阅读说明：本技术 一种木材热处理方法及装置 (Wood heat treatment method and device ) 是由 钟世禄 蒋明月 张钰 于 2021-08-04 设计创作，主要内容包括：一种木材热处理方法,将木材浸没于乙醇中,加热至温度T1并持续一段时间；再超声震动浸没于乙醇中的木材后排出溶液；在流动氮气保护下,以温度T2热烘木材后,冷却。本发明以充分改善木材内的渗透通道为前提,在恒温状态下浸泡木材,溶解木材表面的油脂,置换生木材内的水分,并溶解部分木材内的抽提物,通过改善渗透通道以改善木材的渗透性。通过超声波震动,加强了溶解的效率和效果,进一步改善了渗透通道；再通过热烘将木材内的乙醇蒸发。结合装置内的半导体电路,可同时实现乙醇的加热蒸发和冷凝回收,使得乙醇可循环利用,降低了能耗,节约了成本。结构简单,可实现自动化的热处理操作,节能效果好,具有很强的实用性和广泛的适用性。(A method for heat treatment of wood comprises immersing wood in ethanol, heating to temperature T1 for a period of time; ultrasonically vibrating the wood immersed in the ethanol and then discharging the solution; after the wood was heat baked at a temperature T2 under flowing nitrogen, it was cooled. The invention takes the premise of fully improving the permeation channel in the wood, soaks the wood in a constant temperature state, dissolves the grease on the surface of the wood, replaces the water in the raw wood, dissolves the extract in part of the wood, and improves the permeability of the wood by improving the permeation channel. Through ultrasonic vibration, the dissolving efficiency and effect are enhanced, and the permeation channel is further improved; and then the ethanol in the wood is evaporated by hot baking. The heating evaporation and condensation recovery of the ethanol can be realized simultaneously by combining a semiconductor circuit in the device, so that the ethanol can be recycled, the energy consumption is reduced, and the cost is saved. The device has the advantages of simple structure, capability of realizing automatic heat treatment operation, good energy-saving effect, strong practicability and wide applicability.)

1. A method of heat treating wood, comprising the steps of:

s1, immersing the wood in ethanol, and heating to the temperature T1 for a period of time;

s2, ultrasonically vibrating the wood immersed in the ethanol at the temperature of T1, and discharging the solution;

and S3, under the protection of flowing nitrogen, drying the wood at the temperature of T2, and then cooling.

2. The method for heat-treating wood according to claim 1, wherein the ethanol immersion time in step S1 is 3-7 days, and the temperature T1 is 50-60 ℃.

3. The heat treatment method for wood according to claim 1, wherein the frequency of the ultrasonic wave in the step S2 is 20-30KHz and the time is 3-5 h.

4. The method as claimed in claim 1, wherein the temperature T2 in the step S3 is 130-150 ℃, and the heating manner is a gradient of 5 ℃/10 min; the baking time is 20-30 h.

5. A wood heat treatment device, which is suitable for the wood heat treatment method of any one of claims 1 to 4, and comprises a hollow box body consisting of a first copper substrate, a second copper substrate, an N-type semiconductor, a P-type semiconductor, a cold end and a heat dissipation base;

the cold end is the top surface of the box body, the heat dissipation base is the bottom surface of the box body, one side surface of the box body is formed by a first copper substrate which is connected with an N-type semiconductor in a top connection mode, the N-type semiconductor is connected with the cold end in a top connection mode, and the bottom of the first copper substrate is connected with the heat dissipation base; the opposite side surface is formed by a second copper substrate which is connected with a P-type semiconductor in a top connection mode, the P-type semiconductor is connected with a cold end in a top connection mode, and the bottom of the second copper substrate is connected with a heat dissipation base;

the first copper substrate, the second copper substrate, the N-type semiconductor, the P-type semiconductor and the cold end are connected in series to form a semiconductor circuit based on the Peltier principle, the first copper substrate is connected with the positive electrode of a power supply, and the second copper substrate is connected with the negative electrode of the power supply;

the inner cavity of the box body is divided into a condensation cavity and a drying cavity by the partition plates with the N-type semiconductor and the P-type semiconductor at two ends; a condensing pipe with a condensing valve and connected with the condensing cavity is arranged on the top side of the drying cavity, and a liquid guide valve connected with the drying cavity is arranged in the condensing cavity; a drain valve is arranged at the bottom side of the drying cavity;

the ultrasonic generator is arranged on the back side surface of the drying cavity.

6. The wood heat treatment device according to claim 5, characterized in that the bottom of the drying chamber is provided with a liquid storage chamber, and the drying chamber is connected with the liquid storage chamber through a liquid discharge valve.

7. A wood-heat-treating device according to claim 6, wherein the liquid-storage chamber and the drying chamber share a heat-dissipating base.

8. A wood-heat-treating device according to claim 6, characterized in that the top side of the liquid-storing chamber is provided with a steam pipe connected with a condensation pipe.

9. The wood heat treatment device according to claim 5, wherein the top side of the drying chamber is provided with an air inlet pipe with a one-way valve, and the air outlet pipe with a one-way valve is arranged on the top side of the condensing chamber.

10. The wood heat treatment device according to claim 5, wherein a liquid level sensor and a temperature sensor are arranged in the box body and are respectively connected with the control device;

the control device controls the opening and closing of the liquid guide valve according to the feedback of the liquid level sensor, and controls the current intensity in the circuit through the PWM current modulator connected with the power supply according to the feedback of the temperature sensor.

Technical Field

The invention relates to a wood heat treatment method, in particular to a wood heat treatment method and a wood heat treatment device.

Background

With the gradual improvement of living standard, people seek living enjoyment more and more, and wood products are blended into the aspects of life due to durability, nature, beauty, good texture, greenness and health, but the growth speed is slow, so people need to reasonably and effectively utilize wood.

The existing wood is often bent, deformed and broken due to improper drying method, the utilization rate is low, resources are wasted, and serious loss is caused. Therefore, a drying method with high drying speed, no deformation and cracking of the product and high utilization rate is needed.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention aims to provide a wood heat treatment method and a wood heat treatment device.

In order to achieve the above object, the present invention adopts the following technical solutions:

a method of heat treating wood comprising the steps of:

s1, immersing the wood in ethanol, and heating to the temperature T1 for a period of time;

s2, ultrasonically vibrating the wood immersed in the ethanol at the temperature of T1, and discharging the solution;

and S3, under the protection of flowing nitrogen, drying the wood at the temperature of T2, and then cooling.

The ethanol immersion time in the step S1 is 3-7 days, and the temperature T1 is 50-60 ℃.

The frequency of the ultrasound in the step S2 is 20-30KHz, and the time is 3-5 h.

The temperature T2 in the step S3 is 130-150 ℃, and the heating mode is a gradient type at 5 ℃/10 min; the baking time is 20-30 h.

A wood heat treatment device is suitable for the wood heat treatment method, and comprises a hollow box body consisting of a first copper substrate, a second copper substrate, an N-type semiconductor, a P-type semiconductor, a cold end and a heat dissipation base;

the cold end is the top surface of the box body, the heat dissipation base is the bottom surface of the box body, one side surface of the box body is formed by a first copper substrate which is connected with an N-type semiconductor in a top connection mode, the N-type semiconductor is connected with the cold end in a top connection mode, and the bottom of the first copper substrate is connected with the heat dissipation base; the opposite side surface is formed by a second copper substrate which is connected with a P-type semiconductor in a top connection mode, the P-type semiconductor is connected with a cold end in a top connection mode, and the bottom of the second copper substrate is connected with a heat dissipation base;

the first copper substrate, the second copper substrate, the N-type semiconductor, the P-type semiconductor and the cold end are connected in series to form a semiconductor circuit based on the Peltier principle, the first copper substrate is connected with the positive electrode of a power supply, and the second copper substrate is connected with the negative electrode of the power supply;

the inner cavity of the box body is divided into a condensation cavity and a drying cavity by the partition plates with the N-type semiconductor and the P-type semiconductor at two ends; a condensing pipe with a condensing valve and connected with the condensing cavity is arranged on the top side of the drying cavity, and a liquid guide valve connected with the drying cavity is arranged in the condensing cavity; a drain valve is arranged at the bottom side of the baking cavity.

The bottom of the drying cavity is provided with a liquid storage cavity, and the drying cavity is connected with the liquid storage cavity through a liquid discharge valve.

The ultrasonic generator is arranged on the back side surface of the drying cavity.

Further, the liquid storage cavity and the drying cavity share a heat dissipation base.

Furthermore, a steam pipe connected with a condensation pipe is arranged on the top side of the liquid storage cavity.

The top side of the drying cavity is provided with an air inlet pipe with a one-way valve, and the air outlet pipe with the one-way valve is arranged on the top side of the condensing cavity.

A liquid level sensor and a temperature sensor are arranged in the box body and are respectively connected with a control device;

the control device controls the opening and closing of the liquid guide valve according to the feedback of the liquid level sensor, and controls the current intensity in the circuit through the PWM current modulator connected with the power supply according to the feedback of the temperature sensor.

The invention has the advantages that:

the wood heat treatment method and the wood heat treatment device provided by the invention have the advantages that on the premise of fully improving the permeation channel in the wood, the wood is soaked in a constant temperature state, the wood is pretreated by ethanol, the grease on the surface of the wood is dissolved, the water in the raw wood is replaced, the extract in part of the wood is dissolved, and the permeability of the wood is improved by improving the permeation channel. At a certain temperature, the fiber cells in the wood are in an active state, the inner wall and the cell membrane of the cells are activated, the replacement and dissolution efficiency is improved, and meanwhile, the preparation is made for hot drying. Through ultrasonic vibration, the dissolving efficiency and effect are enhanced, and the permeation channel is further improved; the ethanol in the wood is evaporated by hot drying, and the speed and the thoroughness of the ethanol evaporation are accelerated by the dredged permeation channel, so that the retention of the ethanol in the wood is reduced. The heating evaporation and condensation recovery of the ethanol can be realized simultaneously by combining a semiconductor circuit in the device, so that the ethanol can be recycled, the energy consumption is reduced, and the cost is saved.

The wood heat treatment method and the wood heat treatment device have the advantages of simple structure, clear and coherent steps, good energy-saving effect, strong practicability and wide applicability, and can realize automatic heat treatment operation by combining the control device.

Drawings

FIG. 1 is a schematic view of a heat treatment apparatus for wood.

The designations in the drawings have the following meanings: 1. nitrogen source, 2, cold end, 3, N-type semiconductor, 4, first copper substrate, 5, P-type semiconductor, 6, second copper substrate, 7, heat dissipation base, 8, liquid guide valve, 9, liquid discharge valve, 10, condenser pipe, 11, steam pipe, 12, gas outlet pipe, 13, gas inlet pipe, 14 and fan.

Detailed Description

The invention is described in detail below with reference to the figures and the embodiments.

A wood heat treatment device comprises a hollow box body and a semiconductor circuit based on the Peltier principle.

The semiconductor circuit consists of a first copper substrate 4, a second copper substrate 6, an N-type semiconductor 3, a P-type semiconductor 5, a cold end 2 and a power supply which are connected in series; the power supply is provided with a PWM current modulator, the first copper substrate 4 is connected with the anode of the power supply, and the second copper substrate 6 is connected with the cathode of the power supply.

The cold end 2 is arranged on the top surface of the box body, the heat dissipation base 7 is arranged on the bottom surface of the box body, the first copper substrate 4 which is connected with the N-type semiconductor 3 in a jacking mode is arranged on one side surface of the box body, and the second copper substrate 6 which is connected with the P-type semiconductor 5 in a jacking mode is arranged on the opposite side surface of the box body; the top ends of the N-type semiconductor 3 and the N-type semiconductor 3 are respectively connected with the cold end 2 in a top-to-top mode, and the bottom ends of the first copper substrate 4 and the second copper substrate 6 are respectively connected with the heat dissipation base 7 in a bottom-to-bottom mode.

The partition plate divides the inner cavity of the box body into a condensation cavity at the top and a drying cavity at the bottom; two ends of the partition board are respectively connected with the N-type semiconductor 3 and the P-type semiconductor 5; the wall of the condensing cavity and the wall of the drying cavity are both provided with insulating heat-conducting layers. The baffle is equipped with the drain valve 8 that switches on the condensation chamber and dry by the fire the chamber, dries by the fire the top side in chamber and is equipped with the condenser pipe 10 of switch on condensation chamber, and the condenser pipe 10 embeds the condensate valve.

The liquid storage cavity is arranged at the bottom of the drying cavity and shares a heat dissipation base 7 with the drying cavity, and an insulating heat conduction layer is arranged on the cavity wall of the liquid storage cavity. A drain valve 9 at the bottom of the baking cavity is connected into the liquid storage cavity through a heat dissipation base 7. A steam pipe 11 is arranged on the top side of the liquid storage cavity, and the port of the steam pipe 11 is connected with a condensation pipe 10.

The top side of the drying cavity is also provided with an air inlet pipe 13, and an air outlet pipe 12 is arranged on the top side of the condensing cavity. And the condenser pipe 10, the air inlet pipe 13 and the air outlet pipe 12 are all internally provided with one-way valves. Preferably, the inlet of the outlet pipe 12 is further provided with a gas-permeable liquid-proof membrane.

Preferably, the outlet of the outlet pipe 12 is connected with an inlet pipe 13, the inlet of the inlet pipe 13 is connected with the nitrogen source 1, and the inlet pipe 13 is also connected with a fan 14.

A liquid level sensor and a temperature sensor are also arranged in the box body; the liquid level sensor, the temperature sensor, the condensing valve, the liquid guide valve 8 and the liquid discharge valve 9 are respectively connected with the control device.

The control device controls the opening and closing of the liquid guide valve 8 and the liquid discharge valve 9 according to the feedback of the liquid level sensor, and controls the current intensity in the circuit through the PWM current modulator according to the feedback of the temperature sensor, so that the temperature is adjusted.

The ultrasonic generator is arranged on the back side surface of the drying cavity and driven by the control device, and the front (side) surface is a box body door.

A method of heat treating wood comprising the steps of:

and S1, stacking the wood in the baking cavity, and closing the box body door. The control device opens the liquid guide valve 8, the ethanol in the condensation cavity flows into the drying cavity, so that the wood is immersed in the ethanol, and then the liquid guide valve 8 is closed according to the feedback of the liquid level sensor; simultaneously closing the condensing valve; and starting a power supply, and heating the hot ends (the first copper substrate 4, the second copper substrate 6 and the heat dissipation base 7) of the semiconductor circuit to ensure that the temperature in the baking cavity reaches 50-60 ℃ and is maintained for 3-7 days.

S2, starting an ultrasonic generator at 50-60 ℃, ultrasonically vibrating the ethanol and the wood immersed in the ethanol, wherein the ultrasonic frequency is 20-30KHz, the ultrasonic time is 3-5h, opening a liquid guide valve 8, and discharging the solution in the drying cavity into a liquid storage cavity.

S3, opening a nitrogen source 1, and filling nitrogen into the baking cavity; opening a condensing valve, under the protection of flowing nitrogen, controlling a control device to adjust the current intensity in a circuit, adjusting the temperature in a drying cavity to 130-150 ℃, and drying the wood in a hot mode, wherein the temperature is adjusted to be in a gradient mode at 5 ℃/10 min; the baking time is 20-30h, and then cooling.

During hot drying, ethanol in the wood is heated and evaporated, flows into the condensation cavity along the condensation pipe 10 along with nitrogen, and is condensed into liquid after being cooled by the cold end 2, and the liquid falls into the condensation cavity to be accumulated. The nitrogen gas continuously flows out along the air outlet pipe 12, enters the baking cavity through the air inlet pipe 13 and circulates in sequence.

The heat dissipation base 7 is double-sided heat dissipation, ethanol in the liquid storage cavity is heated and evaporated, the ethanol is converged into the condensation pipe 10 through the steam pipe 11 and then enters the condensation cavity, and the ethanol liquid is condensed and condensed into ethanol liquid to be stored in the condensation cavity for recycling. The solution in the liquid storage cavity is heated to form a distillation effect, substances dissolved in the ethanol in the wood are retained in the liquid storage cavity, and the ethanol is purified, so that the ethanol can be reused.

Heated ethanol steam can realize automatic airflow flowing between the cold cavity and the hot cavity, and further can blow flowing air to the air inlet pipe through the fan, so that the flowing of the airflow is accelerated, and the evaporation and condensation effects of the ethanol are accelerated.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It should be understood by those skilled in the art that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent variations fall within the scope of the present invention.