阅读说明：本技术 阳极污泥清除装置、清除方法及清除系统 (Anode sludge removing device, removing method and removing system ) 是由 陈笃全 陈启文 于 2019-11-15 设计创作，主要内容包括：本发明公开了一种阳极污泥清除装置,包括阳极隔离件、收集管路及输送装置,阳极隔离件用于套在镀层金属外,阳极隔离件的底部设有允许阳极污泥穿出的排污孔,收集管路开设有插接口,阳极隔离件的底部由插接口插在收集管路,阳极隔离件中的阳极污泥可以经由排污孔排入收集管路,然后通过输送装置输送电镀液至收集管路,利用电镀液的流速携带阳极污泥排出收集管路,实现电镀设备的阳极污泥的清除,提高了待镀工件的镀层金属厚度的均匀度,且无需频繁更换阳极隔离件。另,本发明还公开阳极污泥清除装置的清除方法,其根据电镀设备的状态控制输送装置以相应的模式输出电镀液来进行阳极污泥清除。此外,本发明还公开一种阳极污泥清除系统。(The invention discloses an anode sludge removing device which comprises an anode separator, a collecting pipeline and a conveying device, wherein the anode separator is used for being sleeved outside a plating metal, a sewage discharge hole allowing anode sludge to penetrate out is formed in the bottom of the anode separator, an inserting port is formed in the collecting pipeline, the bottom of the anode separator is inserted into the collecting pipeline through the inserting port, the anode sludge in the anode separator can be discharged into the collecting pipeline through the sewage discharge hole, then electroplating solution is conveyed to the collecting pipeline through the conveying device, the anode sludge is carried by the flow velocity of the electroplating solution and discharged out of the collecting pipeline, the anode sludge of electroplating equipment is removed, the uniformity of the plating metal thickness of a workpiece to be plated is improved, and the anode separator does not need to be frequently replaced. In addition, the invention also discloses a clearing method of the anode sludge clearing device, which controls the conveying device to output electroplating solution in a corresponding mode according to the state of the electroplating equipment to clear the anode sludge. In addition, the invention also discloses an anode sludge removal system.)

1. The utility model provides an anode sludge removal device for the positive pole of clearance electroplating device, its characterized in that, anode sludge removal device includes positive pole separator, collection pipeline and conveyor, the positive pole separator is used for the cover to pierce through outside cladding material metal and can supply the plating solution, the bottom of positive pole separator is equipped with the blowoff hole that allows anode sludge to wear out, the interface that runs through its pipe wall is seted up to the collection pipeline, the bottom of positive pole separator by the interface is inserted collect the pipeline, conveyor be used for carrying the plating solution extremely collect the pipeline, with through the plating solution carries anode sludge to discharge collect the pipeline.

2. The anode sludge removing device of claim 1, wherein the anode separator comprises an anode basket for loading the plated metal and a filter bag sleeved outside the anode basket, the bottom of the anode basket is provided with the sewage discharge hole, and the bottom of the filter bag is opened to expose the sewage discharge hole.

3. The anode sludge removing device according to claim 2, wherein the lower part of the filter bag is retracted inwards to form a joint part, the inner side of the joint part is tightly jointed with the outer wall of the anode basket, a sealing sleeve is sleeved outside the joint part, and the sealing sleeve is inserted into the insertion port.

4. The anode sludge removal apparatus of claim 1 wherein said delivery means comprises a fluid pump, said plating solution being pressurized by said fluid pump and delivered to said collection line.

5. The anode sludge removal apparatus of claim 1, further comprising an auxiliary delivery device comprising an auxiliary delivery pipe hermetically connected to an opening in a wall of the collection pipe to output plating solution to the collection pipe when plating solution supplied from the delivery device is insufficient to carry anode sludge out of the collection pipe.

6. The anode sludge removal apparatus of claim 1, further comprising a filtering device connected to the delivery device, the filtering device being configured to filter the plating solution carrying the anode sludge discharged from the collection line and deliver the filtered plating solution to the delivery device.

7. A method of removing the anode sludge removing apparatus according to any one of claims 1 to 6, comprising:

judging whether the preset clearing time is reached and/or whether the using current amount of the electroplating equipment reaches the preset current amount;

if yes, acquiring whether the electroplating equipment works;

and if the anode sludge is not discharged, the conveying device is controlled to continuously convey the electroplating solution to the collecting pipeline so as to discharge the anode sludge quickly.

8. The method for removing anode sludge according to claim 7, wherein the preset current amount and the preset removal time are reset after controlling the delivery means to output the plating solution.

9. An electronic device, comprising:

a processor, a memory, and one or more computer programs stored in the memory and configured to be executed by the processor, which when executed by the processor, performs the cleaning method of the anode sludge cleaning apparatus of claim 7.

10. An anode sludge removal system comprising an electronic device and the anode sludge removal device of any one of claims 1-6, the electronic device comprising a processor, a memory, and one or more computer programs stored in the memory and configured to be executed by the processor, the processor when executing the computer programs performing the removal method of the anode sludge removal device of claim 7.

Technical Field

The invention relates to the technical field of anode cleaning of electroplating equipment, in particular to an anode sludge cleaning device, a cleaning method and an anode sludge cleaning system.

Background

In the electroplating equipment, a coating metal is connected with an anode, a workpiece to be plated is connected with a cathode, metal ions in an electroplating solution are attracted to the cathode by applying voltage between the anode and the cathode, and meanwhile, the coating metal is dissolved to release the metal ions so that the electroplating process is continuously carried out until the coating metal with enough thickness is deposited on the workpiece to be plated. Because the small particles formed by the decomposition of the plating metal in the electroplating process do not directly contact the anode and can not completely release metal ions, the oxide film on the surface of the plating metal in the electroplating process is dissolved and falls off, impurities carried by the plating metal can form anode sludge, and in order to isolate the anode sludge and prevent the anode sludge from polluting electroplating solution, an anode filter bag is usually sleeved outside the plating metal in the prior art.

However, as the service time of the anode filter bag increases, the anode sludge is stacked below the anode filter bag to reduce cations released below the anode filter bag, so that the thickness of a plating layer below a workpiece to be plated is insufficient; moreover, the polluted anode filter bag is easy to generate polarization action to influence the release and distribution of cations, so that the coating thickness of the workpiece to be coated is not uniform. At present, the anode is cleaned periodically (for example, once cleaning for 3 months) and the anode filter bag is frequently replaced to ensure the uniformity of the coating thickness of the workpiece to be plated, the anode is cleaned difficultly, and the anode filter bag is frequently replaced, so that the consumption of the anode filter bag is too high.

Therefore, it is desirable to provide an anode sludge removing apparatus, a removing method and a removing system capable of collecting and removing anode sludge.

Disclosure of Invention

The invention aims to provide an anode sludge removing device, a removing method and a removing system which can realize the collection and removal of anode sludge.

In order to achieve the purpose, the invention discloses an anode sludge removing device which is used for cleaning an anode of electroplating equipment and comprises an anode isolating piece, a collecting pipeline and a conveying device, wherein the anode isolating piece is used for being sleeved outside plating metal and can be penetrated by electroplating solution, a sewage discharge hole allowing the anode sludge to penetrate out is formed in the bottom of the anode isolating piece, an inserting port penetrating through the pipe wall of the collecting pipeline is formed in the collecting pipeline, the bottom of the anode isolating piece is inserted into the collecting pipeline through the inserting port, and the conveying device is used for conveying electroplating solution to the collecting pipeline so as to carry the anode sludge to be discharged out of the collecting pipeline through the electroplating solution.

Preferably, the anode separator comprises an anode basket for loading the plated metal and a filter bag sleeved outside the anode basket, the bottom of the anode basket is provided with the drain hole, and the bottom of the filter bag is opened to expose the drain hole.

Preferably, the lower part of the filter bag contracts inwards to form a joint part, the inner side of the joint part is tightly jointed with the outer wall of the anode basket, a sealing sleeve is sleeved outside the joint part, and the sealing sleeve is inserted into the insertion port.

Preferably, the delivery device comprises a liquid pump, and the plating solution is pressurized by the liquid pump and then delivered to the collection pipeline.

Preferably, the anode sludge removing device further comprises an auxiliary conveying device, wherein the auxiliary conveying device comprises an auxiliary conveying pipeline, the auxiliary conveying pipeline is hermetically connected to an opening on the pipe wall of the collecting pipeline, so as to output electroplating solution to the collecting pipeline when the electroplating solution supplied by the conveying device is insufficient to carry anode sludge out of the collecting pipeline.

Preferably, the anode sludge removing device further comprises a filtering device, the filtering device is connected to the conveying device, and the filtering device is used for filtering the electroplating solution carrying the anode sludge discharged from the collecting pipeline and conveying the filtered electroplating solution to the conveying device.

Compared with the prior art, the anode separator is provided with the sewage draining hole at the bottom, the bottom of the anode separator is inserted into the collecting pipeline, anode sludge in the anode separator can be discharged into the collecting pipeline through the sewage draining hole, then electroplating solution is conveyed through the collecting pipeline by the conveying device, and the anode sludge is discharged out of the collecting pipeline by utilizing the flow velocity of the electroplating solution, so that the anode sludge of electroplating equipment is removed, and the uniformity of the thickness of the coating metal of a workpiece to be plated is improved; the invention does not need to frequently replace the anode separator, thereby reducing the use of the anode separator.

In order to achieve the above object, the present invention discloses a cleaning method of the above anode sludge cleaning apparatus, comprising: judging whether the preset clearing time is reached and/or whether the using current amount of the electroplating equipment reaches the preset current amount; if yes, acquiring whether the electroplating equipment works; and if the anode sludge is not discharged, the conveying device is controlled to continuously convey the electroplating solution to the collecting pipeline so as to discharge the anode sludge quickly.

Preferably, the preset current amount and the preset purge time are reset after controlling the delivery device to output the plating solution.

When the preset removing condition is reached, the state of the electroplating equipment is judged, the conveying device is controlled to remove the anode sludge in a matched mode according to the state of the electroplating equipment, and when the electroplating equipment is in an idle state, the conveying device is controlled to continuously convey electroplating liquid, so that the anode sludge in the collecting pipeline is quickly discharged; when the electroplating equipment is in a working state, the conveying device is controlled to intermittently output the electroplating solution, so that the anode sludge in the collecting pipeline can be discharged without influencing the normal work of the electroplating equipment.

In order to achieve the above object, the present invention discloses an electronic device comprising: a processor, a memory, and one or more computer programs stored in the memory and configured to be executed by the processor, which when executed by the processor, perform the method of cleaning an anode sludge cleaning device as described above.

In order to achieve the above object, the present invention discloses a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements a cleaning method of an anode sludge cleaning apparatus as described above.

In order to achieve the above object, the present invention also discloses an anode sludge removal system, which comprises the electronic device as described above and the anode sludge removal device as described above.

Drawings

FIG. 1 is a schematic diagram of the composition structure of an anode sludge removal device according to an embodiment of the present invention.

Fig. 2 is a schematic view of the anode separator, the collecting pipe and the auxiliary conveying pipe of fig. 1 at another angle.

Fig. 3 is a perspective view of the anode separator of fig. 1.

Fig. 4 is an exploded view of the anode separator shown in fig. 3.

Fig. 5 is a partial sectional view of the anode separator and the collecting pipe shown in fig. 2.

FIG. 6 is a flow chart of a cleaning method of the anode sludge cleaning apparatus according to an embodiment of the present invention.

FIG. 7 is a block diagram of an electrical control system of the anode sludge removal system according to the embodiment of the present invention.

Detailed Description

The following detailed description is given with reference to the accompanying drawings for illustrating the contents, structural features, and objects and effects of the present invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "middle", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, and thus, should not be construed as limiting the scope of the present invention.

Referring to fig. 1 to 5, the present invention discloses an anode sludge removing apparatus 100, which is used for collecting and removing anode sludge (such as small particles formed by the coating metal being decomposed and peeled off, oxide film formed by the coating metal being dissolved and peeled off, impurities carried by the coating metal itself, etc.) generated by an anode of an electroplating device (not shown), so as to prevent the anode sludge from polluting the electroplating solution and ensure the uniform thickness of the coating metal on the workpiece to be plated. Specifically, the anode sludge removal device 100 comprises an anode separator 1, a collection pipeline 2 and a conveying device 3, wherein the anode separator 1 is used for being sleeved outside the coating metal, the anode separator 1 can be penetrated by the plating solution so that cations released by the coating metal can swim out of the anode separator 1, a plurality of sewage discharge holes 111 allowing the anode sludge to penetrate out are formed in the bottom of the anode separator 1, the collection pipeline 2 is provided with a socket 21 penetrating through the pipe wall of the collection pipeline, the bottom of the anode separator 1 is inserted into the collection pipeline 2 through the socket 21, and in the electroplating process, the anode sludge in the anode separator 1 can penetrate out of the anode separator 1 from the sewage discharge holes 111 and enter the collection pipeline 2; and conveyor 3 is received to the input mouth of pipe 22 of collection pipeline 2, and the plating solution that conveyor 3 carried gets into collection pipeline 2 by input mouth of pipe 22, and the plating solution carries anode sludge to discharge collection pipeline 2 by output pipe 23 of collection pipeline 2 when passing through collection pipeline 2 to the collection and the clearance of electroplating device's anode sludge have been realized.

Referring to fig. 3, in particular, the anode separator 1 includes an anode basket 11 for loading the plated metal and a filter bag 12 sleeved outside the anode basket 11, a drain hole 111 is formed at the bottom of the anode basket 11, and the bottom of the filter bag 12 is opened to expose the drain hole 111, so that the anode sludge in the anode basket 11 can be discharged into the collection pipe 2 through the drain hole 111. In this embodiment, the anode separator 1 has a double-layer structure, and is loaded with plating metal through the anode basket 11 (preferably, a titanium basket), and the filter bag 12 is sleeved on the periphery of the anode basket 11 to prevent anode sludge from entering the electroplating bath, so that the filter bag 12 can be prevented from being directly attached to the plating metal to affect the dissolution of the plating metal while the isolation of the anode sludge is realized, and the electroplating effect is ensured. Of course, in other embodiments, the anode separator 1 may have other structures as long as it can separate the anode sludge from the plating solution in the plating tank and discharge the anode sludge into the collection pipe 2 through the drain hole 111 at the bottom thereof.

Referring to fig. 2 to 4, specifically, the anode basket 11 has a clamping member 112 located at an upper portion thereof, the clamping member 112 includes a connecting portion 1121 fixed to an outer wall of the anode basket 11 and a clamping portion 1122 connected to a lower end of the connecting portion 1121, a gap is formed between the clamping portion 1122 and the anode basket 11, and the filter bag 12 is clamped between the clamping portion 1122 and the outer wall of the anode basket 11. In this embodiment, the anode basket 11 is fixed with the filter bag 12 by means of a clamp 112; when the anode basket 11 and the filter bag 12 are assembled, the filter bag 12 may be fitted over the anode basket 11 from the lower portion of the anode basket 11, and the upper portion of the filter bag 12 may be inserted into the gap between the clamping portion 1122 and the anode basket 11. Further, in the present embodiment, the wrapping tape 121 is provided on the outer wall of the filter bag 12, and when the anode sludge removing apparatus 100 is provided with a plurality of anode separators 1, the plurality of anode separators 1 are inserted side by side in the collecting pipe 2 and are mutually wrapped and fixed by the wrapping tape 121.

Referring to fig. 4 and 5, in particular, the lower portion of the filter bag 12 is retracted inward to form a joint portion 122, and the inner side of the joint portion 122 is tightly jointed with the outer wall of the anode basket 11. Further, the fitting portion 122 is externally fitted with a sealing sleeve 13, and the sealing sleeve 13 is inserted into the socket 21. As shown in fig. 5, the sealing sleeve 13 goes down beyond the anode separator 1 and the upper end edge of the sealing sleeve 13 is slightly lower than the upper end edge of the attaching portion 122. By means of the design of the joint portion 122 and the sealing sleeve 13, the anode sludge in the anode separator 1 can be prevented from leaking into the plating tank (not shown) at the insertion port 21. In addition, in order to avoid the pollution of the plating solution caused by the leakage of the anode sludge penetrating through the drain hole 111 into the plating tank, in this embodiment, the lower portion of the anode separator 1 penetrates into the collecting pipe 2 by the size matching of the anode separator 1 and the collecting pipe 2, and the bottom of the anode separator 1 is higher than the central axis of the collecting pipe 2, so that the anode sludge is ensured not to leak into the plating tank, and the anode separator 1 does not obstruct the plating solution from passing through the collecting pipe 2. Of course, in other embodiments, the anode separator 1 may be hermetically inserted into the collecting pipe 2 by other means, for example, by welding, applying a sealant, and the like, so that the anode separator 1 is hermetically connected to the insertion port 21, and therefore, the invention should not be limited thereto.

Referring to fig. 1, specifically, the conveying device 3 includes a liquid pump 31 and a conveying pipeline 32, an input pipe of the conveying pipeline 32 is connected to a liquid outlet of the liquid pump 31, and the plating solution is pressurized by the liquid pump 31 and then conveyed to the collecting pipeline 2 through the conveying pipeline 32. In this embodiment, the plating liquid is pressurized by the liquid pump 31 to take away the anode sludge in the delivery pipe 32 with the flow rate of the plating liquid; of course, the liquid pump 31 pressurizes the plating liquid so that the plating liquid has a sufficiently large flow rate to flush away the anode sludge, and the anode sludge is not carried by the plating liquid due to the excessive pressure and flows back into the anode separator 1 through the drain hole 111.

Referring to fig. 1, in particular, the anode sludge removing apparatus 100 further includes an auxiliary conveying device, the auxiliary conveying device includes an auxiliary conveying pipeline 41, the auxiliary conveying pipeline 41 is hermetically connected to the opening on the pipe wall of the collecting pipeline 2, so as to convey the electroplating solution to the collecting pipeline 2 when the electroplating solution supplied by the conveying device 3 is insufficient to carry the anode sludge out of the collecting pipeline 2. When the plating bath is large, the length of the collecting pipeline 2 needs to be set to be long, the plating solution conveyed to the input pipe orifice 22 by the conveying device 3 needs to flow in the collecting pipeline 2 for a long distance, the flow rate of the plating solution in the collecting pipeline 2 is gradually reduced, and more anode sludge is carried in the plating solution, so that the plating solution conveyed by the conveying pipeline 32 alone is not enough to push the anode sludge to be discharged out of the collecting pipeline 2; in this embodiment, the auxiliary delivery device is provided, so that the plating solution provided by the auxiliary delivery device can be delivered into the collection pipe 2 from a certain position of the collection pipe 2, thereby assisting in discharging the anode sludge out of the collection pipe 2. Preferably, the collecting line 2 is provided with an opening approximately one third of its length from the inlet nozzle 22, at which opening the auxiliary conveying line 41 is connected. Of course, in the specific implementation, the auxiliary delivery pipe 41 can be connected at any position except the input pipe opening 22 and the output pipe opening 23, as long as the auxiliary pushing of the anode sludge out of the collecting pipe 2 can be realized.

In some embodiments, the auxiliary conveying device only includes an auxiliary conveying pipeline 41, an input pipe orifice of the auxiliary conveying pipeline 41 is connected to a liquid outlet of the liquid pump 31, the electroplating solution output by the liquid pump 31 enters the conveying pipeline 32 and the auxiliary conveying pipeline 41 respectively, the electroplating solution entering the conveying pipeline 32 is conveyed to the collecting pipeline 2 through the input pipe orifice 22, and the electroplating solution entering the auxiliary conveying pipeline 41 is conveyed to the collecting pipeline 2 through an opening on a pipe wall of the collecting pipeline 2; in some embodiments, the input pipe orifice of the auxiliary delivery pipe 41 is connected to the delivery pipe 32, and the plating solution delivered by the delivery pipe 32 is partially delivered to the collection pipe 2 directly from the input pipe orifice 22, partially enters the auxiliary delivery pipe 41, and is delivered to the collection pipe 2 from the auxiliary delivery pipe 41. Of course, in some embodiments, the auxiliary delivery device may further include a second liquid pump (not shown) and an auxiliary delivery pipe 41, an input pipe of the auxiliary delivery pipe 41 is connected to a liquid outlet of the second liquid pump, and the plating solution pressurized by the second liquid pump is input into the auxiliary delivery pipe 41 and then delivered to the collection pipe 2 via the auxiliary delivery pipe 41.

Referring to fig. 1, specifically, the anode sludge removing device 100 further includes a filtering device 5, and the filtering device 5 is configured to filter the electroplating solution carrying the anode sludge discharged from the collecting pipeline 2; the electroplating solution and the anode sludge are separated by the filtering device 5, so that the electroplating solution and the anode sludge can be recycled. Wherein, the anode sludge separated by the filtering device 5 can be arranged in a collecting tank (not shown), and then metal recovery can be carried out by professional units, so as to realize recycling. The filtering device 5 is also connected to a liquid inlet of the liquid pump 31, the filtering device 5 conveys the filtered clean electroplating liquid to the liquid pump 31, and the electroplating liquid pressurized by the liquid pump 31 can be conveyed to the collecting pipeline 2 again through the conveying pipeline 32, so that the electroplating liquid can be recycled.

Compared with the prior art, the anode separator 1 is provided with the drain hole 111 at the bottom, the bottom of the anode separator 1 is inserted into the collecting pipeline 2, anode sludge in the anode separator 1 can be discharged into the collecting pipeline 2 through the drain hole 111, then electroplating solution is conveyed to the collecting pipeline 2 through the conveying device 3, and the electroplating solution is discharged out of the collecting pipeline 2 by using the flow velocity of the electroplating solution to carry the anode sludge, so that the anode sludge of electroplating equipment is removed, and the uniformity of the thickness of the plating metal of a workpiece to be plated is improved; the invention does not need to frequently replace the anode separator 1, thereby reducing the use of the anode separator 1.

The invention also discloses a removing method of the anode sludge removing device 100, which is used for removing the anode sludge in the collecting pipeline 2. Specifically, the method for removing the anode sludge removing device 100 includes: judging whether the preset clearing time is reached and/or whether the using current amount of the electroplating equipment reaches the preset current amount; if yes, acquiring whether the electroplating equipment works; if so, the conveying device 3 is controlled to intermittently output the electroplating solution to the collecting pipeline 2, otherwise, the conveying device 3 is controlled to continuously convey the electroplating solution to the collecting pipeline 2 so as to quickly discharge the anode sludge.

When the preset removing condition is reached, the state of the electroplating equipment is judged, the conveying device 3 is controlled to remove the anode sludge in a matched mode according to the state of the electroplating equipment, and when the electroplating equipment is in an idle state, the conveying device 3 is controlled to continuously convey electroplating liquid, so that the anode sludge in the collecting pipeline 2 is quickly discharged; when the electroplating equipment is in a working state, the conveying device 3 is controlled to intermittently output the electroplating solution, so that the anode sludge in the collecting pipeline 2 can be discharged without influencing the normal operation of the electroplating equipment.

Referring to fig. 6, in an embodiment, a cleaning method of the anode sludge cleaning apparatus 100 includes the following steps:

s1: starting the anode sludge removal device 100;

s2: acquiring whether anode sludge is automatically removed or not, if not, starting anode sludge removal operation according to a manual starting signal, for example, when a worker manually starts the liquid pump 31, the liquid pump 31 delivers electroplating liquid to the collection pipeline 2, so as to start to remove the anode sludge in the collection pipeline 2; if yes, go to step S3;

s3: judging whether the actual current amount used by the electroplating equipment reaches a preset current amount, if so, executing step S5; if not, go to step S4;

s4: judging whether the current time reaches the preset clearing time, if so, executing the step S5; if not, returning to the step S3;

s5: acquiring whether electroplating equipment works or not; if yes, go to step S6; if not, go to step S7;

s6: controlling the conveying device 3 to intermittently output the electroplating solution;

s7: the conveyor 3 is controlled to continuously convey the plating liquid.

The preset cleaning time is maintenance time scheduled according to the use condition of the electroplating equipment, and is cleaned once every week, every two weeks, every month and the like; the preset current amount is set according to the anode sludge generation condition of the electroplating equipment, for example, the copper sludge generated by 15mm microcrystalline phosphorus copper balls is 5-15g/KAH, the copper sludge generated by 50mm microcrystalline phosphorus copper balls is 3-10g/KAH, if the anode sludge in the collecting pipeline 2 is expected to be removed once every 5-15 kg of accumulated anode sludge, the cleaning can be started when the electroplating equipment uses 1500-3000KAH current amount.

Specifically, when the conveying device 3 intermittently outputs the electroplating solution to the collecting pipeline 2, the discharge speed and the replenishment speed of the electroplating solution in the electroplating tank are equal, so as to ensure that the liquid level of the electroplating solution in the electroplating tank is kept unchanged, and ensure that the cleaning of the anode sludge in the collecting pipeline 2 does not influence the normal operation of the electroplating equipment. When the plating liquid is intermittently discharged from the transport means 3, it takes about five times as long as when the plating liquid is continuously transported by the transport means 3, for example, when the length of the collecting line 2 is 30 meters, it takes about 7 to 10 minutes for the plating liquid to be continuously transported by the transport means 3, and it takes about one hour for the plating liquid to be intermittently transported by the transport means 3.

In this embodiment, it is first determined whether the actual amount of current used by the plating apparatus reaches the preset amount of current through step S3, and when the actual amount of current does not reach the preset amount of current, it is determined whether the current time reaches the preset clearing time through step S4; in other embodiments, it may also be determined whether the current time reaches the preset clearing time, and when the current time does not reach the preset clearing time, it is determined whether the actual current amount used by the electroplating apparatus reaches the preset current amount, which is not limited in the specific implementation. In this embodiment, step S5 is executed as long as any one of the actual current amount and the current time reaches the preset condition, and in other embodiments, it may be set that step S5 is executed if and only if both the actual current amount and the current time reach the preset condition, so it should not be limited thereto.

Specifically, before step S3, a preset clearing time and a preset current amount are preset, and an actual current amount and a current time used by the electroplating apparatus are obtained; wherein, the actual current amount can be obtained by automatically counting the current amount, or can be obtained by receiving the input current amount value; the current time may be obtained by reading the date every day or by receiving the input time information.

In this embodiment, after the steps S6/S7, a step S8 is further included: resetting the preset current amount and the preset clearing time to arrange the next anode sludge clearing.

Referring to fig. 7, the present invention further discloses an anode sludge removing system, which includes an electronic device 200 corresponding to the method for removing the anode sludge removing device 100 and the anode sludge removing device 100. The electronic device 200 comprises a processor 210, a memory 220 and one or more computer programs 230, wherein the electronic device 200 controls the anode sludge removal device 100 to output the plating solution in a corresponding mode by controlling the operation (continuous output of the plating solution or intermittent output of the plating solution) of the liquid pump 31.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.