optical element 40 is incorporated in the wiring layer 24 of the display 20.

Fig. 21 shows a partial cross-sectional view of a display 20 and an optical element 40 according to a third embodiment. As shown in fig. 21, the display 20 is made of an OLED, and the light emitting layer 22 and the wiring layer 24 are substantially transparent, but the back surface of the wiring layer 24 is not flat. That is, the wires 26 project toward the direction of travel of light through the display 20. The uneven back surface of the wiring layer 24 causes diffraction of light. Here, the back surface of wiring layer 24 is the back surface of wiring layer 24 of display 20.

Therefore, in the electronic apparatus 10 of the third embodiment, the optical element 40 is interposed between the display 20 and the camera 30, but the optical element 40 is incorporated in the display 20. Here, it can also be explained that the optical element 40 is placed between the display 20 and the camera 30.

Optical element 40 covers the uneven back surface of wiring layer 24 of display 20. In other words, the recess of the wiring layer 24 is filled with the optical element 40. The optical element 40 is made of a transparent material, and filters and transmits light from the display 20 to the camera 30.

The material of the optical element 40 may be filled into the recessed portion of the wiring layer 26, but the materials in the recessed portion of the wiring layer 26 may be connected to each other as shown in fig. 21. In other words, the back surface of wiring layer 24 is covered with the material of optical element 40.

In contrast to fig. 21, the materials in the recessed portions may not be connected to each other, as shown in fig. 22. That is, by filling the material of the optical element 40 into the concave portion of the wiring layer 26, it is sufficient to planarize the back surface of the wiring layer 26 to reduce diffraction due to the uneven back surface of the wiring layer 26.

As described above, since the optical element 40 makes the back surface of the display 20 flat, the optical element 40 can prevent diffraction due to the uneven back surface formed by the wires 26. Accordingly, diffraction artifacts generated on the image obtained by the camera 30 can be reduced.

[ modifications of the first, second and third embodiments ]

Since the display 20 is comprised of a transparent display, the camera 30 may be placed anywhere in the electronic device 10. For example, as shown in fig. 23 showing a plan view of the electronic apparatus 10 according to the modifications of the first embodiment, the second embodiment and the third embodiment, the camera 30 may be placed in a middle area of the electronic apparatus 10 corresponding to fig. 1. In particular, in the present modification, the camera 30 is placed in the center of the electronic device 10.

According to the electronic device 10 of the first to third embodiments, the camera 30 can be mounted behind the display 20 without unsightly artifacts caused by diffraction. This enables the camera 30 to be placed anywhere behind the display 20, and this may make it possible to take a natural eyepoint self-portrait without any expensive calculations.

More specifically, if the camera 30 is mounted in the upper area of the electronic device 10 as shown in fig. 1, the eyepoint of the self-timer image IM1 may be unnatural as shown in fig. 23. On the other hand, if the camera 30 is mounted in the middle area of the electronic device 10 as shown in fig. 23, the eyepoint of the self-timer image IM2 may be natural. Here, the middle area does not necessarily mean that the camera 30 is installed at the center of the electronic device 10. That is, the camera 30 may be placed around the center of the electronic device 10 to obtain the self-portrait image IM2 with a natural eyepoint. In other words, the middle area refers to an area including the center of the electronic device 10 and the peripheral area of the center of the electronic device 10. The distance between the eye position displaying the face and the camera 30 in the case where the camera 30 is located in the middle area is smaller than in the case where the camera 20 is located in the upper area of the electronic device 10. Therefore, the user of the electronic apparatus 10 can easily take a self-portrait image with a natural eyepoint.

Further, the electronic device 10 of fig. 23 is a full-coverage display smartphone. There is no area on the front surface of the display 20 for allocating the camera 30, so a wider area for the display 20 may be implemented on the front surface of the electronic device 10.

In the description of embodiments of the present disclosure, it should be understood that terms such as "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "upper," "lower," "inner," "outer," "clockwise," and "counterclockwise" should be interpreted as referring to the orientation or position as shown in the drawing under description or discussion. These relative terms are used merely to simplify the description of the present disclosure and do not indicate or imply that the devices or elements involved must have a particular orientation or be constructed or operated in a particular orientation. Accordingly, these terms should not be construed to limit the present disclosure.

In addition, terms such as "first" and "second" are used herein for descriptive purposes and not to indicate or imply relative importance or importance, or to imply a number of technical features that are indicated. Thus, a feature defined by "first" and "second" may include one or more of that feature. In the description of the present disclosure, "plurality" means two or more unless otherwise specified.

In the description of the embodiments of the present disclosure, unless specified or limited otherwise, the terms "mounted," "connected," "coupled," and the like are used broadly and can be, for example, a fixed connection, a detachable connection, or an integral connection; or may be mechanically or electrically connected; or may be directly or indirectly connected through intervening structures; or an internal communication of the two elements, as the skilled person will understand from the specific case.

In embodiments of the present disclosure, unless specified or limited otherwise, a structure in which a first feature is "on" or "under" a second feature may include an embodiment in which the first feature is in direct contact with the second feature, and may also include an embodiment in which the first feature and the second feature are not in direct contact with each other, but are in contact with additional features formed therebetween. Furthermore, a first feature "on," "over," or "uppermost" a second feature may include embodiments in which the first feature is to the right of, or diagonally "on," "over," or "uppermost" the second feature, or simply means that the height of the first feature is greater than the height of the second feature; and a first feature being "below," "beneath," or "bottom" a second feature may encompass embodiments in which the first feature is "below," "beneath," or "bottom" the second feature, or simply means that the first feature is at a lower elevation than the second feature.

Various embodiments and examples are provided in the above description to implement different configurations of the present disclosure. Certain elements and arrangements are described above to simplify the present disclosure. However, these elements and arrangements are merely exemplary and are not intended to limit the present disclosure. Additionally, reference numerals and/or reference letters in different examples in the present disclosure may be repeated. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations. Further, examples of different processes and materials are provided in this disclosure. However, one skilled in the art will appreciate that other processes and/or materials may also be applied.

Reference throughout this specification to "one embodiment," "some embodiments," "an example embodiment," "one example," "a particular example," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. Thus, the appearances of the foregoing phrases or examples throughout this specification are not necessarily referring to the same embodiment or example of the present disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Any process or method described in process figures or otherwise herein may be understood as including one or more modules, segments, or portions of code which may be executable instructions for implementing specific logical functions or steps in the process, and the scope of the preferred embodiments of the present disclosure includes other implementations, it being understood by those skilled in the art that functions may be implemented in an order other than that shown or discussed, including in substantially the same order or in reverse order.

The logic and/or steps described otherwise herein or shown in the process diagrams, e.g., as a particular sequence of executable instructions for implementing logical functions, may be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, e.g., a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples of the computer readable medium include, but are not limited to: an electronic connection (electronic device) having one or more wires, a portable computer housing (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the paper or other suitable medium can be optically scanned and then edited, decrypted, or otherwise processed in other suitable ways, for example, and the program can be stored in a computer memory when electronically captured, via, for instance, an optical transceiver.

It should be understood that each part of the present disclosure can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, then, in another embodiment as well, the steps or methods may be implemented by one or a combination of the following techniques known in the art: a discrete logic circuit having a logic gate circuit for realizing a logic function of a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.

Those skilled in the art will appreciate that all or part of the steps in the above-described exemplary methods of the present disclosure may be implemented by using program command-related hardware. The program may be stored in a computer readable storage medium and when run on a computer comprises one or a combination of the steps in the method embodiments of the present disclosure.

In addition, each functional unit of the embodiments of the present disclosure may be integrated in a processing module, or these units may exist separately physically, or two or more units are integrated in a processing module. The integration module may be implemented in the form of hardware or in the form of a software functional module. When the integrated module is implemented in the form of a software functional module and sold or used as a separate product, the integrated module may be stored in a computer-readable storage medium.

The storage medium may be a read-only memory, a magnetic disk, a CD, etc.

Although embodiments of the present disclosure have been shown and described, it will be understood by those skilled in the art that these embodiments are illustrative and should not be construed as limiting the present disclosure, and that changes, modifications, substitutions, and alterations may be made to these embodiments without departing from the scope of the present disclosure.