阅读说明：本技术 超声波探头和超声波内窥镜 (Ultrasonic probe and ultrasonic endoscope ) 是由 吉田晓 于 2018-10-19 设计创作，主要内容包括：超声波探头(10)包括：超声波换能器(11),其具有能够与输入的电信号相应地分别出射超声波的多个压电元件(111),多个压电元件(111)沿着第一方向A1排列；声透镜层(13),其用于将从多个压电元件(111)出射的超声波向外部发射；背面层(14),其隔着超声波换能器(11)与声透镜层(13)相对；和配线部件(12),其一部分设置在声透镜层(13)与超声波换能器(11)之间的第一位置(P1)。配线部件(12)包括：具有电绝缘性的树脂层；和设置在树脂层上的具有多条信号配线的导电层,多条信号配线分别与多个压电元件(111)电连接、并且分别对多个压电元件供给使其分别出射超声波的电信号。(An ultrasonic probe (10) comprises: an ultrasonic transducer (11) having a plurality of piezoelectric elements (111) capable of emitting ultrasonic waves in response to input electric signals, the plurality of piezoelectric elements (111) being arranged along a first direction A1; an acoustic lens layer (13) for emitting, to the outside, ultrasonic waves emitted from the plurality of piezoelectric elements (111); a back surface layer (14) that faces the acoustic lens layer (13) with the ultrasonic transducer (11) therebetween; and a wiring member (12) which is partially disposed at a first position (P1) between the acoustic lens layer (13) and the ultrasonic transducer (11). The wiring member (12) comprises: a resin layer having an electrical insulating property; and a conductive layer provided on the resin layer and having a plurality of signal lines, the plurality of signal lines being electrically connected to the plurality of piezoelectric elements (111), respectively, and supplying electrical signals to the plurality of piezoelectric elements, respectively, to emit ultrasonic waves.)

1. An ultrasonic probe, comprising:

an ultrasonic transducer having a plurality of piezoelectric elements capable of emitting ultrasonic waves in response to input electric signals, the plurality of piezoelectric elements being arranged along a first direction;

an acoustic lens layer for emitting the ultrasonic waves emitted from the plurality of piezoelectric elements to the outside;

a back surface layer facing the acoustic lens layer with the ultrasonic transducer interposed therebetween; and

a wiring member, at least a part of which is provided at a first position between the acoustic lens layer and the ultrasonic transducer or at a second position facing the ultrasonic transducer via the back layer,

the wiring member includes:

a resin layer having an electrical insulating property; and

and a conductive layer provided on the resin layer and having a plurality of signal wirings electrically connected to the plurality of piezoelectric elements, respectively, and supplying the plurality of piezoelectric elements with the electric signals for emitting the ultrasonic waves, respectively.

2. The ultrasonic probe of claim 1, wherein:

lengths of the plurality of signal wirings along a length direction of the resin layer are different from each other.

3. The ultrasonic probe of claim 1, wherein:

the wiring member further includes an insulating layer opposed to the resin layer with the conductive layer interposed therebetween,

the plurality of signal wirings are electrically connected to the plurality of piezoelectric elements via a plurality of through holes provided in the insulating layer, respectively.

4. The ultrasonic probe of claim 1, wherein:

the conductive layer includes a dummy wiring having the same material and the same thickness as the signal wiring.

5. The ultrasonic probe of claim 1, wherein:

the plurality of signal wirings include:

a first signal wiring line extending from one end to the other end of the resin layer in the longitudinal direction of the resin layer; and

and a second signal wiring line extending from the other end to the one end in the longitudinal direction of the resin layer on the resin layer.

6. The ultrasonic probe of claim 1, wherein:

at least a portion of the wiring member is disposed at the first position and has an acoustic impedance intermediate between acoustic impedances of the plurality of piezoelectric elements and the acoustic impedance of the acoustic lens layer.

7. The ultrasonic probe of claim 6, wherein:

the back surface layer is electrically connected to the plurality of piezoelectric elements, is formed of a conductive dematching layer having an acoustic impedance greater than that of the plurality of piezoelectric elements, and is electrically connected to a ground line.

8. The ultrasonic probe of claim 1, wherein:

a plurality of the back surface layers are provided for the plurality of piezoelectric elements, respectively, and each of the back surface layers is composed of a plurality of conductive dematching layers having acoustic impedance higher than that of the plurality of piezoelectric elements,

at least a portion of the wiring member is disposed at the second position,

the plurality of signal wirings are electrically connected to the plurality of piezoelectric elements via the plurality of dematching layers, respectively.

9. An ultrasonic endoscope having an insertion portion that can be inserted into a subject, characterized in that:

the insertion portion includes, on a distal end side thereof:

an ultrasonic transducer having a plurality of piezoelectric elements capable of emitting ultrasonic waves in response to input electric signals, the plurality of piezoelectric elements being arranged along a first direction;

an acoustic lens layer for emitting the ultrasonic waves emitted from the plurality of piezoelectric elements to the outside;

a back surface layer facing the acoustic lens layer with the ultrasonic transducer interposed therebetween; and

a wiring member, at least a part of which is provided at a first position between the acoustic lens layer and the ultrasonic transducer or at a second position facing the ultrasonic transducer via the back layer,

the wiring member includes:

a resin layer having an electrical insulating property; and

and a conductive layer provided on the resin layer and having a plurality of signal wirings electrically connected to the plurality of piezoelectric elements, respectively, and supplying the plurality of piezoelectric elements with the electric signals for emitting the ultrasonic waves, respectively.

Technical Field

The present invention relates to an ultrasonic probe and an ultrasonic endoscope.

Background

Conventionally, an ultrasonic probe including a plurality of piezoelectric elements capable of emitting ultrasonic waves in response to input electric signals is known (for example, see patent document 1).

The ultrasonic probe (ultrasonic array transducer) disclosed in patent document 1 is constituted by a convex type ultrasonic probe. More specifically, the ultrasonic probe includes, in addition to the plurality of piezoelectric elements, an acoustic matching layer, an acoustic lens layer, a backing member, and a cable wiring circuit board.

Here, a ground electrode is provided on an outer surface of the piezoelectric element. Further, the signal electrode is provided on the inner surface of the back surface side of the piezoelectric element, which constitutes the front and back surfaces with the outer surface.

The cable wiring board is erected in a state of being in contact with each signal electrode provided on the plurality of piezoelectric elements. An electrical signal is input to each of the signal electrodes via the cable wiring board. Then, the plurality of piezoelectric elements emit ultrasonic waves in response to the input electric signals.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2002-224104

Disclosure of Invention

Technical problem to be solved by the invention

However, the ultrasonic probe disclosed in patent document 1 has a problem that a large space is required on the back surface side of the plurality of piezoelectric elements in order to dispose the cable wiring board, and it is difficult to achieve miniaturization. Further, when the cable wiring board is directly disposed on the back surface side of the plurality of piezoelectric elements, the cable wiring board does not function as a backing member, and thus there is a problem that acoustic performance may be lowered.

Therefore, a technique capable of realizing miniaturization while avoiding a decrease in acoustic performance is demanded.

The present invention has been made in view of the above problems, and an object thereof is to provide an ultrasonic probe and an ultrasonic endoscope that can be miniaturized while avoiding a decrease in acoustic performance.

Means for solving the problems

In order to solve the above-described problems and achieve the above-described object, an ultrasonic probe according to the present invention includes: an ultrasonic transducer having a plurality of piezoelectric elements capable of emitting ultrasonic waves in response to input electric signals, the plurality of piezoelectric elements being arranged along a first direction; an acoustic lens layer for emitting the ultrasonic waves emitted from the plurality of piezoelectric elements to the outside; a back surface layer facing the acoustic lens layer with the ultrasonic transducer interposed therebetween; and a wiring member, at least a part of which is provided at a first position between the acoustic lens layer and the ultrasonic transducer or at a second position facing the ultrasonic transducer via the back surface layer, the wiring member including: a resin layer having an electrical insulating property; and a conductive layer provided on the resin layer and having a plurality of signal wirings electrically connected to the plurality of piezoelectric elements, respectively, and supplying the plurality of piezoelectric elements with the electric signals for emitting the ultrasonic waves, respectively.

An ultrasonic endoscope according to the present invention includes an insertion portion that can be inserted into a subject, and is characterized by including, on a distal end side of the insertion portion: an ultrasonic transducer having a plurality of piezoelectric elements capable of emitting ultrasonic waves in response to input electric signals, the plurality of piezoelectric elements being arranged along a first direction; an acoustic lens layer for emitting the ultrasonic waves emitted from the plurality of piezoelectric elements to the outside; a back surface layer facing the acoustic lens layer with the ultrasonic transducer interposed therebetween; and a wiring member, at least a part of which is provided at a first position between the acoustic lens layer and the ultrasonic transducer or at a second position facing the ultrasonic transducer via the back surface layer, the wiring member including: a resin layer having an electrical insulating property; and a conductive layer provided on the resin layer and having a plurality of signal wirings electrically connected to the plurality of piezoelectric elements, respectively, and supplying the plurality of piezoelectric elements with the electric signals for emitting the ultrasonic waves, respectively.

Effects of the invention

The ultrasonic probe of the invention can realize miniaturization while avoiding the reduction of acoustic performance.

Drawings

Fig. 1 is a diagram showing an endoscope system according to embodiment 1.

Fig. 2 is a perspective view showing the distal end of the insertion portion.

Fig. 3 is a sectional view showing the ultrasonic probe.

Fig. 4 is a diagram showing a connection structure between the ultrasonic transducer and the wiring member.

Fig. 5 is a diagram showing a connection structure between the ultrasonic transducer and the wiring member.

Fig. 6 is a view showing a back surface layer.

Fig. 7 is a sectional view showing an ultrasonic probe according to embodiment 2.

Fig. 8 is an enlarged sectional view of a part of fig. 7.

Fig. 9 is a diagram showing modification 1 of embodiment 1.

Fig. 10 is a diagram showing modification 2 of embodiment 1.

Fig. 11 is a diagram showing modification 3 of embodiments 1 and 2.

Fig. 12 is a diagram showing modification 3 of embodiments 1 and 2.

Fig. 13 is a diagram showing modification 4 of embodiments 1 and 2.

Fig. 14 is a diagram showing modification 4 of embodiments 1 and 2.

Detailed Description

Hereinafter, a mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described with reference to the drawings. The present invention is not limited to the embodiments described below. In the description of the drawings, the same reference numerals are given to the same parts.

(embodiment mode 1)

[ schematic Structure of endoscope System ]

Fig. 1 is a diagram showing an endoscope system 1 according to embodiment 1.

The endoscope system 1 is a system for performing ultrasonic diagnosis and treatment in a subject such as a person using an ultrasonic endoscope. As shown in fig. 1, the endoscope system 1 includes an ultrasonic endoscope 2, an ultrasonic observation device 3, an endoscopic observation device 4, and a display device 5.

A part of the ultrasonic endoscope 2 is insertable into a subject, and the ultrasonic endoscope 2 includes: a function of transmitting an ultrasonic pulse (acoustic pulse) to a body wall within a subject and receiving an ultrasonic echo reflected by the subject to output an echo signal; and a function of imaging the inside of the subject to output an image signal.

The detailed configuration of the ultrasonic endoscope 2 will be described later.

The ultrasound observation apparatus 3 is electrically connected to the ultrasound endoscope 2 via an ultrasound cable 31 (fig. 1), and outputs a pulse signal to the ultrasound endoscope 2 and an echo signal from the ultrasound endoscope 2 via the ultrasound cable 31. Then, the ultrasonic observation device 3 performs a predetermined process on the echo signal to generate an ultrasonic image.

An endoscope connector 9 (fig. 1) to be described later of the ultrasonic endoscope 2 is detachably connected to the endoscope observation device 4. As shown in fig. 1, the endoscopic observation apparatus 4 includes a video processor 41 and a light source apparatus 42.

The image signal from the ultrasonic endoscope 2 is input to the video processor 41 via the endoscope connector 9. Then, the video processor 41 performs predetermined processing on the image signal to generate an endoscopic image.

The light source device 42 supplies illumination light for illuminating the inside of the subject to the ultrasound endoscope 2 via the endoscope connector 9.

The display device 5 is composed of a liquid crystal display device, an organic EL (Electro Luminescence) display device, a CRT (Cathode Ray Tube) display device, or a projector, and displays an ultrasonic image generated by the ultrasonic observation device 3, an endoscopic image generated by the endoscopic observation device 4, and the like.

[ Structure of ultrasonic endoscope ]

Next, the structure of the ultrasonic endoscope 2 will be described.

As shown in fig. 1, the ultrasonic endoscope 2 includes an insertion portion 6, an operation portion 7, a universal cable 8, and an endoscope connector 9.

Fig. 2 is a perspective view showing the distal end of the insertion portion 6.

In the following description of the structure of the insertion portion 6, the distal end side of the insertion portion 6 (the distal end side in the insertion direction into the subject) is referred to as "the distal end side" only, and the proximal end side of the insertion portion 6 (the side opposite to the distal end of the insertion portion 6) is referred to as "the proximal end side" only.

The insertion portion 6 is a portion that can be inserted into the subject. As shown in fig. 1 or 2, the insertion portion 6 includes: an ultrasonic probe 10 provided on the distal end side; a rigid member 61 connected to the proximal end of the ultrasonic probe 10; a bendable bending portion 62 connected to the proximal end of the rigid member 61; and a flexible tube 63 (fig. 1) connected to the proximal end of the bending portion 62 and having flexibility.

A light guide (not shown) for transmitting illumination light supplied from the light source device 42, a transducer cable CB (see fig. 3) for transmitting the pulse signal and the echo signal, and a signal cable (not shown) for transmitting an image signal are arranged inside the insertion portion 6, the operation portion 7, the universal cable 8, and the endoscope connector 9, and a conduit (not shown) for circulating a fluid is provided.

Here, the hard member 61 is a hard member made of a resin material or the like, and has a substantially cylindrical shape extending along the insertion axis Ax (fig. 2). Wherein the insertion axis Ax is an axis along the extending direction of the insertion portion 6.

An inclined surface 611 is formed on the outer peripheral surface of the rigid member 61 on the distal end side, and the inclined surface 611 is formed so that the rigid member 61 becomes a shape that gradually tapers toward the distal end.

As shown in fig. 2, the rigid member 61 is provided with a mounting hole (not shown) penetrating from the base end to the tip end, an illumination hole 612 penetrating from the base end to the inclined surface 611, an imaging hole 613, an air/water feeding hole 614, a treatment instrument channel 615, and the like.

The mounting hole (not shown) is a hole for mounting the ultrasonic probe 10. The vibrator cable CB (see fig. 3) is inserted through the mounting hole.

Inside the illumination hole 612, an exit end side of the light guide (not shown) and an illumination lens 616 (fig. 2) for irradiating illumination light exiting from the exit end of the light guide into the subject are provided.

Inside the imaging hole 613, an objective optical system 617 (fig. 2) for converging light (object image) irradiated into the subject and reflected in the subject and an imaging element (not shown) for imaging the object image converged by the objective optical system 617 are provided. The image signal picked up by the image pickup device is transmitted to the endoscopic observation apparatus 4 (the video processor 41) via the signal cable (not shown).

In embodiment 1, as described above, the illumination hole 612 and the imaging hole 613 are formed on the inclined surface 611. Therefore, the ultrasonic endoscope 2 according to embodiment 1 is configured as a squint-type endoscope that observes in a direction intersecting the insertion axis Ax at an acute angle.

The air/water supply hole 614 constitutes a part of the above-described pipe (not shown), and is a hole for supplying air or water to the imaging hole 613 to clean the surface of the objective optical system 617.

The treatment instrument channel 615 is a passage for extending a treatment instrument (not shown) such as a puncture needle inserted into the insertion portion 6 to the outside.

The operation unit 7 is a portion connected to the proximal end side of the insertion unit 6 and receives various operations from a doctor or the like. As shown in fig. 1, the operation unit 7 includes: a bending knob 71 for performing a bending operation of the bending portion 62; and a plurality of operation members 72 for performing various operations.

The operation unit 7 is provided with a treatment instrument insertion port 73 (fig. 1), and the treatment instrument insertion port 73 communicates with the treatment instrument channel 615 via a tube (not shown) provided inside the bending portion 62 and the flexible tube 63, and through which a treatment instrument (not shown) is inserted.

The universal cord 8 is a cord extending from the operation unit 7 and provided with the above-described light guide (not shown), the oscillator cord CB, the above-described signal cord (not shown), and a tube (not shown) constituting a part of the above-described conduit (not shown).

The endoscope connector 9 is provided at an end of the universal cable 8. The endoscope connector 9 is connected to the ultrasonic cable 31, and is connected to the video processor 41 and the light source device 42 by being inserted into the endoscopic observation device 4.

[ Structure of ultrasonic Probe ]

Next, the structure of the ultrasonic probe 10 will be described.

Fig. 3 is a sectional view showing the ultrasonic probe 10. Specifically, fig. 3 is a cross-sectional view obtained by cutting the ultrasonic probe 10 with a plane including the insertion axis Ax and orthogonal to the scanning plane SS.

The ultrasonic probe 10 is a convex type ultrasonic probe, and has a cylindrical scanning surface SS projecting outward (upward in fig. 3). Here, the scanning surface SS constitutes a part of the outer surface of the ultrasonic probe 10.

In the following description of the configuration of the ultrasonic probe 10, the circumferential direction of the cylindrical scanning surface SS is referred to as a first direction a1 (fig. 3), and the direction along the cylinder axis of the cylindrical scanning surface SS (the direction perpendicular to the paper surface in fig. 3) is referred to as a second direction a2 (fig. 4). The upper side in fig. 3 is referred to as an outer surface side A3 (fig. 3), and the lower side in fig. 3 is referred to as a rear surface side a4 (fig. 3).

The ultrasonic probe 10 scans (transmits and receives) an ultrasonic wave in a first direction a1 in an ultrasonic transmission and reception area Ar (fig. 3) having a sector-shaped cross section formed by a normal line of the scanning surface SS.

As shown in fig. 3, the ultrasonic probe 10 includes an ultrasonic transducer 11, a wiring member 12, an acoustic lens layer 13, a back surface layer 14, and a holding member 15.

As shown in fig. 3, the ultrasonic transducer 11 includes a plurality of piezoelectric elements 111.

Each of the plurality of piezoelectric elements 111 is formed of a rectangular parallelepiped having a long shape linearly extending along the second direction a2, and is regularly arranged along the first direction a1 as shown in fig. 3. First and second electrodes 111a and 111b are formed on the outer surface of the piezoelectric element 111 (see fig. 5 and 6). The piezoelectric element 111 converts a pulse signal (corresponding to an electric signal of the present invention) input via the transducer cable CB, the wiring member 12, the back surface layer 14, and the first and second electrodes 111a and 111b into an ultrasonic pulse, and transmits the ultrasonic pulse to the subject. The piezoelectric element 111 converts an ultrasonic echo reflected by the subject into an electric echo signal, and outputs the electric echo signal to the transducer cable CB via the first and second electrodes 111a and 111b, the back surface layer 14, and the wiring member 12.

Here, the piezoelectric element 111 is formed of a PMN-PT single crystal, a PMN-PZT single crystal, a PZN-PT single crystal, a PIN-PZN-PT single crystal, or a relaxation system material.

Wherein, PMN-PT single crystal is short for solid solution of lead magnesium niobate and lead titanate. The PMN-PZT single crystal is short for the solid solution of lead magnesium niobate and lead zirconate titanate. The PZN-PT single crystal is a short for solid solution of lead zincate niobate and lead titanate. The PIN-PZN-PT monocrystal is a solid solution of lead indium niobate, lead zincate niobate and lead titanate for short. The relaxation-type material is a generic name of a ternary piezoelectric material obtained by adding a lead-based complex perovskite as a relaxation material to lead zirconate titanate (PZT) for the purpose of increasing the piezoelectric constant and the dielectric constant. The lead-based composite perovskite is made of Pb (B1, B2) O₃It is indicated that B1 is any one of magnesium, zinc, indium, and scandium, and B2 is any one of niobium, tantalum, and tungsten. These materials have excellent piezoelectric effect. Therefore, the value of the electrical impedance can be reduced even with miniaturization, and is preferable from the viewpoint of impedance matching with the first and second electrodes 111a and 111 b.

The first and second electrodes 111a and 111b are made of a conductive metal material or a conductive resin material, and are formed on the surface of the piezoelectric element 111 described below.

The first electrode 111a is formed on the entire surface of the outer surface side a3 among the surfaces of the piezoelectric element 111. The first electrode 111a is electrically connected to a plurality of signal lines 124 (see fig. 4 and 5) provided in the wiring member 12, and functions as a signal electrode for inputting and outputting a signal to and from the piezoelectric element 111.

The second electrode 111b is formed on the entire surface of the back surface side a4 in the surface of the piezoelectric element 111. That is, the first and second electrodes 111a and 111b face each other through the piezoelectric element 111 in the normal direction of the scanning surface SS. The second electrode 111b is electrically connected to a ground line GR (fig. 3) of the transducer cable CB, and functions as a ground electrode.

Fig. 4 and 5 are diagrams showing a connection structure between the ultrasonic transducer 11 and the wiring member 12. Specifically, fig. 4 is a plan view of a part of the wiring member 12 (a part provided at a first position P1 (fig. 3) between the ultrasonic transducer 11 and the acoustic lens layer 13) as viewed from the outer surface side a 3. In fig. 4, the resin layer 121 is not illustrated for convenience of explanation. Fig. 5 is an enlarged sectional view of a part of fig. 3. In fig. 5, for convenience of explanation, a plurality of signal wirings 124 are illustrated as one member as the conductive layer 122.

The wiring member 12 is a member for electrically connecting a signal line (not shown) of the transducer cable CB and each of the first electrodes 111a provided on the plurality of piezoelectric elements 111. In embodiment 1, the wiring member 12 is formed of a Flexible Printed Circuit (FPC). As shown in fig. 3 to 5, the wiring member 12 includes a resin layer 121 (fig. 3 and 5), a conductive layer 122, and an insulating layer 123. In fig. 3, the conductive layer 122 and the insulating layer 123 are not illustrated for convenience of explanation.

The resin layer 121 is a flexible, long sheet (substrate) made of an insulating material such as polyimide. Next, in the resin layer 121, a pair of sheet surfaces constituting the front and back surfaces thereof are referred to as first and second surfaces 121a and 121b (fig. 3 and 5). As shown in fig. 3, the resin layer 121 is folded back in a state where the first surface 121a constitutes an outer surface. In other words, the resin layer 121 is folded back with the second surface 121b positioned inside. The ultrasonic transducer 11 and the back surface layer 14 are disposed inside the folded resin layer 121. That is, a part of the wiring member 12 is disposed at the first position P1 (fig. 3) between the ultrasonic transducer 11 and the acoustic lens layer 13.

As shown in fig. 4, the conductive layer 122 includes a plurality of signal wirings 124 and a plurality of dummy wirings 125.

The plurality of signal wires 124 are made of a conductive metal material or a conductive resin material, and are signal wires for transmitting the pulse signals and the echo signals described above between the signal lines (not shown) of the transducer cable CB and the first electrodes 111a provided on the plurality of piezoelectric elements 111. As shown in fig. 4, the plurality of signal wirings 124 includes a plurality (14 in the example of fig. 4) of first signal wirings 124a and a plurality (14 in the example of fig. 4) of second signal wirings 124 b.

The plurality of first signal wires 124a are configured as wiring patterns extending from one end ER1 (fig. 3) to the other end ER2 (fig. 3) in the longitudinal direction of the resin layer 121 on the second surface 121b and arranged along the width direction (second direction a2) of the resin layer 121. As shown in fig. 4, the lengths of the plurality of first signal wirings 124a along the length direction of the resin layer 121 are different from each other. In the example of fig. 4, the length of the uppermost first signal wiring 124a among the plurality of first signal wirings 124a in fig. 4 is the longest, and becomes shorter as going to the lower side in fig. 4.

The second signal wires 124b are made of a conductive metal material or a conductive resin material, and are configured as wiring patterns extending from the other end ER2 to the one end ER1 in the longitudinal direction of the resin layer 121 and arranged along the width direction (second direction a2) of the resin layer 121 on the second surface 121 b. As shown in fig. 4, the lengths of the plurality of second signal wirings 124b along the length direction of the resin layer 121 are different from each other. In the example of fig. 4, the second signal wiring 124b located on the lowermost side in fig. 4 among the plurality of second signal wirings 124b has the longest length, and the length becomes shorter toward the upper side in fig. 4.

On the second surface 121b, a parallelogram-shaped area Ar1 is formed between each end ES1 (fig. 4) on the side of the other end ER2 of the plurality of first signal wires 124a and each end ES2 (fig. 4) on the side of one end ER1 of the plurality of second signal wires 124 b.

The dummy wirings 125 are formed of a conductive metal material or a conductive resin material, and are dummy (dummy) wiring patterns (wiring patterns not electrically connected to any component) formed in the area Ar1 on the second surface 121 b. In embodiment 1, the dummy wirings 125 are provided in the same number as the first and second signal wirings 124a and 124b, and are provided on lines connecting the end portions ES1 and ES2 facing each other.

In embodiment 1, the plurality of signal wirings 124 and dummy wirings 125 are made of the same material and have the same width and thickness dimensions.

The insulating layer 123 is made of an insulating material such as polyimide. The insulating layer 123 is provided at a position facing the resin layer 121 (second surface 121b) with the conductive layer 122 interposed therebetween, and protects the conductive layer 122 while ensuring insulation of the conductive layer 122. As shown in fig. 5, through holes VI are provided in the insulating layer 123 at positions facing the end portions ES1 and ES2, respectively. The through holes VI are electrically connected to the end portions ES1 and ES2, respectively, and to the first electrodes 111a provided on the piezoelectric elements 111, respectively. That is, the signal wires 124 are electrically connected to the first electrodes 111a (the piezoelectric elements 111) through the through holes VI, respectively.

Although not shown in detail, the insulating layer 123 is also provided with through holes at positions facing the respective ends of the first signal wires 124a on the ER1 side and the respective ends of the second signal wires 124b on the ER2 side. The through holes are electrically connected to the end portions, respectively, and are electrically connected to the signal lines of the oscillator cable CB, respectively. As shown in fig. 3, the connection position of the wiring member 12 and the signal line of the transducer cable CB is located closer to the base end side than the ultrasonic transducer 11, the acoustic lens layer 13, and the back surface layer 14.

When a part of the wiring member 12 is disposed at the first position P1, in order to allow sound (ultrasonic waves) to efficiently transmit between the ultrasonic transducer 11 and the subject, it is preferable that the wiring member 12 functions as an acoustic matching layer for matching acoustic impedance between the ultrasonic transducer 11 and the subject.

Specifically, the wiring member 12 preferably has an acoustic impedance intermediate between the acoustic impedance of the ultrasonic transducer 11 and the acoustic impedance of the acoustic lens layer 13. For example, the acoustic impedances of the resin layer 121 and the insulating layer 123 are preferably 2 to 20 MRayl. It is preferable that the acoustic impedances of the resin layer 121 and the insulating layer 123 decrease in order from the ultrasonic transducer 11 side to the acoustic lens layer 13 side (for example, acoustic impedance of the insulating layer 123: 9MRayl, acoustic impedance of the resin layer 121: 2 MRayl). The thicknesses of the resin layer 121 and the insulating layer 123 are preferably not more than 1/4 of the wavelength λ (for example, 400 to 500 μm) at the center frequency of the ultrasonic wave transmitted from the ultrasonic transducer 11 and transmitted through the resin layer 121 and the insulating layer 123. The thickness of the conductive layer 122 is preferably 1/25 or less of the wavelength λ.

As shown in fig. 3, the acoustic lens layer 13 is fixed to the first surface 121a of the resin layer 121 at the portion of the wiring member 12 provided at the first position P1 by the adhesive force of an adhesive (not shown) or the adhesive force when the lens material itself is poured. That is, the surface of the outer surface side a3 of the acoustic lens layer 13 is the scanning surface SS. The scanning surface SS has a cross-sectional view arc shape extending along the first direction a1, and has a cross-sectional view arc shape extending along the second direction. That is, the scanning surface SS has a convex shape protruding toward the outer surface side a 3. The acoustic lens layer 13 converges the ultrasonic pulse transmitted from the ultrasonic transducer 11 and transmitted through the portion of the wiring member 12 provided at the first position P1. In addition, the acoustic lens layer 13 transmits the ultrasonic echo reflected by the subject to the portion of the wiring member 12 provided at the first position P1.

Fig. 6 is a view showing the back surface layer 14. Specifically, fig. 6 is an enlarged cross-sectional view of a part of fig. 3.

The back surface layer 14 is provided on the back surface side a4 of the ultrasonic transducer 11 (the side facing the acoustic lens layer 13 with the ultrasonic transducer 11 interposed therebetween). In embodiment 1, the back layer 14 functions as a dematching layer made of, for example, tungsten or the like, which has acoustic impedance higher than that of the ultrasonic transducer 11 and also has conductivity. That is, the back layer 14 has a function of reflecting the ultrasonic waves transmitted from the ultrasonic transducer 11 and going in the direction opposite to the subject (back side a4) toward the subject, and increasing the amount of the ultrasonic waves incident on the subject. The back layer 14 is electrically connected to the second electrodes 111b provided on the plurality of piezoelectric elements 111. As shown in fig. 3 or 6, the ground line GR of the vibrator cable CB is electrically connected to the back surface layer 14. That is, the second electrodes 111b provided on the plurality of piezoelectric elements 111 are electrically connected to the ground line GR via the back layer 14.

As shown in fig. 3, the holding member 15 includes a holding portion 151 and a mounting portion 152.

The holding portion 151 is a portion for holding a unit formed by integrating the ultrasonic transducer 11, the wiring member 12, the acoustic lens layer 13, and the back surface layer 14. As shown in fig. 3, the holding portion 151 is formed with a recess 151a for holding the unit and exposing the scanning surface SS of the acoustic lens layer 13 to the outside. The gap between the recess 151a and the cell is filled with an adhesive AD (fig. 3).

The attachment portion 152 is a portion integrally formed at the root end of the holding portion 151 and insertable into the attachment hole (not shown) of the rigid member 61 to be attached to the rigid member 61. As shown in fig. 3, the mounting portion 152 is formed with an insertion hole 152a through which the vibrator cable CB is inserted, the insertion hole penetrating from the base end to the recess 151 a.

The following effects can be obtained by the embodiment 1 described above.

The ultrasonic probe 10 according to embodiment 1 includes the wiring member 12, a part of which is disposed at the first position P1. The wiring member 12 electrically connects the signal line (not shown) of the transducer cable CB and the first electrodes 111a provided on the plurality of piezoelectric elements 111.

Therefore, it is not necessary to dispose a wiring board on the rear surface side a4 of the plurality of piezoelectric elements 111 as in the conventional case. In other words, a large space is not required on the back surface side a4 of the plurality of piezoelectric elements 111. That is, the ultrasonic probe 10 can be downsized.

The wiring member 12 functions as an acoustic matching layer. The back surface layer 14 is electrically connected to the second electrodes 111b provided on the plurality of piezoelectric elements 111, is formed of a conductive dematching layer, and is electrically connected to a ground line GR.

Therefore, even when a part of the wiring member 12 is disposed at the first position P1, the ultrasonic wave can be efficiently transmitted between the ultrasonic transducer 11 and the subject, and the acoustic performance is not degraded.

Therefore, the ultrasonic probe 10 according to embodiment 1 can be downsized while avoiding a reduction in acoustic performance.

In the ultrasonic probe 10 according to embodiment 1, the first signal wires 124a extend from the one end ER1 to the other end ER2, respectively, and have lengths along the longitudinal direction of the resin layer 121 that are different from each other. Further, the plurality of second signal wirings 124b extend from the other end ER2 to the one end ER1, respectively, and are different from each other in length along the longitudinal direction of the resin layer 121.

Therefore, even when the wiring space for the plurality of signal wirings 124 on the second surface 121b is narrow, the plurality of signal wirings 124 can be efficiently routed, and the signal lines (not shown) of the oscillator cable CB and the first electrodes 111a can be electrically connected by the plurality of signal wirings 124.

In the ultrasonic probe 10 according to embodiment 1, the wiring member 12 has a structure in which the conductive layer 122 is sandwiched between the resin layer 121 and the insulating layer 123. The plurality of signal lines 124 are electrically connected to the first electrodes 111a through a plurality of vias VI provided in the insulating layer 123.

Therefore, the signal lines (not shown) of the vibrator cable CB can be electrically connected to the first electrodes 111a by the wiring member 12 while sufficiently securing the insulation property of the conductive layer 122.

In the ultrasonic probe 10 according to embodiment 1, the conductive layer 122 includes the dummy wiring 125 which is made of the same material as the signal wiring 124 and has the same width and thickness dimensions.

Therefore, when the ultrasonic waves transmitted from the ultrasonic transducer 11 are transmitted from any position, the ultrasonic waves transmit the conductive layer 122 having the same volume. Therefore, the variation in acoustic performance can be suppressed.

(embodiment mode 2)

Next, embodiment 2 will be explained.

In the following description, the same components as those in embodiment 1 are denoted by the same reference numerals, and detailed description thereof will be omitted or simplified.

Fig. 7 is a sectional view showing an ultrasonic probe 10A according to embodiment 2. Specifically, fig. 7 is a sectional view corresponding to fig. 3. In fig. 7, the conductive layer 122 and the insulating layer 123 are not illustrated for convenience of explanation. Fig. 8 is an enlarged sectional view of a part of fig. 7.

As shown in fig. 8, the ultrasonic probe 10A according to embodiment 2 employs a back surface layer 14A having a different shape from the back surface layer 14, as compared with the ultrasonic probe 10 described in embodiment 1. In the ultrasonic probe 10A, as shown in fig. 7, instead of the part of the wiring member 12 being provided at the first position P1 as described in embodiment 1 above, the part of the wiring member 12 is provided on the back surface side a4 of the back surface layer 14A (the second position P2 facing the ultrasonic transducer 11 through the back surface layer 14A). Further, in the ultrasonic probe 10A, the acoustic matching layer 16 is provided at the first position P1.

Specifically, as shown in fig. 8, a back surface layer 14A is provided on the back surface side of the ultrasonic transducer 11 for each of the plurality of piezoelectric elements 111, and the back surface layer 14A functions as a dematching layer in the same manner as the back surface layer 14 described in embodiment 1.

The wiring member 12 of embodiment 2 is folded back in a state where the second surface 121b constitutes the outer surface, contrary to the wiring member 12 described in embodiment 1. In other words, the wiring member 12 is folded back with the first surface 121a positioned inside. Each via VI is electrically connected to each back surface layer 14A. In embodiment 2, the plurality of signal lines 124 are electrically connected to the second electrodes 111b (the plurality of piezoelectric elements 111) through the through holes VI and the back surface layers 14A, respectively. That is, the second electrode 111b functions as a signal electrode for inputting and outputting a signal to and from the piezoelectric element 111.

The acoustic matching layer 16 is a member for matching acoustic impedance between the ultrasonic transducer 11 and the subject in order to efficiently transmit sound (ultrasonic waves) between the ultrasonic transducer 11 and the subject. In embodiment 2, the acoustic matching layer 16 is made of a resin having electrical conductivity. That is, the acoustic matching layer 16 is electrically connected to the first electrodes 111a provided on the plurality of piezoelectric elements 111. As shown in fig. 7, the ground line GR of the vibrator cable CB is electrically connected to the acoustic matching layer 16. That is, the first electrode 111a functions as a ground electrode.

The ultrasonic probe 10A according to embodiment 2 described above also has the same effects as those of embodiment 1 described above.

(other embodiments)

The embodiments for carrying out the present invention have been described above, but the present invention should not be limited to the above-described embodiments 1 and 2.

In embodiments 1 and 2 described above, the ultrasonic probe 10(10A) is formed by a convex ultrasonic probe, but is not limited to this, and may be formed by a radial ultrasonic probe.

In embodiments 1 and 2 described above, the endoscope system 1 has both the function of generating an ultrasonic image and the function of generating an endoscopic image, but is not limited to this, and may have only the function of generating an ultrasonic image.

In embodiments 1 and 2 described above, the endoscope system 1 is not limited to the medical field, and may be an endoscope system for observing the inside of a subject such as a mechanical structure in the industrial field.

In embodiments 1 and 2 described above, the ultrasonic endoscope 2 is configured as a squint-type endoscope that observes in a direction intersecting at an acute angle with respect to the insertion axis Ax, but the present invention is not limited to this. For example, the ultrasonic endoscope 2 may be configured as a side-view endoscope that observes in a direction intersecting at right angles with respect to the insertion axis Ax, or a direct-view endoscope that observes in a direction along the insertion axis Ax.

In embodiments 1 and 2 described above, the positions of the piezoelectric element 111 where the first and second electrodes 111a and 111b are provided are not limited to the positions described in embodiments 1 and 2 described above, and may be provided in other positions. For example, the first electrode 111a may be provided on the surface of the piezoelectric element 111 other than the surface a3 on the outer surface side of the piezoelectric element 111, and may have a cross-sectional view L shape. Similarly, the second electrode 111b may be provided on the surface of the piezoelectric element 111 other than the surface of the rear surface a4 of the piezoelectric element 111, and may have an L-shaped cross-sectional view. The first and second electrodes 111a and 111b may be provided on the surface of the piezoelectric element 111 at positions facing each other in the first direction a1 with the piezoelectric element 111 interposed therebetween.

In embodiment 1 described above, a layer having conductivity may be further provided on the outermost surface (first surface 121a) of the wiring member 12 for the purpose of electrical safety and avoiding noise from entering the first and second signal wirings 124a and 124 b.

Fig. 9 is a diagram showing modification 1 of embodiment 1. Specifically, fig. 9 is a perspective view of a part of the wiring member 12B (a part provided at the first position P1) in modification 1 as viewed from the outer surface side a 3. In fig. 9, the resin layer 121 is not illustrated for convenience of explanation.

In the wiring member 12B of modification 1, a conductive layer 122B different from the conductive layer 122 is used as compared with the wiring member 12 described in embodiment 1.

The conductive layer 122B does not have the plurality of dummy wirings 125 unlike the conductive layer 122. In addition, as shown in fig. 9, the plurality of first signal wirings 124a and the plurality of second signal wirings 124b are respectively provided in regions that do not overlap with the region ArO located at the center of the ultrasonic transducer 11 when viewed from the outer surface side a 3.

In the case of using the wiring member 12B of modification 1, since the conductive layer 122B is not provided in the region ArO when viewed from the outer surface side a3, a decrease in acoustic performance due to the conductive layer 122B can be avoided.

Fig. 10 is a diagram showing modification 2 of embodiment 1. Specifically, fig. 10 is a plan view of a part of the wiring member 12C (a part provided at the first position P1) in modification example 2 as viewed from the outer surface side a 3. In fig. 10, the resin layer 121 and the plurality of first signal wirings 124a are omitted for convenience of explanation.

In the wiring member 12C of modification 2, a conductive layer 122C different from the conductive layer 122 is used as compared with the wiring member 12 described in embodiment 1.

The conductive layer 122C does not have the plurality of dummy wirings 125 unlike the conductive layer 122. As shown in fig. 10, when viewed from the outer surface side a3, the plurality of second signal wires 124b are partially disposed between the adjacent piezoelectric elements 111 in a state where they do not overlap the plurality of piezoelectric elements 111 as much as possible. The same applies to the plurality of first signal wirings 124 a.

Even in the case of using wiring member 12C according to modification 2, the same effects as those of modification 1 can be obtained.

Fig. 11 and 12 are views showing modification 3 of embodiments 1 and 2. Specifically, fig. 11 is a plan view of wiring member 12D according to modification 3, as viewed from first surface 121a side.

Fig. 12 is a plan view of wiring member 12D as viewed from second surface 121b side. In fig. 11 and 12, the plurality of first signal wirings 124a are not shown for convenience of explanation. In fig. 12, the insulating layer 123 is not shown.

In embodiments 1 and 2 described above, the conductive layer 122 is provided only on the second surface 121 b. That is, the conductive layer 122 is formed of only one layer.

The conductive layer 122D provided in the wiring member 12D of modification 3 is formed of two layers. Specifically, as shown in fig. 11, the plurality of second signal wirings 124b are formed of two layers, one layer provided on each of the first surfaces 121a and one layer provided on each of the second surfaces 121 b. The same applies to the plurality of first signal wirings 124 a.

In the case of the configuration as in modification 3, the distance between the second signal wirings 124b adjacent to each other (between the first signal wirings 124a adjacent to each other) becomes longer. Therefore, mutual interference of signals between the second signal wirings 124b adjacent to each other (between the first signal wirings 124a adjacent to each other) can be suppressed (occurrence of crosstalk can be suppressed).

Fig. 13 and 14 are views showing modification 4 of embodiments 1 and 2. Specifically, fig. 13 and 14 are views showing the configuration of the connection member 200 provided in the endoscope connector 9 and electrically connecting the transducer cable CB and the ultrasonic cable 31. Fig. 13 is a plan view of the FPC 210. Fig. 14 is a side view of the connecting member 200.

In the endoscope system 1 according to embodiments 1 and 2 described above, the coupling member 200 shown in fig. 13 and 14 can be used.

As shown in fig. 13 or 14, the connection member 200 includes an FPC210 and a connector 220 (fig. 14).

As shown in fig. 13 or 14, the FPC210 includes: a circuit board 211; a ground pad 212; a plurality of (4 in modification 3) signal pads 213; and a covering member 214.

The circuit board 211 is a circuit board in which a ground line (not shown) and a plurality of signal lines (not shown) are provided in a long substrate made of an insulating material such as polyimide.

The ground pad 212 is provided at an end portion of the circuit board 211 on the side of the vibrator cable CB (left side in fig. 13 and 14), and is electrically connected to a ground line (not shown) inside the circuit board 211. As shown in fig. 14, the ground line GR of the vibrator cable CB is electrically connected to the ground pad 212.

A plurality of signal pads 213 are provided on the circuit board 211 on the right side in fig. 13 and 14 with respect to the ground pad 212. The plurality of signal pads 213 extend along the longitudinal direction of the circuit board 211 (the left-right direction in fig. 13 and 14), respectively, and are arranged along the width direction of the circuit board 211 (the up-down direction in fig. 13). The right-hand ends of the signal pads 213 in fig. 13 and 14 are electrically connected to signal lines (not shown) inside the circuit board 211.

The covering member 214 is made of an insulating material such as a cover film. Also, the cover member 214 is provided in a state of spanning the plurality of signal pads 213, dividing the plurality of signal pads 213 into the left area ArL and the right area ArR in fig. 13 and 14.

As shown in fig. 14, the plurality of signal lines SG of the transducer cable CB are electrically connected to the regions ArL of the plurality of signal pads 213, respectively. The regions ArR of the plurality of signal pads 213 function as pads for inspection of the respective paths from the plurality of piezoelectric elements 111 to the plurality of signal lines SG.

Further, in the example of fig. 13 and 14, a covering member 214 is also provided on the circuit board 211 between the ground pad 212 and the plurality of signal pads 213, and on the end portion on the right side in fig. 13 and 14 of the plurality of signal pads 213.

The connector 220 is a connector for electrically connecting a ground line (not shown) and a plurality of signal lines (not shown) inside the circuit board 211 to the ultrasonic cable 31.

Description of the reference numerals

1 endoscope system, 2 ultrasonic endoscope, 3 ultrasonic observation device, 4 endoscopic observation device, 5 display device, 6 insertion portion, 7 operation portion, 8 universal cable, 9 connector for endoscope, 10A ultrasonic probe, 11 ultrasonic transducer, 12B to 12D wiring member, 13 acoustic lens layer, 14A back surface layer, 15 holding member, 16 acoustic matching layer, 31 ultrasonic cable, 41 video processor, 42 light source device, 61 rigid member, 62 bending portion, 63 flexible tube, 71 bending knob, 72 operation member, 73 treatment instrument insertion port, 111 piezoelectric element, 111a first electrode, 111B second electrode, 121 resin layer, 121a first surface, 121B second surface, 122B to 122D, conductive layer 123 insulating layer, 124 signal wiring, 124A first signal wiring, 124B second signal wiring, 125 dummy wiring, 151 holding portion, 151a recess, 152 mounting portion, 152a insertion hole, 200 connection member, 210FPC, 211 circuit board, 212 ground pad, 213 signal pad, 214 covering member, 220 connector, 611 inclined surface, 612 illumination hole, 613 imaging hole, 614 air/water feeding hole, 615 treatment instrument channel, 616 illumination lens, 617 objective optical system, a1 first direction, a2 second direction, A3 outer surface side, a4 back surface side, AD adhesive, Ar ultrasonic wave transmitting/receiving region, Ar1, ArL, ArO, ArR region, Ax insertion axis, CB vibrator cable, ER1 one end, ER2 other end, ES1, ES2 end, GR ground, P1 first position, P2 second position, SG signal line, SS scanning surface, VI through hole.