阅读说明：本技术 一种高密度多通道光纤通信系统 (High-density multi-channel optical fiber communication system ) 是由 黄君彬 付全飞 杨勇 陈纪辉 龙玲 于 2021-01-25 设计创作，主要内容包括：本发明提供了一种高密度多通道光纤通信系统,包括激光晶元与多个光纤组成的光纤阵列,所述激光晶元与多个所述光纤连接,其中,所述激光晶元包括激光焊盘、激光发射单元、激光正极与激光负极,所述激光焊盘上设置有多个激光发射单元,所述激光正极与所述激光负极与所述激光发射单元电连接,所述激光正极与所述激光负极相对设置于所述激光焊盘两侧。本发明通过将激光负极直接做到激光焊盘的背面,也即用激光正极与激光负极异面,而非采取共面的形式,进一步缩小激光焊盘正面所需要的的面积,将原本相邻的激光光通道从原来的250μm,缩小到250μm以下。(The invention provides a high-density multi-channel optical fiber communication system which comprises an optical fiber array consisting of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected with the optical fibers, the laser wafer comprises a laser bonding pad, a laser emitting unit, a laser anode and a laser cathode, the laser bonding pad is provided with the laser emitting units, the laser anode and the laser cathode are electrically connected with the laser emitting unit, and the laser anode and the laser cathode are oppositely arranged on two sides of the laser bonding pad. The laser negative electrode is directly arranged on the back surface of the laser bonding pad, namely the laser positive electrode and the laser negative electrode are arranged on different surfaces instead of being coplanar, so that the area required by the front surface of the laser bonding pad is further reduced, and the original adjacent laser light channel is reduced to be below 250 mu m from the original 250 mu m.)

1. A high-density multi-channel fiber optic communications system, comprising: the optical fiber array comprises a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected with the optical fibers and comprises a laser bonding pad, a laser emitting unit, a laser anode and a laser cathode, the laser bonding pad is provided with the laser emitting units, the laser anode and the laser cathode are electrically connected with the laser emitting unit, and the laser anode and the laser cathode are oppositely arranged on two sides of the laser bonding pad.

2. A high density multi-channel fiber optic communications system according to claim 1 wherein: the size of the laser bonding pad is 50-70 μm.

3. A high density multi-channel fiber optic communications system according to claim 2 wherein: the laser wafer is made of gallium arsenide materials.

4. A high density multi-channel fiber optic communications system according to claim 3 wherein: the laser array comprises at least two laser emitting units, and the laser array is connected with the optical fiber array.

5. A high density multi-channel fiber optic communications system according to claim 4 wherein: the optical fiber array is formed by bonding bare optical fibers of 125 μm.

6. A high density multi-channel fiber optic communications system according to claim 4 wherein: the optical fiber array adopts multi-core optical fibers which are arranged in a straight line.

Technical Field

The invention relates to the field of communication, in particular to a high-density multi-channel optical fiber communication system.

Background

In the optical fiber communication system used in the prior art, if there are multiple channels, the minimum spacing between the channels is 250 micrometers, and the essential root of the system is to trace back that the diameter of the main fiber core of the multimode optical fiber is 125 micrometers, and the spacing between two adjacent channels of all the general optical fiber arrays is 250 micrometers, and meanwhile, the spacing of 250 micrometers is also the standard spacing of the spacing between the channels of all the previous lasers, PDs and central active regions, and is mainly used for matching with the multi-channel transmission of the whole conventional optical communication system. Thus, all previous driver chips, lasers, optics, and optical fibers in optical communication systems were designed and used at 250 micron intervals.

In the prior art, the multichannel optical fiber system generally adopts the following two modes

Mode 1: spacing greater than 250 microns: a single laser, such as a single VCSEL, or a single TOSA, is used with more than 250 microns between adjacent channels.

Mode 2: spacing equal to 250 microns: the laser array is matched with the optical fiber array to make a multi-channel optical fiber transmission system with adjacent spacing of 250 microns.

Due to structural limitations of optical chips, optical fiber arrays and optical devices, the minimum adjacent spacing of the multichannel optical fiber communication system is limited to 250 micrometers. This 250 micron channel spacing is limited when higher densities are required for practical applications, requiring more fiber optic communication channels per unit volume.

Disclosure of Invention

The technical problem to be solved by the embodiment of the invention is as follows: current fiber optic systems require higher density, and are limited to this 250 micron channel spacing when more fiber optic communication channels need to be accommodated per unit volume.

In order to solve the technical problem, the embodiment of the invention adopts the following technical scheme:

the embodiment of the invention provides a high-density multi-channel optical fiber communication system which comprises an optical fiber array consisting of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected with the optical fibers, the laser wafer comprises a laser bonding pad, a laser emitting unit, a laser anode and a laser cathode, the laser bonding pad is provided with the laser emitting units, the laser anode and the laser cathode are electrically connected with the laser emitting unit, and the laser anode and the laser cathode are oppositely arranged on two sides of the laser bonding pad.

Further, the laser pad size is 50-70 μm.

Further, the laser wafer is made of gallium arsenide materials.

Further, the laser array comprises at least two laser emitting units, and the laser array is connected with the optical fiber array.

Further, the optical fiber array is formed by bonding bare optical fibers of 125 μm.

Further, the optical fiber array adopts multi-core optical fibers arranged in a straight line.

The embodiment of the invention has the beneficial effects that: the embodiment of the invention provides a high-density multi-channel optical fiber communication system which comprises an optical fiber array consisting of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected with the optical fibers, the laser wafer comprises a laser bonding pad, a laser emitting unit, a laser anode and a laser cathode, the laser bonding pad is provided with the laser emitting units, the laser anode and the laser cathode are electrically connected with the laser emitting unit, and the laser anode and the laser cathode are oppositely arranged on two sides of the laser bonding pad. The laser negative electrode is directly arranged on the back surface of the laser bonding pad, namely the laser positive electrode and the laser negative electrode are arranged on different surfaces instead of being coplanar, so that the area required by the front surface of the laser bonding pad is further reduced, and the original adjacent laser light channel is reduced to be below 250 mu m from the original 250 mu m.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is to be understood that the drawings in the following description are of some, but not all, embodiments of the invention. For a person skilled in the art, other figures can also be obtained from the provided figures without inventive effort.

FIG. 1 is a schematic diagram of a laser array according to an embodiment of the present invention;

FIG. 2 is a schematic view of an optical fiber array according to example 1 of the present invention;

fig. 3 is a schematic view of an optical fiber array according to embodiment 2 of the present invention.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

Referring to fig. 1, an embodiment of the present invention provides a high-density multi-channel optical fiber communication system, including an optical fiber array composed of a laser wafer and a plurality of optical fibers, the laser wafer being connected to the plurality of optical fibers, wherein the laser wafer includes a laser pad, a laser emitting unit 1, a laser anode and a laser cathode, the laser pad is provided with the plurality of laser emitting units 1, the laser anode and the laser cathode are electrically connected to the laser emitting unit 1, and the laser anode and the laser cathode are disposed on two sides of the laser pad opposite to each other.

The laser negative electrode is directly arranged on the back surface of the laser bonding pad, namely the laser positive electrode and the laser negative electrode are arranged on different surfaces instead of being coplanar, so that the area required by the front surface of the laser bonding pad is further reduced, and the original adjacent laser light channel is reduced to be below 250 mu m from the original 250 mu m.

It should be noted that the smaller the pitch between two adjacent optical channels, the more advantageous the integration with high-density photoelectric conversion and optical communication. In this embodiment, the original 250 μm of the two adjacent optical channels is minimized to 125 μm. The transmission rate density is doubled, namely, the implementation can transmit more than one time of signal transmission under the original same area, and the high-integration transmission line has the advantage of high integration.

Example 1

Referring to fig. 1 and 2, the laser pad size is further 50 μm to 70 μm.

Further, the laser wafer adopts a gallium arsenide material.

Further, the laser array comprises at least two laser emitting units 1, and the laser array is connected with the optical fiber array.

Further, the optical fiber array is formed by bonding the bare fibers 2 of 125 μm.

In the embodiment, the size of the laser bonding pad is further reduced, and the process of the laser window part is adjusted at the same time, so that two adjacent optical channels are as small as possible, and the relative distance between two adjacent light-emitting quantum wells is reduced to be less than 250 μm from the original 250 μm by reducing the diameter of the power supply metal area; by taking the double consideration of the overall size and the position of the internal structure, the two originally adjacent optical channels can be further reduced to be smaller than 250 μm.

In the present embodiment, for a semiconductor laser made of a iii-v material such as gallium arsenide, the more laser emitting units 1 can be integrated on one 4-inch or 6-inch wafer, the lower the cost of the corresponding single laser emitting unit 1 will be. Since the area of the single laser emitting unit 1 is greatly reduced, the cost of the single laser emitting unit 1 can be reduced to below 1/4, and the advantage of low cost is achieved.

In this embodiment, the optical fiber array can be formed by directly bonding bare fibers 2 with a pitch of 125 μm, and compared with the conventional optical chip, optical fiber array and optical device structure limitations, the minimum adjacent pitch of the multichannel optical fiber communication system is limited to 250 μm, and the optical channel pitch can be reduced to below 250 μm and to 125 μm.

Example 2

Referring to fig. 1 and 3, the laser pad size is further 50 μm to 70 μm.

Further, the laser wafer adopts a gallium arsenide material.

Further, the laser array comprises at least two laser emitting units 1, and the laser array is connected with the optical fiber array.

Further, the optical fiber array employs multi-core optical fibers 3 arranged in a straight line.

In the embodiment, the size of the laser bonding pad is further reduced, and the process of the laser window part is adjusted at the same time, so that two adjacent optical channels are as small as possible, and the relative distance between two adjacent light-emitting quantum wells is reduced to be less than 250 μm from the original 250 μm by reducing the diameter of the power supply metal area; by taking the double consideration of the overall size and the position of the internal structure, the two originally adjacent optical channels can be further reduced to be smaller than 250 μm.

In the present embodiment, for a semiconductor laser made of a iii-v material such as gallium arsenide, the more laser emitting units 1 can be integrated on one 4-inch or 6-inch wafer, the lower the cost of the corresponding single laser emitting unit 1 will be. Since the area of the single laser emitting unit 1 is greatly reduced, the cost of the single laser emitting unit 1 can be reduced to below 1/4, and the advantage of low cost is achieved.

In this embodiment, the optical fiber array may be assembled by the multi-core optical fibers 3 linearly arranged with the light having the pitch of 125 μm, and compared with the conventional multi-core optical fiber 3 which is limited by the structural limitations of the optical chip, the optical fiber array and the optical device, the minimum adjacent pitch of the multi-channel optical fiber communication system is limited to 250 μm, and the optical channel pitch of this embodiment can be reduced to below 250 μm and 125 μm.

In summary, the high-density multi-channel optical fiber communication system provided by the present invention minimizes the original 250 μm of the two adjacent optical channels to 125 μm. The transmission rate density is doubled, namely, the implementation can transmit more than one time of signal transmission under the original same area, and the implementation has the advantage of high integration, and the cost of a single laser can be reduced to be lower than the original 1/4 due to the large reduction of the area of the single laser, so that the implementation has the advantage of low cost.

It is further noted that, in the present disclosure, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined in this disclosure may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.