阅读说明：本技术 线路基板与铜箔自动贴合机 (Automatic laminating machine for circuit substrate and copper foil ) 是由 潘广艺 于 2020-03-31 设计创作，主要内容包括：一种线路基板与铜箔自动贴合机,包括：铜箔清洁装置,用于清洁铜箔；假贴合平台,用于基板与铜箔的假贴合；预压合装置,用于预压合基板与铜箔；夹持拉料装置,用于固定铜箔的一端并在假贴合及预压合后拉动铜箔,移动一个预定工位；卷式铜箔上料装置,用于分离卷式铜箔中的铜箔与离型膜；基板中转装置,用于将基板转移至基板待吸取位置处；位于基板中转装置一侧的基板清洁装置,用于清洁中转装置上的基板；及位于基板中转装置与假贴合平台之间的贴合吸盘装置,用于从基板中转装置吸取基板并将基板转移至假贴合平台上的铜箔的上方并使得基板与铜箔对位并假贴合。本发明提供的线路基板与铜箔自动贴合机能够避免铜箔翘曲且不易产生气泡和褶皱。(The utility model provides a circuit substrate and automatic rigging machine of copper foil, includes: the copper foil cleaning device is used for cleaning the copper foil; the false bonding platform is used for false bonding of the substrate and the copper foil; the pre-pressing device is used for pre-pressing the substrate and the copper foil; the clamping and pulling device is used for fixing one end of the copper foil, pulling the copper foil after false bonding and pre-pressing, and moving a preset station; the roll type copper foil feeding device is used for separating a copper foil and a release film in the roll type copper foil; the substrate transfer device is used for transferring the substrate to a position to be absorbed of the substrate; the substrate cleaning device is positioned on one side of the substrate transfer device and is used for cleaning the substrate on the transfer device; and the bonding sucker device is positioned between the substrate transfer device and the false bonding platform and used for sucking the substrate from the substrate transfer device, transferring the substrate to the position above the copper foil on the false bonding platform, aligning the substrate with the copper foil and performing false bonding. The automatic laminating machine for the circuit substrate and the copper foil can avoid the warping of the copper foil and is not easy to generate bubbles and wrinkles.)

1. The utility model provides a circuit substrate and automatic rigging machine of copper foil which characterized in that includes:

a copper foil cleaning device for cleaning the copper foil;

the false bonding platform is used for false bonding of the substrate and the copper foil;

the pre-pressing device is used for pre-pressing the pseudo-laminated substrate and the copper foil;

the clamping and pulling device is used for fixing one end of the copper foil and pulling the copper foil after pseudo-lamination and pre-lamination respectively so as to enable the copper foil to move a preset station in the direction of the clamping and pulling device;

the roll type copper foil feeding device is used for separating a copper foil and a release film in the roll type copper foil; copper foil in the rolled copper foil sequentially passes through the copper foil cleaning device, the false laminating platform and the pre-pressing device and is fixed on the clamping and pulling device;

The substrate transfer device is used for transferring the substrate to a position to be absorbed of the substrate;

the substrate cleaning device is positioned on one side of the substrate transfer device and is used for cleaning the substrate on the transfer device; and

one lie in base plate transfer device with the laminating sucking disc device between the platform is laminated in the false, laminating sucking disc device is used for following base plate transfer device absorbs the base plate and will the base plate shifts to on the platform is laminated in the false top of copper foil and make the base plate with on the platform is laminated in the false copper foil counterpoint and the false laminating.

2. The automatic laminating machine for circuit substrates and copper foils according to claim 1, wherein the substrate transfer device comprises a transfer platform, a fixed frame, a first linear screw motor and two first moving linear rails, the substrate is fixed on the transfer platform, the transfer platform is connected to the fixed frame, the fixed frame is slidably connected to the two first moving linear rails, and the first linear screw motor is used for driving the fixed frame to slide on the two first moving linear rails so as to transfer the substrate on the transfer platform to a position where the substrate is to be sucked.

3. The automatic circuit substrate and copper foil laminating machine of claim 2, wherein the substrate transfer device further comprises a first rotary driving member disposed in the fixed bracket and connected to the transfer platform; the first rotary driving piece is used for driving the transfer platform to rotate so as to adjust the direction of the substrate.

4. The automatic circuit substrate and copper foil laminating machine of claim 2, wherein the substrate cleaning device comprises a first substrate cleaning assembly and a second substrate cleaning assembly; the first substrate cleaning assembly spans the two first moving linear guide rails, and the second substrate cleaning assembly is positioned on one side of the two first moving linear guide rails; the substrate comprises a first surface and a second surface opposite to the first surface, and the second surface is attached to the transfer platform; the first substrate cleaning assembly is for cleaning the first surface of the substrate and the second substrate cleaning assembly is for cleaning the second surface of the substrate.

5. The automatic circuit substrate and copper foil laminating machine of claim 4, wherein the first substrate cleaning assembly comprises two first supports, a first cleaning roller lifting cylinder and a first cleaning roller, the two first supports are respectively located at two opposite sides of the two first moving linear guide rails, the first cleaning roller lifting cylinder is fixed on the two first supports, the first cleaning roller is fixed on the first cleaning roller lifting cylinder, when the transfer platform passes under the first cleaning roller, the first cleaning roller abuts against the first surface of the substrate on the transfer platform, and the first cleaning roller is used for cleaning the first surface of the substrate on the transfer platform.

6. The automatic circuit substrate and copper foil laminating machine of claim 4, wherein the second substrate cleaning assembly comprises two second supports, a second cleaning roller lifting cylinder and a second cleaning roller; the two second supports are fixed at two ends of the second cleaning roller lifting cylinder, and the second cleaning roller is fixed on the second supports; when the bonding sucker device sucks the substrate from the transfer platform and passes above the second cleaning roller, the second cleaning roller is abutted against the second surface of the substrate sucked by the bonding sucker device; the second cleaning roller is used for cleaning the second surface of the substrate sucked by the bonding sucker device.

7. The automatic circuit substrate and copper foil laminating machine of claim 2, wherein the laminating suction cup device comprises a sliding assembly, a suction cup lifting cylinder, a suction cup driving motor; the sucker lifting cylinder is connected to the sliding assembly, the sucker assembly is fixed to the sucker lifting cylinder, and the sucker driving motor is fixed to the sucker lifting cylinder and connected with the sucker assembly; the slip subassembly is used for being located on the transfer platform the base plate shifts to false laminating platform department, sucking disc lift cylinder is used for driving the sucking disc subassembly is in the perpendicular to the ascending and descending of direction of transfer platform, the sucking disc subassembly is used for absorbing on the transfer platform the base plate, sucking disc actuating motor is used for control the sucking disc subassembly will the base plate with on the false laminating platform copper foil counterpoint and false laminating.

8. The automatic circuit substrate and copper foil laminating machine of claim 7, wherein the suction cup assembly comprises a laminating suction cup, a suction cup fixing seat, at least two buffering elastic members and a second rotary driving member, the suction cup fixing seat is connected to the suction cup driving motor, the laminating suction cup is connected to the suction cup fixing seat, the buffering elastic members are connected between the laminating suction cup and the suction cup fixing seat, and the laminating suction cup is used for sucking the substrate on the transfer platform and aligning and pseudo-laminating the substrate with the copper foil on the pseudo-laminating platform under the control of the suction cup driving motor; the second rotary driving piece is connected with the laminating sucker and used for driving the laminating sucker to rotate so as to compensate alignment deviation between the substrate and a copper foil on the false laminating platform.

9. The automatic laminating machine for circuit substrates and copper foils according to claim 1, further comprising a cutting device located between the clamping and pulling device and the pre-laminating device, wherein the cutting device is used for cutting the pre-laminated substrate and the copper foil, after the cutting device cuts the pre-laminated substrate and the copper foil, the clamping and pulling device pulls the cut substrate and the copper foil to a receiving position, and waits for the cut substrate and the copper foil to be transferred to a receiving platform.

10. The automated circuit substrate and copper foil laminating machine of claim 9, wherein the automated circuit substrate and copper foil laminating machine further comprises a pseudo-lamination alignment scanning device and a substrate camera recognition device; the false bonding alignment scanning device is used for scanning an alignment hole of a copper foil on the false bonding platform, and the substrate camera identification device is used for scanning the substrate; and a control system compares the scanning data of the substrate camera identification device to the substrate and the alignment hole data of the copper foil scanned on the false bonding platform by the false bonding alignment scanning device, and the second rotary driving piece adjusts the relative position of the bonding sucker and the copper foil on the false bonding platform according to the comparison result, so that the substrate is aligned with the copper foil.

Technical Field

The invention relates to the field of copper foil laminating, in particular to an automatic laminating machine for a circuit substrate and a copper foil.

Background

In the circuit board technology, bonding of a substrate and a copper foil is indispensable. In the prior art, a jig with a positioning Pin is used for laminating a substrate and a copper foil, and the substrate and the copper foil are laminated by manually sleeving the Pin for positioning, so that automatic lamination cannot be realized. In addition, the lamination of the copper foil is limited by the typesetting size and needs to be performed in one piece. In the process of laminating, the release paper on the copper foil is difficult to be torn off, if tear off release paper, then can lead to the copper foil at laminating in-process warpage, still produces bubble, fold etc. easily in the laminating process to influence laminating efficiency, laminating precision and the quality etc. of base plate and copper foil.

Disclosure of Invention

In view of the above, the present invention provides an automatic circuit substrate and copper foil laminating machine which can prevent a copper foil from warping after lamination and prevent bubbles and wrinkles from being generated between the copper foil and a substrate after lamination.

The utility model provides a circuit substrate and automatic rigging machine of copper foil, includes: a copper foil cleaning device for cleaning the copper foil; the false bonding platform is used for false bonding of the substrate and the copper foil; the pre-pressing device is used for pre-pressing the pseudo-laminated substrate and the copper foil; the clamping and pulling device is used for fixing one end of the copper foil and pulling the copper foil after pseudo-lamination and pre-lamination respectively so as to enable the copper foil to move a preset station in the direction of the clamping and pulling device; the roll type copper foil feeding device is used for separating a copper foil and a release film in the roll type copper foil; copper foil in the rolled copper foil sequentially passes through the copper foil cleaning device, the false laminating platform and the pre-pressing device and is fixed on the clamping and pulling device; the substrate transfer device is used for transferring the substrate to a position to be absorbed of the substrate; the substrate cleaning device is positioned on one side of the substrate transfer device and is used for cleaning the substrate on the transfer device; and the laminating sucker device is positioned between the substrate transfer device and the false laminating platform, and is used for sucking the substrate by the substrate transfer device, transferring the substrate to the top of the copper foil on the false laminating platform and enabling the substrate to be aligned with the copper foil on the false laminating platform and be subjected to false laminating.

Further, the base plate transfer device includes a transfer platform, a fixed bolster, a first linear screw rod motor and two first removal linear guide rails, the base plate is fixed on the transfer platform, the transfer platform is connected on the fixed bolster, fixed bolster sliding connection is two on the first removal linear guide rail, first linear screw rod motor is used for driving the fixed bolster slides on two on the first removal linear guide rail, in order to with on the transfer platform the base plate shifts to the base plate and treats the position department of absorbing.

Furthermore, the substrate transfer device further comprises a first rotary driving member, and the first rotary driving member is arranged in the fixed support and connected with the transfer platform; the first rotary driving piece is used for driving the transfer platform to rotate so as to adjust the direction of the substrate.

Further, the substrate cleaning device comprises a first substrate cleaning assembly and a second substrate cleaning assembly; the first substrate cleaning assembly spans the two first moving linear guide rails, and the second substrate cleaning assembly is positioned on one side of the two first moving linear guide rails; the substrate comprises a first surface and a second surface opposite to the first surface, and the second surface is attached to the transfer platform; the first substrate cleaning assembly is for cleaning the first surface of the substrate and the second substrate cleaning assembly is for cleaning the second surface of the substrate.

Further, the first substrate cleaning assembly comprises two first supports, a first cleaning roller lifting cylinder and a first cleaning roller, the two first supports are respectively located on two opposite sides of the first movable linear guide rail, the first cleaning roller lifting cylinder is fixed on the two first supports, the first cleaning roller is fixed on the first cleaning roller lifting cylinder, the transfer platform passes through the lower portion of the first cleaning roller, the first cleaning roller is abutted to the first surface of the substrate on the transfer platform, and the first cleaning roller is used for cleaning the first surface of the substrate on the transfer platform.

Furthermore, the second substrate cleaning assembly comprises two second supports, a second cleaning roller lifting cylinder and a second cleaning roller; the two second supports are fixed at two ends of the second cleaning roller lifting cylinder, and the second cleaning roller is fixed on the second supports; when the bonding sucker device sucks the substrate from the transfer platform and passes above the second cleaning roller, the second cleaning roller is abutted against the second surface of the substrate sucked by the bonding sucker device; the second cleaning roller is used for cleaning the second surface of the substrate sucked by the bonding sucker device.

Furthermore, the attaching sucker device comprises a sliding assembly, a sucker lifting cylinder and a sucker driving motor; the sucker lifting cylinder is connected to the sliding assembly in a sliding mode, the sucker assembly is fixed to the sucker lifting cylinder, and the sucker driving motor is fixed to the sucker lifting cylinder and connected with the sucker assembly; the slip subassembly is used for being located on the transfer platform the base plate shifts to false laminating platform department, sucking disc lift cylinder is used for driving the sucking disc subassembly is in the perpendicular to the ascending and descending of direction of transfer platform, the sucking disc subassembly is used for absorbing on the transfer platform the base plate, sucking disc actuating motor is used for control the sucking disc subassembly will the base plate with on the false laminating platform copper foil counterpoint and false laminating.

Further, the sucking disc subassembly includes a laminating sucking disc, a sucking disc fixing base and two at least buffering elastic components, the sucking disc fixing base is connected on the sucking disc actuating motor, the laminating sucking disc is connected on the sucking disc fixing base, the buffering elastic component is connected the laminating sucking disc with between the sucking disc fixing base, the laminating sucking disc is used for absorbing on the transfer platform the base plate will under sucking disc actuating motor's control the base plate with on the false platform of laminating the copper foil is counterpointed and is pasted in the false.

Further, the sucking disc subassembly still includes a second rotary driving spare, the second rotary driving spare with the laminating sucking disc is connected and is used for the drive the laminating sucking disc is rotatory, in order to compensate the base plate with be located the alignment deviation between the copper foil on the false laminating platform.

Furthermore, the automatic laminating machine for the circuit substrate and the copper foil also comprises a false laminating alignment scanning device and a substrate camera identification device; the false bonding alignment scanning device is used for scanning an alignment hole of a copper foil on the false bonding platform, and the substrate camera identification device is used for scanning the substrate; and a control system compares the scanning data of the substrate camera identification device to the substrate and the alignment hole data of the copper foil scanned on the false bonding platform by the false bonding alignment scanning device, and the second rotary driving piece adjusts the relative position of the bonding sucker and the copper foil on the false bonding platform according to the comparison result, so that the substrate is aligned with the copper foil.

The invention provides an automatic laminating machine for circuit substrates and copper foils, which comprises 1) a substrate taking and placing device, a substrate transfer device, a substrate cleaning device, a laminating sucker device, a substrate camera recognition device, a rolled copper foil feeding device, a copper foil cleaning device, a false laminating platform, a false laminating alignment scanning device, a pre-pressing device, a cutting device, a laminated product transfer device, a clamping and pulling device and a laminated product transfer device, wherein the rolled copper foil feeding device and the clamping and pulling device can be matched for use, and the automatic lamination of the substrate and the copper foil can be realized; 2) the roll type copper foil feeding device can separate the release film from the copper foil, so that the warping phenomenon in the process of pressing the substrate and the copper foil can be avoided; 3) the copper foil cleaning device is matched with the substrate cleaning device for use, so that the cleanness of the copper foil and the substrate can be ensured, and the probability of bubbles and wrinkles occurring in the laminating process of the substrate and the copper foil can be reduced.

Drawings

Fig. 1 is a schematic perspective view of an automatic circuit board and copper foil laminating machine according to a preferred embodiment of the present invention.

Fig. 2 is an enlarged schematic view of the substrate cleaning apparatus, the substrate transferring apparatus and the substrate pick-and-place apparatus shown in fig. 1.

Fig. 3 is an enlarged schematic view of a first substrate cleaning apparatus of the substrate relay apparatus and the substrate cleaning apparatus shown in fig. 2.

Fig. 4 is a partially enlarged view of the substrate relay apparatus, the substrate cleaning apparatus and the bonding pad apparatus shown in fig. 1.

Fig. 5 is a perspective view of the vacuum chuck assembly shown in fig. 4.

Fig. 6 is a perspective view of the Y-axis moving assembly and the bonding chuck of the bonding chuck device shown in fig. 5.

Fig. 7 is a perspective view of the pre-press apparatus shown in fig. 1.

Fig. 8 is a schematic perspective view of the cutting device, the transfer device for bonding products, and the clamping and pulling device shown in fig. 1.

Description of the main elements

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

In order to further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be made on the specific embodiments, structures, features and effects of the automatic laminating machine for copper foil and substrate provided by the present invention with reference to fig. 1-8 and preferred embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, the present invention provides an automatic circuit board and copper foil laminating machine 1000 for laminating a circuit board and a copper foil together. The automatic circuit substrate and copper foil laminating machine 1000 includes a substrate taking and placing device 10, a substrate transferring device 20, a substrate cleaning device 30, a laminating suction cup device 40, a substrate camera recognition device (not shown), a roll type copper foil feeding device 50, a copper foil cleaning device 60, a false laminating platform 70, a false laminating alignment scanning device 80, a pre-pressing device 90, a cutting device 100, a laminating product transferring device 110, a clamping and pulling device 120, a laminating product transferring device 130, a receiving platform 140 and a supporting platform 150. The substrate taking and placing device 10, the substrate transferring device 20, the substrate cleaning device 30, the bonding sucker device 40, the substrate camera recognition device, the rolled copper foil feeding device 50, the copper foil cleaning device 60, the false bonding platform 70, the false bonding alignment scanning device 80, the pre-pressing device 90, the cutting device 100, the bonded product transferring device 110, the clamping pulling device 120, the bonded product transferring device 130 and the receiving platform 140 are all arranged on the supporting platform 150. The substrate transfer device 20 is located between the substrate taking and placing device 10 and the bonding sucker device 40. The substrate cleaning device 30 is located at one side of the substrate transferring device 20 and the bonding suction device 40. The substrate camera recognition device is located on one side of the dummy stage 70. The false bonding platform 70 is located on one side of the bonding sucker device 40 and the copper foil cleaning device 60, the rolled copper foil feeding device 50 is located on one side of the copper foil cleaning device 60, the false bonding alignment scanning device 80 is located on one end, close to the pre-pressing device 90, of the false bonding platform 70, the pre-pressing device 90 is located between the false bonding alignment scanning device 80 and the cutting device 100, the bonding product transfer device 110 is located on the main cutting device 100 and the clamping and pulling device 120, the bonding product transfer device 130 is located on one side of the bonding product transfer device 110, and the receiving platform 140 is located on one side of the bonding product transfer device 130.

Referring to fig. 2, the substrate taking and placing device 10 includes a spacing paper placing platform 11, a substrate and spacing paper lifting platform 12, and a substrate and spacing paper transferring assembly 13. The partition paper placing platform 11 is used for storing partition paper. The substrate and spacer lifting platform 12 is used for storing the substrates 200 and the spacers between two adjacent substrates 200. The substrate and spacer transfer assembly 13 is configured to transfer the spacer on the substrate and spacer lifting platform 12 to the spacer placing platform 11, and transfer the substrate 200 on the substrate and spacer lifting platform 12 to a transfer platform 21 (see below) of the substrate transfer device 20. The substrate and spacer lifting platform 12 may adjust the height of the whole body according to the thickness of the stacked substrates and spacers, so that the substrate and spacer transferring assembly 13 transfers the substrate 200 and the spacers.

The substrate 200 includes a first surface 201 and a second surface 202 opposite to the first surface 201. The second surface 202 of the substrate 200 is in contact with the transfer platform 21 (see below) of the substrate transfer device 20.

The substrate transfer device 20 is used for transferring the substrate 200 to a substrate to-be-sucked position and waiting for the substrate 200 to be sucked by the bonding chuck device 40.

Referring to fig. 2-3, the substrate transferring apparatus 20 includes a transferring platform 21, a fixed bracket 22, a first linear screw motor 23, two first moving linear guide rails 24, and a first rotary driving member 25. The transfer platform 21 is used for fixing and placing the substrate 200 transferred from the substrate and spacer lifting platform 12. The transfer platform 21 is connected to the fixed bracket 22. The fixed bracket 22 is slidably connected to the two first moving linear guides 24. The first linear screw motor 23 and the two first moving linear guides 24 are fixed on the support platform 150. In the present embodiment, the first linear screw motor 23 is located between the two first moving linear guides 24. The first linear screw motor 23 is used to drive the fixed bracket 22 to slide on the two first moving linear guides 24. The first rotary driving member 25 is disposed in the fixing bracket 22 and connected to the transfer platform 21. The first rotary driving member 25 is used for driving the transfer platform 21 to rotate so as to adjust the direction of the substrate 200. When the first linear screw motor 23 drives the fixed bracket 22 to slide on the two first moving linear rails 24, the transfer platform 21 slides on the two first moving linear rails 24 along with the fixed bracket 22.

In this embodiment, the transfer platform 21 is an air suction platform. Work as the base plate will with interval paper lift platform 12 the base plate 200 is arranged in when on the transfer platform 21, the transfer platform evacuation is inhaled the base plate 200, first linear screw motor 23 drive the fixed bolster 22 is two slide on the first linear guide rail 24 and wait to laminate suction cup device 40 and will the base plate 200 is siphoned away to a base plate and treat the suction position department.

In this embodiment, the first rotary driver 25 may rotate the substrate 200 by 180 ° according to different directions in which the substrate 200 placed on the transfer platform 21 is located. Of course, in other embodiments, the angle of the first rotary driving member 25 rotating the substrate 200 may be determined according to practical situations, and is not limited to 180 °.

In the present embodiment, the first rotary drive 25 is a rotary motor.

Referring to fig. 2, the substrate cleaning apparatus 30 includes a first substrate cleaning assembly 31 and a second substrate cleaning assembly 32. The first substrate cleaning assembly 31 spans over the two first moving linear guides 24, and the second substrate cleaning assembly 32 is located at one side of the two first moving linear guides 24. The extending direction of the first substrate cleaning assembly 31 is perpendicular to the extending direction of the two first moving linear guides 24, and the extending direction of the second substrate cleaning assembly 32 is parallel to the extending direction of the two first moving linear guides 24.

Specifically, referring to fig. 2-3, the first substrate cleaning assembly 31 includes two first brackets 311, a first cleaning roller lifting cylinder 312, a first dust-binding paper roll 313 and a first cleaning roller 314. The two first brackets 311 are respectively located at two opposite sides of the two first moving linear guides 24 and fixed on the supporting platform 150. The first cleaning roller lifting cylinder 312 is fixed on one end of the two first brackets 311 far away from the supporting platform 150. The first roll of dust-laden paper 313 and the first cleaning roller 314 are respectively fixed to the first cleaning roller lifting cylinder 312. The first roll of dusting paper 313 is positioned above the first cleaning roller 314.

The first cleaning roller lifting cylinder 312 is configured to drive the first cleaning roller 314 to move in a direction perpendicular to the supporting platform 150, so as to adjust a distance between the first cleaning roller 314 and the substrate 200 on the transfer platform 21, thereby ensuring that the first cleaning roller 314 abuts against the first surface 201 of the substrate 200 on the transfer platform 21 when the transfer platform 21 passes under the first cleaning roller 314. The first cleaning roller 314 is used for cleaning the first surface 201 of the substrate 200 on the transfer platform 21. In this embodiment, the first cleaning roller 314 cleans the first surface 201 of the substrate 200 on the transfer platform 21 through a dust-sticking paper. The first dust-binding paper roll 313 is used for rolling up the used dust-binding paper on the first cleaning roller 314.

Referring to fig. 2, 4 and 5, the second substrate cleaning assembly 32 is located at one side of the first moving linear guide 24 and between a third bracket 41 (see below) of the suction cup device 40 and the first substrate cleaning assembly 31.

Specifically, referring to fig. 4 and 5, the second substrate cleaning assembly 32 includes two second brackets 321, a second cleaning roller lifting cylinder 322, a second dust-binding paper roll 323, and a second cleaning roller 324. The second cleaning roller lifting cylinder 322 is fixed on the supporting platform 150. The two second brackets 321 are fixed at both ends of the second cleaning roller elevating cylinder 322. The second dust-sticking paper roll 323 and the second cleaning roller 324 are both fixed on the second bracket 321. The second dust-sticking paper roll 323 and the second cleaning roller 324 are located at one end of the two second brackets 321 far away from the second cleaning roller lifting cylinder 322, and the second dust-sticking paper roll 323 is disposed adjacent to the second cleaning roller 324 and located between the second cleaning roller 32 and the second cleaning roller lifting cylinder 322.

The second cleaning roller lifting cylinder 322 is configured to drive the second support 321 to move in a direction perpendicular to the supporting platform 150, so as to adjust a distance between the second cleaning roller 324 and the second surface 202 of the substrate 200 sucked by the bonding suction cup 431 (see below) of the bonding suction cup device 40, thereby ensuring that the second cleaning roller 324 abuts against the second surface 202 of the substrate 200 sucked by the bonding suction cup 431 when the bonding suction cup 431 passes over the second cleaning roller 324. The second cleaning roller 324 is used for cleaning the second surface 202 of the substrate 200 sucked by the attaching suction cup 431. In this embodiment, the second cleaning roller 324 cleans the second surface 202 of the substrate 200 sucked by the bonding suction cup 431 by using a dust-sticking paper. The second dust-binding paper roll 323 is used for rolling up the used dust-binding paper on the second cleaning roller 324.

Referring to fig. 4-6, the bonding suction cup device 40 includes two third brackets 41 fixed on the supporting platform 150, a sliding assembly 42 fixed on the two third brackets 41, a suction cup assembly 43 slidably connected to the sliding assembly 42, a suction cup lifting cylinder 44, a suction cup driving motor 45 connected to the suction cup lifting cylinder 44, and a second rotary driving member 46 connected to the suction cup assembly 43.

The sliding assembly 42 includes a second linear screw motor 421 and two second moving linear rails 422. Two of the second moving linear guides 422 are fixed to two of the third brackets 41. The second linear screw motor 421 is located between the two second moving linear guides 422. The extending directions of the two second moving linear guides 422 and the second linear screw motor 421 are perpendicular to the extending direction of the two first moving linear guides 24. The second linear screw motor 421 is used to drive the suction cup lifting cylinder 44 to slide back and forth on the two second moving linear guide rails 422.

Wherein, the sucker lifting cylinder 44 is slidably connected to the two second moving linear guide rails 422. The suction cup lifting cylinder 44 is used for driving the suction cup assembly 43 to lift in a direction perpendicular to the transfer platform 21. The sucker lifting cylinder 44 further comprises a lifting cylinder pressure regulating valve 441, and the lifting cylinder pressure regulating valve 441 is used for regulating the pressure in the sucker lifting cylinder 44.

The suction cup assembly 43 includes a bonding suction cup 431, a suction cup fixing seat 432, a vacuum generator 433, a suction cup heater 434 and at least two buffer elastic members 435. The sucking disc fixing base 432 is connected on the sucking disc driving motor 45, the laminating sucking disc 431 is connected on the sucking disc fixing base 432, the vacuum generator 433 is fixed on the laminating sucking disc 431, the sucking disc heater 434 is fixed on the laminating sucking disc 431, the buffering elastic piece 435 is connected between the laminating sucking disc 431 and the sucking disc fixing base 432.

Wherein, the attaching suction cup 431 is used for grabbing the substrate 200 from the transfer platform 21. In this embodiment, the bonding pad 431 has vacuum and heating functions. The suction cup holder 432 is used to connect the attaching suction cup 431 to the suction cup driving motor 45. The vacuum generator 433 is configured to generate a vacuum on the bonding pad 431 to suck the substrate 200. The suction cup heater 434 is used for heating so that the attaching suction cup 431 has a heating function. The buffer elastic member 435 functions to play a role of buffering when the attaching suction cup 431 receives an external force, so as to protect the attaching suction cup 431. In this embodiment, the buffering elastic member 435 is a buffering spring, and the number of the buffering elastic members 435 is four.

The suction cup driving motor 45 is used for driving the attaching suction cup 431 to abut against and suck the substrate 200 or the attaching suction cup 431 is used for sucking the substrate 200, and then the attaching suction cup is driven to be far away from the transferring platform 21.

The second rotary driving member 46 is used for driving the bonding suction cup 431 to rotate by a certain angle so as to compensate for a misalignment between the substrate 200 and a copper foil (not shown) on the dummy bonding stage 70.

The roll-type copper foil feeding device 50 is used for feeding the copper foil which is in a roll shape after being separated from the diaphragm and the release film.

Referring to fig. 1, the roll type copper foil feeding device 50 includes a feeding shaft 51, a separator collecting shaft 52, a first copper foil cleaning assembly 53, a weight passing shaft 54, a release film collecting shaft 55, and a turning passing shaft 56. The membrane collecting shaft 52 is located at the left lower side of the feeding shaft 52, the first copper foil cleaning assembly 53 is located above the feeding shaft 52, the counterweight passing shaft 54 is located at the left lower side of the membrane collecting shaft 52 and close to the copper foil cleaning device 60, the membrane collecting and releasing shaft 55 is located at the left upper side of the first copper foil cleaning assembly 53, and the turning passing shaft 56 is opposite to the copper foil cleaning device 60.

The roll copper foil is sleeved on the feeding shaft 51, the diaphragm in the roll copper foil is wound on the diaphragm collecting shaft 52, the copper foil in the roll copper foil and the release film enter the first copper foil cleaning component 53 together, and the copper foil coming out from the other end of the first copper foil cleaning component 53 is separated from the release film. And then, winding the release film on the release film collecting shaft 5, enabling the copper foil to pass through the counterweight material passing shaft 54, turning by 180 degrees, and then passing through the copper foil cleaning device 60 after turning by 90 degrees from the front of the turning material passing shaft 56.

Referring to fig. 1, the copper foil cleaning device 60 has an upper and lower cleaning roller for cleaning upper and lower surfaces of the copper foil passing through the copper foil cleaning device 60.

Referring to fig. 1, the dummy bonding stage 70 is used for dummy bonding a copper foil to a substrate 200. The bonding sucker device 40 transfers the substrate 200 to the upper part of the false bonding platform 70 and adjusts the substrate 200 to enable the substrate to be opposite to the alignment hole on the false bonding platform 70, and the sucker driving motor 45 drives the bonding sucker 431 to press down to complete alignment and false bonding of the substrate and the copper foil.

Referring to fig. 1, the dummy bonding alignment scanning apparatus 80 is used for scanning alignment holes of a copper foil on the dummy bonding platform 70.

Referring to fig. 7, the pre-bonding device 90 is used for pre-bonding the pseudo-bonded substrate and the copper foil. The pre-pressing device 90 includes a lower pressing plate 91, an upper pressing plate 92, and a fast press lifting cylinder 93. The quick press lifting cylinder 93 is connected with the upper pressure plate 92. The pseudo-laminated substrate and the copper foil are positioned on the lower pressing plate 91, and the quick press lifting cylinder 93 drives the upper pressing plate 92 to press downwards, so that the pseudo-laminated substrate and the copper foil are pressed together.

The cutting device 100 is used for accurately cutting the pre-laminated substrate and the copper foil.

Referring to fig. 8, the cutting apparatus 100 includes a cutting knife holder 101, a cutting knife 102, a cutting knife sliding guide 108, a cutting cylinder 103, two product clamping plates 104, a third linear screw motor 105, two third moving linear guide rails 106, and a scanning alignment camera 107. The cutting knife fixing frame 101 is fixed on the supporting platform 150, the cutting knife 102, the cutting knife sliding guide rail 108, the cutting cylinder 103, the two product clamping plates 104 and the scanning alignment camera 107 are all fixed on the cutting knife fixing frame 101, the cutting knife 102 is slidably connected on the cutting knife sliding guide rail 108, the cutting cylinder 103 is connected with the cutting knife 102 and used for driving the cutting knife 102 to cut the pre-laminated substrate and copper foil, the two product clamping plates 104 are located below the cutting knife 102 and used for fixing the pre-laminated substrate and copper foil, the third linear lead screw motor 105 is used for driving the cutting knife fixing frame 101 to slide on the two third movable linear guide rails 106, and the scanning alignment camera 107 is used for scanning whether the pre-laminated substrate is aligned with the copper foil.

After the pre-laminated substrate and copper foil are pulled to a station in the direction of the cutting device 100, the third linear lead screw motor 105 drives the cutter fixing frame 101 to slide on the two third moving linear guide rails 106 to a position to be cut, the scanning alignment camera 107 is used for scanning whether the pre-laminated substrate and copper foil are aligned, after alignment, the pre-laminated substrate and copper foil are fixed in the two product clamping plates 104, the cutter 102 is manually slid on the cutter sliding guide rail 108 until one end of the cutter 102 is opposite to a cutting position and the cutter 102 is fixed on the cutter sliding guide rail 108, and the cutter cylinder 103 drives the cutter 102 to align and cut the pre-laminated substrate and copper foil.

Referring to fig. 8, the transfer device 110 for bonding products is used for temporarily storing the cut substrates and the cut copper foils and transferring the cut substrates and the cut copper foils to a receiving position. The transfer device 110 for the bonded product comprises a transfer platform 111 for the bonded product and at least one sliding rod 112, wherein the transfer platform 111 for the bonded product is sleeved on the sliding rod 112 and can slide on the sliding rod 112.

Referring to fig. 8, the clamping and pulling device 120 is configured to fix the copper foil extending from the copper foil cleaning device 60, pull the copper foil after pseudo-lamination and pre-lamination to move the copper foil to a set position in the direction of the cutting device 100, and pull the transfer platform 111 of the laminated product to a receiving position after cutting, so as to transfer the laminated substrate and the copper foil to the receiving position.

Referring to fig. 8, the clamping and pulling device 120 includes a clamping frame 121, a clamping jaw 122 fixed on the clamping frame 121, a fourth linear screw motor 123 and two fourth moving linear guide rails 124. The fourth linear screw motor 123 and the fourth moving linear guide 124 are fixed to the support platform 150. The holding bracket 121 is slidably coupled to the fourth moving linear guide 124. The fourth linear lead screw motor 123 is located between the two fourth moving linear guides 124. The material clamping pliers 122 are used for fixing one end of the copper foil extending out of the copper foil cleaning device 60. The fourth linear screw motor 123 is used for driving the clamping support 121 to move on the two fourth moving linear guide rails 124, so as to pull the copper foil after false bonding and pre-pressing, move the copper foil to a set station in the direction of the cutting device 100, and pull the bonded product transfer platform 111 to a material receiving position after cutting.

Referring to fig. 1, the bonded product transferring device 130 is used for taking the bonded and cut substrate and copper foil from the bonded product transferring platform 111 at the receiving position and transferring the bonded and cut substrate and copper foil onto the receiving platform 140 for storage.

The steps of the circuit substrate and copper foil automatic laminating machine 1000 for laminating the substrate and the copper foil are as follows:

in the first step, the substrate and spacer transfer assembly 13 is configured to transfer the spacer on the substrate and spacer lifting platform 12 to the spacer placing platform 11, and transfer the substrate 200 on the substrate and spacer lifting platform 12 to the transfer platform 21 of the substrate transfer device 20. Meanwhile, a roll of copper foil is sleeved on the feeding shaft 51 of the roll-type copper foil feeding device 50, after the copper foil is separated from a release film, the copper foil passes through the copper foil cleaning device 60, the false bonding platform 70, the pre-pressing device 90, the cutting device 100 and the bonded product transfer device 110, and one end of the copper foil is fixed in the material clamping pincers 122 of the clamping and pulling device 120.

In the second step, the first linear screw motor 23 drives the fixed bracket 22 to slide on the two first moving linear guide rails 24 to the position where the substrate is to be sucked and wait for the substrate 200 to be sucked by the bonding chuck device 40. In this process, when the transfer platform 21 passes through the first substrate cleaning assembly 31, the first cleaning roller 314 abuts against the first surface 201 of the substrate 200 on the transfer platform 21, the first cleaning roller 314 rolls to clean the first surface 201 of the substrate 200 on the transfer platform 21 during the sliding process of the transfer platform 21, and the first dust-binding paper roll 313 rolls up the used dust-binding paper on the first cleaning roller 314.

Third, the second linear screw motor 421 of the bonding suction cup device 40 drives the suction cup lifting cylinder 44 to slide on the two second moving linear guide rails 422 to the position above the substrate 200 at the position to be sucked, the suction cup lifting cylinder 44 drives the suction cup assembly 43 to move downward to approach the first surface 201 of the substrate 200, the suction cup driving motor 45 drives the bonding suction cup 431 to abut against and suck the substrate 200 on the transfer platform 21, after the bonding suction cup 431 sucks the substrate 200, the suction cup driving motor 45 drives the bonding suction cup to move away from the transfer platform 21, the suction cup lifting cylinder 44 drives the suction cup assembly 43 to move in the opposite direction to the position above the second substrate cleaning assembly 32 and make the second surface 202 of the substrate 200 abut against the second cleaning roller 324, the second linear screw motor 421 drives the suction cup lifting cylinder 44 to slide on the two second moving linear guide rails 422 in opposite directions to the position above the substrate camera recognition device.

And fourthly, after the copper foil is in place on the false laminating platform 70, scanning the alignment holes of the copper foil on the false laminating platform 70 by the false laminating alignment scanning device 80. The substrate camera recognition device scans the substrate 200, the second linear screw motor 421 drives the sucker lifting cylinder 44 to continuously move to the position above the copper foil on the false bonding platform 70 on the two second movable linear guide rails 422, a control system compares the scanning data of the substrate 200 and the counterpoint hole data of the copper foil on the false bonding platform 70 scanned by the false bonding counterpoint scanning device 80, the second linear screw motor 421 and the second rotary driving piece 46 adjust the relative positions of the bonding sucker 431 and the copper foil on the false bonding platform 70 according to the comparison result, and the sucker driving motor 45 drives the bonding sucker 431 to press down, so that the substrate 200 and the copper foil are bonded in a false mode.

Fifthly, the clamping and pulling device 120 pulls the copper foil, so that the pseudo-bonded substrate and the copper foil move to a preset station in the direction of the pre-pressing device 90 to the lower pressing plate 91 of the pre-pressing device 90, and the quick press lifting cylinder 93 drives the upper pressing plate 92 to press down, so that the pseudo-bonded substrate and the copper foil are pressed together.

Sixthly, the copper foil is pulled by the clamping and pulling device 120, so that the pre-laminated substrate and the pre-laminated copper foil move to a preset station in the direction of the cutting device 100, the third linear lead screw motor 105 drives the cutter fixing frame 101 to slide on the two third movable linear guide rails 106 to a position to be cut, the scanning alignment camera 107 is used for scanning whether the pre-laminated substrate and the pre-laminated copper foil are aligned, after alignment, the pre-laminated substrate and the pre-laminated copper foil are fixed in the two product clamping plates 104, the cutter 102 is manually slid on the cutter sliding guide rails 108 until one end of the cutter 102 is aligned to the cutting position and the cutter 102 is fixed on the cutter sliding guide rails 108, and the cutter cylinder 103 drives the cutter 102 to align and cut the pre-laminated substrate and the pre-laminated copper foil.

And seventhly, pulling the copper foil by the clamping and pulling device 120, pulling the transfer platform 111 of the attached product to a material receiving position so as to transfer the cut substrate and the cut copper foil to the material receiving position.

Eighthly, the bonded product transfer device 130 takes the bonded and cut substrate and the copper foil from the bonded product transfer platform 111 at the material receiving position and transfers the bonded and cut substrate and copper foil to the material receiving platform 140 for storage.

The invention provides an automatic laminating machine for circuit substrates and copper foils, which comprises 1) a substrate taking and placing device 10, a substrate transfer device 20, a substrate cleaning device 30, a laminating sucker device 40, a substrate camera recognition device, a rolled copper foil feeding device 50, a copper foil cleaning device 60, a false laminating platform 70, a false laminating alignment scanning device 80, a pre-pressing device 90, a cutting device 100, a laminating product transfer device 110, a clamping and pulling device 120 and a laminating product transfer device 130, wherein the rolled copper foil feeding device 50 and the clamping and pulling device 120 are matched for use, so that automatic lamination of the substrates and the copper foils can be realized; 2) the roll-type copper foil feeding device 50 can separate the release film from the copper foil, so that the warping phenomenon in the process of laminating the substrate and the copper foil can be avoided; 3) the copper foil cleaning device 60 is matched with the substrate cleaning device 30 for use, so that the cleaning of the copper foil and the substrate can be ensured, and the probability of bubbles and wrinkles occurring in the laminating process of the substrate and the copper foil can be reduced.

Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.